Display panel, flexible circuit board and display device

Abstract

The invention relates to the technical field of display, and particularly discloses a display panel, a flexible circuit board and a display device.The display panel comprises a first binding area, the first binding area comprises at least one row of multiple first binding pads arranged in the first direction, and the width of the first binding pads in the first direction is larger than the length of the first binding pads in the second direction; the first binding area comprises a first center datum line, the first center datum line extends in the second direction, the first binding bonding pads arranged in each row are symmetrical about the first center datum line, and the widths of the multiple first binding bonding pads, located on the same side of the first center datum line, in each row of first binding bonding pads are gradually increased in the first direction. The first binding pads in the display panel are transversely arranged, and the width of the first binding pads farther from the first center datum line in the first direction is larger, so that the size of the first binding pads in the first direction can be increased, alignment binding of the display panel and the flexible circuit board is facilitated, and the binding yield is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a flexible circuit board and a display device. Background Art

[0002] In a display device, in order to better achieve a narrow frame, a flexible printed circuit (FPC) is usually provided to realize the electrical connection between the main driving chip and the circuit routing in the display panel. Bonding pads are respectively provided on the display panel and the flexible printed circuit board, and the corresponding binding connection of the bonding pads between the display panel and the flexible printed circuit board is realized by anisotropic conductive adhesive. However, as the functions of display screens increase, the number of bonding pads in the display screens also increases, and the gaps between the bonding pads become smaller and smaller when the total width of the binding area of ​​the display screen remains unchanged. During the binding process, if there is an alignment deviation between the display panel and the flexible printed circuit board, it is easy to cause the bonding pad to be misaligned, thereby affecting the binding yield. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel, a flexible circuit board and a display device to address the problem that alignment deviation between a display panel and a flexible circuit board easily affects the binding yield.

[0004] A display panel includes a first binding area, the first binding area includes at least one row of multiple first binding pads arranged along a first direction, the width of the first binding pads in the first direction is greater than the length of the first binding pads in the second direction, and the first direction is perpendicular to the second direction; the first binding area includes a first center reference line, the first center reference line extends along the second direction, the first binding pads arranged in each row are symmetrical about the first center reference line, and the widths of multiple first binding pads on the same side of the first center reference line in each row of the first binding pads gradually increase in the first direction.

[0005] In one of the embodiments, the width of the nth first binding pad located on the same side of the first center reference line in each row of the first binding pads is determined in the first direction according to the device deviation information and the width calculation method.

[0006] In one of the embodiments, the equipment deviation information includes the width of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the first binding pad in the display panel in the first direction, the expansion tolerance of the first binding pad in the display panel, and the machine fluctuation.

[0007] In one embodiment, the width calculation method includes:

[0008] L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF ;

[0009] Where, L nP represents the width of the nth first binding pad located on the left or right side of the first center reference line in the first direction, x n represents the width tolerance of the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, p n represents the expansion tolerance between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation of the machine, L nF It represents the width of the second binding pad in the flexible circuit board which is connected to the nth first binding pad in the display panel located on one side of the first center reference line in the first direction.

[0010] In one of the embodiments, the display panel includes a first integrated unit, the display panel includes multiple first wiring layers, and the multiple first binding pads on each row are connected to the first integrated unit via wiring on a layer of the first wiring layer.

[0011] In one embodiment, a distance between two adjacent first binding pads in the first direction is a first gap, and any two first gaps are equal.

[0012] In one embodiment, the lengths of the plurality of first binding pads in the same row in the second direction are all the same.

[0013] A flexible circuit board comprises a second binding area, wherein the second binding area comprises at least one row of multiple second binding pads arranged along a first direction, the width of the second binding pads in the first direction is greater than the length of the second binding pads in the second direction, and the first direction is perpendicular to the second direction; the second binding area comprises a second center reference line, the second center reference line extends along the second direction, the second binding pads arranged in each row are symmetrical about the second center reference line, and the distance between two adjacent second binding pads located on the same side of the second center reference line in each row of the second binding pads gradually increases in the first direction.

[0014] In one embodiment, the widths of the plurality of second binding pads in the same row in the first direction are all the same.

[0015] In one embodiment, the lengths of the plurality of second binding pads in the same row in the second direction are all the same.

[0016] In one embodiment, the flexible circuit board includes a second integrated unit, the flexible circuit board includes multiple layers of second routing layers, and the plurality of second binding pads on each row are connected to the second integrated unit via routing on a layer of the second routing layer.

[0017] A display device comprises a display panel as described in any one of the above embodiments and a flexible circuit board as described in any one of the above embodiments, wherein a first binding pad in the display panel is electrically connected to a second binding pad of the flexible circuit board in a one-to-one correspondence, and a width of the first binding pad in the first direction is greater than a width of the second binding pad in the first direction.

[0018] In one of the embodiments, a first center reference line in the display panel coincides with a second center reference line in the flexible circuit board.

[0019] In one embodiment, the first binding pad includes a first edge and a second edge relative to each other in the first direction, the second binding pad includes a third edge and a fourth edge relative to each other in the first direction, the distance between the first edge and the third edge is equal to the distance between the second edge and the fourth edge, and the distance between the first edge and the third edge or the distance between the second edge and the fourth edge is a second gap.

[0020] In one embodiment, one of the first binding pads is electrically connected to one of the second binding pads to form a binding pad group, and the second gaps between the plurality of binding pad groups located on the same side of the first center reference line in each row of the binding pad groups gradually increase.

[0021] In one of the embodiments, the second gap of the plurality of binding pad groups located on the same side of the first center reference line in each row of the binding pad groups is determined according to the device deviation information and the gap calculation method.

[0022] In one of the embodiments, the equipment deviation information includes the width of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the first binding pad in the display panel in the first direction, the expansion tolerance of the first binding pad in the display panel, and the machine fluctuation.

[0023] In one embodiment, the gap calculation method includes:

[0024] a n =(1 / 2(x n +p n +l P +l F )+X J );

[0025] In the formula, a n represents the second gap of the nth bonding pad group located on the same side of the first center reference line, x n represents the width tolerance of the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, p n represents the expansion tolerance between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation amount of the machine.

[0026] In one of the embodiments, the display device further includes anisotropic conductive adhesive, and the first binding pad in the display panel is electrically connected to the second binding pad of the flexible circuit board through the anisotropic conductive adhesive.

[0027] In one of the embodiments, the distance between two adjacent first binding pads in the display panel in the first direction is a first gap, the distance between two adjacent anisotropic conductive adhesives in the display device is an insulating distance, and the first gap is greater than the insulating distance.

[0028] In one of the embodiments, the minimum area of ​​the second binding pad in the flexible circuit board is greater than or equal to the minimum conductive area of ​​the anisotropic conductive adhesive.

