Electromagnetic shielding heat dissipation case

Abstract

The invention discloses an electromagnetic shielding heat dissipation case, and belongs to the technical field of electronic equipment shielding shells, the electromagnetic shielding heat dissipation case comprises a case shell, a heat conduction mounting plate and a shielding box, the case shell comprises a case body, a case cover and heat dissipation fins which are detachably connected, and the heat conduction mounting plate is arranged in the case shell and used for mounting components; the heat conduction mounting plate is in contact with the inner wall of the case shell to conduct heat out, the shielding box is arranged on the heat conduction mounting plate, and a shielding cavity for shielding electromagnetism is defined between the shielding box and the heat conduction mounting plate. Components are installed on the heat conduction installation plate with the high heat conduction coefficient to conduct out heat, key components and components prone to heating are placed in the aluminum shielding box with the high electromagnetic shielding performance, the heat conduction installation plate makes contact with the shielding box to conduct out heat, and non-key components and components not prone to heating are placed outside the shielding box. On the premise that good electromagnetic shielding and heat dissipation efficiency are guaranteed, the layout of the case shell is simpler and more compact, and space utilization is more reasonable.

Description

Technical Field

[0001] The invention relates to the technical field of electronic equipment shielding shells, and in particular to an electromagnetic shielding heat dissipation chassis. Background Art

[0002] Due to the special working environment of nuclear industrial plants, the communication chassis used needs to have high integration and reliability, which places high demands on the chassis layout, heat dissipation performance, and electromagnetic shielding performance to ensure that the motherboard, components, etc. inside the chassis are not affected by the harsh external electromagnetic environment or cause electromagnetic interference to other external equipment, so that they can be used with high performance over a long period of time.

[0003] At present, conventional control chassis in the communication field usually use fans to blow heat out of the chassis in order to meet the heat dissipation function. The chassis needs to be equipped with special air inlets and outlets, so a large number of heat dissipation vents are arranged on the chassis shell. When used in nuclear industrial plants, if there are many openings on the chassis, the electromagnetic shielding performance of the chassis will be reduced and the electromagnetic shielding requirements cannot be met. A large number of openings on the chassis and fans to assist in heat dissipation will cause dust to enter the interior of the equipment. The accumulation of dust inside the equipment will cause abnormal operation of components or shorten their lifespan. The use of air filtration requires manual regular replacement of the filter device. The present invention proposes a new solution to the above problems. Summary of the invention

[0004] In order to overcome at least one of the above disadvantages, the present invention provides an electromagnetic shielding heat dissipation chassis. The purpose of the present invention can be achieved by adopting the following technical solutions: The present invention provides an electromagnetic shielding heat dissipation chassis, comprising: A chassis shell, the chassis shell comprising a detachably connected box body, a box cover and heat dissipation fins, the box body and the box cover enclose a structure with an opening and no heat dissipation holes, the heat dissipation fins are arranged at the opening to conduct heat out of the chassis shell; A heat-conducting mounting plate, which is arranged in the chassis shell for mounting components, and the heat-conducting mounting plate is in contact with the inner wall of the chassis shell, and is used to transfer the heat of the components to the chassis shell; A shielding box is arranged on the heat-conducting mounting plate, a shielding chamber for electromagnetic shielding is arranged inside the shielding box, and a part of components are located in the shielding chamber.

[0005] In one possible implementation, the heat conductive mounting plate and the shielding box both include aluminum metal or aluminum alloy.

[0006] In one possible implementation, the heat sink fins include aluminum metal or aluminum alloy.

[0007] In one possible implementation manner, the box body includes a bottom plate and side plates respectively arranged on both sides of the bottom plate, and the chassis shell also includes: The end plate, the box cover is used to cover the box body, the end plate is arranged at one end opening of the box body, and the heat dissipation fins are arranged at the other end opening of the box body.

