Multi-port calibration sheet for probe
By designing multiple sets of calibration patterns and alignment mark patterns on the substrate surface of the microwave calibration sheet, the unmet multi-port calibration requirements in the prior art are solved, and smaller sizes and higher calibration performance are achieved.
Patent Information
- Application Number
- CN202411903244.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-03-18
AI Technical Summary
The existing microwave calibration sheets are mostly dual-port calibration, which cannot effectively solve the calibration requirements of multi-port (three-port and above), resulting in a large size and failure to achieve optimal performance.
A multi-port calibration sheet for probes is designed, and high-precision calibration of multi-port probes is achieved by setting multiple sets of calibration patterns and alignment mark patterns on the substrate surface. The calibration pattern includes a ground metal conductor and a signal metal conductor. The ground metal conductor surrounds the signal metal conductor and forms a spaced area as an open circuit structure to improve grounding performance and calibration accuracy.
Through this design, the size of the calibration sheet is reduced, the calibration performance and efficiency are improved, and the calibration operation of the combination of multiple probes can be performed simultaneously, meeting the needs of multi-port calibration.
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Figure CN119644116A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of on-chip calibration of microwave devices, and further to a multi-port calibration sheet for a probe. Background Art
[0002] With the rapid development of new generation communication technologies such as 5G and satellite communications and the continuous advancement of semiconductor manufacturing processes, the integration and complexity of RF transceiver chips have significantly increased. In particular, the number of test ports for multi-port RF transceiver chips such as beamforming chips is increasing, and the test frequency range has also expanded from the RF band to the microwave millimeter wave band. These changes have put forward higher requirements for the calibration technology of microwave probes.
[0003] Existing microwave calibration pieces are mainly dual-port calibration, and multi-port (three ports and above) calibration pieces are mostly used by directly combining dual-port calibration pieces without integrated design. This will make the calibration piece larger in size and the calibration performance will not reach the optimal effect.
[0004] For those skilled in the art, how to improve the performance of the calibration sheet is a technical problem that needs to be solved at present. Summary of the invention
[0005] The core of the present invention is to provide a multi-port calibration sheet for a probe, which improves the performance of the calibration sheet and enhances the accuracy of the calibration process through the design of the calibration graph. The specific scheme is as follows:
[0006] A multi-port calibration sheet for a probe, comprising a substrate, calibration patterns and alignment mark patterns, wherein at least one group of the calibration patterns is arranged on the surface of the substrate, and each group of the calibration patterns corresponds to one alignment mark pattern; the alignment mark patterns are used to calibrate the relative positions of probe pins, and each group of the calibration patterns is adapted to probe pins of the same specification;
[0007] Each calibration pattern includes a ground metal conductor and a signal metal conductor; the ground metal conductor surrounds the signal metal conductor; a spacing area is formed between the ground metal conductor and the signal metal conductor as an open circuit structure; the calibration patterns are arranged in a centrally symmetrical manner.
[0008] Optionally, a thin film resistor is further included, wherein the thin film resistor is arranged in some of the calibration patterns and is used to cross the spacing area to connect to the ground metal conductor and the signal metal conductor.
[0009] Optionally, the graphic styles of the calibration graphics in the same group are different.
[0010] Optionally, the calibration graphic includes four graphic styles: Open, Short, Load, and Thru.
[0011] Optionally, the graphic styles of the Thru form include a straight line type, a broken line type, a slanted line type, and an arc type.
[0012] Optionally, in the straight line, broken line, or oblique line graphic styles of the Thru form, the widths of both ends of the spacing area around the signal metal conductor connecting two pins are greater than the middle width.
[0013] Optionally, one substrate is provided with one calibration pattern in an Open form, one in a Short form, one in a Load form, and three calibration patterns in a Thru form;
[0014] The calibration pattern in the open form is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located in the middle of the edge of the ground metal conductor;
[0015] The calibration pattern in the form of a short is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located in the middle of the edge of the ground metal conductor; the signal metal conductor and the ground metal conductor are provided with short-circuit conductor metal;
[0016] The calibration pattern in the form of Load is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located in the middle of the edge of the ground metal conductor; thin film resistors are provided between the signal metal conductor and the ground metal conductor;
[0017] One of the Thru-form calibration figures is provided with a horizontal dumbbell-shaped spacing area and a horizontal dumbbell-shaped signal metal conductor; another Thru-form calibration figure is provided with a vertical dumbbell-shaped spacing area and a vertical dumbbell-shaped signal metal conductor; another Thru-form calibration figure is provided with four arc-shaped spacing areas and four arc-shaped signal metal conductors.
