Cascade type fluid oscillation jet device for chip heat dissipation

By designing a cascaded fluid oscillation jet device, multiple oscillation jets are generated using in-phase or inverse designs, the problem of local high-temperature hot spots of high-heat flow density chips is solved, and more effective heat dissipation and temperature uniformity are achieved.

CN119634074AActive Publication Date: 2025-03-18SOUTH CHINA UNIV OF TECH
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Patent Information

Application Number
CN202411677944.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-22
Publication Date
2025-03-18
Estimated Expiration
2044-11-22

AI Technical Summary

Technical Problem

The prior art is difficult to effectively solve the local high-temperature hot spots of high-heat flow density chips, and there is a lack of an effective temperature equalization heat dissipation method.

Method used

A cascaded fluid oscillation jet device is designed. By connecting multiple fluid oscillation devices in series, an in-phase or inverse design is used to generate more than two oscillation jets at the jet outlet, reducing interference between the fluids, and enhancing convection heat dissipation through the rib structure of the jet bottom plate.

Benefits of technology

It realizes more effective heat dissipation of the heating chip, especially in local hot spots, improves temperature uniformity and enhances the convective heat dissipation effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a cascade type fluid oscillation jet flow device for chip heat dissipation. The cascade type fluid oscillation jet flow device comprises an inlet jet flow plate; the multiple jet flow plates are arranged in a series connection mode in an attached mode, a fluid oscillation structure is arranged on one face of the inlet jet flow plate and one face of the jet flow plates, and the fluid oscillation structure comprises a flow dividing cavity and at least two oscillation cavities and is used for converting steady-state flowing of fluid into periodic oscillation jet flow; the jet flow bottom plate is provided with a plurality of flow channels, a jet flow outlet of the fluid oscillation structure is located over the flow channels, and fins are formed between the flow channels; an outlet cover plate; the outlet cover plate, the jet flow plate, the inlet jet flow plate and the jet flow bottom plate located at the bottom are connected into a whole. The heat dissipation problem of the heat source surface of the non-uniform heating chip in the prior art can be solved, in-phase or anti-phase unsteady periodic oscillation jet flow can be formed according to actual application requirements, and the heat dissipation effect is improved.
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Description

Technical Field

[0001] The invention relates to a fluid oscillation jet device, in particular to a cascade fluid oscillation jet device for chip heat dissipation. Background Art

[0002] As the performance of electronic chips continues to improve, thermal management issues have become increasingly prominent and have become the main factor restricting their development. A sharp increase in heat flux density leads to rapid accumulation of heat inside the chip, which easily forms high-temperature areas, thereby affecting the stability and performance of the device. At present, effective heat dissipation technology for high heat flux density chips is still insufficient, especially for heat-generating chips with local high-temperature hot spots, there is a lack of effective temperature-balanced heat dissipation methods.

[0003] In terms of chip cooling technology, it can be divided into two methods: passive and active. Active cooling technology is a technology that actively intervenes in the heat transfer process of the fluid through external power or energy input to improve the heat transfer efficiency. It uses mechanical vibration, electromagnetic field, fluid excitation and other means to enhance the speed of heat transfer in the fluid. Among them, the means of fluid excitation refers to the use of an actuator to introduce disturbances and inject energy into the fluid, so that the steady-state flow is transformed into an unsteady flow, thereby enhancing the degree of fluid turbulence.

[0004] The fluid oscillation device is a new type of non-steady-state excitation technology. It can produce an active excitation effect at the outlet by relying solely on the intrinsic characteristics of the fluid without mechanical or electromagnetic components. Compared with traditional actuators such as solenoid valves, it has the advantages of high reliability and strong stability, and is suitable for working in various harsh environments. The overall design structure of the device is basically the same, including an oscillation chamber inlet, a mixing chamber, two feedback channels and a jet outlet. Its geometric structure lacks novelty, and it is impossible to obtain independent oscillations of multiple jets at the same time, and it cannot solve the hot spot problem of multiple heating chips and improve temperature uniformity. Summary of the invention

[0005] In order to overcome the above-mentioned shortcomings and deficiencies of the prior art, the object of the present invention is to provide a cascade fluid oscillation jet device for chip heat dissipation, which connects multiple fluid oscillation devices in series, and the fluid oscillation structure adopts the same phase or anti-phase design to generate more than two oscillating jets at the jet outlet, and there will be no strong interference between the fluids.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] A cascade fluid oscillation jet device for chip heat dissipation, comprising:

[0008] Inlet jet plate, used for flow diversion;

[0009] A plurality of jet plates, wherein the plurality of jet plates are arranged in series, and a fluid oscillation structure is provided on one side of the inlet jet plate and the jet plate, and the fluid oscillation structure comprises a flow diversion cavity and at least two oscillation cavities, and is used to transform the steady-state flow of the fluid into a periodic oscillation jet;

[0010] A jet bottom plate, wherein the jet bottom plate is provided with a plurality of flow channels, the jet outlet of the fluid oscillation structure is located directly above the plurality of flow channels, and fins are formed between the flow channels;

[0011] The outlet cover plate is used for sealing; the outlet cover plate, the jet plate, the inlet jet plate and the jet bottom plate at the bottom are connected as a whole.

[0012] Furthermore, the fluid oscillation structure adopts an in-phase design or an anti-phase design;

[0013] By adopting the same-phase design, the jet outlet of the fluid oscillation structure will flow out two or more oscillating jets with the same deflection frequency and the same phase;

[0014] By adopting the anti-phase design, two or more oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out from the jet outlet of the fluid oscillation structure.

[0015] Furthermore, the fluid oscillation structure adopts a co-phase design, including two independent and identical oscillation chambers and four feedback channels, each of which includes an oscillation chamber inlet, a mixing chamber, an attachment wall, a channel return port, a channel inlet, a feedback channel and a jet outlet;

[0016] The mixing chamber is communicated with the channel return port, the channel inlet and the jet outlet respectively; the two attachment walls are located on the left and right sides of the mixing chamber; the channel inlet is communicated with the channel return port through the feedback channel.

[0017] Furthermore, the fluid vibration structure adopts an anti-phase design, including three feedback channels and two oscillation cavities with the same structure, wherein one feedback channel serves as a common feedback channel, and the two oscillation cavities are shared and connected through the common feedback channel;

[0018] Each of the oscillation chambers comprises an oscillation chamber inlet, a mixing chamber, an attachment wall, a channel return port, a channel inlet, a feedback channel and a jet outlet;

[0019] The common feedback channel includes a first middle attachment wall, a second middle attachment wall, a middle channel return port, a middle channel inlet, and a middle channel;

[0020] The first middle attachment wall and the second middle attachment wall are located on both sides of the common feedback channel, the first middle attachment wall is located on one side of an oscillation cavity, and the second middle attachment wall is located on one side of another oscillation cavity. The middle channel inlet and the middle channel return port are connected through the middle channel.

[0021] Furthermore, when the number of vibration flow cavities is greater than two, the multiple vibration flow cavities are connected in parallel to the same flow splitting cavity.

[0022] Furthermore, the number of feedback channels of the in-phase design of the fluid oscillation structure is twice the number of the oscillation cavities, the number of feedback channels of the anti-phase design is the number of the oscillation cavities plus one, and the number of common feedback channels is one less than the number of the oscillation cavities.

[0023] Furthermore, the thickness of the fins is equal to the wall thickness of the fluid oscillation structure, and the fins are arranged along the fluid flow direction.

[0024] Furthermore, the bottom surface of the fluidic bottom plate is closely attached to the heat source surface of the heat generating chip through a thermal interface material with high thermal conductivity.

[0025] Furthermore, a sealing ring groove is provided on one side of the outlet cover plate, and two threaded holes for connecting to the jet bottom plate are provided on the bottom.

[0026] Furthermore, part of the fluid entering the inlet of the middle channel flows through the middle channel and is divided into two flows, which simultaneously act on the main jets of the two mixing chambers, so that the deflection directions of the main jets in the two mixing chambers are opposite.

[0027] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0028] (1) The fluid oscillation structure strengthens the fluid disturbance in the flow channel of the jet bottom plate and enhances convective heat dissipation;

[0029] (2) The thickness of the jet bottom plate fins is equal to that of the fluid oscillation structure wall. On the one hand, this can isolate the interference between the oscillating jets of multiple jet plates. On the other hand, it can make full use of the heat exchange area of ​​the jet bottom plate to take away more heat from the heat-generating chip.

