Semiconductor device feeding device

Abstract

The invention relates to the technical field of semiconductor device processing, and particularly discloses a semiconductor device feeding device which can pour a plurality of semiconductor devices into a vibration disc in advance, after a vibration motor of the vibration disc is started, the semiconductor devices are conveyed to a conveying channel along a spiral material channel, and then high-pressure gas is introduced into an inclined gas hole; the semiconductor device can move along the conveying channel under the oblique blowing action of high-pressure gas, the top plate is arranged to be of a structure capable of moving up and down, the semiconductor device can be pressed down by driving the top plate to move up and down, the top edge of the semiconductor device is prevented from clamping the bottom face of the top plate, and therefore the material clamping phenomenon is avoided; and the semiconductor device can be smoothly conveyed.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device processing, and in particular to a semiconductor device feeding device. Background Art

[0002] In the production process of semiconductor devices, a vibration plate is usually used for vibrating and loading. The discharge end of the vibration plate is then connected to a feed track, and the semiconductor devices are transported to the next workstation through the feed track.

[0003] The feed track of the prior art, such as Figure 1 As shown, the feed track adopts oblique blowing air holes, and the semiconductor device 30 is blown by the inclined high-pressure airflow to move the semiconductor device 30. However, since the internal height of the feed track is consistent, when a semiconductor device 30 with a low height passes through, it is easy to be lifted up by the high-pressure airflow, and the top edge of the semiconductor device 30 is stuck on the bottom surface of the top plate of the feed track, resulting in material jamming and failure to transport smoothly.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies of the prior art, an object of the present invention is to provide a semiconductor device feeding device to solve the problem that the semiconductor devices in the prior art are prone to warping during the process of advancing in the track.

[0006] A semiconductor device feeding device comprises a vibration plate, the vibration plate is provided with a spiral material channel, the discharge end of the spiral material channel is connected to a track conveying assembly, the track conveying assembly comprises a straight track, a partition and a top plate, the straight track is provided with a straight groove, the partition is arranged in the straight groove and divides the straight groove into an air channel located below and a conveying channel located above, the conveying channel is connected to the discharge end of the spiral material channel, the partition is provided with a plurality of inclined air holes that connect the air channel and the conveying channel, and the top plate can move up and down above the conveying channel.

[0007] Specifically, the track conveying assembly also includes a height maintaining mechanism, which includes a plurality of springs connected between the top plate and the straight track, and a pressure block disposed above the top plate and used to press the top plate, and the height of the pressure block is adjustable.

[0008] Specifically, the track conveying assembly also includes a vibrating unloading mechanism, which includes a side plate detachably fixed to one side of the straight track and a lifting drive device fixed to the side plate, and the pressing block is connected to the output end of the lifting drive device.

[0009] Specifically, the lifting drive device is a cylinder, and there are two of the lifting drive device and the pressing block.

[0010] Specifically, the track conveying assembly also includes a quick-release mechanism, which includes a pin connected to the bottom of the side panel, a socket provided on the side of the straight track and plugged into the pin, a mounting seat fixed to one side of the straight track, a baffle whose lower end is rotatably connected to the mounting seat, and a locking member for locking the baffle and the mounting seat, wherein the upper end of the baffle can be swung to one side of the side panel to limit and fix the side panel.

[0011] Specifically, the locking member is a quick-release screw.

[0012] Specifically, an air intake joint connected to the air channel is provided on the outer side of the straight track.

[0013] Specifically, a hollow groove is provided at the inner bottom of the vibration plate, and an upwardly arched guide seat is detachably connected to the hollow groove, a spirally ascending bottom plate is provided at the periphery of the guide seat, a filtering area is provided on the bottom plate, and a plurality of filtering holes are provided in the filtering area. A dust box is provided below the filtering holes, and the dust box is located in the hollow groove.

[0014] Beneficial effects of the present invention:

[0015] The semiconductor device feeding device of the present invention can pour a number of semiconductor devices into a vibration plate in advance. After the vibration motor of the vibration plate is started, the semiconductor devices are transported to the conveying channel along the spiral material channel, and then high-pressure gas is introduced into the inclined air holes. Through the oblique blowing effect of the high-pressure gas, the semiconductor devices can move along the conveying channel. Moreover, the top plate is set to a structure that can move up and down. By driving the top plate to move up and down, the semiconductor devices can also be pressed down to prevent the top edge of the semiconductor device from getting stuck on the bottom surface of the top plate, thereby avoiding the material jamming phenomenon and ensuring that the semiconductor devices can be smoothly transported. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the feeding track conveying semiconductor devices in the prior art;

[0017] Figure 2 A three-dimensional diagram of a semiconductor device feeding device of the present application;

[0018] Figure 3 A three-dimensional diagram of the track conveying assembly of the present application;

[0019] Figure 4 A three-dimensional cross-sectional view of the track conveying assembly of the present application;

[0020] Figure 5 It is a front view of the track conveying assembly of the present application;

[0021] Figure 6 A right side view of the track conveying assembly of the present application;

[0022] Figure 7 A top view of the vibration plate of the present application;

[0023] Figure 8 for Figure 7 Sectional view along line BB;

[0024] Fig. 9 for Figure 8 Magnified view of part C.