[0018] Optionally, one substrate is provided with one calibration pattern in an Open form, one in a Short form, one in a Load form, and four calibration patterns in a Thru form;
[0019] The calibration pattern in the open form is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located at the vertex corners of the ground metal conductor;
[0020] The calibration pattern in the form of a short is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located at the vertex corners of the ground metal conductor; the signal metal conductor and the ground metal conductor are provided with a short-circuit conductor metal;
[0021] The calibration pattern in the form of Load is provided with four rectangular spacing areas and four rectangular signal metal conductors; the four signal metal conductors are respectively located at the vertex corners of the ground metal conductor; thin film resistors are provided between the signal metal conductor and the ground metal conductor;
[0022] One of the Thru form calibration figures is provided with two transverse dumbbell-shaped spacing areas and two transverse dumbbell-shaped signal metal conductors; another Thru form calibration figure is provided with two zigzag line spacing areas and two zigzag line signal metal conductors; another Thru form calibration figure has four contacts on the signal metal conductor, wherein contact 1 and contact 3 are obliquely conducted, and contact 2 and contact 4 are respectively provided with thin film resistors with the ground metal conductor; another Thru form calibration figure has four contacts on the signal metal conductor, wherein contact 2 and contact 4 are obliquely conducted, and contact 1 and contact 3 are respectively provided with thin film resistors with the ground metal conductor.
[0023] Optionally, the slash-shaped empty port in the Thru form is set to a 50Ω load;
[0024] The calibration pattern is a coplanar waveguide structure, and the size of the coplanar waveguide is selected to be close to 50Ω.
[0025] Optionally, the substrate is made of GaAs, has a thickness of 620um and a dielectric constant of 12.9;
[0026] The ground metal conductor and the signal metal conductor are made of gold with a thickness of 4um;
[0027] The thin film resistor is a nickel-chromium alloy with a thickness of 0.035um, and the corresponding square thin film resistor has a resistance of 50Ω±1Ω;
[0028] The alignment mark pattern is made of gold with a thickness of 4um.
[0029] The present invention provides a multi-port calibration sheet for a probe, wherein a calibration pattern and an alignment mark pattern are arranged on the surface of a substrate, and at least one group of calibration patterns is provided, and each group of calibration patterns corresponds to an alignment mark pattern. The relative position of the probe pins is calibrated by the alignment mark pattern. After the position is calibrated, the probe pins can perform calibration detection on each calibration pattern in a group, thereby reducing the size of the entire calibration sheet and improving performance; the calibration pattern includes a ground metal conductor and a signal metal conductor, wherein the ground metal conductor surrounds the signal metal conductor; a spacing area is formed between the ground metal conductor and the signal metal conductor as an open circuit structure; the present invention surrounds the signal metal conductor by the ground metal conductor, thereby improving the grounding performance and improving the accuracy of the calibration process. The calibration pattern is arranged in a central symmetrical manner, and calibration operations can be performed on a combination of multiple probes at the same time, thereby facilitating calibration operations. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0031] Figure 1 A schematic diagram of a center-symmetrical multi-port calibration piece for a probe of the present invention;
[0032] Figure 2 A schematic diagram of a bilaterally symmetrical multi-port calibration piece for a probe of the present invention;
[0033] Figure 3 It is a local schematic diagram of the calibration figure;
[0034] Figure 4 This is a schematic diagram of the needle arrangement for three-port on-wafer testing;
[0035] Figure 5 This is a schematic diagram of the needle arrangement for four-port on-wafer testing.
