Welding spot detection method and device for new energy circuit board

Abstract

The invention provides a welding spot detection method and device for a new energy circuit board. The method comprises the following steps: acquiring temperature distribution data of a to-be-detected welding spot on the new energy circuit board and image data of the new energy circuit board; respectively preprocessing the temperature distribution data and the image data to obtain preprocessed temperature distribution data and preprocessed image data; performing defect detection on a to-be-detected welding spot on the new energy circuit board according to a preset temperature threshold and the preprocessed temperature distribution data to obtain a defect detection result; according to the preprocessed image data, carrying out quantity detection on the to-be-detected welding spots on the new energy circuit board to obtain a quantity detection result; and obtaining a welding spot detection result according to the defect detection result, the number detection result and a preset welding spot detection condition. According to the invention, the efficiency and accuracy of welding spot detection on the new energy circuit board can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also to a method and device for detecting solder joints of a new energy circuit board. Background Art

[0002] Circuit boards are widely used in the field of new energy, and solder joints, as the connecting bridge between components on circuit boards, play a vital role in ensuring the stability and transmission efficiency of circuits. An appropriate amount of solder joints can ensure the stability and reliability of circuit boards and reduce the possibility of failures. However, too many or too few solder joints may lead to a decline in circuit performance and even cause safety problems such as short circuits. In addition, customers may specify the number range of solder joints in their orders, so manufacturers need to check the number of solder joints after soldering is completed to ensure that customer requirements are met. However, the existing detection of solder joints requires manual assistance, and the detection efficiency and effect are poor. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method and device for detecting solder joints of a new energy circuit board, so as to improve the detection efficiency and accuracy of solder joints on the new energy circuit board.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A first aspect of the present invention provides a method for detecting solder joints of a new energy circuit board, comprising:

[0006] Acquire temperature distribution data of solder joints to be inspected on new energy circuit boards and image data of new energy circuit boards;

[0007] Preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data;

[0008] Perform defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results;

[0009] Performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result;

[0010] A solder joint detection result is obtained according to the defect detection result, the quantity detection result and the preset solder joint detection condition.

[0011] Optionally, obtaining temperature distribution data of the solder joints to be detected on the new energy circuit board and image data of the new energy circuit board includes:

[0012] According to the preset measurement conditions, the new energy circuit board is scanned using a scanning device to obtain the temperature distribution data of the solder joints to be tested on the new energy circuit board;

[0013] According to the preset acquisition conditions, the image acquisition device is used to acquire images of the new energy circuit board to obtain image data of the new energy circuit board.

[0014] Optionally, preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data includes:

[0015] Performing data correction, data denoising, data standardization, outlier processing and gradient calculation on the temperature distribution data to obtain pre-processed temperature distribution data;

[0016] The image data is subjected to grayscale processing, denoising processing, binarization processing and morphological processing to obtain pre-processed image data.

[0017] Optionally, defect detection is performed on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results, including:

[0018] Obtaining a preset temperature threshold; the preset temperature threshold is determined according to the working state of the new energy circuit board under preset standard conditions;

[0019] Comparing the preprocessed temperature distribution data with the preset temperature threshold to obtain a comparison result;

[0020] According to the comparison result, defect detection is performed on the solder joints to be detected on the new energy circuit board to obtain defect detection results.

[0021] Optionally, performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result includes:

[0022] Performing connected labeling processing on the preprocessed image data to obtain connected areas;

[0023] Extracting features from the connected area to obtain feature data;

[0024] Determining screening conditions according to the characteristic data;

[0025] The quantity of the solder joints to be detected on the new energy circuit board is detected according to the screening condition and the connected area to obtain a quantity detection result.

[0026] Optionally, obtaining a solder joint detection result according to the defect detection result, the quantity detection result and a preset solder joint detection condition includes:

[0027] Obtaining preset solder joint detection conditions; the preset solder joint detection conditions include preset solder joint quality standards, preset solder joint defect tolerances, and preset solder joint quantity ranges;

[0028] Comparing the defect detection result with the preset solder joint quality standard to obtain a solder joint quality comparison result;

[0029] Comparing the quantity detection result with the preset welding point quantity range to obtain a welding point quantity comparison result;

[0030] Obtaining a solder joint inspection report according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance;

[0031] The solder joint inspection report is formatted according to a preset format to obtain a solder joint inspection result.