[0029] In one embodiment, the minimum area of ​​the second bonding pad is calculated as follows:

[0030] Smin=(L F -l F )*(H F -h F );

[0031] Wherein, Smin represents the minimum area of ​​the second binding pad, L F represents the width of the second binding pad in the first direction, l F represents the width tolerance of the second bonding pad in the first direction, H F represents the length of the second bonding pad in the second direction, h F represents a length tolerance of the second binding pad in the second direction.

[0032] The above-mentioned display panel includes a first binding area and at least one row of a plurality of first binding pads arranged along a first direction in the first binding area. The width of the first binding pad in the first direction is greater than the length of the first binding pad in the second direction, that is, the first binding pads in the first binding area are arranged horizontally. By arranging the first binding pads in the display panel horizontally, the size of a single first binding pad in the first direction can be increased, thereby facilitating alignment and binding of the display panel and the flexible circuit board, reducing the influence of the deviation in the first direction on the binding operation, and improving the binding yield. At the same time, the plurality of first binding pads arranged in each row are symmetrical about the first center reference line, and the width of the first binding pads in each row located on the same side of the first center reference line gradually increases in the first direction. By making the first binding pads farther away from the first center reference line have a larger width in the first direction, the influence of the deviation in the first direction on the binding operation can be further reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods of this specification or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0034] Figure 1 A schematic diagram of the alignment of the display panel and the pads on the flexible circuit board in the existing solution;

[0035] Figure 2 This is a partial enlarged schematic diagram of a display panel in one of the embodiments of the present application;

[0036] Figure 3 This is a partial enlarged schematic diagram of a display panel in another embodiment of the present application;

[0037] Figure 4 This is a partial enlarged schematic diagram of a display panel in yet another embodiment of the present application;

[0038] Figure 5 This is a partially enlarged schematic diagram of a flexible circuit board in one of the embodiments of the present application;

[0039] Figure 6 This is a partial enlarged schematic diagram of a flexible circuit board in another embodiment of the present application;

[0040] Figure 7 This is a partially enlarged schematic diagram of a flexible circuit board in another embodiment of the present application;

[0041] Figure 8 This is a partially enlarged schematic diagram of a display device in one of the embodiments of the present application;

[0042] Fig. 9 It is a partial enlarged schematic diagram of a display device in another embodiment of the present application. DETAILED DESCRIPTION

[0043] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure of the present invention more thoroughly and comprehensively.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0045] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be construed as being one in number.

[0046] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0047] In this application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0048] Figure 1 The figure is a schematic diagram of the alignment of the display panel and the pad on the flexible circuit board in the existing solution. In the prior art, the bonding pads provided on the display panel and the flexible circuit board are arranged and aligned vertically. With the development of display technology, the increase in the functions of the display screen has led to an increase in the number of bonding pads. However, when the total horizontal width remains unchanged, the more bonding pads there are, the smaller the pitch between the bonding pads, and the larger the total size occupied by the bonding pad in the horizontal direction, so that the corresponding size fluctuation rate in the horizontal direction is greater. The greater the size fluctuation rate in the horizontal direction, the easier it is to cause bonding deviation.

[0049] Figure 2 This is a partial enlarged schematic diagram of a display panel in one embodiment of the present application. In one embodiment, the display panel 10 may include a first binding area 100. The first binding area 100 may include at least one row of a plurality of first binding pads 110 arranged along a first direction X, and the plurality of first binding pads 110 are arranged in rows in the first direction X at intervals. Figure 2 The embodiment shown is that a plurality of first binding pads 110 in the first binding area 100 are arranged in a row. Optionally, according to different application requirements of the display panel, a plurality of first binding pads 110 in the first binding area 100 may also be arranged in two or more rows.

[0050] The width L of the first bonding pad 110 in the first direction X P may be greater than the length H of the first bonding pad 110 in the second direction Y PIn this embodiment, the first direction X may refer to a horizontal direction, and the second direction Y may refer to a vertical direction. Preferably, the second direction Y is perpendicular to the first direction X. That is, the first binding pads 110 are arranged horizontally on the first binding area 100 .

[0051] The first binding area 100 may further include a first central reference line A, and the first central reference line A may extend along the second direction Y. The first binding area 100 may be symmetrical about the first central reference line A, and the plurality of first binding pads 110 arranged in each row in the first binding area 100 may also be symmetrical about the first central reference line A. The number of the first binding pads 110 in each row in the first binding area 100 may be an odd number or an even number. Figure 2 The schematic diagram shows an odd number of first binding pads 110 arranged in a row. When the number of first binding pads 110 in a row is an odd number, one of the first binding pads 110 can be used as a reference pad, the center line of the reference pad coincides with the first center reference line A, and the reference pad can be symmetrical about the first center reference line A. The remaining even number of first binding pads 110 can be arranged symmetrically on both sides of the first center reference line A, respectively using the reference pads as alignment references.

[0052] Figure 3 This is a partial enlarged schematic diagram of a display panel in another embodiment of the present application. Figure 3 What is shown is a schematic diagram of an even number of first binding pads 110 in the first binding area 100 arranged in a row. When the number of first binding pads 110 in a row is an even number, the first center reference line A can be used as an alignment reference, and the even number of first binding pads 110 can be symmetrically arranged on both sides of the first center reference line A, with the first center reference line A serving as the alignment reference.

[0053] At the same time, the width L of the first bonding pads 110 in each row of the first bonding pads 110 located on the same side of the first central reference line A in the first direction X is P That is, the width L of the first binding pads 110 in each row that are closer to the first central reference line A in the first direction X is greater. P The width L of the first binding pad 110 in each row of the first binding pads 110 that is farther from the first center reference line A in the first direction X P The bigger.

[0054] In the display panel 10 provided in the present application, the first binding pads 110 in the display panel 10 are designed to be arranged horizontally, and the size of the first binding pads 110 in the first direction X is increased, so that it is convenient to align the pads in the display panel 10 with the pads in the flexible circuit board. Since the size of the first binding pads 110 in the first direction X is increased, the influence of the offset in the first direction X on the binding yield during the alignment operation is reduced, and the offset problem caused by the size fluctuation rate in the first direction X can be solved.

[0055] Meanwhile, it is considered that during operation, the middle position of the display panel 10 is usually used as the alignment reference, and the closer the position is to the alignment reference, the smaller the fluctuation rate in the first direction X, and the farther the position is from the alignment reference, the larger the fluctuation rate in the first direction X. Therefore, the first binding pads 110 arranged in each row in the first binding area 100 are designed such that the first binding pads 110 located on the same side of the first central reference line A in each row are closer to the first central reference line A, and the width L of the first binding pads 110 in the first direction X is greater. P The smaller the width L of the first bonding pad 110 in the first direction X is, the farther the first bonding pad 110 is from the first center reference line A. P That is, the farther the first bonding pad 110 is from the first central reference line A, the larger the width L in the first direction X is. P The larger the value, the more the problem of displacement caused by the dimensional fluctuation in the first direction X can be solved, thereby ensuring the binding yield.

