Power electronic module and inverter with a power electronic module

Abstract

The invention relates to a power electronic module (LM), comprising: a first current terminal surface (AF1) in a first electrical contact plane (E1) of the module (LM); -a second current terminal surface (AF2) in a second electrical contact plane (E2) of the module (LM); -a plate-shaped first contact element (KE1), which is formed in one piece and has: a first contact section (K11), which is in contact with the first current terminal surface (AF1); a second contact section (K12) which is in contact with the second current terminal surface (AF2); and two connecting sections (V1), which each extend from a first contact section (K11) to a second contact section (K12) of the first contact element (KE1), a recess being provided in the first contact element (KE1) between the connecting sections (V1) of the first contact element (KE1), said recess forming a gap (R1) of the first contact element (KE1); and a first signal connection element (SV1) which is guided through the gap (R1) of the first contact element (KE1). The invention further relates to an inverter having a power electronics module (LM).

Description

Technical Field

[0001] The invention relates to a power electronics module for a converter, such as an inverter or a DC voltage converter, in particular for an electric drive of a motor vehicle. The invention also relates to an inverter, in particular for an electric drive of a motor vehicle. Background Art

[0002] Prior art and invention tasks

[0003] Converters such as inverters or DC voltage converters for converting a fed current of one current type (direct current, alternating current) into a current of another current type (alternating current, direct current) or for changing a characteristic parameter of the fed current, such as a voltage, are known and are used in particular in electric drives of motor vehicles. An essential component of the converters constitutes a power electronic module which performs the task of current / voltage conversion. In this case, the power electronic module usually constitutes a switchable half bridge of the converter.

[0004] As is common in all technical devices, there is also a general requirement for converters to be designed in a space-saving manner.

[0005] The object of the present application is therefore to provide a possibility for reducing the size of the power electronics modules and thus the converter for a converter with a constant or even higher power requirement. Summary of the invention

[0006] This object is achieved by the subject matter of the independent claim. Advantageous embodiments are the subject matter of the dependent claims.

[0007] According to a first aspect of the invention, a power electronics module is provided, in particular for a converter, such as an inverter or a DC voltage converter.

[0008] The power electronics module has a first current connection surface located in a first electrical contact plane of the module and a second current connection surface located in a second electrical contact plane of the module.

[0009] The power electronics module further comprises a first electrical contact element, which is formed in a plate-shaped, one-piece manner. The first contact element comprises: a first contact section, which is placed on the first current connection surface and is physically, for example electrically, in contact with or connected to the first current connection surface; and a second contact section, which is placed on the second current connection surface and is physically, for example electrically, in contact with or connected to the second current connection surface. In this case, the two contact sections are particularly formed opposite each other when viewed in the longitudinal direction of the first contact element.

[0010] The first contact element further comprises two (longitudinal) connecting sections, which extend (adjacently in the longitudinal direction of the first contact element, in particular parallel to one another) respectively from a first contact section of the first contact element to a second contact section and connect the two contact sections to one another in one piece similar to a connecting web (in particular on the right and left side of the respective contact section).

[0011] The first contact element further comprises a groove between the two connecting sections, which groove forms the gap of the first contact element. Here, the two contact sections and the two connecting sections of the first contact element at least partially, in particular almost completely, in particular completely surround the gap of the first contact element.

[0012] The power electronics module furthermore has a first signal connection element which is guided through a recess of the first contact element.

[0013] In this case, the first contact element is designed in one piece in the form of a plate. In this case, the expression "plate-shaped" means that the contact element is made of a hard electrically conductive material, such as a metal sheet, which has its own mechanical rigidity or strength and can therefore withstand certain mechanical stresses without a mechanical support. Accordingly, the first contact element is not a classic conductor track of a printed circuit board, which in fact has no own mechanical rigidity and is therefore dependent on the circuit board.

[0014] Since the first contact element can realize the current connection between the current terminal surfaces in two different contact planes (at different structural heights) of the power electronic module through its special shape with the contact section and the connecting section that connects the two contact sections to each other in one piece, and can also realize the signal connection between the signal terminal surfaces in two (other) different contact planes (at different structural heights) of the power electronic module through its gap, the current terminal surface or signal terminal surface of the power module can be implemented in a manner distributed to different structural heights of the power module. Accordingly, it can be avoided that the terminal surface and therefore also the components that conduct or guide signals must be installed on one plane. Thus, the complex wiring of these components using many joint connectors can be avoided. Here, the first contact element has replaced the first joint connection that would otherwise be required for the current connection between the current terminal surfaces. The remaining signal connection through the gap of the first contact element can be established using one or a few joint connectors. Due to the spatially protected position of the first contact element, the signal connection is also not easily affected by external interference. By reducing the number of joint connections with relatively high space requirements, although the current terminal surface / signal terminal surface (Strom- / ), the structure of the module can also be reduced in total in terms of structural height.

