XY double-drive platform

Abstract

The invention relates to the field of wafer detection equipment, and particularly discloses an XY double-drive platform which comprises a sliding mechanism which comprises a base, a lower sliding table, an upper sliding table, a first linear motor and a second linear motor. A detection mechanism; the two fixing mechanisms comprise mounting rings, adsorption blocks, vacuum pumps and driving assemblies, the mounting rings are arranged on the upper sliding table, the adsorption blocks are arranged on the mounting rings in a sliding mode, cavities are formed in the adsorption blocks, adsorption holes are formed in the adsorption blocks, the adsorption blocks communicate with the vacuum pumps, and the driving assemblies are arranged on the vacuum pumps. The driving assembly is used for driving the adsorption block to slide, so that the adsorption block can be adsorbed and fixed with the wafer under the action of negative pressure; a gap for accommodating a wafer is arranged between the two fixing mechanisms, and when one fixing mechanism is fixedly connected with the wafer, the other fixing mechanism is separated from the wafer. According to the invention, the edge part of the wafer can be detected, and the detection integrity can be ensured.

Description

Technical Field

[0001] The present application relates to the field of wafer inspection equipment, and in particular to an XY dual-drive platform. Background Art

[0002] Wafers are substrate materials for making integrated circuits and other microelectronic devices. They are usually round sheets made from high-purity single-crystal silicon through processes such as cutting, grinding, and polishing. Defects on the wafer may cause the electrical performance of the device to deteriorate, so defect detection is required after the wafer is made.

[0003] Defect detection of wafers is usually visual inspection, which uses an optical imaging system to capture the microscopic features of the wafer surface and analyzes the image data through image processing algorithms to identify and classify various defects. During inspection, the wafer needs to be fixed on a dual-drive platform, which drives the wafer to slide horizontally; there are two detection heads, which are located on the upper and lower sides of the wafer respectively. The position of the detection head is fixed and used to identify defects on the wafer surface, thereby detecting the upper and lower sides of the wafer. When the dual-drive platform drives the wafer to move horizontally, the wafer can slide relative to the detection head, thereby realizing the detection of different positions of the wafer.

[0004] During defect detection, the wafer needs to be fixed on the dual-drive platform. The fixing methods include clamping and vacuum adsorption. Since the thickness of the wafer is relatively thin, usually less than 1mm, it is easy to squeeze the wafer when clamping is used, causing the wafer to deform, affecting the subsequent detection results. When using vacuum adsorption to fix, the adsorbent will be adsorbed on the edge of the wafer, and the edge of the wafer will be blocked, making the edge of the wafer unable to be recognized by the detection head, making it difficult to detect the edge of the wafer. Rough, pitted or broken wafer edges can cause surface contamination and may also cause the wafer to burst in the process chamber, affecting the overall quality and reliability of the wafer. Summary of the invention

[0005] In order to facilitate the detection of the edge of the wafer, the present application provides an XY dual-drive platform.

[0006] The XY dual-drive platform provided in this application adopts the following technical solution: An XY dual-drive platform, comprising: The sliding mechanism comprises a base, a lower slide, an upper slide, a first linear motor and a second linear motor, wherein the lower slide is slidably connected to the base, the upper slide is slidably connected to the lower slide, the middle parts of the upper slide and the lower slide are both open, the first linear motor is used to drive the lower slide to slide, and the second linear motor is used to drive the upper slide to slide; The detection mechanism comprises an upper detection head and a lower detection head, wherein the upper detection head is located above the upper slide, and the lower detection head is located below the upper slide, and the detection ends of the upper detection head and the lower detection head are both facing the upper slide; A fixing mechanism, wherein the fixing mechanism is provided with two groups, and the fixing mechanism comprises a mounting ring, an adsorption block, a vacuum pump and a driving assembly, wherein the mounting ring is provided on an upper slide, and the adsorption block is slidably provided on the mounting ring, and the adsorption blocks are provided in a plurality and arranged in a circular array, and a cavity is provided inside the adsorption block, and adsorption holes are provided on the adsorption block, and the cavity inside the adsorption block is connected to the vacuum pump, so that the adsorption block can be adsorbed and fixed to the wafer under the action of negative pressure, and the driving assembly is used to drive the plurality of adsorption blocks to slide toward a side close to or away from the center of the array arrangement; The two fixing mechanisms are arranged at intervals, and a gap for accommodating the wafer is provided between the two fixing mechanisms. One of the fixing mechanisms is used to be adsorbed and connected to the top edge of the wafer, and the other fixing mechanism is used to be adsorbed and connected to the bottom edge of the wafer. When one of the fixing mechanisms is adsorbed and connected to the wafer, the other fixing mechanism is separated from the wafer.