[0036] The figure includes:
[0037] Substrate 1 , calibration pattern 2 , ground metal conductor 21 , signal metal conductor 22 , thin film resistor 23 , spacing area 24 , short-circuit conductor metal 25 , alignment mark pattern 3 , and probe 4 . DETAILED DESCRIPTION
[0038] In order to enable those skilled in the art to better understand the technical solution of the present invention, the multi-port calibration sheet for a probe of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0039] The present invention provides a multi-port calibration sheet for a probe, Figure 1 , Figure 2 As shown, the multi-port calibration sheet for the probe includes a substrate 1, a calibration pattern 2, an alignment mark pattern 3 and other structures. The calibration pattern 2 and the alignment mark pattern 3 are arranged on the upper surface of the substrate 1. The substrate 1 is made of insulating material, and the calibration pattern 2 is made of conductive material.
[0040] At least one group of calibration patterns 2 is arranged on the surface of the substrate 1, and the alignment mark patterns 3 are used to calibrate the relative positions of the probe pins, and each group of calibration patterns 2 is adapted to the probe pins of the same specification. Each calibration pattern 2 of the same group is used to calibrate probes of the same specification, and each calibration pattern 2 of the same group is calibrated for probes or probe combinations of the same size. Each group of calibration patterns 2 is provided with an alignment mark pattern 3, and before calibrating the probes through the calibration patterns 2, the probes need to be positioned through the alignment mark patterns 3 so that the pins of each probe can contact the metal of each calibration pattern 2. Placing at least one group of multiple different calibration patterns 2 and at least one alignment mark pattern 3 on a calibration sheet can reduce the size of the calibration sheet, improve the degree of integration, and enhance performance and calibration efficiency.
[0041] The alignment mark graphic 3 and the calibration graphic 2 are used to achieve different functions. The alignment mark graphic 3 is used to calibrate the relative position of the pins. A group of calibration graphics 2 corresponds to one alignment mark graphic 3. The same type of calibration graphics 2 has the same probe position and one alignment mark graphic 3 can be used. Figure 1 A set of calibration graphs 2 are shown. Figure 2 A set of calibration patterns 2 is shown. Each calibration pattern 2 in a set is arranged in an array, and the alignment mark pattern 3 can be set at any position without affecting the setting of the calibration pattern 2. The alignment mark pattern (Alignment) is mainly used for the needle mark of the calibration pattern, and uses gold with a thickness of 4um as its material, and is located above the substrate 1 together with the calibration pattern.
[0042] The multi-port calibration piece for the probe is a coplanar waveguide structure, wherein the calibration pattern 2 includes a ground metal conductor 21 and a signal metal conductor 22, both of which are metal conductors, and the ground metal conductor 21 and the signal metal conductor 22 are arranged on the upper surface of the substrate 1 to form a shape for forming a conductive contact with the probe. The calibration pattern 2 mainly includes: an open circuit calibration piece (Open), a short circuit calibration piece (Short), a load calibration piece (Load) and a through calibration piece (Thru).
[0043] Typically, the ground metal conductor 21 and the signal metal conductor 22 are arranged on the same plane, the upper surface of the substrate 1 is a plane, and the ground metal conductor 21 and the signal metal conductor 22 are both planar in shape and have a certain thickness.
[0044] The ground metal conductor 21 used in the present invention surrounds the signal metal conductor 22, that is, the ground metal conductor 21 fully surrounds the signal metal conductor 22 in a 360-degree circumferential direction, and each signal metal conductor 22 is surrounded by a ground metal conductor 21. Figure 3 As shown, the Load and Thru structures are shown on the left and right, respectively, and the signal metal conductor 22 is located within the encirclement of the ground metal conductor 21. The ground metal conductor 21 fully encloses the signal metal conductor 22, and all the ground metal conductors 21 of a calibration pattern 2 form an integrated conductive connection. Compared with the traditional method of dividing the ground metal into multiple pieces, the ground metal conductor 21 of the present invention surrounds the signal metal conductor 22, so that the grounding performance of the ground metal conductor 21 is better, the signal is more stable, and the accuracy of calibration is improved.
[0045] A spacing region 24 is formed between the ground metal conductor 21 and the signal metal conductor 22 as an open circuit structure. The spacing region 24 is a metal-free region between the ground metal conductor 21 and the signal metal conductor 22. The spacing region 24 implements insulation between the ground metal conductor 21 and the signal metal conductor 22. The spacing region 24 may be flush with the substrate 1, or may be formed as a groove on the surface of the substrate 1.