[0015] In comparison with modules having electrically conductive or signal-conducting components on one plane or current connection surfaces / signal connection surfaces on one contact plane, a compact design of the power module can thus be achieved on a small scale.

[0016] The galvanic connection via the first contact element and the signal connection through the gap at the first contact element can be implemented with a sufficient spatial distance and thus a sufficient insulation distance, which has a positive influence on the parasitic inductance in the case of a module.

[0017] The above solution enables the use of compact and efficient semiconductors, in particular silicon carbide semiconductors, such as silicon carbide MOSFETs, and thereby further miniaturizes the conductive components in the power electronic module and thus reduces the size of the power electronic module itself. Here, the first contact element can be directly contacted with the silicon carbide semiconductor and other conductive components, for example, by welding or sintering.

[0018] This provides a possibility of reducing the size of the power electronics module and thus the power converter, given a constant or even higher power requirement for the converter.

[0019] For example, the power electronic module further comprises a first signal terminal surface and a second signal terminal surface. The first signal terminal surface is in a first contact plane. The second signal terminal surface is in a third contact plane of the module. Here, the first contact plane, the second contact plane and the third contact plane of the module are at different structural heights of the module, wherein the second contact plane is between the first contact plane and the third contact plane. The first signal connection element electrically connects the first signal terminal surface to the second signal terminal surface.

[0020] Therefore, the first signal connection element bridges the height difference between the first contact plane and the third contact plane and connects the first signal terminal surface and the second signal terminal surface via the shortest connection path passing through the gap of the first contact element.

[0021] For example, the first contact element is designed as a stamped and bent part, which is bent from the first contact plane toward the second contact plane. As a result, the first contact element bridges the height difference between the first contact plane and the second contact plane.

[0022] Here, the first contact element can be produced in a simple manner from a sheet metal part or sheet metal, in particular from a sheet copper part or sheet copper, in a separation and forming process, such as stamping, fine cutting, etching, laser, etc., and subsequent bending and / or calibration, and here too can be flexibly dimensioned according to the shape and requirements. In addition, other regions, such as regions for increasing strength or openings (or other gaps) for guiding other signal connections through, can be formed in the contact element.

[0023] For example, the first contact element has at least one lug at the first contact section, which is bent away from the main plane of the first contact section in the direction of the first contact plane. Alternatively or in addition thereto, the first contact element may have at least one further lug at the second contact section, which is bent away from the main plane of the second contact section in the direction of the second contact plane. The lug enables the first contact element to further cross the height difference between the first contact plane and the second contact plane.

[0024] The power electronics module furthermore has, for example, a third current connection surface which is located in the second contact plane.

[0025] In addition, the power electronic module has, for example, a second electrical contact element, which is formed in an integral floor-like manner. The second contact element has: a first contact section, which is placed on the third current connection surface and is physically, such as electrically contacted or connected to the third current connection surface; and a second contact section, which is formed as a first external current connection of the power electronic module and is provided for electrically connecting the power electronic module to the first external current connection. Here, viewed in the longitudinal direction of the second contact element, the two contact sections are particularly formed opposite to each other. The second contact element also has two (longitudinal) connecting sections, which (adjacently in the longitudinal direction of the second contact element, in particular parallel to each other) extend from the first contact section of the second contact element to the second contact section respectively and connect the two contact sections (in particular the corresponding edge regions of the corresponding contact sections in pairs) to each other in an integral manner similar to a connecting web. The second contact element also has a groove between the two connecting sections, which forms a gap of the second contact element. In this case, the two contact sections and the two connecting sections of the second contact element at least partially, in particular almost completely, in particular completely surround the intermediate space of the second contact element.

[0026] In this case, the first signal connection element is guided through the recess of the second contact element.

[0027] In particular, the second contact element is formed in a one-piece plate-shaped manner from another sheet metal part or another metal sheet, in particular from another sheet copper part or another copper sheet.

[0028] For example, the first contact section of the second contact element has at least one lug which is bent away from a main plane of the second contact element in the direction of the second contact plane.

[0029] For example, the power electronics module further comprises at least one electrically insulating plastic material, which consists of an electrically insulating and thermally conductive material. Furthermore, the power electronics module comprises, for example, at least one first metal platelet, which is at least partially embedded in the plastic material and has an exposed surface. At least a portion of the surface of the first metal platelet forms a second signal connection surface of the power electronics module.

[0030] For example, the first signal connection element is designed as a bonding wire or a bonding ribbon.

[0031] For example, the power electronics module further comprises a third signal connection surface in the third contact plane of the module. In addition, the power electronics module comprises a fourth signal connection surface, for example, on a surface of the first contact element facing away from the first current connection surface (or on a surface of the first contact section of the first contact element facing away from the first current connection surface). In addition, the power electronics module comprises a second signal connection element, which is guided through a gap of the second contact element and electrically connects the fourth signal connection surface to the third signal connection surface.

