IC carrier plate processing equipment based on positioning structure and positioning process

Abstract

The invention relates to the technical field of electrical element assembly manufacturing, and discloses an IC carrier plate processing device based on a positioning structure and a positioning technology.The IC carrier plate processing device comprises a substrate body and a drilling machine body, and a bearing part for positioning the substrate body is arranged on a conveying platform of the drilling machine body; and the bearing part comprises a bearing frame for bearing the substrate main body. The supporting piece is arranged and penetrates through the limiting frame of the movable frame until the fixing block is completely clamped on the inner side of the limiting frame, at the moment, the connecting rod is arranged below the cavity of the bearing frame in a penetrating mode, a worker can change the position of the fixing block on the inner side of the limiting frame by rotating a knob at different rotating angles, and therefore the position of the connecting rod is integrally adjusted; the supporting block is accurately adjusted through the cavity of the bearing frame, and the position of the supporting block on the outer side of the connecting rod is changed through the fixing pin, so that the supporting piece can carry out different supporting and positioning on the base plate main body with various different drilling requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing electrical component assemblies, and in particular to an IC carrier processing device and a positioning process based on a positioning structure. Background Art

[0002] IC substrate is a substrate used to package bare IC (integrated circuit) chips. IC substrate is an intermediate product that connects chips and circuit boards. In the field of high-end packaging, IC substrate has replaced traditional lead frames and become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for chips, but also provides electronic connection between chips and PCB motherboards, playing a role of "bridging the gap".

[0003] During the processing of IC carriers, it is necessary to drill holes in the substrate using a drilling machine. In order to ensure that no positioning error occurs during the drilling of the substrate, the prior art will choose to position the bottom surface of the substrate completely flat against the workbench and then perform single-sided drilling. However, with the increasing complexity of people's demands for electronic components, the positions where the circuit boards need to be drilled are also more diverse. Relying solely on the pressure on the circuit board from one side cannot guarantee the stability of the circuit board during the hole transfer process. During the drilling of the circuit board, the bottom surface of the circuit board needs to be close to the workbench to ensure that the circuit board will not be offset due to vibration during the drilling process. However, the drill bit can easily pass through the circuit board during drilling, causing damage to the surface of the workbench that is in contact with it. The workbench that has been drilled multiple times is not suitable for being set under circuit boards with other drilling requirements, and the workbench needs to be replaced, causing unnecessary losses. In view of this, the present invention provides an IC carrier processing device and a positioning process based on a positioning structure. Summary of the invention

[0004] Technical issues solved

[0005] In view of the above-mentioned shortcomings of the prior art, the present invention provides an IC substrate processing equipment and positioning process based on a positioning structure, which can effectively solve the problem that in the prior art IC substrate drilling process, the drill bit penetrates the substrate, causing the workbench supporting it to be easily damaged and requiring frequent replacement.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides an IC substrate processing device based on a positioning structure, comprising a substrate body;

[0009] A drilling machine body, wherein a bearing part for positioning a substrate body is arranged on the drilling machine body transport platform, wherein the bearing part comprises a bearing frame for carrying the substrate body, wherein a positioning member for all-round limiting the surface of the substrate body is arranged inside the bearing frame, wherein a movable frame is fixedly connected to the bottom end of the bearing frame, wherein a limiting frame is slidably connected to the inside of the movable frame, wherein a supporting member for supporting and positioning the bottom end of the substrate body is arranged inside the limiting frame;

[0010] Wherein, the support member includes a support block for supporting and cleaning the periphery of the drilling hole of the substrate body.

[0011] Furthermore, the four inner walls of the support frame are all provided with side grooves, a pair of the inner walls of the side grooves are provided with guide grooves, and compression springs are elastically connected to the side grooves at positions close to the center of the support frame.

[0012] Furthermore, the positioning member includes an electric push rod arranged on the outside of the carrier frame, a side pressure plate is arranged at the output end of the electric push rod, main shafts are fixedly connected at both ends of the side pressure plate, the main shaft is slidably connected to the inner wall of the guide groove, a push ring is slidably connected to the side of the guide groove away from the side pressure plate, a connecting rod is attached to the other end of the push ring, a limiting plate is movably connected to the outer side of the connecting rod, and a telescopic spring is elastically connected to the inner side of the connecting rod.

