Control method and control system for automatic tool setting and alignment in silicon wafer cutting

Abstract

The invention provides a control method and a control system for automatic tool setting and alignment in silicon wafer cutting. The control method comprises the following steps: an original point calibration step; setting tool setting parameters; a cutting point calibration step: a point formed by the tool setting parameters in the coordinate system is a cutting point and is marked as A, and the coordinate of A is (L, H); a reference point calibration step: a reference point is calibrated above the cutting assembly and at a second preset position, the reference point is marked as B, and the coordinate of the B is (x, y); a reference point and cutting point distance calculation step: through the original point O (0, 0), the cutting point A (L, H) and the reference point B (x, y), the distance M between the reference point and the cutting point in the horizontal direction can be determined to be x-L; the distance N in the vertical direction is y-H; and moving the silicon rod for tool setting. According to the silicon rod cutting device, the silicon rod cutting precision is improved, the working intensity of operators is reduced, and the working efficiency is improved; in addition, the utilization rate of silicon materials is improved, and batch quality abnormity caused by too large tool setting errors is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of silicon rod cutting, and in particular to a control method and a control system for automatic tool alignment in silicon wafer cutting. Background Art

[0002] The knife needs to be set before the silicon rod starts cutting. The knife setting requires that the two ends of the silicon rod should not exceed 1.5mm beyond the wire mesh, and the starting height of cutting should not be greater than 1mm from the wire mesh plane.

[0003] The existing specific operations are as follows: Silicon rod clamping steps: feed the silicon rod into the machine room - clamp the spindle clamping device. Horizontal direction (X axis) tool setting steps: feed the spindle downward - visually check that the lower surface of the silicon rod is 3-5mm away from the wire mesh and stop feeding - move the silicon rod left and right - the end face of the silicon rod exceeds the wire mesh by 1-1.5mm - click to confirm. Vertical direction (Z axis) tool setting steps: feed the spindle downward - visually check that the lower surface of the silicon rod is 1mm away from the wire mesh and stop feeding - click the control panel to return to zero.

[0004] However, the above method has the following shortcomings: if the employee does not operate properly in the vertical direction (z-axis) when setting the knife, the silicon rod will press down on the wire mesh and the entire wire mesh will be broken; in addition, if the silicon rod contacts the wire mesh, abnormalities such as twisting wire / cutting thickness / cutting surface scratches will occur when the machine is turned on. If the employee does not operate properly in the horizontal direction (X-axis) when setting the knife, and the margin is greater than 1.5mm, silicon material will be wasted (1mm thickness is about 5-6 silicon wafers); if the margin is less than 1mm, the edge skin at both ends will easily fall off during the cutting process, which will cause the cutting to be interrupted due to breaking the wire mesh. In addition, the above operation process requires high precision, and currently it depends entirely on manual observation, which cannot guarantee the accuracy of the knife setting. When the gap between the silicon rod and the wire mesh is greater than 1mm, the steel wire cutting force is wasted, and there is also the risk of scratching the cutting surface.

[0005] Therefore, there is an urgent need for a control method and a control system for automatic tool alignment for silicon wafer cutting, which can solve the technical problems existing in the prior art to a certain extent. Summary of the invention

[0006] The purpose of this application is to provide a control method and control system for automatic tool alignment for silicon wafer cutting, which improves the cutting accuracy of silicon rods to a certain extent and reduces the workload of operators; in addition, it improves the utilization rate of silicon materials and reduces batch quality abnormalities caused by excessive tool alignment errors.

[0007] Calibration through origin, cutting point and reference point.

[0008] The present application provides a control method for automatic tool alignment for silicon wafer cutting, comprising the following steps:

[0009] Origin calibration step: calibrate the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system;

[0010] The tool setting parameter setting step is as follows: the lengths of both ends of the silicon rod along the length direction that extend beyond the both ends of the cutting part of the cutting assembly along the length direction are both L; the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod is H;

[0011] Cutting point calibration step: the tool setting parameters form a point in the coordinate system as a cutting point, denoted as A, and the coordinates of A are (L, H);

[0012] Reference point calibration step: calibrating a reference point above the cutting assembly and at a second preset position, denoted as B and having a coordinate of (x, y);

[0013] Calculation steps for the distance between the reference point and the cutting point: Through the origin O(0,0), the cutting point A(L,H) and the reference point B(x,y), it can be determined that the distance M between the reference point and the cutting point in the horizontal direction is xL; the distance N between the reference point and the cutting point in the vertical direction is yH;

[0014] Silicon rod moving tool setting step: move the silicon rod to be cut to the reference point position at a first preset time, and move the silicon rod to be cut from the reference point position by a distance xL in the first direction and a distance yH in the second direction at a second preset time that lags behind the first preset time, so that the silicon rod to be cut is moved to the cutting point B to realize moving tool setting.

