A special deep-hole processing device for semiconductors

Abstract

The present invention relates to the field of semiconductor processing technology, and specifically to a special deep-hole processing device for semiconductors. A mounting bottom box is fixedly connected to the bottom of the mounting top plate. A protruding rotating cylinder is slidably clamped to the bottom of the mounting bottom box. A limiting slide bar is arranged on the outer side of the protruding rotating cylinder, and the limiting slide bar is slidably clamped to the mounting bottom box. A protective rotating ring is rotatably connected to the inner side of the protruding rotating cylinder. A protective mounting column is fixedly connected to the inner side of the protective rotating ring. An adjustment groove is formed inside the protective mounting column, and a moving groove is formed inside the protective mounting column. It has high flexibility and precision, can achieve precise control of deep-hole processing, and through a series of mechanical linkage devices, realizes precise positioning and direction adjustment of the processing head, thereby meeting the strict requirements of the semiconductor industry for deep-hole processing. This device not only improves the processing efficiency, but also ensures the processing quality, and protects the workpiece and the tool.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and particularly to a special deep-hole processing device for semiconductors. Background Art

[0002] With the continuous improvement of semiconductor technology and the continuous expansion of application fields, the demand for semiconductor deep-hole processing is also increasing. To meet this demand, processing equipment and technologies need to be continuously innovated and developed.

[0003] In the prior art, the materials for semiconductor deep-hole processing are mostly hard and brittle materials, such as single-crystalline silicon, silicon carbide, quartz glass, etc. These materials are prone to problems such as chipping and short tool life during processing, and have extremely high requirements for the surface quality and accuracy of the workpiece, and it is necessary to protect the workpiece and the tool; for this reason, the present invention provides a special deep-hole processing device for semiconductors. Summary of the Invention

[0004] The purpose of the present invention is to provide a special deep-hole processing device for semiconductors to solve the problems raised in the above background art.

[0005] The technical solution of the present invention is: a special deep-hole processing device for semiconductors, including a processing base and a mounting top plate. The bottom of the mounting top plate is fixedly connected with a mounting bottom box. The bottom of the mounting bottom box is slidably clamped with a protruding rotating cylinder. The outer side of the protruding rotating cylinder is provided with a limiting slide bar, and the limiting slide bar is slidably clamped with the mounting bottom box. The inner side of the protruding rotating cylinder is rotatably connected with a protective rotating ring. The inner side of the protective rotating ring is fixedly connected with a protective mounting column. An adjustment groove is opened inside the protective mounting column, a moving groove is opened inside the protective mounting column, and a rotating groove is opened at the bottom of the protective mounting column. The adjustment groove is communicated with the moving groove through the rotating groove. A main slide bar is slidably clamped inside the adjustment groove, and a secondary slide bar is slidably clamped inside the moving groove. The bottom of the main slide bar is fixedly connected with a fixed rotating shaft. The outer side of the fixed rotating shaft is rotatably connected with a processing mounting plate. A processing module is installed at the bottom of the processing mounting plate. The inner side of the secondary slide bar is fixedly connected with a sliding rotating shaft. A sliding hole is opened inside the processing mounting plate. The sliding rotating shaft is slidably clamped inside the sliding hole. The inner side of the mounting top plate is fixedly connected with a rotating motor. The output end of the rotating motor is fixedly connected with a rotating top shaft. The secondary slide bar is fixedly connected to the bottom of the rotating top shaft. The main slide bar is slidably clamped inside the rotating top shaft. The outer side of the rotating top shaft is rotatably connected with an external thread ring. The external thread ring is threadedly connected to the inside of the protruding rotating cylinder. The top of the external thread ring is fixedly connected with a protruding disc. An external tooth ring is arranged on the outer side of the protruding disc. When in use: during processing, the protective mounting column enters the inside of the workpiece, and the processing module is located inside the protective mounting column. Through the protection of the protective mounting column, when not processing, the workpiece or the processing module can be prevented from being damaged by contact. By controlling the rotation of the external tooth ring, the protruding disc is driven to rotate, driving the external thread ring to rotate. The protruding rotating cylinder is limited by the limiting slide bar. Through screw transmission, the protruding rotating cylinder moves upward, driving the protective rotating ring to move upward, driving the protective mounting column to move upward. The main slide bar and the secondary slide bar are fixed, so that the processing head of the processing module is exposed to process the bottom of the deep hole of the workpiece. By controlling the up and down movement of the main slide bar, the secondary slide bar is fixed, and the sliding rotating shaft is fixed, the fixed rotating shaft will be pushed downward, so that the sliding rotating shaft moves along the sliding hole, and the processing mounting plate gradually rotates, so that the processing module rotates and aligns with the hole side wall. Then, the whole protective mounting column is rotated, so that the processing module can process the side wall of the deep hole of the workpiece.

