Automatic blanking stamping die for processing semiconductor lead frame

Abstract

The invention relates to the technical field of stamping, and provides an automatic blanking stamping die for semiconductor lead frame processing, which comprises a lower die main body, a rack, a first conveying belt, an upper die main body, a copper strip conveying roller, an overturning assembly, a conveying assembly and a deburring assembly, and further comprises a cover cylinder, a longitudinal channel and a horizontal guide rail which are arranged on the surface of the rack, according to the invention, not only can the stamped semiconductor lead frame be automatically adjusted from a horizontal state to a vertical state, but also the semiconductor lead frame in the vertical state can be automatically moved to the surface of the second conveying belt; on one hand, the two sets of grinding layers rotating reversely can be automatically controlled to remove burrs and flashes on the surface of a stamping hole or a notch of a workpiece, on the other hand, the machined workpiece can enter a discharging port more smoothly and rapidly, and the automatic turning device has the beneficial effects of being capable of achieving automatic turning, conveying double faces to be ground at the same time and achieving automatic discharging.

Description

Technical Field

[0001] The invention relates to the field of stamping technology, in particular to a stamping die for automatically unloading semiconductor lead frame processing. Background Art

[0002] The semiconductor lead frame is the carrier of the integrated circuit. It is a key structural component that uses metal to connect the internal circuit lead-out end of the chip with the external lead to form a loop. It serves as a bridge to connect with external wires. Lead frames are required in most semiconductor integrated blocks and are an important basic material in the electronic information industry.

[0003] After searching, the existing patent number CN116603920B discloses a semiconductor lead frame stamping and deburring integrated equipment, including a base, a stand is arranged at the rear of the base, a support platform is arranged on the stand, a top platform is arranged on the top of the stand, a hydraulic cylinder is arranged at the bottom of the top platform, the top rod of the hydraulic cylinder is connected to the punching template, a punching groove is arranged on the support platform, and a punching hole is arranged in the punching groove. When the rolling ball of the rolling mechanism rolls on the semiconductor lead frame semi-finished product, the rolling ball can roll in and out of each punching hole on the semiconductor lead frame semi-finished product. In this repeated process, the rolling ball passes through each punching hole and can quickly remove the burrs on the inner wall of the punching hole, thereby realizing rolling and throwing of the inner wall of the punching hole; there is no need to wind up the semiconductor lead frame semi-finished product and transport it to other locations for deburring treatment, that is, continuous and better deburring treatment can be achieved, reducing the operation process.

[0004] The above semiconductor lead frame stamping and deburring equipment still has the following defects in actual use: when the stamped semiconductor lead frame is a fixed-length copper strip, on the one hand, it is impossible to deburr it during the winding process, and on the other hand, it is impossible to automatically flip the semiconductor lead frame to perform double-sided polishing and deburring. The two surfaces can only be deburred in two times, which is a cumbersome operation. Summary of the invention

[0005] The object of the present invention is to provide a stamping die for processing a semiconductor lead frame with automatic unloading, aiming to solve the problems existing when using the existing semiconductor lead frame stamping and deburring integrated equipment.

[0006] To achieve the above object, the present invention provides the following technical solution: a stamping die for processing a semiconductor lead frame with automatic unloading, comprising a lower die body, a frame, a first conveyor belt, an upper die body and a copper belt conveyor roller, wherein the upper die body is installed above the lower die body, the lower die body and the frame are fixedly connected, the first conveyor belt and the copper belt conveyor roller are respectively located on both sides of the lower die body, the first conveyor belt and the copper belt conveyor roller are respectively connected to the frame and the lower die body, and further comprising: A cover cylinder, a longitudinal channel and a horizontal guide rail are arranged on the surface of the frame, wherein a longitudinal channel is arranged below the cover cylinder and is located on a side of the longitudinal channel close to the lower mold body; A flip assembly is arranged in the cover cylinder, the flip assembly includes a cross, a receiving cavity, a rotating shaft and a first transmission gear, the cross and the first transmission gear are both fixedly connected to the rotating shaft, the receiving cavity is arranged on the surface of the cross, and the cross is in sliding contact with the inner wall of the cover cylinder; A conveying assembly located below the longitudinal channel and the horizontal guide rail, the conveying assembly comprising a first roller, a second conveyor belt and a toothed belt, the second conveyor belt being slidably connected to two surfaces of the first roller, the first roller being rotatably connected to the surface of the frame, and the surface of the second conveyor belt being provided with a toothed belt; A driving assembly drivingly connected to the first transmission gear and the first roller shaft; The deburring components are symmetrically distributed on both sides of the horizontal guide rail, and the deburring components include a second roller, a grinding layer and a second transmission gear. The grinding layer and the second transmission gear are both fixedly connected to the second roller, the second roller is rotatably connected to the surface of the frame, and the toothed belt is transmission-connected to the second transmission gear.

