Orientation Arrangement Device for Chip-Type Three-Terminal Multilayer Ceramic Filters

Abstract

The present application relates to an alignment device for a wide and thick uniform chip-type three-terminal multilayer ceramic filter, which includes a vibrating disk, a feeding mechanism, and an implanting mechanism. The vibrating disk drives the chip-type three-terminal multilayer ceramic filters therein to be horizontally arranged and lead to its discharge port; the inlet of the feeding mechanism is connected to the discharge port of the vibrating disk, and the feeding mechanism conveys the horizontally arranged chip-type three-terminal multilayer ceramic filters forward; a screening position is arranged on the feeding mechanism, and a removing mechanism is arranged at the screening position; the implanting mechanism is arranged at the end of the feeding mechanism; in the present application, a screening position is arranged on the feeding mechanism for conveying the horizontally arranged MLCF chips, and the MLCF chips with non-electrode surfaces facing upward are removed through the removing mechanism, so that the CD of the MLCF chips entering the implanting mechanism is facing the cutting inner electrode surface in the up and down direction, realizing the alignment of the wide and thick uniform chip-type three-terminal multilayer ceramic filter chips, and improving the alignment efficiency, production efficiency, and capping accuracy.

Description

Technical Field

[0001] This application relates to the technical field of slurry coating for chip three-terminal multilayer ceramic filters, and particularly to an alignment device for chip three-terminal multilayer ceramic filters. Background Art

[0002] With the rapid development of electronic information technology, as one of the three major electronic components, the multi-layer ceramic chip capacitor (MLCC) is continuously developing towards miniaturization, high capacitance, high frequency, etc. In various electronic circuit applications, various multi-layer ceramic chip filters (MLCF) with a three-terminal outer shape structure have developed rapidly. According to the internal structure, they include T-type multi-layer LC filters, π-type multi-layer LC filters, and C-type multi-layer filters (i.e., chip three-terminal capacitive filters). Among them, the chip three-terminal capacitive filter gradually replaces some high-capacitance MLCCs in some applications due to its superior high-frequency characteristics, lower equivalent series inductance (ESL), and smaller mounting area compared to MLCCs.

[0003] Both MLCF and MLCC are composed of multiple dielectric film sheets stacked in an interleaved manner. In addition to leading out internal electrodes in the chip length direction, internal electrodes are also led out in the width direction. By setting a grounding electrode, current can flow in from both ends of the MLCF and flow out through the middle grounding electrode, thereby shortening the current path by half. At the same time, due to the current flowing out in four electrode directions and the existence of self-inductance, the equivalent series inductance (ESL) of the MLCF can be greatly reduced.

[0004] The slurry coating operation of the MLCF grounding electrode is usually to load the ceramic body chips of the MLCF in an array arrangement through tools such as SUS carriers, JIG carriers, thin glue plates, and carrier tapes, so that the electrode surface to be slurry-coated at the waist is exposed. After a specific slurry coating process, the grounding electrode is coated on the electrode surface of the chip. After drying and turning over, the silver coating of the other grounding electrode is carried out and dried, so as to obtain an MLCF chip coated with a grounding external electrode.

[0005] Generally, for some MLCFs with inconsistent width and thickness, during the manufacturing process of their grounding electrodes, a physical method is usually adopted, that is, by processing high-precision tooling, using the dimensional differences of the chip in the width and thickness directions to identify and control the placement direction of the chip. After performing directional identification on the width and thickness directions of the chip and arranging them in an array, it can be ensured that when the chip is loaded by tooling such as SUS carrier board, JIG carrier board, thin glue board, and carrier tape, the electrode surface in the thickness direction is exposed at its waist. For some MLCFs with the same width and thickness, there is no dimensional deviation in the width and thickness directions, and it is impossible to perform width and thickness direction identification, orientation, and arrangement through simple physical methods. Only by relying on manual visual identification and arrangement can it be ensured that the electrode surface is exposed at the waist when it is loaded by tooling, resulting in a long arrangement time, low efficiency, high production cost, and difficulty in achieving mass production. Summary of the Invention

[0006] Based on this, the present application provides an orienting and arranging device for a chip-type three-terminal multilayer ceramic filter that can solve the above technical problems, which can perform orienting and arranging on MLCF chips with the same width and thickness, improve production efficiency, and reduce production costs.

[0007] The above object of the present application is achieved through the following technical solutions:

[0008] The present application provides an orienting and arranging device for a chip-type three-terminal multilayer ceramic filter. The width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides of its thickness direction. The device includes:

[0009] A vibrating disk that drives the chip-type three-terminal multilayer ceramic filters inside it to be arranged horizontally and lead to its discharge port;

[0010] A feeding mechanism. The inlet of the feeding mechanism is connected to the discharge port of the vibrating disk, and the feeding mechanism conveys the horizontally arranged chip-type three-terminal multilayer ceramic filters forward. A screening position is provided on the feeding mechanism, and a removing mechanism is provided at the screening position. The removing mechanism is used to remove the chip-type three-terminal multilayer ceramic filters horizontally placed in the second state from the feeding mechanism. Among them, the second state is that the chip-type three-terminal multilayer ceramic filter faces the up and down directions along both sides of the width surface;

[0011] An implanting mechanism is provided at the end of the feeding mechanism. The implanting mechanism is used to implant the chip-type three-terminal multilayer ceramic filters horizontally placed in the first state conveyed by the feeding mechanism into a carrier board. Among them, the first state is that the chip-type three-terminal multilayer ceramic filter faces the up and down directions along both sides of the thickness surface.