[0007] By adopting the above technical scheme, when the adsorption block in the lower fixing mechanism is fixedly connected to the bottom wall of the wafer, the adsorption block in the upper fixing mechanism is separated from the wafer, and the upper adsorption block is located on the outside of the wafer. Therefore, the upper adsorption block will not block the upper surface of the wafer, and the upper surface of the wafer can be visually inspected by the upper detection head; similarly, when the upper adsorption block is fixedly connected to the top wall of the wafer, the lower adsorption block is located on the outside of the wafer, and the lower surface of the wafer can be visually inspected by the lower detection head. Therefore, while ensuring the fixing effect of the wafer, the edge of the wafer can be inspected, thereby ensuring the detection effect.

[0008] Optionally, the driving assembly includes a ring gear, a connecting rope, a first motor, a gear and a spring, the ring gear is rotatably connected to the mounting ring, the connecting rope is fixedly connected between the adsorption block and the ring gear, so that the adsorption block can be driven to slide when the ring gear rotates, the first motor is arranged on the mounting ring, the gear is connected to the end of the output shaft of the first motor, the gear is meshed with the ring gear, and the spring is connected between the adsorption block and the mounting ring, and the spring makes the adsorption block tend to slide toward the center of the ring gear.

[0009] By adopting the above technical solution, the first motor drives the gear to rotate to make the ring gear rotate, and the ring gear drives the adsorption block to slide outward through the connecting rope; when the output shaft of the first motor rotates in the opposite direction, the spring can make the adsorption block slide inward; thus, multiple adsorption blocks can slide outward or inward at the same time; the sliding setting of the adsorption block is convenient for avoiding the loading and unloading process of the wafer on the one hand, and on the other hand, the sliding distance of the adsorption block can be adjusted as needed, so that the adsorption block can adsorb and fix wafers of different sizes, which helps to improve the applicability of the device.

[0010] Optionally, the mounting ring is slidably arranged on an upper slide, a lifting assembly is arranged on the upper slide, the lifting assembly includes a second motor and a screw rod, the second motor is fixedly arranged on the upper slide, the screw rod is connected to the end of the output shaft of the second motor, and the screw rod is threadedly connected to the mounting ring.

[0011] By adopting the above technical solution, the second motor drives the screw to rotate to make the mounting ring slide, thereby realizing the lifting and lowering drive of the adsorption block. Therefore, the adsorption block that is separated from the wafer can first slide inward in the horizontal direction, and then slide in the vertical direction toward the side close to the wafer, so as to adsorb and fix the wafer; relative sliding when the adsorption block and the wafer are in contact can be avoided, thereby reducing the possibility of the adsorption block scratching the wafer.

[0012] Optionally, a light source is arranged on the base below the upper slide.

[0013] By adopting the above technical solution, the bottom of the upper slide can be illuminated, thereby ensuring the visual inspection effect of the lower inspection head on the wafer.

[0014] Optionally, a connecting ring is provided on the base, a cavity is provided inside the connecting ring, the connecting ring is sleeved on the outside of the lamp source, an air inlet and an exhaust port connected to the internal cavity are opened on the connecting ring, and the exhaust port is connected to the cavity inside the adsorption block.

[0015] By adopting the above technical solution, when the vacuum pump evacuates the adsorption block, it can also extract the air inside the connecting ring, so that the interior of the connecting ring is in a negative pressure state. At this time, the outside air can flow into the connecting ring through the air inlet, so that the air in the connecting ring continues to flow, taking away the heat generated by the lamp source, which helps to accelerate the heat dissipation of the lamp source.

[0016] Optionally, a valve body is provided between the exhaust port and the adsorption block.

