Crystal bar rolling machining device and crystal bar rolling machining method

Abstract

The invention provides a crystal bar rolling machining device and method. The device comprises a crystal bar tail clamping assembly and a crystal bar tail rolling assembly. The crystal bar tail rounding assembly comprises a grinding unit and a rounding unit, wherein the grinding unit comprises a rotatable grinding wheel; the measuring end of the measuring unit faces the crystal bar and is used for measuring the distance from the measuring end to the surface of the crystal bar; the grinding unit and the measuring unit are both arranged on the moving unit, and the moving unit drives the grinding unit and the measuring unit to move in the axial direction and the radial direction of the crystal bar; the control unit is used for determining a tail grinding starting point according to the distance data measured by the measuring unit; the moving unit is controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel moves to the preset position in the radial direction of the crystal bar; and the moving unit is controlled to drive the grinding wheel to move in the axial direction and the radial direction of the crystal bar, and the grinding wheel is controlled to rotate so as to conduct rolling machining on the tail of the crystal bar. According to the crystal bar rolling machining device and method, the tail of the crystal bar can be subjected to rolling machining.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a crystal rod rounding processing device and a crystal rod rounding processing method. Background Art

[0002] In the semiconductor processing process, in order to ensure the quality of the crystal rod, it is necessary to sample and test the crystal rod. Some of the test items require taking slices from the tail of the crystal rod. However, the current rolling machine can only perform rounding processing on the body of the crystal rod, and the tail of the crystal rod is not rounded. When the tail of the crystal rod needs to be tested, slices can only be taken from the body of the crystal rod, resulting in loss of production capacity and yield. Summary of the invention

[0003] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a crystal rod rounding processing device and a crystal rod rounding processing method.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] In a first aspect, an embodiment of the present disclosure provides a crystal rod rounding processing device, including a crystal rod tail clamping assembly and a crystal rod tail rounding assembly; the crystal rod tail rounding assembly includes:

[0006] a grinding unit, comprising a rotatable grinding wheel;

[0007] A measuring unit, wherein a measuring end of the measuring unit faces the crystal rod and is used to measure a distance from the measuring end to a surface of the crystal rod;

[0008] A moving unit is provided on the crystal rod tail clamping assembly, the grinding unit and the measuring unit are both provided on the moving unit, and the moving unit is configured to drive the grinding unit and the measuring unit to move along the axial direction of the crystal rod and the radial direction of the crystal rod; and

[0009] A control unit, connected to the moving unit, the grinding unit and the measuring unit respectively;

[0010] Wherein, the control unit is used for:

[0011] Determining a tail grinding starting point according to the distance data measured by the measuring unit;

[0012] Controlling the moving unit to drive the grinding unit to move to the tail grinding starting point, and moving the grinding wheel to a preset position along the radial direction of the crystal rod;

[0013] The moving unit is controlled to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and the grinding wheel is controlled to rotate to perform rounding processing on the tail of the crystal rod.

[0014] Exemplarily, the mobile unit includes:

[0015] A first connecting platform is provided on the crystal rod tail clamping assembly;

[0016] A first moving mechanism provided on the first connecting platform comprises a first lead screw, a first driving member and a second connecting platform, wherein the first lead screw is arranged to extend along the axial direction of the crystal rod, and the second connecting platform is movable along the first lead screw under the driving of the first driving member;

[0017] a second moving mechanism disposed on the first connecting platform, the second moving mechanism comprising a second lead screw, a second driving member and a third connecting platform, the second lead screw extending along the radial direction of the crystal rod, and the third connecting platform being movable along the second lead screw under the driving of the second driving member;

[0018] Wherein, the grinding unit and the measuring unit are both arranged on the third connecting platform.

[0019] Exemplarily, the grinding unit further includes a third driving member, a driving wheel, a driven wheel and a transmission belt, wherein the transmission belt is drivingly connected between the driving wheel and the driven wheel, the driving wheel is rotatable under the drive of the third driving member, and the grinding wheel is drivingly connected to the driven wheel.

[0020] Exemplarily, the control unit is specifically used for:

[0021] Controlling the moving unit to drive the measuring unit to move along the axial direction of the crystal rod between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the main body of the crystal rod;

[0022] Acquire a correspondence between the distance data and the axial position of the crystal rod according to the distance data obtained during the movement of the measuring unit between the first axial position and the second axial position, wherein in the correspondence, a distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold;

[0023] The first position point is determined as the tail grinding starting point.