[0012] In an alternative embodiment, a first CCD camera is disposed above the screening position. The first CCD camera acquires an image of the chip-type three-terminal multilayer ceramic filter located at the screening position and sends it to the control terminal. The control terminal determines whether the chip-type three-terminal multilayer ceramic filter is in a first state or a second state based on the image, and controls the removal mechanism to remove the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state from the feeding mechanism.

[0013] In an alternative embodiment, the control terminal performs the following steps:

[0014] Acquire the original image of the chip-type three-terminal multilayer ceramic filter located at the screening position;

[0015] Convert the original image into a grayscale image;

[0016] Use an edge detection algorithm to extract all edges in the grayscale image;

[0017] Detect all contours in the image, filter out irrelevant contours according to preset positions or sizes, and obtain the chip contour;

[0018] Extract the chip area according to the chip contour;

[0019] In the chip area, perform secondary contour detection to determine whether there is a contour of a preset size at a preset position;

[0020] If so, determine that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the first state; if not, determine that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the second state, and control the removal mechanism to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

[0021] In an alternative embodiment, the device further includes a recycling track located on the side of the feeding mechanism. The recycling track is used to receive the chip-type three-terminal multilayer ceramic filter removed by the removal mechanism and send it into the vibrating disk.

[0022] In an alternative embodiment, the feeding mechanism includes a vibrating member and a linear vibrating track disposed on the vibrating member;

[0023] The removal mechanism includes a blowing hole, which is arranged on the side of the linear vibration track opposite to the recovery track. A connection channel corresponding to the blowing hole is also arranged on one side of the linear vibration track adjacent to the recovery track, and the connection channel connects the linear vibration track and the recovery track. The blowing hole is used to blow out gas to blow the chip-type three-terminal multilayer ceramic filter from the linear vibration track along the connection channel into the recovery track.

[0024] In an optional embodiment, a magnetic member is arranged below the connection channel, and the magnetic member extends along the direction of the connection channel to the lower parts of the feeding mechanism and the recovery track respectively.

[0025] In an optional embodiment, the implanting mechanism includes an implanting component, a horizontal moving platform and a second CCD camera;

[0026] A carrier board fixing position is arranged on the horizontal moving platform, and the second CCD camera is used to photograph the carrier board fixed on the carrier board fixing position and position it.

[0027] The horizontal moving platform moves the carrier board to a predetermined position according to the positioning information of the second CCD camera.

[0028] The implanting component is connected to the outlet of the feeding mechanism. The implanting component includes an implanting element, and the implanting element sequentially implants the chip-type three-terminal multilayer ceramic filter into the bearing holes of the carrier board.

[0029] In an optional embodiment, the implanting element is a punch. The implanting component further includes a planting port below the punch, and the size of the planting port is larger than the size of the chip-type three-terminal multilayer ceramic filter. The punch can adsorb the chip-type three-terminal multilayer ceramic filter that moves from the outlet of the feeding mechanism to above the planting port.

[0030] The horizontal moving platform moves the carrier board to below the planting port according to the positioning information of the second CCD camera, so that the unfilled bearing holes on the carrier board are aligned with the planting port and the punch.

[0031] The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter through the planting port into the bearing hole of the carrier board.

[0032] In an optional embodiment, the implanting element is a magnetic suction head, an implanting suction nozzle or an implanting manipulator. The magnetic suction head, the implanting suction nozzle or the implanting manipulator is used to adsorb or grasp the chip-type three-terminal multilayer ceramic filter and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing holes on the carrier board.

[0033] In an optional embodiment, the horizontal moving platform includes an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module, and a positioning and clamping assembly. The X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the fixed position of the carrier plate to move horizontally in the X direction and the Y direction; the positioning and clamping assembly is arranged at the fixed position of the carrier plate for fixing the carrier plate.

[0034] The device further includes a carrier plate loading position, a carrier plate unloading position, and a loading and unloading manipulator.

[0035] The loading and unloading manipulator is used to grab the empty carrier plate at the carrier plate loading position to the fixed position of the carrier plate, and the loading and unloading manipulator is also used to grab the carrier plate carrying the chip-type three-terminal multilayer ceramic filter from the fixed position of the carrier plate to the carrier plate unloading position.