[0017] By adopting the above technical solution, when the lower adsorption block is in contact with the lower surface of the wafer, the adsorption block can be adsorbed and fixed to the lower surface of the wafer. At this time, the valve body is in a closed state, which helps to ensure the vacuum effect of the adsorption block, thereby ensuring the adsorption and fixing effect of the wafer; when the lower adsorption block moves to the outside of the wafer, the valve body opens, and the vacuum pump can vacuum the inside of the connecting ring, thereby allowing the air inside the connecting ring to flow and dissipate heat to the lamp source; therefore, the setting of the connecting ring is not easy to affect the adsorption effect of the adsorption block.

[0018] Optionally, a rubber pad is provided on the adsorption block.

[0019] By adopting the above technical solution, the adsorption block and the surface of the wafer are in flexible contact, thereby preventing the adsorption block from causing damage to the wafer.

[0020] Optionally, a groove is arranged on the top surface of the base, and the first linear motor is arranged in the groove.

[0021] By adopting the above technical solution, the overall height of the device can be reduced, thereby reducing the occupied space.

[0022] Optionally, two second linear motors are provided and are respectively located on both sides of the lower slide platform, and the stators of the second linear motors are vertically arranged.

[0023] By adopting the above technical solution, the size of the lower slide in the front-to-back direction is reduced, which helps to save space.

[0024] Optionally, the lower slide is made of marble.

[0025] By adopting the above technical solution, marble is a natural stone with excellent physical properties, which can effectively reduce the impact of the external environment on the slide, such as the impact of changes in temperature, humidity, etc. on the deformation of the slide, thereby maintaining long-term stability.

[0026] In summary, this application includes the following beneficial technical effects: 1. The two fixing mechanisms are not adsorbed and fixed to the wafer at the same time. Therefore, when one of the fixing mechanisms fixes one side of the wafer, the other side of the wafer can be visually inspected, thereby realizing the inspection of the edge of the wafer, which helps to ensure the integrity of the inspection.

[0027] 2. The sliding setting of the adsorption block can not only avoid the loading and unloading process of the wafer, but also adjust the sliding distance of the adsorption block according to needs, so that the device can adapt to wafers of different sizes and has a wider range of applications.

[0028] 3. When the vacuum pump evacuates the interior of the adsorption block, the air in the connecting ring can also be extracted. Under the negative pressure inside the connecting ring, the outside air flows into the connecting ring through the air inlet. The air in the connecting ring continues to flow, thereby taking away the heat generated by the lamp source, which helps to accelerate the heat dissipation of the lamp source. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 is a cross-sectional view of an embodiment of the present application; Figure 3 yes Figure 2 The enlarged schematic diagram of point A in the middle; Figure 4 is a cross-sectional view from another perspective of the embodiment of the present application; Figure 5 yes Figure 4 The enlarged schematic diagram of point B in the middle; Figure 6 yes Figure 2 Enlarged schematic diagram of point C in the middle.

[0030] Figure numerals: 1. sliding mechanism; 11. base; 111. groove; 112. first guide rail; 12. lower slide; 121. first slider; 122. second guide rail; 13. upper slide; 131. second slider; 14. first linear motor; 15. second linear motor; 2. detection mechanism; 21. upper detection head; 22. lower detection head; 3. fixing mechanism; 31. mounting ring; 311. guide frame; 312. connecting block; 32. adsorption block; 321. adsorption hole; 33. driving assembly; 331. gear ring; 332. connecting rope; 333. first motor; 334. gear; 335. spring; 4. lifting assembly; 41. second motor; 42. lead screw; 43. guide rod; 5. light source; 6. connecting ring; 61. air inlet; 62. exhaust port; 7. valve body; 8. hose; 9. wafer. DETAILED DESCRIPTION

[0031] The following combination Figure 1-Figure 6 This application is described in further detail.