[0008] In one possible implementation, the heat-conducting mounting plate is provided with: Component fixing holes are used to install components, a portion of the component fixing holes are located inside the shielding chamber, and another portion of the component fixing holes are located outside the shielding chamber.

[0009] In one possible implementation, the heat-conducting mounting plate is provided with: A first fixing hole, wherein the heat-conducting mounting plate and the box body are connected via a first bolt passing through the first fixing hole.

[0010] In one possible implementation manner, the shielding box comprises a box body and a box cover, wherein the box cover is used to cover the box body, and the shielding chamber is formed by enclosing the box body and the box cover.

[0011] In one possible implementation, the shielding box further includes: an adapter plate, the adapter plate being arranged in the shielding box and having a height difference with the bottom of the shielding box, the adapter plate and the bottom of the shielding box both being used for mounting components; and / or, A fixing bracket, through which the box body is connected to the heat-conducting mounting plate.

[0012] In one embodiment, the box body is provided with: A second fixing hole, wherein the shielding box and the box body are connected by a second bolt passing through the second fixing hole; and / or, The components in the shielding box are electrically connected to the components outside the shielding box through the cables passing through the wire holes.

[0013] In one possible implementation, the electromagnetic shielding heat dissipation chassis further includes: A hard disk bracket comprises a first bracket and a second bracket, wherein the first bracket is arranged on the heat-conducting mounting plate, and the second bracket is arranged on the box body, and the first bracket and the second bracket are adapted to be used for installing the hard disk.

[0014] Beneficial technical effects of the present invention: According to the contents of the present disclosure, the electromagnetic shielding and heat dissipation chassis includes a detachable chassis shell, which is convenient for installation and maintenance. The heat of the components is conducted to the chassis shell by mounting the components on a thermally conductive mounting plate with a higher thermal conductivity coefficient. The key components and components prone to heat are placed in an aluminum shielding box, which has higher electromagnetic shielding. The shielding box is in contact with the thermally conductive mounting plate to conduct the heat in the shielding box. Non-key components and components prone to heat are placed outside the shielding box. The chassis shell with a heat dissipation hole-free structure and heat dissipation fins can ensure good electromagnetic shielding and heat dissipation efficiency, reduce dust and other impurities from entering the chassis shell to damage components, and the layout inside the chassis shell is simpler and more compact, and the space utilization is more reasonable, thereby reducing the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In the accompanying drawings, the following are given by way of example and not limitation: Figure 1 The overall structure of the present invention is shown in the expanded schematic diagram; Figure 2 The overall structure schematic diagram of the present invention is shown (the box cover is not shown); Figure 3 A schematic diagram of the structure of a heat-conducting mounting plate is shown; Figure 4 A schematic structural diagram of a shielding box is shown; Figure 5 A structural schematic diagram of a hard disk bracket is shown.

[0016] In the figure: 1. Chassis shell; 2. Heat conduction mounting plate; 3. Shielding box; 4. Hard disk bracket; 11. Box body; 12. Box cover; 13. End plate; 14. Heat dissipation fins; 15. Mounting ears; 21. Component fixing holes; 22. First fixing holes; 23. Grounding holes; 31. Box body; 32. Box cover; 33. Adapter plate; 34. Fixing bracket; 35. Second fixing hole; 36. Threading hole; 41. First bracket; 42. Second bracket. DETAILED DESCRIPTION

[0017] In the following detailed disclosure, these embodiments are fully described with reference to the accompanying drawings. In order to make the technical scheme of the present invention more clear and specific to those skilled in the art, the implementation methods described below are not limited to this. The present invention is further described in detail below in conjunction with the embodiments and the accompanying drawings.