[0024] Exemplarily, the control unit is further used for:

[0025] Recording a first travel distance of the moving unit in the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point;

[0026] Determine, according to the first travel distance and the distance between the measuring unit and the grinding unit in the axial direction of the crystal rod, a second travel distance corresponding to the moving unit when the grinding unit is at the tail grinding starting point;

[0027] According to the second travel distance, the moving unit is controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel is moved to a preset position along the radial direction of the crystal rod.

[0028] Exemplarily, the control unit is further configured to:

[0029] When the moving unit drives the grinding unit to move to the starting point of the tail grinding and moves the grinding wheel to a preset position along the radial direction of the crystal rod, the grinding wheel is controlled to rotate, and according to the first preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the axial direction of the crystal rod to control the axial grinding length of the tail of the crystal rod; according to the second preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the radial direction of the crystal rod to control the grinding diameter of the tail of the crystal rod.

[0030] In a second aspect, an embodiment of the present disclosure further provides a method for rounding a crystal rod, which is applied to the crystal rod rounding device as described above, and the method comprises:

[0031] Determining a tail grinding starting point according to the distance data measured by the measuring unit;

[0032] Controlling the moving unit to drive the grinding unit to move to the tail grinding starting point, and moving the grinding wheel to a preset position along the radial direction of the crystal rod;

[0033] The moving unit is controlled to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and the grinding wheel is controlled to rotate to perform rounding processing on the tail of the crystal rod.

[0034] Exemplarily, determining the tail grinding starting point according to the distance data measured by the measuring unit specifically includes:

[0035] Controlling the moving unit to drive the measuring unit to move along the axial direction of the crystal rod between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the main body of the crystal rod;

[0036] Acquire, according to the distance data obtained by the measuring unit during the movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod, wherein in the correspondence, a distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold;

[0037] The first position point is determined as the tail grinding starting point.

[0038] Exemplarily, controlling the moving unit to drive the grinding unit to move to the tail grinding starting point, and moving the grinding wheel to a preset position along the radial direction of the crystal rod, specifically includes:

[0039] Recording a first travel distance of the moving unit in the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point;

[0040] Determine, according to the first travel distance and the distance between the measuring unit and the grinding unit in the axial direction of the crystal rod, a second travel distance corresponding to the moving unit when the grinding unit is at the tail grinding starting point;

[0041] According to the second travel distance, the moving unit is controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel is moved to a preset position along the radial direction of the crystal rod.

[0042] Exemplarily, controlling the moving unit to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and controlling the grinding wheel to rotate to perform rounding processing on the tail of the crystal rod specifically includes:

[0043] The grinding wheel is controlled to rotate, and according to a first preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the axial direction of the crystal rod to control the axial grinding length of the tail of the crystal rod; according to a second preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the radial direction of the crystal rod to control the grinding diameter of the tail of the crystal rod.

[0044] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0045] In the crystal ingot rounding processing device and the crystal ingot rounding processing method provided in the embodiments of the present disclosure, the tail of the crystal ingot can be rounded by arranging a crystal ingot tail rounding assembly on the crystal ingot tail clamping assembly, wherein the crystal ingot tail rounding assembly includes a grinding unit, a moving unit, a measuring unit and a control unit, the moving unit can drive the grinding unit and the measuring unit to move along the axial and radial directions of the crystal ingot, the measuring unit can measure the distance from its measuring end to the surface of the crystal ingot, the control unit can determine the starting point of the tail grinding of the crystal ingot based on the distance data measured by the measuring unit, and the grinding unit can move to the tail grinding starting point driven by the moving unit to round the crystal ingot.