[0056] In one embodiment, since the first binding pads 110 disposed at different positions in the first direction X in the display panel 10 are affected to different degrees by various influencing factors, the widths L of the first binding pads 110 disposed at different positions in the first direction X in the display panel 10 are designed to be P According to the device deviation information and the width calculation method, the width L of the nth first binding pad 110 on the same side of the first central reference line A in each row of first binding pads 110 in the first direction X is determined. P .

[0057] Based on the applicant's research, it was found that the substrate PI (polyimide) in the current FPC and display panel has thermal expansion and contraction, and the thermal expansion and contraction amount (size) of the substrate PI in the FPC and display panel is positively correlated with the total width and length of the FPC and the display panel. In addition, there may be certain equipment deviations in the dimensions of the display panel, FPC and pads during preparation. At the same time, there may also be certain machine deviations when the alignment equipment aligns the display panel and FPC. For example, when the width of the first binding pad 110 in the display panel in the first direction X is designed to be L, the ideal width of the manufactured first binding pad 110 is L. However, in the actual preparation process, there may be certain deviations, that is, the width of the first binding pad 110 actually manufactured may be L±l P The difference between the actual width of the first bonding pad 110 and the ideal width of the first bonding pad 110 can be called the width tolerance. These deviations may affect the bonding yield of the display panel and the FPC. Therefore, when designing the width L of the first bonding pad 110 in the first direction X of the display panel, P When considering the impact of the above factors,

[0058] In one embodiment, the width L of each first binding pad 110 in the display panel 10 can be adjusted by comprehensively considering the width of the second binding pad in the flexible circuit board in the first direction X, the expansion tolerance between the first binding pads 110 at different positions in the display panel 10 due to temperature, the machine fluctuation of the alignment equipment, and other factors. P A reasonable design is performed to solve the problem of the deviation of the display panel 10 in the first direction X. Specifically, the device deviation information may include the width of the second binding pad in the flexible circuit board in the first direction X, the width tolerance of the second binding pad in the flexible circuit board in the first direction X, the width tolerance of the first binding pad 110 in the display panel 10 in the first direction X, the expansion tolerance of the first binding pad 110 in the display panel 10, and the machine fluctuation amount.

[0059] In one embodiment, the width L of the nth first bonding pad 110 located on the left or right side of the first central reference line A in the display panel 10 in the first direction X is nP Methods for calculating may include:

[0060] L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF ;

[0061] Where, LnP x may represent the width of the nth first bonding pad 110 located on the left or right side of the first central reference line A in the first direction X. n The width tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X may be represented by p n The expansion tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X is l P The width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X may be represented by l F It can represent the width tolerance of the second binding pad in the flexible circuit board in the first direction X, X J It can represent the machine fluctuation, L nF It may represent the width in the first direction X of the second bonding pad in the flexible circuit board that is connected to the nth first bonding pad 110 located on one side of the first center reference line A in the display panel 10 .

[0062] When each device prepares a display panel 10 or a flexible circuit board, the tolerance of each pad in the same display panel 10 or each pad in the flexible circuit board in the first direction X is the same. At the same time, when the alignment device aligns a display panel 10 and a flexible circuit board, the machine fluctuation caused by the alignment device to each pad in the display panel 10 and each pad in the flexible circuit board is also the same. Therefore, in the same display panel 10, the width L of the first binding pad 110 is nP The calculation method of l P , l F , X J is a fixed amount. The tolerances of the pads in different display panels 10 or the pads in different flexible circuit boards in the first direction X may be different, and the machine fluctuations caused by the alignment equipment to the pads in different display panels 10 and the pads in the flexible circuit board may also be different. Therefore, between different display panels 10, the width L of the first binding pad 110 is nP The calculation method of l P , l F , X J The value of may be different.

[0063] In this embodiment, Figure 2 or Figure 3 The structure shown has a width L of the first bonding pad 110. nP The description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. Figure 2When the number of first binding pads 110 in each row of the first binding area 100 is an odd number, the first binding pad 110 at the center of each row can be used as a reference pad, and the center line of the reference pad coincides with the first center reference line A, and the reference pad can be symmetrical about the first center reference line A. The width L of the reference pad P It can be set arbitrarily according to different application requirements. The width L of the reference pad P It may be the same as the ideal width of the first bonding pad 110. Preferably, the width L of the reference pad P It may be larger than the second binding pad in the flexible circuit board that is connected correspondingly to the reference pad.

[0064] Figure 2 or Figure 3 In the embodiment, the width of the first first bonding pad 110 located on the left side of the first central reference line A and the width of the first first bonding pad 110 located on the right side of the first central reference line A are both width L 1P , width L 1P The calculation method is L 1P =2(1 / 2(x 1 +p 1 +l P +l F )+X J )+L 1F Among them, x 1 is the distance between the first first bonding pad 110 located on the left side of the first central reference line A and the first first bonding pad 110 located on the right side of the first central reference line A in the first direction X, and the width tolerance caused by the manufacturing process or other factors. 1 is the expansion tolerance between the first first binding pad 110 located on the left side of the first central reference line A and the first first binding pad 110 located on the right side of the first central reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second binding pad in the flexible circuit board aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J L is the fluctuation amount of the machine platform caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board in the first direction X. 1F It is the width in the first direction X of the second binding pad in the flexible circuit board which is connected to the first first binding pad 110 located on the left or right side of the first center reference line A in the display panel 10 .

[0065] Similarly, the width of the second first bonding pad 110 located on the left side of the first central reference line A and the width of the second first bonding pad 110 located on the right side of the first central reference line A are both width L 2P , width L 2P The calculation method is L 2P =2(1 / 2(x 2 +p 2 +l P +l F )+X J )+L 2F Among them, x 2 is the distance between the second first bonding pad 110 located on the left side of the first central reference line A and the second first bonding pad 110 located on the right side of the first central reference line A in the first direction X, and the width tolerance caused by the manufacturing process or other factors. 1 is the expansion tolerance between the second first binding pad 110 located on the left side of the first central reference line A and the second first binding pad 110 located on the right side of the first central reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second binding pad in the flexible circuit board aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J L is the fluctuation amount of the machine platform caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board in the first direction X. 2F It is the width of the second binding pad in the flexible circuit board connected to the second first binding pad 110 located on the left or right side of the first center reference line A in the display panel 10 in the first direction X.

[0066] It can be further deduced that the width of the nth first binding pad 110 located on the left side of the first central reference line A and the width of the nth first binding pad 110 located on the left side of the first central reference line A are both width L nP , width L nP The calculation method is L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF .

[0067] Figure 4This is a partial enlarged schematic diagram of a display panel in another embodiment of the present application. In one embodiment, the display panel 10 may include a first integrated unit 120. In an embodiment, the first integrated unit 120 may refer to an integrated circuit chip (IC) in the display panel 10. The first integrated unit 120 may be used to generate a drive signal according to various control signals to drive the display panel 10. The drive signal generated from the first integrated unit 120 may be applied to the gate lines and data lines in the display panel 10 to drive the display panel 10 to implement various functions.

[0068] The display panel 10 may include multiple layers of first wiring layers. Preferably, different first wiring layers may be electrically connected through wiring holes. The multiple first binding pads 110 on each row in the first binding area 100 may be connected to the first integrated unit 120 through wiring on a first wiring layer.

[0069] For example, the multiple first binding pads 110 on the first row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the first routing layer of the first layer; the multiple first binding pads 110 on the second row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the second routing layer of the first layer; the multiple first binding pads 110 on the nth row on the first binding area 100 are connected to the first integrated unit 120 through the routing on the nth first routing layer.

[0070] By setting different first routing layers, the first binding pads 110 on different rows can be connected to the first integrated unit 120 through different first routing layers, which can prevent the routing of multiple first binding pads 110 on different rows from crossing, thereby ensuring the yield rate of the product.

[0071] In some embodiments, the distance between the first integrated unit 120 and the first row of first binding pads 110 in the display panel 10 in the second direction Y can be designed to be different values ​​according to different application requirements.

[0072] In one embodiment, the distance between two adjacent first bonding pads 110 in the first direction X can be defined as a first gap X. P , any two first gaps X in the display panel 10 PThat is, the distances between any two adjacent first binding pads 110 in the display panel 10 in the first direction X are equal. Preferably, when multiple rows of first binding pads 110 are provided in the display panel 10, the distances between two adjacent rows of first binding pads 110 in the second direction Y are also equal. In practical applications, the distances between two adjacent rows of first binding pads 110 in the second direction Y can be set to different values ​​as needed.

[0073] In one embodiment, the length H of the plurality of first bonding pads 110 in the same row in the second direction Y is P Preferably, the lengths H of the first binding pads 110 in different rows in the second direction Y are P The length H of each first bonding pad 110 in the second direction Y may be the same. P , can be designed according to specific application requirements. Similarly, when the length of the first bonding pad 110 in the display panel in the second direction Y is designed to be H P When the first bonding pad 110 is manufactured, the ideal width is H P The actual length of the first bonding pad 110 may be H P ±h P The difference between the actual length of the first bonding pad 110 actually manufactured and the ideal length of the first bonding pad 110 may be referred to as a length tolerance.

[0074] The embodiment of the present disclosure may also provide a flexible circuit board, Figure 5 This is a partial enlarged schematic diagram of a flexible circuit board in one embodiment of the present application. In one embodiment, the flexible circuit board 20 may include a second binding area 200. The second binding area 200 may include at least one row of a plurality of second binding pads 210 arranged along a first direction X, and the plurality of second binding pads 210 are arranged in rows at intervals in the first direction X. The width L of the second binding pads 210 in the first direction X is F It may be greater than the length H of the second bonding pad 210 in the second direction Y. F .

[0075] Figure 5 The embodiment shown is that the plurality of second binding pads 210 in the second binding area 200 are arranged in a row. Optionally, according to different application requirements of the display panel, the plurality of second binding pads 210 in the second binding area 200 may also be arranged in two or more rows.

[0076] The second binding area 200 may further include a second central reference line B, and the second central reference line B may extend along the second direction Y. The second binding area 200 may be symmetrical about the second central reference line B, and the plurality of second binding pads 210 arranged in each row in the second binding area 200 may also be symmetrical about the second central reference line B. The number of the second binding pads 210 in each row in the second binding area 200 may be an odd number or an even number. Figure 4 The schematic diagram shows an odd number of second binding pads 210 arranged in a row. When the number of second binding pads 210 in a row is an odd number, one of the second binding pads 210 can be used as a reference pad, the center line of the reference pad coincides with the second center reference line B, and the reference pad can be symmetrical about the second center reference line B. The remaining even number of second binding pads 210 can be arranged symmetrically on both sides of the second center reference line B, respectively using the reference pads as alignment references.

[0077] Figure 6 This is a partial enlarged schematic diagram of a flexible circuit board in another embodiment of the present application. Figure 6 What is shown is a schematic diagram of an even number of second binding pads 210 in the second binding area 200 arranged in a row. When the number of second binding pads 210 in a row is an even number, the second center reference line B can be used as an alignment reference, and the even number of second binding pads 210 can be symmetrically arranged on both sides of the second center reference line B with the second center reference line B as the alignment reference.

[0078] At the same time, the distance between two adjacent second binding pads 210 located on the same side of the second center reference line B in each row of second binding pads 210 in the first direction X gradually increases. That is, the distance between the second binding pads 210 in each row of second binding pads 210 and the adjacent second binding pads 210 closer to the second center reference line B is smaller; the distance between the second binding pads 210 in each row of second binding pads 210 and the adjacent second binding pads 210 farther from the second center reference line B is larger.

[0079] like Figure 5 As shown, the distance between the first second binding pad 210 located on the left side of the second central reference line B and the second binding pad 210 located at the second central reference line B is X. 1F The distance between the second second binding pad 210 located on the left side of the second center reference line B and the first second binding pad 210 located on the left side of the second center reference line B is X. 2F , X 2F >X 1F .

[0080] In the flexible circuit board 20 provided in the present application, by designing the second binding pads 210 in the flexible circuit board 20 to be arranged horizontally, the size of the second binding pads 210 in the first direction X is increased, so as to facilitate the alignment of the first binding pads 110 in the display panel 10 and the second binding pads 210 in the flexible circuit board 20. Since the size of the second binding pads 210 in the first direction X is increased, the influence of the offset in the first direction X on the binding yield rate during the alignment operation is reduced, and the problem of displacement caused by the size fluctuation rate in the first direction X can be solved.

[0081] At the same time, when the second binding pads 210 are arranged in an array in the first direction X, the second center reference line B is used as a reference reference, and the distance between two adjacent second binding pads 210 closer to the second center reference line B is smaller, and the distance between two adjacent second binding pads 210 farther from the second center reference line B is larger. On the one hand, it can avoid that the distance between the second binding pads 210 is too small, resulting in a short circuit between two adjacent second binding pads 210; on the other hand, it can further solve the problem of deviation caused by the size fluctuation rate in the first direction X, and ensure the binding yield.

[0082] In one embodiment, the distance between the second bonding pads 210 in the flexible circuit board 20 can vary with the width L of the first bonding pads 110 in the display panel 10 in the first direction X. nP By making the distance between the second binding pads 210 in the flexible circuit board 20 provided by the present application change and the width L of the first binding pad 110 in the display panel 10 in the first direction X nP The changes are matched, which can ensure that the display panel 10 and the flexible circuit board 20 can well match the incoming materials and process tolerances during the binding process, thereby effectively reducing the misalignment problem between the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20, and improving the binding yield.