[0032] The power electronics module further comprises, for example, at least one second metal plate which is at least partially embedded in the plastic material and has an exposed surface, wherein at least a portion of the surface of the second metal plate forms a third signal connection surface of the power electronics module.

[0033] For example, the power electronics module further comprises at least one further signal connection surface in the second contact plane of the module and at least one further signal connection surface in the third contact plane of the module. Furthermore, the power electronics module comprises, for example, at least one further signal connection element which is guided through the gap of the second contact element and electrically connects the aforementioned further signal connection surface in the second contact plane with the aforementioned further signal connection surface in the third contact plane.

[0034] For example, the power electronic module further comprises a circuit carrier, which has a first conductor track and a second conductor track on the same surface or the same equipment side. Here, a portion of the first conductor track constitutes a first current terminal surface of the power electronic module. For example, the power electronic module further comprises a first semiconductor switch, which has a first load current terminal on its first surface and a second load current terminal on its second surface facing away from the first surface. The first semiconductor switch is placed on the second conductor track via the first load current terminal and is physically, such as electrically, contacted or connected to the second conductor track. The second load current terminal of the first semiconductor switch constitutes the second current terminal surface of the power electronic module. Therefore, the first contact element electrically connects the first conductor track to the second load current terminal of the first semiconductor switch.

[0035] For example, a portion of the second conductor track forms the first signal connection surface. In this case, the first signal connection element electrically connects the second conductor track to the first metal plate.

[0036] For example, the power electronics module further comprises a second semiconductor switch, which has a first load current connection on its first surface and a second load current connection on its second surface facing away from the first surface. The second semiconductor switch is placed on the first conductor track via the first load current connection and is physically, for example, electrically contacted or connected to the first conductor track. The second load current connection of the second semiconductor switch forms a third current connection surface of the power electronics module.

[0037] The semiconductor switch can be configured as a transistor based on silicon carbide or gallium nitride, such as SiC-MOSFET ("Silicon-Carbide Metal Oxide Field-Effect Transistor" in English) or GaN-MOSFET ("Gallium-Nitrid Metal Oxide Field-Effect Transistor" in English). Alternatively, the semiconductor switch can be configured as a field effect transistor based on β-Ga2O3 ("Beta-Gallium Oxide" in English). It is also possible that the semiconductor switch is configured as a Si-IGBT, that is, as a silicon-based IGBT (IGBT in English is "Silicon-Carbide Insulated Gate Bipolar Transistor", silicon carbide insulated gate bipolar transistor).

[0038] For example, the power electronic module further comprises a third electrical contact element of an integral floor-shaped structure, which is placed on the second conductor track and is physically, such as electrically contacted or connected to the second conductor track. The third contact element is, for example, formed as a plate-shaped third metal part or copper part or a third metal sheet or copper sheet. For example, the power electronic module further comprises a plate-shaped electrical insulator, which is arranged between the second contact element and the third contact element and is physically, such as thermally connected to the second contact element and the third contact element. The insulator physically connects the second contact element and the third contact element to each other and at the same time electrically insulates the two contact elements from each other.

[0039] For example, the insulator is part of the previously mentioned plastic material.

[0040] For example, the power electronics module further has an integral, floor-shaped fourth electrical contact element, which is placed on the first conductor track and is physically, such as electrically, contacted or connected to the first conductor track. The fourth contact element is, for example, a plate-shaped fourth metal or copper part or a fourth metal or copper sheet.

[0041] For example, the circuit carrier has, on a further surface facing away from the conductor tracks, a (in particular metallic) cooling layer for cooling the power electronics module.

[0042] According to a first aspect of the invention, an inverter is provided, in particular for an electric drive of a motor vehicle.

[0043] The inverter has a housing and a plurality of the above-mentioned power electronic modules arranged in the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Exemplary embodiments of the present invention are described in more detail below with reference to the accompanying drawings.

[0045] Figure 1 A schematic top view shows a contact element of a power electronics module according to an exemplary embodiment of the present invention;

[0046] Figure 2 A further schematic top view shows a further contact element of a power electronics module according to a further exemplary embodiment of the present invention;

[0047] Figure 3 A power electronics module according to an exemplary embodiment of the present invention is shown in a further schematic top view, which has a power electronics module from Figure 1 and 2 contact elements; and

[0048] Figure 4 A schematic cross-sectional view of Figure 3 Module. DETAILED DESCRIPTION

[0049] Figure 1 A schematic top view shows a first contact element KE1 according to an exemplary embodiment of the present invention, which is inserted as a first contact element into a Figure 3 and 4 The power electronics module LM.

[0050] The first contact element KE1 is punched and bent from a copper sheet (made of high-purity copper or a copper alloy) as a one-piece punched and bent part in a corresponding shape. In this case, the first contact element KE1 is symmetrically shaped about its longitudinal axis L1.