[0013] Furthermore, a magnetic component 1 is fixedly connected to the top of the limit frame, and the magnetic component 1 is magnetically connected to a magnetic component 2 fixed to the top of the inner wall of the movable frame. When the supporting frame has not entered the drilling space of the drilling machine body, the magnetic component 1 and the magnetic component 2 have the same magnetic properties. When the supporting frame enters the drilling space of the drilling machine body, the magnetic component 1 and the magnetic component 2 have opposite magnetic properties.

[0014] Furthermore, the support member also includes a fixing frame engaged with the limit frame, a positioning block engaged with the limit frame is symmetrically arranged on the inner side of the fixing frame, a knob is rotatably connected to the middle part of the outer side of the fixing frame, a side of the knob close to the fixing frame is fixedly connected to the limit block, the other end of the limit block is movably connected to a positioning plate, the other end of the positioning plate is fixedly connected to a connecting rod, and a plurality of support blocks are detachably connected to the outer side of the connecting rod.

[0015] Furthermore, the top of the support block is set as a plane, the side of the top of the support block is set as an arc, the inner side of the support block is slidably connected to a rubber block, the rubber block can form a complete arc with the top of the support block, and the bottom of the rubber block is elastically connected to a support spring.

[0016] A positioning process of an IC substrate processing device based on a positioning structure comprises the following steps:

[0017] S1. Material preparation: Select appropriate substrate, copper foil, dielectric material and adhesive according to design requirements;

[0018] S2, substrate production: copper foil and dielectric material are alternately laminated to form an undrilled substrate, and then the multilayer materials are pressed into shape by hot pressing and bonded;

[0019] S3, positioning drilling: fix the substrate on the drilling machine, and use the drilling machine to drill holes in the substrate to form through holes for subsequent electroplating;

[0020] S4, hole wall treatment: remove the residue on the hole wall after drilling, and perform electroplating on the hole wall to form a conductive hole wall;

[0021] S5. Surface treatment: Treat the surface of the carrier board, apply solder resist, mark and anti-oxidation treatment;

[0022] S6, processing and forming: cutting the carrier board to the required size and shape, and performing shape processing operations such as chamfering and drilling on its shape;

[0023] S7, Processing and Forming: Conduct electrical tests on the carrier board to ensure that all circuit paths meet the design requirements, clean the carrier board, remove residues from the processing process, conduct appearance inspection and functional inspection to ensure quality, and package qualified products.

[0024] Beneficial Effects

[0025] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0026] The present invention is provided with a support member, and the support member is first passed through the limit frame of the movable frame until the fixed block is completely engaged with the inner side of the limit frame. At this time, the connecting rod is passed through and arranged below the cavity of the carrier frame, and then the knob is rotated. The rotation of the knob drives the limit block to rotate, and the rotation of the limit block squeezes the positioning block, so that the positioning block slides along the positioning groove to the concave groove arranged on the inner side of the compression spring, thereby completing the positioning of the fixed block. When the knob is rotated ninety degrees, the positioning block is completely engaged with the concave groove, and the fixed block will not move. When the rotation angle of the knob is less than ninety degrees, the positioning block is not completely engaged with the concave groove, and the fixed block can be in the concave groove. The staff can slide down the limit groove, and the staff can change the position of the fixed block on the inner side of the limit frame by rotating the knob at different angles, so as to realize the overall adjustment of the connecting rod position. After the installation position of the connecting rod is determined, the position of the support block is determined. The staff can check the position of each support block before installing the support member, or after the support member is installed, the support block can be accurately adjusted through the cavity of the carrier frame. The fixing pin connected to the outside of the support block is engaged, and the position of the support block on the outside of the connecting rod is changed by the fixing pin, so that the support member can perform different support positioning for the substrate body with various different drilling requirements.

