Automatic grinding equipment for semiconductor electrostatic chuck and grinding method of automatic grinding equipment

Abstract

The invention discloses automatic grinding equipment for a semiconductor electrostatic chuck and a grinding method of the automatic grinding equipment. An automatic polishing device for a semiconductor electrostatic chuck comprises a rotary table, the rotary table is arranged in a water tank, and the height of the rotary table is lower than the edge of the water tank; the device further comprises a fixing jig used for fixing the electrostatic chuck, and the fixing jig is detachably installed on the rotating table. A mounting base of the polishing robot is located on the periphery of the water tank, a force position compensator is mounted on a flange at the tail end of the polishing robot, the force position compensator is connected with the abrasive disc through a hook-and-loop fastener structure, and a hook-and-loop fastener matched with the hook-and-loop fastener structure is arranged on one side of the abrasive disc. The device further comprises an automatic abrasive disc feeding mechanism and an automatic waste abrasive disc uncovering mechanism. And the automatic waste abrasive disc uncovering mechanism is used for clamping the abrasive disc and loosening the abrasive disc to place the abrasive disc into the waste disc groove, and the waste disc groove is formed below the automatic waste abrasive disc uncovering mechanism. Automatic grinding of the electrostatic chuck is achieved.

Description

Technical Field

[0001] The invention relates to the field of mechanical technology, in particular to grinding equipment. Background Art

[0002] Electrostatic chuck Electrostatic chuck is one of the core components of semiconductor processing equipment (such as plasma etching chamber). During the etching process, the electrostatic chuck is prone to uneven surface polymer deposition.

[0003] Currently, commonly used cleaning processes often involve chemical immersion and physical grinding. Some parts with serious deposits require long-term manual grinding, which takes up a lot of manpower and is prone to unstable cleaning results.

[0004] Therefore, developing a highly automated, safe and stable electrostatic chuck special polishing equipment is of great significance to improving production efficiency and enhancing the stability of the cleaning process. Summary of the invention

[0005] In view of the problems existing in the prior art, the present invention provides an automatic polishing device for a semiconductor electrostatic chuck and a polishing method thereof to solve at least one of the above technical problems.

[0006] In order to achieve the above object, the present invention provides an automatic polishing device for a semiconductor electrostatic chuck, characterized in that it includes a rotating table, the rotating table is installed in a water tank, and the height of the rotating table is lower than the edge of the water tank;

[0007] It also includes a fixing fixture for fixing the electrostatic chuck, and the fixing fixture is detachably mounted on the rotating table;

[0008] It also includes a polishing robot, wherein the mounting base of the polishing robot is located at the periphery of the water tank, a force compensator is installed on the end flange of the polishing robot, the force compensator is connected to the grinding disc through a Velcro structure, and one side of the grinding disc is provided with a Velcro that matches the Velcro structure;

[0009] It also includes an automatic grinding disc replacement system, which includes an automatic grinding disc supply mechanism and an automatic removal mechanism for used grinding discs. The automatic grinding disc supply mechanism includes a lifting plate and a lifting mechanism for driving the lifting plate to rise and fall. The lifting mechanism drives the lifting plate to rise, thereby placing the uppermost grinding disc at a discharge height.

[0010] The waste grinding disc automatic removal mechanism is used to clamp the grinding disc and release it to place it into the waste disc slot. The waste disc slot is arranged below the waste grinding disc automatic removal mechanism.

[0011] It also includes an abrasive supply system, which includes an abrasive storage tank and a peristaltic pump. The abrasive storage tank is connected to a supply pipeline through the peristaltic pump, and the outlet of the supply pipeline is installed on the end flange of the polishing robot.

[0012] The invention realizes the automatic grinding of the electrostatic chuck.

[0013] It also includes a cleaning supply system, the cleaning supply system includes a flushing water pipe, and the flushing water pipe is arranged adjacent to the feed pipeline;

[0014] The outlet of the flushing water pipe is higher than the outlet of the feed pipeline;

[0015] The outlet of the feed pipeline is arranged adjacent to the outer edge of the grinding plate.

[0016] Further preferably, the rotating table is driven by a servo rotating platform, and the output speed of the rotating table is 80-120 rpm. The rotating table needs to be kept horizontal.

