Processing device for repairing wafer base and repairing method

Abstract

The machining device comprises a machining base table, the machining base table is provided with a tool fixing base capable of moving in the X orthogonal direction, the Y orthogonal direction and the Z orthogonal direction, and a machining tool is installed on the tool fixing base; wherein a lubricating mechanism for providing a lubricating medium for the machining tool is arranged on the machining base station; and the pressure of the lubricating medium output by the lubricating mechanism is variable. By introducing the optimal design of the lubricating mechanism in the wafer base repair processing, the cutting efficiency and the workpiece surface quality are improved by utilizing the mixture of the compressed gas and the lubricant in the cutting process, the interference to the processing environment is reduced, and meanwhile, the precise control and distribution of the lubricating medium are also facilitated.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a processing device and a repair method for a wafer base. Background Art

[0002] As one of the core supporting industries in the wafer base production process, the repair and manufacturing technology of wafer bases is undoubtedly a hot semiconductor sub-industry. Heaters that were previously considered unrepairable can be put back into use after being repaired using proprietary technology. The repaired heaters are the same as new heaters and can be refurbished many times. Therefore, the market development space for the repair and manufacturing technology of wafer bases is relatively broad.

[0003] Due to the long service life of the heater, the bosses on the surface may be worn or some impure metal films may be deposited, causing the bosses to be not in the same plane and other undesirable phenomena.

[0004] For example, the "wafer coating heating platform with horizontal fine-tuning structure" disclosed in Chinese patent documents, with application number "CN202322307804.3", includes a counterweight workbench, a horizontal fine-tuning mechanism is arranged on the top of the counterweight workbench, a convenient heating mechanism is arranged on the top of the counterweight workbench, the horizontal fine-tuning mechanism includes a fine-tuning positioning unit and a horizontal resetting unit, the convenient heating mechanism includes a height adjustment unit and a heating treatment unit, and the fine-tuning positioning unit includes supporting legs.

[0005] Although the above scheme can adjust the tilt of the heating plane, and through the cooperation of the horizontal scale line and the transparent protractor, it is convenient for the user to adjust the specified angle to complete the plane repair, there is still the problem that the heater surface is prone to retain processing marks or defects such as broken edges during the repair process. Summary of the invention

[0006] In order to overcome the problem that the heater in the current wafer base is prone to leaving processing marks or edge collapse during the repair process, which affects the accuracy, the present invention provides a wafer base repair method and a processing device, which integrates the lubrication mechanism with the processing base and realizes adjustable lubrication medium pressure, which can not only improve the processing quality but also save lubrication costs.

[0007] The second invention objective of the present invention is to solve the problem that metal debris generated during the processing may clog or damage the equipment, affecting the processing accuracy and the life of the equipment.

[0008] In order to achieve the above object, the present invention adopts the following technical solutions: The present application discloses a processing device for repairing a wafer base, comprising a processing base, the processing base having a tool fixing seat movable along three orthogonal directions of X, Y and Z, the tool fixing seat being mounted with a processing tool; wherein a lubrication mechanism for providing a lubricating medium to the processing tool is arranged on the processing base; wherein the pressure of the lubricating medium output by the lubrication mechanism is variable.

[0009] This solution allows the tool holder and the machining tool installed thereon to be adjusted in multiple dimensions in space to meet the machining requirements at different positions and angles. In addition, a lubrication mechanism is specially provided in the device, which can provide lubricating medium to the machining tool, which is particularly important in precision machining, because proper lubrication can reduce friction between the tool and the workpiece, reduce wear, and improve machining accuracy and surface quality. In particular, the variability of the lubricating medium pressure provides more adjustment options for the machining process to adapt to the characteristics of materials of different hardness and thickness.

[0010] Precision machining has high requirements for environmental conditions, especially in the semiconductor industry, where the repair of wafer bases must ensure extremely high flatness and cleanliness. By integrating a lubrication mechanism on the machining base, effective lubrication of the machining area can be achieved without affecting the machining accuracy. Compared with traditional external lubrication methods, the design of this built-in lubrication mechanism is more compact, reducing interference with the machining environment, and also facilitating the precise control and distribution of the lubricating medium. In addition, the lubricating medium with variable pressure can effectively remove the debris generated by machining, preventing the debris from causing unnecessary scratches or even damage to the machining object, and also preventing the debris from clogging the channel on the tool.