[0046] The calibration pattern 2 is arranged in a centrally symmetrical manner, and a calibration operation can be performed on a combination of multiple probes at the same time. One probe or a combination of more than two probes can be calibrated at one time, which facilitates the calibration operation and helps to improve the calibration efficiency.
[0047] The multi-port calibration sheet for the probe of the present invention also includes a thin film resistor 23, which is arranged in some calibration graphics 2, that is, the thin film resistor 23 is used in the calibration graphics 2 in the form of Load. The thin film resistor 23 is used to cross the spacing area 24 to connect to the ground metal conductor 21 and the signal metal conductor 22. One end of the thin film resistor 23 is connected to the ground metal conductor 21 and the other end is connected to the signal metal conductor 22. The thin film resistor 23 has a certain resistance value as a load.
[0048] Specifically, the graphic styles of the calibration graphics 2 constituting the same group are different, for example Figure 1 It shows an open-circuit calibration component (Open), a short-circuit calibration component (Short), a load calibration component (Load) and three through-calibration components (Thru). The three through-calibration components (Thru) are Thru1, Thru2, and Thru3, and Thru1, Thru2, and Thru3 are different from each other. Figure 2It shows an open-circuit calibration component (Open), a short-circuit calibration component (Short), a load calibration component (Load) and four thru calibration components (Thru). The four thru calibration components (Thru) are Thru1-2,3-4, Thru1-4,2-3, Thru1-3 and Thru2-4. Thru1-2,3-4, Thru1-4,2-3, Thru1-3 and Thru2-4 are different from each other.
[0049] Each calibration pattern 2 is arranged symmetrically with respect to the center. Figure 1 , Figure 4 The figure shows the calibration form for a three-port probe. The port refers to the S pin on the probe. Figure 4 For example, the three probes 4 are respectively provided with three GSG pins and three S pins, that is, three ports. Figure 2 , Figure 5 The figure shows the form of four-port probe calibration. The port refers to the S pin on the probe. Figure 5 For example, the two probes 4 are provided with five pins of GSGSG, and four S pins are four ports. The calibration pattern 2 on the probe multi-port calibration sheet of the present invention is used to calibrate any one or more probe arrangements of GS, SG, GSG, SGS, GSSG, GSGSG, GSGSG, GND is the abbreviation of GND, S is the abbreviation of Signal, and the number of S pins is the number of ports. Figure 4 The pin distribution of probe 4 is GSG. Figure 5 The pin distribution of the probe 4 is GSGSG. The above are only two specific probe distribution situations, and other distributions can also be used, and these specific forms should be included in the protection scope of the present invention.
[0050] Combination Figure 1 , Figure 2 As shown, the calibration figure 2 includes four types of graphic styles: Open, Short, Load, and Thru, namely, an open-circuit calibration piece (Open), a short-circuit calibration piece (Short), a load calibration piece (Load), and a through-calibration piece (Thru). The multi-port calibration piece for the probe of the present invention is a calibration piece design based on the SOLT (Short-Open-Load-Thru) calibration method.
[0051] The open pattern includes a substrate 1, a signal metal conductor 22, and a ground metal conductor 21. The signal metal conductor 22 is surrounded by the ground metal conductor 21. A spacing area 24 is provided around the signal metal conductor 22 to separate the signal from the ground, thereby forming an open circuit structure.
[0052] The Short graph is based on the Open graph, and a short-circuit conductor metal 25 is added between the signal conductor metal and the ground conductor metal to connect them, so as to form a short-circuit structure.
[0053] The Load graph is composed of a substrate 1, a thin film resistor 23, a signal metal conductor 22, and a ground metal conductor 21. The thin film resistor 23 is made of nickel chromium (NiCr) and is located between the substrate and the metal layer. The thickness is 0.035um. The resistance value of the square thin film resistor (referred to as square resistance) corresponding to this thickness is about 50Ω.