[0046] In this way, based on the crystal rod rounding processing device and method provided in the embodiment of the present disclosure, the measuring unit can be used to measure and determine the starting point position of the tail grinding of the crystal rod, and the moving unit can be controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel can be moved to a preset position along the radial direction of the crystal rod; the moving unit can be controlled to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and the grinding wheel can be controlled to rotate to round the tail of the crystal rod, so that the tail of the crystal rod can be processed into an equal-diameter cylinder, and in the tail test item of the crystal rod, a slice can be taken directly from the tail of the crystal rod, thereby improving the measurement accuracy and reducing the loss of production capacity and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A structural front view showing a crystal rod rounding processing device provided in an embodiment of the present disclosure;

[0048] Figure 2 express Figure 1 Bottom view of . DETAILED DESCRIPTION

[0049] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0050] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0051] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0052] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0053] In the semiconductor processing process, since the current rolling machine can only roll the main body of the crystal rod, while the tail of the crystal rod is not rolled, in the project of testing the tail of the crystal rod, currently only slices can be taken from the main body of the crystal rod, which will cause yield loss.

[0054] In the current crystal ingot rounding processing device, the tail of the crystal ingot is clamped by the crystal ingot tail clamping assembly. The tail of the crystal ingot will be partially embedded in the crystal ingot tail clamping assembly. If the tail of the crystal ingot is to be rounded, it is necessary to round the part of the crystal ingot tail that is not embedded in the crystal ingot tail clamping assembly, so that the tail of the crystal ingot is processed into an equal-diameter cylindrical shape, and then take a slice from the tail to complete the tail test project.

[0055] However, due to the irregularity of the tail of the crystal rod, the length and diameter of the tail part that is not embedded in the crystal rod tail clamping assembly are unknown. If the tail of the crystal rod is to be processed, it is necessary to confirm the grinding starting point position of the tail of the crystal rod to determine the feed point of the grinding wheel.

[0056] Based on this, a crystal rod rounding processing device and a crystal rod rounding processing method are provided in the embodiments of the present disclosure, which can achieve the purpose of rounding the tail of the crystal rod, so as to facilitate the removal of slices from the tail of the crystal rod, complete the crystal rod tail test project, and reduce yield loss.

[0057] like Figure 1 and Figure 2 As shown, the crystal ingot rounding processing device provided in the embodiment of the present disclosure includes a crystal ingot tail clamping assembly 10 and a crystal ingot tail rounding assembly arranged on the crystal ingot tail clamping assembly 10 .

[0058] The crystal rod tail clamping assembly 10 is used to clamp the tail of the crystal rod 1 , and the crystal rod tail rounding assembly is used to round the tail of the crystal rod 1 .

[0059] Wherein, the crystal rod tail rounding assembly comprises:

[0060] A grinding unit 210, comprising a rotatable grinding wheel 211;

[0061] A measuring unit 220, wherein the measuring end of the measuring unit 220 faces the crystal ingot 1 and is used to measure the distance from the measuring end to the surface of the crystal ingot 1;

[0062] A moving unit 230 is provided on the crystal rod tail clamping assembly 10, the grinding unit 210 and the measuring unit 220 are both provided on the moving unit 230, and the moving unit 230 is configured to drive the grinding unit 210 and the measuring unit 220 to move along the axial direction X of the crystal rod 1 and the radial direction Y of the crystal rod 1; and

[0063] A control unit (not shown in the figure), connected to the moving unit 230, the grinding unit 210 and the measuring unit 220 respectively;

[0064] Wherein, the control unit is used for:

[0065] Determine the tail grinding starting point according to the distance data measured by the measuring unit 220;

[0066] Control the moving unit 230 to drive the grinding unit 210 to move to the tail grinding starting point, and move the grinding wheel 211 along the radial direction Y of the crystal rod 1 to a preset position;

[0067] The moving unit 230 is controlled to drive the grinding wheel 211 to move along the axial direction X and the radial direction Y of the crystal rod 1 , and the grinding wheel 211 is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod 1 .

[0068] In the above scheme, by arranging the crystal rod tail rounding assembly on the crystal rod tail clamping assembly 10, the tail of the crystal rod 1 can be rounded, wherein the crystal rod tail rounding assembly includes a grinding unit 210, a moving unit 230, a measuring unit 220 and a control unit, the moving unit 230 can drive the grinding unit 210 and the measuring unit 220 to move along the axial X and radial Y of the crystal rod 1, the measuring unit 220 can measure the distance from its measuring end to the surface of the crystal rod 1, the control unit can determine the starting point of the tail grinding of the crystal rod 1 based on the distance data measured by the measuring unit 220, the grinding unit 210 can be moved to the tail grinding starting point driven by the moving unit 230, and the crystal rod 1 can be rounded.

