A single crystal cutting device for semiconductor transistor production
By introducing a cutting movement component, a wire adjustment component, and a cutting fluid spraying component into the cutting device, the problem of crystal damage caused by loose cutting wire was solved, the cutting accuracy and stability were improved, and the integrity of the crystal and the service life of the cutting wire were ensured.
Patent Information
- Application Number
- CN202510064534.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-15
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2045-01-15
AI Technical Summary
Existing cutting devices cannot adjust the cutting line when cutting single crystals, causing the cutting line to become loose or droopy, making it easy to collide with the crystal, resulting in crystal damage and breakage, and affecting cutting accuracy and quality.
The device employs a combined design of a cutting moving component, a wire cutting component, a wire adjusting component, and a cutting fluid spraying component. By adjusting the screw and slider, the tension of the cutting wire can be adjusted, and the design of the oscillating spray nozzle ensures uniform spraying and cooling of the cutting fluid, thereby improving cutting accuracy and stability.
It achieves stable tension adjustment of the cutting wire, ensuring cutting accuracy and crystal flatness, avoiding crystal damage, and improving cutting quality and the service life of the cutting wire.
Smart Images
Figure CN119635857B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor triode processing, and particularly relates to a single crystal cutting device for semiconductor triode production. BACKGROUND
[0002] A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit. Since the wafer has a circular shape, it is called a wafer. Various circuit element structures can be processed and manufactured on the silicon wafer to become an IC product with specific electrical functions. In the process of processing the semiconductor wafer, the wafer needs to be cut by a cutting device. Multi-wire cutting is a high-precision cutting method. It is mainly based on the principle of grinding and uses multiple high-speed moving cutting wires to cut semiconductor crystals. These cutting wires are usually high-strength steel wires or diamond wires. Under the drive of a motor, the cutting wires move at a very high speed, generally at several hundred meters to several thousand meters per minute. At the same time, a cutting liquid containing silicon carbide (SiC) powder is sprayed on the cutting wires. The abrasive in the cutting liquid plays a grinding role between the cutting wire and the crystal. With the continuous movement of the cutting wire, the crystal is gradually cut into a wafer.
[0003] However, in the process of cutting the single crystal, the cutting wire cannot be adjusted, which causes the cutting wire to sag or loosen, and the cutting wire and the crystal may collide during the cutting process, causing damage and breakage of the crystal and affecting the cutting of the crystal. SUMMARY
[0004] The embodiment of the application provides a single crystal cutting device for semiconductor triode production to solve the problems in the prior art.
[0005] The embodiment of the application adopts the following technical scheme: a single crystal cutting device for semiconductor triode production, comprising a mounting frame, a cutting moving assembly for driving the mounting frame to move vertically is arranged on the top of the mounting frame, a wire cutting assembly for cutting the single crystal is arranged in the mounting frame, the wire cutting assembly is rotatably connected with the mounting frame, a wire adjusting assembly for adjusting the wire cutting assembly is arranged on the mounting frame, the wire adjusting assembly is slidably connected with the mounting frame, a cutting liquid spraying assembly is further arranged in the mounting frame, and the cutting liquid spraying assembly is arranged towards the wire cutting assembly.
[0006] Further, the cutting moving assembly comprises a positioning frame, a moving oil cylinder and two sliding rods, the moving oil cylinder is vertically connected to the positioning frame, the two sliding rods are symmetrically arranged on the top of the mounting frame, the sliding rods are slidably connected with the positioning frame, and the telescopic end of the moving oil cylinder is fixedly connected with the mounting frame.
[0007] Further, the wire cutting assembly comprises a cutting wire, a first rotating wheel, a second rotating wheel and a cutting motor, the first rotating wheel and the second rotating wheel are symmetrically and rotatably connected to the mounting frame, the cutting motor is located on the side wall of the mounting frame and is in transmission connection with the first rotating wheel, and the cutting wire is sleeved on the first rotating wheel and the second rotating wheel.