[0018] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “front” and “back” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0020] The present invention provides an electromagnetic shielding heat dissipation chassis, such as Figure 1-Figure 5 As shown, it includes a chassis shell 1, a heat-conducting mounting plate 2 and a shielding box 3. The chassis shell 1 includes a detachably connected box body 11, a box cover 12 and heat dissipation fins 14. The box body 11 and the box cover 12 are enclosed to form a structure without heat dissipation holes with an opening. The heat dissipation fins 14 are arranged at the opening to dissipate the heat in the chassis shell 1; the heat-conducting mounting plate 2 is arranged in the chassis shell 1 for installing components, and the heat-conducting mounting plate 2 is in contact with the inner wall of the chassis shell 1 for transferring the heat of the components to the chassis shell 1; the shielding box 3 is arranged on the heat-conducting mounting plate 2, and a shielding chamber for shielding electromagnetics is provided in the shielding box 3, and a part of the components are located in the shielding chamber.

[0021] The electromagnetic shielding and heat dissipation chassis provided in this embodiment includes a detachable chassis shell 1, which includes a box body 11 and a box cover 12. The box cover 12 is used to cover the box body 11. The chassis shell 1 can be made of materials such as cold-rolled steel plates, galvanized iron plates and aluminum alloys. Compared with the one-piece aluminum chassis, the modular splicing design simplifies the manufacturing process, has lower processing difficulty and lower cost, and can easily access the interior of the chassis when needed to install, upgrade or maintain components. At the same time, it can be suitable for rack-mounted equipment of different sizes.

[0022] Among them, the chassis shell 1 and the case cover 12 can be quickly assembled and disassembled through connecting structures such as screws and snaps, which reduces the complexity of installation, improves work efficiency, has higher safety and reliability, and is easy to clean the inside of the chassis shell 1, helping to maintain the best working condition of the equipment.

[0023] Among them, there are no heat dissipation holes on the chassis shell 1, which effectively prevents external dust from entering the interior of the chassis, thereby protecting the internal components from dust pollution and potential damage. It is suitable for the nuclear industry's environment with high dust prevention requirements. The chassis shell 1 with no heat dissipation holes and the heat dissipation fins 14 can ensure good electromagnetic shielding and heat dissipation efficiency.

[0024] The electromagnetic shielding heat dissipation chassis provided in this embodiment conducts the heat of the components to the chassis shell 1 by mounting the components on a thermally conductive mounting plate 2 with a relatively high thermal conductivity in contact with the chassis shell 1. Preferably, a metal plate or a metal alloy plate with a thermal conductivity of more than 150 kcal / mh°C is used as the manufacturing material of the thermally conductive mounting plate 2. The good thermal conductivity of the thermally conductive mounting plate 2 is utilized to quickly transfer the heat generated by the components to the chassis shell 1, thereby achieving efficient heat dissipation.

[0025] The heat-conducting mounting plate 2 includes aluminum metal or aluminum alloy, which has high thermal conductivity and can quickly transfer heat from components to the heat-conducting mounting plate 2 and further transfer and disperse it to the entire chassis shell 1.

[0026] Components should fit tightly on the thermally conductive mounting plate 2 to reduce thermal resistance and improve heat transfer efficiency. Thermally conductive fillers can be used to fill the tiny gap between the component housing and the thermally conductive mounting plate 2 to further enhance the thermal conductivity effect.

[0027] The electromagnetic shielding heat dissipation chassis provided in this embodiment places key components and heat-prone components in an aluminum shielding box 3. The shielding box 3 has high electromagnetic shielding, can effectively absorb and offset the interference of electromagnetic waves, and provide high electromagnetic shielding function for the components in the shielding box 3, thereby ensuring the normal operation and reliability of the components.

[0028] Among them, aluminum metal or aluminum alloy has higher electrical conductivity and magnetic permeability. When electromagnetic waves encounter the aluminum shielding layer, most of them will be reflected back, and very small part will penetrate or be absorbed. Through reflection and absorption, a protective layer that can shield electromagnetic wave interference is formed, which can effectively absorb and offset the interference of electromagnetic waves.