[0032] Optionally, a solder joint inspection report is obtained according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance, including:

[0033] Classifying defective solder joints in the solder joint quality comparison result according to the preset solder joint defect tolerance to obtain a classification result;

[0034] Performing a quality assessment on the solder joints to be detected on the new energy circuit board according to the classification result and the solder joint quantity comparison result to obtain a quality assessment result;

[0035] A solder joint inspection report is obtained according to the defect inspection result, the quantity inspection result, the preset solder joint inspection condition, the solder joint quality comparison result, the solder joint quantity comparison result, the classification result, and the quality assessment result.

[0036] A second aspect of the present invention provides a solder joint detection device for a new energy circuit board, comprising:

[0037] An acquisition module, used to acquire temperature distribution data of solder joints to be detected on the new energy circuit board and image data of the new energy circuit board;

[0038] The processing module is used to preprocess the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data; perform defect detection on the solder joints to be detected on the new energy circuit board according to a preset temperature threshold and the preprocessed temperature distribution data to obtain a defect detection result; perform quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result; and obtain a solder joint detection result according to the defect detection result, the quantity detection result and a preset solder joint detection condition.

[0039] According to a third aspect of the present invention, a computing device is provided, comprising: a processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to the first aspect is executed.

[0040] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions, which, when executed on a computer, causes the computer to execute the method described in the first aspect.

[0041] The above solution of the present invention includes at least the following beneficial effects:

[0042] The above scheme of the present invention obtains temperature distribution data of the solder joints to be detected on the new energy circuit board and image data of the new energy circuit board, and preprocesses the acquired data respectively, and then performs defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results, and performs quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain quantity detection results, and finally obtains solder joint detection results according to the defect detection results, quantity detection results and preset solder joint detection conditions, which can not only detect whether there are defects in the solder joints on the new energy circuit board, but also count the number of solder joints on the new energy circuit board, thereby achieving the purpose of improving the detection efficiency and accuracy of solder joints on the new energy circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic flow chart of a solder joint detection method for a new energy circuit board in an embodiment of the present invention;

[0044] Figure 2 It is a structural schematic diagram of a solder joint detection device for a new energy circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0045] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0046] like Figure 1 As shown, an embodiment of the present invention provides a solder joint detection method for a new energy circuit board, comprising the following steps:

[0047] Step 101, obtaining temperature distribution data of the solder joints to be detected on the new energy circuit board and image data of the new energy circuit board;

[0048] Step 102, preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data;

[0049] Step 103, performing defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results;

[0050] Step 104, performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result;

[0051] Step 105, obtaining a solder joint detection result according to the defect detection result, the quantity detection result and a preset solder joint detection condition.

[0052] The solder joint detection method of the new energy circuit board of the embodiment of the present invention obtains the temperature distribution data of the solder joint to be detected on the new energy circuit board and the image data of the new energy circuit board, and pre-processes the acquired data respectively, and then performs defect detection on the solder joint to be detected on the new energy circuit board according to the preset temperature threshold and the pre-processed temperature distribution data to obtain the defect detection result, and performs quantity detection on the solder joint to be detected on the new energy circuit board according to the pre-processed image data to obtain the quantity detection result, and finally obtains the solder joint detection result according to the defect detection result, the quantity detection result and the preset solder joint detection condition, which can not only detect whether there are defects in the solder joint on the new energy circuit board, but also count the number of solder joints on the new energy circuit board, thereby achieving the purpose of improving the detection efficiency and accuracy of the solder joints on the new energy circuit board.

[0053] In an optional embodiment of the present invention, step 101 includes:

[0054] Step 1011, scanning the new energy circuit board using a scanning device according to preset measurement conditions to obtain temperature distribution data of the solder joints to be detected on the new energy circuit board;

[0055] Specifically, a highly sensitive and high-resolution infrared detection device (such as an infrared thermal imager) can be used to scan the new energy circuit board under preset measurement conditions to obtain the temperature distribution data of the solder joints to be detected on the new energy circuit board, so as to ensure that the temperature distribution details on the circuit board can be accurately captured. Here, the preset measurement conditions may include: the scanning device (such as an infrared thermal imager) is calibrated (to ensure the accuracy of the measurement results), the ambient temperature does not change and there is no strong electromagnetic interference (under a stable ambient temperature to avoid the influence of temperature changes on the measurement results), the new energy circuit board is in a working state or a simulated working state (in order to accurately reflect the actual temperature distribution of the solder joints to be detected), and the scanning parameters (such as a temperature range of -40°C to 200°C, a resolution of 640×480, and a frame rate of at least 16Hz); in addition, before scanning, it should be ensured that the new energy circuit board has been preheated to a stable state. The temperature distribution data of the solder joints to be detected on the new energy circuit board scanned under the above preset measurement conditions are relatively accurate, which is conducive to improving the accuracy of solder joint detection.