[0051] The first contact element KE1 is divided into: a first contact area KB1 with a first contact section K11; a second contact area KB2 with a second contact section K12, and when viewed in the extension direction of the longitudinal axis L1 of the contact element KE1, the second contact section faces away from the first contact area KB1; and a connecting area VB1 with two connecting strips or two connecting sections V1, which is located between the two contact areas KB1, KB2 and connects the two areas KB1, KB2 to each other in an integral manner.

[0052] The first contact region KB1 or the first contact section K11 is strip-shaped and extends transversely to the extension direction of the longitudinal axis L1 of the contact element KE1 .

[0053] The two connecting strips V1 of the connecting area VB1 are formed substantially symmetrically to each other and extend in a leg-like manner from one of the two end areas of the first contact section K11 along the extension direction of the longitudinal axis L1 in the direction toward the second contact area KB2, and the second contact area KB2 is connected to the first contact section K11 in one piece. Here, the two connecting sections V1 are bent from the main plane of the first contact section K11 in the direction toward the main plane of the second contact area KB2 and thus bridge the height difference between the main planes of the contact areas KB1 and KB2. In addition, the two connecting sections V1 bridge the longitudinal distance between the two contact sections K11 and K12 along the longitudinal axis L1.

[0054] On a partial area adjacent to the second contact area KB2, the connection area VB1 has a transverse connecting web QV1 extending transversely to the extension direction of the longitudinal axis L1 of the first contact element KE1, which connects the two connection sections V1 to each other at their respective partial sections adjacent to the second contact area KB2. The transverse connecting web QV1 is primarily used to mechanically stabilize the connection area VB1 and thereby to increase the mechanical strength of the first contact element KE1.

[0055] The first contact element KE1 has a recess which is completely surrounded by the two contact regions KB1, KB2 and the connecting region VB1 or by the first contact section K11 and the two connecting sections V1 together with the transverse connecting web QV1 and thus forms an enclosed gap R1 extending through the first contact element KE1. Figure 3 and 4 The functioning mode of the gap R1 is described in more detail.

[0056] The second contact area KB2 or the second contact section K22 has four lugs F1, which are distributed in pairs and are shaped like the tines of a fork at one of the two connecting sections V1 and extend parallel to each other in the direction of the longitudinal axis L1 of the first contact element KE1. The second contact area KB2 has a gap SL1 between the four lugs F1, which forms a cross in a top view of the first contact element KE1 and physically separates the four lugs F1 from each other at their exposed ends, so that the four lugs F1 do not touch each other. Here, the lugs F1 are bent away from the main plane of the second contact area KB2 or the second contact section K22, as shown in Figure 4 As explained in .

[0057] In a top view, the first contact element KE1 is substantially quadrilateral in shape. At the four corner regions, the contact element KE1 has protruding (positioning) profiles AF, via which the contact element KE1 can be held by a corresponding carrier mold and positioned in a corresponding assembly position in a subsequent assembly step, such as when soldering or sintering the contact element KE1 to a circuit carrier or a semiconductor.

[0058] Figure 2 A second contact element KE2 according to another exemplary embodiment of the present invention is shown in another schematic top view, which is inserted as a second contact element into a second contact element from Figure 3 and 4 The power electronics module LM.

[0059] The second contact element KE2 is likewise formed as a one-piece stamped and bent part from a copper sheet (made of high-purity copper or a copper alloy) and is stamped and bent into a corresponding shape. In this case, the second contact element KE2 is symmetrically shaped about its longitudinal axis L2.

[0060] The second contact element KE2 is divided into: an inner contact area IB with a first contact section K21, via which the contact element KE2 is electrically connected inside the power electronic module; an outer contact area AB with a second contact section K22, which, when viewed in the extension direction of the longitudinal axis L2 of the contact element KE2, faces away from the inner contact area IB and via which the contact element KE2 or the power electronic module LM is electrically connected to the outside; and a connecting area VB2 with two connecting sections V2, which is located between the inner contact area IB and the outer area AB and connects the two areas IB, AB to each other in an integral manner.

[0061] In a top view of the second contact element KE2, the outer contact area AB or the second contact section K22 is substantially rectangular and has a rectangular contact surface extending in a flat manner, which is used to make electrical contact between the second contact element KE2 and thus the module LM and an external electrical component. The second contact section K22 also has one or more (positioning) holes or bores LO running through the second contact section K22, via which the contact element KE2 can be held by a corresponding carrier mold and positioned in a corresponding assembly position in a subsequent assembly step, such as when soldering or sintering the contact element KE2 to the circuit carrier.