[0030] (3) In the in-phase design, two or more oscillating jets with the same deflection frequency and phase can make the cooling medium flow in the same direction, which has a better heat dissipation effect on the local hot spots of the heat-generating chip; in the anti-phase design, two or more oscillating jets with the same deflection frequency and a phase difference of half a cycle can make the cooling medium flow in two different directions, which can improve the temperature uniformity of the heat-generating chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structure explosion of the cascade fluid oscillation jet device of the present invention with the same phase design;

[0032] Figure 2 It is a structural schematic diagram of the front side of the jet plate of the fluid oscillation structure in phase design of the present invention;

[0033] Figure 3 It is a schematic structural diagram of the reverse side of the jet plate of the fluid oscillation structure in phase design of the present invention;

[0034] Figure 4 It is a schematic diagram of the structure of the fluid oscillation structure jet bottom plate of the present invention;

[0035] Figure 5 It is a schematic diagram of the structure of the in-phase design of the fluid oscillation structure of the present invention;

[0036] Figure 6 It is a schematic diagram of the fluid flow path of the fluid oscillation structure of the present invention in the same phase design t=0T;

[0037] Figure 7 It is a schematic diagram of the flow path of the fluid oscillation structure of the present invention in phase design t=0.5T;

[0038] Figure 8 It is a schematic diagram of the structure of the inverse phase design of the fluid oscillation structure of the present invention;

[0039] Fig. 9 It is a schematic diagram of the flow path of the fluid oscillation structure of the present invention with an inverse phase design of t=0T body;

[0040] Fig.10 This is a schematic diagram of the flow path of the fluid oscillation structure inverse design t=0.5T of the present invention;

[0041] Fig.11 It is a schematic diagram of the structure in which three oscillators of the fluid oscillation structure of the present invention adopt a co-phase design;

[0042] Fig.12 It is a schematic structural diagram of the three oscillators of the fluid oscillation structure of the present invention adopting an anti-phase design. DETAILED DESCRIPTION

[0043] The present invention will be further described in detail below in conjunction with examples, but the embodiments of the present invention are not limited thereto.

[0044] Example 1

[0045] like Figure 1 As shown, a cascade fluid oscillation jet device for chip heat dissipation includes an inlet jet plate 1, multiple jet plates 2, an outlet cover plate 3, a jet bottom plate 4, a sealing gasket 5, a fixing bolt 6, a flat washer 7, a locking nut 8, a sealing gasket 9, and a fastening screw 10.

[0046] In this embodiment, a plurality of jet plates are tightly fitted in series and are located between the inlet jet plate 1 and the outlet cover plate 3. A fluid oscillation structure 11 is provided inside the inlet jet plate 1 and the jet plate 2. The jet plates are sealed by sealing gaskets 5 and are connected together by fixing bolts 6, flat washers 7 and locking nuts 8. The jet bottom plate 4 is located below the jet plate 2, and connecting through holes are provided at the four corners, which are sealed by sealing gaskets 9 and are connected to the inlet jet plate 1 and the outlet cover plate 3 as a whole by fastening screws 10.

[0047] like Figure 1 , Figure 2 and 3 As shown, the inlet jet plate 1 is mainly used for drainage and sealing, with a liquid inlet 211 on the top and two threaded holes 101 on the bottom for connecting the jet bottom plate 4. A sealing ring groove 23 is provided on one side of the jet plate 2, and a fluid oscillation structure 11 is provided on the other side. The side with the fluid oscillation structure 11 is tightly fitted with the side of the adjacent jet plate 2 with the sealing ring groove 23. The fluid oscillation structure 11 is composed of a diversion cavity 21 and an oscillation cavity 22.

[0048] The outlet cover plate 3 is mainly used for sealing. One side is provided with a sealing ring groove to prevent leakage of the cooling medium. The bottom is provided with two threaded holes 31 for connecting with the jet bottom plate 4.

[0049] like Figure 1 and Figure 4 As shown, the jet bottom plate 4 is provided with a sealing ring groove 44, a liquid outlet 41 is provided in the middle of one side, and a plurality of flow channels 42 are opened on its inner surface, and its forms include but are not limited to parallel flow channels, serpentine flow channels, fractal flow channels, etc. The flow channels 42 correspond one to one with the inlet jet plate 1 and the jet outlets 2230 of the plurality of jet plates 2 installed thereon, and ribs 43 are formed between each flow channel 42 to ensure that the oscillating jets generated by the jet outlets 2230 do not interfere with each other, and the thickness of the ribs 43 is equal to the wall thickness of the fluid oscillation structure 11.