[0056] The temperature distribution data can be used to detect whether there are defects in the solder joints in the future. For example, for solder joints with good welding quality, their temperature distribution curves are usually smoother, and the temperature variation range is within the normal range. The temperature distribution curves of these solder joints appear as a relatively stable horizontal line or a slightly fluctuating curve, indicating that the solder joints dissipate heat evenly during operation without abnormal heating. For solder joints with welding defects or overheating, their temperature distribution curves show obvious fluctuations or abnormal peaks. For example, solder joints with cold solder joints or loose solder joints result in uneven temperature distribution and local high or low temperature areas, while overheated solder joints show an obvious trend of temperature increase, even exceeding the normal operating temperature range of new energy circuit boards.

[0057] Step 1012: According to preset acquisition conditions, an image acquisition device is used to acquire an image of the new energy circuit board to obtain image data of the new energy circuit board.

[0058] Specifically, the preset acquisition conditions may include: the acquisition temperature range is 20 to 25°C, the acquisition humidity range is 30%RH to 60%RH, and may also include: good lighting conditions (such as acquisition under LED lights or halogen lights), ensuring that the acquisition area has sufficient and uniform lighting to reduce the impact of shadows and reflections on image quality; selecting appropriate image resolution according to the size and detail requirements of the new energy circuit board, etc. Using image acquisition equipment to acquire images of new energy circuit boards under the preset acquisition conditions can obtain high-quality image data of new energy circuit boards, which is conducive to improving the accuracy of subsequent solder joint quantity detection.

[0059] In an optional embodiment of the present invention, step 102 includes:

[0060] Step 1021, performing data correction, data denoising, data standardization, outlier processing and gradient calculation on the temperature distribution data to obtain pre-processed temperature distribution data;

[0061] Specifically, the temperature distribution data can be corrected by comparing the black body radiation of a known temperature with the temperature distribution data to reduce the data error; the temperature distribution data can be denoised by using a median filter or a Gaussian filter to improve the signal-to-noise ratio and reduce the impact of noise on the data. In a specific embodiment, the step of denoising the temperature distribution data by using a median filter includes:

[0062] Determine the preset window specification, for example, the preset window specification is a 3×3 window, and the temperature distribution data will be subsequently slid according to the preset window specification;

[0063] Collect the pixel values ​​of all temperature distribution data within the preset window specification, and arrange these values ​​in ascending order to obtain arrangement data;

[0064] Replace the value of the center pixel of the window with the middle value in the arranged data to obtain the denoised temperature distribution data. In this step, you can use the formula The denoised temperature distribution data is obtained, where Represents all pixel positions within a window centered at (x,y); is the pixel value of the image at position (x, y). The default window size is N×N, where N is an odd number. is the temperature distribution data after denoising.

[0065] The temperature distribution data is converted into a dimensionless form to eliminate the dimension difference between the data; the temperature distribution data is processed for outliers by deleting the temperature distribution data that does not meet the preset temperature distribution threshold to avoid the negative impact of outliers on subsequent data analysis; The temperature gradient is calculated as follows: is the gradient of temperature T, which indicates the rate and direction of change of temperature T in space; It is the partial derivative of temperature T with respect to the x-coordinate, which indicates the rate of change of temperature T with the x-coordinate when the y-coordinate remains unchanged; It is the partial derivative of temperature T with respect to the y coordinate, which indicates the rate of change of temperature T with the y coordinate when the y coordinate is fixed. The preprocessed temperature distribution data includes not only the temperature curve after data correction, data denoising, data standardization, and outlier processing, but also the temperature gradient.

[0066] Step 1022, performing grayscale processing, denoising processing, binarization processing and morphological processing on the image data to obtain pre-processed image data.

[0067] Specifically, the image data can be grayed by Gray=0.3R+0.59G+0.11B to obtain a gray image to simplify subsequent processing steps, wherein Gray is the gray value, and R, G, and B are the pixel values ​​of the red, green, and blue channels in the image data, respectively; then the gray image is subjected to median filtering or Gaussian filtering to obtain a denoised image to remove noise points in the gray image and improve image quality; then, according to a preset division threshold, the pixel points in the denoised image whose gray values ​​are greater than the preset division threshold are set as the foreground (i.e., the welding point), and those whose gray values ​​are less than the preset division threshold are set as the background to obtain a binary image; then the binary image is subjected to morphological processing such as corrosion, expansion, opening operation, and closing operation to remove small noise points in the binary image, fill holes, connect adjacent welding points, etc., to obtain preprocessed image data.