[0025] The figures are marked as: vibration disk 10, spiral material channel 11, track conveying assembly 20, straight track 21, partition 22, top plate 23, air channel 201, conveying channel 202, air hole 203, height maintaining mechanism 24, spring 241, pressure block 242, vibration unloading mechanism 25, side plate 251, lifting drive device 252, quick release mechanism 26, latch 261, socket 262, mounting seat 263, baffle 264, locking piece 265, air intake connector 27, hollow groove 12, guide seat 13, bottom plate 14, filter hole 15, dust collection box 16, semiconductor device 30. DETAILED DESCRIPTION

[0026] The present invention provides a semiconductor device feeding device. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention and are not used to limit the present invention.

[0027] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0028] like Figures 1 to 9The present embodiment discloses a semiconductor device feeding device, including a vibration plate 10, the vibration plate 10 is provided with a spiral material channel 11, the discharge end of the spiral material channel 11 is connected to a track conveying assembly 20, the track conveying assembly 20 includes a straight track 21, a partition 22 and a top plate 23, the straight track 21 is provided with a straight groove, the partition 22 is arranged in the straight groove and divides the straight groove into an air channel 201 located below and a conveying channel 202 located above, the conveying channel 202 is connected to the discharge end of the spiral material channel 11, the partition 22 is provided with a plurality of inclined air holes 203 connecting the air channel 201 and the conveying channel 202, and the top plate 23 can move up and down above the conveying channel 202.

[0029] The semiconductor device feeding device of the present embodiment can pour a number of semiconductor devices 30 into the vibration plate 10 in advance. After the vibration motor of the vibration plate 10 is started, the semiconductor devices 30 are transported to the conveying channel 202 along the spiral material channel 11, and then high-pressure gas is introduced into the inclined air hole 203. Through the oblique blowing effect of the high-pressure gas, the semiconductor devices 30 can move along the conveying channel 202. In addition, the top plate 23 is set to a structure that can move up and down. By driving the top plate 23 to move up and down, the semiconductor devices 30 can also be pressed down to prevent the top edge of the semiconductor device 30 from being stuck on the bottom surface of the top plate 23, thereby avoiding the material jamming phenomenon and ensuring that the semiconductor devices 30 can be smoothly transported.

[0030] For further information, please refer to Figure 2 , Figure 5 and Figure 6 The track conveying assembly 20 of this embodiment also includes a height holding mechanism 24, which includes a plurality of springs 241 connected between the top plate 23 and the straight track 21, and a pressing block 242 arranged above the top plate 23 and used to press the top plate 23. The height of the pressing block 242 is adjustable, and the height of the pressing block 242 can be adjusted according to the height of the semiconductor device 30, thereby adjusting the height of the conveying channel 202. The height of the conveying channel 202 can be set to be slightly larger than the height of the semiconductor device 30 to avoid contact between the bottom surface of the top plate 23 and the semiconductor device 30, thereby reducing the conveying resistance. A plurality of springs 241 are arranged between the top plate 23 and the straight track 21, and the top plate 23 has a certain downward buffer space. When one end of the semiconductor device 30 is blown up by the inclined airflow, the top plate 23 can be driven to move up and down, thereby pressing the semiconductor device 30 down, correcting the conveying posture of the semiconductor device 30, and ensuring that the semiconductor device 30 can be smoothly conveyed.

[0031] For further information, please refer to Figure 6The track conveying assembly 20 of this embodiment also includes a vibrating unloading mechanism 25, which includes a side plate 251 detachably fixed to one side of the straight track 21, and a lifting drive device 252 fixed to the side plate 251. The pressing block 242 is connected to the output end of the lifting drive device 252. The lifting drive device 252 drives the pressing block 242 to move up and down, thereby pressing or vibrating the semiconductor device 30 on the bottom surface of the top plate 23 to avoid material jamming.

[0032] Furthermore, the lifting drive device 252 of this embodiment is a cylinder, which generates force by compressing air or gas. The cylinder moves very fast and can achieve high-frequency driving of the pressure block 242, so that the semiconductor device 30 on the bottom surface of the top plate 23 can be quickly pressed down or vibrated off.

[0033] For further information, please refer to Figure 5 There are two lifting drive devices 252 and two pressing blocks 242. By providing two lifting drive devices 252 and two pressing blocks 242, the stability of the up and down movement of the top plate 23 is improved.

[0034] In addition, the track conveying assembly 20 needs to be disassembled for inspection and maintenance regularly. Based on this, the present embodiment further adds a quick-release mechanism 26, which includes a pin 261 connected to the bottom of the side panel 251, a socket 262 provided on the side of the straight track 21 and plugged with the pin 261, a mounting seat 263 fixed to one side of the straight track 21, a baffle 264 rotatably connected to the mounting seat 263 at the lower end, and a locking member 265 for locking the baffle 264 and the mounting seat 263. The upper end of the baffle 264 can be swung to one side of the side panel 251 to limit and fix the side panel 251. When it needs to be disassembled for inspection and maintenance, the locking member 265 can be loosened, the upper end of the baffle 264 can be swung downward, and then the vibrating feeding mechanism 25 can be removed. After the vibrating feeding mechanism 25 is removed, the top plate 23 can be directly disassembled to achieve quick disassembly and assembly.