[0027] The present invention provides a support block, and the limit frame moves upward to drive the support member engaged therein to move upward as a whole, and the rubber block on the upper surface of the support block moves to the inner side of the support block. At this time, the fixed plane on the upper surface of the support block fits with the bottom end of the substrate body, thereby stably supporting the bottom end of the substrate body. When the drilling operation is performed, the support block on the side of the hole wall can support the drilling position to avoid stress concentration on the substrate body due to drilling. The drill bit of the drilling machine body will not contact the support member after penetrating the substrate body. The dispersed fixed blocks can not only provide sufficient support for the bottom end of the substrate body, but also will not be damaged due to the drill bit penetrating the carrier, thereby improving the service life of the device. , reducing the waste of resources. After the drilling operation is completed, the substrate body moves out of the drilling machine space, and the magnetic field direction of the magnetic part 2 is restored to a state of mutual repulsion with the magnetic part 1. The limit frame is forced to slide to the bottom of the inner wall of the movable frame. At this time, the rubber block in the support block is restored to a state of close fit with the bottom of the substrate body. The staff pulls the knob, and the knob drives the limit block to slide on the inside of the fixed block. The movement of the limit block drives the positioning plate to move, and the positioning plate drives the connecting rod to move horizontally to the position of a hole wall. The connecting rod drives the support block to move. At the same time as the support block moves, the rubber block that is closely fitted with the bottom of the substrate body moves. The reciprocating movement of the rubber block can clean the burrs at the bottom of the drilled hole.

[0028] The present invention sets a movable frame. Before the drilling structure of the drilling machine body moves down to drill the substrate main body, the magnetic field direction of the magnetic component two is the same as the magnetic field direction of the magnetic component one. The magnetic component two and the magnetic component one have the same magnetism and repel each other, thereby ensuring that the limit frame is located at the top of the inner wall of the movable frame before the drilling operation is performed. When the drilling structure of the drilling machine body moves down to drill the substrate main body, the magnetic field direction of the magnetic component two is opposite to the magnetic field direction of the magnetic component one. The magnetic component two and the magnetic component one have the same magnetism and attract each other. The limit frame is located at the top of the inner wall of the movable frame when the drilling operation is performed.

[0029] The present invention provides a positioning piece, and in the process that the main shaft moves to the side edge of the guide groove and drives the side pressure plate to move downward to pressurize the two sides of the upper surface of the substrate main body, as the main shaft gets closer to the side edge of the guide groove, the main shaft will contact the push ring, and the push ring will be squeezed by the main shaft. The push ring slides along the open groove of the guide groove, and the push ring moves to squeeze the slider of the connecting rod. The slider of the connecting rod overcomes the elastic force of the telescopic spring and slides along the long rod. The movement of the slider drives the connecting rod to rotate, and the rotation of the connecting rod moves out the limit plate embedded in the inner side of the side groove, and the small-sized arc-shaped limit strip on the outer side of the limit plate squeezes the other two side edges of the substrate main body, and the large-sized arc-shaped limit strip on the outer side of the limit plate will move to the upper surface of the substrate main body, thereby limiting the other two sides of the upper surface of the substrate main body, thereby realizing all-round limiting of the substrate main body and improving the stability of the substrate main body during the drilling process. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 A schematic diagram of a positioning process flow of an IC substrate processing device according to an embodiment of the present invention;

[0032] Figure 2 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0033] Figure 3 It is a schematic diagram of the structure of the bearing part of an embodiment of the present invention;

[0034] Figure 4 This is a schematic diagram of the connection structure of the positioning member according to an embodiment of the present invention;

[0035] Figure 5 It is a structural schematic diagram of the carrier frame according to an embodiment of the present invention when no circuit board is carried;

[0036] Figure 6 A schematic diagram of a support structure split according to an embodiment of the present invention;

[0037] Figure 7 Schematic diagram of the movable frame structure of an embodiment of the present invention.

[0038] The numbers in the figure represent respectively: 1. drilling machine body; 2. bearing part; 21. bearing frame; 211. side groove; 212. guide groove; 213. compression spring; 22. positioning member; 221. electric push rod; 222. side pressure plate; 223. push ring; 224. telescopic spring; 225. connecting rod; 226. limit plate; 227. main shaft; 23. movable frame; 231. limit frame; 232. magnetic part 1; 233. magnetic part 2; 24. supporting member; 241. fixing frame; 242. connecting rod; 243. supporting block; 245. positioning block; 246. limit block; 247. knob; 248. positioning plate; 3. substrate body. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The present invention will be further described below in conjunction with the embodiments.

[0041] Example:

[0042] See also Figure 2-Figure 7 The present invention provides an IC substrate processing device based on a positioning structure, including a drilling body 1 for performing a drilling operation, and a bearing portion 2 is placed on the upper surface of the drilling body 1.