[0068] In an optional embodiment of the present invention, step 103 includes:

[0069] Step 1031, obtaining a preset temperature threshold; the preset temperature threshold is determined according to the working state of the new energy circuit board under preset standard conditions;

[0070] Specifically, the preset temperature threshold may include a maximum temperature threshold and a temperature gradient threshold, etc., so as to provide a standard for subsequent solder joint defect detection. The preset temperature threshold needs to be determined based on factors such as the material of the new energy circuit board, the normal operating temperature range of the new energy circuit board, the material properties of the solder joint, and the manufacturing process. For example, for solder joints on FR-4 glass fiber copper clad boards, the maximum temperature threshold can be set to 130°C to 150°C, while for solder joints on high-performance materials such as polyimide (PI) or polytetrafluoroethylene (PTFE), due to their excellent heat resistance, the maximum temperature threshold can be set to be greater than or equal to 250°C. The temperature gradient threshold can be set to no more than 5°C / mm or 10°C / mm. Here, the preset temperature threshold may include: a maximum temperature threshold of 130°C to 150°C or not less than 250°C (specific selection needs to be based on the material of the new energy circuit board), and a temperature gradient threshold of no more than 5°C / mm or 10°C / mm. The preset temperature threshold fully takes into account factors such as the material and working environment of the new energy circuit board, and can improve the accuracy of solder joint defect detection.

[0071] Step 1032, comparing the preprocessed temperature distribution data with the preset temperature threshold to obtain a comparison result;

[0072] Specifically, the preprocessed temperature distribution data is compared with the preset temperature threshold, and the temperature abnormality areas are analyzed, especially those areas where the temperature exceeds the maximum temperature threshold or the temperature gradient threshold exceeds the allowable range. The degree of deviation of the temperature abnormality area from the preset temperature threshold is calculated, including the degree to which the temperature exceeds the maximum temperature threshold and the change in the temperature gradient. The greater the degree of deviation, the higher the possibility that there are defects inside the solder joint. Based on the analysis results of the degree of deviation, a preliminary judgment is made as to whether there are defects inside the solder joint. If the degree of deviation of the temperature abnormality area from the preset temperature threshold is significant, and the area shows abnormality in multiple measurements, then there is a high probability that there are defects inside the solder joint. In a specific embodiment, the pre-processed temperature distribution data includes: the highest temperature of the solder joint is 150°C, the temperature gradient is 10°C / mm, the preset temperature threshold includes: the highest temperature threshold is 140°C, the temperature gradient threshold is not more than 5°C / mm, and the pre-processed temperature distribution data is compared with the preset temperature threshold, and it can be obtained that the highest temperature of the solder joint exceeds the highest temperature threshold by 10°C, the excess range is greater than the preset temperature excess range (less than 5°C), and the temperature gradient of the solder joint also exceeds the temperature gradient threshold by 5°C / mm, and the excess range is greater than the preset temperature gradient excess range (less than 1°C / mm), indicating that the pre-processed temperature distribution data is seriously deviated from the preset temperature threshold, indicating that there is a defect inside the solder joint. Here, the comparison result includes the comparison result of the highest temperature of the solder joint in the pre-processed temperature distribution data and the highest temperature threshold in the preset temperature threshold, and the corresponding comparison result of the excess range and the preset temperature excess range; the comparison result of the temperature gradient of the solder joint in the pre-processed temperature distribution data and the temperature gradient threshold in the preset temperature threshold, and the corresponding comparison result of the excess range and the preset temperature gradient excess range.

[0073] Step 1033: perform defect detection on the solder joints to be detected on the new energy circuit board according to the comparison result to obtain a defect detection result.

[0074] Specifically, if the comparison result includes that the difference between the highest temperature of the solder joint in the pre-processed temperature distribution data and the highest temperature threshold in the preset temperature threshold is greater than the preset temperature out of range, and the temperature gradient of the solder joint in the pre-processed temperature distribution data and the temperature gradient threshold in the preset temperature threshold is greater than the preset temperature gradient out of range, then X-rays are used to perform perspective detection on the solder joints on the new energy circuit board to detect whether there are defects such as bubbles, cracks, slag inclusions, etc. inside the solder joints, or ultrasonic waves are used to detect whether there are defects such as unfused, cracks, slag inclusions, etc. inside the solder joints on the new energy circuit board by transmitting and receiving ultrasonic waves. Through further detection, the type, location and quantity of defects inside the solder joints on the new energy circuit board can be determined. The defect detection result may include the comparison result, the type, location and quantity of defects detected on the solder joints on the new energy circuit board using X-rays or ultrasonic waves.

