Construction method of multi-layer carrier pile

Abstract

The invention discloses a construction method of a multi-layer carrier pile, relates to the field of building construction, and aims to solve the quality problem of a pile body. According to the technical scheme, the construction method comprises the steps that S1, construction preparation is conducted, specifically, a pile machine is moved to a pile position, the center of a pile casing is aligned with the pile center, and the perpendicularity of the pile casing is adjusted; s2, the immersed tube is tamped, specifically, the tube is immersed to the designed pile bottom elevation or the upper portion of the designed pile bottom elevation, a winch pulls up a column hammer to conduct tamping, and meanwhile an outer pile casing synchronously sinks to the designed pile bottom elevation or the upper portion of the designed pile bottom elevation; and S3, the carrier material is tamped to form a carrier, specifically, the column hammer is pulled up, the pile casing is filled with a certain amount of the carrier material in batches, the column hammer conducts tamping, and the carrier is formed after the certain amount of the carrier material is tamped. And S4, a pile body is placed, specifically, the column hammer is lifted out, and the pile body is placed in the pile casing. And S5, pile forming is conducted, specifically, after the pile body is placed, pipe drawing and pile forming are conducted. According to the construction method of the multi-layer carrier pile, the high-quality pile body can be prepared, and the compression resistance, shear resistance and pulling resistance of the pile body are improved.

Description

Technical Field

[0001] The invention relates to the technical field of building construction, and more particularly to a construction method for a multi-layer carrier pile. Background Art

[0002] Carrier piles are a mature pile foundation construction technology. Traditional carrier piles are mostly one carrier. The bottom of the pile body is located on the upper part of the single carrier or enters a certain part of the carrier. The bottom of the pile body and the carrier are not effectively connected, which reduces the pull-out and shear bearing capacity of the pile to a certain extent. Especially in geologically complex areas, it is ineffective for projects that require reinforcement of multiple sections of soil around piles. There are also projects that require shear resistance, and a single carrier cannot meet their requirements.

[0003] Therefore, a new solution needs to be proposed to solve this problem. Summary of the invention

[0004] In view of the deficiencies in the prior art, the object of the present invention is to provide a construction method for multi-layer carrier piles, which obtains a multi-layer carrier by changing the molding method of the carrier, thereby improving the load-bearing capacity, shear resistance, pull-out resistance of the carrier pile and the effective connection between the pile body and the carrier.

[0005] The above technical purpose of the present invention is achieved through the following technical solution: A construction method of a multi-layer carrier pile comprises the following steps: S1. Construction preparation: Move the pile driver to the pile position, align the center of the casing with the pile center, and adjust the verticality of the casing; S2. Ramming and sinking pipe: sink the pipe to the designed pile bottom elevation or the upper part of the designed pile bottom elevation, and the winch pulls up the column hammer for ramming. At the same time, the outer casing sinks synchronously until it reaches the designed pile bottom elevation or the upper part of the designed pile bottom elevation. The pipe sinking method is completed by one of the following or a combination: ① Vibration sinking ② Back pressure sinking ③ Ramming sinking ④ Spiral drilling sinking

[0006] S3. Ramming the carrier material to form a carrier: Pull up the column hammer, fill a certain amount of carrier material into the casing in batches, and tamp with the column hammer to complete the tamping of a certain amount of carrier material to form the first carrier. The carrier is formed by one or a combination of the following methods: ① Sink to the designed pile bottom elevation and start tamping the carrier material to form the lower layer carrier, then raise the casing to a certain height and tamp the carrier material to form the upper layer carrier, and so on, multiple carriers can be formed. ② Sink to a certain distance above the designed pile bottom elevation, first tamp to form the upper layer carrier, then sink the casing, tamp to form the lower layer carrier, and so on, multiple carriers can be formed. ③ Sink to the designed elevation and tamp the carrier material to form a single carrier.