[0054] The Thru pattern is composed of a substrate 1, a signal metal conductor 22, and a ground metal conductor 21. Figure 1 There are three different types of Thru, Thru1 and Thru2 are horizontal and vertical Thru respectively, which are mainly used for on-chip calibration of left and right and upper and lower ports. The trapezoidal structure with different widths at both ends is used to improve the impedance of the straight-through and enhance the calibration performance. In particular, Thru3 is slightly different from Thru1 and Thru2, but it is also a coplanar waveguide structure in essence. Thru3 is in the shape of four 1 / 4 circles, which is mainly provided for probe calibration scenarios with 90° port difference in four directions: upper left, upper right, lower left, and lower right. Figure 2 There are four Thru with different graphics, which are used for through calibration of different combinations of four ports, namely Thru1-2,3-4, Thru1-4,2-3, Thru1-3 and Thru2-4.
[0055] The boundary shape of the metal conductor 21 is any one of square, rectangle and arch. Figure 1 The boundary shapes of the ground metal conductors 21 of Open, Short, Load, Thru1, and Thru2 are square, and the boundary shapes of the ground metal conductor 21 of Thru3 are composed of four arches. Figure 2 The boundary shapes of the metal conductors 21 of Open, Short, Load, Thru1-2, 3-4, Thru1-4, 2-3, Thru1-3 and Thru2-4 are rectangular.
[0056] A hollow area exposing the substrate 1 is provided within the boundary range of the ground metal conductor 21, the hollow area is also the shape of the spacing area 24, the hollow area is a fully enclosed shape, the hollow area is a square, a rectangle, a dumbbell, a parallelogram, an arch, or any combination thereof, a signal metal conductor 22 is provided within the hollow area, the signal metal conductor 22 is a square, a rectangle, a dumbbell, a parallelogram, an arch, or any combination thereof; combined Figure 1As shown, the hollow areas of Open, Short, and Load are rectangular, and the signal metal conductor 22 is rectangular; the hollow areas of Thru1 and Thru2 are dumbbell-shaped with wide ends and narrow in the middle, and the signal metal conductor 22 is dumbbell-shaped with wide ends and narrow in the middle; the hollow area of Thru3 is arched, and the signal metal conductor 22 is arched. Figure 2 As shown, the hollow areas of Open, Short, and Load are rectangular, and the signal metal conductor 22 is rectangular; the hollow areas of Thru1-2, 3-4 are dumbbell-shaped with wide ends and narrow in the middle, and the signal metal conductor 22 is dumbbell-shaped with wide ends and narrow in the middle; the hollow areas of Thru1-4, 2-3 are also dumbbell-shaped with wide ends and narrow in the middle, and the signal metal conductor 22 is dumbbell-shaped with wide ends and narrow in the middle, which can also be regarded as a combination of different rectangles; the two hollow areas of contact 2 and contact 4 of Thru1-3 are The domain is a rectangle, the hollow areas of contact 1 and contact 3 are connected as a whole, the signal metal conductors 22 of contact 2 and contact 4 are rectangles, and the signal metal conductors 22 of contact 1 and contact 3 are a combination of two rectangles and a parallelogram; the two hollow areas of contact 1 and contact 3 of Thru2-4 are rectangles, the hollow areas of contact 2 and contact 4 are connected as a whole, the signal metal conductors 22 of contact 1 and contact 3 are rectangles, and the signal metal conductors 22 of contact 2 and contact 4 are a combination of two rectangles and a parallelogram.
[0057] The ground metal conductor 21 and the signal metal conductor 22 are deposited in the same layer and etched to form the spacing area 24. The ground metal conductor 21 and the signal metal conductor 22 can be formed by processing a metal layer at the same time, and the spacing area 24 is etched in a specific area on the metal layer, thereby separating the ground metal conductor 21 and the signal metal conductor 22. The ground metal conductor 21 and the signal metal conductor 22 can also be processed through different processes.
[0058] Combination Figure 1 , Figure 2 As shown, the graphic styles of the Thru form in the present invention include straight line type, broken line type, oblique line type, and arc type. The straight line type indicates that it is parallel to the rectangular outer edge of the ground metal conductor 21, and the oblique line type indicates that it is not parallel to the rectangular outer edge of the ground metal conductor 21; Figure 1 Thru1 and Thru2 are straight lines, Thru3 is arc-shaped, Thru1 is a horizontal signal metal conductor 22 , and Thru2 is a vertical signal metal conductor 22 .
