Wireless transmission module

Abstract

The invention provides a wireless transmission module. The wireless transmission module comprises a circuit assembly and a first magnetic element. The circuit assembly is configured to be connected to a coil. At least one part of the first magnetic element is arranged in the circuit assembly, and the circuit assembly comprises a first substrate corresponding to the first magnetic element.

Description

Technical Field

[0001] The present disclosure relates to a wireless transmission module, and more particularly to a wireless transmission module with an integrated magnetic conductive plate. Background Art

[0002] With the development of technology, many electronic devices (such as tablets or smart phones) now have the function of wireless charging. Users can place the electronic device on a wireless charging transmitter so that the wireless charging receiver in the electronic device generates current to charge the battery by electromagnetic induction or electromagnetic resonance. Due to the convenience of wireless charging, electronic devices with wireless charging modules are gradually becoming popular among the public.

[0003] Generally speaking, a wireless charging module includes a magnetically conductive substrate that carries a coil. When the coil is powered on and operates in a wireless charging mode or a wireless communication mode, the magnetically conductive substrate can make the magnetic lines of force emitted by the coil more concentrated to achieve better performance. However, the structure of the existing wireless charging (or communication) module and the winding method of the coil cannot meet the various requirements for wireless transmission modules, such as the need for better charging, communication performance and more miniaturized size.

[0004] Therefore, how to design a wireless transmission module that can meet various needs of users is a topic worth exploring and solving today. Summary of the invention

[0005] An object of the present invention is to provide a wireless transmission module to solve at least one of the above problems.

[0006] According to some embodiments of the present disclosure, the present disclosure provides a wireless transmission module, including a circuit component and a first magnetic element. The circuit component is configured to be connected to a coil. At least a portion of the first magnetic element is disposed inside the circuit component. The circuit component includes a first substrate corresponding to the first magnetic element.

[0007] According to some embodiments of the present disclosure, the circuit assembly is configured to electrically connect an electronic component. The first substrate includes at least one of a polymer material such as glass fiber, plastic or resin. The first magnetic element is connected to the first substrate. The first magnetic element includes a ferromagnetic material. The first magnetic element corresponds to the coil.

[0008] According to some embodiments of the present disclosure, the wireless transmission module further includes a conductive structure disposed on the circuit component. The conductive structure penetrates the circuit component along a first direction. The conductive structure includes a through hole penetrating the circuit component. When observed along a second direction, the conductive structure overlaps at least a portion of the first magnetic element. The second direction is not parallel to the first direction. The second direction is perpendicular to the first direction. The conductive structure is made of a conductive material. The conductive structure does not contact the first magnetic element. The wireless transmission module further includes a first connecting element. The first magnetic element is connected to the circuit component via the first connecting element. At least a portion of the first connecting element is located inside the circuit component.

[0009] According to some embodiments of the present disclosure, the wireless transmission module further includes a second connecting element configured to connect to the first connecting element. The first magnetic element is located between the first connecting element and the second connecting element. The first connecting element and the second connecting element are made of the same material. At least a portion of the second connecting element is located inside the circuit assembly. The circuit assembly further includes a first circuit disposed on the first substrate. When viewed along the second direction, the first circuit overlaps with at least a portion of the first connecting element.

[0010] According to some embodiments of the present disclosure, the circuit assembly further has a second substrate and a second circuit. The second substrate is connected to the first substrate through a second connecting element and a first connecting element. The second circuit is arranged on the second substrate. When observed along the second direction, the first circuit does not overlap with the second circuit. When observed along a third direction, the first circuit does not overlap with the second circuit. The third direction is perpendicular to the first direction and the second direction. When observed along the second direction, the first circuit does not overlap with the second connecting element. When observed along the second direction, the second circuit overlaps with at least a portion of the second connecting element. When observed along the second direction, the second circuit does not overlap with the first connecting element.

[0011] According to some embodiments of the present disclosure, the wireless transmission module further includes a second magnetic element, at least a portion of which is disposed inside the circuit assembly. When viewed along the second direction, the conductive structure overlaps at least a portion of the second magnetic element. The conductive structure does not contact the second magnetic element. The second magnetic element is connected to the circuit assembly via a second connecting element. When viewed along the second direction, the second magnetic element overlaps the second connecting element. When viewed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element. When viewed along the second direction, the first magnetic element overlaps the first connecting element. When viewed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element. When viewed along the first direction, the first magnetic element overlaps at least a portion of the second circuit. When viewed along the first direction, the second magnetic element overlaps at least a portion of the first circuit. The first connecting element is located between the first substrate and the second substrate. The second connecting element is located between the first substrate and the second substrate. The first magnetic element is located between the first substrate and the second substrate. The second magnetic element is located between the first substrate and the second substrate. The first magnetic element has a plurality of split portions, and a portion of the first connecting element is located between two adjacent split portions.

[0012] According to some embodiments of the present disclosure, when viewed along the second direction, the first magnetic element does not overlap the second magnetic element. The first magnetic element and the second magnetic element have different characteristics. The first magnetic element and the second magnetic element have different magnetic permeabilities. The second magnetic element includes a base element and a plurality of nano units. These nano units are arranged in the base element. The material of the base element is different from the material of the second connecting element. When viewed along the second direction, the first circuit overlaps a portion of the first magnetic element. When viewed along the second direction, the second circuit overlaps a portion of the second magnetic element.