[0006] Preferably, a slide bar strip is fixedly connected to the top of the main slide bar. An outer push groove is formed on the outer side of the rotating top shaft. An adjustment slider is slidably clamped in the outer push groove. The adjustment slider is fixedly connected to the top of the slide bar strip. Two adjustment push cylinders are fixedly connected to the inside of the installation top plate. The output end of the adjustment push cylinder is fixedly connected to an adjustment push plate. An adjustment push disc is rotatably connected to the inner side of the adjustment push plate. The adjustment slider is fixedly connected to the inner side of the adjustment push disc. A protruding motor is fixedly connected to the bottom of the installation bottom box. The output end of the protruding motor is fixedly connected to a protruding gear. The protruding gear meshes with the external tooth ring. A workpiece module is installed on the top of the processing base. An installation base is fixedly connected to one side of the processing base. A rotating shaft box is fixedly connected to the inside of the installation base. A vertical electric cylinder is installed inside the rotating shaft box. The output end of the vertical electric cylinder is fixedly connected to a vertical installation plate. A horizontal electric cylinder is installed inside the vertical installation plate. The output end of the horizontal electric cylinder is fixedly connected to the installation top plate; When in use: By setting the rotating shaft box, the vertical electric cylinder and the horizontal electric cylinder, the up and down movement and position of the installation top plate are controlled. The adjustment push plate is pushed down by the adjustment push cylinder, so that the adjustment push disc moves down, and the adjustment slider pushes the slide bar strip down, thereby controlling the rotation of the processing installation plate. The protruding gear is driven to rotate by the protruding motor. The protruding gear meshes with the external tooth ring. By the power of the rotation of the protruding disc, the rotating top shaft is driven by the rotating motor, and the protective installation column is driven to rotate, so that the processing module can adjust the processing direction.

[0007] The present invention provides a semiconductor special deep hole processing device through improvement. Compared with the prior art, it has the following improvements and advantages:

[0008] First: For the semiconductor special deep hole processing device of the present invention, during processing, the protective installation column enters the inside of the workpiece, and the processing module is located inside the protective installation column. Through the protection of the protective installation column, when not processing, the workpiece or the processing module is prevented from being damaged by touching. By controlling the rotation of the external tooth ring, the protruding disc is driven to rotate, and the external thread ring is driven to rotate. The protruding rotating cylinder is limited by the limiting slide bar. Through screw transmission, the protruding rotating cylinder moves up, driving the protective rotating ring to move up, driving the protective installation column to move up. The main slide bar and the auxiliary slide bar are fixed, so that the processing head of the processing module is exposed to process the bottom of the deep hole of the workpiece. By controlling the up and down movement of the main slide bar, the auxiliary slide bar is fixed, and the sliding rotating shaft is fixed. The fixed rotating shaft will be pushed downward, so that the sliding rotating shaft moves along the sliding hole, and the processing installation plate gradually rotates, so that the processing module rotates and aligns with the hole side wall. Then, the whole protective installation column rotates, so that the processing module can process the side wall of the deep hole of the workpiece;

[0009] Second: In the special deep hole processing device for semiconductors of the present invention, by setting a rotating shaft box, a vertical electric cylinder and a horizontal electric cylinder, the up and down movement and position of the installation top plate are controlled. By adjusting the push cylinder to push the adjustment push plate downward, the adjustment push disk is moved downward, and the adjustment slider is made to push the slide bar downward, thereby controlling the rotation of the processing mounting plate. By driving the protruding gear to rotate through the protruding motor, the protruding gear meshes with the external tooth ring. Through the power of the rotation of the protruding disk, by driving the rotating top shaft through the rotating motor, the protective mounting column is driven to rotate, so that the processing module can adjust the processing direction;

[0010] Summary: The special deep hole processing device for semiconductors of the present invention has high flexibility and precision, can achieve precise control of deep hole processing, and through a series of mechanical linkage devices, realizes precise positioning and direction adjustment of the processing head, thus meeting the strict requirements of the semiconductor industry for deep hole processing. This device not only improves the processing efficiency, but also ensures the processing quality, and protects the workpiece and the tool. Brief Description of the Drawings