[0059] Figure 2Among them, Thru1-2, 3-4 are straight-line type, Thru1-4, 2-3 are folded-line type, Thru1-3 and Thru2-4 are oblique-line type, Thru1-2, 3-4 are two signal metal conductors 22 horizontally connecting contacts 1-2 and 3-4 respectively, Thru1-4, 2-3 are two folded-lines vertically connecting contacts 1-4 and 2-3 respectively, Thru1-3 is an oblique signal metal conductor 22 obliquely connecting the upper left (contact 1) and the lower right (contact 3), and Thru2-4 is provided with an oblique signal metal conductor 22 obliquely connecting the lower left (contact 4) and the upper right (contact 2).
[0060] Combination Figure 1 , Figure 2 As shown, in the straight line, broken line and oblique line graphic styles of the Thru form, the widths at both ends of the spacing area 24 around the signal metal conductor 22 connecting the two pins are greater than the middle width, that is, the spacing area 24 is a region that is wide at both ends and narrow in the middle. The structure with different width changes at both ends can improve the impedance of the straight-through and enhance the calibration performance.
[0061] The present invention provides two specific shapes, respectively as follows Figure 1 , Figure 2 shown.
[0062] Combination Figure 1 , wherein a total of one alignment mark graphic 3 and six calibration graphics 2 are set, and one substrate 1 is provided with one calibration graphic 2 in the Open form, one in the Short form, one in the Load form, and three calibration graphics 2 in the Thru form.
[0063] The calibration pattern 2 in the open form is provided with four rectangular spacing areas 24 and four rectangular signal metal conductors 22 ; the four signal metal conductors 22 are respectively located in the middle of the edge of the ground metal conductor 21 ; the signal metal conductor 22 is isolated from the ground metal conductor 21 by the rectangular spacing areas 24 .
[0064] The calibration figure 2 in the Short form sets four rectangular spacing areas 24 and four rectangular signal metal conductors 22; the four signal metal conductors 22 are respectively located in the middle of the edge of the ground metal conductor 21; that is, on the basis of the Open form, each signal metal conductor 22 is respectively provided with a short-circuit conductor metal 25 with the ground metal conductor 21.
[0065] The calibration figure 2 in the Load form sets four rectangular spacing areas 24 and four rectangular signal metal conductors 22; the four signal metal conductors 22 are respectively located in the middle of the edge of the ground metal conductor 21; that is, based on the Open form, each signal metal conductor 22 is respectively provided with a thin film resistor 23 with the ground metal conductor 21.
[0066] There are three Thru-type calibration patterns 2. The Thru1-type calibration pattern 2 is provided with a horizontal dumbbell-shaped spacing area 24 and a horizontal dumbbell-shaped signal metal conductor 22. The Thru2-type calibration pattern 2 is provided with a vertical dumbbell-shaped spacing area 24 and a vertical dumbbell-shaped signal metal conductor 22. Both the dumbbell-shaped spacing area 24 and the signal metal conductor 22 are wide at both ends and narrow in the middle. The Thru3-type calibration pattern 2 is provided with four arc-shaped spacing areas 24 and four arc-shaped signal metal conductors 22, and the arc-shaped signal metal conductors 22 are of equal width.
[0067] Combination Figure 2 In another structure, there is a total of one alignment mark pattern 3 and seven calibration patterns 2. One substrate 1 is provided with one calibration pattern 2 in the form of Open, one in the form of Short, one in the form of Load, and four calibration patterns 2 in the form of Thru;
[0068] The calibration pattern 2 in the open form is provided with four rectangular spacing areas 24 and four rectangular signal metal conductors 22 ; the four signal metal conductors 22 are respectively located at the vertices of the ground metal conductor 21 ; the signal metal conductor 22 is isolated from the ground metal conductor 21 by the rectangular spacing areas 24 .
[0069] The calibration figure 2 in the Short form sets four rectangular spacing areas 24 and four rectangular signal metal conductors 22; the four signal metal conductors 22 are respectively located at the four vertices of the ground metal conductor 21; based on the Open form, the signal metal conductor 22 and the ground metal conductor 21 are set with a short-circuit conductor metal 25.