[0013] According to some embodiments of the present disclosure, the wireless transmission module further includes a second magnetic element, at least a portion of which is disposed inside the circuit component. The second magnetic element is connected to the circuit component via a second connecting element. The first magnetic element has a first bottom surface, which directly contacts a first inner side surface of the first substrate. The second magnetic element has a second bottom surface, which directly contacts a second inner side surface of the second substrate. The first circuit is formed on the first inner side surface of the first substrate. The second circuit is formed on the second inner side surface of the second substrate. When viewed along the second direction, the first magnetic element overlaps the first connecting element. When viewed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element. When viewed along the second direction, the second magnetic element overlaps the second connecting element. When viewed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element. When viewed along the second direction, the first circuit overlaps a portion of the first magnetic element. When viewed along the second direction, the second circuit overlaps a portion of the second magnetic element. The first magnetic element includes a substrate element and a plurality of nano units. The nano units are disposed in the substrate element. The material of the substrate element is different from that of the first connecting element.

[0014] According to some embodiments of the present disclosure, the wireless transmission module further includes a third connecting element disposed between the first connecting element and the second connecting element. The circuit assembly further includes a third circuit connected to the first magnetic element via the third connecting element. The third circuit is located between the first magnetic element and the first substrate. The third circuit is located between the first magnetic element and the first circuit. The third connecting element and the first connecting element have the same material. When viewed along the second direction, the first magnetic element overlaps the third connecting element. When viewed along the second direction, the third circuit overlaps the first connecting element. When viewed along the second direction, the third circuit does not overlap the third connecting element. When viewed along the first direction, the first magnetic element overlaps at least a portion of the third circuit. When the wireless transmission module is disposed on an external electronic device, the wireless transmission module is configured to transmit data or power to the external electronic device. The first substrate is disposed on the external electronic device. The third circuit is disposed between the first magnetic element and the external electronic device.

[0015] According to some embodiments of the present disclosure, the circuit assembly further has a second substrate and a second circuit. The second substrate is connected to the first substrate through the second connecting element and the first connecting element. The second circuit is arranged on the first substrate. When observed along the second direction, the first circuit overlaps at least a portion of the second circuit. When observed along a third direction, the first circuit does not overlap the second circuit. The third direction is perpendicular to the first direction and the second direction. When observed along the second direction, the second circuit overlaps at least a portion of the first connecting element. When observed along the second direction, the first circuit does not overlap the second connecting element. When observed along the second direction, the second circuit does not overlap the second connecting element. The wireless transmission module also includes a second magnetic element, which is arranged inside the circuit assembly. The second magnetic element is connected to the circuit assembly via the second connecting element. When observed along the second direction, the first magnetic element does not overlap at least a portion of the first connecting element. When observed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element. When observed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element. When observed along the second direction, the second magnetic element does not overlap at least a portion of the second connecting element. When observed along the second direction, the second magnetic element does not overlap at least a portion of the second connecting element. The wireless transmission module further includes a third connecting element connected between the first connecting element and the second connecting element. When viewed along the second direction, the third connecting element overlaps the first magnetic element and the second magnetic element. When viewed along the second direction, the third connecting element does not overlap the first circuit and the second circuit. When viewed along the second direction, the first magnetic element overlaps a portion of the second magnetic element. The first magnetic element and the second magnetic element have different characteristics. The first magnetic element and the second magnetic element have different magnetic permeabilities. The first magnetic element corresponds to the first circuit. The second magnetic element corresponds to the second circuit.

[0016] The present disclosure provides a wireless transmission module for transmitting energy or signals, comprising at least one substrate, at least one magnetic element, at least one connecting element and at least one circuit. The at least one magnetic element can be fixedly connected to the at least one substrate through the connecting element. The at least one circuit can constitute at least one coil, and the coil can be arranged on the substrate or in the connecting element. The at least one magnetic element corresponds to the at least one coil to concentrate the magnetic field of the coil and increase its transmission efficiency.

[0017] Based on the design of the wireless transmission module disclosed in the present invention, the circuit constituting the coil and the magnetic element for improving the efficiency of the coil and reducing signal distortion can be disposed in one or more sections inside the circuit assembly through at least one connecting element. Therefore, the overall thickness of the wireless transmission module can be reduced.

[0018] In addition, since the coil and the magnetic element are directly formed in the circuit assembly (printed circuit board) during the process of the printed circuit board, there is no need to assemble the magnetic element and the coil on the printed circuit board by manpower after the process of the printed circuit board like the known wireless transmission module, thereby simplifying the process steps of the wireless transmission module and greatly reducing the time cost during manufacturing. In addition, the design disclosed in the present invention can also improve mechanical strength, improve use efficiency, improve charging efficiency, improve heat dissipation efficiency, achieve overall miniaturization, overall lightweight and reduce electromagnetic interference. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 1 is an exploded view of a wireless transmission module 100 according to an embodiment of the present disclosure.

[0020] Figure 2 A wireless transmission module 100 according to an embodiment of the present disclosure is Figure 1 Cross-section view of line segment AA in .

[0021] Figure 3 FIG. 4 is an exploded view of a wireless transmission module 100A according to another embodiment of the present disclosure.

[0022] Figure 4 FIG. 4 is a three-dimensional cross-sectional view of a partial structure of a wireless transmission module 100A according to another embodiment of the present disclosure.

[0023] Figure 5 FIG. 4 is a cross-sectional view of a partial structure of a wireless transmission module 100B according to another embodiment of the present disclosure.

[0024] Figure 6 FIG. 4 is a cross-sectional view of a partial structure of a wireless transmission module 100C according to another embodiment of the present disclosure.

[0025] Figure 7 FIG. 4 is a cross-sectional view of a partial structure of a wireless transmission module 100D according to another embodiment of the present disclosure.

[0026] Figure 8 FIG. 4 is a cross-sectional view of a partial structure of a wireless transmission module 100E according to another embodiment of the present disclosure.