[0017] Further preferably, the fixing fixture comprises an annular structure, the inner wall of the annular structure is provided with a bridging platform for bridging the electrostatic chuck, and the annular structure and the bridging platform are provided with mutually conductive pick-and-place notches;

[0018] The lap joint platform is detachably mounted on the rotating platform by bolts;

[0019] A water seepage gap is provided at the bottom of the annular structure.

[0020] Further preferably, the automatic feeding mechanism for the grinding disc comprises a front limiting post, a rear limiting post, a left limiting post and a right limiting post for limiting the outer edge of the grinding disc;

[0021] The automatic grinding disc feeding mechanism also includes a fixed plate, and the front limiting column, the rear limiting column, the left limiting column and the right limiting column are installed on the front, rear, left and right sides of the fixed plate;

[0022] The fixing plate is provided with a guide seat.

[0023] The lifting plate is installed above the fixed plate, and the front, rear, left, and right sides of the lifting plate are provided with notches for avoiding the front limit column, the rear limit column, the left limit column, and the right limit column. The lifting plate is threadedly connected with a guide column that is slidably connected to the guide seat;

[0024] The lifting mechanism is installed on the fixed plate, and the telescopic end of the lifting mechanism is connected to the lifting plate.

[0025] It is convenient to achieve the stability of lifting.

[0026] Further preferably, four guide columns are provided, and the bottoms of the four guide columns are connected to the linkage ring.

[0027] Further preferably, the front limiting column and the rear limiting column are arranged in front-to-back mirror symmetry;

[0028] The left limiting column and the right limiting column are arranged in a left-right mirror-symmetrical manner;

[0029] The front limiting column and the rear limiting column are used to limit the long side of the grinding plate;

[0030] The left limiting column and the right limiting column are used to limit the short side of the grinding plate;

[0031] The left limiting column is a cylindrical structure;

[0032] The front limiting column includes a vertically arranged limiting plate and a mounting base, wherein a vertically arranged reinforcing rib is connected between the limiting plate and the mounting base, and the limiting plate and the reinforcing rib are connected to form a T-shaped structure with a T-shaped cross section.

[0033] Further preferably, the automatic grinding sheet feeding mechanism is provided with two, and the two automatic grinding sheet feeding mechanisms are arranged front and back;

[0034] The waste grinding disc automatic removal mechanism is located in front of all the grinding disc automatic supply mechanisms.

[0035] Further preferably, the automatic removal mechanism for waste grinding discs comprises a separation insert for inserting into the connection of the Velcro structure and a clamping telescopic cylinder;

[0036] The separation insert and the telescopic end of the clamping telescopic cylinder clamp the grinding plate.

[0037] When in use, the polishing robot sets the grinding disc vertically and inserts the separation insert horizontally, and the separation insert pre-separates the end of the Velcro structure;

[0038] The clamping telescopic cylinder extends to clamp the grinding disc, and the polishing robot drives the end flange to move forward to separate the grinding disc from the polishing robot;

[0039] The clamping telescopic cylinder is shortened and the grinding disc naturally falls into the waste disc slot.

[0040] More preferably, it further comprises a cabinet, in which a water tank and an operating table are installed, and the grinding robot, the automatic grinding supply mechanism and the automatic removal mechanism of the waste grinding plates are installed;

[0041] A visual window is installed on the side wall of the cabinet;

[0042] A take-in / put-out opening is provided on the front side of the cabinet, and an induction grating is installed on the take-in / put-out opening.

[0043] Once the inductive grating knows that the pick-up and place port is performing a pick-up and place operation, the movement of the grinding robot and the rotating table is avoided.

[0044] A method for polishing a semiconductor electrostatic chuck using an automatic polishing device, characterized in that it comprises the following steps:

[0045] Step 1: Install a fixed fixture, and install the electrostatic chuck to be polished on the fixed fixture;

[0046] Step 2, setting the rotation parameters of the rotating table and the motion parameters of the grinding robot during grinding, the rotation parameters including the rotation time, rotation speed and rotation direction of the rotating table;

[0047] The motion parameters include the speed and number of times that the grinding robot drives the grinding plate to move radially from the inside to the outside relative to the rotating table;

[0048] Step 3: The grinding robot moves to the grinding automatic feeding mechanism, moves vertically downward, and sticks the grinding wheel to the grinding wheel through the Velcro structure;

[0049] Step 4: The grinding robot moves to the rotating table, the rotating table rotates, and the grinding plate moves radially from inside to outside to perform grinding;

[0050] Step 5: After the grinding is completed, the grinding robot moves to the waste grinding disc automatic removal mechanism, and the waste grinding disc automatic removal mechanism removes the grinding disc and throws it into the waste disc slot;

[0051] Step 6: The grinding robot moves to the grinding station.