[0011] Preferably, the processing tool adopts a resin tool, and the diameter range of the resin tool is 60mm-120mm. The size of the wafer base is usually large, and a tool that can cover a large area is required to achieve effective processing. At the same time, this diameter range also provides sufficient rigidity and strength for the resin tool to withstand the cutting force during high-precision processing and ensure the stability of the processing process. Compared with traditional carbide tools, resin tools have better toughness and vibration resistance, which enables them to reduce vibration and noise during high-speed rotation and cutting, and further improve processing accuracy and surface quality. In addition, the cost-effectiveness of resin tools is high, which makes them have advantages in the field of wafer base repair that needs to be frequently replaced. Resin tools can provide smoother cutting action during processing, reduce processing errors caused by tool wear, and extend the service life of the tool. At the same time, the resin tool has a lower affinity for the wafer base material, which helps to reduce burrs and adhesion during processing. Compared with common carbide tools, resin tools show higher processing quality and longer service life in the field of precision processing.

[0012] Preferably, at least one channel is provided inside the resin tool, and the channel extends from the shank of the machining tool to the cutting edge of the machining tool, and the lubrication mechanism transports the lubricating medium to the machining area. In precision machining, especially in the machining of high-hardness materials such as wafer bases, a large amount of heat will be generated at the contact surface between the tool and the material. This heat will not only accelerate the wear of the tool, but may also affect the machining accuracy. By providing a channel inside the tool, the lubricating medium can be directly transported to the cutting area, effectively cooling the tool, reducing friction and wear, thereby extending the service life of the tool, and improving machining efficiency and quality. In addition, the uniform distribution of the lubricating medium in the machining area helps to reduce cutting force, reduce burrs and adhesion, and further improve the finish of the machined surface. Compared with the traditional method of directly spraying the lubricating medium into the machining area, this design can more accurately control the flow and distribution of the lubricating medium, and avoid material waste and environmental problems caused by excessive lubrication.

[0013] Preferably, the lubrication mechanism includes one or more nozzles arranged corresponding to the number of channels, and the nozzles evenly disperse the lubricating medium into each channel inside the resin tool. The position and design of the nozzles enable the lubricating medium to act directly on the cutting area, which can reduce the generation of heat and deformation of the workpiece material, while improving the finish of the processed surface. Traditional lubrication methods may not be able to accurately deliver the lubricating medium to the required position, but this design achieves precise control of the lubricating medium through the built-in nozzle, thereby improving processing efficiency and processing quality. Spraying the lubricating medium directly into the cutting area can more effectively reduce the temperature of the cutting area, reduce tool wear, and improve the processing quality of the workpiece material.

[0014] Preferably, the lubricating mechanism is connected with a compressed air source and a lubricant source, and the lubricating mechanism includes an aerosol generating unit connected to the nozzle. The aerosol generating unit generates a fine aerosol by the cooperation of the compressed air source and the lubricant source. The aerosol is a mixture of compressed air and lubricant, which can be more evenly covered on the processing surface, providing a more effective lubrication and cooling effect. This aerosol can not only reduce the temperature of the cutting area, reduce material deformation and tool wear caused by high temperature, but also help remove the debris generated during the processing through the impact force of the aerosol. Traditional lubrication methods may not meet the needs of high-precision processing, especially in applications such as wafer bases that require extremely high precision. Through the design of the aerosol generating unit, accurate control and uniform distribution of the lubricating medium can be achieved, thereby improving processing quality and processing efficiency. The aerosol generated by the aerosol generating unit can effectively reduce the temperature of the processing area, reduce the influence of heat on the workpiece and tool, and improve the stability of the processing process. At the same time, the cleaning effect of the aerosol helps to keep the processing surface clean and reduce processing defects caused by debris accumulation.

[0015] Preferably, the aerosol generating unit includes a pressure regulating valve for controlling the output pressure of the aerosol; the extension line of the channel is arranged at an inclined angle with the processing surface. The pressure regulating valve in the aerosol generating unit allows the operator to adjust the output pressure of the aerosol according to the actual processing conditions, such as workpiece material, tool type, cutting speed, etc. By accurately controlling the pressure of the aerosol, it is possible to ensure that the lubricating medium is sprayed into the processing area with a suitable intensity while reducing unnecessary impact on the workpiece surface. In addition, the design of the channel inside the resin tool at an inclined angle to the processing surface further improves the coverage efficiency of the lubricating medium, and at the same time, with the help of the momentum of the aerosol, the metal debris is effectively blown away from the processing area. Traditional lubrication systems may not be able to effectively solve the impact of metal debris on processing accuracy and surface quality. The inclined channel design enables the lubricating medium to play a role in removing debris in the opposite direction of the cutting motion, reducing the risk of secondary cutting or surface damage caused by debris accumulation. Through the precise control of the aerosol and the inclined channel design, efficient cooling and lubrication of the processing area is achieved, while the debris removal efficiency is significantly improved. This not only improves the stability and quality of the machining process, but also helps to extend the service life of the tool and reduce equipment failures caused by chips.