[0029] The electromagnetic shielding heat dissipation chassis provided in this embodiment contacts the heat dissipation mounting base plate through the shielding box 3, thereby conducting heat out of the shielding box 3 and improving the heat dissipation effect of components that need to be electromagnetically shielded.

[0030] Among them, the shielding box 3 includes aluminum metal or aluminum alloy, which has high thermal conductivity and can quickly transfer heat from the components to the shielding box 3, then to the thermal mounting plate 2, and further transfer and disperse it to the entire chassis shell 1, thereby quickly reducing the operating temperature of key components and heat-prone components.

[0031] The electromagnetic shielding and heat dissipation chassis provided in this embodiment places key components and heat-prone components in an aluminum shielding box 3, and non-key components and heat-prone components outside the shielding box 3. Under the premise of ensuring good electromagnetic shielding and heat dissipation efficiency, it can make the layout inside the chassis shell 1 simpler and more compact, and the space utilization more reasonable, thereby reducing the occupied space.

[0032] Among them, non-critical components and components that are not easy to heat up are placed outside the shielding box 3, which makes better use of the limited space inside the chassis shell 1. This layout avoids the crowded placement of all components inside the shielding box 3, thereby improving the space utilization efficiency. By distinguishing between critical and non-critical, and components that are easy to heat up and components that are not easy to heat up, and performing electromagnetic shielding and heat dissipation layout accordingly, the internal structure of the chassis can be made clearer and more orderly, simplifying the design and assembly process, and facilitating subsequent maintenance and upgrades.

[0033] Among them, although non-critical components and components that are not easy to heat are placed outside the shielding box 3, the critical components are still effectively protected in the chassis shell 1, and on the side with the heat-conducting mounting plate 2 and the heat dissipation fins 14, and non-critical components and components that are not easy to heat can also be protected to a certain extent. The critical components and components that are easy to heat are placed in the shielding box 3, and the excellent thermal conductivity of aluminum metal is used for heat dissipation. The components that are not easy to heat are placed outside the shielding box 3, which will not cause additional burden on the heat dissipation system in the shielding box 3, and the overall heat dissipation efficiency is guaranteed.

[0034] In one possible implementation, Figure 1 and Figure 2 As shown, the chassis shell 1 includes heat dissipation fins 14 with a fin structure made of aluminum metal or aluminum alloy. The heat dissipation fins 14 are mainly used to effectively conduct heat inside the chassis shell 1. The heat dissipation fins 14 are usually made of aluminum metal or aluminum alloy, have excellent thermal conductivity and relatively light weight, and can ensure that heat is quickly transferred from the heat source to the heat dissipation fins 14, and then the large area of ​​the fins is in contact with the air to achieve effective heat dissipation, which greatly reduces the temperature inside the chassis, ensures the normal operation of the equipment, and extends the service life of the equipment.

[0035] In one possible implementation, Figure 1 and Figure 2 As shown, the box body 11 includes a bottom plate and side plates respectively arranged on both sides of the bottom plate, the chassis shell 1 also includes an end plate 13, and the box cover 12 is used to cover the box body 11. The end plate 13 is arranged at an opening at one end of the box body 11, and the heat dissipation fins 14 are arranged at the other end of the box body 11.

[0036] Among them, the box body 11 includes a bottom plate and side plates respectively arranged on both sides of the bottom plate, which provides a stable basic structure and is also conducive to the installation and fixation of internal components. The box body 11 and the box cover 12 adopt an upper and lower split structure, which is convenient for the box cover 12 to be separated from the box body 11, simplifying the installation and disassembly process, facilitating maintenance, upgrading or replacement of components, and helping to reduce the complexity of the manufacturing process and reduce production costs. The end plate 13 and the heat dissipation fins 14 are respectively arranged at both ends, which enhances the stability of the overall structure. At the same time, the end plate 13 can also be used as a platform for connecting or fixing other components. Other components, such as cables, power supplies, boards, external interfaces, etc., are fixed through the mounting holes on the end plate 13. The heat dissipation fins 14 are located at the end away from the end plate 13 for heat dissipation. Since heat will flow from the high temperature part to the low temperature part, the fins are in contact with the air for heat dissipation, which helps to keep the internal temperature of the chassis stable.

