Sunlight-like lamp bead packaging structure and packaging method thereof

Abstract

The invention relates to the technical field of LED illumination, in particular to a sunlight-like lamp bead packaging structure and a packaging method thereof. The packaging structure is prepared by the packaging method. The packaging method comprises the following steps: spin-coating first glue in a lamp bead bracket to form a first glue layer; carrying out die bonding on a single crystal multi-wavelength LED chip on the first glue layer; the number of peak waves of the single crystal multi-wavelength LED chip is at least two; connecting the single-crystal multi-wavelength LED chip with an external power supply by adopting a lead wire; uniformly mixing fluorescent powder and second glue according to a required mass ratio to form a powder blending system, and spin-coating the powder blending system into the lamp bead bracket to obtain a prefabricated product; and baking the prefabricated product, testing to be qualified, and braiding to obtain the sunlight-like lamp bead packaging structure. According to the invention, the problems of discontinuous spectrum, poor color rendering property and large blue light harm in the prior art can be solved, and the requirement of healthy illumination is met.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lighting, and in particular to a solar light bead packaging structure and a packaging method thereof. Background Art

[0002] As the quality of life continues to improve, the light quality of indoor and outdoor lighting is becoming more and more important. At present, the industry's method of obtaining light quality is mostly to use a single-peak blue LED to excite phosphors to obtain white light. This method has the advantages of low cost and mature technology, but it brings problems such as discontinuous spectrum, poor color rendering, and high blue light hazards, which cannot meet the needs of healthy lighting.

[0003] In summary, it is necessary to provide a solar lamp bead packaging structure and a packaging method thereof to solve the problems of spectrum discontinuity, poor color rendering and severe blue light hazards existing in the prior art. Summary of the invention

[0004] The object of the present invention is to provide a solar light bead packaging structure and a packaging method thereof, and the specific technical scheme is as follows:

[0005] In a first aspect, the present invention provides a packaging method of a solar lamp bead packaging structure, comprising:

[0006] Step S1, spin-coating a first glue in a lamp bead bracket to form a first glue layer; solidifying a single crystal multi-wavelength LED chip on the first glue layer; the number of peak waves of the single crystal multi-wavelength LED chip is at least two;

[0007] Step S2, connecting the single crystal multi-wavelength LED chip to an external power source using leads;

[0008] Step S3, mixing the fluorescent powder and the second glue in a required mass ratio to form a powder system, and spin-coating the system into the lamp bead bracket to obtain a preformed product;

[0009] Step S4, baking the preformed product, testing it to be qualified and weaving it into tape to obtain a solar lamp bead packaging structure.

[0010] Optionally, the number of peak waves of the single-crystal multi-wavelength LED chip is at most five.

[0011] Optionally, the number of the single-crystal multi-wavelength LED chips is at most thirty.

[0012] Optionally, when there are multiple single-crystal multi-wavelength LED chips, the difference in peak wavelengths between each two adjacent single-crystal multi-wavelength LED chips is greater than or equal to 2nm; and a gap is set between each two adjacent single-crystal multi-wavelength LED chips.

[0013] Optionally, the number of the first glue layers is the same as the number of the single-crystal multi-wavelength LED chips, and the two are arranged in a one-to-one correspondence; each of the single-crystal multi-wavelength LED chips is fixed to the inner wall of the lamp bead bracket through the corresponding first glue layer;

[0014] The lead wires are used to connect all the single-crystal multi-wavelength LED chips in series or in parallel, or to connect a part of them in series and another part in parallel to an external power supply; when parallel connection is adopted, a powder distribution system with the same color temperature or a powder distribution system with different color temperatures is respectively used for different single-crystal multi-wavelength LED chips in parallel.

[0015] Optionally, the lamp bead bracket includes an SMD bracket, a ceramic bracket or a PCB bracket.

[0016] Optionally, the color temperature range of the powder mixing system is 2000-6500K.

[0017] If the color temperature of the powder system is around 3000K, the mass ratio formula used is as follows:

[0018]

[0019] If the color temperature of the powder system is around 5700K, the mass ratio formula used is as follows:

[0020]

[0021] Optionally, the peak wavelengths of the single-crystal multi-wavelength LED chip include 437nm, 447nm and 464nm.

[0022] Optionally, the peak wavelengths of the single-crystal multi-wavelength LED chip include 439 nm, 449 nm and 467 nm.

[0023] In a second aspect, the present invention provides a solar-light lamp bead packaging structure, which is prepared by using the packaging method of the solar-light lamp bead packaging structure.