[0069] In this way, based on the crystal rod rounding processing device provided by the embodiment of the present disclosure, the measuring unit 220 can be used to measure and determine the starting point position of the tail grinding of the crystal rod 1, and the moving unit 230 can be controlled to drive the grinding unit 210 to move to the tail grinding starting point, and the grinding wheel 211 can be moved to a preset position along the radial direction Y of the crystal rod 1; the moving unit 230 can be controlled to drive the grinding wheel 211 to move along the axial direction X and radial direction Y of the crystal rod 1, and the grinding wheel 211 can be controlled to rotate to round the tail of the crystal rod 1, so that the tail of the crystal rod 1 can be processed into an equal-diameter cylinder, and in the tail test item of the crystal rod 1, a slice can be directly taken from the tail of the crystal rod 1, thereby improving the measurement accuracy and reducing the loss of production capacity yield.

[0070] In some embodiments, Figure 1 and Figure 2 As shown, the mobile unit 230 includes:

[0071] A first connecting platform 231 is provided on the crystal rod tail clamping assembly 10;

[0072] The first moving mechanism 232 provided on the first connecting platform 231 includes a first lead screw 2321, a first driving member 2322 and a second connecting platform 2323, wherein the first lead screw 2321 is arranged to extend along the axial direction X of the crystal rod 1, and the second connecting platform 2323 is movable along the first lead screw 2321 under the drive of the first driving member 2322;

[0073] a second moving mechanism 233 disposed on the first connecting platform 231, the second moving mechanism 233 comprising a second lead screw 2331, a second driving member 2332 and a third connecting platform 2333, the second lead screw 2331 extending along the radial direction Y of the crystal rod 1, and the third connecting platform 2333 being movable along the second lead screw 2331 under the drive of the second driving member 2332;

[0074] The grinding unit 210 and the measuring unit 220 are both disposed on the third connecting platform 2333 .

[0075] In the above scheme, the first moving mechanism 232 can realize the purpose of moving the grinding unit 210 and the measuring unit 220 along the axial direction X of the crystal rod 1, and the second moving mechanism 233 can realize the purpose of moving the grinding unit 210 and the measuring unit 220 along the radial direction Y of the crystal rod 1.

[0076] Specifically, the first connecting platform 231 serves as a supporting platform, which is mainly responsible for the connection with the crystal rod tail clamping assembly 10 and provides an extension platform for the first lead screw 2321 .

[0077] The first driving member 2322 can be implemented by a servo motor, etc., and the first screw 2321 can be implemented by a screw, etc. The first driving member 2322 drives the first screw to rotate so that the second connecting platform 2323 connected to the first screw 2321 moves along the first screw 2321, that is, moves along the axial direction X of the crystal rod 1.

[0078] The second driving member 2332 can be implemented by a servo motor, etc., and the second lead screw 2331 can be implemented by a lead screw, etc. The second driving member 2332 drives the second lead screw to rotate, so that the third connecting platform 2333 connected to the second lead screw 2331 moves along the second lead screw 2331, that is, moves along the radial direction Y of the crystal rod 1.

[0079] Since the measuring unit 220 and the grinding unit 210 are both mounted on the third connecting platform 2333, the movement of the measuring unit 220 and the grinding unit 210 along the axial direction X of the crystal rod 1 can be controlled by controlling the working state of the first driving member 2322, and the movement of the measuring unit 220 and the grinding unit 210 along the radial direction Y of the crystal rod 1 can be controlled by controlling the working state of the second driving member 2332.

[0080] It should be noted that the above is only an example of the structure of the mobile unit 230, and the implementation of the mobile unit 230 is not limited thereto.

[0081] Furthermore, in some embodiments, Figure 1 and Figure 2As shown, the grinding unit 210 also includes a third driving member 212, a driving wheel 213, a driven wheel 214 and a transmission belt 215, wherein the transmission belt 215 is transmission-connected between the driving wheel 213 and the driven wheel 214, the driving wheel 213 is rotatable under the drive of the third driving member 212, and the grinding wheel 211 is transmission-connected to the driven wheel 214.