[0070] The calibration pattern 2 in the Load form sets four rectangular spacing areas 24 and four rectangular signal metal conductors 22; the four signal metal conductors 22 are respectively located at the vertices of the ground metal conductor 21; based on the Open form, a thin film resistor 23 is set between the signal metal conductor 22 and the ground metal conductor 21.
[0071] There are four Thru-type calibration figures 2 in total. The Thru1-2, 3-4-type calibration figures 2 are provided with two transverse dumbbell-shaped spacing areas 24 and two transverse dumbbell-shaped signal metal conductors 22, forming a narrow middle and wide ends; the Thru1-4, 2-3-type calibration figures 2 are provided with two zigzag spacing areas 24 and two zigzag signal metal conductors 22, the spacing area 24 is U-shaped, and the signal metal conductor 22 is U-shaped, with large widths at both ends and small widths in the middle; the signal metal conductor 22 of the Thru1-3 calibration figure 2 is provided with four contacts, wherein contact 1 and contact 3 are obliquely conducted, and two empty ports of contact 2 and contact 4 are respectively provided with thin film resistors 23 with the ground metal conductor 21 to form a load; the signal metal conductor 22 of the Thru2-4-type calibration figure 2 is provided with four contacts, wherein contact 2 and contact 4 are obliquely conducted, and two empty ports of contact 1 and contact 3 are respectively provided with thin film resistors 23 with the ground metal conductor 21 to form a load.
[0072] The slash-shaped empty port in Thru form sets a 50Ω load. Figure 2 As shown, contact 2 and contact 4 of Thru1-3 are respectively connected to a 50Ω load, and contact 1 and contact 3 of Thru2-4 are respectively connected to a 50Ω load, forming a calibrated impedance without affecting the matching of the two ports.
[0073] The calibration figure 2 of the present invention is a coplanar waveguide structure. The size of the coplanar waveguide is selected to be close to 50Ω, and the LineCalc calculation tool of ADS can be used for calculation. The performance of the coplanar waveguide is mainly determined by the width of the signal metal conductor, the groove width and the substrate thickness. The substrate 1 is made of GaAs with a thickness of 620um and a dielectric constant of 12.9. There is no metal in the lower layer of the substrate; the ground metal conductor 21 and the signal metal conductor 22 are made of gold with a thickness of 4um; the thin film resistor 23 is a nickel-chromium alloy with a thickness of 0.035um, and the corresponding square thin film resistor has a resistance of 50Ω±1Ω; the alignment mark figure 3 is made of gold with a thickness of 4um.
[0074] The present invention provides a calibration sheet that can be used for dual-port and multi-port probe calibration. By placing different types of multi-port probe calibration patterns on a substrate, the requirements of multiple probe port calibration scenarios are enriched. In addition, the calibration pattern integrated design method is adopted to reduce the size of the calibration pattern while also improving the calibration performance.
[0075] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A multi-port calibration sheet for a probe, characterized in that: The invention comprises a substrate (1), a calibration pattern (2) and an alignment mark pattern (3), wherein at least one group of the calibration patterns (2) is arranged on the surface of the substrate (1), and each group of the calibration patterns (2) corresponds to one alignment mark pattern (3); the alignment mark pattern (3) is used to calibrate the relative position of probe pins, and each group of the calibration patterns (2) is adapted to probe pins of the same specification; Each calibration pattern (2) comprises a ground metal conductor (21) and a signal metal conductor (22); the ground metal conductor (21) surrounds the signal metal conductor (22); a spacing area (24) is formed between the ground metal conductor (21) and the signal metal conductor (22) as an open circuit structure; and the calibration patterns (2) are arranged in a centrally symmetrical manner.
2. The multi-port calibration sheet for a probe according to claim 1, characterized in that: It also includes a thin film resistor (23), which is arranged in some of the calibration patterns (2) and is used to cross the spacing area (24) to connect to the ground metal conductor (21) and the signal metal conductor (22).
3. The multi-port calibration sheet for a probe according to claim 1, characterized in that: The graphic styles of the calibration graphics (2) in the same group are different.