[0016] Preferably, the processing base also includes a debris collection groove, which is arranged around the outer edge of the processing area. When the resin tool performs milling on the wafer base, metal debris will be generated. If these debris are not removed in time, they may damage the processing surface or block the lubrication system, affecting the processing quality and the normal operation of the equipment. The design of the debris collection groove cleverly solves this problem. It can collect and store these debris in real time to prevent them from having an adverse effect on the processing process. In the traditional processing process, the treatment of metal debris often requires additional cleaning steps or equipment, which not only increases the workload, but also may cause processing quality problems due to untimely cleaning. By integrating the debris collection groove in the design of the processing base, these risks can be effectively reduced and the continuity and stability of the processing process can be achieved. By setting the debris collection groove, the cleanliness and safety of the processing process can be improved, equipment failures and processing defects caused by debris can be reduced, and the workload of subsequent cleaning and maintenance can also be reduced. In addition, the collected debris has the possibility of reprocessing and recycling, thereby improving the utilization rate of materials.

[0017] The present application also discloses a wafer base repair method using the above processing device, comprising the following steps: Step 1: placing the wafer base to be processed at the center of a four-jaw chuck, and using the four jaws of the chuck to clamp the periphery of the wafer base respectively; Step 2: Start the CNC system and control the tool holder to move along the X-axis, Y-axis and Z-axis according to the pre-set processing program, so that the resin tool gradually approaches the surface of the wafer base; Step 3: Adjust the rotation speed and feed speed of the tool, and start milling the surface of the wafer base heater with appropriate cutting parameters until the required flatness is achieved; Step 4: During the machining process, the aerosol lubricant is delivered to the cutting area through the internal channel of the resin tool; Step 5: After the processing is completed, stop the tool rotation and machine tool movement, and use measuring equipment to detect the flatness of the processed wafer base surface.

[0018] The wafer base to be processed is precisely positioned and fixed in the center of the four-claw chuck. This step is crucial because it ensures the stability and repeatability of the wafer base throughout the entire processing process. Subsequently, the CNC system is started, and its high-precision control capability is used to move the tool holder along the three orthogonal directions of X, Y, and Z, so that the resin tool approaches and processes the surface of the wafer base in a predetermined path. Through the precise control of the CNC system, the position and movement trajectory of the tool can be accurately adjusted to adapt to wafer bases of different shapes and sizes, and personalized repair processing can be achieved. At the same time, adjusting the rotation speed and feed speed of the tool can optimize the cutting conditions, reduce processing stress and thermal deformation, and thus obtain the required flatness. This scheme not only improves the processing accuracy, but also reduces the processing time and labor costs through automated control. In addition, the method also includes a post-processing inspection step, using a measuring device to detect the surface flatness of the processed wafer base, ensuring the reliability and verifiability of the repair quality.

[0019] Furthermore, the delivery of the aerosol lubricant in the step 4 is achieved by controlling the connection between the nozzle of the aerosol mixing mechanism and the internal channel of the resin tool, so as to achieve uniform distribution of the aerosol in the cutting area. The nozzle of the aerosol mixing mechanism is directly connected to the channel inside the resin tool, ensuring that the lubricant can be accurately delivered to the cutting area. This direct connection method improves the delivery efficiency of the lubricant and reduces possible losses or uneven distribution during the delivery process. The uniform distribution of the aerosol helps to maintain the temperature stability of the cutting area, reduce the adverse effects of heat on the workpiece material and the tool, thereby improving the stability of the processing process and the finish of the processed surface.