[0027] The reference numerals are as follows:

[0028] 100, 100A~100E: Wireless transmission module

[0029] 101: Circuit components

[0030] 102: First base

[0031] 102S1: First inner side

[0032] 103: Second base

[0033] 103S1: Second inner side

[0034] 104: first magnetic element

[0035] 1041: Base element

[0036] 1042:Nano unit

[0037] 104PP: Split Department

[0038] 104S1: First bottom surface

[0039] 105: Second magnetic element

[0040] 105S1: Second bottom surface

[0041] 106: first connecting element

[0042] 110: Second connecting element

[0043] 112: Third connecting element

[0044] 120: first protection element

[0045] 130: Second protection element

[0046] CT1: First Line

[0047] CT2: Second Line

[0048] CT3: The third line

[0049] CTL: Coil

[0050] D1: First direction

[0051] D2: Second direction

[0052] D3: Third direction

[0053] SC1: First Segment

[0054] SC2: Second Segment

[0055] VA1: Conductive structure

[0056] VA2: Conductive structure

[0057] X: X-axis

[0058] Y: Y axis

[0059] Z: Z axis DETAILED DESCRIPTION

[0060] Many different implementation methods or examples are disclosed below to implement the different features provided. The following describes specific embodiments of the components and their arrangements to illustrate the present disclosure. Of course, these embodiments are only for illustration and do not limit the scope of the present disclosure. For example, in the specification, it is mentioned that the first characteristic component is formed on the second characteristic component, which may include an embodiment in which the first characteristic component and the second characteristic component are in direct contact, and may also include an embodiment in which there are other features between the first characteristic component and the second characteristic component. In other words, the first characteristic component and the second characteristic component are not in direct contact.

[0061] In addition, repeated numbers or marks may be used in different embodiments, and these repetitions are only for the purpose of simply and clearly describing the present disclosure, and do not represent a specific relationship between the different embodiments and / or structures discussed. In addition, in the present disclosure, forming, connecting to and / or coupling to another feature component on another feature component may include an embodiment in which the feature component is formed to be in direct contact, and may also include an embodiment in which an additional feature component inserted into the above-mentioned feature component can be formed, so that the above-mentioned feature component may not be in direct contact. In addition, space-related words may be used, such as "vertical", "above", "up", "below", "bottom" and similar words (such as "downwardly", "upwardly", etc.), these space-related words are for the convenience of describing the relationship between one (some) element or feature and another (some) element or feature in the diagram, and these space-related words are intended to cover different directions of the device including the feature.

[0062] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0063] Furthermore, the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify the elements of the claims, do not themselves mean or represent any previous ordinal numbers of the requested elements, nor do they represent the order of one requested element and another requested element, or the order in the manufacturing method. The use of ordinal numbers is only used to clearly distinguish a requested element with a certain name from another requested element with the same name.

[0064] In addition, in some embodiments of the present disclosure, terms such as "connection" and "interconnection" may refer to two structures being in direct contact with each other, or two structures not being in direct contact with each other, and other structures being disposed between the two structures, unless otherwise specified. Such terms may also include situations where both structures are movable or both structures are fixed.

[0065] Please refer to Figure 1 as well as Figure 2 , Figure 1 is an exploded view of a wireless transmission module 100 according to an embodiment of the present disclosure, and Figure 2 A wireless transmission module 100 according to an embodiment of the present disclosure is Figure 1 The wireless transmission module 100 is a wireless transmission module that can be used to transmit energy or signals, and may include a circuit component 101 and a first magnetic element 104 .

[0066] For example, the circuit component 101 is a part or the whole of a printed circuit board, but is not limited thereto. The circuit component 101 is configured to be connected to a coil CTL, and at least a part of the first magnetic element 104 is disposed inside the circuit component 101. In this embodiment, the circuit component 101 includes a first substrate 102 corresponding to the first magnetic element 104.

[0067] The first substrate 102 is, for example, a substrate of a printed circuit board, and may include, for example, at least one of glass fiber and plastic. The coil CTL is, for example, a metal line formed on the first substrate 102. In addition, one or more metal welding points may also be formed on the first substrate 102 to set one or more electronic components (such as resistors or capacitors, etc., not shown in the figure), so that the circuit component 101 is electrically connected to one or more of the aforementioned electronic components.

[0068] Furthermore, the first magnetic element 104 is configured to be connected to the first substrate 102, and the first magnetic element 104 includes a ferromagnetic material. For example, the first magnetic element 104 may have a ferrite (including soft magnetism, hard magnetism, or powder, etc.) or a nanocrystalline material. The first magnetic element 104 can make the magnetic field of the corresponding coil (such as coil CTL) more concentrated, improve the transmission efficiency, and reduce signal distortion.

[0069] In addition, the wireless transmission module 100 further includes a first connection element 106, and the first magnetic element 104 is connected to the first substrate 102 of the circuit element 101 via the first connection element 106. The first connection element 106 can be made of a polymer material, such as epoxy resin, but is not limited thereto.

[0070] like Figure 1 and Figure 2 As shown, the first connecting element 106 can be bonded to the first substrate 102 by a high temperature or high pressure process, and the first magnetic element 104 can be enclosed by the first connecting element 106. In this embodiment, the thickness of the first connecting element 106 is between 15 μm and 300 μm, but is not limited thereto. The thickness of the first magnetic element 104 is, for example, 0.1 mm, but is not limited thereto.

[0071] Furthermore, the circuit assembly 101 may further include a first protection element 120 and a second protection element 130. The first protection element 120 may be fixedly disposed on the first connecting element 106 to protect the first connecting element 106 and the first magnetic element 104.

[0072] The second protection element 130 may be fixedly disposed at the bottom of the first substrate 102, and a portion of the second protection element 130 may cover the coil CTL to protect the coil CTL. The first protection element 120 and the second protection element 130 are, for example, a protective layer made of resin or polymer material, but are not limited thereto. Based on such a structural configuration, at least a portion of the first connection element 106 is located inside the circuit component 101.