[0082] By adopting the above solution, the third driving member 212 is used to drive the driving wheel 213 to rotate, thereby driving the transmission belt 215 to rotate, and the transmission belt 215 drives the driven wheel 214 to rotate, thereby realizing the rotation of the grinding wheel 211. The use of the transmission belt 215 to drive the grinding wheel 211 to rotate can provide a smooth transmission when the grinding wheel 211 is working, reduce vibration and noise, and is simple to maintain, with high transmission efficiency, ensuring the accuracy of transmission. However, it can be understood that in other embodiments, the specific structure of the grinding unit 210 is not limited to this.

[0083] In addition, in some embodiments, the measuring unit 220 may be a distance sensor.

[0084] A distance sensor is a component used to measure the distance between an object and a sensor. The distance sensor can be divided into many types, such as non-contact distance sensors, including ultrasonic sensors, laser sensors, infrared sensors, electromagnetic wave sensors, optical sensors, capacitive sensors, etc.

[0085] Among them, the laser sensor calculates the distance by emitting a laser beam and measuring the time it takes for the laser to reflect back. The rectilinear propagation characteristics of the laser beam make it highly accurate in long-distance measurement. The infrared sensor determines the distance by emitting infrared light and measuring the intensity or time of the reflected light. The ultrasonic sensor emits high-frequency sound waves (ultrasound waves), which are reflected back when they encounter obstacles. The sensor receives the reflected waves and calculates the distance to the obstacle based on the propagation time of the sound waves. The electromagnetic wave sensor uses electromagnetic waves (such as microwaves) to measure the distance. The sensor emits electromagnetic waves, which are reflected after encountering an object. The sensor receives the reflected waves and calculates the distance. The optical sensor determines the distance by measuring the intensity change or phase difference of light. The optical sensor can use light sources such as lasers and LEDs. The capacitive sensor determines the distance of an object by measuring the change in capacitance. The capacitance will change as the object approaches. For example, in some embodiments, the distance sensor in the embodiments of the present disclosure can use any suitable sensor such as a laser sensor or an infrared sensor.

[0086] In addition, the measuring unit 220 may also be a contact distance sensor. A contact distance sensor usually works through physical contact or contact sensing. For example, a mechanical contact distance sensor that relies on physical contact to measure distance, or an electrical signal distance sensor that feeds back distance information through an electrical signal.

[0087] In some exemplary embodiments, the control unit is specifically configured to:

[0088] Control the moving unit 230 to drive the measuring unit 220 to move along the axial direction X of the crystal ingot 1 between a first axial position corresponding to the tail of the crystal ingot 1 and a second axial position corresponding to the main body of the crystal ingot 1 ;

[0089] According to the distance data obtained by the measuring unit 220 during the movement between the first axial position and the second axial position, a corresponding relationship between the distance data and the axial X position of the crystal ingot 1 is obtained, wherein in the corresponding relationship, from the first position point to the second axial position, the distance difference in the corresponding distance data is within a threshold value;

[0090] The first position point is determined as the tail grinding starting point.

[0091] In the above scheme, when the tail grinding starting point is determined by the measuring unit 220, the measuring unit 220 can be driven by the moving unit 230 to move from the side where the tail of the crystal ingot 1 is located to the side where the main body of the crystal ingot 1 is located, that is, from the first axial position to the second axial position. In the above movement process, the measuring unit 220 will obtain a series of distance data, and this series of distance data is in a corresponding relationship with the axial X position of the crystal ingot 1. Since the diameter of the tail of the crystal ingot 1 gradually increases from the side away from the main body of the crystal ingot 1 to the side close to the main body of the crystal ingot 1, and the main body of the crystal ingot 1 has a constant diameter, therefore, in the above During the movement, in a series of distance data acquired by the measuring unit 220, when the measuring unit 220 is at the tail of the crystal rod 1, as the measuring unit 220 moves, the distance value gradually changes, and after the measuring unit 220 reaches the main body of the crystal rod 1, as the measuring unit 220 moves, the distance value remains unchanged (that is, the distance difference is within the threshold value). Therefore, the first axial X position point when the distance value remains unchanged can be found from the above series of distance data. The first axial X position point is the first position point, and the first position point is determined as the starting point of the tail grinding.