[0062] The two connecting sections V2 are formed substantially symmetrically to each other and extend in a leg-like manner from the outer contact area AB or the second contact section K22 in the extension direction of the longitudinal axis L2 of the contact element KE2 toward the inner contact area IB. Therefore, the outer contact area AB and the connecting area VB2 or the second contact section K22 and the two connecting sections V2 substantially have the shape of a tuning fork. The two connecting sections V2 connect the outer contact area AB with the inner contact area IB, which is adjacent to the connecting area VB2 in the extension direction of the longitudinal axis L2 of the contact element KE2. Here, the two connecting sections V2 are bent from the main plane of the outer contact area AB in the direction toward the main plane of the inner contact area IB and thus bridge the height difference between the main planes of the outer contact area and the inner contact areas AB, IB. In addition, the two connecting sections V2 bridge the longitudinal distance between the two contact sections K21, K22 along the longitudinal axis L2.

[0063] At a partial region adjacent to the inner contact region IB, the connection region VB2 has a transverse connecting web QV2 extending transversely to the extension direction of the longitudinal axis L2 of the second contact element KE2, which connects the two connection sections V2 to each other at their respective partial sections adjacent to the inner contact region IB. The transverse connecting web QV2 is primarily used to mechanically stabilize the connection region VB2 and thereby to increase the mechanical strength of the second contact element KE2.

[0064] The second contact element KE2 has a groove which is completely surrounded by the outer contact region, the connection region and the inner contact regions AB, VB2 and IB or by the second contact section K22, the two connection sections V2 together with the transverse connecting web QV2 and thus forms an enclosed gap R2 through the second contact element KE2. Figure 3 and 4 The functioning mode of the gap R2 is described in more detail.

[0065] The inner contact area IB or the first contact section K21 has four lugs F2, which are distributed in pairs and are shaped like the tines of a fork at one of the two connecting sections V2 and extend parallel to each other in the direction of the longitudinal axis L2 of the second contact element KE2. Here, the lugs F2 are formed symmetrically about the longitudinal axis L2 in pairs. The first contact section K21 has a gap SL2 between the four lugs F2, which forms a cross in the top view of the second contact element KE2 and physically separates the four lugs F2 from each other at their exposed ends, so that the four lugs F2 do not touch each other. Here, the lugs F2 are bent away from the main plane of the first contact section K21 in a direction away from the main plane of the second contact section K22, as in Figure 4 As explained in .

[0066] Figure 3 and 4 A power electronics module LM according to an exemplary embodiment of the present invention is shown in a schematic top view or a schematic cross-sectional view, respectively, which has a power electronics module from Figure 1 and 2 Two contact elements KE1, KE2.

[0067] The power electronic module LM forms a switchable half-bridge circuit having two semiconductor switches T1 and T2 connected in series, and has a circuit carrier ST, which is composed of a DCB substrate (English: "Direct Copper Bonded Substrate" or an AMB substrate (English: "Active metal brazed Substrate" and forms a half-bridge circuit on the circuit carrier.

[0068] The circuit carrier ST comprises an electrically insulating (ceramic) insulation layer IS1 and first and second conductor tracks LB1, LB2, which are formed adjacent to each other in a planar manner on the same surface of the insulation layer IS1. On the surface of the insulation layer IS1 facing away from the conductor tracks LB1, LB2, the circuit carrier ST comprises a cooling layer KS extending in a planar manner for cooling the module LM.

[0069] The two conductor tracks LB1 , LB2 or their respective surfaces facing away from the insulation layer IS1 are located in a first contact plane E1 of the power electronics module LM or form the first contact plane E1 .

[0070] The power electronics module LM further comprises a first semiconductor switch and a second semiconductor switch T1, T2, which in this embodiment are designed as SIC-MOSFETs without a housing (designed as bare chips). The first semiconductor switch T1 is placed centrally on the second conductor track LB2 and is sintered or soldered to the second conductor track LB2 via its first load current terminal L11 (drain terminal) formed on its lower side. Similarly, the second semiconductor switch T2 is placed centrally on the first conductor track LB1 and is sintered or soldered to the first conductor track LB1 via its first load current terminal L21 (drain terminal) formed on its lower side. The two semiconductor switches T1, T2 have second upper load current terminals L12, L22 (source terminals) and a plurality of upper signal terminals (gate terminals and Kelvin source terminals) on the respective upper sides.

[0071] The second upper load current terminals L12, L22 or their corresponding current terminal surfaces AF2, AF3 and the corresponding upper signal terminals or their corresponding signal terminal surfaces SF5, SF7 are located in the second contact plane E2 of the power electronic module LM or form the second contact plane E2. In this case, the aforementioned first contact plane E1 and the second contact plane E2 are located at different structural heights of the module LM, such as at Figure 4 As explained in .

[0072] The power electronics module LM also has the previously described Figure 1 The first contact element KE1 described previously according to Figure 2 The described second contact element KE2 and the third and fourth contact elements KE3 , KE4 are here also stamped out of a copper sheet (made of high-purity copper or a copper alloy) as a one-piece stamped part in a corresponding shape.

[0073] In addition to the first semiconductor switch T1, the third contact element KE3 is connected via the Figure 4 The end region on the right side (as viewed in FIG. 1 ) is placed onto the second conductor track LB2 (at Figure 4 The third contact element KE3 is sintered or soldered to the second conductor track LB2.