[0007] As another embodiment of the present invention, the driving assembly includes a driving motor, a driving rod, a driving gear and a synchronous wheel. The driving motor is fixedly connected to the outer side of the cover tube, the driving rod is fixedly connected to the driving motor, the driving rod and the surface of the first roller shaft are fixedly connected with a synchronous wheel, a synchronous belt is slidably connected between the two synchronous wheels, the driving gear is movably sleeved on the surface of the driving rod, and the surfaces of the driving rod and the driving gear are respectively provided with a key bar and a key slot, the key bar is slidably connected to the key slot, and the first transmission gear is transmission connected to the driving gear.

[0008] As another embodiment of the present invention, the driving assembly also includes a magnetic ring, an electromagnet, a return spring and a limit ring, the magnetic ring is embedded in the surface of the driving gear, the electromagnet is fixedly connected to the outer side of the cover tube, the return spring is connected between the driving gear and the electromagnet, and the limit ring is fixedly connected to the driving rod.

[0009] As another embodiment of the present invention, when the electromagnet is magnetically fitted with the magnetic ring, the driving gear is disengaged from the first transmission gear, and when the return spring drives the driving gear to contact the surface of the limit ring, the first transmission gear is connected to the driving gear in a transmission manner.

[0010] As another embodiment of the present invention, the number of the horizontal guide rails is two groups, the horizontal guide rails on both sides are symmetrical about the workpiece, the workpiece is slidably connected in the horizontal guide rails on both sides, the polishing layer is in sliding contact with the surface of the workpiece, and the second rollers on both sides of the workpiece rotate in opposite directions.

[0011] As another embodiment of the present invention, the head end of the second conveyor belt is located directly below the longitudinal channel, the horizontal guide rail is horizontally connected to the longitudinal channel, and a feed discharge port is provided at the position of the horizontal guide rail located at the end of the second conveyor belt.

[0012] As another embodiment of the present invention, a limit plate and a support plate are fixedly connected to the surface of the frame, the limit plate is located above the first conveyor belt, and the support plate is in sliding contact with the lower surface of the second conveyor belt.

[0013] As another embodiment of the present invention, it also includes a cleaning nozzle fixedly connected to the frame, and two groups of the cleaning nozzles are symmetrically distributed on both sides of the deburring component.

[0014] As another embodiment of the present invention, it further comprises an infrared sensing module and a control panel, wherein the infrared sensing module is fixedly connected to the cover tube, and the infrared sensing module is communicatively connected to the control panel.

[0015] The beneficial effect of the present invention is that when the infrared sensing module detects that the semiconductor lead frame enters the cross, it can not only automatically adjust the stamped semiconductor lead frame from a horizontal state to a vertical state, but also automatically move the semiconductor lead frame in the vertical state to the surface of the second conveyor belt, and utilize the toothed belt on the surface of the second conveyor belt and the second transmission gear to connect the transmission. On the one hand, it can automatically control two sets of counter-rotating grinding layers to remove burrs and flash on the surface of the punching holes or cuts of the workpiece, and on the other hand, it can more smoothly and quickly move the processed workpiece into the unloading port, and has the characteristics of automatic flipping, simultaneous grinding of both sides and automatic unloading. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a stereogram of the present invention.

[0017] Figure 2 It is a stereoscopic diagram of the mold body and the frame according to an embodiment of the present invention.

[0018] Figure 3 It is a side view of the mold body and the frame according to an embodiment of the present invention.