[0037] In one possible implementation, Figure 3 As shown, the heat-conducting mounting plate 2 is provided with component fixing holes 21, which are used to install components. A part of the component fixing holes 21 is located inside the shielding chamber, and another part of the component fixing holes 21 is located outside the shielding chamber.

[0038] Among them, the thermally conductive mounting plate 2 is an important part of the internal heat dissipation structure of the chassis. Its main function is to quickly conduct the heat generated by the components to the chassis shell 1 or the heat dissipation fins 14. The thermally conductive mounting plate 2 is usually provided with a plurality of component fixing holes 21 for installing and fixing components. The component fixing holes 21 can ensure the stable installation of the components on the thermally conductive mounting plate 2, prevent the displacement or damage of the components caused by vibration or impact, ensure the normal operation of the equipment, and extend the service life of the equipment. At the same time, by tightly fixing the components on the thermally conductive mounting plate 2, the thermal resistance between the components and the mounting plate is reduced, thereby optimizing the heat dissipation path, so that the heat generated by the components can be transferred to the thermally conductive mounting plate 2 more quickly, and then effectively dissipated to the external environment.

[0039] The layout of the component fixing holes 21 needs to be reasonably designed according to the size and installation requirements of the components to ensure that the components can be installed smoothly and maintain a good heat dissipation effect.

[0040] In one possible implementation, Figure 3 As shown, a first fixing hole 22 is provided on the heat-conducting mounting plate 2 , and the heat-conducting mounting plate 2 is connected to the box body 11 via a first bolt passing through the first fixing hole 22 .

[0041] Among them, a plurality of first fixing holes 22 are opened on the heat-conducting mounting plate 2, and the first fixing holes 22 on the heat-conducting mounting plate 2 are accurately aligned with the corresponding holes on the box body 11, and the first bolts pass through the corresponding holes to achieve a firm connection between the heat-conducting mounting plate 2 and the box body 11. By tightening the first bolts, the heat-conducting mounting plate 2 is connected to the box body 11, thereby achieving a firm connection between the two, making installation and disassembly more convenient, and ensuring that the heat-conducting mounting plate 2 will not shift or loosen during operation, thereby ensuring the stability and reliability of the entire heat dissipation system.

[0042] In one possible implementation, Figure 3 As shown, for the sake of equipment safety and electrostatic discharge, a ground wire hole can also be provided on the thermally conductive mounting plate 2. During the operation of the electronic equipment, the accumulation of static electricity may cause damage to the components. By adding a ground wire hole and using a ground wire to connect the thermally conductive mounting plate 2 to the grounding system or the earth of the equipment, it is helpful to release the static electricity in time and prevent it from posing a potential threat to the equipment, thereby ensuring the safe operation of the equipment. It can not only protect the equipment itself, but also protect the safety of the operator to a certain extent and prevent electric shock accidents caused by equipment leakage.

[0043] In one possible implementation, Figure 4 As shown, the shielding box 3 includes a box body 31 and a box cover 32 . The box cover 32 is used to cover the box body 31 . The shielding chamber is formed by the box body 31 and the box cover 32 .

[0044] The box body 31 and the box cover 32 are made of materials with good electrical conductivity, such as metal or metal alloy, to ensure effective electromagnetic shielding. The box body 31, as the basic structure of the shielding box 3, provides the main support and protection for the internal components, and has sufficient rigidity and strength to withstand various stresses in the external environment and during operation. The box cover 32 is used to cover the box body 31, and is closely matched with the box body 31 to form a closed shielding chamber, which can effectively isolate electromagnetic radiation and prevent electromagnetic interference to the components in the shielding box 3.

