High-voltage cable equivalent thermal parameter solving method and device, equipment and storage medium

Abstract

The invention discloses a high-voltage cable equivalent thermal parameter solving method, device and equipment and a storage medium, and the method comprises the steps: collecting the outer skin temperature and cable core temperature of a high-voltage cable according to a preset period in a temperature rise experiment process of the high-voltage cable, constructing a temperature rise equation set of the high-voltage cable based on the collected outer skin temperature and cable core temperature, and calculating the equivalent thermal parameter of the high-voltage cable according to the temperature rise equation set; according to the method, the high-voltage cable does not need to be heated to a constant temperature and then data are collected to calculate the equivalent thermal parameters, so that the time of a temperature rise experiment can be shortened, the time consumed for determining the thermal parameters is reduced, and the temperature data collected by the whole temperature rise experiment can be utilized to determine the equivalent thermal parameters of the high-voltage cable. Meanwhile, all equivalent thermal parameters are solved, and the solving speed of the equivalent thermal parameters of the high-voltage cable is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of power transmission, and in particular to a method, device, equipment and storage medium for solving equivalent thermal parameters of a high-voltage cable. Background Art

[0002] With the continuous development of society, the demand for electricity in cities is also increasing. In the power system, high-voltage cables carry a large amount of power transmission tasks. When the current passes through the cable, heat loss will occur, causing the cable temperature to rise. If the cable temperature is too high, it may reduce the cable life, reduce the cable performance, and even cause safety accidents. Therefore, in order to ensure the safe and stable operation of the power system, it is very important to solve the temperature of the high-voltage cable core.

[0003] The solution to the cable core temperature mainly relies on the thermal circuit model. The thermal circuit model is composed of three major elements: heat source, temperature and thermal parameters. Knowing the values ​​of two of the three elements can determine the value of another element. Since the heat source can be calculated through the current flow of the cable and related electrical parameters, the cable conductor temperature can be solved after knowing the thermal parameters of the cable.

[0004] At present, the equivalent thermal parameters of cables are generally solved based on experimental results. For the thermal resistance parameters of cables, the cables need to be heated to a constant temperature state before the data values ​​at the constant temperature state can be used for calculation. This process is time-consuming, and only after the thermal resistance parameters are obtained can the transient temperature rise data be used to calculate the thermal capacity parameters of the cables. It can be seen that the solution of thermal resistance in the calculation process of equivalent thermal parameters is the bottleneck of the entire process. Summary of the invention

[0005] The present invention provides a method, device, equipment and storage medium for solving equivalent thermal parameters of a high-voltage cable, so as to solve the problem that it takes a long time to solve the equivalent thermal parameters after heating the high-voltage cable to a constant temperature state.

[0006] In a first aspect, the present invention provides a method for solving equivalent thermal parameters of a high voltage cable, comprising:

[0007] During the temperature rise test of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period;

[0008] Constructing a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature;

[0009] The temperature rise equations are solved to obtain equivalent thermal parameters of the high voltage cable.

[0010] Optionally, during the temperature rise test of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period, including:

[0011] Energizing the high-voltage cable with a preset current so that the temperature of the outer sheath and the cable core of the high-voltage cable increases;

[0012] The outer skin temperature and core temperature of the high-voltage cable are collected according to the preset cycle.

[0013] Optionally, a temperature rise equation group of the high-voltage cable is constructed based on the collected outer skin temperature and cable core temperature, including:

[0014] Constructing a first-order thermal circuit model of the high-voltage cable;

[0015] generating a first-order transient thermal circuit equation of the first-order thermal circuit model;

[0016] The outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple cycles are substituted into the first-order transient thermal circuit equation to construct the temperature rise equation group of the high-voltage cable.

[0017] Optionally, constructing a first-order thermal circuit model of the high-voltage cable includes:

[0018] Construct a first-order thermal circuit model consisting of equivalent heat source, equivalent thermal resistance and equivalent heat capacity.

