Photoresist replacement control method, device and system, storage medium and program

Abstract

The embodiment of the invention provides a photoresist replacement control method, device and system, a storage medium and a program, and the method comprises the steps: obtaining first photoresist information which is used for replacing the material information of a target photoresist of a to-be-replaced photoresist; acquiring second photoresist information, wherein the second photoresist information is material information of the photoresist to be replaced; generating first control information and second control information according to the first photoresist information and the second photoresist information; wherein the first control information is used for controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used for controlling the photoresist pipelines, except the photoresist pipeline corresponding to the photoresist to be replaced, in the photoetching equipment.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the technical field of semiconductor device manufacturing, and in particular, to a control method, device, system, storage medium and program for replacing photoresist. Background Art

[0002] In the field of semiconductor device manufacturing technology, photoresist is used in large quantities and needs to be replaced frequently.

[0003] However, the large number of photoresists and the variety of types make it very easy to cause errors in photoresist replacement. Since the types of photoresists installed in the pipelines inside the lithography equipment are fixed, incorrect replacement will cause the photoresists in the pipelines to mix, thereby affecting production efficiency. Therefore, how to avoid errors in photoresist replacement has become a technical problem that technicians in this field urgently need to solve. Summary of the invention

[0004] In view of this, the embodiments of the present disclosure provide a control method, device, system, storage medium and program for replacing photoresist, which can effectively avoid photoresist replacement errors, thereby improving the production efficiency of semiconductor devices.

[0005] First, an embodiment of the present disclosure provides a control method for replacing a photoresist, comprising:

[0006] Acquire first photoresist information, where the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced;

[0007] Acquire second photoresist information, where the second photoresist information is material information of the photoresist to be replaced;

[0008] First control information and second control information are generated according to the first photoresist information and the second photoresist information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used to control the photoresist pipeline in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced.

[0009] Optionally, generating first control information and second control information according to the first photoresist information and the second photoresist information includes:

[0010] Determining whether the first photoresist information and the second photoresist information are the same;

[0011] When confirming that the first photoresist information and the second photoresist information are the same, generating first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced; and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation;

[0012] When it is confirmed that the first photoresist information and the second photoresist information are different, first control information and second control information are generated; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and generate a prompt message of the target photoresist error; the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0013] Optionally, the first photoresist information is carried on a first photoresist identifier, which is set in a container containing the target photoresist; the second photoresist information is carried on a second photoresist identifier, which is set in a photoresist pipeline corresponding to the photoresist to be replaced.

[0014] Optionally, the first photoresist identification and the second photoresist identification are both in the form of barcodes; the first photoresist information and the second photoresist information are obtained by scanning with a scanner.

[0015] The disclosed embodiment also provides a control device for replacing photoresist, including:

[0016] An information acquisition unit, adapted to acquire first photoresist information and second photoresist information; the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced;

[0017] an information processing unit, adapted to generate first control information and second control information according to the first photoresist information and the second photoresist information;

[0018] The control unit is adapted to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information, and to control the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information.

[0019] The embodiment of the present disclosure also provides a control system for replacing photoresist, including: a scanning gun, a computer device and a flow control device, wherein:

[0020] The scanning gun is suitable for scanning to obtain first photoresist information and scanning to obtain second photoresist information; the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced;

[0021] The computer device is adapted to obtain first photoresist information and second photoresist information from the scanning gun; generate first control information and second control information according to the first photoresist information and the second photoresist information, transmit the first control information to the flow control device, and control the photoresist pipelines in the photolithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced;

[0022] The flow control device is coupled to the photoresist pipeline of the lithography equipment, and is suitable for obtaining first control information from the computer equipment, and controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information.

[0023] Optionally, the first photoresist information is carried on a first photoresist identifier, which is set in a container containing the target photoresist; the second photoresist information is carried on a second photoresist identifier, which is set in a photoresist pipeline corresponding to the photoresist to be replaced.