[0032] The present application embodiment discloses an XY dual-drive platform. Figure 1, the XY dual-drive platform includes a sliding mechanism 1, a detection mechanism 2 and a fixing mechanism 3. The sliding mechanism 1 includes a base 11, a lower slide 12, an upper slide 13, a first linear motor 14 and a second linear motor 15. The base 11 is arranged horizontally. The lower slide 12 is made of marble, and the upper slide 13 is made of aluminum alloy. The lower slide 12 is arranged above the base 11, and the upper slide 13 is arranged above the lower slide 12. Two first linear motors 14 are arranged in parallel at intervals; a groove 111 is provided on the top surface of the base 11, and the stator of the first linear motor 14 is fixedly connected to the bottom wall of the groove 111, and the mover of the first linear motor 14 is slidably arranged in the stator, and the mover is fixedly connected to the bottom wall of the lower slide 12, so that the first linear motor 14 can drive the lower slide 12 to slide horizontally. Two second linear motors 15 are provided and arranged in parallel at intervals. The stator of the second linear motor 15 is fixedly connected to the side wall of the lower slide 12, and the mover of the second linear motor 15 is fixedly connected to the bottom wall of the upper slide 13. Therefore, the second linear motor 15 can drive the upper slide 13 to slide horizontally, and the sliding direction of the upper slide 13 is perpendicular to the sliding direction of the lower slide 12. The middle parts of the upper slide 13 and the lower slide 12 are both provided with openings, so that the overall weight can be reduced, thereby reducing the load of the first linear motor 14 and the second linear motor 15.

[0033] The stator of the second linear motor 15 is vertically arranged, so that the width of the lower slide 12 can be reduced, thus saving more space.

[0034] A first guide rail 112 is fixedly connected to the top wall of the base 11, a first slider 121 is fixedly connected to the bottom wall of the lower slide 12, and the first slider 121 is slidably connected to the first guide rail 112. A second guide rail 122 is fixedly connected to the top wall of the lower slide 12, a second slider 131 is fixedly connected to the bottom wall of the upper slide 13, and the second slider 131 is slidably connected to the second guide rail 122. This helps to improve the stability of the sliding process of the lower slide 12 and the upper slide 13.

[0035] Reference Figure 2 The detection mechanism 2 includes an upper detection head 21 and a lower detection head 22. The upper detection head 21 is located above the upper slide 13, and the lower detection head 22 is located below the upper slide 13. The detection ends of the upper detection head 21 and the lower detection head 22 are facing toward a side close to each other, so that the upper and lower surfaces of the wafer 9 placed on the upper slide 13 can be visually inspected.

[0036] Reference Figure 2 and Figure 3, two groups of fixing mechanisms 3 are provided, and are arranged at intervals in the vertical direction. The two fixing mechanisms 3 are used to fix the upper and lower sides of the wafer 9 respectively. The fixing mechanism 3 includes a mounting ring 31, an adsorption block 32, a vacuum pump and a driving assembly 33. The mounting ring 31 is arranged on the upper slide 13. A guide frame 311 is fixedly connected to the mounting ring 31. Four guide frames 311 are provided and arranged in a circular array. A connecting block 312 is slidably provided inside each guide frame 311. Four adsorption blocks 32 are provided, corresponding to the four connecting blocks 312 respectively, and the adsorption blocks 32 are fixedly connected to the corresponding ends of the connecting blocks 312. A cavity is provided inside the adsorption block 32, and adsorption holes 321 are provided on the sides where the upper and lower groups of adsorption blocks 32 are close to each other. The adsorption holes 321 are connected to the internal cavity of the adsorption block 32, and a plurality of adsorption holes 321 are provided. The cavity inside the adsorption block 32 is connected to the vacuum pump, so when the vacuum pump is evacuated, negative pressure can be generated inside the adsorption block 32 , thereby adsorbing and fixing the surface of the wafer 9 on the adsorption hole 321 of the adsorption block 32 .

[0037] A rubber pad is provided on one side of the adsorption block 32 close to the adsorption hole 321 , and a through hole corresponding to the adsorption hole 321 is opened on the rubber pad, so that the adsorption block 32 and the wafer 9 are in flexible contact, which can avoid damage to the wafer 9 .