[0019] Optionally, the first-order transient heat circuit equation for generating the first-order heat circuit model is as follows:

[0020]

[0021] Where k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high-voltage cable at Δt after it is energized with a preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer skin temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature at the k+1th cycle.

[0022] Optionally, the generated temperature rise equations are as follows:

[0023] Y = βX;

[0024] in:

[0025] Y=[θ c (1)θ c (2)…θ c (N)] T ;

[0026]

[0027] Optionally, solving the temperature rise equations to obtain equivalent thermal parameters of the high-voltage cable includes:

[0028] An objective function for solving the temperature rise equations is constructed, and the objective function is as follows:

[0029] F=min‖Y-Xβ‖ 2 ;

[0030] The objective function is solved by a linear regression method to obtain β when the objective function F is minimized, which is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

[0031] In a second aspect, the present invention provides a device for solving equivalent thermal parameters of a high-voltage cable, comprising:

[0032] The temperature acquisition module is used to collect the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset cycle during the temperature rise experiment of the high-voltage cable;

[0033] An equation group construction module, used to construct a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature;

[0034] The equivalent thermal parameter solving module is used to solve the temperature rise equation group to obtain the equivalent thermal parameters of the high-voltage cable.

[0035] In a third aspect, the present invention provides an electronic device, the electronic device comprising:

[0036] at least one processor; and

[0037] a memory communicatively connected to the at least one processor; wherein,

[0038] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for solving equivalent thermal parameters of a high-voltage cable as described in any one of the first aspects of the present invention.

[0039] In a fourth aspect, the present invention provides a computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a processor to implement the method for solving equivalent thermal parameters of a high-voltage cable as described in any one of the first aspects of the present invention when executed.

[0040] During a temperature rise test of a high-voltage cable, an embodiment of the present invention collects the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset period, and constructs a temperature rise equation group using the outer skin temperature and the cable core temperature collected during the temperature rise test. The temperature rise equation group is further solved to obtain equivalent thermal parameters of the high-voltage cable. There is no need to collect data after heating the high-voltage cable to a constant temperature to calculate the equivalent thermal parameters. This can shorten the time of the temperature rise test and reduce the time consumption for determining the thermal parameters. Furthermore, the temperature data collected during the entire temperature rise test can be used to solve all equivalent thermal parameters at the same time, thereby improving the speed of solving the equivalent thermal parameters of the high-voltage cable.

[0041] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 It is a flow chart of a method for solving equivalent thermal parameters of a high-voltage cable provided in the first embodiment of the present invention;

[0044] Figure 2 is a schematic diagram of a transient thermal circuit model of a high-voltage cable according to an embodiment of the present invention;

[0045] Figure 3 It is a schematic diagram of a transient thermal circuit model of a high-voltage cable according to an embodiment of the present invention simplified to a first-order thermal circuit model;

[0046] Figure 4 is a flow chart of a method for solving equivalent thermal parameters of a high-voltage cable provided in Embodiment 2 of the present invention;

[0047] Figure 5 It is a structural schematic diagram of a high-voltage cable equivalent thermal parameter solving device provided by the third embodiment of the present invention;

[0048] Figure 6 It is a schematic diagram of the structure of an electronic device provided in Embodiment 4 of the present invention. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0050] Embodiment 1

[0051] Figure 1 This is a flowchart of a method for solving the equivalent thermal parameters of a high-voltage cable provided in the first embodiment of the present invention. This embodiment can be applied to solving the equivalent thermal resistance and equivalent heat source of a high-voltage cable. The method can be executed by a high-voltage cable equivalent thermal parameter solving device. The high-voltage cable equivalent thermal parameter solving device can be implemented in the form of hardware and / or software and can be configured in an electronic device. Figure 1 As shown, the method for solving the equivalent thermal parameters of the high-voltage cable includes:

[0052] S101. During the temperature rise test of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset cycle.