[0011] The present invention will be further explained below in conjunction with the drawings and embodiments:

[0012] Figure 1 is the three-dimensional structure schematic diagram of the present invention;

[0013] Figure 2 is the structure schematic diagram of the processing base of the present invention;

[0014] Figure 3 is the structure schematic diagram of the installation top plate of the present invention;

[0015] Figure 4 is the structure schematic diagram of the rotating motor of the present invention;

[0016] Figure 5 is the structure schematic diagram of the protruding disk of the present invention;

[0017] Figure 6 is the structure schematic diagram of the rotating top shaft of the present invention;

[0018] Figure 7 is the structure schematic diagram of the protruding rotating cylinder of the present invention;

[0019] Figure 8 is the structure schematic diagram of the main slide bar of the present invention;

[0020] Figure 9 is the structure schematic diagram of the processing mounting plate of the present invention;

[0021] Figure 10 is the cross-sectional schematic diagram of the protective mounting column of the present invention.

[0022] Explanation of the Reference Numerals in the Drawings:

[0023] 1. Processing base; 2. Workpiece module; 3. Installation base; 4. Installation top plate; 5. Rotating shaft box; 6. Vertical electric cylinder; 7. Vertical installation plate; 8. Horizontal electric cylinder; 9. Installation bottom box; 10. Rotating motor; 11. Adjusting push cylinder; 12. Adjusting push plate; 13. Adjusting push disc; 14. Adjusting slider; 15. Protruding motor; 16. Protruding gear; 17. Rotating top shaft; 18. Protruding disc; 19. Protective installation column; 20. Protruding rotating cylinder; 21. External thread ring; 22. External gear ring; 23. Limit slide bar; 24. Protective rotating ring; 25. Main slide bar; 26. Slide bar strip; 27. Sub-slide bar; 28. Processing mounting plate; 29. Fixed rotating shaft; 30. Processing module; 31. Sliding rotating shaft. Specific implementation manner

[0024] The present invention will be described in detail below. The technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] The present invention provides a semiconductor special deep hole processing device by improvement. The technical solution of the present invention is as follows:

[0026] As Figures 1 - 10As shown in the figure, a special deep-hole processing device for semiconductors includes a processing base 1 and a mounting top plate 4. A mounting bottom box 9 is fixedly connected to the bottom of the mounting top plate 4. A protruding rotating cylinder 20 is slidably clamped to the bottom of the mounting bottom box 9. A limiting slide bar 23 is arranged on the outer side of the protruding rotating cylinder 20, and the limiting slide bar 23 is slidably clamped to the mounting bottom box 9. A protective rotating ring 24 is rotatably connected to the inner side of the protruding rotating cylinder 20. A protective mounting column 19 is fixedly connected to the inner side of the protective rotating ring 24. An adjustment groove is opened inside the protective mounting column 19. A moving groove is opened inside the protective mounting column 19. A rotating groove is opened at the bottom of the protective mounting column 19. The adjustment groove is communicated with the moving groove through the rotating groove. A main slide bar 25 is slidably clamped inside the adjustment groove. A secondary slide bar 27 is slidably clamped inside the moving groove. A fixed rotating shaft 29 is fixedly connected to the bottom of the main slide bar 25. A processing mounting plate 28 is rotatably connected to the outer side of the fixed rotating shaft 29. A processing module 30 is installed at the bottom of the processing mounting plate 28. A sliding rotating shaft 31 is fixedly connected to the inner side of the secondary slide bar 27. A sliding hole is opened inside the processing mounting plate 28. The sliding rotating shaft 31 is slidably clamped in the sliding hole. A rotating motor 10 is fixedly connected to the inner side of the mounting top plate 4. A rotating top shaft 17 is fixedly connected to the output end of the rotating motor 10. The secondary slide bar 27 is fixedly connected to the bottom of the rotating top shaft 17. The main slide bar 25 is slidably clamped inside the rotating top shaft 17. An external thread ring 21 is rotatably connected to the outer side of the rotating top shaft 17. The external thread ring 21 is threadedly connected to the inside of the protruding rotating cylinder 20. A protruding disc 18 is fixedly connected to the top of the external thread ring 21. An external gear ring 22 is arranged on the outer side of the protruding disc 18. When in use: during processing, the protective mounting column 19 enters the inside of the workpiece, and the processing module 30 is located inside the protective mounting column 19. Through the protection of the protective mounting column 19, when not processing, the workpiece or the processing module 30 can be prevented from being damaged by touching. By controlling the rotation of the external gear ring 22, the protruding disc 18 is driven to rotate, driving the external thread ring 21 to rotate. The protruding rotating cylinder 20 is limited by the limiting slide bar 23. Through screw transmission, the protruding rotating cylinder 20 moves upward, driving the protective rotating ring 24 to move upward, driving the protective mounting column 19 to move upward. The main slide bar 25 and the secondary slide bar 27 are fixed, so that the processing head of the processing module 30 is exposed to process the bottom of the deep hole of the workpiece. By controlling the up and down movement of the main slide bar 25, the secondary slide bar 27 is fixed, and the sliding rotating shaft 31 is fixed, the fixed rotating shaft 29 will be pushed downward, so that the sliding rotating shaft 31 moves along the sliding hole, and the processing mounting plate 28 gradually rotates, making the processing module 30 rotate and align with the hole side wall. Then, the whole protective mounting column 19 is rotated, so that the processing module 30 can process the side wall of the deep hole of the workpiece, and the processing mounting plate 28 can be unfolded inside the deep hole, and it can be applied to deep holes with a small mouth and a large inside.