[0052] Beneficial effects:

[0053] The present invention provides an automatic grinding device for a semiconductor electrostatic chuck. A product rotating table is installed in a water tank to prevent abrasive splashing. A jig adapted to the electrostatic chuck model can be installed on the rotating table for product fixing. The grinding disc can be automatically replaced. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 A structural schematic diagram of the present invention;

[0055] Figure 2 It is a structural schematic diagram of the present invention from another perspective;

[0056] Figure 3 It is a schematic diagram of the local structure of the present invention;

[0057] Figure 4 It is a schematic diagram of the local structure of the rotating table of the present invention;

[0058] Figure 5 It is a schematic diagram of the local structure of the rotating table of the present invention;

[0059] Figure 6 It is a structural schematic diagram of the automatic removal mechanism for waste grinding discs of the present invention;

[0060] Figure 7 It is a structural schematic diagram of the automatic feeding mechanism of the grinding disc of the present invention;

[0061] Figure 8 It is a structural schematic diagram of the automatic feeding mechanism of the grinding disc of the present invention in a state where the grinding disc is hidden;

[0062] Fig. 9 This is an exploded view of the automatic feeding mechanism for grinding discs of the present invention;

[0063] Fig.10 It is a structural schematic diagram of the automatic feeding mechanism of the grinding disc of the present invention.

[0064] Among them: 1 is a rotating table, 2 is a water tank, 3 is a fixed fixture, 4 is a polishing robot, 41 is a force compensator, 42 is a grinding disc, 43 is a feeding pipeline, 5 is an automatic removal mechanism for waste grinding discs, 51 is a separation insert, 52 is a clamping telescopic cylinder, 6 is an automatic feeding mechanism for grinding discs, 61 is a front limit column, 62 is a left limit column, 63 is a guide column, 64 is a lifting mechanism, 65 is a linkage ring, 66 is a lifting plate, 67 is a first position sensor, 68 is a second position sensor, and 69 is a third position sensor. DETAILED DESCRIPTION

[0065] The present invention will be further described below in conjunction with the accompanying drawings.

[0066] See also Figures 1 to 10, Specific embodiment 1: An automatic polishing device for a semiconductor electrostatic chuck, comprising a rotating table 1, the rotating table 1 is installed in a water tank 2, the height of the rotating table 1 is lower than the edge of the water tank 2; it also includes a fixing fixture 3 for fixing the electrostatic chuck, the fixing fixture 3 is detachably installed on the rotating table 1; it also includes a polishing robot 4, the mounting base of the polishing robot 4 is located at the periphery of the water tank 2, the end flange of the polishing robot 4 is installed with a force compensator 41, the force compensator 41 is connected to the grinding disc 42 through a Velcro structure, and one side of the grinding disc 42 is provided with Velcro matching the Velcro structure; it also includes an automatic grinding disc replacement system, the grinding disc is automatically replaced The replacement system includes an automatic grinding sheet supply mechanism 6 and an automatic waste grinding sheet removal mechanism 5. The automatic grinding sheet supply mechanism 6 includes a lifting plate and a lifting mechanism 64 that drives the lifting plate to rise and fall. The lifting mechanism 64 drives the lifting plate to rise, thereby placing the top grinding sheet at the discharge height; the automatic waste grinding sheet removal mechanism 5 is used to clamp the grinding sheet and release the grinding sheet to place it in the waste sheet slot. The waste sheet slot is arranged below the automatic waste grinding sheet removal mechanism 5; and also includes an abrasive supply system, which includes an abrasive storage tank and a peristaltic pump. The abrasive storage tank is connected to a feed pipeline 43 through the peristaltic pump, and the outlet of the feed pipeline 43 is installed on the end flange of the polishing robot 4. The present invention realizes the automatic grinding of the electrostatic chuck.