[0074] In addition to the second semiconductor switch T2, the first contact element KE1 is placed via its first contact section K11 on the first conductor track LB1 (at Figure 4 The first contact element KE1 is connected to the right edge region of the first semiconductor switch T1 (or its first current terminal surface AF1) (as viewed in FIG. 1 ) and is in electrical contact with the first conductor track LB1. Here, the first contact element KE1 or its first contact section K11 is sintered or welded to the first conductor track LB1. The first contact element KE1 is placed on the first semiconductor switch T1 via its second contact section K12 or its four terminals F1 and is in electrical contact with its second load current terminal L12. Here, the second contact section K12 or the four terminals F1 are sintered or welded to the second load current terminal L12. Due to the connecting section V1 that is bent from the main plane of the first contact section K11 toward the main plane of the second contact section K12, the first contact element KE1 bridges the height difference between the first contact plane and the second contact planes E1, E2.

[0075] The second contact element KE2 is placed on the second semiconductor switch T2 via its first contact section K21 or its four terminals F2 and is in electrical contact with its second load current terminal L22. Here, the first contact section K21 or the four terminals F2 are sintered or welded to the second load current terminal L22. The second contact element KE2 is indirectly placed on the third contact element KE3 via its second contact section K22. A plate-shaped electrical insulator IS2 is arranged between the second contact element and the third contact element KE2, KE3, which physically connects the second contact element and the third contact element KE2, KE3 to each other and at the same time electrically insulates them from each other. Here, the insulator IS2 is part of the plastic material MM (for example made of a mold compound) to be described below. Due to the connecting section V2 bent from the main plane of the first contact section K21 toward the main plane of the second contact section K22 and the terminal F2 extending from the main plane of the first contact section K21 in the direction toward the second semiconductor switch T2, the second contact element KE2 bridges the height difference between the second contact plane E2 and the main plane of the second contact section K22.

[0076] In addition to the second semiconductor switch T2, the fourth contact element KE4 is connected via the Figure 4 The left end region (as viewed in FIG. 2 ) is placed on the first conductor track LB1 (at Figure 4 The fourth contact element KE4 is sintered or soldered to the first conductor track LB1.

[0077] The power electronics module LM further comprises the aforementioned plastic material MM made of an electrically insulating and thermally conductive plastic, which is formed in one piece or in multiple pieces in the cavities at or between the contact elements KE1, KE2, KE3, KE4. The plastic material MM comprises, on the surface facing away from the circuit carrier ST, a plurality of metal or copper plates M1, M2, M3, M4, M5, each with a signal connection surface SF2, SF3, SF8, SF6, SF9, which are injection-molded over the plastic material MM except for their corresponding signal connection surfaces. The copper plates M1, M2, M3, M4, M5 or their signal connection surfaces SF2, SF3, SF8, SF6, SF9 serve to establish a signal connection between the two semiconductor switches T1, T2 and an external drive / control circuit (not shown in the figure) of the power module LM.

[0078] Other signal connections can be provided (also for other circuit components) for transmitting sensor signals or control signals, which are formed, for example, in the form of bonding wires and are guided through the gaps R1, R2 of the first contact element and / or the second contact element KE1, KE2. Similarly, fewer signal connections than previously described can also be provided as required.

[0079] The copper plates M1, M2, M3, M4, M5 or their signal connection surfaces SF2, SF3, SF8, SF6, SF9 are located in or form a third contact plane E3 of the power electronic module LM. The third contact plane E3 is located between the aforementioned first contact plane and the aforementioned second contact planes E1, E2 and is therefore located at a different structural height than the two contact planes E1, E2.

[0080] The power electronics module LM furthermore has a plurality of signal connection elements SV1 , SV2 , SV3 , SV4 , SV5 which are formed by bonding wires or bonding ribbons.

[0081] The first signal connection element SV1 electrically connects the first signal connection surface SF1, which is part of the second conductor track LB2 and is therefore located in the first contact plane E1, to the second signal connection surface SF2, which is formed on the first copper platelet M1 and is located in the third contact plane E3 of the module LM. The first signal connection element SV1 thus bridges the height difference between the first contact plane and the third contact plane E1, E3. Here, the first signal connection element SV1 is guided through the gap R1, R2 of the first contact element or the second contact element KE1, KE2.

[0082] The second signal connection element SV2 electrically connects the first contact section K11 of the first contact element KE1 or the signal connection surface SF4 on the surface of the contact section K11 facing away from the first current connection surface AF1 to the third signal connection surface SF3, which is formed on the second copper plate M2 and is located in the third contact plane E3 of the module LM. Therefore, the first signal connection element SV1 bridges the height difference between the first contact element KE1 and the third contact plane E3. In this case, the second signal connection element SV2 is guided through the gap R2 of the second contact element KE2.