[0073] like Figure 2 As shown, the wireless transmission module 100 may further include a conductive structure VA1 disposed on the circuit component 101. The conductive structure VA1 penetrates the circuit component 101 along a first direction D1. Specifically, the conductive structure VA1 may be, for example, a through hole (VIA) that penetrates the circuit component 101. Part of the first protection element 120 and the second protection element 130 may cover a part of the conductive structure VA1 to achieve a protective effect.

[0074] Furthermore, when viewed along a second direction D2, the conductive structure VA1 overlaps at least a portion of the first magnetic element 104. The second direction D2 is not parallel to the first direction D1, for example, the second direction D2 is perpendicular to the first direction D1. Furthermore, the conductive structure VA1 can be made of a conductive material, such as copper, but not limited thereto. It is worth noting that the conductive structure VA1 does not contact the first magnetic element 104.

[0075] Based on the above configuration, in this embodiment, the coil CTL can be used as a charging coil to wirelessly charge an external device. For example, the coil CTL can be used as a resonant charging coil based on the standard of the Alliance for Wireless Power (A4WP), but is not limited thereto. In addition, the coil CTL can be used as an inductive charging coil based on the standard of the Wireless Power Consortium (WPC), such as the Qi standard.

[0076] Therefore, this implementation enables the coil CTL to correspond to different forms of charging methods at the same time to increase the scope of application. For example, at a close distance (e.g., less than 1 cm), an inductive operation is used; and at a long distance, a resonant operation is used. In this embodiment, the coil CTL can also be used as a communication coil, for example, operating in a near field communication (NFC) mode to communicate with an external electronic device. For example, the operating frequency band of the coil CTL can be, for example, between 100 MHz and 13.6 GHz, but is not limited thereto.

[0077] Please refer to Figure 3 as well as Figure 4 , Figure 3 is an exploded view of a wireless transmission module 100A according to another embodiment of the present disclosure, and Figure 4 FIG. 1 is a three-dimensional cross-sectional view of a portion of a wireless transmission module 100A according to another embodiment of the present disclosure. Compared with the wireless transmission module 100 of the aforementioned embodiment, the wireless transmission module 100A of this embodiment may further include a second substrate 103 and a second connecting element 110 .

[0078] The second connecting element 110 is configured to connect to the first connecting element 106, and the first magnetic element 104 is located between the first connecting element 106 and the second connecting element 110. The first connecting element 106 and the second connecting element 110 are made of the same material, but not limited thereto. Similar to the first connecting element 106, at least a portion of the second connecting element 110 is located inside the circuit assembly 101.

[0079] The circuit element 101 further includes a first circuit CT1 and a second circuit CT2, which are disposed on the first substrate 102. Specifically, the first circuit CT1 and the second circuit CT2 are formed on opposite sides of the first substrate 102. The thickness of the first circuit CT1 and the second circuit CT2 is, for example, between 9 μm and 70 μm, but is not limited thereto.

[0080] The first connecting element 106 is disposed on the first circuit CT1 . That is, when viewed along the second direction D2 , the first circuit CT1 overlaps at least a portion of the first connecting element 106 .

[0081] Similarly, the first magnetic element 104 is connected to the second substrate 103 via the second connecting element 110. When viewed along the second direction D2, the second connecting element 110 overlaps at least a portion of the first magnetic element 104.

[0082] like Figure 4As shown, the wireless transmission module 100 may further include another conductive structure VA2, and the coil CTL may be electrically connected to the second circuit CT2 through the conductive structures VA1 and VA2. Similarly, the second circuit CT2 may also be electrically connected to the first circuit CT1 through other conductive structures (not shown).

[0083] Similar to the above embodiment, when viewed along the second direction D2 , the conductive structure VA1 and the conductive structure VA2 overlap at least a portion of the first magnetic element 104 , but the conductive structure VA1 and the conductive structure VA2 do not contact the first magnetic element 104 .

[0084] In addition, if Figure 4 As shown, the circuit assembly 101 of this embodiment may also include a first protection element 120 and a second protection element 130, which are fixedly disposed on the first substrate 102 and the second substrate 103, respectively, wherein a portion of the first protection element 120 and the second protection element 130 may cover a portion of the first line CT1 and the coil CTL to protect the first line CT1 and the coil CTL. The configuration of the first protection element 120 and the second protection element 130 is not limited to this embodiment, and the protection elements may be added to protect the line or the coil in the subsequent embodiments.

[0085] Please refer to Figure 5 , Figure 5 1 is a cross-sectional view of a partial structure of a wireless transmission module 100B according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100B also includes a second substrate 103, a second connecting element 110 and a third connecting element 112. The second connecting element 110 is configured to be connected to the third connecting element 112, and the third connecting element 112 is connected to the first connecting element 106, and the first magnetic element 104 is located between a portion of the first connecting element 106 (a portion close to the first substrate 102) and the second connecting element 110.

[0086] The circuit element 101 also includes a first circuit CT1 disposed on the first substrate 102. The first connecting element 106 is disposed on the first circuit CT1. That is, when viewed along the second direction D2, the first circuit CT1 overlaps at least a portion of the first connecting element 106.

[0087] In this embodiment, the first magnetic element 104 is connected to the first substrate 102 via a first connecting element 106. When viewed along the second direction D2, the first connecting element 106 overlaps at least a portion of the first magnetic element 104.

[0088] Furthermore, the second substrate 103 is connected to the first substrate 102 through the second connecting element 110 and the first connecting element 106 , and the circuit element 101 further has a second circuit CT2 . The second circuit CT2 is disposed on the second substrate 103 .