[0050] The bottom surface of the jet base plate 4 is tightly fitted with the heat source surface of the heat generating chip through a thermal interface material with high thermal conductivity to eliminate air gaps and reduce contact thermal resistance. The thermal interface material includes but is not limited to thermal grease, liquid metal, graphene thermal conductive film, etc. The number of flow channels 42 of the jet base plate 4 is adjusted according to the heat source surface area of ​​the heat generating chip to be cooled, and the fins 43 are arranged along the flow direction of the fluid. On the one hand, they play a role in enhancing disturbance and guiding fluid flow, and on the other hand, they play a supporting role, thereby improving the structural strength of the base plate. For each local heating area, a closed jet space is formed together with the fluid oscillation structure 11 to avoid interference between the oscillating jets generated by the jet outlet 2230 from adversely affecting the heat exchange performance and ensuring the cooling effect.

[0051] The working principle of a cascade fluid oscillation jet device for chip heat dissipation is as follows: the cooling medium flows into the cascade fluid oscillation jet device from the liquid inlet 211 of the inlet jet plate 1, flows through the inlet jet plate 1 and the fluid oscillation structure 11 provided in multiple jet plates 2, and the oscillating jet flowing out from the jet outlet 2230 impacts the surface of the flow channel 42 of the jet bottom plate 4, thereby enhancing the heat dissipation of the heat-generating chip area, and then converges on both sides of the flow channel 42 of the jet bottom plate 4, flows to the liquid outlet 41, and then flows out of the cascade fluid oscillation jet device, thereby taking away the heat generated by the heat-generating chip.

[0052] The fluid oscillation structure 11 can be designed in phase or in anti-phase, and can generate two in-phase or anti-phase oscillating jets at the oscillating jet outlet 2230, transforming the steady-state flow of the fluid into a periodic oscillating jet, increasing the degree of turbulence, and thus improving the heat transfer performance.

[0053] The fluid oscillation structures set up by multiple jet plates can all be in-phase structures, or can all be anti-phase structures, or can be set alternately. According to actual application requirements, periodic non-steady-state oscillating jets with in-phase or anti-phase are formed, which can continuously destroy the boundary layer of the jet bottom plate and enhance the convective heat transfer effect. The number of oscillation cavities can be increased or decreased according to actual needs.

[0054] like Fig.11 and Fig.12 As shown, the fluid oscillation structure 11 includes at least two oscillation cavities. When the number of oscillation cavities is greater than two, the multiple oscillation cavities are connected in parallel in the same flow diversion cavity, that is, they share one inlet.

[0055] Specifically, when designed in phase, multiple oscillation cavities are independent of each other and have the same structure.

[0056] When the anti-phase design is used, two adjacent oscillation cavities among the multiple oscillation cavities share a feedback channel.

[0057] like Figure 5 As shown, when there are two oscillation cavities, the fluid oscillation structure 11 is designed with two independent and identical left and right oscillation cavities in phase, including four feedback channels, so that the jet outlets 2230 on the left and right sides can flow out two oscillation jets with the same deflection frequency and the same phase, which has a better heat dissipation effect for the local hot spots of the heat-generating chip; Figure 8 As shown, the fluid oscillation structure 11 is designed in an inverse phase with two left and right oscillation cavities that are not independent of each other and have a common feedback channel, including three feedback channels, which can allow the jet outlets 2230 on the left and right sides to flow out oscillating jets with the same deflection frequency and a phase difference of half a cycle, thereby improving the temperature uniformity of the heat-generating chip.

[0058] In this embodiment, two oscillation cavities are used, and the structure of the in-phase design is as follows:

[0059] like Figure 5 As shown, the flow dividing chamber 21 of the fluid oscillation structure 11 is designed in phase and is provided with a liquid inlet 211 and a flow dividing boss 212; the oscillation chamber 22 includes a right oscillation chamber 221 and a left oscillation chamber 222; the right oscillation chamber 221 and the left oscillation chamber 222 have the same structure, and the structure is described by taking the left oscillation chamber 222 as an example, the left oscillation chamber 222 includes an oscillation chamber inlet 2220, a mixing chamber 2221, a right attachment wall 2222, a left attachment wall 2223, a right channel return port 2224, a left channel return port 2225, a right channel inlet 2226, and a left channel inlet 2227. 227, right channel 2228, left channel 2229, jet outlet 2230; the mixing chamber 2221 is connected with the right channel return port 2224, the left channel return port 2225, the right channel inlet 2226, the left channel inlet 2227 and the jet outlet 2230; the right attachment wall 2222 and the left attachment wall 2223 are located on the left and right sides of the mixing chamber 2221; the right channel inlet 2226 is connected with the right channel return port 2224 through the right channel 2228; the left channel inlet 2227 is connected with the left channel return port 2225 through the left channel 2229.