[0007] S4. Place the pile body: Raise the column hammer and place the pile body in the casing; the control of the pile bottom elevation includes one of the following or a combination: ① The pile body passes through the upper carrier, and the pile bottom elevation is located above the lower carrier or enters the lower carrier to a certain depth. ② The pile bottom elevation is located in the upper carrier and does not penetrate the upper carrier. ③ The pile bottom elevation is located above the uppermost carrier and does not enter the upper carrier. ④ The pile bottom elevation is located on a single carrier or enters a single carrier to a certain depth.

[0008] S5. Pile formation: After placing the pile body, pull out the pipe to form the pile.

[0009] The present invention is further configured as follows: the upper carrier and the lower carrier can be completely independent or combined with each other.

[0010] The present invention is further configured such that: the bottom of the pile body is located inside the upper carrier or on the upper part of the upper carrier.

[0011] The present invention is further configured such that: the bottom of the pile body is located on the upper part of the lower carrier or inside the lower carrier.

[0012] The present invention is further configured such that the bottom of the pile body is located on the upper part or inside of the single carrier.

[0013] The present invention is further configured as follows: the carrier material can be one or a combination of dry concrete, dry mortar, concrete, mortar, broken bricks, broken stones, and steel slag.

[0014] The present invention is further configured as follows: the pile body can be reinforced concrete, plain concrete, prefabricated piles, etc.

[0015] The present invention is further configured as follows: in step S5, when the pipe is pulled out to form a pile, the grouting machine is connected to the high-pressure nozzle, and a certain proportion of cement slurry is injected from the bottom of the pile. At the same time, the vibration device is turned on, and the casing is pulled out while grouting, so that the cement slurry fills the gap between the pile and the soil to make it tightly combined and reinforce the soil layer around the pile.

[0016] The present invention is further configured as follows: the casing is provided with a double-layer structure, and a plurality of vertical grouting pipes are provided between the double-layer structures for grouting.

[0017] In summary, the present invention has the following beneficial effects: the present invention utilizes secondary immersed tube construction to form a multi-layer carrier, and the pile body is made of reinforced concrete, plain concrete or precast piles, so that the pile body and the carrier are effectively combined, thereby achieving pull-out and shear resistance effects, solving the requirements that the carrier pile is pull-out, compression and shear resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The structure of the present invention is schematically shown Figure 1 ; In the figure: 1. Column hammer; 2. Pipe sinking and pulling and grouting device; 3. Casing; 4. Grouting pipeline; 5. Pile body; 6. Upper carrier; 7. Lower carrier. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Embodiment 1: A construction method of a multi-layer carrier pile comprises the following steps: S1. Construction preparation: Move the pile driver to the pile position, align the center of the casing with the pile center, and adjust the verticality of the casing; S2. Ramming and sinking the pipe: sink the pipe to the designed pile bottom elevation or the upper part of the designed pile bottom elevation, the winch pulls up the column hammer to ram, and the outer casing sinks synchronously until it reaches the designed pile bottom elevation or the upper part of the designed pile bottom elevation; S3, tamping the carrier material to form a carrier: pull up the column hammer, fill a certain amount of carrier material into the casing in batches, and tamp the column hammer to tamp a certain amount of carrier material to form a carrier; S4. Place the pile: lift the column hammer and place the pile in the casing; S5. Pile formation: After placing the pile body, pull out the pipe to form the pile.

[0021] The upper carrier and the lower carrier can be completely independent or combined with each other.

[0022] In step S2, the immersed tube method is completed by one or a combination of the following: ①Vibration pipe sinking; ② Counter-pressure sinking tube; ③ Ramming and sinking the pipe; ④Spiral drilling and sinking of pipes.

[0023] In step S3, the carrier is formed by one or a combination of the following methods: ① Sink to the designed pile bottom elevation and start tamping the carrier material to form the lower layer carrier, then raise the casing to a certain height and tamping the carrier material to form the upper layer carrier, and so on to form multiple carriers; ② Sink to a certain distance above the designed pile bottom elevation, first tamp to form the upper carrier, then sink the casing, tamp to form the lower carrier, and so on to form multiple carriers; ③ Sink to the designed elevation and tamp the carrier material to form a single carrier.