[0083] The third signal connection element SV3 electrically connects a fifth signal connection surface SF5, which is formed on the signal connection of the first semiconductor switch T1 and is therefore located in the second contact plane E2, to a sixth signal connection surface SF6, which is formed on the other copper plate and is therefore located in the third contact plane E3. In this case, the third signal connection element SV3 is guided through the gap R2 of the second contact element KE2 and bridges the height difference between the two contact planes E2, E3.

[0084] The fourth signal connection element SV4 electrically connects the seventh signal connection surface SF7, which is formed on the signal connection of the second semiconductor switch T2 and is therefore located in the second contact plane E2, to the eighth signal connection surface SF8, which is formed on the further copper plate M3 and is therefore located in the third contact plane E3. In this case, the fourth signal connection element SV4 also bridges the height difference between the two contact planes E2, E3.

[0085] The fifth signal connecting element SV5 electrically connects a ninth signal connection surface SF9 which is formed on the further copper plate M3 and is therefore located in the third contact plane E3 to a tenth signal connection surface SF10 which is formed on the surface of the second contact element KE2 facing away from the circuit carrier ST.

[0086] The power module LM can be encapsulated by a molding compound, wherein the molding compound fills the gaps between the aforementioned components of the module LM and mechanically stabilizes these components and at the same time electrically insulates them from each other. Here, the exposed ends of the second, third and fourth contact elements KE2, KE3, KE4 (respectively the left end regions of the second and third contact elements KE2, KE3 and the right end regions of the fourth contact element KE4) protrude from the molding compound. These end regions constitute the external current terminals (H+ terminals, H-terminals or phase terminals) of the power module LM. In addition, the cooling layer KS of the circuit carrier ST is free of molding compound. The module LM can be thermally contacted with a cooler via the cooling layer KS.

[0087] Parasitic inductances can be reduced by implementing the second and third contact elements KE2 , KE3 so as to overlap over substantially the entire length of the third contact element KE3 , which forms the H+ / H− connection of the power module LM.

[0088] By conducting the contact elements KE1, KE2, KE3 and KE4 as stamped parts or stamped and bent parts and implementing the contact elements KE1, KE2, KE3 and KE4 layer by layer, it is possible to conduct / guide the signals on multiple planes E1, E2, E3 and thus to reduce the area of ​​the circuit carrier ST with a significant reduction in costs and module size in the case of the power module LM. In this case, unlike the stamped and bent parts formed by clamps or wave shapes, the contact elements KE1, KE2, KE3 and KE4 can be designed with a sufficiently large cross-sectional area to enable a large current flow.

[0089] The use of first and second contact elements KE1, KE2 with corresponding gaps R1, R2 allows space-saving signal connections between different contact planes of the module LM, wherein these connections pass through the gaps R1, R2 and are thus guided from one plane to the other over a short connection path and are protected from external influences by the two contact elements KE1, KE2. The gaps R1, R2 also enable simple access of a joining tool when establishing a signal connection to the (joining) terminal face and subsequent optical control of the signal connection. In addition, the gaps R1, R2 prevent the formation of gaseous inclusions during the molding process of encapsulating the power module LM with the previously mentioned molding compound.

Claims

1. A power electronic module (LM), comprising: - a first current connection surface (AF1) in a first electrical contact plane (E1) of the module (LM); - a second current connection surface (AF2) in a second electrical contact plane (E2) of the module (LM); - a first plate-shaped contact element (KE1) formed in one piece, the first contact element comprising: a first contact section (K11) which is in contact with the first current connection surface (AF1); a second contact section (K12) which is in contact with the second current connection surface (AF2); and two connecting sections (V1) which extend respectively from the first contact section (K11) of the first contact element (KE1) to the second contact section (K12), wherein a groove is provided in the first contact element (KE1) between the connecting sections (V1) of the first contact element (KE1), the groove forming a gap (R1) of the first contact element (KE1); A first signal connection element (SV1) which is guided through a gap (R1) of the first contact element (KE1).

2. The power electronic module (LM) according to claim 1, wherein The first signal connection element (SV1) connects a first signal connection surface (SF1) located in the first contact plane (E1) to a second signal connection surface (SF2) located in a third contact plane (E3) of the module (LM); - wherein the first contact plane (E1), the second contact plane (E2) and the third contact plane (E3) are located at different structural heights of the module (LM), and the second contact plane (E2) is located between the first contact plane (E1) and the third contact plane (E3). 3 . The power electronic module (LM) according to claim 1 , wherein the first contact element ( KE1 ) is designed as a stamped and bent part which is bent from the first contact plane ( E1 ) toward the second contact plane ( E2 ). 4 .

4. A power electronic module (LM) according to any one of the preceding claims, wherein The first contact element (KE1) has at least one lug on the first contact section (K11), which lug is bent away from a main plane of the first contact section (K11) in the direction of the first contact plane (E1); and / or The first contact element (KE1) has at least one lug (F1) on the second contact section (K12), which is bent away from a main plane of the second contact section (K12) in the direction of the second contact plane (E2).