[0036] The present application has the following beneficial effects:

[0037] For the chip-type three-terminal multilayer ceramic filter orientation arrangement device in the embodiment of the present application, the MLCF chips are arranged horizontally through a vibrating bowl, a screening position is set on the feeding mechanism for conveying the horizontally arranged MLCF chips, and the MLCF chips placed horizontally in the second state are removed through the removal mechanism, so that the CD of the MLCF chips entering the implantation mechanism is facing the up and down direction of the cutting inner electrode surface, thereby realizing the orientation arrangement of the chip-type three-terminal multilayer ceramic filter chips with consistent width and thickness, and improving the arrangement efficiency, production efficiency, and capping accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 It is a schematic structural diagram of a chip-type three-terminal multilayer ceramic filter with consistent width and thickness in an exemplary embodiment;

[0039] Figure 2 It is a schematic structural diagram of a chip-type three-terminal multilayer ceramic filter orientation arrangement device in an exemplary embodiment;

[0040] Figure 3 It is a schematic structural diagram of a vibrating bowl and a feeding mechanism in an exemplary embodiment;

[0041] Figure 4 It is a schematic structural diagram of a vibrating bowl, a feeding mechanism, and an implantation mechanism in an exemplary embodiment;

[0042] Figure 5 It is a schematic structural diagram of the loading and unloading of the carrier plate in an exemplary embodiment;

[0043] Figure 6 It is a schematic structural diagram of a carrier plate in an exemplary embodiment;

[0044] Figure 7 Schematic diagram of the structure of the MLCF chip in an exemplary embodiment.

[0045] Explanation of the reference numerals in the drawings:

[0046] 100, Orienting device for chip-type three-terminal multilayer ceramic filters; 110, Workbench;

[0047] 120, Vibration bowl; 121, Vibration base; 122, Hopper;

[0048] 130, Feeding mechanism; 131, Vibration member; 132, Linear vibration track; 1321, Air blowing hole; 1322, Air blowing device; 133, First CCD camera; 134, Connection channel; 135, Screening position;

[0049] 140, Implanting mechanism; 141, Implanting component; 1412, Punch; 142, Horizontal moving platform; 1422, High-precision X-axis servo linear module; 1423, High-precision Y-axis servo linear module; 143, Second CCD camera;

[0050] 150, Carrier plate;

[0051] 160, Recycling track;

[0052] 170, Loading position of the carrier plate;

[0053] 180, Unloading position of the carrier plate;

[0054] 190, Loading and unloading manipulator;

[0055] 200, Chip-type three-terminal multilayer ceramic filter. Detailed implementation manners

[0056] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the following provides a detailed description of the specific implementation manners of the present application. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0057] In addition, the terms "first", "first" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "first" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items.

[0059] In view of the technical problems in the background art, the present application provides an orientation arrangement device for a wide and thick uniform chip-type three-terminal multilayer ceramic filter, which can batch-orient the wide and thick uniform chip-type three-terminal multilayer ceramic filters in a specified wide and thick direction, so as to quickly perform the slurry dipping operation on the exposed waist grounding electrodes after loading the wide and thick uniform chip-type three-terminal multilayer ceramic filters (hereinafter referred to as MLCF chips), improving production efficiency and reducing production costs.

[0060] As Figure 1 shown, it is a schematic structural diagram of a wide and thick uniform MLCF chip 200, whose length, width and thickness (height) are a1, b1 and c1 respectively, where a1 > b1 = c1. Here, the statement b1 = c1 does not mean that the absolute values are equal, but that the two values are nearly equal or the range difference is very small. For example, the range difference between the two is ≤ 0.05 mm. Through a precision processing process, the tooling cannot achieve wide and thick direction orientation by relying on the physical method of the difference between the width and thickness of the chip itself, and it can be approximately considered that the two values are equal. The manufacturing process of MLCF chips usually includes processes such as batching, tape casting, printing, laminating, lamination, cutting, debinding, sintering, and end capping. Figure 1 The product form shown is a ceramic semi-finished product formed after sintering and chamfering. At both ends in the length direction, AB faces the inner electrode surface, with the inner electrode exposed, and an input electrode is formed at this position; at both ends in the thickness direction, CD faces the cutting inner electrode surface, with the inner electrode at the waist exposed, and a grounding electrode is formed at this position; at both ends in the width direction, EF faces the cover surface, with no inner electrode exposed, and the inner electrodes inside are parallel to Figure 1 the height direction.

[0061] End capping is the process of dipping slurry on the inner electrode surface facing AB and the inner electrode surface facing CD of the ceramic semi-finished product after sintering and chamfering, so as to connect the electrodes exposed on the same side in parallel to form external electrodes. Before the end capping process of the waist grounding electrode, the MLCF chips 200 need to be arrayed in a unified arrangement method so that the side with the inner electrode exposed at the waist faces the same direction, for example, downward, to avoid the simultaneous presence of EF facing the cover surface and CD facing the cutting surface, which may affect the accuracy of end capping.

[0062] In the prior art such as Patent No. CN117116676A, through holes for loading MLCF chips are provided on a carrier board. After arranging the MLCF chips in an array in the Figure 1 direction, they are batch-loaded into the through holes, so that the CD-facing cutting inner electrode surface faces the outside of the through holes, and slurry coating operation can be performed on the CD-facing cutting inner electrode surface.