[0038] Reference Figure 2 , Figure 4 and Figure 5 The driving assembly 33 is used to drive the adsorption block 32 to slide, and the driving assembly 33 includes a ring gear 331, a connecting rope 332, a first motor 333, a gear 334 and a spring 335. The ring gear 331 is rotatably connected to the mounting ring 31. There are four connecting ropes 332, which correspond to the four connecting blocks 312 respectively; the connecting rope 332 is a flexible rope body and has no elasticity. One end of the connecting rope 332 is located in the guide frame 311 and is fixedly connected to the end of the connecting block 312; the other end of the connecting rope 332 is fixedly connected to the inner wall of the ring gear 331. The first motor 333 is fixedly connected to the mounting ring 31, and the output shaft of the first motor 333 and the gear 334 are coaxially fixedly connected. The gear 334 is meshed with the teeth on the outside of the ring gear 331, so the first motor 333 drives the gear 334 to rotate, which can cause the ring gear 331 to rotate. The ring gear 331 can drive the connection block 312 to slide through the connection rope 332, so that the multiple adsorption blocks 32 slide toward the side away from each other. There are four springs 335, which correspond to the four connection blocks 312 respectively. The spring 335 is located in the guide frame 311. The spring 335 is fixedly connected between the connection block 312 and the inner wall of the guide frame 311. The spring 335 is in a compressed state, so the spring 335 makes the connection block 312 have a tendency to slide toward the outside of the guide frame 311. Therefore, under the driving action of the first motor 333 and the reset action of the spring 335, the multiple adsorption blocks 32 can be moved away from or close to each other.

[0039] The two sets of fixing mechanisms 3 are respectively located on the upper and lower sides of the wafer 9. When the fixing mechanism 3 below the wafer 9 adsorbs and fixes the lower surface of the wafer 9, the fixing mechanism 3 above the wafer 9 and the wafer 9 are in a separated state, so the upper surface of the wafer 9 can be detected at this time. After the detection of the upper surface of the wafer 9 is completed, the fixing mechanism 3 above the wafer 9 adsorbs and fixes the upper surface of the wafer 9, and then the fixing mechanism 3 below the wafer 9 is separated from the lower surface of the wafer 9, and the lower surface of the wafer 9 can be detected at this time. Therefore, while ensuring the fixing effect of the wafer 9, the edge of the wafer 9 can be detected, which helps to ensure the detection effect.

[0040] Reference Figure 1 Furthermore, both mounting rings 31 are vertically slidably arranged on the upper slide 13, and a lifting assembly 4 for driving the mounting rings 31 to slide is arranged on the upper slide 13. The lifting assembly 4 is provided with two groups, corresponding to the two mounting rings 31 respectively. The lifting assembly 4 includes a second motor 41 and a screw 42. The second motor 41 is fixedly connected to the upper slide 13, and the screw 42 is coaxially fixedly connected to the end of the output shaft of the second motor 41. A guide rod 43 is also fixedly connected to the upper slide 13. Both sides of the mounting ring 31 are fixedly connected with protrusions, one of which is threadedly connected to the screw 42, and the other protrusion is slidably connected to the guide rod 43. Therefore, the second motor 41 drives the screw 42 to rotate to make the mounting ring 31 slide in the vertical direction, so that the adsorption block 32 slides to the side close to the wafer 9 or away from the wafer 9, thereby avoiding scratches on the surface of the wafer 9 when the adsorption block 32 slides horizontally.

[0041] Reference Figure 2 In order to ensure the detection effect of the lower detection head 22 on the lower surface of the wafer 9, a light source 5 is arranged below the upper slide 13. The light source 5 is an LED light, so the light source 5 can illuminate the area below the wafer 9, which helps to enhance the recognition effect.

[0042] Reference Figure 2 and Figure 6 , a connecting ring 6 is also provided on the base 11, and a cavity is provided inside the connecting ring 6. The connecting ring 6 is covered on the outside of the main body of the lamp source 5. An air inlet 61 and an exhaust port 62 which are connected to the internal cavity are provided on the connecting ring 6. A hose 8 is fixedly connected to the exhaust port 62, and one end of the hose 8 away from the exhaust port 62 is fixedly connected to one of the adsorption blocks 32 in the lower fixing mechanism 3, and the hose 8 is connected to the cavity inside the adsorption block 32. Therefore, when the interior of the adsorption block 32 is evacuated, the air inside the connecting ring 6 can also be extracted. At this time, the outside air can flow into the connecting ring 6 through the air inlet 61, so that the air in the connecting ring 6 can flow continuously, thereby taking out the heat of the lamp source 5, which helps to enhance the heat dissipation effect of the lamp source 5 and avoid the lamp source 5 from being too high in temperature.