[0075] In an optional embodiment of the present invention, step 104 includes:

[0076] Step 1041, performing connected labeling processing on the pre-processed image data to obtain connected areas;

[0077] Specifically, all connected white (or black) pixel regions in the preprocessed image data are marked to obtain at least one original connected region; each original connected region is then assigned a unique label to obtain a connected region, which is a solder joint to be confirmed. If a connected region meets the subsequent screening conditions, it can be confirmed as a solder joint, and the number of solder joints is calculated. It should be noted that the original connected region can be formed by traversing the image pixels in the preprocessed image data, marking and connecting adjacent foreground pixels. The original connected region refers to a connected subset of foreground pixels in the preprocessed image data, and there is a path between any two pixels in the connected subset that is completely composed of foreground pixels.

[0078] Step 1042, extracting features from the connected region to obtain feature data;

[0079] Specifically, for each connected region, its features are extracted as feature data, such as area, perimeter, shape, etc. These features can be used for subsequent classification and screening.

[0080] Step 1043, determining a screening condition according to the characteristic data;

[0081] Specifically, the filtering conditions are determined based on the extracted feature data and the actual area and shape of the weld. Here, the filtering conditions may include at least one of an area threshold, a shape threshold, and a perimeter threshold. For example, if the actual area of ​​the weld is between 100 and 500 pixels, the area threshold in the filtering conditions may be set to [100,500]. If the area of ​​the connected area meets the area threshold, it may be regarded as a weld. If the actual shape of the weld is circular, the shape threshold in the filtering conditions may be set to a roundness between 0.9 and 1. If the shape of the connected area meets the shape threshold, it may be regarded as a weld.

[0082] It should be noted that the screening conditions can also be set according to the characteristics of the actual preprocessed image data and the characteristics of the welds, or at least one of the area, shape, perimeter, circularity, etc. in the screening conditions can be given based on experience to improve the accuracy and reliability of recognition.

[0083] Step 1044, performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the screening condition and the connected area to obtain a quantity detection result.

[0084] Specifically, a connected area can be considered as a solder joint to be confirmed, and the connected areas that do not meet the screening conditions are excluded from the multiple connected areas to obtain at least one screened connected area, and the screened connected area can be considered as a solder joint, and the total number of screened connected areas is the number of solder joints. The number detection result includes the number of solder joints.

[0085] In an optional embodiment of the present invention, step 105 includes:

[0086] Step 1051, obtaining preset solder joint detection conditions; the preset solder joint detection conditions include preset solder joint quality standards, preset solder joint defect tolerances, and preset solder joint quantity ranges;

[0087] Specifically, the preset solder joint quality standards may include the size (such as length, width, height, etc.), shape, position, etc. of the solder joints; the preset solder joint defect tolerance includes acceptable trap types and unacceptable trap types; the preset solder joint quantity range refers to the solder joint quantity range that should be on the new energy circuit board. According to the preset solder joint detection conditions, the solder joint defects and quantity in the defect detection results and quantity detection results are judged to determine whether the new energy circuit board meets the user's needs, thereby improving the detection efficiency.

[0088] Step 1052, comparing the defect detection result with the preset solder joint quality standard to obtain a solder joint quality comparison result;

[0089] Specifically, the defect detection result of each weld in the defect detection result can be compared with the preset weld quality standard to identify welds that do not meet the preset weld quality standard. The weld quality comparison result includes welds that do not meet the preset weld quality standard.

[0090] Step 1053, comparing the quantity detection result with the preset welding point quantity range to obtain a welding point quantity comparison result;

[0091] Specifically, the quantity detection result is compared with a preset welding point quantity range to determine whether the welding point quantity meets the standard. The welding point quantity comparison result includes whether the welding point quantity in the quantity detection result meets the preset welding point quantity range.

[0092] Step 1054, obtaining a solder joint inspection report according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance;

[0093] Specifically, the solder joints that do not meet the preset solder joint quality standards in the solder joint quality comparison results are compared with the preset solder joint defect tolerance to determine whether the solder joints that do not meet the preset solder joint quality standards are within the user's acceptable range. The solder joints that do not meet the standards are divided into acceptable and unacceptable, and the solder joint inspection report is obtained in combination with the solder joint quantity comparison results.

[0094] Step 1055: convert the format of the solder joint inspection report according to a preset format to obtain a solder joint inspection result.

[0095] Specifically, the preset format may be an electronic document or paper form required by the user. The solder joint inspection report is converted into the preset format, that is, the solder joint inspection result is obtained and provided to the user for convenient viewing by the user.