4. The multi-port calibration sheet for a probe according to claim 2, characterized in that: The calibration graph (2) includes four types of graphic styles: Open, Short, Load, and Thru.
5. The multi-port calibration sheet for a probe according to claim 4, characterized in that: The graphic styles of Thru form include straight line, broken line, oblique line and arc.
6. The multi-port calibration sheet for a probe according to claim 5, characterized in that: In the straight line, broken line, and oblique line graphic styles of the Thru form, the widths of the two ends of the spacing area (24) around the signal metal conductor (22) connecting the two pins are greater than the middle width.
7. The multi-port calibration sheet for a probe according to claim 6, characterized in that: One substrate (1) is provided with one calibration pattern (2) in an Open form, one in a Short form, one in a Load form, and three calibration patterns (2) in a Thru form; The calibration pattern (2) in the open form is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located in the middle of the edge of the ground metal conductor (21); The calibration pattern (2) in the short form is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located in the middle of the edge of the ground metal conductor (21); a short-circuit conductor metal (25) is provided between the signal metal conductor (22) and the ground metal conductor (21); The calibration pattern (2) in the form of a load is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located in the middle of the edge of the ground metal conductor (21); and a thin film resistor (23) is provided between the signal metal conductor (22) and the ground metal conductor (21); One of the Thru-shaped calibration patterns (2) is provided with a horizontal dumbbell-shaped spacing area (24) and a horizontal dumbbell-shaped signal metal conductor (22); another Thru-shaped calibration pattern (2) is provided with a vertical dumbbell-shaped spacing area (24) and a vertical dumbbell-shaped signal metal conductor (22); another Thru-shaped calibration pattern (2) is provided with four arc-shaped spacing areas (24) and four arc-shaped signal metal conductors (22).
8. The multi-port calibration sheet for a probe according to claim 6, characterized in that: One substrate (1) is provided with one calibration pattern (2) in an Open form, one in a Short form, one in a Load form, and four calibration patterns (2) in a Thru form; The calibration pattern (2) in the open form is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located at the vertices of the ground metal conductor (21); The calibration pattern (2) in the form of a short is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located at the vertices of the ground metal conductor (21); a short-circuit conductor metal (25) is provided between the signal metal conductor (22) and the ground metal conductor (21); The calibration pattern (2) in the form of a load is provided with four rectangular spacing areas (24) and four rectangular signal metal conductors (22); the four signal metal conductors (22) are respectively located at the vertices of the ground metal conductor (21); a thin film resistor (23) is provided between the signal metal conductor (22) and the ground metal conductor (21); One of the Thru-form calibration patterns (2) is provided with two transverse dumbbell-shaped spacing areas (24) and two transverse dumbbell-shaped signal metal conductors (22); another Thru-form calibration pattern (2) is provided with two folded-line spacing areas (24) and two folded-line signal metal conductors (22); the signal metal conductor (22) of another Thru-form calibration pattern (2) is provided with four contacts, wherein contact 1 and contact 3 are obliquely connected, and contact 2 and contact 4 are respectively provided with thin film resistors (23) with the ground metal conductor (21); another Thru-form calibration pattern (2) is provided with four contacts, wherein contact 2 and contact 4 are obliquely connected, and contact 1 and contact 3 are respectively provided with thin film resistors (23) with the ground metal conductor (21).
9. The multi-port calibration sheet for a probe according to claim 7 or 8, characterized in that: The empty port with a slash in the Thru form is set to a 50Ω load; The calibration pattern (2) is a coplanar waveguide structure, and the size of the coplanar waveguide is selected to be close to 50Ω.
10. The multi-port calibration sheet for a probe according to claim 2, characterized in that: The substrate (1) is made of GaAs, has a thickness of 620 μm and a dielectric constant of 12.9; The ground metal conductor (21) and the signal metal conductor (22) are made of gold and have a thickness of 4 um; The thin film resistor (23) is a nickel-chromium alloy with a thickness of 0.035 um, and the corresponding square thin film resistor has a resistance of 50Ω±1Ω; The alignment mark pattern (3) is made of gold with a thickness of 4 um.