[0027] Further, a slide bar strip 26 is fixedly connected to the top of the main slide bar 25. An outer push groove is formed in the outer side of the rotating top shaft 17. An adjustment slider 14 is slidably clamped in the outer push groove. The adjustment slider 14 is fixedly connected to the top of the slide bar strip 26. Two adjustment push cylinders 11 are fixedly connected to the inside of the installation top plate 4. The output end of the adjustment push cylinder 11 is fixedly connected to an adjustment push plate 12. The inner side of the adjustment push plate 12 is rotatably connected to an adjustment push disk 13. The adjustment slider 14 is fixedly connected to the inner side of the adjustment push disk 13. A protruding motor 15 is fixedly connected to the bottom of the installation bottom box 9. The output end of the protruding motor 15 is fixedly connected to a protruding gear 16. The protruding gear 16 meshes with the outer tooth ring 22. A workpiece module 2 is installed on the top of the processing base 1. One side of the processing base 1 is fixedly connected to an installation base 3. A rotating shaft box 5 is fixedly connected to the inside of the installation base 3. A vertical electric cylinder 6 is installed inside the rotating shaft box 5. The output end of the vertical electric cylinder 6 is fixedly connected to a vertical installation plate 7. A horizontal electric cylinder 8 is installed inside the vertical installation plate 7. The output end of the horizontal electric cylinder 8 is fixedly connected to the installation top plate 4; When in use: By setting the rotating shaft box 5, the vertical electric cylinder 6 and the horizontal electric cylinder 8, the up and down movement and position of the installation top plate 4 are controlled. The adjustment push plate 12 is pushed down by the adjustment push cylinder 11, so that the adjustment push disk 13 moves down, and the adjustment slider 14 pushes the slide bar strip 26 to move down, thereby controlling the rotation of the processing mounting plate 28. The protruding gear 16 is driven to rotate by the protruding motor 15. The protruding gear 16 meshes with the outer tooth ring 22. By the power of the rotation of the protruding disk 18, the rotating top shaft 17 is driven by the rotating motor 10, and the protective mounting column 19 is driven to rotate, so that the processing module 30 can adjust the processing direction.

[0028] Working principle: When in use: During processing, the protective mounting column 19 enters the interior of the workpiece. The processing module 30 is located inside the protective mounting column 19. Through the protection of the protective mounting column 19, when not processing, it can prevent the workpiece or the processing module 30 from being damaged by contact. By controlling the rotation of the external gear ring 22, it drives the protruding disc 18 to rotate, drives the external thread ring 21 to rotate. The protruding rotating cylinder 20 is limited by the limiting slide bar 23. Through screw drive, the protruding rotating cylinder 20 moves upward, drives the protective rotating ring 24 to move upward, drives the protective mounting column 19 to move upward. The main slide bar 25 and the auxiliary slide bar 27 are fixed, so that the processing head of the processing module 30 is exposed to process the bottom of the deep hole of the workpiece. By controlling the up and down movement of the main slide bar 25, with the auxiliary slide bar 27 fixed and the sliding rotating shaft 31 fixed, it will push the fixed rotating shaft 29 downward, so that the sliding rotating shaft 31 moves along the sliding hole, and the processing mounting plate 28 gradually rotates, making the processing module 30 rotate to align with the hole side wall. Then, the whole protective mounting column 19 rotates, so that the processing module 30 can process the side wall of the deep hole of the workpiece. By setting the rotating shaft box 5, the vertical electric cylinder 6 and the horizontal electric cylinder 8, the up and down movement and position of the mounting top plate 4 are controlled. By adjusting the push cylinder 11 to push the adjusting push plate 12 downward, the adjusting push disc 13 moves downward, and the adjusting slider 14 pushes the slide bar strip 26 downward, thereby controlling the rotation of the processing mounting plate 28. By driving the protruding gear 16 to rotate through the protruding motor 15, the protruding gear 16 meshes with the external gear ring 22. Through the power of the rotation of the protruding disc 18, by driving the rotating top shaft 17 through the rotating motor 10, the protective mounting column 19 is driven to rotate, so that the processing module 30 can adjust the processing direction.