[0089] It is worth noting that when viewed along the second direction D2, the first line CT1 does not overlap the second line CT2. That is, the first line CT1 and the second line CT2 are located in different sections. For example, the first line CT1 is located in a first section SC1, and the second line CT2 is located in a second section SC2.

[0090] In addition, when viewed along a third direction D3 (Y axis), the first line CT1 will not overlap the second line CT2. The third direction D3 is perpendicular to the drawing, and is also perpendicular to the first direction D1 and the second direction D2.

[0091] Furthermore, when viewed along the second direction D2, the first trace CT1 does not overlap the second connection element 110. When viewed along the second direction D2, the second trace CT2 overlaps at least a portion of the second connection element 110, and when viewed along the second direction D2, the second trace CT2 does not overlap the first connection element 106.

[0092] In this embodiment, the wireless transmission module 100B further includes a second magnetic element 105, and at least a portion of the second magnetic element 105 is disposed inside the circuit element 101. Similar to the above embodiment, the wireless transmission module 100B may also include a conductive structure VA1 that passes through the circuit element 101.

[0093] like Figure 5 As shown, when viewed along the second direction D2 , the conductive structure VA1 overlaps at least a portion of the first magnetic element 104 and the second magnetic element 105 , and the conductive structure VA1 does not contact the first magnetic element 104 and the second magnetic element 105 .

[0094] In this embodiment, the second magnetic element 105 is connected to the second substrate 103 of the circuit assembly 101 via the second connecting element 110. When viewed along the second direction D2, the second magnetic element 105 overlaps the second connecting element 110. When viewed along the second direction D2, the second magnetic element 105 does not overlap at least a portion of the first connecting element 106.

[0095] That is to say, the second magnetic element 105 and the first connecting element 106 are disposed in different sections, wherein the first connecting element 106 is located in a first section SC1 , and the second magnetic element 105 is located in a second section SC2 .

[0096] Furthermore, when viewed along the second direction D2, the first magnetic element 104 overlaps the first connecting element 106. When viewed along the second direction D2, the first magnetic element 104 does not overlap at least a portion of the second connecting element 110. In other words, the first magnetic element 104 and the second connecting element 110 are disposed in different sections.

[0097] In addition, if Figure 5 As shown, when viewed along the first direction D1, the first magnetic element 104 overlaps at least a portion of the second line CT2, and in some embodiments, the first magnetic element 104 may not overlap at least a portion of the second line CT2. Similarly, when viewed along the first direction D1, the second magnetic element 105 overlaps at least a portion of the first line CT1, and in some embodiments, the second magnetic element 105 may not overlap at least a portion of the first line CT1.

[0098] In this embodiment, the first connecting element 106 is located between the first substrate 102 and the second substrate 103, and the second connecting element 110 is located between the first substrate 102 and the second substrate 103. Similarly, the first magnetic element 104 is located between the first substrate 102 and the second substrate 103, and the second magnetic element 105 is located between the first substrate 102 and the second substrate 103.

[0099] It is worth noting that in this embodiment, the first magnetic element 104 can be made of ferrite and consists of a plurality of split parts 104PP, and a portion of the first connecting element 106 is located between two adjacent split parts 104PP. In other words, the first connecting element 106 can bond the split parts 104PP to each other.

[0100] When viewed along the second direction D2, the first magnetic element 104 does not overlap the second magnetic element 105. In other words, the first magnetic element 104 and the second magnetic element 105 are located in different sections.

[0101] The first magnetic element 104 and the second magnetic element 105 have different characteristics. Specifically, the first magnetic element 104 and the second magnetic element 105 may have different magnetic permeabilities, corresponding to the first circuit CT1 and the second circuit CT2, respectively.

[0102] The first circuit CT1 can form a first coil, and the second circuit CT2 can form a second coil. The first magnetic element 104 and the second magnetic element 105 with different magnetic permeabilities can effectively increase the efficiency of the first coil and the second coil, and the first coil and the second coil can perform different functions.

[0103] In this embodiment, the second magnetic element 105 and the first magnetic element 104 can be made of different materials. For example, the second magnetic element 105 can be made of nanocrystalline material, which includes a base element 1051 and a plurality of nano units 1052. These nano units 1052 are, for example, nano crystal grains, which are disposed in the base element 1051, and the material of the base element 1051 is different from that of the second connecting element 110, for example, made of different polymer materials such as resin.

[0104] When viewed along the second direction D2, the first line CT1 overlaps a portion of the first magnetic element 104. When viewed along the second direction D2, the second line CT2 overlaps a portion of the second magnetic element 105. Based on such a structural configuration, the overall thickness of the wireless transmission module 100B can be reduced, thereby achieving the advantage of thinness.

[0105] In this embodiment, the third connecting element 112 is disposed between the first connecting element 106 and the second connecting element 110. When viewed along the second direction D2, the third connecting element 112 does not overlap the first magnetic element 104 and the second magnetic element 105.

[0106] Furthermore, when viewed along the second direction D2, the third connecting element 112 does not overlap the first circuit CT1 and the second circuit CT2. That is, the third connecting element 112 and the above elements are located in different sections. Specifically, the third connecting element 112 is located in a third section SC3.

[0107] In addition, it should be noted that in some embodiments, the third connecting element 112 may also be omitted, so that the overall thickness of the wireless transmission module 100B can be further reduced, thereby achieving the advantage of thinness.

[0108] Please refer to Figure 6 , Figure 6 FIG. 1 is a cross-sectional view of a partial structure of a wireless transmission module 100C according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100C is similar to the wireless transmission module 100B, except that the first magnetic element 104 has a first bottom surface 104S1 directly contacting a first inner side surface 102S1 of the first substrate 102, and the second magnetic element 105 has a second bottom surface 105S1 directly contacting a second inner side surface 103S1 of the second substrate 103.