[0024] In step S4, the pile bottom elevation is controlled by one or a combination of the following methods: ① The pile body passes through the upper carrier, and the pile bottom elevation is located above the lower carrier or enters the surface or a certain depth into the lower carrier; ② The pile bottom elevation is located in the upper carrier and does not penetrate the upper carrier; ③ The pile bottom elevation is located above the uppermost carrier and does not enter the upper carrier; ④ The pile bottom elevation is located on a single carrier or enters a certain depth into a single carrier.

[0025] The carrier material is one or a combination of cement, concrete, mortar, broken bricks, broken stones, and steel slag.

[0026] The pile body is one or more of reinforced concrete, plain concrete, and precast piles.

[0027] In step S5, when the pipe is pulled out to form a pile, the grouting machine is connected to a high-pressure nozzle and a certain proportion of cement slurry is injected from the bottom of the pile. At the same time, the vibration device is turned on, and the casing is pulled out while grouting, so that the cement slurry fills the gap between the pile and the soil to make it tightly combined and reinforce the soil layer around the pile.

[0028] The casing is provided with a double-layer structure, and a plurality of vertical grouting pipes are arranged between the double-layer structures for grouting.

[0029] The casing is provided with a double-layer structure, and a plurality of grouting pipes wound around the sides of the casing are provided between the double-layer structures for grouting.

[0030] Embodiment 2: A construction method of a multi-layer carrier pile comprises the following steps: S1. Construction preparation: Move the pile driver to the pile position, align the center of the casing with the pile center, and adjust the verticality of the casing; S2. Ramming and sinking the pipe: When the pipe is sunk to a certain distance above the designed pile bottom elevation, the winch pulls up the column hammer for ramming, and the outer casing sinks synchronously until it reaches a certain distance above the designed pile bottom elevation; S3, tamping the carrier material to form a carrier: pull up the column hammer, fill a certain amount of carrier material into the casing in batches, and tamp the column hammer to tamp a certain amount of carrier material to form an upper layer of carrier; S4. Secondary tamping of carrier material: After the upper carrier is completely formed, the casing is sunk to the pile bottom elevation, and the carrier material is filled in batches below the upper carrier formed in the casing, and the column hammer is used for tamping until the three-hit penetration reaches the design requirement, thereby forming a lower carrier located below the upper carrier. At this time, the upper carrier and the lower carrier may or may not be fused; S5. Place the pile body: lift the column hammer, measure the pile bottom elevation, lift the pile body and place it in the casing; S6. Pile formation: After placing the pile body, vibrate and pull out the pipe to form the pile.

[0031] Embodiment 3: Based on Embodiment 1, the bottom of the pile body is located above or inside the lower carrier, such as Figure 1 As shown, 1. column hammer; 2. pipe sinking and pulling and grouting device; 3. casing; 4. grouting pipeline; 5. pile body; 6. upper carrier; 7. lower carrier.

[0032] Embodiment 4: Based on Embodiment 1, the bottom of the pile body is located above or inside the upper carrier.

[0033] Embodiment 5: Based on Embodiment 2, the bottom of the pile body is located on or inside the lower carrier.

[0034] Embodiment 6: Based on Embodiment 2, the bottom of the pile body is located above or inside the upper carrier.

[0035] Embodiment 7: Based on Embodiment 2, the carrier may be provided with several Figure 1 As shown in ①②③④⑤, the number of carriers can be set as needed.

[0036] Of course, on the basis of the above-mentioned embodiments one to six, the pile body forming process includes pulling the pipe to form the pile, the grouting machine is connected to the high-pressure nozzle, and a certain proportion of cement slurry is injected from the bottom of the pile. At the same time, the vibration device is turned on, and the casing is raised while grouting, so that the cement slurry fills the gap between the pile and the soil to make it tightly combined and reinforce the soil layer around the pile.