[0083] In one embodiment, the width L of the plurality of second bonding pads 210 in the same row of the flexible circuit board 20 in the first direction X is F Can be the same.

[0084] In one embodiment, the length H of the plurality of second binding pads 210 in the same row of the flexible circuit board 20 in the second direction Y is F Can be the same.

[0085] Similarly, l F h is the width tolerance of the second binding pad 210 in the flexible circuit board 20 in the first direction X due to the manufacturing process or other factors, Fis the length tolerance of the second binding pad 210 in the flexible circuit board 20 in the second direction Y due to the manufacturing process or other factors. The actual width of the second binding pad 210 in the flexible circuit board 20 in the first direction X is L F ±l F The actual length of the second binding pad 210 in the flexible circuit board 20 in the second direction Y is H F ±h F .

[0086] Preferably, the distances between two adjacent rows of second binding pads 210 in the flexible circuit board 20 in the second direction Y are equal. In practical applications, the distances between two adjacent rows of second binding pads 210 in the second direction Y can be set to different values ​​as needed.

[0087] Figure 7 This is a partial enlarged schematic diagram of a flexible circuit board in another embodiment of the present application. In one embodiment, the flexible circuit board 20 may include a second integrated unit 220. In an embodiment, the second integrated unit 220 may refer to an integrated circuit chip (IC) in the flexible circuit board 20. The second integrated unit 220 may be used to generate a drive signal to drive the display panel 10 and / or the flexible circuit board 20 according to various control signals. The drive signal generated from the first integrated unit 120 may be applied to the display panel 10 and / or the flexible circuit board 20 to drive the display panel 10 and / or the flexible circuit board 20 to realize various functions.

[0088] The flexible circuit board 20 may include multiple layers of second wiring layers. Preferably, different second wiring layers may be electrically connected through wiring holes. The multiple second binding pads 210 on each row may be connected to the second integrated unit 220 through wiring on a layer of the second wiring layer.

[0089] For example, the multiple second binding pads 210 on the first row on the second binding area 200 are connected to the second integrated unit 220 through the routing on the first-level second routing layer; the multiple second binding pads 210 on the second row on the second binding area 200 are connected to the second integrated unit 220 through the routing on the second-level second routing layer; the multiple second binding pads 210 on the nth row on the second binding area 200 are connected to the second integrated unit 220 through the routing on the nth-level second routing layer.

[0090] By setting different second routing layers, the second binding pads 210 on different rows can be connected to the second integrated unit 220 through different second routing layers, which can prevent the routing of multiple second binding pads 210 on different rows from crossing, so as to ensure the yield rate of the product.

[0091] In some embodiments, the distance between the second integrated unit 220 and the first row of second binding pads 210 in the second direction Y in the flexible circuit board 20 can be designed to be different values ​​according to different application requirements.

[0092] The embodiments of the present disclosure may also provide a display device, which may be a rigid display device or a flexible display device. The display device may be applied to any product or component with a display function, including but not limited to the following categories: mobile phones, televisions, digital cameras, tablet computers, notebook computers, desktop displays, smart bracelets, smart glasses, vehicle displays, medical equipment, industrial control equipment, touch interactive terminals, etc., and the embodiments of the present disclosure do not specifically limit this.

[0093] Figure 8 This is a partial enlarged schematic diagram of a display device in one embodiment of the present application. In order to better illustrate the structural design of the first binding pad 110 and the second binding pad 210 in the display device, Figure 8 The structures of the first binding pad 110 and the second binding pad 210 are mainly displayed, and other structures of the display device are hidden. In one embodiment, the display device may include a display panel 10 as described in any of the above embodiments and a flexible circuit board 20 as described in any of the above embodiments, and the first binding pad 110 in the display panel 10 is electrically connected to the second binding pad 210 of the flexible circuit board 20 in a one-to-one correspondence. Preferably, the number of the first binding pads 110 in the display panel 10 is the same as the number of the second binding pads 210 in the flexible circuit board 20.

[0094] The width L of the first bonding pad 110 in the display panel 10 in the first direction X P Greater than the width L of the second bonding pad 210 in the flexible circuit board 20 in the first direction X F , by measuring the width L of the first bonding pad 110 in the display panel 10 P Designed to be larger than the width L of the second bonding pad 210 in the flexible circuit board 20 F , leaving a margin for possible deviation in the binding process, so as to facilitate accurate one-to-one alignment of the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20.

[0095] In one embodiment, the first center reference line A in the display panel 10 coincides with the second center reference line B in the flexible circuit board 20, and the electrical connection between a first binding pad 110 and a second binding pad 210 in the display device can form a binding pad group. Multiple binding pad groups in the display device can be symmetrical about the first center reference line A and / or the second center reference line B. The number of binding pad groups in each row of the display device can be an odd number or an even number.

[0096] Figure 8 The schematic diagram shows an odd number of binding pad groups arranged in a row. When the number of binding pad groups in a row is an odd number, one of the binding pad groups can be used as a reference pad group, the center line of the reference pad group coincides with the first center reference line A and / or the second center reference line B, and the reference pad group can be symmetrical about the first center reference line A and / or the second center reference line B. The remaining even number of reference pad groups can be arranged symmetrically on both sides of the first center reference line A and / or the second center reference line B, respectively, with the reference pad groups as alignment references.

[0097] Fig. 9 This is a partial enlarged schematic diagram of a display device in another embodiment of the present application, in order to better illustrate the structural design of the first binding pad 110 and the second binding pad 210 in the display device. Fig. 9 The structure of the first binding pad 110 and the second binding pad 210 is mainly displayed, and other structures of the display device are hidden. Fig. 9 What is shown is a schematic diagram of an even number of reference pad groups in a display device arranged in a row. When the number of reference pad groups in a row is an even number, the first center reference line A and / or the second center reference line B can be used as an alignment reference, and the even number of reference pad groups can be symmetrically arranged on both sides of the first center reference line A and / or the second center reference line B, with the first center reference line A and / or the second center reference line B as the alignment reference.

[0098] In one embodiment, the first bonding pad 110 may include opposite first edges 110 in the first direction X. P1 and the second edge l P2 The second bonding pad 210 includes opposite third edges l in the first direction X. F1 and the fourth edge l F2 .like Fig. 9 As shown, the first edge l P1 and the second edge l P2 The distance between the first bonding pad 110 in the first direction X is the width L of the first bonding pad 110 in the first direction X. P ±l P . The third edge F1 and the fourth edge l F1The distance between the two bonding pads in the first direction X is the width L of the second bonding pad 210 in the first direction X. F ±l F . First edge l P1 The distance between the first center reference line A and the second edge l is greater than P2 The distance between the first center reference line A and the third edge l F1 The distance between the second center reference line B is greater than the fourth edge l F2 The distance between the second center reference line B.