[0019] Figure 4 It is a planar cross-sectional view of the lower mold body, the first conveyor belt, the upper mold body and the frame according to an embodiment of the present invention.

[0020] Figure 5 It is a three-dimensional diagram of a flip assembly according to an embodiment of the present invention.

[0021] Figure 6 It is an assembly diagram of the conveying component and the driving component according to an embodiment of the present invention.

[0022] Figure 7 For the present invention Figure 6A partial enlarged view of point a in the middle.

[0023] Figure 8 This is a perspective view of the deburring assembly of the embodiment of the present invention.

[0024] Fig. 9 Assembly drawings for flip assembly, deburring assembly, conveying assembly and driving assembly for embodiments of the present invention.

[0025] Fig.10 A cross-sectional view of the invention.

[0026] Fig.11 It is a horizontal cross-sectional view of the present invention.

[0027] Fig.12 It is a top view of the present invention.

[0028] Fig.13 It is a side view of the present invention.

[0029] Figure markings: 1-lower mold body, 2-frame, 21-limiting plate, 22-cover cylinder, 23-longitudinal channel, 24-support plate, 25-horizontal guide rail, 26-feeding port, 3-first conveyor belt, 4-upper mold body, 5-flipping assembly, 51-cross, 52-accommodating chamber, 53-rotating shaft, 54-first transmission gear, 6-driving assembly, 61-driving motor, 62-driving rod, 63-driving gear, 631-magnetic ring, 64-electromagnet, 65-reset spring, 66-limiting ring, 67-synchronous wheel, 7-conveyor assembly, 71-first roller, 72-second conveyor belt, 73-toothed belt, 74-synchronous belt, 8-deburring assembly, 81-second roller, 82-polishing layer, 83-second transmission gear, 9-cleaning nozzle, 10-copper belt conveyor roller, 11-workpiece, 12-infrared sensing module, 13-control panel. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0031] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0032] See also Figures 1 to 13In one embodiment of the present invention, a stamping die for processing a semiconductor lead frame with automatic unloading includes a lower die body 1, a frame 2, a first conveyor belt 3, an upper die body 4 and a copper belt conveyor roller 10, wherein the upper die body 4 is installed above the lower die body 1, the lower die body 1 and the frame 2 are fixedly connected, the first conveyor belt 3 and the copper belt conveyor roller 10 are respectively located on both sides of the lower die body 1, and the first conveyor belt 3 and the copper belt conveyor roller 10 are respectively connected to the frame 2 and the lower die body 1, and further includes: A cover cylinder 22, a longitudinal channel 23 and a horizontal guide rail 25 are arranged on the surface of the frame 2, wherein the longitudinal channel 23 is arranged below the cover cylinder 22, and the longitudinal channel 23 is located on a side of the longitudinal channel 23 close to the lower mold body 1; A flip assembly 5 is arranged in the cover tube 22, and the flip assembly 5 includes a cross 51, a receiving cavity 52, a rotating shaft 53 and a first transmission gear 54. The cross 51 and the first transmission gear 54 are both fixedly connected to the rotating shaft 53. The receiving cavity 52 is arranged on the surface of the cross 51, and the cross 51 is in sliding contact with the inner wall of the cover tube 22; A conveying assembly 7 located below the longitudinal channel 23 and the horizontal guide rail 25, the conveying assembly 7 comprising a first roller 71, a second conveying belt 72 and a toothed belt 73, the second conveying belt 72 being slidably connected to the surfaces of the two first rollers 71, the first roller 71 being rotatably connected to the surface of the frame 2, and the surface of the second conveying belt 72 being provided with a toothed belt 73; A driving assembly 6 connected to the first transmission gear 54 and the first roller shaft 71; The deburring assembly 75 is symmetrically distributed on both sides of the horizontal guide rail 25, and the deburring assembly 75 includes a second roller 81, a grinding layer 82 and a second transmission gear 83. The grinding layer 82 and the second transmission gear 83 are both fixedly connected to the second roller 81, the second roller 81 is rotatably connected to the surface of the frame 2, and the toothed belt 73 is transmission-connected to the second transmission gear 83.