[0096] In an optional embodiment of the present invention, step 1054 includes:

[0097] Step 10541, classifying defective solder joints in the solder joint quality comparison result according to the preset solder joint defect tolerance to obtain a classification result;

[0098] Specifically, although some solder joints do not meet the preset solder joint quality standards, they are still within the acceptable range of the user. Therefore, it is necessary to compare and classify the defective solder joints in the solder joint quality comparison results with the preset solder joint defect tolerance, and classify the defective solder joints that meet the acceptable trap type into the acceptable type, and the defective solder joints that meet the unacceptable trap type into the unacceptable type. Therefore, the classification results include acceptable types and unacceptable types.

[0099] Step 10542, performing quality assessment on the solder joints to be inspected on the new energy circuit board according to the classification result and the solder joint quantity comparison result to obtain a quality assessment result;

[0100] Specifically, the quality of the solder joints to be tested on the new energy circuit board can be evaluated according to the classification results and the comparison results of the number of solder joints, defect types, defect locations, classification of defective solder joints, and overall solder joint quality to obtain quality evaluation results, which will facilitate subsequent users to check the solder joint quality and whether the solder joints meet the expected requirements based on the quality evaluation results. Here, the quality evaluation score can be obtained according to the following formula:

[0101]

[0102] Where d is the quality assessment score, N is the total number of solder joints to be inspected, is the i-th solder joint on the new energy circuit board, is the defect type score (different scores are assigned according to the defect type of the solder joint (such as cracks, pores, slag inclusions, etc.), these scores can be determined based on the severity of the defect and its impact on the performance of the solder joint), is the defect location score (different scores are assigned according to the location of the defect in the solder joint), is the classification score of defective solder joints (different scores are assigned according to the classification of defective solder joints), is the overall solder joint quality score (different scores are assigned based on the appearance, strength, reliability, etc. of the solder joint). yes The weight of yes The weight of yes The weight of yes The weight of yes In practical applications, the weight of , , , and Add or delete to suit the actual situation. Get the quality assessment result based on the quality assessment score and the corresponding grade. For example, if the quality assessment score is 80 and the corresponding grade is excellent, the quality assessment result includes the quality assessment score of 80 and the grade of excellent. You can set the grade corresponding to the score according to the actual situation to suit the actual needs.

[0103] Step 10543, obtaining a solder joint inspection report according to the defect inspection result, the quantity inspection result, the preset solder joint inspection condition, the solder joint quality comparison result, the solder joint quantity comparison result, the classification result, and the quality assessment result.

[0104] Specifically, according to the preset solder joint inspection report template or the user requirement template, the corresponding information can be extracted from the defect detection results, quantity detection results, preset solder joint inspection conditions, solder joint quality comparison results, solder joint quantity comparison results, classification results, quality assessment results, etc. to fill in the template, quickly generate a solder joint inspection report, and improve the inspection efficiency.

[0105] A specific embodiment of the solder joint detection method of the new energy circuit board of the embodiment of the present invention includes:

[0106] Step 111, obtaining data;

[0107] Use highly sensitive and high-resolution infrared detection equipment (such as infrared thermal imager) to scan the new energy circuit board under preset measurement conditions to obtain high-quality temperature distribution data of the solder joints to be detected on the new energy circuit board; use image acquisition equipment to collect image data of the new energy circuit board under preset acquisition conditions of good lighting conditions, preset acquisition temperature range and preset humidity range.

[0108] Step 112, preprocessing;

[0109] The temperature distribution data is preprocessed by data correction, data denoising, data standardization, outlier processing and gradient calculation; the image data is preprocessed by grayscale processing, denoising, binarization processing and morphological processing to improve data quality and accuracy.

[0110] Step 113, defect detection;

[0111] The preprocessed temperature distribution data is compared with the preset temperature threshold to perform defect detection on the solder joints to be detected on the new energy circuit board to obtain whether there are defects outside and inside the solder joints, the defect type, location and quantity, etc.

[0112] Step 114, quantity detection;

[0113] By performing connectivity marking processing, feature extraction, screening and other processing on the preprocessed image data, the number of solder joints to be detected on the new energy circuit board is detected to obtain the number detection result.

[0114] Step 115, solder joint inspection.

[0115] The defect detection results and quantity detection results are compared with the preset solder joint detection conditions to obtain a solder joint detection report, and the solder joint detection report is converted into a format acceptable to the user for easy reception and viewing by the user.