[0015] In the above technical solution, further, the cutting assembly includes a rotating roller and a cutting line;

[0016] The rotating rollers are provided in plurality, and the plurality of rotating rollers are arranged at intervals and constitute a driving part;

[0017] A plurality of the cutting wires are provided, and the plurality of cutting wires are wound around the driving part at intervals along the first direction to form the cutting part.

[0018] In the above technical solution, further, three rotating rollers are provided, and the three rotating rollers are arranged in an isosceles triangle, so that the end surface of the cutting portion facing the silicon rod is a plane.

[0019] In the above technical solution, further, the origin calibration step includes the following steps:

[0020] Horizontal origin calibration step: driving the silicon rod to move in the horizontal direction until it is flush with the cutting line at the end of the cutting portion;

[0021] Vertical origin calibration step: driving the silicon rod to move in the vertical direction until the end surface of the silicon rod facing the cutting assembly contacts the cutting portion.

[0022] In the above technical solution, further, the origin calibration step also includes an origin change step, including the following steps:

[0023] Origin horizontal direction changing step: when the cutting part moves in the first direction, restart the horizontal direction origin calibration step and update the position of the origin in the horizontal direction;

[0024] The step of changing the origin in the vertical direction: when the driving unit moves in the second direction, restarting the step of calibrating the origin in the vertical direction, and updating the position of the origin in the vertical direction.

[0025] In the above technical solution, further, the reference point calibration step includes the following steps:

[0026] Horizontal reference point detection step: a first sensor component is arranged at the second preset position and is in communication with the controller;

[0027] A horizontal reference point calibration step: driving the silicon rod to move toward the first sensor assembly, when the silicon rod contacts the first sensor assembly, the controller can receive a first signal sent by the first sensor assembly, and the controller calibrates the horizontal position of the first sensor assembly in the coordinate system as the horizontal position of the reference point according to the first signal;

[0028] A vertical reference point detection step: a second sensor component communicatively connected to the controller is disposed at the second preset position and spaced apart from the first sensor component;

[0029] Vertical reference point calibration step: driving the silicon rod to move toward the second sensor assembly. When the silicon rod contacts the second sensor assembly, the controller can receive a second signal emitted by the second sensor assembly. The controller calibrates the vertical position of the second sensor assembly at the coordinate as the vertical position of the reference point according to the second signal.

[0030] In the above technical solution, further, the first sensor component includes a pressure sensor or a tension sensor; the second sensor component includes a pressure sensor or a tension sensor.

[0031] In the above technical solution, further, the first sensor assembly and the second sensor assembly both include a support frame, and the support frame can support the pressure sensor or the tension sensor.

[0032] In the above technical solution, further, the controller is communicatively connected with the silicon rod to be cut, and can control the movement of the silicon rod to be cut.

[0033] The present application also provides a control system for automatic tool alignment for silicon wafer cutting, based on a control method for automatic tool alignment for silicon wafer cutting.

[0034] Compared with the prior art, this application has the following beneficial effects:

[0035] The present application provides a control method for automatic tool alignment for silicon wafer cutting, comprising the following steps:

[0036] Origin calibration step: calibrate the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system;

[0037] The tool setting parameter setting step is as follows: the lengths of both ends of the silicon rod along the length direction that extend beyond the both ends of the cutting part of the cutting assembly along the length direction are both L; the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod is H;

[0038] Cutting point calibration step: the tool setting parameters form a point in the coordinate system as a cutting point, denoted as A, and the coordinates of A are (L, H);

[0039] Reference point calibration step: calibrating a reference point above the cutting assembly and at a second preset position, denoted as B and having a coordinate of (x, y);

[0040] Calculation steps for the distance between the reference point and the cutting point: Through the origin O(0,0), the cutting point A(L,H) and the reference point B(x,y), it can be determined that the distance M between the reference point and the cutting point in the horizontal direction is xL; the distance N between the reference point and the cutting point in the vertical direction is yH;

[0041] Silicon rod moving tool setting step: move the silicon rod to be cut to the reference point position at a first preset time, and move the silicon rod to be cut from the reference point position by a distance xL in the first direction and a distance yH in the second direction at a second preset time that lags behind the first preset time, so that the silicon rod to be cut is moved to the cutting point B to realize moving tool setting.