[0099] In this embodiment, the first edge l P1 With the third edge l F1 The distance between the second edge l P2 With the fourth edge F2 The distances between the first edge and the P1 With the third edge l F1 The distance between the second edge l P2 With the fourth edge F2 The distance between them can be defined as a second gap a.

[0100] In one embodiment, since the width L of the first bonding pads 110 at different positions in the first direction X in the display substrate 10 is P Different, the width L of the second binding pad 210 on the flexible circuit board 20 in the first direction X F are all the same, so the second gaps a of the plurality of binding pad groups located on the same side of the first center reference line A in each row of binding pad groups gradually increase.

[0101] In the display device provided by the present application, the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20 are designed to be arranged horizontally, and the size of the first binding pad 110 and the second binding pad 210 in the first direction X is increased, so that the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20 are easily aligned one by one. Since the size of the first binding pad 110 and the second binding pad 210 in the first direction X is increased, the influence of the offset in the first direction X on the binding yield of the display device in the alignment operation is reduced, and the offset problem caused by the size fluctuation rate in the first direction X can be solved to ensure the stability of the display device. The display device provided by the present application can solve the problems of open circuit and short circuit after the display panel 10 and the flexible circuit board 20 are bound due to the large total spacing size tolerance of the pads of the flexible circuit board 20 and the insufficient alignment accuracy of the module factory equipment in the binding process of the display panel 10 and the flexible circuit board 20, thereby improving the yield of the binding process and reducing the material cost.

[0102] In one embodiment, the second gap a of the plurality of bonding pad groups located on the same side of the first central reference line A in each row of bonding pad groups is determined according to the device deviation information and the gap calculation method.

[0103] Since the width L of the first bonding pads 110 at different positions in the first direction X in the display substrate 10 is P Different, the width L of the second binding pad 210 on the flexible circuit board 20 in the first direction X F Therefore, the second gaps a of the plurality of binding pad groups located on the same side of the first central reference line A in each row of the binding pad group gradually increase, and the second gap a of the binding pad group in each binding pad group is equal to the width L of the first binding pad 110 in the binding pad group in the first direction X. P related.

[0104] According to the above analysis, it can be known that when designing the width L of the first binding pad 110 in the first direction X P When designing the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the expansion tolerance between the first bonding pads 110 at different positions in the display panel 10 due to temperature, the machine fluctuation of the alignment equipment and other factors can be comprehensively considered. Similarly, the second gap a of each bonding pad group in the display device can be reasonably designed by comprehensively considering the width of the second bonding pad 210 in the flexible circuit board 20 in the first direction X, the expansion tolerance between the first bonding pads 110 at different positions in the display panel 10 due to temperature, the machine fluctuation of the alignment equipment and other factors, so as to solve the problem of the deviation of the display device in the first direction X during the binding process.

[0105] That is, specifically, the equipment deviation information may include the width of the second binding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the second binding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the first binding pad 110 in the display panel 10 in the first direction X, the expansion tolerance of the first binding pad 110 in the display panel 10, and the machine fluctuation amount.

[0106] In one embodiment, the second gap a of the nth bonding pad group located on the left or right side of the first center reference line A in the display device n Methods for calculating may include:

[0107] a n =(1 / 2(x n +p n +l P +l F )+X J );

[0108] In the formula, a n It can represent the second gap of the nth bonding pad group located on the same side of the first center reference line A, x n The width tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X may be represented by p n The expansion tolerance of the nth first bonding pad 110 located on the left side of the first central reference line A and the nth first bonding pad 110 located on the right side of the first central reference line A in the first direction X may be represented by l F It can represent the width tolerance of the second binding pad 210 in the flexible circuit board 20 in the first direction X, where X J It can indicate the fluctuation of the machine.

[0109] When each device prepares a display panel 10 or a flexible circuit board 20, the tolerance of each pad in the same display panel 10 or each pad in the flexible circuit board 20 in the first direction X is the same. At the same time, when the alignment device aligns a display panel 10 and a flexible circuit board 20, the machine fluctuation caused by the alignment device to each pad in the display panel 10 and each pad in the flexible circuit board 20 is also the same. Therefore, in the same display panel 10, the width L of the first binding pad 110 is nP The calculation method of l P , l F , X J is a fixed amount. The tolerances of the pads in different display panels 10 or the pads in different flexible circuit boards 20 in the first direction X may be different, and the machine fluctuations caused by the alignment equipment to the pads in different display panels 10 and the pads in the flexible circuit board 20 may also be different. Therefore, in different display panels 10, the width L of the first binding pad 110 is nP The calculation method of l P , l F , X J The value of may be different.

[0110] In this embodiment, Figure 8 The structure shown has a second gap a for the bonding pad group. n The description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. Figure 8When the number of binding pad groups in each row of the display device is an odd number, the binding pad group at the center of each row can be used as a reference pad group, the center line of the reference pad group coincides with the first center reference line A, and the reference pad group can be symmetrical about the first center reference line A. The second gap a in the reference pad group can be arbitrarily set according to different application requirements. Preferably, the second gap in the reference pad group is greater than 0.

[0111] Figure 8 In the embodiment, the second gap of the first bonding pad group located on the left side of the first center reference line A (ie, the first edge l of the first first bonding pad 110 located on the left side of the first center reference line A) is P1 and the third edge l of the first second bonding pad 210 located on the left side of the first center reference line A. F1 The distance between the first bonding pad 110 and the first center reference line A is the distance between the first bonding pad 110 and the second edge l P2 and the fourth edge l of the first second bonding pad 210 located on the left side of the first center reference line A. F2 The distance between the first center reference line A and the second gap of the first bonding pad group on the right side of the first center reference line A are both the second gap a 1 , the second gap a 1 The calculation method is a 1 =(1 / 2(x 1 +p 1 +l P +l F )+X J ). Among them, x 1 is the distance between the first first bonding pad 110 located on the left side of the first central reference line A and the first first bonding pad 110 located on the right side of the first central reference line A in the first direction X, and the width tolerance caused by the manufacturing process or other factors. 1 is the expansion tolerance between the first first binding pad 110 located on the left side of the first central reference line A and the first first binding pad 110 located on the right side of the first central reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second binding pad 210 in the flexible circuit board 20 aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J The fluctuation amount of the machine platform in the first direction X caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board 20 .