[0043] Furthermore, a valve body 7 is provided between the hose 8 and the exhaust port 62. The valve body 7 is a stop valve, which can control the on and off of the hose 8. In other embodiments, it can also be other types of valves, such as a ball valve or a gate valve. Therefore, when the adsorption block 32 in the lower fixing mechanism 3 adsorbs and fixes the lower surface of the wafer 9, the valve body 7 is in a closed state. At this time, the interior of the adsorption block 32 can be better evacuated, thereby ensuring the adsorption and fixing effect of the adsorption block 32. When the adsorption block 32 in the lower fixing mechanism 3 is separated from the wafer 9, the valve body 7 is opened again, so that the air in the connecting ring 6 continues to flow, accelerating the heat dissipation of the lamp source 5.

[0044] In this embodiment, the output shafts of the first motor 333 and the second motor 41 have self-locking capabilities, that is, after the motors stop running, the output shafts of the motors cannot be rotated by external forces.

[0045] The implementation principle of an XY dual-drive platform in an embodiment of the present application is as follows: in the initial state, the distance between the four adsorption blocks 32 in the lower fixing mechanism 3 is small, and the distance between the four adsorption blocks 32 in the upper fixing mechanism 3 is large. First, the wafer 9 is moved to the top of the adsorption block 32, and then the wafer 9 is moved downward. During the downward movement of the wafer 9, it will not contact the upper adsorption block 32 until the bottom wall of the wafer 9 is against the top of the four adsorption blocks 32 below. Then, under the action of the vacuum pump, the interior of the adsorption block 32 can be placed in a negative pressure state, and the lower surface of the wafer 9 can be adsorbed and fixed on the top of the lower adsorption block 32. Then, with the cooperation of the first linear motor 14 and the second linear motor 15, the lower slide 12 and the upper slide 13 can be made to slide horizontally, so that the wafer 9 slides, and the position of the wafer 9 relative to the upper detection head 21 is adjusted, and the upper surface of the wafer 9 is visually inspected by the upper detection head 21.

[0046] After the upper surface of the wafer 9 is inspected, the lower adsorption block 32 stops adsorbing the wafer 9, and the wafer 9 stays on the top surface of the lower adsorption block 32. The first motor 333 in the upper fixing mechanism 3 is started, so that the gear 334 rotates, and the gear 334 drives the gear ring 331 to rotate, and the spring 335 makes the connecting block 312 and the adsorption block 32 slide to the outside of the guide frame 311 until the adsorption block 32 slides to the top of the edge of the wafer 9. Then the second motor 41 is started, driving the screw rod 42 to rotate, so that the upper mounting ring 31 slides downward until the bottom of the adsorption block 32 on the upper mounting ring 31 fits the upper surface of the wafer 9, and then the adsorption block 32 is adsorbed and fixed to the upper surface of the wafer 9 under the action of negative pressure. The lower adsorption block 32 slides downward again, and then slides outward until it slides to the outside of the wafer 9, thereby avoiding the lower adsorption block 32 from blocking the lower surface of the wafer 9. At this time, the lower surface of the wafer 9 can be visually inspected by the lower detection head 22.

[0047] When the lower adsorption block 32 slides to the outside of the wafer 9, the vacuum pump is turned on again, and the valve body 7 is opened. At this time, the air inside the connecting ring 6 can be pumped out by the vacuum pump, and the outside air flows into the connecting ring 6 through the air inlet 61, thereby taking away the heat generated when the lamp source 5 emits light, which helps to accelerate the heat dissipation of the lamp source 5. When the lower adsorption block 32 slides inward again, the vacuum pump is turned off, and the valve body 7 is closed, thereby ensuring the vacuuming effect inside the adsorption block 32, which helps to ensure the adsorption and fixing effect of the wafer 9.