[0033] See also Fig.11 and Fig.12 Furthermore, there are two groups of horizontal guide rails 25, and the horizontal guide rails 25 on both sides are symmetrical about the workpiece 11. The workpiece 11 is slidably connected in the horizontal guide rails 25 on both sides, and the polishing layer 82 is in sliding contact with the surface of the workpiece 11. The second rollers 81 on both sides of the workpiece 11 rotate in opposite directions.

[0034] See also Fig.11 and Fig.12Furthermore, the head end of the second conveyor belt 72 is located directly below the longitudinal channel 23, the horizontal guide rail 25 is horizontally connected to the longitudinal channel 23, and the horizontal guide rail 25 is located at the end of the second conveyor belt 72 and is provided with a discharge port 26, and a conveyor belt or a collection box is provided below the discharge port 26.

[0035] See also Figures 10 to 13 Furthermore, a limit plate 21 and a support plate 24 are fixedly connected to the surface of the frame 2, the limit plate 21 is located above the first conveyor belt 3, and the support plate 24 is in sliding contact with the lower surface of the second conveyor belt 72.

[0036] See also Fig.10 Furthermore, it also includes a cleaning nozzle 9 fixedly connected to the frame 2, and two groups of the cleaning nozzles 9 are symmetrically distributed on both sides of the deburring component 75.

[0037] In an embodiment of the present invention, the upper mold body 4 is composed of a cylinder and an upper mold body. The cylinder is used to control the upper mold body to perform stamping movement at a certain frequency. The horizontal guide rail 25 is limited from the upper and lower sides of the workpiece 11. The horizontal guide rail 25 will not cover the stamping holes on the surface of the semiconductor lead frame. The cleaning nozzle 9 is used to spray cleaning agent onto the surface of the workpiece 11. The support plate 24 is used to support the second conveyor belt 72 or the workpiece 11. The limiting plate 21 is used to prevent the workpiece 11 from shaking up and down, thereby ensuring that the workpiece 11 smoothly enters the accommodating cavity 52.

[0038] See also Figures 9 to 12 In one embodiment of the present invention, the driving assembly 6 includes a driving motor 61, a driving rod 62, a driving gear 63 and a synchronous wheel 67. The driving motor 61 is fixedly connected to the outer side of the cover tube 22, the driving rod 62 is fixedly connected to the driving motor 61, the driving rod 62 and the first roller shaft 71 are fixedly connected with a synchronous wheel 67 on the surface, and a synchronous belt 74 is slidably connected between the two synchronous wheels 67. The driving gear 63 is movably sleeved on the surface of the driving rod 62, and the surfaces of the driving rod 62 and the driving gear 63 are respectively provided with a key bar and a key groove, the key bar is slidably connected to the key groove, and the first transmission gear 54 is transmission-connected to the driving gear 63.

[0039] See also Fig. 9 and Fig.10 Furthermore, the driving assembly 6 also includes a magnetic ring 631, an electromagnet 64, a return spring 65 and a limit ring 66. The magnetic ring 631 is embedded in the surface of the driving gear 63, the electromagnet 64 is fixedly connected to the outer side of the cover tube 22, the return spring 65 is connected between the driving gear 63 and the electromagnet 64, and the limit ring 66 is fixedly connected to the driving rod 62.

[0040] See also Figure 1Furthermore, it also includes an infrared sensing module 12 and a control panel 13. The infrared sensing module 12 is fixedly connected to the cover tube 22. An angle sensor is provided on the surface of the rotating shaft 53. The infrared sensing module 12 and the angle sensor are both communicatively connected to the control panel 13.

[0041] In the embodiment of the present invention, when the electromagnet 64 is magnetically attached to the magnetic ring 631 , the driving gear 63 is disengaged from the first transmission gear 54 , and when the return spring 65 drives the driving gear 63 to contact the surface of the limiting ring 66 , the first transmission gear 54 is connected to the driving gear 63 in transmission.