[0109] In addition, the first circuit CT1 is formed on the first inner side surface 102S1 of the first substrate 102 , and the second circuit CT2 is formed on the second inner side surface 103S1 of the second substrate 103 .

[0110] When viewed along the second direction D2, the first magnetic element 104 overlaps the first connecting element 106, and the second magnetic element 105 overlaps the second connecting element 110. When viewed along the second direction D2, the first magnetic element 104 does not overlap at least a portion of the second connecting element 110, and when viewed along the second direction D2, the second magnetic element 105 does not overlap at least a portion of the first connecting element 106.

[0111] Furthermore, when viewed along the second direction D2 , the first line CT1 overlaps a portion of the first magnetic element 104 , and when viewed along the second direction D2 , the second line CT2 overlaps a portion of the second magnetic element 105 .

[0112] It is worth noting that the wireless transmission module 100C only includes the first connection element 106 and the second connection element 110, that is, the third connection element 112 of the above embodiment is omitted. Based on such a configuration and the configuration of the above circuits and magnetic elements, the wireless transmission module 100C further reduces the overall thickness, thereby achieving the advantage of thinness.

[0113] In addition, similar to the above-mentioned embodiment, the first magnetic element 104 of this embodiment is made of nanocrystalline material, for example, and the second magnetic element 105 is made of ferrite, for example. The first magnetic element 104 may include a base element 1041 and a plurality of nano units 1042, and these nano units 1042 are disposed in the base element 1041. The material of the base element 1041 is different from the material of the first connecting element 106. That is, the first connecting element 106 will not be located between adjacent nano units 1042.

[0114] Please refer to Figure 7 , Figure 7 FIG. 1 is a cross-sectional view of a portion of a wireless transmission module 100D according to another embodiment of the present disclosure. In this embodiment, the wireless transmission module 100D includes a first connection element 106 , a second connection element 110 , and a third connection element 112 , and the third connection element 112 is disposed between the first connection element 106 and the second connection element 110 .

[0115] Furthermore, the circuit element 101 includes a first circuit CT1 and a second circuit CT2, which are respectively formed on the first substrate 102 and the second substrate 103. In addition, the circuit element 101 also includes a third circuit CT3, which is connected to the third connection element 112 via a portion of the first connection element 106, and the third connection element 112 is connected to the first magnetic element 104.

[0116] The third circuit CT3 is located between the first magnetic element 104 and the first substrate 102 , and the third circuit CT3 is located between the first magnetic element 104 and the first circuit CT1 . The third connecting element 112 has the same material as the first connecting element 106 and the second connecting element 110 .

[0117] The first magnetic element 104 is disposed in the third connecting element 112 . That is, when viewed along the second direction D2 , the first magnetic element 104 overlaps the third connecting element 112 .

[0118] When viewed along the second direction D2, the third trace CT3 overlaps the first connecting element 106. When viewed along the second direction D2, the third trace CT3 does not overlap the third connecting element 112. In addition, when viewed along the first direction D1, the first magnetic element 104 overlaps at least a portion of the third trace CT3.

[0119] In this embodiment, the third line CT3 can be used as a coil (eg, coil CTL) to communicate with or charge an external electronic device 50. Figure 7 As shown, when the wireless transmission module 100D is disposed on the external electronic device 50 , the wireless transmission module 100D is configured to transmit data or power to the external electronic device 50 .

[0120] The external electronic device 50 may be any electronic device used for communication or power supply. For example, the external electronic device 50 may be a smart phone, a smart watch or a tablet computer, but is not limited thereto.

[0121] like Figure 7 As shown, the first substrate 102 is disposed on the external electronic device 50. The third circuit CT3 is disposed between the first magnetic element 104 and the external electronic device 50, and the first magnetic element 104, the third circuit CT3 and the external electronic device 50 are arranged in sequence along the first direction D1.

[0122] Based on such a structural configuration, the coil (third line CT3) can be formed inside the circuit component 101. Compared with the known wireless transmission module, the wireless transmission module 100D of this embodiment can not only achieve the advantage of protecting the coil, but also achieve the purpose of thinness.

[0123] Please refer to Figure 8 , Figure 8 FIG. 1 is a cross-sectional view of a portion of a wireless transmission module 100E according to another embodiment of the present disclosure. Similar to the above embodiment, in this embodiment, the circuit element 101 has a first substrate 102 and a second substrate 103 , and the circuit element 101 also has a first circuit CT1 and a second circuit CT2 .

[0124] The second substrate 103 is connected to the second connection element 110, the third connection element 112 and the first connection element 106, and the first connection element 106 is connected to the first substrate 102, and the second circuit CT2 is disposed on the first substrate 102. Similarly, the first circuit CT1 is also disposed on the first substrate 102. In other words, the first circuit CT1 and the second circuit CT2 are formed on the first inner side surface 102S1 of the first substrate 102.

[0125] like Figure 8 As shown, when viewed along the second direction D2, the first line CT1 overlaps at least a portion of the second line CT2. In addition, when viewed along the third direction D3, the first line CT1 does not overlap the second line CT2. The third direction D3 is perpendicular to the first direction D1 and the second direction D2.

[0126] When viewed along the second direction D2, the second circuit CT2 overlaps at least a portion of the first connecting element 106, and the first circuit CT1 also overlaps at least a portion of the first connecting element 106. That is, the first circuit CT1 and the second circuit CT2 are located in the same section (first section SC1).

[0127] Therefore, when viewed along the second direction D2, the first circuit CT1 does not overlap the second connecting element 110. When viewed along the second direction D2, the second circuit CT2 does not overlap the second connecting element 110. That is, the first circuit CT1 and the second circuit CT2 are not located in the second section SC2.

