Circuit testing system and method and related equipment

Abstract

The invention provides a circuit test system and method and related equipment, and the test system comprises a test mold, electronic test equipment and computing equipment, can test a plurality of circuit parameters in parallel, can complete a large number of tests in a short time for circuit boards produced in batches, can run according to a preset program, and is high in test efficiency. The test result is more accurate and stable, a high-precision test instrument can be equipped, tiny voltage and current changes can be accurately measured, the device has the characteristics of high efficiency and stability, the test cost can be reduced, defective circuit boards can be found and removed in time, defective products are prevented from flowing into the next process, the defective products are prevented from flowing out, and the rework cost is reduced. The test data can be automatically recorded and stored, subsequent data analysis and quality tracing are facilitated, and the test system has obvious advantages in the aspects of efficiency, precision, cost, data management, repeatability and the like and is suitable for large-scale and high-precision circuit board production requirements.

Description

Technical Field

[0001] The present application relates to the field of circuit testing technology, and in particular to a circuit testing system, method and related equipment. Background Art

[0002] In the field of electronic technology, the performance and reliability of circuits are crucial to the normal operation of various electronic devices. As a key link to ensure circuit quality, circuit testing has long relied on manual operation and recording.

[0003] Traditional circuit testing methods require technicians to use specialized test equipment, such as oscilloscopes and multimeters, to measure each parameter of the circuit one by one. During the test, technicians need to manually set test conditions, connect test points, and carefully observe the display results of the test equipment, and then manually record the test data and conclusions in paper forms or electronic documents. This manual testing method has many obvious disadvantages. First, manual operation will inevitably introduce human errors, affecting the accuracy and consistency of test results. Differences in operating habits and experience levels of different technicians may lead to deviations in test results for the same circuit. Secondly, manual testing is inefficient. For complex circuit systems, there are many test points and various parameters, and it takes a lot of time and effort to complete a comprehensive test. This has become a serious constraint in the face of large-scale production or scenarios where testing needs to be completed quickly. In addition, manual recording of test results is prone to recording errors, omissions, or data loss, which brings difficulties to subsequent data analysis and quality traceability. Moreover, a large amount of manual test data is difficult to effectively organize and analyze, and potential quality problems and trends cannot be discovered in a timely manner.

[0004] With the rapid development of electronic technology, the complexity of circuits continues to increase, which puts higher requirements on the accuracy, speed and reliability of testing. Traditional manual testing methods can no longer meet the needs of modern circuit production and research and development. There is an urgent need for a new system that can realize automatic testing, improve test efficiency and accuracy, and effectively manage and analyze test data. Summary of the invention

[0005] The present application aims to solve at least one of the above-mentioned technical defects. In view of this, the present application provides a circuit testing system, method and related equipment to solve the technical defect that the prior art cannot efficiently complete circuit testing.

[0006] A circuit testing system, the system comprising: a testing mold, an electronic testing device and a computing device;

[0007] Wherein, the test mold is connected to the electronic test equipment and the computing equipment respectively;

[0008] The test mold includes a power supply and a control module, and the test mold is used to place the object to be tested; wherein the power supply is used to power the test mold; the control module has at least one test circuit built in, and each test circuit is used to test at least one indicator to be tested of the object to be tested;

[0009] The electronic testing device is used to display the test results of the object to be tested;

[0010] The computing device is used to store and analyze the test results of the object to be tested and form a test analysis report of the object to be tested.

[0011] Preferably, the test mold further comprises: a base, a frame, a test platform, a test head, and a handle;

[0012] in,

[0013] The control module is built into the control box of the base;

[0014] The base is a rectangular base with four supporting feet at the corners to ensure the stability of the test mold during operation. There is a handle on each side of the base to facilitate carrying and moving the test mold.

[0015] The frame is a bakelite and metal frame, the frame is located above the base, and the frame is composed of two vertical bakelite and two vertical metal pillars and two horizontal bakelite beams to form a stable support structure;

[0016] The test platform is arranged in the middle of the frame, and is used to place the object to be tested, wherein the test platform has a plurality of fixing holes for fixing the object to be tested to ensure that the object to be tested does not move during the test process;

[0017] The test head is deployed on the top of the frame, and a plurality of probes are provided below the test head for contacting various test points of the object to be tested;

[0018] The test head is connected to the handle, and the handle is used to operate the test head.

[0019] Preferably, the test platform supports simultaneous measurement of at least two indicators to be tested of the object to be tested.

[0020] Preferably, the test platform comprises a clamping device.