[0008] Further, the wire adjusting assembly comprises two sliding blocks and two adjusting screws, two sliding grooves are arranged on the side wall of the mounting frame, the two sliding blocks are arranged in the two sliding grooves respectively, the sliding block and the sliding groove are in sliding fit, the adjusting screw is horizontally and rotatably connected to the mounting frame and is located at the sliding groove, and the sliding block and the adjusting screw are in threaded connection.
[0009] Further, the cutting liquid spraying assembly comprises a horizontal electric sliding table, the horizontal electric sliding table is horizontally arranged in the mounting frame, and the moving end of the horizontal electric sliding table is provided with a mounting plate.
[0010] Further, the mounting plate is provided with a driving motor, the main shaft of the driving motor is provided with a driving disc, the mounting plate is provided with a swing plate which is rotatably connected, the swing plate is provided with a swing groove, the driving disc is provided with a driving column, the driving column and the swing groove are in sliding fit, the bottom of the swing plate is provided with a swing arc-shaped plate, and the swing arc-shaped plate is provided with a plurality of liquid spraying nozzles which are arranged at equal intervals.
[0011] Further, the mounting frame is further provided with an ultrasonic cleaning device, and the cutting wire passes through the ultrasonic cleaning device.
[0012] The above-mentioned at least one technical scheme adopted by the embodiment of the present application can achieve the following beneficial effects:
[0013] One, the present application cuts motor work drives the first rotating wheel rotation, thereby driving the second rotating wheel on two sliders to rotate, the cutting line strip rotates to cut the single crystal, and during cutting, the cutting line strip and the single crystal will constantly rub, which will affect the tightness of the cutting line strip, by rotating two adjusting screws on the mounting frame, the two sliders will move in the two sliding grooves respectively, thereby moving the position of the second rotating wheel, adjusting the tension of the cutting line strip, which can ensure the cutting accuracy, the cutting line tension has a key influence on the cutting accuracy during the single crystal cutting process, when the cutting line tension is appropriate, the cutting line can maintain a stable state during high-speed movement, making the cutting process more stable, for the single crystal, the accuracy of the crystal direction is crucial to its electrical properties and subsequent process compatibility, appropriate cutting line tension helps to cut along the correct crystal direction, when the tension is stable, the cutting line can accurately cut the single crystal along the predetermined crystal direction, avoiding deviation of the crystal direction due to the cutting line deviation.
[0014] Secondly, the horizontal electric sliding table of the present application can drive the position of the plurality of liquid spray nozzles to move horizontally, so that the cutting liquid can be sprayed comprehensively onto the single crystal, improving the comprehensiveness of cutting, and then the driving motor is driven to rotate the driving disc, thereby driving the driving column on the driving disc to rotate, the driving column can rotate in the swing groove on the swing plate, thereby driving the swing plate to swing on the mounting plate, the swing of the swing plate will drive the position of the plurality of liquid spray nozzles on the swing arc plate to swing, the cutting liquid can be sprayed at a wider angle to the crystal surface, and the swinging liquid spray nozzles can uniformly spray the cutting liquid to the entire crystal cutting area, ensuring that the abrasives in the cutting liquid can play a grinding role in all parts of the crystal, avoiding a decrease in cutting quality due to a lack of cutting liquid in some parts; through the swing of the liquid spray nozzles, the abrasives are more evenly distributed on the crystal surface. This is like when painting a wall, the paint can be evenly distributed by swinging the spray head; evenly distributed abrasives can make the grinding between the cutting line and the crystal more uniform, thereby improving the cutting accuracy and making the surface of the cut crystal more flat; the swinging cutting liquid spraying method can quickly bring the cooling liquid to the high-temperature area, preventing the crystal from generating thermal stress or even breaking due to overheating, and also helping to protect the cutting line and prolong its service life. BRIEF DESCRIPTION OF DRAWINGS
[0015] The drawings described herein are used to provide a further understanding of the present application, and form a part of the present application. The illustrative embodiments of the present application and their description serve to explain the present application without forming an improper limitation on the present application. In the drawings:
[0016] Figure 1 It is a schematic view of the three-dimensional structure of the present application.