[0067] It also includes a cleaning supply system, which includes a flushing water pipe, which is arranged adjacent to the supply pipeline 43; the outlet of the flushing water pipe is higher than the outlet of the supply pipeline 43; the outlet of the supply pipeline 43 is arranged adjacent to the outer edge of the grinding plate.

[0068] The rotating table 1 is driven by a servo rotating platform, and the output speed of the rotating table 1 is 80~120rpm. The rotating table 1 needs to be kept horizontal.

[0069] The fixing fixture 3 includes an annular structure, the inner wall of which is provided with a bridging platform for bridging the electrostatic suction cup, and the annular structure and the bridging platform are provided with mutually conductive pick-up and drop-out notches; the bridging platform is detachably mounted on the rotating table 1 by bolts; and a water seepage notch is provided at the bottom of the annular structure.

[0070] The automatic feeding mechanism 6 of the grinding disc includes a front limit column 61, a rear limit column, a left limit column 62 and a right limit column for limiting the outer edge of the grinding disc; the automatic feeding mechanism 6 of the grinding disc also includes a fixed plate, and the front limit column 61, the rear limit column, the left limit column 62 and the right limit column are installed on the front, rear, left and right sides of the fixed plate; a guide seat is installed on the fixed plate, and a lifting plate 66 is installed above the fixed plate. The lifting plate 66 is provided with gaps on the front, rear, left and right sides to avoid the front limit column 61, the rear limit column, the left limit column 62 and the right limit column, and the lifting plate 66 is threadedly connected with a guide column 63 that is slidably connected to the guide seat; a lifting mechanism 64 is installed on the fixed plate, and the telescopic end of the lifting mechanism 64 is connected to the lifting plate 66. It is convenient to achieve the stability of lifting. Magic sticky is fixed on the upper side of the grinding disc 42. The grinding discs are stacked from bottom to top between the front limit column 61, the rear limit column, the left limit column 62 and the right limit column.

[0071] Four guide posts 63 are provided, and the bottoms of the four guide posts 63 are connected to the linkage ring 65 .

[0072] The front limit column 61 and the rear limit column are arranged in front-to-back mirror symmetry; the left limit column 62 and the right limit column are arranged in left-to-right mirror symmetry; the front limit column 61 and the rear limit column are used to limit the long side of the grinding plate; the left limit column 62 and the right limit column are used to limit the short side of the grinding plate; the left limit column 62 is a cylindrical structure; the front limit column 61 includes a vertically arranged limit plate and a mounting base, and the limit plate and the mounting base are connected with a vertically arranged reinforcing rib, and the limit plate and the reinforcing rib are connected to form a T-shaped structure with a T-shaped cross section.

[0073] See also Fig.10 The lifting mechanism is a telescopic rod, which includes a fixed portion and a telescopic rod portion connected in a sliding manner. The fixed portion is sequentially installed with a first position sensor 67, a second position sensor 68 and a third position sensor 69 for sensing the position of the linkage ring 65 along the length direction from the side away from the lifting plate to the side adjacent to the lifting plate. The first position sensor is used to trigger in-situ sensing, the second position sensor is used to trigger a material shortage alarm, and the third position sensor is used to trigger a material shortage stop.

[0074] When the telescopic rod is in the shortened initial position, the first position sensor senses the linkage ring 65. At this time, the grinding discs are stacked on the top of the lifting plate from bottom to top in sequence and are in a full state.

[0075] When the telescopic rod is continuously extended to lift the grinding disc upward, when the second position sensor senses the linkage ring, the second position sensor transmits a signal to the PLC system, and the PLC system performs alarm processing, and the alarm reminds the operator to add material in spare time.

[0076] When the telescopic rod is continuously extended to lift the abrasive disc upward, when the third position sensor 69 senses the linkage ring, that is, when the remaining material is used up, it reminds that there is a shortage of material and stops the feeding operation. The polishing robot 4 switches to another automatic abrasive disc feeding mechanism 6 to obtain the abrasive disc. When the third position sensor senses the linkage ring, the telescopic rod is in the maximum extension state.

[0077] The distance between the second position sensor and the third position sensor is greater than the thickness of at least two grinding plates.