[0020] Further, the flow and pressure of the aerosol lubricant in the step 4 are adjusted by the pressure regulating valve and the flow control valve in the aerosol mixing mechanism, and the pressure is increased in the cutting interval to blow the debris away from the added area. Through the pressure regulating valve and the flow control valve, the operator can dynamically adjust the output of the aerosol according to the changes in processing conditions, such as cutting force, workpiece material hardness, etc., to achieve the best lubrication and cooling effect. In addition, the mechanism of increasing pressure in the cutting interval can effectively remove metal debris in the processing area, and prevent the debris from damaging the processing surface or affecting the processing accuracy. The precise control of the aerosol lubricant during the processing is crucial to ensure the processing quality. Different processing stages may require different lubrication and cooling conditions. Through the setting of the regulating valve, these changes can be flexibly responded to to ensure the continuity and stability of the processing process. By accurately adjusting the flow and pressure of the aerosol, the processing efficiency can be improved and the processing defects caused by insufficient or excessive lubrication can be reduced. At the same time, the mechanism of increasing the pressure to blow the debris helps to keep the processing area clean and further improve the processing quality and the reliability of equipment operation.

[0021] This solution has the following beneficial effects: Through the precise control of the CNC system and the uniform cutting of the resin tool, the processing error is reduced, ensuring that the wafer base reaches the required flatness after repair.

[0022] The steam mist lubrication system with built-in channel and nozzle design effectively reduces the temperature in the cutting area, reduces tool wear and extends tool life.

[0023] The tilted channels and increased pressure strategy work together to effectively remove debris from the processing area, avoiding secondary damage and equipment failure.

[0024] The pressure regulating valve and flow control valve in the steam-mist mixing mechanism can realize dynamic adjustment to adapt to different processing conditions and shorten the processing time.

[0025] The design of the debris collection trough reduces the impact of processing waste on the environment, promotes material recycling, and meets the requirements of sustainable development. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a structural schematic diagram of the processing base of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of the lubrication mechanism in Example 3.

[0028] Figure 3 It is a side sectional view of the protective cover in Example 5.

[0029] In the figure: 100 wafer base heater, 101 electrode rod, 1 processing base, 2 tool fixing seat, 21 connection port, 3 processing tool, 31 channel, 4 nozzle, 5 aerosol generating part, 51 mixing chamber, 52 first chamber, 53 second chamber, 6 pressure regulating valve, 61 flow display meter, 7 debris collecting tank, 71 tank bottom, 8 protective cover, 81 groove, 82 cavity. DETAILED DESCRIPTION

[0030] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0031] Example 1 like Figure 1 As shown, in this embodiment, the processing device for repairing the wafer base is based on a precision CNC vertical lathe, which is equipped with a tool fixing seat 2 that can move along three orthogonal directions of X, Y, and Z to achieve multi-axial precision processing of the wafer base heater 100. This design not only provides flexibility in the processing process, but also ensures processing accuracy and efficiency.

[0032] The resin processing tool 3 installed on the tool fixing seat 2 has a diameter range of 60mm-120mm. The selection of this diameter range takes into account the size of the workpiece to be processed and the required cutting force, ensuring the stability and rigidity of the tool during the cutting process. The tool fixing seat 2 includes a porous connection port 21 connected to each nozzle 4 in the lubrication mechanism. At least one channel 31 is provided inside the resin tool, and these channels 31 extend from the tool handle to the cutting edge, allowing the lubrication mechanism to directly transport the lubricating medium to the cutting area through these channels. The design of this built-in channel reduces the loss of the lubricating medium during the transportation process and ensures the efficient use of the lubricating medium. The lubrication mechanism includes one or more nozzles 4, which are connected to the channels inside the resin tool to ensure that the lubricating medium can be evenly sprayed onto the processing surface. The arrangement and design of the nozzles allow the vapor mist to form a uniform covering layer in the processing area, effectively reducing the temperature of the cutting area, reducing the thermal deformation of the tool and the workpiece, and providing necessary lubrication to reduce friction and wear. The design of the aerosol generating unit 5 further enhances the function of the lubrication mechanism. It is connected to a compressed air source and a lubricant source, and the output pressure of the aerosol is controlled by a pressure regulating valve. This design allows the operator to precisely adjust the pressure of the gas mist according to the actual processing conditions, such as the hardness of the workpiece material, the type of tool, etc., in order to achieve the best lubrication and cooling effect.

[0033] In this embodiment, the processing base 1 not only provides a stable support and precise positioning, but also includes a debris collection groove 7, which is arranged around the outer edge of the processing area, and the groove bottom 71 can be disassembled to facilitate the cleaning of metal debris. This design effectively collects and stores the metal debris generated during the processing process, avoids the secondary damage of the debris to the processing surface, and also reduces the complexity and time of subsequent cleaning work.