[0043] refer to Figure 2 , Figure 3 and Figure 4 The bearing part 2 includes a bearing frame 21 for placing the substrate body 3, and the inner wall of the side of the bearing frame 21 is provided with a positioning member 22 for pressing and limiting the side of the substrate body 3, such as Figure 5 As shown, the carrier 21 is set to be in a hollow state, the rectangle at the bottom of the carrier 21 is smaller than the size of the substrate body 3, and the rectangular groove in the middle of the carrier 21 is larger than the size of the substrate body 3, so the substrate body 3 can fall into the carrier 21 stably, and the carrier 21 supports and positions the bottom of the circuit board around, and the inner wall of the carrier 21 is provided with a side groove 211 for limiting the positioning member 22, as shown in FIG. Figure 4 As shown, there are two symmetrically arranged side grooves 211, and the two side grooves 211 are fixedly connected with an electric push rod 221 at a position away from the center of the carrier frame 21. The output end of the electric push rod 221 is hingedly connected to a fixed block, and the other end of the fixed block is fixedly connected to a side pressure plate 222. Both ends of the side pressure plate 222 are fixedly connected with a main shaft 227. The main shaft 227 is slidably connected to a guide groove 212 opened on the inner wall of the side groove 211, and the guide groove 212 consists of a groove and an inclined groove connected to the bottom of the groove.

[0044] In the initial state, the spindle 227 is located above the inner inclined groove of the notch. As the electric push rod 221 extends and pushes the side pressure plate 222, the side pressure plate 222 moves and drives the side pressure plate 222 to move. The side pressure plate 222 slides along the side groove 211, and the side pressure plate 222 drives the spindle 227 to slide. The moving trajectory of the electric push rod 221 is the same as the sliding trajectory of the spindle 227 on the inner side of the guide groove 212. Under the push of the electric push rod 221, the side pressure plate 222 moves from a position completely embedded in the side groove 211 to a position where its outer end penetrates the side groove 211 and is located above the side of the substrate body 3. Position, when the main shaft 227 moves to the bottom end position of the inclined groove of the guide groove 212, the side pressure plate 222 moves downward, the fixed block between the side pressure plate 222 and the electric push rod 221 rotates, the side pressure plate 222 presses the upper surface of the substrate body 3, and the inner wall of the side groove 211 is elastically connected with a compression spring 213 near the center of the carrier frame 21. When the side pressure plate 222 moves downward to press the upper surface of the substrate body 3, further pressure is applied to ensure that the side pressure plate 222 can provide sufficient pressure on the upper surface of the substrate body 3 to avoid vibration of the substrate body 3 during rotation.

[0045] An open groove is provided on one side of the bottom end of the inclined groove of the guide groove 212, and a push ring 223 is slidably connected to the inner side of the open groove. A connecting rod 225 is provided at the other end of the push ring 223. The connecting rod 225 includes a slider fixedly connected to the side of the push ring 223. In the initial state, the slider fits the side of the guide groove 212, and the limit plate 226 is completely embedded in the inner side of the side groove 211. When the main shaft 227 moves to the side position of the bottom end of the guide groove 212, the main shaft 227 will squeeze the push ring 223, and the push ring 223 moves out of the open groove to apply thrust to the slider that fits therewith. A long rod is provided through the center of the slider, and the slider slides along the long rod. The two ends of the long rod are respectively connected to the side The inner wall of the groove 211 is fixedly connected, and the slider is rotatably connected with a connecting rod near the center of the carrier 21. The connecting rods are rotatably connected by a rotating shaft, and the connecting rod connection is embedded in the rectangular block on the side of the limit plate 226. A telescopic spring 224 is also sleeved on the outside of the long rod, and the two ends of the telescopic spring 224 are respectively fitted with the slider. In the initial state, when the other side of the slider is fitted with the opening groove of the guide groove 212, the telescopic spring 224 is in a normal state. Two arc-shaped limit strips are arranged on the other side of the limit plate 226. The larger arc-shaped limit strip is located at the top, and the smaller arc-shaped limit strip is located at the bottom, and the height dimension of the limit plate 226 is greater than the height dimension of the side pressure plate 222.