[0024] Optionally, the computer device is adapted to generate first control information and second control information according to the first photoresist information and the second photoresist information, including:

[0025] Determining whether the first photoresist information and the second photoresist information are the same;

[0026] When confirming that the first photoresist information and the second photoresist information are the same, generating first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation;

[0027] When it is confirmed that the first photoresist information and the second photoresist information are different, first control information and second control information are generated; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and control the flow control device to generate a prompt message of the target photoresist error, and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0028] Optionally, the flow control device is coupled to the photoresist pipeline of the lithography equipment, and includes:

[0029] The flow control device is detachably coupled to the photoresist pipeline of the photolithography equipment.

[0030] The embodiment of the present disclosure further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed, the steps of the control method for replacing the photoresist described in any of the aforementioned embodiments are executed.

[0031] The present disclosure also provides a computer program product, including computer instructions, which, when executed by a processor, implement the steps of the control method for replacing photoresist described in any of the aforementioned embodiments.

[0032] According to the control method for replacing photoresist provided by the embodiment of the present disclosure, since the first photoresist information is the material information of the target photoresist used to replace the photoresist to be replaced, and the second photoresist information is the material information of the photoresist to be replaced, whether the target photoresist used to replace the photoresist to be replaced is correct can be determined according to the first photoresist information and the second photoresist information, and the photoresist pipeline corresponding to the photoresist to be replaced can be determined. Therefore, according to the first photoresist information and the second photoresist information, first control information for controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced can be generated, and second control information for controlling the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced can be generated, thereby effectively avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0034] Figure 1A schematic diagram showing the steps of a control method for replacing photoresist in an embodiment of the present disclosure is shown;

[0035] Figure 2 A schematic diagram of the steps of generating first control information and second control information in an embodiment of the present disclosure is shown;

[0036] Figure 3 A schematic structural diagram of a control device for replacing photoresist in an embodiment of the present disclosure is shown;

[0037] Figure 4 A schematic structural diagram of a control system for replacing photoresist in an embodiment of the present disclosure is shown;

[0038] Figure 5 A schematic diagram of the coupling structure between a flow control device and a photoresist pipeline of a lithography device in an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0039] As described in the background art, the quantity and variety of photoresists are large, which can easily lead to photoresist replacement errors. Since the types of photoresists installed in the pipelines inside the lithography equipment are fixed, replacement errors can cause the photoresists in the pipelines to mix, thereby affecting production efficiency.

[0040] In response to the above problems, an embodiment of the present disclosure provides a control method for replacing photoresist. Since the first photoresist information is the material information of the target photoresist used to replace the photoresist to be replaced, and the second photoresist information is the material information of the photoresist to be replaced, whether the target photoresist used to replace the photoresist to be replaced is correct can be determined according to the first photoresist information and the second photoresist information, and the photoresist pipeline corresponding to the photoresist to be replaced can be determined. Therefore, according to the first photoresist information and the second photoresist information, first control information for controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced can be generated, and second control information for controlling the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced can be generated, thereby effectively avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices.

[0041] In order to enable those skilled in the art to better understand and implement the embodiments of the present disclosure, the concepts, schemes, principles and advantages of the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings and through specific application examples.

[0042] First, some embodiments of the present disclosure provide a control method for replacing a photoresist, referring to Figure 1 The schematic diagram of a control method for replacing photoresist is shown. The following steps can be used to control the replacement of photoresist, thereby avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices. The control method may include the following steps:

[0043] Step A: obtaining first photoresist information, wherein the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced.

[0044] The photoresist to be replaced refers to the photoresist used up in the photolithography process. For the used up photoresist, new photoresist needs to be provided so that the photolithography process can continue.

[0045] In some embodiments of the present disclosure, the first photoresist information may include a category of a target photoresist used to replace the photoresist to be replaced.

[0046] In some embodiments of the present disclosure, the first photoresist information may include information such as the type, production batch number, and expiration time of the target photoresist used to replace the photoresist to be replaced. Specifically, after determining whether the target photoresist is correct by the type of the photoresist, the production batch number, expiration time, and other information of the target photoresist may be further checked to confirm whether the target photoresist meets the usage conditions.