[0063] In the prior art, to adjust MLCF chips with inconsistent width and thickness to the Figure 1 arrangement, a high-precision tooling can be used to identify and control the placement direction of the chips by utilizing the dimensional differences of the chips in the width and thickness directions, and perform directional identification and array arrangement on the width and thickness directions of the chips. However, for MLCF chips with consistent width and thickness, the prior art cannot arrange them.

[0064] To address this technical problem, an embodiment of the present application provides an orienting and arranging device 100 for a chip-type three-terminal multilayer ceramic filter with consistent width and thickness. As Figures 2 - 6 shown, in one embodiment, the orienting and arranging device 100 for a chip-type three-terminal multilayer ceramic filter includes a workbench 110, and a vibrating disk 120, a feeding mechanism 130, and an implanting mechanism 140 provided on the workbench 110. The vibrating disk 120 is used to laterally arrange the MLCF chips therein and lead them to its discharge port through vibration. The inlet of the feeding mechanism 130 is connected to the discharge port of the vibrating disk 120 and is used to convey the laterally arranged MLCF chips forward. The implanting mechanism is arranged at the end of the feeding mechanism and is used to implant the laterally placed MLCF chips into a carrier board for subsequent slurry coating operation.

[0065] In an alternative embodiment, as Figures 3 - 4 shown, the vibrating disk 120 includes a vibrating base 121 and a hopper 122. The vibrating base 121 is fixed on the workbench 110, the hopper 122 is fixed at the upper end of the vibrating base 121, the bottom of the hopper 122 is a material receiving pool, and a spiral ascending discharge track is provided along its inner wall. The vibrating base 121 drives the hopper 122 to perform torsional pendulum vibration around its vertical axis. The MLCF chips in the material receiving pool of the hopper 122 rise and move one by one along the spiral discharge track with the torsional pendulum vibration and are orderly arranged laterally at the discharge port of the vibrating disk 120.

[0066] Preferably, the feeding mechanism 130 can convey the MLCF chips forward through vibration. As Figures 3 - 4 shown, in one embodiment, the feeding mechanism 130 includes a vibrating member 131 and a linear vibrating track 132 provided on the vibrating member 131. The linear vibrating track 132 is inclined downward, and the vibrating member 131 drives the MLCF chips on the linear vibrating track 132 to vibrate and move forward.

[0067] In this embodiment, after the MLCF chip enters the feeding mechanism 130 horizontally, it presents in a first state or a second state. The first state is that both sides of the MLCF chip along the thickness plane face the up and down directions. For example Figure 1 That is, the MLCF chip is placed in the first state, and the grounding electrodes at its waist are exposed in the up and down directions; the second state is that both sides of it along the width plane face the up and down directions, that is Figure 1 For the MLCF chip, its EF faces the cover plane on the upper and lower sides, and the grounding electrodes at its waist are exposed in the left and right side directions.

[0068] In this embodiment, it is necessary to remove the MLCF chip placed in the second state from the feeding mechanism 130. As Figure 3 shown, a screening position 135 is provided on the feeding mechanism 130, and a removing mechanism is provided at the screening position 135. The removing mechanism is used to remove the MLCF chip placed in the second state from the feeding mechanism 130. Specifically, when the removing mechanism operates, the feeding mechanism 130 can be paused or continue its conveying process according to its conveying speed.

[0069] Specifically, the removing mechanism can be implemented by a manipulator, a blowing mechanism, or other related mechanisms that can remove the MLCF chip from the feeding mechanism 130. Specifically, the removing mechanism can move the MLCF chip from the feeding mechanism 130 to the vibrating disk 110 for re-screening, or move it to the recycling device for recycling, waiting for the next round of screening.

[0070] In this embodiment, it can be judged whether the MLCF chip moved to the screening position 135 of the feeding mechanism 130 is placed in the first state or the second state by means of manual visual inspection or machine vision inspection. To realize the state detection of the MLCF chip, if there is an upper cover above the feeding mechanism 130, a window for observation is provided above the screening position 135.

[0071] The implanting mechanism 140 is used to implant the horizontally placed chip-type three-terminal multilayer ceramic filter conveyed by the feeding mechanism 130 into the carrier plate 150; as Figure 6 shown, in this embodiment, a plurality of carrier holes for loading MLCF chips are arranged in an array on the carrier plate 150, and the size of each carrier hole is slightly smaller than that of the horizontally placed MLCF chip, so that after the MLCF chip is horizontally implanted into the carrier hole by the implanting mechanism 140, it can be more stable for the next slurry dipping operation in the carrier hole.

[0072] The working process of the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter in this embodiment is as follows:

[0073] Step 1: Place the MLCF chip into the vibrating bowl 120. Through the vibration of the vibrating bowl, the MLCF chip spirally ascends in the vibrating bowl and enters the feeding mechanism 130 in a horizontal arrangement.