[0116] The solder joint detection method of the new energy circuit board of the embodiment of the present invention improves the comprehensiveness and detection efficiency of the solder joint detection by detecting defects and quantity of the solder joints to be detected on the new energy circuit board.

[0117] like Figure 2 As shown, an embodiment of the present invention provides a solder joint detection device 200 for a new energy circuit board, comprising:

[0118] An acquisition module 201 is used to acquire temperature distribution data of solder joints to be detected on the new energy circuit board and image data of the new energy circuit board;

[0119] The processing module 202 is used to preprocess the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data; perform defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results; perform quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain quantity detection results; and obtain solder joint detection results according to the defect detection results, the quantity detection results and preset solder joint detection conditions.

[0120] Optionally, obtaining temperature distribution data of the solder joints to be detected on the new energy circuit board and image data of the new energy circuit board includes:

[0121] According to the preset measurement conditions, the new energy circuit board is scanned using a scanning device to obtain the temperature distribution data of the solder joints to be tested on the new energy circuit board;

[0122] According to the preset acquisition conditions, the image acquisition device is used to acquire images of the new energy circuit board to obtain image data of the new energy circuit board.

[0123] Optionally, preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data includes:

[0124] Performing data correction, data denoising, data standardization, outlier processing and gradient calculation on the temperature distribution data to obtain pre-processed temperature distribution data;

[0125] The image data is subjected to grayscale processing, denoising processing, binarization processing and morphological processing to obtain pre-processed image data.

[0126] Optionally, defect detection is performed on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results, including:

[0127] Obtaining a preset temperature threshold; the preset temperature threshold is determined according to the working state of the new energy circuit board under preset standard conditions;

[0128] Comparing the preprocessed temperature distribution data with the preset temperature threshold to obtain a comparison result;

[0129] According to the comparison result, defect detection is performed on the solder joints to be detected on the new energy circuit board to obtain defect detection results.

[0130] Optionally, performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result includes:

[0131] Performing connected labeling processing on the preprocessed image data to obtain connected areas;

[0132] Extracting features from the connected area to obtain feature data;

[0133] Determining screening conditions according to the characteristic data;

[0134] The quantity of the solder joints to be detected on the new energy circuit board is detected according to the screening condition and the connected area to obtain a quantity detection result.

[0135] Optionally, obtaining a solder joint detection result according to the defect detection result, the quantity detection result and a preset solder joint detection condition includes:

[0136] Obtaining preset solder joint detection conditions; the preset solder joint detection conditions include preset solder joint quality standards, preset solder joint defect tolerances, and preset solder joint quantity ranges;

[0137] Comparing the defect detection result with the preset solder joint quality standard to obtain a solder joint quality comparison result;

[0138] Comparing the quantity detection result with the preset welding point quantity range to obtain a welding point quantity comparison result;

[0139] Obtaining a solder joint inspection report according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance;

[0140] The solder joint inspection report is formatted according to a preset format to obtain a solder joint inspection result.

[0141] Optionally, a solder joint inspection report is obtained according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance, including:

[0142] Classifying defective solder joints in the solder joint quality comparison result according to the preset solder joint defect tolerance to obtain a classification result;

[0143] Performing a quality assessment on the solder joints to be detected on the new energy circuit board according to the classification result and the solder joint quantity comparison result to obtain a quality assessment result;

[0144] A solder joint inspection report is obtained according to the defect inspection result, the quantity inspection result, the preset solder joint inspection condition, the solder joint quality comparison result, the solder joint quantity comparison result, the classification result, and the quality assessment result.

[0145] The solder joint detection device for the new energy circuit board of the embodiment of the present invention obtains the temperature distribution data of the solder joints to be detected on the new energy circuit board and the image data of the new energy circuit board, and pre-processes the acquired data respectively, and then performs defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the pre-processed temperature distribution data to obtain defect detection results, and performs quantity detection on the solder joints to be detected on the new energy circuit board according to the pre-processed image data to obtain quantity detection results, and finally obtains solder joint detection results according to the defect detection results, the quantity detection results and the preset solder joint detection conditions, which can not only detect whether there are defects in the solder joints on the new energy circuit board, but also count the number of solder joints on the new energy circuit board, thereby achieving the purpose of improving the detection efficiency and accuracy of the solder joints on the new energy circuit board.

[0146] It should be noted that the device is a device corresponding to the above method, and all implementations in the above method embodiment are applicable to the embodiment of the device and can achieve the same technical effect. This embodiment will not be repeated.