[0047] By using the above embodiment, the type of photoresist, production batch number and expiration time can not only accurately identify the type of photoresist, but also confirm whether the photoresist meets the usage conditions, thereby avoiding the adverse effects of expired photoresist on the processing process.

[0048] It can be understood that the first photoresist information may include only the type of the target photoresist, or a combination of the type of the target photoresist and any other one or more types of information.

[0049] It should be noted that the first photoresist information is not specifically limited in the embodiments of the present disclosure, and the first photoresist information listed in the above embodiments is only for illustrative purposes. In some embodiments of the present disclosure, the first photoresist information may also include other information such as the composition of the photoresist.

[0050] Step B, obtaining second photoresist information, where the second photoresist information is material information of the photoresist to be replaced.

[0051] In some embodiments of the present disclosure, the information type of the second photoresist information may be the same as the information type of the first photoresist information. For example, the second photoresist information includes the category of the photoresist to be replaced.

[0052] In some embodiments of the present disclosure, the second photoresist information may include information such as the type, production batch number, and expiration date of the photoresist to be replaced.

[0053] Step C, generating first control information and second control information according to the first photoresist information and the second photoresist information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used to control the photoresist pipeline in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced.

[0054] In some embodiments of the present disclosure, the first control information and the second control information may be generated by an integrated circuit. In some embodiments, the first control information and the second control information may be generated by a processor, such as a central processing unit (CPU), a microprocessor, or an FPGA (field programmable gate array). In some embodiments, the first control information and the second control information may be generated by a combination circuit of an integrated circuit and a processor.

[0055] The photoresist pipeline is used to transport photoresist. In a photolithography device, it usually includes multiple photoresist pipelines, each of which corresponds to a specific type of photoresist.

[0056] Using the above embodiment, since the first photoresist information is the material information of the target photoresist used to replace the photoresist to be replaced, and the second photoresist information is the material information of the photoresist to be replaced, therefore, according to the first photoresist information and the second photoresist information, it can be determined whether the target photoresist used to replace the photoresist to be replaced is correct, and the photoresist pipeline corresponding to the photoresist to be replaced can be determined. Therefore, according to the first photoresist information and the second photoresist information, first control information for controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced can be generated, and second control information for controlling the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced can be generated, thereby effectively avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices.

[0057] In some embodiments of the present disclosure, for step C, refer to Figure 2 The schematic diagram of a step of generating the first control information and the second control information shown may specifically include the following steps:

[0058] Step C1, determining whether the first photoresist information and the second photoresist information are the same.

[0059] Step C2, when confirming that the first photoresist information and the second photoresist information are the same, generate first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced; the second control information is used to lock the photoresist pipeline in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0060] Step C3, when confirming that the first photoresist information and the second photoresist information are different, generate first control information and second control information; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and generate a prompt message of the target photoresist error; the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0061] By adopting the above embodiment, when confirming that the first photoresist information and the second photoresist information are the same, the first control information for supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced is generated, so that the correctness of the target photoresist can be guaranteed. In addition, the second control information for locking the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced is also generated, so that the locked photoresist pipeline cannot perform the photoresist replacement operation, which can further avoid the error of photoresist replacement. By confirming that the first photoresist information and the second photoresist information are the same, the first control information for supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced is generated, so that the locked photoresist pipeline cannot perform the photoresist replacement operation, so as to further avoid the error of photoresist replacement. When the information is different, a first control information is generated for stopping the supply of the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced and generating a prompt message of a target photoresist error, so that the wrong target photoresist can be prevented from entering the photoresist pipeline corresponding to the photoresist to be replaced. At the same time, the prompt message is used to remind the staff to make a correct replacement. In addition, a second control information is generated for locking the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation, which can further avoid photoresist replacement errors.