[0053] In this embodiment, the high-voltage cable temperature rise test may refer to energizing the high-voltage cable to make the high-voltage cable generate heat, and collecting the temperature through temperature sensors arranged on the outer skin and cable core of the high-voltage cable. For example, when the temperature begins to rise after the high-voltage cable is energized, the temperature sensors on the outer skin and cable core may collect the temperature according to a preset cycle to obtain the outer skin temperature and cable core temperature collected in multiple cycles.

[0054] S102: construct a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature.

[0055] In the temperature rise equation group of this embodiment, each temperature rise equation uses the equivalent heat capacity, equivalent thermal resistance, equivalent heat source (known quantity) and cycle interval length of the high-voltage cable as constants, and the outer skin temperature and cable core temperature of the current cycle as independent variables, and the cable core temperature of the next cycle as the dependent variable. The equivalent heat capacity and equivalent thermal resistance in the composed equation group are unknown quantities, that is, the values ​​to be solved.

[0056] S103. Solve the temperature rise equations to obtain equivalent thermal parameters of the high voltage cable.

[0057] In one embodiment, an objective function for solving the temperature rise equation group can be constructed. The optimal solution when solving the minimum value of the objective function can obtain the equivalent heat capacity and the equivalent thermal resistance. After solving the equivalent heat capacity and the equivalent thermal resistance, the equivalent heat capacity and the equivalent thermal resistance can be used to calculate the temperature of the high-voltage cable.

[0058] During a temperature rise test of a high-voltage cable, an embodiment of the present invention collects the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset period, and constructs a temperature rise equation group using the outer skin temperature and the cable core temperature collected during the temperature rise test. The temperature rise equation group is further solved to obtain equivalent thermal parameters of the high-voltage cable. There is no need to collect data after heating the high-voltage cable to a constant temperature to calculate the equivalent thermal parameters. This can shorten the time of the temperature rise test and reduce the time consumption for determining the thermal parameters. Furthermore, the temperature data collected during the entire temperature rise test can be used to solve all equivalent thermal parameters at the same time, thereby improving the speed of solving the equivalent thermal parameters of the high-voltage cable.

[0059] Embodiment 2

[0060] Figure 2 Flow chart of a method for solving equivalent thermal parameters of a high-voltage cable provided in the second embodiment of the present invention. The embodiment of the present invention is optimized on the basis of the above-mentioned first embodiment. Figure 4 As shown, the method for solving the equivalent thermal parameters of the high-voltage cable includes:

[0061] S201. Powering the high-voltage cable with a preset current increases the temperature of the outer sheath and the cable core of the high-voltage cable.

[0062] Specifically, in the high-voltage cable temperature rise test, high voltage can be applied to the high-voltage cable, and the current in the high-voltage cable is a preset current I. After the high-voltage cable is energized, the cable core heats up, causing the cable core temperature and the outer skin temperature to increase.

[0063] S202: collecting the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset period.

[0064] In this embodiment, temperature sensors can be set at the cable core and outer skin of the high-voltage cable to collect the cable core temperature and the outer skin temperature through the temperature sensors. For example, the temperature can be collected according to a preset period, for example, the outer skin temperature and the cable core temperature can be collected at a time interval of 5 seconds, wherein the cable core temperature can be recorded as {θ c (1), θ c (2), ..., θ c (k)}, the outer skin temperature can be recorded as {θ o (1), θ o (2), ..., θ o (k)}.

[0065] S203. Construct a first-order thermal circuit model of the high-voltage cable.