[0046] In the process that the main shaft 227 moves to the side of the guide groove 212 and drives the side pressure plate 222 to move downward to pressurize the two sides of the upper surface of the substrate body 3, as the main shaft 227 gets closer to the side of the guide groove 212, the main shaft 227 will contact the push ring 223, and the push ring 223 will be squeezed by the main shaft 227. The push ring 223 slides along the open groove of the guide groove 212, and the push ring 223 moves to squeeze the slider of the connecting rod 225. The slider of the connecting rod 225 overcomes the elasticity of the telescopic spring 224. The force slides along the long rod, and the movement of the slider drives the connecting rod to rotate. The rotation of the connecting rod will move out the limit plate 226 embedded in the inner side of the side groove 211, and the small-sized arc-shaped limit strip on the outer side of the limit plate 226 squeezes the other two sides of the substrate body 3, and the large-sized arc-shaped limit strip on the outer side of the limit plate 226 will move to the upper surface of the substrate body 3, thereby limiting the other two sides of the upper surface of the substrate body 3, realizing all-round limitation of the substrate body 3 and improving the stability of the substrate body 3 during the hole rotation process.

[0047] refer to Figure 5 , Figure 6 and Figure 7 A movable frame 23 is fixedly connected to the lower part of the carrier frame 21, and a limit frame 231 is slidably connected to the inner side of the movable frame 23. In the initial state, the limit frame 231 is located at the bottom end of the inner wall of the movable frame 23. The inner wall of the movable frame 23 is provided with a groove for limiting the side of the limit frame 231, so as to ensure the stability of the sliding of the limit frame 231. A magnetic member 232 is fixedly connected to the top of the limit frame 231, and a magnetic member 233 magnetically connected to the magnetic member 232 is fixedly connected to the bottom end of the inner wall of the movable frame 23. Before the drilling structure of the drilling machine body 1 is moved down to drill the substrate main body 3, the magnetic member 233 is fixedly connected to the bottom end of the inner wall of the movable frame 23. The magnetic field direction of magnetic component 233 is the same as that of magnetic component 1 232. Magnetic component 233 and magnetic component 1 232 have the same magnetism and repel each other, ensuring that the limit frame 231 is located at the top of the inner wall of the movable frame 23 before the drilling operation is performed. When the drilling structure of the drilling machine body 1 moves down to perform the drilling operation on the substrate main body 3, the magnetic field direction of magnetic component 233 is opposite to that of magnetic component 1 232. Magnetic component 233 and magnetic component 1 232 have the same magnetism and attract each other. The limit frame 231 is located at the top of the inner wall of the movable frame 23 when the drilling operation is performed.

[0048] A support member 24 is provided on the inner side of the limiting frame 231. The support member 24 includes a fixing frame 241 embedded in the inner side of the limiting frame 231. A positioning groove is provided inside the fixing frame 241. A positioning block 245 is slidably connected to the inner side of the positioning groove. Two positioning blocks 245 are symmetrically arranged. The size of the positioning block 245 is equal to the size of the concave groove provided in the middle part of the inner side of the limiting frame 231. Rubber strips are fixedly connected on both sides of the positioning block 245. When the positioning block 245 is inserted into the inner side of the concave groove, the friction between the two can be increased to ensure the stability of the engagement between the two. At the same time, the positioning block 245 that is not subjected to external force can be limited to prevent it from being moved from the fixed position due to its own gravity. The limit block 246 slides down in the positioning groove, and the middle part of the positioning groove is rotatably connected to the limit block 246. The limit block 246 includes a circular shaft, and an arc plate is symmetrically fixedly connected to the outer surface of the circular shaft. The side of the arc plate fits with the positioning block 245, and the positioning block 245 that is completely embedded in the inner side of the positioning groove in the initial state can be squeezed out of the positioning groove. The outer end of the limit block 246 is fixedly connected with a knob 247 for easy operation by the staff. The other end of the limit block 246 is engaged in the circular groove on the inner wall of the positioning plate 248. The limit block 246 can rotate inside the circular groove. The other end of the positioning plate 248 is fixedly connected with a connecting rod 242, and a plurality of support blocks 243 are detachably connected to the outer side of the connecting rod 242.