[0062] In some embodiments of the present disclosure, the first photoresist information can be carried on a first photoresist identifier, which can be set in a container for accommodating the target photoresist; the second photoresist information can be carried on a second photoresist identifier, which can be set in a photoresist pipeline corresponding to the photoresist to be replaced.

[0063] By adopting the above embodiment, the first photoresist information and the second photoresist information are carried by the first photoresist mark and the second photoresist mark, which not only can realize the carrying of information, facilitate the scanning and identification of information, but also can ensure the accuracy of the obtained information, and can further reduce the probability of photoresist replacement errors.

[0064] In some embodiments of the present disclosure, the first photoresist identification and the second photoresist identification are both in the form of barcodes, and the first photoresist information and the second photoresist information are obtained by scanning with a scanner.

[0065] By adopting the above embodiment, a variety of information can be carried by a barcode, and then the first photoresist information and the second photoresist information can be obtained by scanning with a scanner. Not only is the operation convenient, but also due to the telemetry technology of the scanner, it is not limited by the collection environment and the operation is flexible.

[0066] The present disclosure also provides a control device for replacing photoresist, referring to Figure 3 The schematic diagram of the structure of a control device for replacing photoresist is shown, and the control device T for replacing photoresist may include:

[0067] The information acquisition unit T1 is adapted to acquire first photoresist information and second photoresist information; the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced;

[0068] An information processing unit T2, adapted to generate first control information and second control information according to the first photoresist information and the second photoresist information;

[0069] The control unit T3 is adapted to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information, and to control the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information.

[0070] Using the above embodiment, the first photoresist information and the second photoresist information are obtained by the information acquisition unit. Since the first photoresist information is the material information of the target photoresist used to replace the photoresist to be replaced, and the second photoresist information is the material information of the photoresist to be replaced, therefore, according to the first photoresist information and the second photoresist information, it can be determined whether the target photoresist used to replace the photoresist to be replaced is correct, and the photoresist pipeline corresponding to the photoresist to be replaced can be determined. Then, the information processing unit can generate first control information and second control information according to the first photoresist information and the second photoresist information. Then, the control unit can control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information, and control the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information, thereby effectively avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices.

[0071] In a specific implementation, the information acquisition unit may acquire information by adopting the relevant embodiments of acquiring information in the above-mentioned control method for replacing photoresist, which will not be described in detail here.

[0072] In a specific implementation, the information processing unit may generate control information by adopting the relevant embodiments of generating the first control information and the second control information in the control method for replacing the photoresist, which will not be described in detail here.

[0073] For ease of implementation, the present specification also provides a control system for replacing photoresist, referring to Figure 4 The schematic diagram of the structure of a control system for replacing photoresist is shown in the figure. The control system X for replacing photoresist may include a scanning gun X1, a computer device X2 and a flow control device X3, wherein:

[0074] The scanning gun X1 is suitable for scanning to obtain first photoresist information and scanning to obtain second photoresist information; the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced.

[0075] The computer device X2 is suitable for obtaining the first photoresist information and the second photoresist information from the scanning gun X1; generating the first control information and the second control information according to the first photoresist information and the second photoresist information, and transmitting the first control information to the flow control device, and controlling the photoresist pipelines in the photolithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced.

[0076] The flow control device X3 is coupled to the photoresist pipeline of the lithography equipment, and is suitable for obtaining first control information from the computer device X2, and controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information.

[0077] According to the above embodiment, the first photoresist information is obtained by scanning with the scanning gun, and the second photoresist information is obtained by scanning, and then the first photoresist information and the second photoresist information are obtained from the scanning gun by the computer device. Since the first photoresist information is the material information of the target photoresist used to replace the photoresist to be replaced, and the second photoresist information is the material information of the photoresist to be replaced, it can be determined whether the target photoresist used to replace the photoresist to be replaced is correct according to the first photoresist information and the second photoresist information, and the photoresist pipeline corresponding to the photoresist to be replaced can be determined. Then, the computer device can generate first control information and second control information according to the first photoresist information and the second photoresist information, transmit the first control information to the flow control device, and control the photoresist pipelines in the photolithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information. Then, the flow control device can control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information, thereby effectively avoiding photoresist replacement errors and improving the production efficiency of semiconductor devices.