[0042] Working principle: In the initial state, the driving motor 61 controls the rotation of the first roller 71 through the driving rod 62, the synchronous wheel 67 and the synchronous belt 74. The rotating first roller 71 drives the second conveyor belt 72 to move toward the unloading port 26. At the same time, the two sets of toothed belts 73 on the surface of the second conveyor belt 72 control the two sets of second rollers 81 to rotate in the opposite direction by means of transmission connection with the second transmission gear 83. The copper belt conveyor roller 10 automatically conveys the copper belt to the lower mold body 1. At the same time, the upper mold body 4 processes the copper belt into a fixed-length semiconductor lead frame (workpiece 11) through a stamping movement of a certain frequency. The first conveyor belt 3 automatically conveys the workpiece 11 horizontally to the accommodating cavity 52 on the surface of the cross 51. When the infrared sensing module 12 detects that the workpiece 11 passes by, the control panel 13 controls the electromagnet 64 to be powered off. Since the electromagnet 64 loses the magnetic attraction to the magnetic ring 631 after power failure, the elastic deformation of the reset spring 65 drives the driving gear 63 to fit with the limit ring 66. At this time, the driving gear 63 is connected to the first transmission gear 54 in transmission connection. Next, the driving gear 63 rotating with the driving rod 62 controls the rotating shaft 53 to rotate 90 degrees through the first transmission gear 54, and the control panel 13 controls the electromagnet 64 to be energized. The energized electromagnet 64 is magnetically attached to the magnetic ring 631. At this time, the driving gear 63 is disengaged from the first transmission gear 54. After the cross 51 rotates 90 degrees, on the one hand, the workpiece 11 is adjusted from a horizontal state to a vertical state, and on the other hand, the workpiece 11 in the vertical state slides along the longitudinal channel 23 to the surface of the second conveyor belt 72, and the second conveyor belt 72 drives the workpiece 11 to move horizontally into the horizontal guide rail 25. The horizontal guide rail 25 is limited from the upper and lower sides of the workpiece 11. The reversely rotating grinding layer 82 is used to remove burrs and flash on the surface of the punching hole or the cut of the workpiece 11 on the one hand, and on the other hand, the horizontal friction force generated by grinding is used to drive the workpiece 11 to move toward the unloading port 26, so that the processed workpiece 11 quickly enters the unloading port 26, realizing the functions of stamping, flipping, double-sided simultaneous deburring and automatic unloading of the semiconductor lead frame.

[0043] In summary, the present application utilizes a structural design in which a flipping component 5, a conveying component 7 and a deburring component 75 cooperate with each other. When the infrared sensing module 12 detects that the semiconductor lead frame has entered the cross 51, it can not only automatically adjust the stamped semiconductor lead frame from a horizontal state to a vertical state, but also automatically move the semiconductor lead frame in the vertical state to the surface of the second conveyor belt 72, and utilize the toothed belt 73 on the surface of the second conveyor belt 72 to be connected to the second transmission gear 83. On the one hand, it can automatically control two sets of counter-rotating polishing layers 82 to remove burrs and flash on the surface of the punching holes or cuts of the workpiece 11, and on the other hand, it can more smoothly and quickly bring the processed workpiece 11 into the unloading port 26, and has the characteristics of automatic flipping, simultaneous double-sided polishing and automatic unloading.

[0044] For those skilled in the art, although several embodiments and examples of the present invention have been described, these embodiments and examples are provided as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the main purpose of the invention.