[0024] The application of the technical solution of the present invention has at least the following beneficial effects:

[0025] The present invention provides a kind of sunlight lamp bead packaging structure and its packaging method, which can solve the problems of spectral discontinuity, poor color rendering and great blue light hazard existing in the prior art, and meet the needs of healthy lighting. Specifically, the present invention adopts a single-crystal multi-wavelength LED chip with at least two peak waves, which can emit different peak waves and appropriately widen the peak wave width, so that the prepared sunlight lamp bead packaging structure can achieve spectral continuity, and the fitting degree with the sunlight spectrum in 420-710nm is greater than 0.98; the color rendering index Ra is greater than 95, and the special color rendering index (i.e., R1 to R15) is greater than 90, showing excellent color rendering; wherein, the relative intensity of the spectrum in the band of 400-480nm is less than 0.6, which can ensure that the blue light hazard is low. In addition, the packaging method of the sunlight lamp bead packaging structure provided by the present invention can mass-produce the sunlight lamp bead packaging structure, which has strong practicality.

[0026] In addition to the above-described purposes, features and advantages, the present invention has other purposes, features and advantages. The present invention will be further described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0028] Figure 1 This is a schematic structural diagram of a solar lamp bead packaging structure in Embodiment 1 of the present invention;

[0029] Figure 2 is a blue light spectrum diagram of two single crystal multi-wavelength LED chips in Example 1;

[0030] Figure 3 This is a spectrum diagram of the solar-like lamp bead packaging structure prepared in Example 1 at a color temperature of 5700K;

[0031] Figure 4 This is a spectrum diagram of the solar-like lamp bead packaging structure prepared in Example 2 at a color temperature of 3000K;

[0032] Figure 5 This is a spectrum diagram of the solar-like lamp bead packaging structure prepared in Example 2 at a color temperature of 5700K;

[0033] Figure 6 This is a spectrum diagram of the solar-like lamp bead packaging structure prepared in Example 2 at a color temperature of 4000K;

[0034] Figure 7 This is a blue light spectrum diagram of the LED blue light chip in Comparative Example 1;

[0035] Figure 8 This is a spectrum diagram of the solar-like lamp bead packaging structure prepared in Comparative Example 1 at a color temperature of 5700K;

[0036] Among them, 1. single crystal multi-wavelength LED chip, 2. lamp bead bracket, 3. first glue layer, 4. lead wire, 5. second glue, 6. phosphor;

[0037] exist Figure 3-Figure 6 and Figure 8 Among them, the wavelength of purple light is about 380-440 nanometers; the wavelength of blue light is about 440-485 nanometers; the wavelength of cyan light is about 485-500 nanometers; the wavelength of green light is about 500-565 nanometers; the wavelength of yellow light is about 565-590 nanometers; the wavelength of orange light is about 590-625 nanometers; and the wavelength of red light is about 625-780 nanometers. DETAILED DESCRIPTION

[0038] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.

[0039] Embodiment 1:

[0040] See also Figure 1 , a packaging method of a solar lamp bead packaging structure, comprising:

[0041] Step S1, spin-coat the first glue (specifically, the crystal-fixing glue DX-20C glue) in the lamp bead bracket 2 (specifically, the SMD2835 bracket) to form two first glue layers 3; respectively, fix two single-crystal multi-wavelength LED chips 1 on the two first glue layers 3; set a gap between each two adjacent single-crystal multi-wavelength LED chips 1, which is conducive to better wavelength continuity after packaging; the number of peak waves of the single-crystal multi-wavelength LED chips 1 is three, among which, a single-crystal multi-wavelength LED chip 1 (referred to as chip A, see Figure 2 ) have peak wavelengths of 437nm, 447nm and 464nm respectively, and another single crystal multi-wavelength LED chip 1 (denoted as chip B, see Figure 2 ) have peak wavelengths of 439, 449 and 467 nm respectively;

[0042] Step S2, connecting the two single-crystal multi-wavelength LED chips 1 in series with an external power source using a lead 4;

[0043] Step S3, mixing the fluorescent powder 6 and the second glue 5 (specifically OE6551A glue and OE6551B glue) according to the required mass ratio shown in Table 1 to form a powder system, and spin-coating it into the lamp bead bracket 2 to obtain a preformed product; wherein the color temperature of the powder system is 5700K;

[0044] Table 1 The mass ratio formula of phosphor and second glue at 5700K color temperature

[0045]

[0046] Step S4, the preform is baked (conventional baking), tested to be qualified (conventional testing) and braided (conventional braiding) to obtain a solar lamp bead packaging structure.

[0047] Embodiment 2:

[0048] Different from Example 1, in step S2, the two single-crystal multi-wavelength LED chips 1 are connected in parallel to the external power supply by using leads 4; in step S3, the first powder system and the second powder system are respectively prepared; wherein, the first powder system is a powder system formed by mixing the phosphor 6 and the second glue 5 according to the required mass ratio as shown in Table 2, and is spin-coated onto a single-crystal multi-wavelength LED chip 1 in the lamp bead bracket 2; the second powder system is a powder system formed by mixing the phosphor 6 and the second glue 5 according to the required mass ratio (same as Example 1), and is spin-coated onto another single-crystal multi-wavelength LED chip 1 in the lamp bead bracket 2; the color temperature of the first powder system is 3000K; the color temperature of the second powder system is 5700K. When a single crystal multi-wavelength LED chip 1 under the first powder system is lit alone, its color temperature is 3000K; when a single crystal multi-wavelength LED chip 1 under the second powder system is lit alone, its color temperature is 5700K; when two of the single crystal multi-wavelength LED chips 1 are lit at the same time, the mixed light of the first powder system and the second powder system can produce a color temperature of 4000K.