[0045] In one possible implementation, Figure 4 As shown, the shielding box 3 further includes an adapter plate 33, which is disposed in the shielding box 3 and has a height difference with the bottom of the shielding box 3. The adapter plate 33 and the bottom of the shielding box 3 are both used for installing components.

[0046] Among them, the adapter plate 33 is used as an intermediary to connect components of different specifications and sizes. The height difference between the adapter plate 33 and the bottom of the shielding box 3 leaves space for installing components of different sizes, increasing the flexibility of the structure and being able to install more or larger components in a limited space.

[0047] Among them, the key control card board module can be fixed to the bottom of the shielding box 3, and the boards of different specifications and sizes inside the shielding box 3 are stacked through the adapter plate 33, which can achieve high-density installation and effectively utilize the vertical space.

[0048] In one possible implementation, Figure 4 As shown, the shielding box 3 further includes a fixing bracket 34 , and the box body 11 is connected to the heat-conducting mounting plate 2 via the fixing bracket 34 .

[0049] Among them, the shielding box 3 is connected to the heat-conducting mounting plate 2 through the fixed brackets 34 on both sides, ensuring the stability of the entire structure. This design can effectively prevent the shielding box 3 from shaking or shifting during the operation of the equipment, thereby maintaining the safe operation and normal operation of internal components.

[0050] The fixing bracket 34 may be L-shaped and fixed to the heat-conducting mounting plate 2 through holes reserved on the fixing bracket 34 .

[0051] In one possible implementation, Figure 4 As shown, a second fixing hole 35 is provided on the box body 31 , and the shielding box 3 is connected to the box body 11 via a second bolt passing through the second fixing hole 35 .

[0052] Among them, a plurality of second fixing holes 35 are opened on the box body 31, and the second fixing holes 35 on the box body 31 are accurately aligned with the corresponding holes on the box body 11. The second bolts pass through the corresponding holes to realize a firm connection between the box body 31 and the box body 11. By tightening the second bolts, the shielding box 3 is connected to the box body 11, thereby realizing a firm connection between the two, making installation and disassembly more convenient, and ensuring that the shielding box 3 will not shift or loosen during operation, thereby ensuring the stability and reliability of the entire heat dissipation system.

[0053] In one possible implementation, Figure 4 As shown, a threading hole 36 is provided on the box body 31 , and the components in the shielding box 3 are electrically connected to the components outside the shielding box 3 through cables passing through the threading hole 36 .

[0054] Among them, the wire hole 36 is opened on the shielding box 3. It is necessary to ensure that while allowing the cable to pass through, the impact on the overall electromagnetic shielding performance of the shielding box 3 is minimized. There is preferably a small gap between the wire hole 36 and the cable. The cable outlet part can use a rubber plug to fill the gap between the cable and the shielding box 3, and a shielding clamp can be installed behind the wire hole 36 through which the cable passes.

[0055] It is understandable that multiple wire holes 36 can be set at different positions to support complex wiring fields. Reasonable layout of wire holes 36 helps to achieve good cable management, reduce crossing and confusion between cables, and thus improve the reliability and maintainability of the equipment.

[0056] In one possible implementation, Figure 1 , Figure 2 and Figure 5 As shown, the electromagnetic shielding heat dissipation chassis also includes a hard disk bracket 4, which includes a first bracket 41 and a second bracket 42. The first bracket 41 is arranged on the heat-conducting mounting plate 2, and the second bracket 42 is arranged on the box body 11. The first bracket 41 and the second bracket 42 are adapted to be used for installing the hard disk.