[0066] like Figure 3The figure shows the transient thermal circuit model established based on the structure of the cross-linked polyethylene (XLPE) high-voltage cable. From the inside to the outside, the cross-linked polyethylene (XLPE) high-voltage cable consists of a cable core (conducting), an XLPE insulation layer, a buffer layer, an aluminum sheath layer, and an outer skin layer (outer sheath). Figure 3 In, θ c ,θ i ,θ s ,θ o Respectively represent the cable core temperature, insulation temperature, aluminum sheath temperature, and outer skin temperature, T i 、T b 、T o They represent the thermal resistance of the cable insulation layer, the cable buffer layer, and the cable outer skin, respectively. c is the cable core heat capacity, C i1 , C i2 is the insulation distributed heat capacity, C b is the heat capacity of the buffer layer, C s is the heat capacity of the aluminum sheath, C o is the heat capacity of the outer skin, Q1 is the heat generated by the cable core, Q2 and Q3 are the insulation losses of the cable, and Q4 is the aluminum sheath loss of the cable.

[0067] Based on the simplified principle of the circuit, the above Figure 3 The transient thermal circuit model can be simplified as Figure 4 The first-order thermal circuit model of Figure 4 middle:

[0068] Q = Q1;

[0069] T=T i +T b +T o ;

[0070]

[0071] therefore, Figure 4 The equivalent thermal parameters of the cable in the simplified first-order thermal circuit model have a corresponding relationship with the original transient thermal circuit model. Solving the equivalent thermal parameters of the first-order transient thermal circuit model can also be used to characterize the thermal parameters in the transient thermal circuit model of the cable.

[0072] S204: Generate a first-order transient thermal circuit equation of a first-order thermal circuit model.

[0073] This embodiment can construct a first-order thermal circuit model consisting of an equivalent heat source Q, an equivalent thermal resistance T, and an equivalent heat capacity C. Figure 4 The first-order thermal circuit model illustrates the generation process of the first-order transient thermal circuit equation.

[0074] Figure 4 The first-order transient thermal circuit equation of the first-order thermal circuit model is as follows:

[0075]

[0076] The equivalent heat source Q can be calculated according to the IEC 60287 standard. The equivalent heat capacity C and the equivalent thermal resistance T are unknown quantities. After performing a differential operation on the above first-order transient heat circuit equation, the first-order transient heat circuit equation of the first-order heat circuit model can be obtained as follows:

[0077]

[0078] Where k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high-voltage cable at Δt after it is energized with a preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer skin temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature at the k+1th cycle.

[0079] S205, substituting the outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple cycles into the first-order transient thermal circuit equation to construct a temperature rise equation group of the high-voltage cable.

[0080] Specifically, the following temperature rise equations can be constructed:

[0081] Y = βX;

[0082] in:

[0083] Y=[θ c (1)θ c (2)…θ c (N)] T ;

[0084]

[0085] The cable core temperature θ is obtained in each cycle c (N) and the outer skin temperature θ o (N), and after calculating the heat value Q and the cycle time interval Δt, substitute them into the above equations to obtain the temperature rise equations of the high-voltage cable.

[0086] S206. Construct an objective function for solving the temperature rise equations.

[0087] For the above temperature rise equations, the solution can be based on parameter identification, that is, the solution problem of the equations is converted into an optimization problem, that is, the following objective function F is constructed:

[0088] F=min‖Y-Xβ‖ 2 .

[0089] S207. Use a linear regression method to solve the objective function and obtain β when F is minimized, so as to serve as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

[0090] Linear regression is a statistical analysis method that uses regression analysis in mathematical statistics to determine the quantitative relationship between two or more variables that are interdependent. The analysis can be divided into linear regression analysis and nonlinear regression analysis according to the type of relationship between the independent variable and the dependent variable. Specifically in this embodiment, linear regression is a regression analysis that uses the least square function called the linear regression equation to model the relationship between one or more independent variables and the dependent variable. In this embodiment, for the objective function F, Y is the dependent variable, X is the independent variable, and β that minimizes the objective function F is solved. For example, the least squares method can be used to approximate and fit to obtain the optimal solution. T and C in the optimal solution β are the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable. After determining the equivalent thermal resistance T and equivalent heat capacity C, the cable core temperature of the cable in the k+1th period can be obtained through the first-order transient thermal circuit equation.