[0048] The above are optional embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An XY dual-drive platform, characterized in that: include: The sliding mechanism (1) comprises a base (11), a lower slide (12), an upper slide (13), a first linear motor (14) and a second linear motor (15), wherein the lower slide (12) is slidably connected to the base (11), the upper slide (13) is slidably connected to the lower slide (12), the middle parts of the upper slide (13) and the lower slide (12) are both open, the first linear motor (14) is used to drive the lower slide (12) to slide, and the second linear motor (15) is used to drive the upper slide (13) to slide; The detection mechanism (2) comprises an upper detection head (21) and a lower detection head (22), wherein the upper detection head (21) is located above the upper slide (13), and the lower detection head (22) is located below the upper slide (13), and the detection ends of the upper detection head (21) and the lower detection head (22) are both facing the upper slide (13); A fixing mechanism (3), wherein the fixing mechanism (3) is provided with two groups, the fixing mechanism (3) comprising a mounting ring (31), an adsorption block (32), a vacuum pump and a driving component (33), the mounting ring (31) being provided on an upper slide table (13), the adsorption block (32) being slidably provided on the mounting ring (31), a plurality of the adsorption blocks (32) being provided and arranged in a circular array, a cavity being provided inside the adsorption block (32), an adsorption hole (321) being provided on the adsorption block (32), the cavity inside the adsorption block (32) being connected to the vacuum pump so that the adsorption block (32) can be adsorbed and fixed to the wafer (9) under the action of negative pressure, and the driving component (33) being used to drive the plurality of adsorption blocks (32) to slide toward a side close to or away from the center of the array arrangement; The two fixing mechanisms (3) are arranged at intervals, and a gap for accommodating the wafer (9) is provided between the two fixing mechanisms (3). One of the fixing mechanisms (3) is used to be adsorbed and connected to the top edge of the wafer (9), and the other fixing mechanism (3) is used to be adsorbed and connected to the bottom edge of the wafer (9). When one of the fixing mechanisms (3) is adsorbed and connected to the wafer (9), the other fixing mechanism (3) is separated from the wafer (9).

2. An XY dual-drive platform according to claim 1, characterized in that: The driving assembly (33) comprises a ring gear (331), a connecting rope (332), a first motor (333), a gear (334) and a spring (335); the ring gear (331) is rotatably connected to the mounting ring (31); the connecting rope (332) is fixedly connected between the adsorption block (32) and the ring gear (331), so that when the ring gear (331) rotates, it can drive the adsorption block (32) to slide; the first motor (333) is arranged on the mounting ring (31); the gear (334) is connected to the end of the output shaft of the first motor (333); the gear (334) is meshed with the ring gear (331); the spring (335) is connected between the adsorption block (32) and the mounting ring (31); the spring (335) causes the adsorption block (32) to have a tendency to slide toward the center of the ring gear (331).

3. An XY dual-drive platform according to claim 1, characterized in that: The mounting ring (31) is slidably arranged on the upper slide (13); a lifting assembly (4) is arranged on the upper slide (13); the lifting assembly (4) comprises a second motor (41) and a screw rod (42); the second motor (41) is fixedly arranged on the upper slide (13); the screw rod (42) is connected to the end of the output shaft of the second motor (41); and the screw rod (42) is threadedly connected to the mounting ring (31).

4. The XY dual-drive platform according to claim 1, characterized in that: A light source (5) is arranged on the base (11) below the upper slide platform (13).

5. The XY dual-drive platform according to claim 4, characterized in that: The base (11) is provided with a connecting ring (6), a cavity is provided inside the connecting ring (6), the connecting ring (6) is sleeved on the outside of the light source (5), the connecting ring (6) is provided with an air inlet (61) and an air outlet (62) which are communicated with the internal cavity, and the air outlet (62) is communicated with the cavity inside the adsorption block (32).

6. An XY dual-drive platform according to claim 5, characterized in that: A valve body (7) is provided between the exhaust port (62) and the adsorption block (32).

7. The XY dual-drive platform according to claim 1, characterized in that: A rubber pad is provided on the adsorption block (32).

8. The XY dual-drive platform according to claim 1, characterized in that: A groove (111) is provided on the top surface of the base (11), and the first linear motor (14) is arranged in the groove (111).

9. The XY dual-drive platform according to claim 1, characterized in that: Two second linear motors (15) are provided and are respectively located on both sides of the lower slide platform (12); the stator of the second linear motor (15) is arranged vertically.

10. The XY dual-drive platform according to claim 1, characterized in that: The lower slide platform (12) is made of marble.

Images