[0034] In the implementation of the wafer base repair method, the wafer base to be processed is first placed in the center position of the four-claw chuck, and the four claws of the chuck are used to clamp the periphery of the wafer base respectively. This step ensures the stability and precision of the wafer base during the processing. Subsequently, the numerical control system controls the tool holder 2 to move along the X, Y, and Z axis directions according to the pre-set processing program, so that the resin tool gradually approaches the surface of the wafer base. During the cutting process, the rotation speed and feed speed of the tool are adjusted, and the surface of the wafer base heater 100 is milled with appropriate cutting parameters. In this step, the aerosol lubricant transported through the internal channel of the resin tool to the cutting area effectively reduces the temperature of the cutting area, reduces tool wear, and improves the finish of the processed surface. After the processing is completed, the tool rotation and machine tool movement are stopped, and the surface flatness of the processed wafer base is detected using a measuring device. This detection step verifies the processing quality and ensures that the wafer base meets the technical requirements after repair.

[0035] In this embodiment, during the delivery of the aerosol lubricant, the direct connection between the nozzle and the internal channel of the resin tool is a key structural design. This design simplifies the lubrication system and avoids complex pipeline layout, while ensuring that the vapor mist can act directly on the cutting area, providing a more uniform lubrication and cooling effect. This direct connection also helps to reduce the cost and maintenance difficulty of the system. Specifically, for the compressed air source, we chose an industrial-grade air compressor, which provides compressed air that is both economical and easy to obtain, while ensuring sufficient pressure and flow to meet the generation requirements of the aerosol lubricant. This air compressor can continuously and stably provide a pressure of 5-10 bar, providing the necessary power for the vapor mist mixing mechanism.

[0036] In terms of the selection of lubricants, this embodiment uses a synthetic base oil with good lubricity and cooling properties, as well as low volatility and high flash point, ensuring safety during processing. This synthetic oil is usually composed of poly-alpha-olefin (PAO) or ester oil. Depending on the processing material, this embodiment may add some polar additives to improve lubricity and reduce friction.

[0037] The resin tool selected in this embodiment is a high-performance polyetheretherketone (PEEK) material, which has excellent mechanical properties, chemical corrosion resistance and thermal stability. The PEEK tool can withstand temperatures as high as 160° C. during processing while maintaining its structural integrity.

[0038] The design of the steam-mist mixing mechanism uses multiple precision nozzles, which are optimally arranged according to the size and shape of the processing area to ensure that the steam mist can evenly cover the entire cutting area. The nozzle design uses stainless steel material to resist corrosion and wear while ensuring accurate spraying of the steam mist.

[0039] The design of the processing base 1 takes into account the stability of the workpiece and the management of debris. The four-jaw chuck is made of high-strength alloy steel, which can firmly clamp the wafer base to ensure stability during processing. The design of the debris collection tank 7 adopts wear-resistant plastic materials, such as polytetrafluoroethylene (PTFE), which is not only light but also has good chemical corrosion resistance, which is convenient for cleaning debris.

[0040] The programming and control of the CNC system adopts advanced computer-aided manufacturing (CAM) software, which can generate accurate processing paths and parameters according to different processing requirements. The CNC system has a friendly operation interface, which is easy for operators to set and monitor parameters.

[0041] Example 2 In this embodiment, a processing method for repairing the surface of a heater using the processing device in Embodiment 1 is disclosed: Before starting the operation process of this solution, you need to first conduct a comprehensive inspection of the machine tool to ensure that all components and systems are in good working condition. This includes the self-check procedure of the CNC system to ensure that all electronic components and interfaces are free of any faults. At the same time, you also need to check the compressed air source and lubricant source to ensure that their pressure and flow meet the processing requirements.

[0042] After confirming that the machine tool is in good condition, the operator selects the appropriate resin tool according to the process requirements and selects the appropriate diameter size according to the parameters in the reference table. For example, a resin tool with a diameter of 80mm may require higher cutting force and wear resistance when processing materials with higher hardness, while a tool with a smaller diameter is suitable for situations with higher precision requirements and smaller removal volume.

[0043] Next, the operator places the wafer base in the center of the four-claw chuck and stably clamps the wafer base with the claws of the chuck. At this time, the operator needs to carefully adjust the position of the chuck to ensure that the center of the wafer base is aligned with the rotation center of the CNC machine tool, which is a key step to ensure processing accuracy.