[0029] The above description enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor-specific deep hole processing device, comprising a processing base (1) and a mounting top plate (4), characterized in that: The bottom of the mounting top plate (4) is fixedly connected to a mounting bottom box (9), the bottom of the mounting bottom box (9) is slidably engaged with a protruding rotating cylinder (20), a limiting slide bar (23) is provided on the outer side of the protruding rotating cylinder (20), the limiting slide bar (23) is slidably engaged with the mounting bottom box (9), the inner side of the protruding rotating cylinder (20) is rotatably connected to a protective rotating ring (24), the inner side of the protective rotating ring (24) is fixedly connected to a protective mounting column (19), and the interior of the protective mounting column (19) is provided with an adjustment A groove, a movable groove is provided inside the protective mounting column (19), a rotating groove is provided at the bottom of the protective mounting column (19), the adjustment groove is connected to the movable groove through the rotating groove, a main slide bar (25) is slidably connected inside the adjustment groove, a secondary slide bar (27) is slidably connected inside the movable groove, a fixed rotating shaft (29) is fixedly connected to the bottom of the main slide bar (25), a processing plate (28) is rotatably connected to the outer side of the fixed rotating shaft (29), and a processing module (30) is installed at the bottom of the processing plate (28); A sliding shaft (31) is fixedly connected to the inner side of the auxiliary sliding rod (27), a sliding hole is opened on the inner side of the processing mounting plate (28), and the sliding shaft (31) is slidably engaged in the sliding hole; A rotating motor (10) is fixedly connected to the inner side of the mounting top plate (4), an output end of the rotating motor (10) is fixedly connected to a rotating top shaft (17), the auxiliary sliding rod (27) is fixedly connected to the bottom of the rotating top shaft (17), and the main sliding rod (25) is slidably engaged with the inside of the rotating top shaft (17); The top of the main slide bar (25) is fixedly connected to a slide bar (26); the outer side of the rotating top shaft (17) is provided with an outer push groove, and an adjustment slide block (14) is slidably engaged in the outer push groove; the adjustment slide block (14) is fixedly connected to the top of the slide bar (26); the inside of the mounting top plate (4) is fixedly connected to two adjustment push cylinders (11); the output end of the adjustment push cylinder (11) is fixedly connected to an adjustment push plate (12); the inner side of the adjustment push plate (12) is rotatably connected to an adjustment push disk (13); and the adjustment slide block (14) is fixedly connected to the inner side of the adjustment push disk (13); An external threaded ring (21) is rotatably connected to the outer side of the rotating top shaft (17), the external threaded ring (21) is threadedly connected to the inside of the protruding rotating drum (20), the top of the external threaded ring (21) is fixedly connected to a protruding disc (18), and an external toothed ring (22) is provided on the outer side of the protruding disc (18); The bottom of the mounting bottom box (9) is fixedly connected to a protruding motor (15), the output end of the protruding motor (15) is fixedly connected to a protruding gear (16), and the protruding gear (16) is meshed with an outer gear ring (22).

2. A semiconductor-specific deep hole processing device according to claim 1, characterized in that: A workpiece module (2) is installed on the top of the processing base (1); a mounting base (3) is fixedly connected to one side of the processing base (1); a rotating shaft box (5) is fixedly connected inside the mounting base (3); a vertical electric cylinder (6) is installed inside the rotating shaft box (5); an output end of the vertical electric cylinder (6) is fixedly connected to a vertical mounting plate (7); a horizontal electric cylinder (8) is installed inside the vertical mounting plate (7); and the output end of the horizontal electric cylinder (8) is fixedly connected to the mounting top plate (4).

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