[0060] like Figure 6 As shown, in this embodiment, the working process of a complete oscillation cycle is: at t = 0T (T represents the change cycle of the fluid deflection angle at the jet outlet from positive to negative), the fluid enters from the oscillation chamber inlet 2220, passes through the left and right mixing chambers, and flows along the attachment wall due to the "Coanda effect". When the main jet of the mixing domain 2221 flows along the left attachment wall 2223, the fluid in the mixing chamber 2221 forms a counterclockwise vortex ring, most of the fluid flows out from the jet outlet 2230, and a small amount of fluid flows to the mixing chamber 2221 through the left channel 2229 to interact with the main jet, and the main jet in the mixing chamber 2221 is deflected to the right attachment wall 2222; as shown in FIG. Figure 7 As shown, when t=0.5T, when the main jet of the mixing domain 2221 flows along the right attachment wall 2222, the fluid in the mixing chamber 2221 forms a clockwise vortex ring, and a small amount of fluid flows to the mixing chamber 2221 through the right channel 2228 to interact with the main jet, and the main jet in the mixing chamber 2221 is deflected to the left attachment wall 2223. Through the above process, a complete oscillation cycle is formed. The oscillation sequence of the right oscillation chamber is consistent with that of the left oscillation chamber, so two oscillation jets with the same deflection frequency and the same phase flow out from the jet outlets 2230 of the left and right mixing chambers.

[0061] In this embodiment, the two oscillating cavities adopt an anti-phase design:

[0062] like Figure 8As shown, the oscillation chamber 22 includes a left oscillation chamber inlet 2201, a right oscillation chamber inlet 2202, a left mixing chamber 2203, a right mixing chamber 2204, a left attachment wall 2205, a middle attachment wall 2206, a middle attachment wall 2207, a right attachment wall 2208, a left channel return port 2209, a middle channel return port 2210, a right channel return port 2212, a left channel inlet 2212, a middle channel inlet 2213, a right channel inlet 2214, a left channel Channel 2215, middle channel 2216, right channel 2217, left jet outlet 2218, right jet outlet 2219, the middle channel 2216 is a common feedback channel; the left oscillation cavity is connected with the right oscillation cavity through the middle channel 2216 of the common feedback channel, the middle channel inlet 2213 is connected with the middle channel return port 2210 through the middle channel 2216, and the first middle attachment wall 2206 and the second middle attachment wall 2207 are respectively on the left and right sides of the middle channel 2216.

[0063] like Fig. 9 As shown, in this embodiment, the working process of a complete oscillation cycle is: when t=0T, the main jet of the fluid entering the left mixing chamber 2203 from the left oscillation chamber inlet 2201 flows along the first middle attachment wall 2206, and the main jet entering the right mixing chamber 2204 from the right oscillation chamber inlet 2202 flows along the second middle attachment wall 2207, a small amount of fluid flows into the middle channel 2216 from the middle channel inlet 2213, and then flows out from the middle channel return port 2210. The two streams act on the main jets in the left mixing chamber 2203 and the right mixing chamber 2204 at the same time, the main jet in the left mixing chamber 2203 deflects toward the left attachment wall 2205, and the main jet in the right mixing chamber 2204 deflects toward the right attachment wall 2208, and the deflection directions of the main jets in the two mixing chambers are opposite; Fig.10 As shown, at t=0.5T, the main jets in the two mixing chambers flow along the left attachment wall 2205 and the right attachment wall 2208 respectively, and the feedback fluids in the channel 2215 and the right channel 2217 act on the fluids in the two mixing chambers respectively, so that two oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out from the jet outlets 2218 and 2219 of the left and right mixing chambers.

[0064] The present invention structurally adopts multiple fluid oscillation structures on the jet plates in series to generate oscillating jets with a certain frequency and diffusion angle, without relying on any driving device. According to the actual application requirements, periodic non-steady-state oscillating jets with the same phase or opposite phase are formed to continuously destroy the boundary layer of the jet bottom plate. The number of oscillation cavities can be increased or decreased according to actual needs. The thickness of the jet bottom plate fins is the same as the wall thickness of the fluid oscillation structure of the jet plate, which minimizes the interference between fluids and increases the effective cooling coverage area, thereby increasing the amount of cooling acting on the chip surface, and can effectively improve the temperature uniformity inside the chip and reduce local hot spots.