[0042] In summary, the present application only requires manual calibration once in the cutting point calibration step, and no manual participation in tool setting is required subsequently. The overall solution makes the cutting of silicon rods more accurate, reduces the workload of operators, and improves work efficiency. In addition, it improves the utilization rate of silicon materials and reduces batch quality abnormalities caused by excessive tool setting errors.

[0043] The present application also provides a control system for automatic tool alignment for silicon wafer cutting, which is based on the control method for automatic tool alignment for silicon wafer cutting, and thus has all the beneficial effects of the control method for automatic tool alignment for silicon wafer cutting, and thus will not be elaborated in detail. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 A structural demonstration diagram of the control method for automatic tool alignment for silicon wafer cutting provided by the present application and a diagram from a first perspective;

[0046] Figure 2 for Figure 1 A in the enlarged view;

[0047] Figure 3 A structural demonstration diagram of the control method for automatic tool alignment for silicon wafer cutting provided by the present application and a diagram from a second viewing angle;

[0048] Figure 4 This is a structural demonstration diagram of the control method for automatic tool alignment for silicon wafer cutting provided in this application and a diagram from a third perspective.

[0049] Figure numerals: 1-silicon rod; 2-side end surface; 3-bottom end surface; 4-rotating roller; 5-cutting line; 6-driving part; 7-cutting part; 8-first direction; 9-second direction; 10-first sensor component; 11-second sensor component. DETAILED DESCRIPTION

[0050] The following specific embodiments are provided to help the reader obtain a comprehensive understanding of the methods, devices and / or systems described herein. However, after understanding the disclosure of the present application, various changes, modifications and equivalents of the methods, devices and / or systems described herein will be apparent. For example, the order of operations described herein is merely an example, and is not limited to the order set forth herein, but in addition to the operations that must occur in a particular order, changes that will be apparent after understanding the disclosure of the present application may be made. In addition, in order to improve clarity and brevity, descriptions of features known in the art may be omitted.

[0051] The features described herein may be implemented in different forms and should not be interpreted as being limited to the examples described herein. Rather, the examples described herein have been provided only to illustrate some of the many possible ways of implementing the methods, devices and / or systems described herein that will be apparent after understanding the disclosure of the present application.

[0052] Throughout the specification, when an element (such as a layer, a region, or a substrate) is described as being “on”, “connected to”, “bound to”, “over”, or “covering” another element, it may be directly “on”, “connected to”, “bound to”, “over”, or “covering” another element, or one or more other elements may be present between them. In contrast, when an element is described as being “directly on”, “directly connected to”, “directly bound to”, “directly over”, or “directly covering” another element, there may be no other elements present between them.

[0053] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0054] Although terms such as "first," "second," and "third" may be used herein to describe various members, components, regions, layers, or portions, these members, components, regions, layers, or portions are not limited by these terms. Rather, these terms are only used to distinguish one member, component, region, layer, or portion from another member, component, region, layer, or portion. Therefore, without departing from the teachings of the examples described herein, the first member, component, region, layer, or portion referred to may also be referred to as the second member, component, region, layer, or portion.

[0055] For ease of description, spatial relational terms such as "above", "upper", "below", and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element will subsequently be "below" or "lower" relative to the other element. Therefore, the term "above" includes both "above" and "below" orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relational terms used herein will be interpreted accordingly.

[0056] The terms used herein are only used to describe various examples and are not used to limit the present disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms "include", "comprise" and "have" list the stated features, quantities, operations, components, elements and / or their combinations that exist, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or their combinations.

[0057] Variations in the shapes shown in the drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include variations in shapes that occur during manufacturing.

[0058] The features of the examples described herein may be combined in various ways that will be apparent after understanding the disclosure of the present application. In addition, although the examples described herein have various configurations, other configurations are possible as will be apparent after understanding the disclosure of the present application.