[0112] Similarly, the second gap of the second bonding pad group located on the left side of the first central reference line A and the second gap of the second bonding pad group located on the right side of the first central reference line A are both the second gap a 2 , the second gap a 2 The calculation method is a 2 =(1 / 2(x 2 +p 2 +l P +l F )+X J ). Among them, x 2 is the distance between the second first bonding pad 110 located on the left side of the first central reference line A and the second first bonding pad 110 located on the right side of the first central reference line A in the first direction X, and the width tolerance caused by the manufacturing process or other factors. 1 is the expansion tolerance between the second first binding pad 110 located on the left side of the first central reference line A and the second first binding pad 110 located on the right side of the first central reference line A in the first direction X due to factors such as temperature. P is the width tolerance of the first bonding pad 110 in the display panel 10 in the first direction X due to the manufacturing process or other factors, F is the width tolerance of the second binding pad 210 in the flexible circuit board 20 aligned with the display panel 10 in the first direction X due to the manufacturing process or other factors, X J The fluctuation amount of the machine platform in the first direction X caused by the alignment equipment for aligning the display panel 10 and the flexible circuit board 20 .

[0113] It can be further deduced that the second gap a of the nth bonding pad group located on the left side of the first center reference line A is n and the second gap a of the nth bonding pad group located on the right side of the first center reference line A n The second gap a n , the second gap a n The calculation method is a n =(1 / 2(x n +p n +l P +l F )+X J ).

[0114] In the display device provided in the present application, the width L of the first binding pad 110 in the display panel 10 in the first direction X is calculated by comprehensively considering various equipment deviation factors such as the width of the second binding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the second binding pad 210 in the flexible circuit board 20 in the first direction X, the width tolerance of the first binding pad 110 in the display panel 10 in the first direction X, the expansion tolerance of the first binding pad 110 in the display panel 10, and the machine fluctuation amount. P And the second gap a between the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20 is reasonably designed, so as to effectively solve the problem of deviation in the first direction X.

[0115] When the first bonding pads 110 in the display panel 10 are arranged in an array in the first direction X, the first central reference line A is used as a reference reference, and the width L of the first bonding pad 110 closer to the first central reference line A is P The smaller the width L of the first bonding pad 110 is, the farther away from the first center reference line A is. P At the same time, when the second binding pads 210 in the flexible circuit board 20 are arranged in an array in the first direction X, the second center reference line B is used as a reference reference. The distance between adjacent second binding pads 210 closer to the second center reference line B is smaller, and the distance between adjacent second binding pads 210 farther from the second center reference line B is larger. On the one hand, it can avoid the short circuit between two adjacent second binding pads 210 caused by the small distance between the second binding pads 210 in the flexible circuit board 20; on the other hand, it can solve the problem of deviation caused by the size fluctuation in the first direction X caused by various influencing factors in the display device, and ensure the binding yield.

[0116] In one embodiment, the display device may further include an anisotropic conductive film (ACF). The first binding pad 110 in the display panel 10 may be electrically connected to the second binding pad 210 of the flexible circuit board 20 through the anisotropic conductive adhesive. In some embodiments, the anisotropic conductive adhesive may include a resin gel, and the resin gel may also include a plurality of conductive particles distributed in the resin gel. The plurality of conductive particles may form an electrically conductive path in the resin gel under the action of an electric field, thereby achieving electrical connection between the first binding pad 110 in the display panel 10 and the second binding pad 210 in the flexible circuit board 20.

[0117] In one embodiment, the distance between two adjacent first bonding pads 110 in the display panel 10 in the first direction X can be defined as a first gap X. P. The distance between two adjacent anisotropic conductive adhesives in the display device can be defined as the insulation spacing Xgap. In this embodiment, the insulation spacing Xgap may refer to the minimum distance that can ensure insulation between two adjacent anisotropic conductive adhesives. When the distance between two adjacent anisotropic conductive adhesives is less than or equal to the insulation spacing Xgap, the conductive particles in the two anisotropic conductive adhesives may form a conductive path under the action of the electric field, thereby causing a short circuit between the two adjacent anisotropic conductive adhesives. Therefore, in the design of the display device, the distance between two adjacent anisotropic conductive adhesives should be greater than the insulation spacing Xgap to prevent a short circuit between the anisotropic conductive adhesives.

[0118] Furthermore, the first gap X P Since the first bonding pad 110 in the display panel 10 is electrically connected to the second bonding pad 210 in the flexible circuit board 20 through anisotropic conductive adhesive, the first gap Xgap between the two adjacent first bonding pads 110 is set to P When the gap is greater than the insulation gap Xgap, it can be ensured that no short circuit problem occurs between two adjacent first binding pads 110 .

[0119] In one embodiment, the anisotropic conductive adhesive may have a minimum conductive area S ACF In this embodiment, the minimum conduction area S ACF It can refer to the minimum area that can ensure that the conductive particles in the anisotropic conductive adhesive establish a stable conductive path. When the area of ​​the anisotropic conductive adhesive is less than the minimum conductive area S ACF When the conductive particles in the anisotropic conductive adhesive are not able to form a conductive path or may be disconnected after conduction. Therefore, in the design of the display device, the area of ​​each anisotropic conductive adhesive should be greater than or equal to the minimum conduction area S ACF , so as to prevent the display device from having a short circuit due to the anisotropic conductive adhesive.

[0120] Furthermore, the minimum area Smin of the second binding pad 210 in the flexible circuit board 20 may be greater than or equal to the minimum conductive area S ACF , that is, Smin ≥ S ACF Since the first binding pad 110 in the display panel 10 is electrically connected to the second binding pad 210 in the flexible circuit board 20 through the anisotropic conductive adhesive, the area of ​​the second binding pad 210 is smaller than the area of ​​the first binding pad 110, so the area of ​​electrical contact between the first binding pad 110 and the second binding pad 210 depends on the area of ​​the first binding pad 110. By designing the second binding pad 210 such that the minimum area Smin of the second binding pad 210 is greater than or equal to the minimum conductive area S of the anisotropic conductive adhesive, the second binding pad 210 can be electrically connected to the second binding pad 210. ACF, it can be ensured that the first binding pad 110 and the second binding pad 210 can be stably electrically connected with the help of anisotropic conductive adhesive.

[0121] In one embodiment, the minimum area Smin of the second bonding pad 210 may be calculated as follows:

[0122] Smin=(L F -l F )*(H F -h F );

[0123] Wherein, Smin may represent the minimum area of ​​the second bonding pad 210, L F It can represent the width of the second bonding pad 210 in the first direction X, l F It can represent the width tolerance of the second bonding pad 210 in the first direction, H F It can represent the length of the second bonding pad 210 in the second direction Y, h F θ may represent a length tolerance of the second bonding pad 210 in the second direction Y.