[0074] Step 2: The feeding mechanism 130 conveys the MLCF chip forward. When it is conveyed to its screening position 135, visually or through machine vision, it is detected whether the MLCF chip passing through the screening position 135 is placed horizontally in the first state or the second state. If it is in the second state, the removal mechanism removes it from the feeding mechanism 130.

[0075] Step 3: The feeding mechanism 130 continues to convey the MLCF chip placed horizontally in the first state forward to the implanting mechanism 140. The implanting mechanism 140 implants the MLCF chip into the bearing holes of the bearing plate 150, and then an MLCF chip arranged in the width-thickness direction can be obtained. After applying the external electrode by a specific slurry application process at the grounding electrode at the waist of the MLCF chip, drying and turning it over, then applying and drying the grounding electrode on the other side, and after high-temperature sintering, an MLCF chip coated with the grounding external electrode can be obtained.

[0076] The directional arrangement device of the chip-type three-terminal multilayer ceramic filter in the embodiment of the present application arranges the MLCF chips horizontally through the vibrating bowl, sets a screening position on the feeding mechanism for conveying the horizontally arranged MLCF chips, and removes the MLCF chips placed horizontally in the second state through the removal mechanism, so that the CD of the MLCF chips entering the implanting mechanism is facing the up-down direction with the cutting inner electrode surface, thereby realizing the directional arrangement of the chip-type three-terminal multilayer ceramic filter chips with consistent width and thickness, and improving the arrangement efficiency, production efficiency and capping accuracy.

[0077] In an optional embodiment, as Figure 3 and Figure 4 shown, a first CCD camera 133 is arranged above the screening position 135. The first CCD camera 133 acquires the image of the MLCF chip located at the screening position 135 and sends it to the control terminal. The control terminal determines whether the MLCF chip is in the first state or the second state according to the image, and controls the removal mechanism to remove the MLCF chip placed horizontally in the second state from the feeding mechanism 130.

[0078] Referring to Figure 7 shown, it is a schematic diagram of MLCF chips with inconsistent width and thickness ( Figure 7 the sizes of the multiple MLCF chips in it are not the same), where A is placed in the first state and B is placed in the second state. It can be seen from the figure that A shows a more obvious inner electrode pattern.

[0079] Based on this, in a preferred embodiment, the control terminal executes the following steps:

[0080] S301: Obtain the original image of the chip-type three-terminal multilayer ceramic filter located at the screening position;

[0081] S302: Convert the original image into a grayscale image to remove the color information in the original color image, so as to simplify the subsequent image processing;

[0082] S303: Use an edge detection algorithm to extract all the edges in the grayscale image; Preferably, use the Canny edge detection algorithm to extract all the edges in the image to ensure that it includes the external contour of the chip and any possible internal electrodes.

[0083] S304: Detect all the contours in the image, and filter out the irrelevant contours according to the preset position or size to obtain the chip contour; Preferably, detect all the contours in the image through the findContours function.

[0084] S305: Extract the chip area according to the chip contour;

[0085] S306: In the chip area, perform secondary contour detection to determine whether there is a contour with a preset size at a preset position;

[0086] Preferably, step S306 includes the following sub-steps:

[0087] S3061: Perform binarization processing on the extracted chip area to distinguish the internal electrode pattern from other areas;

[0088] S3062: In order to remove possible small noises or interfering objects, use morphological operations (such as opening operation) to further clean the debris in the chip area and retain the possible electrode patterns;

[0089] S3063: In the cleaned chip area, use the contour detection method to find the internal electrode stripes. Since the internal electrode pattern is a slender stripe, it can be discriminated by its shape characteristics (such as aspect ratio).

[0090] S307: If there is, then determine that the chip-type three-terminal multilayer ceramic filter in the original image is in the first state and placed horizontally;

[0091] S308: If not, then determine that the chip-type three-terminal multilayer ceramic filter in the original image is in the second state and placed horizontally, and control the removal mechanism to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

[0092] Such as Figures 3 - 4As shown, in one embodiment, the orienting arrangement device 100 of the chip-type three-terminal multilayer ceramic filter further includes a recycling track 160. The recycling track 160 is located on the side of the feeding mechanism 130 and is used to receive the MLCF chips removed by the removing mechanism and send them into the vibrating bowl 120.

[0093] Preferably, the recycling track 160 also drives the MLCF chips thereon to move upward above the hopper 122 in a vibrating manner to be recycled into the hopper 122.

[0094] As Figures 3 - 4 shown, in a preferred embodiment, the removing mechanism includes a blowing device 1322 and a blowing hole 1321. The blowing hole 1321 is arranged on the side of the linear vibrating track 132 opposite to the recycling track. A connection channel 134 corresponding to the blowing hole is also arranged on one side of the linear vibrating track 132 adjacent to the recycling track. The connection channel 134 connects the linear vibrating track 132 and the recycling track 160; the blowing hole 1321 is connected to the blowing device 1322, and the blowing device 1322 blows out gas through the blowing hole 1321 to blow the MLCF chips from the linear vibrating track 132 along the connection channel 134 into the recycling track 160. In a specific embodiment, the blowing device 1322 can be a nozzle or a controllable gas source pipeline.