[0059] Embodiment 1

[0060] However, the above method has the following shortcomings: if the employee does not operate properly in the vertical direction (z-axis) when setting the knife, the silicon rod 1 will press down on the wire mesh, and the entire wire mesh will be broken; in addition, if the silicon rod 1 contacts the wire mesh, it will cause abnormalities such as twisting wire / cutting thickness / cutting surface scratches when starting the machine. If the employee does not operate properly in the horizontal direction (X-axis) when setting the knife, and the margin is greater than 1.5mm, it will cause silicon material waste (1mm thickness is about 5-6 silicon wafers); if the margin is less than 1mm, the edge skin at both ends will easily fall off during the cutting process, which will cause the cutting interruption problem due to breaking the wire mesh. In addition, the above operation process requires high precision, and currently it depends entirely on manual observation, which cannot guarantee the accuracy of the knife setting. When the gap between the silicon rod 1 and the wire mesh is greater than 1mm, the steel wire cutting force is wasted, and there is also the risk of scratching the cut surface.

[0061] The present application provides a control method for automatic tool alignment for silicon wafer cutting, comprising the following steps:

[0062] Origin calibration step 100: calibrate the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system.

[0063] Specifically, combined Figure 1 and Figure 2 As shown, the cutting assembly includes a rotating roller 4 and a cutting line 5; wherein the rotating roller 4 is provided with a plurality of rotating rollers 4, and the plurality of rotating rollers 4 are arranged at intervals to form a driving part 6. wherein the cutting line 5 is provided with a plurality of cutting lines 5, and the plurality of cutting lines 5 are wound around the driving part 6 at intervals along a first direction 8 to form a cutting part 7. Figure 3As shown, one direction here refers to the horizontal left direction, that is, multiple cutting lines 5 are arranged in a spaced manner along the horizontal left direction, and the distance between adjacent cutting lines 5 is the thickness of the silicon wafer formed after the silicon rod 1 is cut. In the actual cutting process of the silicon rod 1, the rotating roller 4 is driven to rotate, and the rotating rotating roller 4 drives the cutting line 5 to rotate, thereby cutting the silicon rod 1.

[0064] Furthermore, combined with Figure 1 As shown, three rotating rollers 4 are provided, and the three rotating rollers 4 are arranged in an isosceles triangle, so that the end surface of the cutting portion 7 facing the silicon rod 1 is a plane.

[0065] Specifically, the origin calibration step includes the following steps:

[0066] Horizontal origin calibration step 101: drive the silicon rod 1 to move in the horizontal direction until it is flush with the cutting line 5 at the end of the cutting portion 7; specifically, Figure 1 As shown, in actual use, the silicon rod 1 is first fed into the machine chamber, and the spindle clamping device clamps the silicon rod 1;

[0067] Then the spindle drives the silicon rod 1 to move in a vertical downward direction, and the feeding is stopped when the lower surface of the silicon rod 1 is 3-5 mm away from the wire mesh; then the spindle drives the silicon rod 1 to move in a direction opposite to the first direction 8 until the side end surface 2 of the silicon rod 1 is aligned with the wire mesh. Figure 1 The rightmost cutting line 5 is aligned; at this time, click the horizontal origin calibration button on the control panel to make it in the OK state.

[0068] The control panel is a control panel of a silicon rod cutting system 1. The silicon rod cutting system 1 is a prior art and can be understood by those skilled in the art.

[0069] Vertical origin calibration step 102: drive the silicon rod 1 to move in the vertical direction until the end surface of the silicon rod 1 facing the cutting assembly contacts the cutting portion 7. Figure 1 As shown, the silicon rod 1 is driven to move vertically downward toward the cutting assembly until the bottom end surface 3 of the silicon rod 1 contacts the cutting portion 7; at this time, the vertical origin calibration button on the control panel is clicked to put it in the ok state.

[0070] In summary, the first preset position refers to Figure 1 The center position of the rightmost cutting line 5 in FIG. Through the above steps, the origin O (0, 0) can be calibrated at the first preset position of the cutting component and the coordinate system can be established.

[0071] Tool setting parameter setting step 200: Assume that the lengths of both ends of the silicon rod 1 along its length direction that extend beyond the both ends of the cutting part 7 of the cutting assembly along its length direction are both L; Assume that the distance between the end surface of the silicon rod 1 facing the cutting assembly and the end surface of the cutting part 7 facing the silicon rod 1 is H. Specifically, L here shall not be greater than 1.5 mm, and H here shall not be greater than 1 mm.