[0057] Among them, the first bracket 41 is longitudinally installed on the heat-conducting mounting plate 2, and its function is to lock one side of the hard disk. The second bracket 42 is transversely installed on the end plate 13 of the chassis shell 1, and its function is to lock the other side of the hard disk, ensuring a close connection between the hard disk and the heat-conducting mounting plate 2, preventing the hard disk from loosening or shifting during the operation of the equipment, and improving the installation stability of the hard disk. The hard disk is supported in the middle and upper part of the chassis by the hard disk bracket 4, so that the entire chassis has a double-layer structure, making the chassis structure more compact.

[0058] The first bracket 41 and the second bracket 42 are made of aluminum metal or aluminum alloy, which can effectively conduct the heat generated by the hard disk during operation to the heat-conducting mounting plate 2 and the chassis shell 1, thereby ensuring that the hard disk operates within a suitable temperature range.

[0059] The specific installation steps of the electromagnetic shielding heat dissipation chassis provided in this embodiment are as follows: S1. Align the several evenly distributed first fixing holes 22 provided on the heat-conducting mounting plate 2 with the corresponding holes on the box body 11, tighten the first screw from the bottom surface of the box body 11 to connect the heat-conducting mounting plate 2 and the box body 11 as a whole, fix the end plate 13 and the heat dissipation fins 14 to the assembled part of the box body 11 with screws through the screw holes densely provided on the side and bottom surfaces, and fix the left and right hanging ears 15 of the chassis to the parts assembled in the second step with screws; S2, fix two fixing brackets 34 to the front and rear sides of the box body 31 with screws, fix the key control board module in the box body 31, stack the boards of different specifications and sizes inside through the adapter board, complete the wiring between the boards, and assemble the inlet and outlet cable heads through the threading holes 36 on the box body 31, lock the box cover 32 to the top of the box body 31, and fix the shielding box 3 to the heat-conducting mounting plate 2 through the reserved holes on the fixing brackets 34; S3. Lock the first bracket 41 and the second bracket 42 to the holes on both sides of the hard disk respectively, and fix other component modules through the holes reserved on the thermal mounting plate 2 or the end plate 13. Fix the hard disk to the end plate 13 and the thermal mounting plate 2 through the holes of the first bracket 41 and the second bracket 42 respectively, insert the front folded edge of the box cover 12 into the top flange of the heat sink fin 14, and then lock the fixing screws on both sides and the rear to complete the installation.

[0060] The electromagnetic shielding heat dissipation chassis provided in this embodiment adopts aluminum alloy as the thermal conductive mounting plate 2. The aluminum alloy material has high strength and good thermal conductivity. It can quickly conduct the heat generated by the module close to the mounting surface of the mounting base to the entire mounting base. The heat generated by the hard disk can also be quickly conducted to the thermal conductive mounting plate 2 and the end plate 13 through the aluminum alloy fixing bracket 34; and there are densely distributed screw holes between the end plate 13, the heat dissipation fins 14, and the case cover 12. The several plates are tightly connected together, and the heat generated by the internal module can be quickly conducted to the entire chassis shell 1, and the conduction heat dissipation effect is good; in addition, the densely distributed fin structure forms another end plate 13 opposite to the end plate 13, which can effectively increase the heat dissipation area, improve the air heat exchange efficiency, and thus improve the heat dissipation effect.

[0061] The chassis shell 1 adopts a design without ventilation holes. There is no direct gap at the module joints. Densely distributed screw holes are also used for connection. Rubber plugs are used at the cable outlet to fill the gap between the cable and the shell, which has a good dust-proof effect. For the key internal control module part, a metal shielding box 3 with good conductivity is designed to strengthen the shielding protection and effectively isolate the internal and external electromagnetic environments.

[0062] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

[0064] In view of the above detailed description, these and other changes can be made to these embodiments, and this written description includes the best mode embodiments to disclose the present invention. The scope of the patent obtained by the present invention is defined by the claims, which are not limited by the present disclosure, and the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field within the scope disclosed by the present invention, according to the technical solution and its conception of the present invention, is equivalent to or changes, and all are within the protection scope of the present invention.