[0044] According to the preset program, the CNC system starts to control the tool holder 2 to move along three orthogonal directions of X, Y, and Z, and adjusts the tool to the preset starting position. The operator inputs the feed speed and removal amount parameters obtained from the reference table through the touch screen interface of the CNC system, such as a feed speed of 0.1mm / min and a removal amount of 0.03mm. Subsequently, the steam mist mixing mechanism is triggered, the compressed air and lubricant sources are started, and the output pressure and flow of the steam mist are accurately controlled by the pressure regulating valve and the flow control valve. At this time, the steam mist is evenly sprayed into the cutting area through the channels and nozzles inside the resin tool, providing sufficient lubrication and cooling for the tool and the workpiece. While the steam mist is sprayed, the rotation of the tool is started, and the CNC system controls the tool to approach and start cutting the surface of the wafer base at the set feed speed. The operator needs to closely monitor the feedback information of the CNC system to ensure that the movement and rotation speed of the tool meet the preset parameters, and pay attention to observe whether there are any abnormal phenomena during the cutting process, such as tool vibration or workpiece displacement.

[0045] During the cutting process, the operator needs to adjust the steam mist output pressure and flow rate in a timely manner according to the actual processing feedback. For example, if it is found that the tool marks on the machined surface are obvious, it may be necessary to appropriately reduce the steam mist output pressure to reduce the contact pressure between the tool and the workpiece and improve the surface quality.

[0046] After the processing is completed, the operator stops the tool rotation and the movement of the CNC machine tool to perform a quality inspection on the wafer base. Use high-precision measuring equipment, such as a laser interferometer or a three-dimensional coordinate measuring machine, to detect the surface flatness of the wafer base to ensure that it meets the technical requirements. If the test results show that the flatness does not meet the requirements, the operator can readjust the parameters of the CNC system as needed, such as changing the feed speed or removal amount, and re-process. If the test results are satisfactory, the operator can proceed to the next processing operation, such as further finishing or surface treatment of the wafer base.

[0047] During the entire machining process, the operator also needs to pay attention to the maintenance and cleaning of the machine tool. Regularly check the wear of the tool, replace or sharpen the tool in time to ensure that it maintains good cutting performance. At the same time, clean the debris collection groove on the machining base 1 to keep the machine tool clean and tidy, and the groove bottom 71 of the debris collection groove 7 can be disassembled and cleaned.

[0048] Example 3 According to relevant data, the cost associated with lubricating cutting fluid is equivalent to 7%-17% of the total manufacturing cost, while the tool cost accounts for only 2%-4%. In this embodiment, we optimize the lubrication mechanism in the wafer base repair process in order to achieve more efficient and economical processing. The core of the optimization is that the nozzle sprays a gas and lubricant atomized mixture formed by a mixture of a compressed gas source and a lubricant source during the cutting process, and only uses pressurized gas to blow metal debris during the cutting interval, thereby saving the use of lubricant. This design significantly reduces the waste of lubricant, especially during the cutting interval, where only compressed gas is used to remove debris without the participation of lubricants, which not only reduces production costs, but also reduces the impact on the environment. By precisely controlling the use of lubricants, processing efficiency and workpiece surface quality can also be improved.

[0049] like Figure 2 As shown, in this embodiment, the core components of the lubrication mechanism include a mixing chamber 51, a pressure regulating valve 6, a flow control valve and a flow display meter 61. The mixing chamber includes a first chamber 52 and a second chamber 53 respectively connected to a compressed air source and a lubricant source, and the nozzle can adjust the mixing ratio of the gas and the lubricant according to the processing requirements. The pressure regulating valve is located between the compressed air source and the mixing chamber, and is used to control the pressure of the nozzle to ensure that the lubricant and the gas can be fully mixed and evenly sprayed. The flow control valve is located between the lubricant source and the mixing chamber, and is used to accurately control the flow of the lubricant, and is displayed through a flow display meter. The nozzle is directly connected to the internal channel of the resin tool to ensure that the steam mist can directly act on the cutting area.

[0050] In actual operation, the operator can adjust the pressure regulating valve and flow control valve through the CNC system according to the characteristics of the processed material and the processing conditions to achieve the best processing effect. For example, when processing materials with higher hardness, it may be necessary to increase the supply of lubricant to reduce tool wear; and during the cutting interval, the pressure of the compressed gas can be increased to more effectively remove the debris. In addition, in order to ensure the long-term stable operation of the lubrication mechanism, the pressure regulating valve, flow control valve and nozzle need to be regularly inspected and maintained.