[0049] Before the carrier 21 carries the substrate body 3, first, the support member 24 is passed through the limit frame 231 of the movable frame 23 until the fixed frame 241 is completely engaged with the inner side of the limit frame 231. At this time, the connecting rod 242 is passed through the lower part of the cavity of the carrier 21. Then, the knob 247 is rotated. The rotation of the knob 247 drives the limit block 246 to rotate. The limit block 246 rotates to squeeze the positioning block 245, so that the positioning block 245 slides along the positioning groove to the concave groove set on the inner side of the compression spring 213, thereby completing the positioning of the fixed frame 241. When the knob 247 is rotated 90 degrees, the positioning block 245 is completely engaged with the concave groove, and the fixed frame 241 will not move. When the rotation angle of the knob 247 is less than 90 degrees, the positioning block 245 is not completely engaged with the concave groove. The fixing frame 241 can slide under the restriction of the concave groove, and the staff can change the position of the fixing frame 241 on the inner side of the limit frame 231 through the different rotation angles of the knob 247, so as to realize the overall adjustment of the position of the connecting rod 242. After the installation position of the connecting rod 242 is determined, the position of the support block 243 is then determined. The staff can check the position of each support block 243 before installing the support member 24, or after the support member 24 is installed, accurately adjust the support block 243 through the cavity of the carrier frame 21, and the fixing pin connected to the outside of the support block 243 is engaged. The position of the support block 243 on the outside of the connecting rod 242 is changed through the fixing pin, so that the support member 24 can perform different support positioning on the substrate body 3 with various different drilling requirements.

[0050] A support spring is elastically connected to the inner side of the support block 243, and a rubber block is elastically connected to the top of the support spring. In the initial state, the rubber block is supported by the support spring so that the upper surface of the support block 243 is a complete arc. When the rubber block is squeezed by external force, the rubber block is embedded in the inner side of the support block 243, and the top of the support block 243 is a horizontal plane.

[0051] After the substrate body 3 is placed in the carrier 21, the bottom end of the substrate body 3 contacts the rubber block on the upper surface of the support block 243, and the rubber block fits tightly with the bottom end of the substrate body 3. The upper surface of the substrate body 3 is limited by the positioning member 22, and the lower surface is supported by the support member 24. When the drilling machine body 1 performs a drilling operation on the substrate body 3, the magnetic field direction of the magnetic member 233 changes, and the limiting frame 231 moves up quickly under the action of the magnetic field of the magnetic member 1 232. The upward movement of the limiting frame 231 drives the support member 24 engaged therein to move upward as a whole, and the rubber block on the upper surface of the support block 243 moves to the support block On the inner side of 243, at this time, the fixed plane on the upper surface of the support block 243 fits with the bottom end of the substrate body 3, thereby stably supporting the bottom end of the substrate body 3. When drilling, the support block 243 on the side of the hole wall can support the drilling position to avoid stress concentration on the substrate body 3 due to drilling. The drill bit of the drilling machine body 1 will not contact the support member 24 after penetrating the substrate body 3. The dispersed fixed frame 241 can not only provide sufficient support for the bottom end of the substrate body 3, but also will not be damaged due to the drill bit penetrating the carrier frame 21, thereby improving the service life of the device and reducing the waste of resources.

[0052] After the drilling operation is completed, the substrate body 3 moves out of the space of the drilling machine body 1, and the magnetic field direction of the magnetic part 233 is restored to the state of mutual repulsion with the magnetic part 1 232. The limit frame 231 is forced to slide to the bottom end of the inner wall of the movable frame 23. At this time, the rubber block in the support block 243 is restored to a state of close fit with the bottom end of the substrate body 3. The staff pulls the knob 247, and the knob 247 drives the limit block 246 to slide on the inside of the fixed frame 241. The movement of the limit block 246 drives the positioning plate 248 to move, and the positioning plate 248 drives the connecting rod 242 to move horizontally to the position of the hole wall. The connecting rod 242 drives the support block 243 to move. At the same time as the support block 243 moves, the rubber block that is closely fitted with the bottom end of the substrate body 3 moves. The reciprocating movement of the rubber block can clean the burrs at the bottom end of the drilled hole.

[0053] See also Figure 1 On the other hand, the present invention provides a positioning process of an IC substrate processing device based on a positioning structure, characterized in that it includes the following steps:

[0054] S1. Material preparation: Select appropriate substrate, copper foil, dielectric material and adhesive according to design requirements;

[0055] S2, substrate production: copper foil and dielectric material are alternately laminated to form an undrilled substrate, and then the multilayer materials are pressed into shape by hot pressing and bonded;

[0056] S3, positioning drilling: fix the substrate on the drilling machine, and use the drilling machine to drill holes in the substrate to form through holes for subsequent electroplating;

[0057] S4, hole wall treatment: remove the residue on the hole wall after drilling, and perform electroplating on the hole wall to form a conductive hole wall;

[0058] S5. Surface treatment: Treat the surface of the carrier board, apply solder resist, mark and anti-oxidation treatment;

[0059] S6, processing and forming: cutting the carrier board to the required size and shape, and performing shape processing operations such as chamfering and drilling on its shape;

[0060] S7, Processing and Forming: Conduct electrical tests on the carrier board to ensure that all circuit paths meet the design requirements, clean the carrier board, remove residues from the processing process, conduct appearance inspection and functional inspection to ensure quality, and package qualified products.