[0045] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A stamping die for processing semiconductor lead frames with automatic unloading, comprising a lower die body (1), a frame (2), a first conveyor belt (3), an upper die body (4) and a copper belt conveyor roller (10), wherein the upper die body (4) is installed above the lower die body (1), the lower die body (1) and the frame (2) are fixedly connected, the first conveyor belt (3) and the copper belt conveyor roller (10) are respectively located on both sides of the lower die body (1), and the first conveyor belt (3) and the copper belt conveyor roller (10) are respectively connected to the frame (2) and the lower die body (1), characterized in that: Also includes: A cover cylinder (22), a longitudinal channel (23) and a horizontal guide rail (25) are arranged on the surface of the frame (2), wherein a longitudinal channel (23) is arranged below the cover cylinder (22), and the longitudinal channel (23) is located on a side of the longitudinal channel (23) close to the lower mold body (1); A flip assembly (5) is arranged in the cover cylinder (22), the flip assembly (5) comprising a cross (51), a receiving cavity (52), a rotating shaft (53) and a first transmission gear (54), the cross (51) and the first transmission gear (54) are both fixedly connected to the rotating shaft (53), the receiving cavity (52) is arranged on the surface of the cross (51), and the cross (51) is in sliding contact with the inner wall of the cover cylinder (22); A conveying assembly (7) located below the longitudinal channel (23) and the horizontal guide rail (25), the conveying assembly (7) comprising a first roller (71), a second conveying belt (72) and a toothed belt (73), the second conveying belt (72) being slidably connected to the surfaces of two of the first rollers (71), the first rollers (71) being rotatably connected to the surface of the frame (2), and the surface of the second conveying belt (72) being provided with a toothed belt (73); A driving assembly (6) drivingly connected to the first transmission gear (54) and the first roller shaft (71); A deburring assembly (75) is symmetrically distributed on both sides of the horizontal guide rail (25), the deburring assembly (75) comprising a second roller (81), a grinding layer (82) and a second transmission gear (83), the grinding layer (82) and the second transmission gear (83) are both fixedly connected to the second roller (81), the second roller (81) is rotationally connected to the surface of the frame (2), and the toothed belt (73) is transmission-connected to the second transmission gear (83).

2. The stamping die for automatically unloading semiconductor lead frame processing according to claim 1, characterized in that: The driving assembly (6) comprises a driving motor (61), a driving rod (62), a driving gear (63) and a synchronous wheel (67); the driving motor (61) is fixedly connected to the outer side of the cover tube (22); the driving rod (62) is fixedly connected to the driving motor (61); the driving rod (62) and the surface of the first roller shaft (71) are both fixedly connected with a synchronous wheel (67); a synchronous belt (74) is slidably connected between the two synchronous wheels (67); the driving gear (63) is movably sleeved on the surface of the driving rod (62); the surfaces of the driving rod (62) and the driving gear (63) are respectively provided with a key bar and a key groove; the key bar is slidably connected to the key groove; the first transmission gear (54) is transmission-connected to the driving gear (63).

3. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 2, characterized in that: The driving assembly (6) further comprises a magnetic ring (631), an electromagnet (64), a return spring (65) and a limit ring (66); the magnetic ring (631) is embedded in the surface of the driving gear (63); the electromagnet (64) is fixedly connected to the outer side of the cover tube (22); the return spring (65) is connected between the driving gear (63) and the electromagnet (64); and the limit ring (66) is fixedly connected to the driving rod (62).

4. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 3, characterized in that: When the electromagnet (64) and the magnetic ring (631) are magnetically attached, the driving gear (63) and the first transmission gear (54) are separated, and when the return spring (65) drives the driving gear (63) to contact the surface of the limiting ring (66), the first transmission gear (54) and the driving gear (63) are transmission-connected.

5. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 1, characterized in that: The number of the horizontal guide rails (25) is two groups, and the horizontal guide rails (25) on both sides are symmetrical about the workpiece (11) in the upper and lower directions. The workpiece (11) is slidably connected in the horizontal guide rails (25) on both sides, and the polishing layer (82) is in sliding contact with the surface of the workpiece (11). The second rollers (81) on both sides of the workpiece (11) rotate in opposite directions.

6. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 5, characterized in that: The head end of the second conveyor belt (72) is located directly below the longitudinal channel (23), the horizontal guide rail (25) is horizontally connected to the longitudinal channel (23), and a feed port (26) is provided at the position of the horizontal guide rail (25) located at the end of the second conveyor belt (72).

7. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 6, characterized in that: A limit plate (21) and a support plate (24) are fixedly connected to the surface of the frame (2); the limit plate (21) is located above the first conveyor belt (3); and the support plate (24) is in sliding contact with the lower surface of the second conveyor belt (72).

8. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 1, characterized in that: It also includes a cleaning nozzle (9) fixedly connected to the frame (2), and two groups of the cleaning nozzles (9) are symmetrically distributed on both sides of the deburring component (75).

9. The stamping die for processing semiconductor lead frames with automatic unloading according to claim 1, characterized in that: It also comprises an infrared sensing module (12) and a control panel (13), wherein the infrared sensing module (12) is fixedly connected to the cover tube (22), and the infrared sensing module (12) is communicatively connected to the control panel (13).

Images