[0051] In order to further improve processing efficiency and reduce costs, it is theoretically possible to consider using different types of gases as compressed gas sources, such as nitrogen or carbon dioxide, which may have better cooling effects or more environmentally friendly properties. At the same time, the use of biodegradable lubricants can also be explored to further reduce the impact on the environment.

[0052] Example 4 In this embodiment, the applicant used resin cutters with diameters of 60 mm, 80 mm, 100 mm and 120 mm, as well as specific feed speeds and removal amounts, and conducted six groups of experiments. Through these experiments, the purpose is to explore the processing quality and flatness of the wafer base under different cutter parameters.

[0053] First, we tested a resin tool with a diameter of 120mm. Under the conditions of a feed rate of 0.1mm / min and a removal amount of 0.03mm, the surface flatness of the machined disc reached 0.0212mm, but the surface knife marks were more obvious. This shows that although a larger tool diameter can provide better cutting stability, a higher feed rate may lead to a decrease in surface quality during machining.

[0054] Next, we used a resin tool with a diameter of 100 mm and maintained the same feed rate and removal volume. The test results showed that the surface flatness of the disc was 0.0192 mm, and the surface knife marks were still obvious. This result further confirmed the influence of tool diameter on processing quality and surface knife marks.

[0055] In order to obtain better surface quality, we switched to a resin tool with a diameter of 80 mm and conducted two sets of tests. In the first set of tests, the feed rate was kept at 0.1 mm / min, the removal amount was 0.03 mm, the flatness was 0.0125 mm, and the surface knife marks were more obvious. In the second set of tests, we reduced the feed rate to 0.05 mm / min, the flatness was 0.0135 mm, and the surface knife marks were reduced.

[0056] Further reducing the feed rate to 0.08mm / min and retaining the same removal amount, we obtained more satisfactory results. The surface flatness of the disc body reached 0.0085mm, and the surface knife marks basically disappeared. This shows that at an appropriate feed rate, even with a smaller tool diameter, a high-quality machined surface can be obtained.

[0057] Finally, we used a resin tool with a diameter of 60 mm, and the feed rate and removal amount remained unchanged. The results showed that the flatness was 0.015 mm and the surface knife marks were obvious. This shows that the reduction of tool diameter will affect the cutting stability to a certain extent, but by reducing the feed rate, good processing quality can still be obtained.

[0058] Through these experiments, we have drawn some key conclusions and suggestions. First, the choice of tool diameter should be determined according to the size of the wafer base and the processing requirements. A larger tool diameter can provide better cutting stability, but may make certain compromises in surface quality. Secondly, the control of feed speed has a significant impact on the processing quality and surface knife marks. Lower feed speeds help to obtain higher quality machined surfaces. Finally, by optimizing cutting parameters such as feed speed, removal amount and tool diameter, high-precision repair of the wafer base can be achieved. In summary, we use a resin tool with a diameter of 80 mm in Examples 1 and 2 to ensure that the marks on the processed surface are reduced as much as possible or even eliminated.

[0059] When applying this solution in actual production, the following issues need to be noted. First, the appropriate tool diameter should be selected according to the specific size and material properties of the wafer base. Secondly, the CNC system should accurately control the tool feed speed and cutting path according to the processing requirements and tool parameters. In addition, the tool should be regularly inspected and maintained to ensure its sharpness and stability. Finally, high-precision measuring equipment should be used to perform quality inspection on the processed wafer base to ensure that it meets the technical requirements.

[0060] In terms of the preferred solution, we can consider using coating technology to improve the wear resistance and corrosion resistance of the tool, thereby extending its service life. In addition, we can explore the use of different types of lubricants to further improve processing efficiency and surface quality. We can also consider introducing advanced monitoring and diagnostic technologies to achieve real-time monitoring and optimization of the processing process.

[0061] Example 5 like Figure 3 As shown, in this embodiment, a protective cover 8 is added to the electrode rod 101 at the bottom of the heater. The protective cover 8 is made of acrylic material and is equipped with a sealing ring to prevent the infiltration of cutting fluid during processing. This innovative design not only improves the safety of the processing process, but also ensures the integrity and functionality of the electrode rod 101.

[0062] The design of the protective cover 8 takes into account the differences in the lengths of the electrode rods 101 of different heaters. The length and size of the protective cover 8 can be customized according to the specific size of the electrode rod 101 to achieve the best protection effect. The basic shape of the protective cover 8 is cylindrical, and the internal cavity 82 fits tightly with the electrode rod 101, and a certain space is left on the top to accommodate the top structure of the electrode rod 101. The inner wall of the protective cover is designed with a groove 81 to facilitate the installation of the sealing ring. The sealing ring is made of oil-resistant and wear-resistant materials, such as rubber or silicone, to ensure its stability and sealing performance during processing.