[0091] In the embodiment of the present invention, a high-voltage cable is energized with a preset current, so that the temperature of the outer skin and the cable core of the high-voltage cable increases, and the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period, and a first-order transient thermal circuit equation of the first-order thermal circuit model is generated after a first-order thermal circuit model of the high-voltage cable is constructed. The outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple periods are substituted into the first-order transient thermal circuit equation to construct a temperature rise equation group of the high-voltage cable, and a target function for solving the temperature rise equation group is further constructed. The target function is solved by linear regression to obtain β when F is minimized, which is used as the equivalent thermal resistance T and equivalent thermal capacity C of the high-voltage cable. There is no need to collect data to calculate the equivalent thermal parameters after heating the high-voltage cable to a constant temperature, which can shorten the time of the temperature rise experiment and reduce the time consumption of determining the thermal parameters. Moreover, the temperature data collected in the entire temperature rise experiment can be used to solve all the equivalent thermal parameters at the same time, thereby improving the solution speed of the equivalent thermal parameters of the high-voltage cable.

[0092] Embodiment 3

[0093] Figure 5 This is a schematic diagram of the structure of a high-voltage cable equivalent thermal parameter solving device provided in the third embodiment of the present invention. Figure 5 As shown, the high-voltage cable equivalent thermal parameter solving device includes:

[0094] The temperature acquisition module 501 is used to collect the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset period during the temperature rise experiment of the high-voltage cable;

[0095] An equation group construction module 502 is used to construct a temperature rise equation group of the high voltage cable based on the collected outer skin temperature and cable core temperature;

[0096] The equivalent thermal parameter solving module 503 is used to solve the temperature rise equation group to obtain the equivalent thermal parameters of the high voltage cable.

[0097] Optionally, the temperature acquisition module 501 includes:

[0098] A power supply unit, used to supply power to the high-voltage cable with a preset current, so that the temperature of the outer skin and the cable core of the high-voltage cable increases;

[0099] The temperature collection unit is used to collect the outer skin temperature and cable core temperature of the high-voltage cable according to a preset period.

[0100] Optionally, the equation group building module 502 includes:

[0101] A first-order thermal model building unit, used to build a first-order thermal circuit model of the high-voltage cable;

[0102] A first-order transient heat circuit equation generating unit, used to generate a first-order transient heat circuit equation of the first-order heat circuit model;

[0103] The temperature rise equation group construction unit is used to substitute the outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple cycles into the first-order transient thermal circuit equation to construct the temperature rise equation group of the high-voltage cable.

[0104] Optionally, the first-order thermal model building unit is specifically used for:

[0105] Construct a first-order thermal circuit model consisting of equivalent heat source, equivalent thermal resistance and equivalent heat capacity.

[0106] Optionally, the first-order transient heat circuit equation for generating the first-order heat circuit model is as follows:

[0107]

[0108] Where k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high-voltage cable at Δt after it is energized with a preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer skin temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature at the k+1th cycle.

[0109] Optionally, the generated temperature rise equations are as follows:

[0110] Y = βX;

[0111] in:

[0112] Y=[θ c (1)θ c (2)…θ c (N)] T ;

[0113]

[0114] Optionally, the equivalent thermal parameter solving module 503 includes:

[0115] The objective function construction unit is used to construct an objective function for solving the temperature rise equations, and the objective function is as follows:

[0116] F=min‖Y-Xβ‖ 2 ;

[0117] The optimal solution solving unit is used to solve the objective function by linear regression method to obtain β when the objective function F is minimized, so as to serve as the equivalent thermal resistance T and equivalent thermal capacity C of the high-voltage cable.