[0072] Cutting point calibration step 300: The tool setting parameters form a point in the coordinate system as the cutting point, which is denoted as A and the coordinates of A are (L, H).

[0073] Reference point calibration step 400: Calibrate a reference point above the cutting assembly and at a second preset position, denoted as B and having a coordinate of (x, y); specifically, the reference point calibration step 400 includes the following steps:

[0074] Horizontal reference point detection step 401: A first sensor assembly 10 is arranged at a second preset position and is communicatively connected to the controller. Preferably, the first sensor assembly 10 includes a pressure sensor or a tension sensor. In addition, the first sensor assembly 10 also includes a support frame, which is used to support the pressure sensor or the tension sensor.

[0075] Horizontal reference point calibration step 402: drive the silicon rod 1 to move toward the first sensor assembly 10. When the silicon rod 1 contacts the first sensor assembly 10, the controller can receive a first signal sent by the first sensor assembly 10. The controller calibrates the horizontal position of the first sensor assembly 10 in the coordinate system as the horizontal position of the reference point according to the first signal.

[0076] Vertical reference point detection step 403: A second sensor assembly 11 is arranged at a second preset position and spaced apart from the first sensor assembly 10 and is communicatively connected to the controller; preferably, the second sensor assembly 11 includes a pressure sensor or a tension sensor. In addition, the second sensor assembly 11 also includes a support frame, which is used to support the pressure sensor or the tension sensor.

[0077] Vertical reference point calibration step 404: drive the silicon rod 1 to move toward the second sensor component 11. When the silicon rod 1 contacts the second sensor component 11, the controller can receive a second signal sent by the second sensor component 11. The controller calibrates the vertical position of the second sensor component 11 in the coordinate as the vertical position of the reference point according to the second signal.

[0078] In summary, combined Figure 4 As shown, the second preset position is above the cutting assembly and at Figure 1 The right side of the middle silicon rod 1. The cutting point calibration can be completed through the above steps.

[0079] Step 500 of calculating the distance between the reference point and the cutting point: through the origin O(0,0), the cutting point A(L,H) and the reference point B(x,y), the controller can calculate and determine that the distance M between the reference point and the cutting point in the horizontal direction is xL; the distance N between the reference point and the cutting point in the vertical direction is yH.

[0080] Silicon rod 1 moving tool setting step 600: move the silicon rod 1 to be cut to the reference point position at a first preset time, and move the silicon rod 1 to be cut from the reference point position along the first direction 8 by a distance xL and along the second direction 9 by a distance yH at a second preset time that lags behind the first preset time, so that the silicon rod 1 to be cut is moved to the cutting point B to realize moving tool setting.

[0081] In this embodiment, further, after the origin calibration step, an origin changing step is also included, including the following steps:

[0082] Origin horizontal direction changing step: when the cutting part 7 moves in the first direction 8, the horizontal direction origin calibration step is restarted, and the position of the origin in the horizontal direction is updated.

[0083] The step of changing the origin in the vertical direction: when the driving unit 6 moves in the second direction 9, the step of calibrating the origin in the vertical direction is restarted, and the position of the origin in the vertical direction is updated.

[0084] In this embodiment, further, the controller is in communication connection with the silicon rod 1 to be cut, and can control the movement of the silicon rod 1 to be cut.

[0085] In summary, the present application only requires manual calibration once in the cutting point calibration step, and no manual participation in the tool setting is required subsequently. The overall solution makes the cutting of the silicon rod 1 more accurate, reduces the workload of the operators, and improves work efficiency; in addition, it improves the utilization rate of silicon materials and reduces batch quality abnormalities caused by excessive tool setting errors.