[0065] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A cascade fluid oscillation jet device for chip heat dissipation, characterized in that: include: Inlet jet plate, used for flow diversion; A plurality of jet plates, wherein the plurality of jet plates are arranged in series, and a fluid oscillation structure is provided on one side of the inlet jet plate and the jet plate, and the fluid oscillation structure comprises a flow diversion cavity and at least two oscillation cavities, and is used to transform the steady-state flow of the fluid into a periodic oscillation jet; A jet bottom plate, wherein the jet bottom plate is provided with a plurality of flow channels, the jet outlet of the fluid oscillation structure is located directly above the plurality of flow channels, and fins are formed between the flow channels; The outlet cover plate is used for sealing; the outlet cover plate, the jet plate, the inlet jet plate and the jet bottom plate at the bottom are connected as a whole.

2. The cascade fluid oscillation jet device according to claim 1, characterized in that: The fluid oscillation structure adopts an in-phase design or an anti-phase design; By adopting the same-phase design, the jet outlet of the fluid oscillation structure will flow out two or more oscillating jets with the same deflection frequency and the same phase; By adopting the anti-phase design, two or more oscillating jets with the same deflection frequency and a phase difference of half a cycle flow out from the jet outlet of the fluid oscillation structure.

3. The cascade fluid oscillation jet device according to claim 2, characterized in that: The fluid oscillation structure adopts a co-phase design, including two independent oscillation chambers with the same structure and four feedback channels, each of which includes an oscillation chamber inlet, a mixing chamber, an attachment wall, a channel return port, a channel inlet, a feedback channel and a jet outlet; The mixing chamber is communicated with the channel return port, the channel inlet and the jet outlet respectively; the two attachment walls are located on the left and right sides of the mixing chamber; the channel inlet is communicated with the channel return port through the feedback channel.

4. The cascade fluid oscillation jet device according to claim 2, characterized in that: The fluid vibration structure adopts an anti-phase design, including three feedback channels and two oscillation cavities with the same structure, one of which is used as a common feedback channel, and the two oscillation cavities are shared and connected through the common feedback channel; Each of the oscillation chambers comprises an oscillation chamber inlet, a mixing chamber, an attachment wall, a channel return port, a channel inlet, a feedback channel and a jet outlet; The common feedback channel includes a first middle attachment wall, a second middle attachment wall, a middle channel return port, a middle channel inlet, and a middle channel; The first middle attachment wall and the second middle attachment wall are located on both sides of the common feedback channel, the first middle attachment wall is located on one side of an oscillation cavity, and the second middle attachment wall is located on one side of another oscillation cavity. The middle channel inlet and the middle channel return port are connected through the middle channel.

5. The cascade fluid oscillation jet device according to any one of claims 1 to 4, characterized in that: When the number of vibration flow cavities is greater than two, the multiple vibration flow cavities are connected in parallel to the same flow splitting cavity.

6. The cascade fluid oscillation jet device according to any one of claims 1 to 4, characterized in that: The number of feedback channels of the in-phase design of the fluid oscillation structure is twice the number of the oscillation cavities, the number of feedback channels of the anti-phase design is the number of the oscillation cavities plus one, and the number of common feedback channels is one less than the number of the oscillation cavities.

7. The cascade fluid oscillation jet device according to claim 1, characterized in that: The thickness of the fins is equal to the wall thickness of the fluid oscillation structure, and the fins are arranged along the fluid flow direction.

8. The cascade fluid oscillation jet device according to claim 1, characterized in that: The bottom surface of the fluidic bottom plate is closely attached to the heat source surface of the heat generating chip through a thermal interface material with high thermal conductivity.

9. The cascade fluid oscillation jet device according to claim 1, characterized in that: A sealing ring groove is arranged on one side of the outlet cover plate, and two threaded holes for connecting with the jet bottom plate are arranged on the bottom.

10. The cascade fluid oscillation jet device according to claim 4, characterized in that: Part of the fluid entering the inlet of the middle channel flows through the middle channel and is divided into two flows, which simultaneously act on the main jets of the two mixing chambers, so that the deflection directions of the main jets in the two mixing chambers are opposite.

Citation Information

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