[0049] Table 2 Phosphor mass ratio formula at 3000K color temperature

[0050]

[0051] Comparative Example 1 (manufacturing scheme of traditional solar lamp bead packaging structure):

[0052] The difference from Example 1 is that in step S1, the two single-crystal multi-wavelength LED chips 1 are replaced with two LED blue light chips with only a single peak and a peak wavelength of 445 nm, see Figure 7 .

[0053] The chip spectrum performance of various types of solar lamp bead packaging structures prepared in Examples 1-2 and Comparative Example 1 was tested respectively (the testing method was the integrating sphere method), and the test results are shown in Table 3. Among them, the spectrum fitting degree in Table 3 is the fitting degree of the solar lamp bead packaging structure and the sunlight spectrum in the 420-710nm band.

[0054] Table 3 Test results of chip spectral performance

[0055]

[0056] See Table 3 for data. Figure 3-Figure 6 and Figure 8 It is known that comparative example 1 uses two LED blue light chips with only a single peak and a peak wavelength of 445nm, which can only emit a single peak wave, and the peak wave width is relatively narrow, so that the prepared solar light lamp bead packaging structure has the problems of spectral discontinuity, poor color rendering and large blue light hazard; compared with comparative example 1, the present invention uses a single crystal multi-wavelength LED chip 1 with three peak waves in embodiments 1-2, and the difference in the peak wave wavelengths between two adjacent single crystal multi-wavelength LED chips 1 is greater than or equal to 2nm, which can emit different The peak wave can be appropriately widened, so that the prepared sunlight lamp bead packaging structure can achieve spectral continuity, and the degree of fit with the sunlight spectrum in 420-710nm is greater than 0.98; the color rendering index Ra is greater than 95, and the special color rendering index (i.e., R1 to R15) is greater than 90, showing excellent color rendering; among them, the sunlight lamp bead packaging structure prepared in Example 2 has a spectral relative intensity of less than 0.6 in the band of 400-480nm at a color temperature of 4000K, which can ensure that the blue light hazard is low.

[0057] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging method for a solar lamp bead packaging structure, characterized in that: include: Step S1, spin-coating a first glue in a lamp bead bracket (2) to form a first glue layer (3); solid-crystal-bonding a single-crystal multi-wavelength LED chip (1) on the first glue layer (3); the number of peak waves of the single-crystal multi-wavelength LED chip (1) is at least two; Step S2, connecting the single-crystal multi-wavelength LED chip (1) to an external power source using a lead wire (4); Step S3, mixing the fluorescent powder (6) and the second glue (5) in a required mass ratio to form a powder system, and spin-coating the system into the lamp bead bracket (2) to obtain a preformed product; Step S4, baking the preformed product, testing it to be qualified and weaving it into tape to obtain a solar lamp bead packaging structure.

2. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The number of peak waves of the single-crystal multi-wavelength LED chip (1) is at most five.

3. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The number of the single-crystal multi-wavelength LED chips (1) is at most thirty.

4. The packaging method of the solar-like lamp bead packaging structure according to claim 3, characterized in that: When the number of the single-crystal multi-wavelength LED chips (1) is plural, the difference in peak wavelengths between each two adjacent single-crystal multi-wavelength LED chips (1) is greater than or equal to 2 nm; and a gap is provided between each two adjacent single-crystal multi-wavelength LED chips (1).

5. The packaging method of the solar-like lamp bead packaging structure according to claim 4, characterized in that: The number of the first glue layers (3) is the same as the number of the single-crystal multi-wavelength LED chips (1), and the two are arranged in a one-to-one correspondence; each of the single-crystal multi-wavelength LED chips (1) is fixed to the inner wall of the lamp bead bracket (2) via the corresponding first glue layer (3); The lead wire (4) is used to connect all the single-crystal multi-wavelength LED chips (1) in series or in parallel, or to connect a part in series and another part in parallel to an external power supply; when parallel connection is adopted, a powder distribution system with the same color temperature or a powder distribution system with different color temperatures is respectively used for different single-crystal multi-wavelength LED chips (1) connected in parallel.

6. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The lamp bead bracket (2) comprises an SMD bracket, a ceramic bracket or a PCB bracket.

7. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The color temperature range of the powder mixing system is 2000-6500K.

8. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The peak wavelengths of the single-crystal multi-wavelength LED chip (1) include 437 nm, 447 nm and 464 nm.

9. The packaging method of the solar-like lamp bead packaging structure according to claim 1, characterized in that: The peak wavelengths of the single-crystal multi-wavelength LED chip (1) include 439 nm, 449 nm and 467 nm.

10. A solar lamp bead packaging structure, characterized in that: The solar lamp bead packaging structure is prepared by the packaging method of the solar lamp bead packaging structure as described in any one of claims 1 to 9.

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