[0095] In a preferred embodiment, the recycling track 160 can be arranged on the side of the linear vibrating track 132. The connection channel can be a through hole penetrating the recycling track 160 and the linear vibrating track 132. The blowing hole 1321 is connected to the blowing device 1322, and the blowing device 1322 blows out gas through the blowing hole 1321 to blow the MLCF chips from the connection through hole 134 into the recycling track 160. Then, through the vibrating manner, the MLCF chips thereon are driven to be recycled into the hopper 122.

[0096] To prevent the blown gas from blowing the MLCF chips outside the recycling track 160, in a preferred embodiment, the side wall of the recycling track 160 far from the linear vibrating track 132 is set to be higher to block the MLCF chips. More preferably, the recycling track is set to be semi-surrounding, and only an opening facing the linear vibrating track 132 is left, and the opening is communicated with the connection channel 134.

[0097] To relieve the impact force when the MLCF chips are blown out, in a preferred embodiment, a magnetic member (not shown) is arranged below the connection channel 134, and the magnetic member extends along the direction of the connection channel to the lower part of the feeding mechanism and the lower part of the recycling track respectively.

[0098] In a traditional multi-layer ceramic chip capacitor, its internal electrodes are generally made of metal materials, and an external magnet has a relatively small magnetic adsorption force on it. In the embodiments of the present application, to increase the magnetic adsorption force, a nickel internal electrode material can be selected or a magnetic material such as nickel can be added to the internal electrodes, so that the internal electrodes have greater magnetism, and there are also internal electrodes exposed directly opposite the CD, increasing the magnetic attraction to the magnet. Therefore, in this embodiment, whether it is the CD directly opposite the cut internal electrode surface or the EF directly opposite the cover surface, it has a certain magnetism. A magnetic member is provided below the connection channel, which can relieve and control the moving speed of the MLCF chips blown onto the recovery track, avoiding damage caused by too fast an impact.

[0099] In one embodiment, an air valve (not shown) can be installed at the air blowing device 1322 to control the amount of the blown gas to ensure that the chips will not be blown out.

[0100] In one embodiment, as Figures 3 - 4 shown, the implanting mechanism 140 includes an implanting component 141, a horizontal moving platform 142 and a second CCD camera 143. Among them, the implanting component 141 is connected to the outlet of the feeding mechanism 130. The implanting component includes an implanting element, and the implanting element is used to sequentially implant the MLCF chips into the bearing holes on the bearing plate 150.

[0101] A bearing plate fixing position is provided on the horizontal moving platform 142. The second CCD camera 143 is used to photograph the bearing plate 150 fixed at the bearing plate fixing position and position it.

[0102] The horizontal moving platform 142 moves the bearing plate 150 to a predetermined position according to the positioning information of the second CCD camera 143, so that the implanting element can implant the MLCF chips output by the feeding mechanism 130 into the bearing holes on the bearing plate 150.

[0103] In a preferred embodiment, as Figure 4 shown, the implanting element includes a punch 1412. The implanting component 141 further includes a planting port (not shown) located below the punch 1412. The size of the planting port is larger than the size of the MLCF chip. After the MLCF chips enter the implanting mechanism 140 from the linear vibration track 132, they continue to move forward in an orderly manner according to the current arrangement, so that the foremost MLCF chip moves above the planting port, and the punch 1412 can adsorb the MLCF chips that move from the outlet of the feeding mechanism 130 above the planting port.

[0104] In this embodiment, the horizontal moving platform 142 moves the carrier plate 150 below the implanting assembly 141 according to the positioning information of the second CCD camera 143, aligning the unloaded carrier holes on the carrier plate 150 with the implanting ports and the punch 1412. The punch 1412 moves downward to implant the MLCF chip located above the implanting port into the corresponding carrier hole on the carrier plate 150 through the implanting port. Specifically, the punch 1412 is a high-speed electromagnet implanting mechanism, and the punch 1412 is driven to move up and down by a high-speed electromagnet. During the implanting process, the horizontal moving platform 142 continuously moves the carrier plate 150 according to the positioning information of the second CCD camera 143, so that the carrier holes on the carrier plate 150 without loaded MLCF chips sequentially move below the implanting port until all the carrier holes are loaded with MLCF chips.

[0105] In this embodiment, the punch 1412 has magnetism to adsorb the MLCF chip so that it does not fall below the implanting port. Alternatively, the implanting mechanism 140 further includes a vacuum adsorption assembly (not shown), and the vacuum adsorption assembly is communicated with the adsorption port opened at the bottom of the punch 1412 to adsorb the MLCF chip through the adsorption port. After the MLCF chip is implanted into the carrier hole, since the size of the carrier hole is slightly smaller than the size of the MLCF chip, when the punch 1412 rises, the adsorption force of the punch 1412 on the MLCF chip is less than the clamping force of the carrier hole on the MLCF chip, and the MLCF chip is firmly fixed in the carrier hole. In other embodiments, the punch can also stop vacuum adsorption after implanting the MLCF chip.