[0092] In some embodiments, exemplarily, the control unit is further configured to:

[0093] Recording a first travel distance of the moving unit 230 in the axial direction X of the crystal ingot 1 when the grinding unit 210 is at the tail grinding starting point;

[0094] Determine, according to the first travel distance and the distance between the measuring unit 220 and the grinding unit 210 in the axial direction X of the crystal ingot 1, a second travel distance corresponding to the moving unit 230 when the grinding unit 210 is at the tail grinding starting point;

[0095] According to the second travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move to the tail grinding starting point, and the grinding wheel 211 is moved along the radial direction Y of the crystal rod 1 to a preset position.

[0096] In the above scheme, after determining the starting point of the tail grinding, the first travel distance of the moving unit 230 in the axial direction X of the crystal rod 1 when the measuring unit 220 is at the starting point of the tail grinding can be recorded. Since the measuring unit 220 and the grinding unit 210 have a certain distance in the axial direction X of the crystal rod 1, the second travel distance corresponding to the moving unit 230 when the grinding unit 210 is exactly at the starting point of the tail grinding can be determined based on the first travel distance and the distance.

[0097] Specifically, when the measuring unit 220 is at the starting point of the tail grinding, the first travel distance of the moving unit 230 in the axial direction X of the crystal ingot 1 is X1, and when the grinding unit 210 is located at the side of the measuring unit 220 close to the tail of the crystal ingot 1 in the axial direction X of the crystal ingot 1, the distance between the grinding unit 210 and the measuring unit 220 in the axial direction X of the crystal ingot 1 is L, then it can be determined that when the grinding unit 210 is at the starting point of the tail grinding, the travel distance of the moving unit 230 in the axial direction X of the crystal ingot 1 is the second travel distance X2, X2 = X1 + L. Therefore, based on the second travel distance X2, the grinding unit 210 can be moved to the starting point of the tail grinding.

[0098] It should be noted that the distance between the grinding unit 210 and the measuring unit 220 in the axial direction X of the crystal rod 1 specifically refers to the distance between the contact point between the grinding wheel and the crystal rod 1 and the measuring unit 220 along the axial direction X of the crystal rod 1 .

[0099] After the grinding unit 210 is moved to the tail grinding starting point, the control unit may control the moving unit 230 to move the grinding wheel 211 to a preset position along the radial direction Y of the crystal ingot 1. For example, the grinding wheel 211 may be moved along the radial direction Y of the crystal ingot 1 to a position 2 mm away from the main surface of the crystal ingot 1. The preset position is not specifically limited.

[0100] In addition, in some exemplary embodiments, the control unit is further configured to:

[0101] When the moving unit 230 drives the grinding unit 210 to move to the starting point of the tail grinding and moves the grinding wheel 211 to a preset position along the radial direction Y of the crystal rod 1, the grinding wheel 211 is controlled to rotate, and according to the first preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the distance in the axial direction X of the crystal rod 1 to control the axial X grinding length of the tail of the crystal rod 1, and according to the second preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the distance in the radial direction Y of the crystal rod 1 to control the grinding diameter of the tail of the crystal rod 1.

[0102] By adopting the above scheme, in the process of processing the tail of the crystal ingot 1 by the grinding wheel 211, the grinding length of the tail of the crystal ingot 1 in the axial direction X is controlled by controlling the moving unit 230 to drive the grinding unit 210, and the grinding diameter of the tail of the crystal ingot 1 is controlled by controlling the moving unit 230 to drive the grinding unit 210 in the radial direction Y of the crystal ingot 1. After the tail of the crystal ingot 1 is ground to a predetermined specification, the grinding unit 210 can be driven by the moving unit 230 to return to the initial position.

[0103] In a second aspect, the embodiments of the present disclosure further provide a method for rounding a crystal rod, which is applied to the crystal rod rounding device provided in the embodiments of the present disclosure, and the method includes:

[0104] Determine the tail grinding starting point according to the distance data measured by the measuring unit 220;

[0105] Control the moving unit 230 to drive the grinding unit 210 to move to the tail grinding starting point, and move the grinding wheel 211 along the radial direction Y of the crystal rod 1 to a preset position;

[0106] The moving unit 230 is controlled to drive the grinding wheel 211 to move along the axial direction X and the radial direction Y of the crystal rod 1 , and the grinding wheel 211 is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod 1 .