5. The power electronics module (LM) according to claim 1 , further comprising: - a third current connection surface (AF3) in said second contact plane (E2); - a second plate-shaped contact element (KE2) formed in one piece, the second contact element comprising: a first electrical contact section (K21) which is in contact with the third current connection surface (AF3); a second electrical contact section (K22) for establishing a first external current connection for the module (LM); and two connection sections (V2), each extending from a first contact section (K21) of the second contact element (KE2) to a second contact section (K22), wherein a recess is provided in the second contact element (KE2) between the connection sections (V2) of the second contact element (KE2), the recess forming a gap (R2) of the second contact element (KE2); - wherein the first signal connection element (SV1) is guided through the gap (R2) of the second contact element (KE2).

6. A power electronic module (LM) according to claim 5, wherein the first contact section (K21) of the second contact element (KE2) has at least one terminal lug (F2), which is bent away from the main plane of the second contact element (KE2) in the direction of the second contact plane (E2).

7. The power electronics module (LM) according to claim 1, further comprising: - electrically insulating plastic material (MM); - a first metal platelet (M1) at least partially embedded in the plastic material (MM) and having an exposed surface; - wherein the second signal terminal surface (SF2) is a portion of the surface of the first metal plate (M1).

8. The power electronics module (LM) according to claim 1, wherein the first signal connection element (SV1) is designed as a bonding wire or a bonding ribbon.

9. The power electronics module (LM) according to claim 1, further comprising: - a third signal terminal surface (SF3) in a third contact plane (E3) of the module (LM); a fourth signal connection surface (SF4) on a surface of the first contact element (KE1) facing away from the first current connection surface (AF1); A second signal connection element (SV2) which is guided through a gap (R2) of the second contact element and electrically connects the fourth signal connection surface (SF4) to the third signal connection surface (SF3).

10. The power electronics module (LM) according to claim 8 or 9, further comprising: a second metal platelet (M2) at least partially embedded in the plastic material (MM) and having an exposed surface, wherein the third signal terminal face (SF3) is part of the surface of the second metal platelet (M2).

11. The power electronics module (LM) according to claim 1, further comprising: - at least one further signal terminal surface (SF5) in a second contact plane (E2) of the module (LM); - at least one further signal terminal surface (SF6) in a third contact plane (E3) of the module (LM); - at least one further signal connection element (SV3), which is guided through the gap (R2) of the second contact element (KE2) and electrically connects the signal terminal surface (SF5) in the second contact plane (E2) with the signal terminal surface (SF6) in the third contact plane (E3).

12. The power electronics module (LM) according to claim 1, further comprising: a circuit carrier ST having a first conductor track (LB1) and a second conductor track (LB2) on the same equipment side, wherein the first current connection surface (AF1) is part of the first conductor track (LB1); a first semiconductor switch (T1) having a first load current terminal (L11) on a first surface and a second load current terminal (L12) on a second surface facing away from the first surface; - wherein the first semiconductor switch (T1) is contacted with the second conductor track (LB2) via the first load current terminal (L11); - wherein the second load current connection (L12) of the first semiconductor switch (T1) forms the second current connection surface (AF2). 13 . The power electronic module (LM) according to claim 12 , wherein the first signal connection surface ( SF1 ) is part of the second conductor track ( LB2 ).

14. The power electronics module (LM) according to claim 12 or 13, further comprising: a second semiconductor switch (T2), the second semiconductor switch having a first load current connection (L21) on a first surface and a second load current connection (L22) on a second surface facing away from the first surface, the second semiconductor switch being arranged on the first conductor track (LB1) via the first load current connection (L21) and being electrically connected to the first conductor track (LB1); - wherein the second load current connection (L22) of the second semiconductor switch (T2) forms the third current connection surface (AF3).

15. The power electronics module (LM) according to claim 12, further comprising: a third plate-shaped contact element (KE3) formed in one piece and making contact with the second conductor track (LB2); - a plate-shaped electrical insulator (IS2), which is arranged between the second contact element (KE2) and the third contact element (KE3) and is physically connected to the second contact element (KE2) and the third contact element (KE3) and electrically insulates the second contact element (KE2) and the third contact element (KE3) from each other.

16. A power electronic module (LM) according to claims 7 and 15, wherein the insulator (IS2) is part of the plastic material (MM). 17 . The power electronics module (LM) according to claim 12 , further comprising a fourth plate-shaped contact element (KE4 ) formed integrally and making contact with the first conductor track (LB1 ).

18. The power electronic module (LM) as claimed in claim 12, wherein the circuit carrier (ST) has a cooling layer (KS) for cooling the module (LM) on a surface facing away from the conductor tracks (LB1, LB2).

19. An inverter, comprising: -case; - A power electronics module (LM) according to any one of claims 1 to 18, which is arranged in the housing.

Images