[0106] In a specific embodiment, to ensure that the MLCF chip just moves above the implanting port, the implanting mechanism forms a product flow channel between the outlet of the linear vibration track 132 and above the implanting port, and the product flow channel ends above the implanting port. Therefore, the continuously incoming MLCF chips in the product flow channel will push the frontmost MLCF chip above the implanting port, facilitating the punch to directly implant it. This driving force can also overcome the adsorption force of the punch 1412 on the MLCF chip, so that when the punch 1412 adsorbs the MLCF chip, the position of the MLCF chip can still move directly above the implanting port until all move directly above the implanting port.

[0107] In other embodiments, the implanting element can also be a magnetic suction head, an implanting suction nozzle or an implanting manipulator. The magnetic suction head and the implanting suction nozzle can adsorb the MLCF chip, and the implanting manipulator can grasp the MLCF chip. After the carrier plate 150 moves to a predetermined position, the magnetic suction head and the implanting suction nozzle or the implanting manipulator can implant the MLCF chip into the carrier hole of the carrier plate 150.

[0108] In this embodiment, the implanting nozzle or the implanting manipulator can move relatively flexibly. The implanting nozzle or the implanting manipulator sucks or grabs the MLCF chips output by the feeding mechanism 130 at a set position, and then implants them into the bearing holes. During the implanting process, the horizontal moving platform 142 can continuously move the bearing plate 150 according to the positioning information of the second CCD camera 143, so that the bearing holes on the bearing plate 150 without loaded MLCF chips are sequentially moved to the implanting positions of the implanting nozzle or the implanting manipulator until all the bearing holes are loaded with MLCF chips. In other examples, it can also be that the implanting nozzle or the implanting manipulator implants the MLCF chips into all the bearing holes of the bearing plate in sequence after the bearing plate moves to a predetermined position according to the positioning information of the second CCD camera 143.

[0109] Preferably, the implanting nozzle or the implanting manipulator is driven by a driving component, and the bearing plate 150 moves to a predetermined position below the implanting nozzle or the implanting manipulator, so that the implanting nozzle or the implanting manipulator can suck, grab and implant the MLCF chips through lateral movement and longitudinal movement.

[0110] In this embodiment, the implanting nozzle or the implanting manipulator can suck or grab the MLCF chips in a vision-assisted manner, or the feeding mechanism 130 outputs the MLCF chips to a designated position, and the implanting nozzle or the implanting manipulator defaults to suck or grab at a set position.

[0111] In a preferred embodiment, as Figure 4 shown, the horizontal moving platform 142 includes an X-axis high-precision servo linear module 1422, a Y-axis high-precision servo linear module 1423 and a positioning and clamping component (not shown). The X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 drive the fixed position of the bearing plate to move horizontally in the X direction and the Y direction; the positioning and clamping component is arranged at the fixed position of the bearing plate for fixing the bearing plate.

[0112] Specifically, the X-axis high-precision servo linear module 1422 and the Y-axis high-precision servo linear module 1423 can be the driving party and the driven party to each other, and the positioning and clamping component can be a snap component or a vacuum suction component.

[0113] In one embodiment, as Figure 2 and Figure 5 shown, the directional arrangement device 100 of the chip-type three-terminal multilayer ceramic filter further includes a bearing plate loading position 170, a bearing plate unloading position 180 and a loading and unloading manipulator 190.

[0114] The loading and unloading manipulator 190 is used to grab the empty carrier plate 150 at the loading position 170 of the carrier plate and place it at the carrier plate fixing position. The loading and unloading manipulator 190 is also used to grab the carrier plate 150 carrying MLCC chips from the carrier plate fixing position and place it at the unloading position 180 of the carrier plate.

[0115] In one embodiment, according to the actual production efficiency requirements, multiple sets of vibrating bowls 120 and their other spare parts can be combined to achieve the synchronous operation mode of multiple vibrating bowls, multiple tracks, and multiple implanting units, so as to achieve the purpose of improving production efficiency.

[0116] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0117] The above-described embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims, and the specification can be used to explain the content of the claims.