[0078] In some embodiments of the present disclosure, the first photoresist information can be carried on a first photoresist identifier, which can be set in a container for accommodating the target photoresist; the second photoresist information can be carried on a second photoresist identifier, which can be set in a photoresist pipeline corresponding to the photoresist to be replaced.

[0079] By adopting the above embodiment, the first photoresist information and the second photoresist information are carried by the first photoresist mark and the second photoresist mark, which not only can realize the carrying of information, facilitate the scanning and identification of information, but also can ensure the accuracy of the obtained information, and can further reduce the probability of photoresist replacement errors.

[0080] In some embodiments of the present disclosure, the computer device may generate the first control information and the second control information by taking the following steps:

[0081] Step S1, determining whether the first photoresist information and the second photoresist information are the same.

[0082] Step S2, when confirming that the first photoresist information and the second photoresist information are the same, generate first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced; the second control information is used to lock the photoresist pipeline in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0083] Step S3, when confirming that the first photoresist information and the second photoresist information are different, generate first control information and second control information; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and control the flow control device to generate a prompt message of the target photoresist error, and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

[0084] In some embodiments of the present disclosure, the prompt information of the target photoresist error generated by the flow control device may be in the form of a sound alarm or a visual alarm.

[0085] It should be noted that the embodiments of the present disclosure do not impose any specific restrictions on the prompt information, as long as the prompt can be issued.

[0086] By adopting the above embodiment, the computer device can ensure the correctness of the target photoresist by generating first control information for supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced when confirming that the first photoresist information and the second photoresist information are the same. In addition, the computer device also generates second control information for locking the photoresist pipelines in the lithography device except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation, thereby further avoiding photoresist replacement errors. By confirming the first photoresist information and the second photoresist information At the same time, a first control information is generated for stopping the supply of target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced and controlling the flow control device to generate a prompt message of a target photoresist error, so that the wrong target photoresist can be prevented from entering the photoresist pipeline corresponding to the photoresist to be replaced. At the same time, the prompt message is used to remind the staff to make a correct replacement. In addition, a second control information is generated for locking the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation, which can further avoid photoresist replacement errors.

[0087] In some embodiments of the present disclosure, the flow control device can be detachably coupled to the photoresist pipeline of the lithography equipment, which is beneficial for subsequent cleaning operations.

[0088] In some embodiments of the present disclosure, the flow control device may include a pneumatic valve.

[0089] In some embodiments of the present disclosure, reference Figure 5 The schematic diagram of the coupling structure of a flow control device and a photoresist pipeline of a lithography device is shown, comprising a pipeline 1 at the end of the lithography device, a container cover 2 at the end of the lithography device, a pneumatic valve 3, and an internal pipeline 4 inserted into the photoresist container, wherein the pneumatic valve 3 is arranged on the internal pipeline 4 inserted into the photoresist container, and the dotted frame portion 5 is detachably connected to the pipeline 1 at the end of the lithography device.

[0090] The present disclosure also provides a computer-readable storage medium on which a computer program is stored, wherein when the computer program is executed, the steps of the control method for replacing the photoresist described in any of the above embodiments are executed. The specific steps can be referred to in the above embodiments and will not be repeated here.

[0091] In a specific implementation, the computer-readable storage medium may be any appropriate readable storage medium such as an optical disk, a mechanical hard disk, a solid-state hard disk, etc.

[0092] The present disclosure also provides a computer program product, including computer instructions, wherein when the computer instructions are executed by a processor, the steps of the control method for replacing photoresist described in any of the above embodiments are implemented. The specific steps can be referred to in the above embodiments and will not be repeated here.

[0093] It should be noted that the terms "first", "second", etc. in the embodiments of the present disclosure are only used to distinguish different photoresist information, control information, and photoresist identifications, and are not used to make any limitations on their specific information or forms.

[0094] Although the embodiments of the present disclosure are disclosed as above, the present application is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present application shall be subject to the scope defined by the claims.