[0078] There are two automatic grinding sheet supply mechanisms 6 , which are arranged front and back; the automatic removal mechanism 5 for waste grinding sheets is located in front of all the automatic grinding sheet supply mechanisms 6 .

[0079] The mechanism 5 for automatically removing the waste abrasive discs includes a separation insert 51 for inserting into the connection of the Velcro structure and a clamping telescopic cylinder 52; the separation insert 51 and the telescopic end of the clamping telescopic cylinder 52 clamp the abrasive disc. When in use, the polishing robot 4 sets the abrasive disc vertically, inserts the separation insert 51 horizontally, and the separation insert 51 pre-separates the end of the Velcro structure; the clamping telescopic cylinder 52 extends to clamp the abrasive disc, and the polishing robot 4 drives the end flange to move forward to separate the abrasive disc from the polishing robot 4; the clamping telescopic cylinder 52 shortens, and the abrasive disc naturally falls to the waste disc slot.

[0080] It also includes a cabinet, in which a water tank 2 and an operating table are installed at the front and back. A grinding robot, an automatic grinding supply mechanism 6 and an automatic removal mechanism 5 for waste grinding plates are installed on the operation; a visual window is installed on the side wall of the cabinet; a take-in and put-out port is opened on the front side of the cabinet, and an induction grating is installed on the take-in and put-out port.

[0081] Once the inductive grating learns that the material picking and placing operation is being performed at the pick-up and placement port, the movement of the grinding robot and the rotating table 1 is avoided.

[0082] A method for polishing a semiconductor electrostatic chuck using an automatic polishing device comprises the following steps:

[0083] Step 1: Install a fixed fixture 3, and install the electrostatic chuck to be polished on the fixed fixture 3;

[0084] Step 2, setting the rotation parameters of the rotating table 1 and the motion parameters of the grinding robot during grinding, the rotation parameters including the rotation time, rotation speed and rotation direction of the rotating table 1;

[0085] The motion parameters include the speed and number of times that the grinding robot drives the grinding plate to move radially from inside to outside relative to the rotating table 1;

[0086] Step 3: The grinding robot moves to the grinding automatic feeding mechanism 6, and moves vertically downward to pick up the grinding wheel through the Velcro structure;

[0087] Step 4: the grinding robot moves to the rotating table 1, the rotating table 1 rotates, and the grinding plate moves from inside to outside in the radial direction to perform grinding;

[0088] Step 5: After the grinding is finished, the grinding robot moves to the waste grinding automatic removal mechanism 5, and the waste grinding automatic removal mechanism 5 removes the grinding disc and throws it into the waste disc slot;

[0089] Step 6: The grinding robot moves to the grinding station.

[0090] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An automatic polishing device for a semiconductor electrostatic chuck, characterized in that: It includes a rotating table, which is installed in a water tank, and the height of the rotating table is lower than the edge of the water tank; It also includes a fixing fixture for fixing the electrostatic chuck, and the fixing fixture is detachably mounted on the rotating table; It also includes a polishing robot, wherein the mounting base of the polishing robot is located at the periphery of the water tank, a force compensator is installed on the end flange of the polishing robot, the force compensator is connected to the grinding disc through a Velcro structure, and one side of the grinding disc is provided with a Velcro that matches the Velcro structure; It also includes an automatic grinding disc replacement system, which includes an automatic grinding disc supply mechanism and an automatic removal mechanism for used grinding discs. The automatic grinding disc supply mechanism includes a lifting plate and a lifting mechanism for driving the lifting plate to rise and fall. The lifting mechanism drives the lifting plate to rise, thereby placing the uppermost grinding disc at a discharge height. The waste grinding disc automatic removal mechanism is used to clamp the grinding disc and release it to place it into the waste disc slot. The waste disc slot is arranged below the waste grinding disc automatic removal mechanism. It also includes an abrasive supply system, which includes an abrasive storage tank and a peristaltic pump. The abrasive storage tank is connected to a supply pipeline through the peristaltic pump, and the outlet of the supply pipeline is installed on the end flange of the polishing robot.

2. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: It also includes a cleaning supply system, the cleaning supply system includes a flushing water pipe, and the flushing water pipe is arranged adjacent to the feed pipeline; The outlet of the flushing water pipe is higher than the outlet of the feed pipeline; The outlet of the feed pipeline is arranged adjacent to the outer edge of the grinding plate.

3. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: The rotating table is driven by a servo rotating platform, and the output rotation speed of the rotating table is 80-120 rpm.

4. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: The fixing fixture comprises an annular structure, the inner wall of the annular structure is provided with a bridging platform for bridging the electrostatic chuck, and the annular structure and the bridging platform are provided with mutually conductive pick-and-place notches; The lap joint platform is detachably mounted on the rotating platform by bolts; A water seepage gap is provided at the bottom of the annular structure.

5. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: The automatic feeding mechanism for the grinding disc comprises a front limiting post, a rear limiting post, a left limiting post and a right limiting post for limiting the outer edge of the grinding disc; The automatic grinding disc feeding mechanism also includes a fixed plate, and the front limiting column, the rear limiting column, the left limiting column and the right limiting column are installed on the front, rear, left and right sides of the fixed plate; The fixing plate is provided with a guide seat. The lifting plate is installed above the fixed plate, and the front, rear, left, and right sides of the lifting plate are provided with notches for avoiding the front limit column, the rear limit column, the left limit column, and the right limit column. The lifting plate is threadedly connected with a guide column that is slidably connected to the guide seat; The lifting mechanism is installed on the fixed plate, and the telescopic end of the lifting mechanism is connected to the lifting plate.

6. The automatic polishing device for a semiconductor electrostatic chuck according to claim 5, characterized in that: The guide columns are provided with four, and the bottoms of the four guide columns are connected with the linkage ring.

7. The automatic polishing device for a semiconductor electrostatic chuck according to claim 5, characterized in that: The front limiting column and the rear limiting column are arranged in front-to-back mirror symmetry; The left limiting column and the right limiting column are arranged in a left-right mirror-symmetrical manner; The front limiting column and the rear limiting column are used to limit the long side of the grinding plate; The left limiting column and the right limiting column are used to limit the short side of the grinding plate; The left limiting column is a cylindrical structure; The front limiting column includes a vertically arranged limiting plate and a mounting base, a vertically arranged reinforcing rib is connected between the limiting plate and the mounting base, and the limiting plate and the reinforcing rib are connected to form a T-shaped structure with a T-shaped cross section.

8. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: The automatic grinding sheet supply mechanism is provided with two, and the two automatic grinding sheet supply mechanisms are arranged front and back; The waste grinding disc automatic removal mechanism is located in front of all the grinding disc automatic supply mechanisms.

9. The automatic polishing device for a semiconductor electrostatic chuck according to claim 1, characterized in that: The automatic removal mechanism for waste grinding discs comprises a separation insert for inserting into the connection of the Velcro structure and a clamping telescopic cylinder; The separation insert and the telescopic end of the clamping telescopic cylinder clamp the grinding disc; When in use, the polishing robot sets the grinding disc vertically and inserts the separation insert horizontally, and the separation insert pre-separates the end of the Velcro structure; The clamping telescopic cylinder extends to clamp the grinding disc, and the polishing robot drives the end flange to move forward to separate the grinding disc from the polishing robot; The clamping telescopic cylinder is shortened and the grinding disc naturally falls into the waste disc slot.

10. The method for polishing a semiconductor electrostatic chuck using an automatic polishing device according to claim 1, characterized in that: The following steps are included: Step 1: Install a fixed fixture, and install the electrostatic chuck to be polished on the fixed fixture; Step 2, setting the rotation parameters of the rotating table and the motion parameters of the grinding robot during grinding, the rotation parameters including the rotation time, rotation speed and rotation direction of the rotating table; The motion parameters include the speed and number of times that the grinding robot drives the grinding plate to move radially from the inside to the outside relative to the rotating table; Step 3: The grinding robot moves to the grinding automatic feeding mechanism, moves vertically downward, and sticks the grinding wheel to the grinding wheel through the Velcro structure; Step 4: The grinding robot moves to the rotating table, the rotating table rotates, and the grinding plate moves radially from inside to outside to perform grinding; Step 5: After the grinding is completed, the grinding robot moves to the waste grinding disc automatic removal mechanism, and the waste grinding disc automatic removal mechanism removes the grinding disc and throws it into the waste disc slot; Step 6: The grinding robot moves to the grinding station.

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