[0118] The high-voltage cable equivalent thermal parameter solving device provided in the embodiment of the present invention can execute the high-voltage cable equivalent thermal parameter solving method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0119] Embodiment 4

[0120] Figure 6 A schematic diagram of the structure of an electronic device 40 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0121] like Figure 6As shown, the electronic device 40 includes at least one processor 41, and a memory connected to the at least one processor 41, such as a read-only memory (ROM) 42, a random access memory (RAM) 43, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 41 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 42 or the computer program loaded from the storage unit 48 to the random access memory (RAM) 43. In the RAM 43, various programs and data required for the operation of the electronic device 40 can also be stored. The processor 41, the ROM 42, and the RAM 43 are connected to each other through a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0122] A number of components in the electronic device 40 are connected to the I / O interface 45, including: an input unit 46, such as a keyboard, a mouse, etc.; an output unit 47, such as various types of displays, speakers, etc.; a storage unit 48, such as a disk, an optical disk, etc.; and a communication unit 49, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 49 allows the electronic device 40 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0123] The processor 41 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The processor 41 executes the various methods and processes described above, such as a method for solving equivalent thermal parameters of a high-voltage cable.

[0124] In some embodiments, the high-voltage cable equivalent thermal parameter solution method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 40 via the ROM 42 and / or the communication unit 49. When the computer program is loaded into the RAM 43 and executed by the processor 41, one or more steps of the high-voltage cable equivalent thermal parameter solution method described above can be performed. Alternatively, in other embodiments, the processor 41 can be configured to execute the high-voltage cable equivalent thermal parameter solution method in any other appropriate manner (for example, by means of firmware).

[0125] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0126] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0127] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0128] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0129] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0130] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0131] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0132] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for solving equivalent thermal parameters of a high voltage cable, characterized in that: include: During the temperature rise test of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period; Constructing a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature; The temperature rise equations are solved to obtain equivalent thermal parameters of the high voltage cable.

2. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 1, characterized in that: During the temperature rise test of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period, including: Energizing the high-voltage cable with a preset current so that the temperature of the outer sheath and the cable core of the high-voltage cable increases; The outer skin temperature and core temperature of the high-voltage cable are collected according to the preset cycle.

3. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 2, characterized in that: The temperature rise equation group of the high-voltage cable is constructed based on the collected outer skin temperature and cable core temperature, including: Constructing a first-order thermal circuit model of the high-voltage cable; generating a first-order transient thermal circuit equation of the first-order thermal circuit model; The outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple cycles are substituted into the first-order transient thermal circuit equation to construct the temperature rise equation group of the high-voltage cable.

4. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 3 is characterized in that: Constructing a first-order thermal circuit model of the high-voltage cable, including: Construct a first-order thermal circuit model consisting of equivalent heat source, equivalent thermal resistance and equivalent heat capacity.

5. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 4 is characterized in that: The first-order transient heat circuit equation for generating the first-order heat circuit model is as follows: Where k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high-voltage cable at Δt after it is energized with a preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer skin temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature at the k+1th cycle.

6. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 5, characterized in that: The generated temperature rise equations are as follows: Y = βX; in: Y=[θ c (1)i c (2)…θ c (N)] T ; 7. The method for solving the equivalent thermal parameters of a high-voltage cable according to claim 6, characterized in that: Solving the temperature rise equations to obtain equivalent thermal parameters of the high voltage cable includes: An objective function for solving the temperature rise equations is constructed, and the objective function is as follows: F=min‖Y-Xβ‖ 2 ; The objective function is solved by a linear regression method to obtain β when the objective function F is minimized, which is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

8. A device for solving equivalent thermal parameters of a high voltage cable, characterized in that: include: The temperature acquisition module is used to collect the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset cycle during the temperature rise experiment of the high-voltage cable; An equation group construction module, used to construct a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature; The equivalent thermal parameter solving module is used to solve the temperature rise equation group to obtain the equivalent thermal parameters of the high-voltage cable.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can execute the method for solving equivalent thermal parameters of a high-voltage cable according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method for solving equivalent thermal parameters of a high-voltage cable according to any one of claims 1 to 7 when executed.

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