[0017] Figure 2 is a perspective view of the sectional structure of the present application;
[0018] Figure 3 is a perspective view of the line body adjusting assembly in the present application;
[0019] Figure 4 is a perspective view of the sectional structure of the present application;
[0020] Figure 5 is a perspective view of the cutting liquid spraying assembly in the present application;
[0021] Reference signs:
[0022] mounting frame 1, sliding groove 11, cutting moving assembly 2, positioning frame 21, moving oil cylinder 22, sliding rod 23, line body cutting assembly 3, cutting line 31, first rotating wheel 32, second rotating wheel 33, cutting motor 34, line body adjusting assembly 4, sliding block 41, adjusting screw 42, cutting liquid spraying assembly 5, horizontal electric sliding table 50, mounting plate 51, driving motor 52, driving disc 53, swinging plate 54, swinging groove 55, driving column 56, swinging arc-shaped plate 57, liquid spraying nozzle 58, ultrasonic cleaning device 6. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely below in combination with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0024] The technical scheme of a single crystal cutting device for semiconductor triode production provided by each embodiment of the present application will be described in detail below in combination with the drawings.
[0025] Referring to Figures 1 to 5 The embodiment of the present application provides a single crystal cutting device for semiconductor triode production, which comprises a mounting frame 1, a cutting moving assembly 2 arranged on the top of the mounting frame 1 to drive the mounting frame 1 to move in the vertical direction, a line body cutting assembly 3 arranged in the mounting frame 1 to cut a single crystal, the line body cutting assembly 3 being rotatably connected with the mounting frame 1, a line body adjusting assembly 4 arranged on the mounting frame 1 to adjust the line body cutting assembly 3, the line body adjusting assembly 4 being slidably connected with the mounting frame 1, a cutting liquid spraying assembly 5 arranged in the mounting frame 1, and the cutting liquid spraying assembly 5 being arranged towards the line body cutting assembly 3.
[0026] In the embodiment, the cutting moving assembly 2 comprises a positioning frame 21, a moving oil cylinder 22 and two sliding rods 23, the moving oil cylinder 22 is vertically connected to the positioning frame 21, the two sliding rods 23 are symmetrically arranged on the top of the mounting frame 1, the sliding rods 23 and the positioning frame 21 are in sliding fit, and the telescopic end of the moving oil cylinder 22 is fixedly connected to the mounting frame 1.
[0027] In the process of cutting the single crystal, the moving oil cylinder 22 drives the mounting frame 1 to move downward, so that the two sliding rods 23 move downward on the positioning frame 21, thereby driving the linear cutting assembly 3 below the mounting frame 1 to move downward, and the single crystal is cut.
[0028] In the embodiment, the linear cutting assembly 3 comprises a cutting wire 31, a first rotating wheel 32, a second rotating wheel 33 and a cutting motor 34, the first rotating wheel 32 and the second rotating wheel 33 are symmetrically and rotatably connected to the mounting frame 1, the cutting motor 34 is located on the side wall of the mounting frame 1 and is in transmission connection with the first rotating wheel 32, and the cutting wire 31 is sleeved on the first rotating wheel 32 and the second rotating wheel 33; the linear adjusting assembly 4 comprises two sliding blocks 41 and two adjusting screws 42, the side wall of the mounting frame 1 is provided with two sliding grooves 11, the two sliding blocks 41 are respectively arranged in the two sliding grooves 11, the sliding blocks 41 and the sliding grooves 11 are in sliding fit, the adjusting screws 42 are horizontally and rotatably connected to the mounting frame 1 and are located at the sliding grooves 11, the sliding blocks 41 and the adjusting screws 42 are in threaded connection, and the two ends of the second rotating wheel 33 are rotatably connected to the two sliding blocks 41.