[0107] Exemplarily, determining the tail grinding starting point according to the distance data measured by the measuring unit 220 specifically includes:

[0108] Control the moving unit 230 to drive the measuring unit 220 to move along the axial direction X of the crystal ingot 1 between a first axial position corresponding to the tail of the crystal ingot 1 and a second axial position corresponding to the main body of the crystal ingot 1 ;

[0109] According to the distance data obtained by the measuring unit 220 during the movement between the first axial position and the second axial position, a corresponding relationship between the distance data and the axial X position of the crystal ingot 1 is obtained, wherein a distance difference in the distance data corresponding to the first position point to the second axial position in the corresponding relationship is within a threshold value;

[0110] The first position point is determined as the tail grinding starting point.

[0111] Exemplarily, controlling the moving unit 230 to drive the grinding unit 210 to move to the tail grinding starting point, and moving the grinding wheel 211 to a preset position along the radial direction Y of the crystal rod 1 specifically includes:

[0112] Recording a first travel distance of the moving unit 230 in the axial direction X of the crystal ingot 1 when the grinding unit 210 is at the tail grinding starting point;

[0113] Determine, according to the first travel distance and the distance between the measuring unit 220 and the grinding unit 210 in the axial direction X of the crystal ingot 1, a second travel distance corresponding to the moving unit 230 when the grinding unit 210 is at the tail grinding starting point;

[0114] According to the second travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move to the tail grinding starting point, and the grinding wheel 211 is moved along the radial direction Y of the crystal rod 1 to a preset position.

[0115] Exemplarily, controlling the moving unit 230 to drive the grinding wheel 211 to move along the axial direction X and the radial direction Y of the crystal rod 1, and controlling the grinding wheel 211 to rotate to perform rounding processing on the tail of the crystal rod 1 specifically includes:

[0116] The grinding wheel 211 is controlled to rotate, and according to a first preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the crystal rod 1 in the axial direction X to control the axial X grinding length of the tail of the crystal rod 1; according to a second preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the crystal rod 1 in the radial direction Y to control the grinding diameter of the tail of the crystal rod 1.

[0117] Since the principle of solving the problem by the crystal rod rounding processing method is similar to the principle of solving the problem by the above-mentioned crystal rod rounding processing device, the embodiment of the crystal rod rounding processing method provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned crystal rod rounding processing device provided in the embodiment of the present disclosure, and will not be repeated here.

[0118] In addition, the embodiment of the present disclosure further provides a device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program. Since the above device can implement the above methods when its processor executes the computer program, similarly, the wafer tail rounding process can be completed.

[0119] In one embodiment, the present disclosure further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0120] The computer readable storage medium mentioned above implements the steps in the above-mentioned method embodiments when the computer program stored in its memory is executed by the processor. Similarly, the wafer tail rounding process can be automatically completed.

[0121] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0122] There are a few points to note:

[0123] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0124] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0125] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0126] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A crystal rod rounding processing device, characterized in that: It includes a crystal rod tail clamping component and a crystal rod tail rounding component; the crystal rod tail rounding component includes: a grinding unit, comprising a rotatable grinding wheel; A measuring unit, wherein a measuring end of the measuring unit faces the crystal rod and is used to measure a distance from the measuring end to a surface of the crystal rod; A moving unit is provided on the crystal rod tail clamping assembly, the grinding unit and the measuring unit are both provided on the moving unit, and the moving unit is configured to drive the grinding unit and the measuring unit to move along the axial direction of the crystal rod and the radial direction of the crystal rod; and A control unit, connected to the moving unit, the grinding unit and the measuring unit respectively; Wherein, the control unit is used for: Determining a tail grinding starting point according to the distance data measured by the measuring unit; Controlling the moving unit to drive the grinding unit to move to the tail grinding starting point, and moving the grinding wheel to a preset position along the radial direction of the crystal rod; The moving unit is controlled to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and the grinding wheel is controlled to rotate to perform rounding processing on the tail of the crystal rod.

2. The ingot rounding device according to claim 1, characterized in that: The mobile unit comprises: A first connecting platform is provided on the crystal rod tail clamping assembly; A first moving mechanism provided on the first connecting platform comprises a first lead screw, a first driving member and a second connecting platform, wherein the first lead screw is arranged to extend along the axial direction of the crystal rod, and the second connecting platform is movable along the first lead screw under the driving of the first driving member; a second moving mechanism disposed on the first connecting platform, the second moving mechanism comprising a second lead screw, a second driving member and a third connecting platform, the second lead screw being arranged to extend radially along the crystal rod, and the third connecting platform being movable along the second lead screw under the driving of the second driving member; Wherein, the grinding unit and the measuring unit are both arranged on the third connecting platform.