[0037] The casing is provided with a double-layer structure, and a plurality of vertical grouting pipes are arranged between the double-layer structures for grouting.

[0038] Alternatively, the casing is provided with a double-layer structure, and a plurality of grouting pipes wound around the sides of the casing are provided between the double-layer structures for grouting.

[0039] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A construction method for multi-layer carrier piles, characterized in that: The following steps are involved: S1. Construction preparation: Move the pile driver to the pile position, align the center of the casing with the pile center, and adjust the verticality of the casing; S2. Ramming and sinking the pipe: sink the pipe to the designed pile bottom elevation or the upper part of the designed pile bottom elevation, the winch pulls up the column hammer to ram, and the outer casing sinks synchronously until it reaches the designed pile bottom elevation or the upper part of the designed pile bottom elevation; S3, tamping the carrier material to form a carrier: pull up the column hammer, fill a certain amount of carrier material into the casing in batches, and tamp the column hammer to tamp a certain amount of carrier material to form a carrier; S4. Place the pile: lift the column hammer and place the pile in the casing; S5. Pile formation: After placing the pile body, pull out the pipe to form the pile.

2. The construction method of a multi-layer carrier pile according to claim 1, characterized in that: The upper carrier and the lower carrier may be completely independent or combined with each other.

3. A dual-carrier construction method according to claim 1, characterized in that: In step S2, the immersed tube method is completed by one or a combination of the following: ①Vibration sinking tube; ② Counter-pressure sinking tube; ③ Ramming and sinking the pipe; ④Spiral drilling and sinking of pipes.

4. A dual-carrier construction method according to claim 1, characterized in that: In step S3, the carrier is formed by one or a combination of the following methods: ① Sink to the designed pile bottom elevation and start tamping the carrier material to form the lower layer carrier, then raise the casing to a certain height and tamping the carrier material to form the upper layer carrier, and so on to form multiple carriers; ② Sink to a certain distance above the designed pile bottom elevation, first tamp to form the upper carrier, then sink the casing, tamp to form the lower carrier, and so on to form multiple carriers; ③ Sink to the designed elevation and tamp the carrier material to form a single carrier.

5. The construction method of a multi-layer carrier pile according to claim 1, characterized in that: In step S4, the pile bottom elevation is controlled by one or a combination of the following methods: ① The pile body passes through the upper carrier, and the pile bottom elevation is located above the lower carrier or enters the surface or a certain depth into the lower carrier; ② The pile bottom elevation is located in the upper carrier and does not penetrate the upper carrier; ③ The pile bottom elevation is located above the uppermost carrier and does not enter the upper carrier; ④ The pile bottom elevation is located on a single carrier or enters a certain depth into a single carrier.

6. A dual-carrier construction method according to claim 1, characterized in that: The carrier material is one or a combination of cement, concrete, mortar, broken bricks, broken stones and steel slag.

7. A dual-carrier construction method according to claim 1, characterized in that: The pile body is one or more of reinforced concrete, plain concrete and prefabricated piles.

8. A dual-carrier construction method according to claim 1, characterized in that: In step S5, when the pipe is pulled out to form a pile, the grouting machine is connected to a high-pressure nozzle and a certain proportion of cement slurry is injected from the bottom of the pile. At the same time, the vibration device is turned on, and the casing is pulled out while grouting, so that the cement slurry fills the gap between the pile and the soil to make it tightly combined and reinforce the soil layer around the pile.

9. A dual-carrier construction method according to claim 8, characterized in that: The casing is provided with a double-layer structure, and a plurality of vertical grouting pipes are arranged between the double-layer structures for grouting.

10. A dual-carrier construction method according to claim 8, characterized in that: The casing is provided with a double-layer structure, and a plurality of grouting pipes wound around the sides of the casing are provided between the double-layer structures for grouting.

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