[0029] The cutting motor 34 works to drive the first rotating wheel 32 to rotate, thereby driving the second rotating wheel 33 to rotate on the two sliding blocks 41 through the cutting wire 31. The cutting wire 31 rotates to cut the single crystal. During the cutting, the cutting wire 31 and the single crystal continuously rub against each other, which affects the tightness of the cutting wire 31. The two adjusting screws 42 are simultaneously rotated to drive the two sliding blocks 41 to move in the two sliding grooves 11, thereby driving the second rotating wheel 33 to move, adjusting the tension of the cutting wire 31, and ensuring the cutting precision. The tension of the cutting wire 31 has a key influence on the cutting precision. When the tension of the cutting wire 31 is appropriate, the cutting wire 31 can maintain a stable state during high-speed movement, so that the cutting process is more stable. For the single crystal, the accuracy of the crystal direction is crucial to the electrical performance and subsequent process compatibility. Proper tension of the cutting wire 31 helps to cut the single crystal along the correct crystal direction. When the tension is stable, the cutting wire 31 can accurately cut the single crystal along the predetermined crystal direction, avoiding deviation of the crystal direction due to deviation of the cutting wire 31.
[0030] In the embodiment, the cutting liquid spraying assembly 5 comprises a horizontal electric sliding table 50 horizontally arranged in the mounting frame 1, and an installation plate 51 is arranged on the moving end of the horizontal electric sliding table 50. A driving motor 52 is arranged on the installation plate 51, a driving disc 53 is arranged on the main shaft of the driving motor 52, a swing plate 54 is rotatably arranged on the installation plate 51, a swing groove 55 is arranged on the swing plate 54, a driving column 56 is arranged on the driving disc 53, and the driving column 56 is in sliding fit with the swing groove 55. An arc swing plate 57 is arranged at the bottom of the swing plate 54, and a plurality of liquid spraying nozzles 58 are arranged at equal intervals on the arc swing plate 57.
[0031] During the cutting of the single crystal by the cutting wire 31, the cutting liquid containing silicon carbide SiC powder is sprayed on the cutting wire through the liquid spraying nozzles 58. The abrasive in the cutting liquid plays a grinding role between the cutting wire and the crystal. With the continuous movement of the cutting wire, the crystal is gradually cut into a wafer.
[0032] While spraying the cutting liquid, the horizontal electric sliding table 50 works to drive the positions of the several liquid spraying nozzles 58 to move horizontally, so that the cutting liquid can be sprayed comprehensively onto the single crystal, improving the comprehensiveness of cutting. Thereafter, the driving motor 52 works to drive the driving disc 53 to rotate, so as to drive the driving column 56 on the driving disc 53 to rotate, the driving column 56 can rotate in the swing groove 55 on the swing plate 54, so as to drive the swing plate 54 to swing on the mounting plate 51, the swing of the swing plate 54 will drive the positions of the several liquid spraying nozzles 58 on the swing arc-shaped plate 57 to swing, the cutting liquid can be sprayed to the crystal surface at a wider angle, and the swinging liquid spraying nozzles 58 can uniformly spray the cutting liquid on the whole crystal cutting area, ensuring that the abrasives in the cutting liquid can play a grinding role in each part of the crystal, avoiding the decrease of cutting quality caused by the lack of cutting liquid in some parts; through the swing of the liquid spraying nozzles 58, the abrasives are more uniformly distributed on the crystal surface. This is like when painting a wall, the pigments in the paint can be uniformly distributed through the swing of the liquid spraying nozzles 58; the uniformly distributed abrasives can make the grinding between the cutting line and the crystal more uniform, thereby improving the cutting precision and making the flatness of the cut crystal surface higher; the swinging cutting liquid spraying mode can quickly bring the cooling liquid to the high-temperature area, preventing the crystal from generating thermal stress or even breaking due to overheating, and also being beneficial to protecting the cutting line 31 and prolonging the service life thereof.