[0147] The embodiment of the present invention further provides a computing device, comprising: a processor, and a memory storing a computer program, wherein when the computer program is executed by the processor, the method described in any one of the above embodiments is executed. All implementations in the above method embodiments are applicable to the embodiments of the device, and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0148] The embodiment of the present invention further provides a computer-readable storage medium on which instructions are stored. When the instructions are executed on a computer, the computer executes the method as described in any one of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0149] It should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0150] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0151] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for detecting solder joints of a new energy circuit board, characterized in that: include: Acquire temperature distribution data of solder joints to be inspected on new energy circuit boards and image data of new energy circuit boards; Preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data; Perform defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results; Performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result; A solder joint detection result is obtained according to the defect detection result, the quantity detection result and the preset solder joint detection condition.

2. The solder joint detection method of the new energy circuit board according to claim 1 is characterized in that: Obtain the temperature distribution data of the solder joints to be tested on the new energy circuit board and the image data of the new energy circuit board, including: According to the preset measurement conditions, the new energy circuit board is scanned using a scanning device to obtain the temperature distribution data of the solder joints to be tested on the new energy circuit board; According to the preset acquisition conditions, the image acquisition device is used to acquire images of the new energy circuit board to obtain image data of the new energy circuit board.

3. The solder joint detection method of the new energy circuit board according to claim 1 is characterized in that: Preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data, including: Performing data correction, data denoising, data standardization, outlier processing and gradient calculation on the temperature distribution data to obtain pre-processed temperature distribution data; The image data is subjected to grayscale processing, denoising processing, binarization processing and morphological processing to obtain pre-processed image data.

4. The solder joint detection method of the new energy circuit board according to claim 1 is characterized in that: Defect detection is performed on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results, including: Obtaining a preset temperature threshold; the preset temperature threshold is determined according to the working state of the new energy circuit board under preset standard conditions; Comparing the preprocessed temperature distribution data with the preset temperature threshold to obtain a comparison result; According to the comparison result, defect detection is performed on the solder joints to be detected on the new energy circuit board to obtain defect detection results.

5. The solder joint detection method of the new energy circuit board according to claim 1 is characterized in that: Performing a quantity detection on the solder joints to be detected on the new energy circuit board according to the preprocessed image data to obtain a quantity detection result, including: Performing connected labeling processing on the preprocessed image data to obtain connected areas; Extracting features from the connected area to obtain feature data; Determining screening conditions according to the characteristic data; The quantity of the solder joints to be detected on the new energy circuit board is detected according to the screening condition and the connected area to obtain a quantity detection result.

6. The solder joint detection method of the new energy circuit board according to claim 1 is characterized in that: According to the defect detection result, the quantity detection result and the preset solder joint detection condition, a solder joint detection result is obtained, including: Obtaining preset solder joint detection conditions; the preset solder joint detection conditions include preset solder joint quality standards, preset solder joint defect tolerances, and preset solder joint quantity ranges; Comparing the defect detection result with the preset solder joint quality standard to obtain a solder joint quality comparison result; Comparing the quantity detection result with the preset welding point quantity range to obtain a welding point quantity comparison result; Obtaining a solder joint inspection report according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance; The solder joint inspection report is formatted according to a preset format to obtain a solder joint inspection result.

7. The solder joint detection method of the new energy circuit board according to claim 6 is characterized in that: A solder joint inspection report is obtained according to the solder joint quality comparison result, the solder joint quantity comparison result and the preset solder joint defect tolerance, including: Classifying defective solder joints in the solder joint quality comparison result according to the preset solder joint defect tolerance to obtain a classification result; Performing a quality assessment on the solder joints to be detected on the new energy circuit board according to the classification result and the solder joint quantity comparison result to obtain a quality assessment result; A solder joint inspection report is obtained according to the defect inspection result, the quantity inspection result, the preset solder joint inspection condition, the solder joint quality comparison result, the solder joint quantity comparison result, the classification result, and the quality assessment result.

8. A solder joint detection device for a new energy circuit board, characterized in that: include: An acquisition module is used to acquire temperature distribution data of solder joints to be detected on the new energy circuit board and image data of the new energy circuit board; A processing module, used for preprocessing the temperature distribution data and the image data respectively to obtain preprocessed temperature distribution data and preprocessed image data; Perform defect detection on the solder joints to be detected on the new energy circuit board according to the preset temperature threshold and the preprocessed temperature distribution data to obtain defect detection results; According to the preprocessed image data, the number of solder joints to be detected on the new energy circuit board is detected to obtain a number detection result; according to the defect detection result, the number detection result and the preset solder joint detection condition, the solder joint detection result is obtained.

9. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 7 is performed.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 7.

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