[0128] In this embodiment, the wireless transmission module 100E includes a first magnetic element 104 and a second magnetic element 105 , and the first magnetic element 104 and the second magnetic element 105 are disposed inside the circuit component 101 .

[0129] The second magnetic element 105 is connected to the second connecting element 110, and the second connecting element 110 is connected to the second substrate 103 of the circuit component 101. The first magnetic element 104 is connected to the second connecting element 110, and the second connecting element 110 is connected to the second substrate 103 of the circuit component 101.

[0130] When viewed along the second direction D2, the first magnetic element 104 does not overlap at least a portion of the first connecting element 106, and when viewed along the second direction D2, the second magnetic element 105 does not overlap at least a portion of the first connecting element 106. Similarly, when viewed along the second direction D2, the first magnetic element 104 does not overlap at least a portion of the second connecting element 110, and when viewed along the second direction D2, the second magnetic element 105 does not overlap at least a portion of the second connecting element 110.

[0131] Specifically, in this embodiment, the wireless transmission module 100E also includes a third connection element 112 connected between the first connection element 106 and the second connection element 110. When viewed along the second direction D2, the third connection element 112 overlaps the first magnetic element 104 and the second magnetic element 105.

[0132] When viewed along the second direction D2, the third connecting element 112 does not overlap the first circuit CT1 and the second circuit CT2. When viewed along the second direction D2, the first magnetic element 104 overlaps a portion of the second magnetic element 105. In other words, the first magnetic element 104 and the second magnetic element 105 are located in the same section (third section SC3).

[0133] In this embodiment, the first magnetic element 104 and the second magnetic element 105 have different characteristics. Specifically, the first magnetic element 104 and the second magnetic element 105 have different magnetic permeabilities.

[0134] The first circuit CT1 can constitute a first coil, and the second circuit CT2 can constitute a second coil, and the first magnetic element 104 corresponds to the first circuit CT1, and the second magnetic element 105 corresponds to the second circuit CT2. That is, the first magnetic element 104 and the second magnetic element 105 can respectively make the magnetic fields of the first coil and the second coil more concentrated, and the transmission efficiency is better.

[0135] In addition, it should be noted that although Figure 7 and Figure 8 The fact that the conductive structure is not shown does not mean that the wireless transmission module 100D and the wireless transmission module 100E do not have the aforementioned conductive structure. In other words, these two embodiments may also include the conductive structure (eg, conductive structure VA1) and related structural configurations in the aforementioned embodiments.

[0136] The present disclosure provides a wireless transmission module for transmitting energy or signals, comprising at least one substrate, at least one magnetic element, at least one connecting element and at least one circuit. The at least one magnetic element can be fixedly connected to the at least one substrate through the connecting element. The at least one circuit can constitute at least one coil, and the coil can be arranged on the substrate or in the connecting element. The at least one magnetic element corresponds to the at least one coil to concentrate the magnetic field of the coil and increase its transmission efficiency.

[0137] Based on the design of the wireless transmission module disclosed in the present invention, the circuit constituting the coil and the magnetic element for improving the efficiency of the coil and reducing signal distortion can be disposed in one or more sections inside the circuit assembly through at least one connecting element. Therefore, the overall thickness of the wireless transmission module can be reduced.

[0138] In addition, since the coil and the magnetic element are directly formed in the circuit assembly (printed circuit board) during the process of the printed circuit board, there is no need to assemble the magnetic element and the coil on the printed circuit board by manpower after the process of the printed circuit board like the known wireless transmission module, thereby simplifying the process steps of the wireless transmission module and greatly reducing the time cost during manufacturing. In addition, the design disclosed in the present invention can also improve mechanical strength, improve use efficiency, improve charging efficiency, improve heat dissipation efficiency, achieve overall miniaturization, overall lightweight and reduce electromagnetic interference.

[0139] Ordinal numbers in this specification and claims, such as "first", "second", "third", etc., have no sequential relationship with each other and are only used to distinguish two different elements with the same name.

[0140] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the present disclosure. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment.

Claims

1. A wireless transmission module, comprising: a circuit assembly configured to be connected to a coil; as well as a first magnetic element, wherein at least a portion of the first magnetic element is disposed within the circuit assembly; The circuit component includes a first substrate corresponding to the first magnetic element.

2. The wireless transmission module according to claim 1, wherein The circuit assembly is configured to electrically connect to an electronic component; The first substrate includes at least one of polymer materials such as glass fiber, plastic or resin; The first magnetic element is connected to the first substrate; The first magnetic element comprises a ferromagnetic material; The first magnetic element corresponds to the coil.

3. The wireless transmission module according to claim 2, wherein The wireless transmission module further includes a conducting structure disposed on the circuit assembly; The conductive structure penetrates the circuit component along a first direction; The conductive structure includes a through hole that penetrates the circuit component; When viewed along a second direction, the conductive structure overlaps at least a portion of the first magnetic element; The second direction is not parallel to the first direction; The second direction is perpendicular to the first direction; The conducting structure is made of a conductive material; The conductive structure does not contact the first magnetic element; The wireless transmission module also includes a first connecting element; The first magnetic element is connected to the circuit component via the first connecting element; At least a portion of the first connecting element is located inside the circuit assembly.

4. The wireless transmission module according to claim 3, wherein The wireless transmission module further includes a second connection element configured to connect to the first connection element; The first magnetic element is located between the first connecting element and the second connecting element; The first connecting element and the second connecting element are made of the same material; At least a portion of the second connecting element is located inside the circuit assembly; The circuit assembly also includes a first circuit disposed on the first substrate; When viewed along the second direction, the first line overlaps with at least a portion of the first connecting element.