3. The crystal rod rounding device according to claim 1, characterized in that: The grinding unit also includes a third driving member, a driving wheel, a driven wheel and a transmission belt, wherein the transmission belt is drivingly connected between the driving wheel and the driven wheel, the driving wheel is rotatable under the drive of the third driving member, and the grinding wheel is drivingly connected to the driven wheel.

4. The ingot rounding device according to claim 1, characterized in that: The control unit is specifically used for: Controlling the moving unit to drive the measuring unit to move along the axial direction of the crystal rod between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the main body of the crystal rod; According to the distance data obtained by the measuring unit during the movement between the first axial position and the second axial position, a corresponding relationship between the distance data and the axial position of the crystal rod is obtained, wherein in the corresponding relationship, a distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold; The first position point is determined as the tail grinding starting point.

5. The crystal rod rounding device according to claim 4, characterized in that: The control unit is also specifically used for: Recording a first travel distance of the moving unit in the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point; Determine, according to the first travel distance and the distance between the measuring unit and the grinding unit in the axial direction of the crystal rod, a second travel distance corresponding to the moving unit when the grinding unit is at the tail grinding starting point; According to the second travel distance, the moving unit is controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel is moved to a preset position along the radial direction of the crystal rod.

6. The crystal rod rounding processing device according to claim 1, characterized in that: The control unit is also specifically used for: When the moving unit drives the grinding unit to move to the starting point of the tail grinding and makes the grinding wheel move to a preset position along the radial direction of the crystal rod, the grinding wheel is controlled to rotate; according to the first preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the axial direction of the crystal rod to control the axial grinding length of the tail of the crystal rod; according to the second preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the radial direction of the crystal rod to control the grinding diameter of the tail of the crystal rod.

7. A method for rounding a crystal rod, characterized in that: Applied to the ingot rounding processing device according to any one of claims 1 to 6, the method comprises: Determining a tail grinding starting point according to the distance data measured by the measuring unit; Controlling the moving unit to drive the grinding unit to move to the tail grinding starting point, and moving the grinding wheel to a preset position along the radial direction of the crystal rod; The moving unit is controlled to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and the grinding wheel is controlled to rotate to perform rounding processing on the tail of the crystal rod.

8. The method for rounding a crystal rod according to claim 7, characterized in that: Determining the tail grinding starting point according to the distance data measured by the measuring unit specifically includes: Controlling the moving unit to drive the measuring unit to move along the axial direction of the crystal rod between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the main body of the crystal rod; Acquire, according to the distance data obtained by the measuring unit during the movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod, wherein in the correspondence, a distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold; The first position point is determined as the tail grinding starting point.

9. The method for rounding a crystal rod according to claim 7, characterized in that: The controlling the moving unit drives the grinding unit to move to the tail grinding starting point, and moves the grinding wheel to a preset position along the radial direction of the crystal rod, specifically includes: Recording a first travel distance of the moving unit in the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point; Determine, according to the first travel distance and the distance between the measuring unit and the grinding unit in the axial direction of the crystal rod, a second travel distance corresponding to the moving unit when the grinding unit is at the tail grinding starting point; According to the second travel distance, the moving unit is controlled to drive the grinding unit to move to the tail grinding starting point, and the grinding wheel is moved to a preset position along the radial direction of the crystal rod.

10. The method for rounding a crystal rod according to claim 7, characterized in that: The controlling the moving unit to drive the grinding wheel to move along the axial direction and radial direction of the crystal rod, and controlling the grinding wheel to rotate so as to perform rounding processing on the tail of the crystal rod, specifically includes: The grinding wheel is controlled to rotate, and according to a first preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the axial direction of the crystal rod to control the axial grinding length of the tail of the crystal rod; according to a second preset travel distance, the moving unit is controlled to drive the grinding unit to move the distance in the radial direction of the crystal rod to control the grinding diameter of the tail of the crystal rod.

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