Claims

1. An electromagnetic shielding heat dissipation chassis, characterized in that: include: A case shell (1), the case shell (1) comprising a detachably connected case body (11), a case cover (12) and heat dissipation fins (14), the case body (11) and the case cover (12) enclosing to form a structure without heat dissipation holes having an opening, the heat dissipation fins (14) being arranged at the opening to dissipate heat from the case shell (1); A heat-conducting mounting plate (2), the heat-conducting mounting plate (2) being arranged inside the chassis shell (1) for mounting components, the heat-conducting mounting plate (2) being in contact with an inner wall of the chassis shell (1) for transferring heat from the components to the chassis shell (1); A shielding box (3), the shielding box (3) being arranged on the heat-conducting mounting plate (2), the shielding box (3) being provided with a shielding chamber for electromagnetic shielding, and a part of components being located in the shielding chamber.

2. The electromagnetic shielding heat dissipation chassis according to claim 1, characterized in that: The heat-conducting mounting plate (2) and the shielding box (3) both comprise aluminum metal or aluminum alloy.

3. The electromagnetic shielding heat dissipation chassis according to claim 1, characterized in that: The heat dissipation fins (14) include aluminum metal or aluminum alloy.

4. The electromagnetic shielding heat dissipation chassis according to claim 3, characterized in that: The box body (11) comprises a bottom plate and side plates respectively arranged on both sides of the bottom plate, and the chassis shell (1) further comprises: The end plate (13) is used to cover the box body (11), the end plate (13) is arranged at one end opening of the box body (11), and the heat dissipation fins (14) are arranged at the other end opening of the box body (11).

5. The electromagnetic shielding heat dissipation chassis according to claim 1, characterized in that: The heat-conducting mounting plate (2) is provided with: A component fixing hole (21), the component fixing hole (21) is used to install components, a portion of the component fixing hole (21) is located inside the shielding chamber, and another portion of the component fixing hole (21) is located outside the shielding chamber.

6. The electromagnetic shielding heat dissipation chassis according to claim 1 or 5, characterized in that: The heat-conducting mounting plate (2) is provided with: A first fixing hole (22), wherein the heat-conducting mounting plate (2) and the box body (11) are connected via a first bolt passing through the first fixing hole (22).

7. The electromagnetic shielding heat dissipation chassis according to claim 2, characterized in that: The shielding box (3) comprises a box body (31) and a box cover (32); the box cover (32) is used to cover the box body (31); and the shielding chamber is formed by enclosing the box body (31) and the box cover (32).

8. The electromagnetic shielding heat dissipation chassis according to claim 7, characterized in that: The shielding box (3) further comprises: an adapter plate (33), the adapter plate (33) being arranged in the shielding box (3) and having a height difference with the bottom of the shielding box (3), the adapter plate (33) and the bottom of the shielding box (3) both being used for mounting components; and / or, A fixing bracket (34), wherein the box body (11) is connected to the heat-conducting mounting plate (2) via the fixing bracket (34).

9. The electromagnetic shielding heat dissipation chassis according to claim 7 or 8, characterized in that: The box body (31) is provided with: A second fixing hole (35), the shielding box (3) and the box body (11) are connected via a second bolt passing through the second fixing hole (35); and / or, A wire threading hole (36), wherein the components in the shielding box (3) are electrically connected to the components outside the shielding box (3) via a cable passing through the wire threading hole (36).

10. The electromagnetic shielding heat dissipation chassis according to claim 1, characterized in that: The electromagnetic shielding heat dissipation chassis also includes: A hard disk bracket (4), the hard disk bracket (4) comprising a first bracket (41) and a second bracket (42), the first bracket (41) being arranged on the heat-conducting mounting plate, the second bracket (42) being arranged on the box body (11), the first bracket (41) and the second bracket (42) being adapted to be used for mounting a hard disk.

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