[0086] Embodiment 2

[0087] The present application also provides a control system for automatic tool alignment for silicon wafer cutting, which is based on the control method for automatic tool alignment for silicon wafer cutting and has all the beneficial effects of the control method for automatic tool alignment for silicon wafer cutting.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A control method for automatic tool alignment for silicon wafer cutting, characterized in that: The steps include: Origin calibration step: calibrate the origin O(0,0) at the first preset position of the cutting component and establish a coordinate system; The tool setting parameter setting step is as follows: the lengths of both ends of the silicon rod along the length direction that extend beyond the both ends of the cutting part of the cutting assembly along the length direction are both L; the distance between the end face of the silicon rod facing the cutting assembly and the end face of the cutting part facing the silicon rod is H; Cutting point calibration step: the tool setting parameters form a point in the coordinate system as a cutting point, denoted as A, and the coordinates of A are (L, H); Reference point calibration step: calibrating a reference point above the cutting assembly and at a second preset position, denoted as B and having a coordinate of (x, y); Calculation steps for the distance between the reference point and the cutting point: Through the origin O(0,0), the cutting point A(L,H) and the reference point B(x,y), it can be determined that the distance M between the reference point and the cutting point in the horizontal direction is xL; the distance N between the reference point and the cutting point in the vertical direction is yH; Silicon rod moving tool setting step: move the silicon rod to be cut to the reference point position at a first preset time, and move the silicon rod to be cut from the reference point position by a distance xL in the first direction and a distance yH in the second direction at a second preset time that lags behind the first preset time, so that the silicon rod to be cut is moved to the cutting point B to realize moving tool setting.

2. The control method for automatic tool alignment for silicon wafer cutting according to claim 1 is characterized in that: The cutting assembly includes a rotating roller and a cutting wire; The rotating rollers are provided in plurality, and the plurality of rotating rollers are arranged at intervals and constitute a driving part; A plurality of the cutting wires are provided, and the plurality of cutting wires are wound around the driving part at intervals along the first direction to form the cutting part.

3. The control method for automatic tool alignment for silicon wafer cutting according to claim 2, characterized in that: There are three rotating rollers, which are arranged in an isosceles triangle so that the end surface of the cutting portion facing the silicon rod is a plane.

4. The control method for automatic tool alignment for silicon wafer cutting according to claim 2, characterized in that: The origin calibration step comprises the following steps: Horizontal origin calibration step: driving the silicon rod to move in the horizontal direction until it is flush with the cutting line at the end of the cutting portion; Vertical origin calibration step: driving the silicon rod to move in the vertical direction until the end surface of the silicon rod facing the cutting assembly contacts the cutting portion.

5. The control method for automatic tool alignment for silicon wafer cutting according to claim 4 is characterized in that: The origin calibration step also includes an origin change step, which includes the following steps: Origin horizontal direction changing step: when the cutting part moves in the first direction, restart the horizontal direction origin calibration step and update the position of the origin in the horizontal direction; The step of changing the origin in the vertical direction: when the driving unit moves in the second direction, restarting the step of calibrating the origin in the vertical direction, and updating the position of the origin in the vertical direction.

6. The control method for automatic tool alignment for silicon wafer cutting according to claim 1, characterized in that: The reference point calibration step comprises the following steps: Horizontal reference point detection step: a first sensor component is arranged at the second preset position and is in communication with the controller; A horizontal reference point calibration step: driving the silicon rod to move toward the first sensor assembly, when the silicon rod contacts the first sensor assembly, the controller can receive a first signal sent by the first sensor assembly, and the controller calibrates the horizontal position of the first sensor assembly in the coordinate system as the horizontal position of the reference point according to the first signal; A vertical reference point detection step: a second sensor component communicatively connected to the controller is disposed at the second preset position and spaced apart from the first sensor component; Vertical reference point calibration step: driving the silicon rod to move toward the second sensor assembly. When the silicon rod contacts the second sensor assembly, the controller can receive a second signal emitted by the second sensor assembly. The controller calibrates the vertical position of the second sensor assembly at the coordinate as the vertical position of the reference point according to the second signal.

7. The control method for automatic tool alignment for silicon wafer cutting according to claim 6, characterized in that: The first sensor assembly includes a pressure sensor or a tension sensor; the second sensor assembly includes a pressure sensor or a tension sensor.

8. The control method for automatic tool alignment for silicon wafer cutting according to claim 7, characterized in that: The first sensor assembly and the second sensor assembly both include a support frame, and the support frame can support the pressure sensor or the tension sensor.

9. The control method for automatic tool alignment for silicon wafer cutting according to claim 6, characterized in that: The controller is in communication connection with the silicon rod to be cut and can control the movement of the silicon rod to be cut.

10. A control system for automatic tool alignment during silicon wafer cutting, characterized in that: A control method for automatic tool alignment based on silicon wafer cutting.

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