[0124] In the actual preparation process of the second bonding pad 210, there may be some deviation. The ideal design width of the second bonding pad 210 is L F , but the actual width of the second bonding pad 210 may be L F ±l F The difference between the width of the second bonding pad 210 actually manufactured and the ideal width of the second bonding pad 210 may be referred to as a width tolerance l. F Similarly, the ideal design length of the second bonding pad 210 is H F , but the actual length of the second bonding pad 210 may be H F ±h F The difference between the actual length of the second bonding pad 210 and the ideal length of the second bonding pad 210 may be referred to as the length tolerance h. F Generally, when one device prepares each second binding pad 210 on the same flexible circuit board 20, there is a width tolerance l F and / or length tolerance h F is fixed, width tolerance l F and / or length tolerance h F It can be determined based on historical preparation conditions.

[0125] Therefore, based on the ideal design width L of the second bonding pad 210 F 、Ideal design length H F , Width tolerance due to equipment process l Fand / or length tolerance h F , the minimum area Smin that may exist in the second binding pad 210 that is actually manufactured can be determined. By designing the second binding pad 210 so that the minimum area Smin of the second binding pad 210 is greater than or equal to the minimum conductive area S of the anisotropic conductive adhesive, ACF , so as to ensure that the first binding pad 110 and the second binding pad 210 are stably electrically connected with each other by means of anisotropic conductive adhesive.

[0126] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0127] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A display panel, characterized in that: The first binding area includes at least one row of a plurality of first binding pads arranged along a first direction, the width of the first binding pads in the first direction is greater than the length of the first binding pads in the second direction, and the first direction is perpendicular to the second direction; The first binding area includes a first center reference line, which extends along the second direction. The first binding pads arranged in each row are symmetrical about the first center reference line, and the widths of multiple first binding pads located on the same side of the first center reference line in each row of the first binding pads gradually increase in the first direction.

2. The display panel according to claim 1, characterized in that: Determine, according to the device deviation information and the width calculation method, the width of the nth first binding pad in each row of the first binding pads located on the same side of the first center reference line in the first direction; Preferably, the equipment deviation information includes the width of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the first binding pad in the display panel in the first direction, the expansion tolerance of the first binding pad in the display panel, and the machine fluctuation amount; Preferably, the width calculation method includes: L nP =2(1 / 2(x n +p n +l P +l F )+X J )+L nF ; Where, L nP represents the width of the nth first binding pad located on the left or right side of the first center reference line in the first direction, x n represents the width tolerance of the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, p n represents the expansion tolerance between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation of the machine, L nF It represents the width of the second binding pad in the flexible circuit board which is connected to the nth first binding pad in the display panel located on one side of the first center reference line in the first direction.

3. The display panel according to claim 1 or 2, characterized in that: The display panel includes a first integrated unit, and the display panel includes multiple layers of first wiring layers. The multiple first binding pads on each row are connected to the first integrated unit via wiring on a layer of the first wiring layer.

4. The display panel according to claim 1, characterized in that: The distance between two adjacent first binding pads in the first direction is a first gap, and any two first gaps are equal; Preferably, the lengths of the plurality of first binding pads in the same row in the second direction are all the same.

5. A flexible circuit board, characterized in that: The second binding area includes at least one row of a plurality of second binding pads arranged along a first direction, the width of the second binding pads in the first direction is greater than the length of the second binding pads in the second direction, and the first direction is perpendicular to the second direction; The second binding area includes a second center reference line, which extends along the second direction. The second binding pads arranged in each row are symmetrical about the second center reference line, and the distance between two adjacent second binding pads located on the same side of the second center reference line in each row of the second binding pads gradually increases in the first direction.

6. The flexible circuit board according to claim 5, characterized in that: The widths of the plurality of second binding pads in the same row in the first direction are all the same; Preferably, the lengths of the plurality of second binding pads in the same row in the second direction are all the same.

7. The flexible circuit board according to claim 6, characterized in that: The flexible circuit board includes a second integrated unit, and the flexible circuit board includes multiple layers of second wiring layers. The plurality of second binding pads on each row are connected to the second integrated unit via wiring on a layer of the second wiring layer.

8. A display device, characterized in that: It includes a display panel as described in any one of claims 1 to 4 and a flexible circuit board as described in any one of claims 5 to 7, wherein a first binding pad in the display panel is electrically connected to a second binding pad of the flexible circuit board in a one-to-one correspondence, and a width of the first binding pad in the first direction is greater than a width of the second binding pad in the first direction.

9. The display device according to claim 8, characterized in that: A first central reference line in the display panel coincides with a second central reference line in the flexible circuit board; Preferably, the first binding pad includes a first edge and a second edge opposite to each other in the first direction, the second binding pad includes a third edge and a fourth edge opposite to each other in the first direction, the distance between the first edge and the third edge is equal to the distance between the second edge and the fourth edge, and the distance between the first edge and the third edge or the distance between the second edge and the fourth edge is a second gap; Preferably, one of the first binding pads is electrically connected to one of the second binding pads to form a binding pad group, and the second gaps between the plurality of binding pad groups located on the same side of the first center reference line in each row of the binding pad groups gradually increase; Preferably, the second gap of the plurality of binding pad groups located on the same side of the first center reference line in each row of the binding pad groups is determined according to the device deviation information and the gap calculation method; Preferably, the equipment deviation information includes the width of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the second binding pad in the flexible circuit board in the first direction, the width tolerance of the first binding pad in the display panel in the first direction, the expansion tolerance of the first binding pad in the display panel, and the machine fluctuation amount; Preferably, the gap calculation method includes: a n =(1 / 2(x n +p n +l P +l F )+X J ); In the formula, a n represents the second gap of the nth bonding pad group located on the same side of the first center reference line, x n represents the width tolerance of the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, p n represents the expansion tolerance between the nth first binding pad located on the left side of the first center reference line and the nth first binding pad located on the right side of the first center reference line in the first direction, l P represents the width tolerance of the first binding pad in the display panel in the first direction, l F represents the width tolerance of the second binding pad in the flexible circuit board in the first direction, X J Indicates the fluctuation amount of the machine.

10. The display device according to claim 8, characterized in that: The display device further comprises an anisotropic conductive adhesive, and the first binding pad in the display panel is electrically connected to the second binding pad of the flexible circuit board through the anisotropic conductive adhesive; Preferably, the distance between two adjacent first binding pads in the display panel in the first direction is a first gap, the distance between two adjacent anisotropic conductive adhesives in the display device is an insulation distance, and the first gap is greater than the insulation distance; Preferably, the minimum area of ​​the second binding pad in the flexible circuit board is greater than or equal to the minimum conductive area of ​​the anisotropic conductive adhesive; Preferably, the minimum area of ​​the second binding pad is calculated as follows: Smin=(L F -l F )*(H F -h F ); Wherein, Smin represents the minimum area of ​​the second binding pad, L F represents the width of the second binding pad in the first direction, l F represents the width tolerance of the second bonding pad in the first direction, H F represents the length of the second bonding pad in the second direction, h F represents a length tolerance of the second binding pad in the second direction.

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