[0063] The installation process of the protective cover is as follows: First, select a suitable protective cover according to the size of the heater electrode rod 101. Then, put the protective cover on the electrode rod 101 and adjust the position so that its bottom is tightly fitted with the bottom of the electrode rod 101. Next, install a sealing ring in the inner wall groove of the protective cover to ensure that a good seal is formed between the sealing ring and the inner wall of the protective cover and the electrode rod 101. Finally, install the electrode rod 101 equipped with the protective cover and the sealing ring on the wafer base.

[0064] During the processing, the protective cover plays a role in the following aspects: First, the protective cover can prevent the cutting fluid from directly contacting the electrode rod 101, thereby preventing the electrode rod 101 from being corroded or damaged due to long-term contact with the cutting fluid. Second, the protective cover can reduce the impact and wear of the debris generated during the cutting process on the electrode rod 101, thereby extending the service life of the electrode rod 101. In addition, the protective cover can also play a certain role in heat insulation, reduce the temperature of the electrode rod 101 during the processing, and improve the safety of the processing.

[0065] It is also worth noting that the material selection of the protective cover and the sealing ring needs to take into account its compatibility with the cutting fluid and its stability in a high temperature environment. Therefore, in practical applications, the material, size and sealing ring selection of the protective cover need to be optimized according to specific processing conditions and requirements.

Claims

1. A processing device for repairing a wafer base, characterized in that: include: A processing base, the processing base is provided with a tool fixing seat movable along three orthogonal directions of X, Y and Z, and a processing tool is installed on the tool fixing seat; Wherein, a lubrication mechanism for providing lubricating medium to the machining tool is connected to the machining base; Wherein, the pressure of the lubricating medium output by the lubricating mechanism is variable.

2. The device according to claim 1, characterized in that: The processing tool is a resin tool, and the diameter of the resin tool ranges from 60mm to 120mm.

3. The device according to claim 2, characterized in that: At least one channel is provided inside the resin tool, and the channel extends from the shank of the machining tool to the cutting edge of the machining tool. The lubricating mechanism delivers lubricating medium to the machining area.

4. The device according to claim 3, characterized in that: The lubricating mechanism comprises one or more nozzles arranged corresponding to the number of channels, and the nozzles evenly disperse the lubricating medium into each channel inside the resin tool.

5. The device according to claim 1, characterized in that: The lubricating mechanism is connected to a compressed air source and a lubricant source, and the lubricating mechanism includes an aerosol generating part connected to a nozzle.

6. The device according to claim 5, characterized in that: The aerosol generating part comprises a pressure regulating valve for controlling the output pressure of the aerosol; the extension line of the channel is arranged at an inclined angle to the processing surface.

7. The device according to any one of claims 1 to 6, characterized in that: The processing base also includes a debris collection groove, which is arranged around the outer edge of the processing area.

8. A method for repairing a wafer base, characterized in that The specific steps include: Step 1: Place the wafer base to be processed at the center of the four-jaw chuck, and use the four jaws of the chuck to clamp the periphery of the wafer base respectively; Step 2: Start the CNC system and control the tool holder to move along the X-axis, Y-axis and Z-axis according to the pre-set processing program, so that the resin tool gradually approaches the surface of the wafer base; Step 3: Adjust the rotation speed and feed speed of the tool, and start milling the surface of the wafer base heater with appropriate cutting parameters until the required flatness is achieved; Step 4: During the machining process, the vapor mist lubricant is delivered to the cutting area through the internal channel of the resin tool; Step 5: After the processing is completed, stop the tool rotation and machine tool movement, and use measuring equipment to detect the flatness of the processed wafer base surface.

9. The repair method according to claim 8, characterized in that: The delivery of the vapor mist lubricant in step 4 is achieved by controlling the connection between the nozzle of the vapor mist mixing mechanism and the internal channel of the resin tool to achieve uniform distribution of the vapor mist in the cutting area.

10. The repair method according to claim 8, characterized in that: In step 4, the flow rate and pressure of the vapor mist lubricant are adjusted by the pressure regulating valve and the flow control valve in the vapor mist mixing mechanism, and the pressure is increased during the cutting interval to blow the debris away from the cutting area.

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