[0061] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. An IC substrate processing device based on a positioning structure, characterized in that: include: substrate body; A drilling machine body, wherein a bearing part for positioning a substrate body is arranged on the drilling machine body transport platform, wherein the bearing part comprises a bearing frame for carrying the substrate body, wherein a positioning member for all-round limiting the surface of the substrate body is arranged inside the bearing frame, wherein a movable frame is fixedly connected to the bottom end of the bearing frame, wherein a limiting frame is slidably connected to the inside of the movable frame, wherein a supporting member for supporting and positioning the bottom end of the substrate body is arranged inside the limiting frame; Wherein, the support member includes a support block for supporting and cleaning the periphery of the drilling hole of the substrate body.

2. The IC substrate processing equipment based on the positioning structure according to claim 1 is characterized in that: The four inner walls of the support frame are all provided with side grooves, a pair of the inner walls of the side grooves are provided with guide grooves, and compression springs are elastically connected to the positions of the side grooves near the center of the support frame.

3. The IC substrate processing equipment based on the positioning structure according to claim 2 is characterized in that: The positioning member includes an electric push rod arranged on the outside of the carrier frame, a side pressure plate is arranged at the output end of the electric push rod, main shafts are fixedly connected at both ends of the side pressure plate, the main shaft is slidably connected to the inner wall of the guide groove, a push ring is slidably connected to the side of the guide groove away from the side pressure plate, a connecting rod is attached to the other end of the push ring, a limiting plate is movably connected to the outer side of the connecting rod, and a telescopic spring is elastically connected to the inner side of the connecting rod.

4. The IC substrate processing equipment based on the positioning structure according to claim 3 is characterized in that: A magnetic part 1 is fixedly connected to the top of the limit frame, and the magnetic part 1 is magnetically connected to a magnetic part 2 fixed on the top of the inner wall of the movable frame. When the supporting frame has not entered the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have the same magnetic properties. When the supporting frame enters the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have opposite magnetic properties.

5. The IC substrate processing equipment based on the positioning structure according to claim 4 is characterized in that: The support member also includes a fixing frame engaged with the limit frame, a positioning block engaged with the limit frame is symmetrically arranged on the inner side of the fixing frame, a knob is rotatably connected to the middle part of the outer side of the fixing frame, a side of the knob close to the fixing frame is fixedly connected to the limit block, the other end of the limit block is movably connected to a positioning plate, the other end of the positioning plate is fixedly connected to a connecting rod, and a plurality of support blocks are detachably connected to the outer side of the connecting rod.

6. The IC substrate processing equipment based on the positioning structure according to claim 5 is characterized in that: The top of the support block is set as a plane, the side of the top of the support block is set as an arc, the inner side of the support block is slidably connected with a rubber block, the rubber block can form a complete arc with the top of the support block, and the bottom of the rubber block is elastically connected with a support spring.

7. The positioning process of the IC substrate processing equipment based on the positioning structure according to claim 6 is characterized in that: The steps include: S1. Material preparation: Select appropriate substrate, copper foil, dielectric material and adhesive according to design requirements; S2, substrate production: copper foil and dielectric material are alternately laminated to form an undrilled substrate, and then the multilayer materials are pressed into shape by hot pressing and bonded; S3, positioning drilling: fix the substrate on the drilling machine, and use the drilling machine to drill holes in the substrate to form through holes for subsequent electroplating; S4, hole wall treatment: remove the residue on the hole wall after drilling, and perform electroplating on the hole wall to form a conductive hole wall; S5. Surface treatment: Treat the surface of the carrier board, apply solder resist, mark and anti-oxidation treatment; S6, processing and forming: cutting the carrier board to the required size and shape, and performing shape processing operations such as chamfering and drilling on its shape; S7, Processing and Forming: Conduct electrical tests on the carrier board to ensure that all circuit paths meet the design requirements, clean the carrier board, remove residues from the processing process, conduct appearance inspection and functional inspection to ensure quality, and package qualified products.

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