5. The wireless transmission module according to claim 4, wherein The circuit component also has a second substrate and a second circuit; The second substrate is connected to the first substrate through the second connecting element and the first connecting element; The second circuit is disposed on the second substrate; When viewed along the second direction, the first line does not overlap the second line; When viewed along a third direction, the first line does not overlap the second line; The third direction is perpendicular to the first direction and the second direction; When viewed along the second direction, the first circuit does not overlap the second connecting element; When viewed along the second direction, the second line overlaps at least a portion of the second connecting element; When viewed along the second direction, the second circuit does not overlap the first connecting element.

6. The wireless transmission module according to claim 5, wherein The wireless transmission module further includes a second magnetic element, at least a portion of which is disposed inside the circuit assembly; When viewed along the second direction, the conductive structure overlaps at least a portion of the second magnetic element; The conductive structure does not contact the second magnetic element; The second magnetic element is connected to the circuit component via the second connecting element; When viewed along the second direction, the second magnetic element overlaps the second connecting element; When viewed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element; When viewed along the second direction, the first magnetic element overlaps the first connecting element; When viewed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element; When viewed along the first direction, the first magnetic element overlaps at least a portion of the second circuit; When viewed along the first direction, the second magnetic element overlaps at least a portion of the first circuit; The first connecting element is located between the first substrate and the second substrate; The second connecting element is located between the first substrate and the second substrate; The first magnetic element is located between the first substrate and the second substrate; The second magnetic element is located between the first substrate and the second substrate; The first magnetic element has a plurality of split parts, and a portion of the first connecting element is located between two adjacent split parts.

7. The wireless transmission module according to claim 6, wherein When viewed along the second direction, the first magnetic element does not overlap the second magnetic element; The first magnetic element and the second magnetic element have different characteristics; The first magnetic element and the second magnetic element have different magnetic permeabilities; The second magnetic element includes a base element and a plurality of nano units; A plurality of the nano units are disposed in the base element; The material of the base element is different from the material of the second connecting element; When viewed along the second direction, the first circuit overlaps a portion of the first magnetic element; When viewed along the second direction, the second circuit overlaps a portion of the second magnetic element.

8. The wireless transmission module according to claim 5, wherein The wireless transmission module further includes a second magnetic element, at least a portion of which is disposed inside the circuit assembly; The second magnetic element is connected to the circuit component via the second connecting element; The first magnetic element has a first bottom surface directly contacting a first inner side surface of the first base; The second magnetic element has a second bottom surface directly contacting a second inner side surface of the second base; The first circuit is formed on the first inner side surface of the first substrate; The second circuit is formed on the second inner side surface of the second substrate; When viewed along the second direction, the first magnetic element overlaps the first connecting element; When viewed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element; When viewed along the second direction, the second magnetic element overlaps the second connecting element; When viewed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element; When viewed along the second direction, the first circuit overlaps a portion of the first magnetic element; When viewed along the second direction, the second circuit overlaps a portion of the second magnetic element; The first magnetic element includes a base element and a plurality of nano units; A plurality of the nano units are disposed in the base element; The material of the base element is different from the material of the first connecting element.

9. The wireless transmission module according to claim 5, wherein The wireless transmission module further includes a third connection element, which is disposed between the first connection element and the second connection element; The circuit assembly further includes a third circuit connected to the first magnetic element via the third connecting element; The third circuit is located between the first magnetic element and the first substrate; The third circuit is located between the first magnetic element and the first circuit; The third connecting element and the first connecting element are made of the same material; When viewed along the second direction, the first magnetic element overlaps the third connecting element; When viewed along the second direction, the third line overlaps the first connecting element; When viewed along the second direction, the third line does not overlap the third connecting element; When viewed along the first direction, the first magnetic element overlaps at least a portion of the third circuit; When the wireless transmission module is disposed on an external electronic device, the wireless transmission module is configured to transmit data or power to the external electronic device; The first substrate is disposed on the external electronic device; The third circuit is arranged between the first magnetic element and the external electronic device.

10. The wireless transmission module according to claim 4, wherein The circuit component also has a second substrate and a second circuit; The second substrate is connected to the first substrate through the second connecting element and the first connecting element; The second circuit is disposed on the first substrate; When viewed along the second direction, the first line overlaps at least a portion of the second line; When viewed along a third direction, the first line does not overlap the second line; The third direction is perpendicular to the first direction and the second direction; When viewed along the second direction, the second line overlaps at least a portion of the first connecting element; When viewed along the second direction, the first circuit does not overlap the second connecting element; When viewed along the second direction, the second circuit does not overlap the second connecting element; The wireless transmission module further includes a second magnetic element, which is disposed inside the circuit assembly; The second magnetic element is connected to the circuit component via the second connecting element; When viewed along the second direction, the first magnetic element does not overlap at least a portion of the first connecting element; When viewed along the second direction, the second magnetic element does not overlap at least a portion of the first connecting element; When viewed along the second direction, the first magnetic element does not overlap at least a portion of the second connecting element; When viewed along the second direction, the second magnetic element does not overlap at least a portion of the second connecting element; The wireless transmission module further includes a third connection element connected between the first connection element and the second connection element; When viewed along the second direction, the third connecting element overlaps the first magnetic element and the second magnetic element; When viewed along the second direction, the third connecting element does not overlap the first circuit and the second circuit; When viewed along the second direction, the first magnetic element overlaps a portion of the second magnetic element; The first magnetic element and the second magnetic element have different characteristics; The first magnetic element and the second magnetic element have different magnetic permeabilities; The first magnetic element corresponds to the first circuit; The second magnetic element corresponds to the second circuit.

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