[0035] Furthermore, the locking member 265 of the present embodiment is a quick-release screw, which can be easily installed and removed, thereby greatly reducing the time and cost of equipment maintenance and replacement.

[0036] Please refer to Figure 2 In this embodiment, an air intake connector 27 connected to the air channel 201 is provided on the outside of the straight track 21. The air intake connector 27 is connected to the air supply device through a pipeline. The air supply device provides high-pressure gas to the air intake connector 27. The high-pressure gas then flows into the air channel 201 and is blown toward the conveying channel 202 through the inclined air holes 203, thereby pushing the semiconductor device 30 in the conveying channel 202.

[0037] When the vibration plate 10 vibrates, particles or debris are easily generated. Based on this, please refer to Figures 7 to 9In this embodiment, a hollow groove 12 is provided at the inner bottom of the vibration plate 10, and an upwardly arched guide seat 13 is detachably connected to the hollow groove 12, and a spirally ascending bottom plate 14 is provided on the periphery of the guide seat 13, and a filtering area is provided on the bottom plate 14, and a plurality of filtering holes 15 are provided in the filtering area. A dust collecting box 16 is provided below the filtering holes 15, and the dust collecting box 16 is located in the hollow groove 12. During the vibration process, particles or debris can fall through the filtering holes 15 into the dust collecting box 16 for collection.

[0038] In addition, in this embodiment, the guide seat 13 is designed to be a detachable structure. When it is necessary to clean the particles or debris in the dust box 16, the guide seat 13 can be removed and the dust box 16 can be taken out of the hollow groove 12 for cleaning.

[0039] The preferred embodiments of the present invention are specifically described above, but the present invention is not limited to the embodiments. Those skilled in the art may make various equivalent modifications or substitutions without violating the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. A semiconductor device feeding device, comprising a vibration plate (10), wherein the vibration plate (10) is provided with a spiral material channel (11), and the discharge end of the spiral material channel (11) is connected to a track conveying component (20), characterized in that: The track conveying assembly (20) comprises a straight track (21), a partition (22) and a top plate (23); a straight groove is provided on the straight track (21); the partition (22) is arranged in the straight groove and divides the straight groove into an air channel (201) located below and a conveying channel (202) located above; the conveying channel (202) is connected to the discharge end of the spiral material channel (11); the partition (22) is provided with a plurality of inclined air holes (203) connecting the air channel (201) and the conveying channel (202); and the top plate (23) can move up and down above the conveying channel (202).

2. A semiconductor device feeding device according to claim 1, characterized in that: The track conveying assembly (20) further comprises a height maintaining mechanism (24), wherein the height maintaining mechanism (24) comprises a plurality of springs (241) connected between the top plate (23) and the straight track (21), and a pressing block (242) disposed above the top plate (23) and used for pressing the top plate (23), wherein the height of the pressing block (242) is adjustable.

3. A semiconductor device feeding device according to claim 2, characterized in that: The track conveying assembly (20) further comprises a vibrating material discharging mechanism (25), the vibrating material discharging mechanism (25) comprising a side plate (251) detachably fixed to one side of the straight track (21), and a lifting drive device (252) fixed to the side plate (251), and the pressing block (242) is connected to an output end of the lifting drive device (252).

4. A semiconductor device feeding device according to claim 3, characterized in that: The lifting drive device (252) is a cylinder, and both the lifting drive device (252) and the pressing block (242) have two.

5. A semiconductor device feeding device according to claim 1, characterized in that: The track conveying assembly (20) further comprises a quick-release mechanism (26), the quick-release mechanism (26) comprising a latch (261) connected to the bottom of the side plate (251), a socket (262) provided on the side of the straight track (21) and plugged with the latch (261), a mounting seat (263) fixed to one side of the straight track (21), a stop bar (264) rotatably connected to the mounting seat (263) at the lower end, and a locking member (265) for locking the stop bar (264) and the mounting seat (263), wherein the upper end of the stop bar (264) can swing to one side of the side plate (251) to limit and fix the side plate (251).

6. A semiconductor device feeding device according to claim 5, characterized in that: The locking member (265) is a quick-release screw.

7. A semiconductor device feeding device according to claim 1, characterized in that: An air intake joint (27) connected to the air channel (201) is provided on the outside of the straight track (21).

8. A semiconductor device feeding device according to claim 1, characterized in that: The inner bottom of the vibration plate (10) is provided with a hollow groove (12), an upwardly arched guide seat (13) is detachably connected to the hollow groove (12), a spirally ascending bottom plate (14) is provided on the periphery of the guide seat (13), a filtering area is provided on the bottom plate (14), a plurality of filtering holes (15) are provided in the filtering area, a dust collecting box (16) is provided below the filtering holes (15), and the dust collecting box (16) is located in the hollow groove (12).

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