Claims

1. A control method for replacing photoresist, characterized in that: include: Acquire first photoresist information, where the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced; Acquire second photoresist information, where the second photoresist information is material information of the photoresist to be replaced; First control information and second control information are generated according to the first photoresist information and the second photoresist information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used to control the photoresist pipeline in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced.

2. The method according to claim 1, characterized in that The generating first control information and second control information according to the first photoresist information and the second photoresist information includes: Determining whether the first photoresist information and the second photoresist information are the same; When confirming that the first photoresist information and the second photoresist information are the same, generating first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced; and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation; When it is confirmed that the first photoresist information and the second photoresist information are different, first control information and second control information are generated; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and generate a prompt message of the target photoresist error; the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

3. The method according to claim 1, characterized in that The first photoresist information is carried on a first photoresist mark, and the first photoresist mark is set in a container containing the target photoresist; The second photoresist information is carried on a second photoresist identifier, and the second photoresist identifier is set on the photoresist pipeline corresponding to the photoresist to be replaced.

4. The method according to claim 3, characterized in that The first photoresist identification and the second photoresist identification are both in the form of barcodes; the first photoresist information and the second photoresist information are obtained by scanning with a scanner.

5. A control device for replacing photoresist, characterized in that: include: An information acquisition unit, adapted to acquire first photoresist information and second photoresist information; The first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced; an information processing unit, adapted to generate first control information and second control information according to the first photoresist information and the second photoresist information; The control unit is adapted to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information, and to control the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information.

6. A control system for replacing photoresist, characterized in that: Includes scanners, computer equipment and flow control devices, including: The scanning gun is suitable for scanning to obtain first photoresist information and scanning to obtain second photoresist information; the first photoresist information is material information of a target photoresist used to replace the photoresist to be replaced, and the second photoresist information is material information of the photoresist to be replaced; The computer device is adapted to obtain first photoresist information and second photoresist information from the scanning gun; generate first control information and second control information according to the first photoresist information and the second photoresist information, transmit the first control information to the flow control device, and control the photoresist pipelines in the photolithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced according to the second control information; wherein the first control information is used to control the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced; The flow control device is coupled to the photoresist pipeline of the lithography equipment, and is suitable for obtaining first control information from the computer equipment, and controlling the photoresist supplied to the photoresist pipeline corresponding to the photoresist to be replaced according to the first control information.

7. The system according to claim 6, characterized in that The first photoresist information is carried on a first photoresist mark, and the first photoresist mark is set in a container containing the target photoresist; The second photoresist information is carried on a second photoresist identifier, and the second photoresist identifier is set on the photoresist pipeline corresponding to the photoresist to be replaced.

8. The system according to claim 6, characterized in that The computer device is adapted to generate first control information and second control information according to the first photoresist information and the second photoresist information, including: Determining whether the first photoresist information and the second photoresist information are the same; When confirming that the first photoresist information and the second photoresist information are the same, generating first control information and second control information; wherein the first control information is used to supply the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation; When it is confirmed that the first photoresist information and the second photoresist information are different, first control information and second control information are generated; wherein, the first control information is used to stop supplying the target photoresist to the photoresist pipeline corresponding to the photoresist to be replaced, and control the flow control device to generate a prompt message of the target photoresist error, and the second control information is used to lock the photoresist pipelines in the lithography equipment except the photoresist pipeline corresponding to the photoresist to be replaced, so that the locked photoresist pipeline cannot perform the photoresist replacement operation.

9. The system according to claim 6, characterized in that The flow control device is coupled to the photoresist pipeline of the lithography equipment, and includes: The flow control device is detachably coupled to the photoresist pipeline of the photolithography equipment.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is running, the steps of the control method for replacing photoresist as described in any one of claims 1 to 4 are executed.

11. A computer program product comprising computer instructions, characterized in that: When the computer instructions are executed by the processor, the steps of the control method for replacing photoresist as described in any one of claims 1-4 are implemented.

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