[0033] In the present embodiment, the mounting frame 1 is further provided with an ultrasonic cleaning device 6, and the cutting line 31 passes through the ultrasonic cleaning device 6. The ultrasonic cleaning device 6 is provided with an ultrasonic generator, and at a proper stage in the cutting process, the cutting line can be cleaned by ultrasonic cleaning. The ultrasonic waves produce high-frequency vibrations in the cleaning liquid, and these vibrations can make the residues attached to the cutting line be subjected to strong impact and be separated, and the frequency and time of the ultrasonic cleaning can be determined according to the type and accumulation degree of the residues. Generally, the ultrasonic cleaning device 6 is started to clean for 10-15 minutes after cutting a certain number of crystals or the cutting line works for a certain time, for example, after cutting for several hours or cutting a certain area of the crystal.
[0034] The above merely describes the embodiments of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the scope of claims of the present application.
Claims
1. A single crystal cutting device for manufacturing semiconductor transistors, characterized in that, The utility model provides a single crystal cutting device, including installation frame (1), the top of installation frame (1) is equipped with with cutting movement subassembly (2) of taking installation frame (1) and carries out vertical direction movement, be equipped with the line body cutting subassembly (3) of cutting to single crystal in installation frame (1), line body cutting subassembly (3) are rotatably connected between installation frame (1), be equipped with line body adjustment subassembly (4) of adjusting line body cutting subassembly (3) on installation frame (1), line body adjustment subassembly (4) and installation frame (1) between sliding fit, still be equipped with cutting liquid spraying subassembly (5) in installation frame (1), cutting liquid spraying subassembly (5) are located line body cutting subassembly (3) are set up, The line body cutting subassembly (3) includes a cutting wire, a first rotating wheel, a second rotating wheel and a cutting motor, the first rotating wheel and the second rotating wheel are symmetrically and rotatably connected to the installation frame (1), the cutting motor is located on the side wall of the installation frame (1) and is in transmission connection with the first rotating wheel, and the cutting wire is sleeved on the first rotating wheel and the second rotating wheel; The line body adjustment subassembly (4) includes two sliding blocks and two adjustment screws, two sliding grooves are formed in the side wall of the installation frame (1), the two sliding blocks are respectively arranged in the two sliding grooves, the sliding block is in sliding connection with the sliding groove, the adjustment screw is horizontally and rotatably connected to the installation frame (1) and is located at the sliding groove, the sliding block is in threaded connection with the adjustment screw, and the two ends of the second rotating wheel are rotatably connected to the two sliding blocks; The cutting liquid spraying subassembly (5) includes a horizontal electric sliding table, the horizontal electric sliding table is horizontally arranged in the installation frame (1), and the moving end of the horizontal electric sliding table is provided with a mounting plate; The mounting plate (51) is provided with a driving motor, a driving disc is arranged on the main shaft of the driving motor, a swing plate is rotatably arranged on the mounting plate (51), a swing groove is arranged on the swing plate, a driving column is arranged on the driving disc, the driving column is in sliding connection with the swing groove, the bottom of the swing plate is provided with a swing arc-shaped plate, and a plurality of liquid spraying nozzles are arranged at equal intervals on the swing arc-shaped plate.
2. A single crystal cutting apparatus for producing a semiconductor triode according to claim 1, wherein: The cutting movement subassembly (2) includes a positioning frame, a moving oil cylinder and two sliding rods, the moving oil cylinder is vertically connected to the positioning frame, the two sliding rods are symmetrically arranged on the top of the installation frame (1), the sliding rod is in sliding connection with the positioning frame, and the extension end of the moving oil cylinder is fixedly connected to the installation frame (1).
3. A single crystal cutting apparatus for producing a semiconductor triode according to claim 1, wherein: The mounting frame (1) is further provided with an ultrasonic cleaning device (6), and the cutting line (31) passes through the ultrasonic cleaning device (6).
Citation Information
Patent Citations
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CN112026035A
Novel sapphire cutting equipment
CN202952401U