Claims

1. A directional arrangement device for a chip-type three-terminal multilayer ceramic filter, wherein the width and thickness of the chip-type three-terminal multilayer ceramic filter are the same, and the inner electrodes are exposed on both sides of the thickness direction; characterized in that: The device comprises: A vibration plate, wherein the vibration plate drives a chip-type three-terminal multilayer ceramic filter arranged transversely therein to lead to a discharge port thereof; A feeding mechanism, wherein the inlet of the feeding mechanism is connected to the outlet of the vibration plate, and the feeding mechanism conveys the chip-type three-terminal multilayer ceramic filter arranged transversely and entering forward; the feeding mechanism is provided with a screening position, and the screening position is provided with a removal mechanism, and the removal mechanism is used to remove the chip-type three-terminal multilayer ceramic filter placed transversely in a second state from the feeding mechanism; wherein the second state is that the chip-type three-terminal multilayer ceramic filter is facing up and down along both sides of the width surface; An implantation mechanism, the implantation mechanism is arranged at the end of the feeding mechanism, and the implantation mechanism is used to implant the chip-type three-terminal multilayer ceramic filter placed horizontally in the first state conveyed by the feeding mechanism into the carrier board; wherein the first state is that the chip-type three-terminal multilayer ceramic filter is in the up and down directions along both sides of the thickness surface; The device further comprises a recovery track, which is located on the side of the feeding mechanism and is used to receive the chip-type three-terminal multilayer ceramic filter removed by the removal mechanism and feed it into the vibration disk; The feeding mechanism comprises a vibrating member and a straight vibration track arranged on the vibrating member; The removal mechanism includes an air blowing hole, which is arranged on the side of the straight vibration track opposite to the recovery track. A connecting channel corresponding to the air blowing hole is also arranged on the side of the straight vibration track adjacent to the recovery track, and the connecting channel connects the straight vibration track and the recovery track; the air blowing hole is used to blow out gas to blow the chip-type three-terminal multilayer ceramic filter from the straight vibration track along the connecting channel into the recovery track.

2. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: A first CCD camera is arranged above the screening position. The first CCD camera obtains an image of the chip-type three-terminal multilayer ceramic filter located at the screening position and sends it to the control terminal. The control terminal determines whether the chip-type three-terminal multilayer ceramic filter is in the first state or the second state according to the image, and controls the removing mechanism to remove the chip-type three-terminal multilayer ceramic filter placed horizontally in the second state from the feeding mechanism.

3. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 2, characterized in that: The control terminal performs the following steps: Acquire an original image of the chip-type three-terminal multilayer ceramic filter located at the screening position; Converting the original image into a grayscale image; Use edge detection algorithms to extract all edges in the grayscale image; Detect all contours in the image, filter out irrelevant contours according to preset positions or sizes, and obtain the chip contour; Extracting a chip area according to the chip outline; Perform secondary contour detection in the chip area to determine whether there is a contour of a preset size at a preset position; If yes, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the first state; if no, it is judged that the chip-type three-terminal multilayer ceramic filter in the original image is placed horizontally in the second state, and the removal mechanism is controlled to remove the chip-type three-terminal multilayer ceramic filter from the feeding mechanism.

4. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: A magnetic piece is arranged below the connecting passage, and the magnetic piece extends along the direction of the connecting passage to below the feeding mechanism and below the recovery track respectively.

5. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 1, characterized in that: The implantation mechanism comprises an implantation component, a horizontal moving platform and a second CCD camera; The horizontal moving platform is provided with a carrier plate fixing position, and the second CCD camera is used to photograph the carrier plate fixed on the carrier plate fixing position and position it; The horizontal moving platform moves the carrying plate to a predetermined position according to the positioning information of the second CCD camera; The implantation component is connected to the outlet of the feeding mechanism, and the implantation component includes an implantation element, which sequentially implants the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate.

6. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 5, characterized in that: The implant element is a punch, and the implant assembly further comprises an implant opening below the punch, the size of the implant opening being larger than the size of the chip-type three-terminal multilayer ceramic filter; the punch can absorb the chip-type three-terminal multilayer ceramic filter that moves from the outlet of the feeding mechanism to above the implant opening; The horizontal moving platform moves the carrying plate to below the implantation port according to the positioning information of the second CCD camera, so that the unloaded carrying hole on the carrying plate is aligned with the implantation port and the punch; The punch moves downward to implant the chip-type three-terminal multilayer ceramic filter into the bearing hole of the bearing plate through the implantation opening.

7. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 5, characterized in that: The implantation element is a magnetic suction head, an implantation nozzle or an implantation manipulator, and the magnetic suction head, the implantation nozzle or the implantation manipulator is used to adsorb or grab the chip-type three-terminal multilayer ceramic filter, and implant the chip-type three-terminal multilayer ceramic filter into the corresponding bearing hole on the bearing plate.

8. The directional arrangement device of the chip-type three-terminal multilayer ceramic filter according to claim 5, characterized in that: The horizontal moving platform includes an X-axis high-precision servo linear module, a Y-axis high-precision servo linear module and a positioning clamping assembly. The X-axis high-precision servo linear module and the Y-axis high-precision servo linear module drive the carrier plate fixed position to move horizontally along the X direction and the Y direction; the positioning clamping assembly is arranged at the carrier plate fixed position for fixing the carrier plate; The device also includes a loading position on the carrier plate, a loading position on the carrier plate, and a loading and unloading manipulator; The loading and unloading robot is used to grab the empty loading plate at the loading position of the loading plate to the loading plate fixed position, and the loading and unloading robot is also used to grab the loading plate carrying the chip-type three-terminal multilayer ceramic filter from the loading plate fixed position to the loading plate unloading position.

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