[0021] A circuit testing method, applied to any of the circuit testing systems described above, comprising:

[0022] Placing the object to be tested on the test platform of the test mold;

[0023] Determine at least one indicator to be tested corresponding to the object to be tested;

[0024] Starting the test mold, testing the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtaining test results of each indicator to be tested of the object to be tested;

[0025] The test results of each of the indicators to be tested are displayed and saved, and the test results of each of the indicators to be tested are analyzed to form a test report of the object to be tested.

[0026] Preferably, the indicators to be tested include frequency, burning, voltage, current and resistance of the object to be tested.

[0027] Preferably, the test mold comprises at least one test circuit.

[0028] A circuit testing device, applied to the circuit testing method described above, comprises:

[0029] A placing unit, used for placing the object to be tested on the test platform of the test mold;

[0030] A determination unit, used to determine at least one to-be-tested indicator corresponding to the to-be-tested object;

[0031] A starting unit, used to start the test mold, test the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtain test results of each indicator to be tested of the object to be tested;

[0032] The analysis unit displays and saves the test results of each of the indicators to be tested, and analyzes the test results of each of the indicators to be tested to form a test report of the object to be tested.

[0033] A circuit testing device, comprising: one or more processors, and a memory;

[0034] The memory stores computer-readable instructions, and when the computer-readable instructions are executed by the one or more processors, the steps of the circuit testing method described above are implemented.

[0035] A readable storage medium stores computer-readable instructions. When the computer-readable instructions are executed by one or more processors, the one or more processors implement the steps of the circuit testing method as described above.

[0036] It can be seen from the technical scheme introduced above that the circuit test system provided in the embodiment of the present application includes a test mold, an electronic test device and a computing device; wherein the test mold is connected to the electronic test device and the computing device respectively; the test mold may include a power supply and a control module, and the test mold can be used to place the object to be tested; wherein the power supply is used to power the test mold; the control module has at least one test circuit built in, and each test circuit is used to test at least one indicator to be tested of the object to be tested; the electronic test device can be used to display the test results of the object to be tested; the computing device can be used to save and analyze the test results of the object to be tested, and form a test analysis report for the object to be tested. The circuit test system provided in the embodiment of the present application can test multiple circuit parameters in parallel, and for mass-produced circuit boards, a large number of tests can be completed in a short time. The test can be run according to the preset program, and the test results are more accurate and stable. It can be equipped with high-precision test instruments, can accurately measure tiny voltage and current changes, has high efficiency and stability, can reduce testing costs, can promptly detect and remove defective circuit boards, and avoid defective products from flowing into the next process, thereby reducing scrap rate and rework costs. It can automatically record and store test data for subsequent data analysis and quality traceability, and can help enterprises achieve statistical process control (SPC), optimize production processes, and improve product quality. It can ensure that the conditions and methods of each test are completely consistent, and ensure the repeatability of test results. In summary, the circuit testing system provided in the embodiment of the present application has obvious advantages in efficiency, accuracy, cost, data management and repeatability, and is suitable for large-scale, high-precision circuit board production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0038] Figure 1 A schematic diagram of a system architecture for implementing circuit testing provided in an embodiment of the present application;

[0039] Figure 2 A schematic diagram of the structure of a circuit test mold provided in an embodiment of the present application;

[0040] Figure 3 A flow chart of a circuit testing method provided in an embodiment of the present application;

[0041] Figure 4 A schematic diagram of the structure of a circuit testing device exemplified in an embodiment of the present application;

[0042] Figure 5 A hardware structure block diagram of a circuit testing device disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0043] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0044] In view of the fact that most of the current circuit testing solutions are difficult to adapt to complex and changeable business needs, the applicant has studied a circuit testing solution, which can test multiple circuit parameters in parallel. For mass-produced circuit boards, a large number of tests can be completed in a short time, and can be run according to preset programs. The test results are more accurate and stable, and can be equipped with high-precision test instruments. It can accurately measure tiny voltage and current changes, has high efficiency and stability, can reduce testing costs, can promptly detect and remove defective circuit boards, and avoid defective products from flowing into the next process, thereby reducing scrap rate and rework costs. It can automatically record and store test data, which is convenient for subsequent data analysis and quality traceability, and can help enterprises achieve statistical process control (SPC), optimize production processes, and improve product quality. It can ensure that the conditions and methods of each test are completely consistent, and ensure the repeatability of test results; In summary, the circuit testing system provided in the embodiment of the present application has obvious advantages in efficiency, accuracy, cost, data management and repeatability, and is suitable for large-scale, high-precision circuit board production needs.

[0045] The method provided in the embodiments of the present application can be used in many general or special computing device environments or configurations, such as personal computers, server computers, handheld devices or portable devices, tablet devices, multi-processor devices, and distributed computing environments including any of the above devices or equipment.

[0046] An embodiment of the present application provides a circuit testing method, which can be applied to various circuit board detection systems and can also be applied to various computer terminals or smart terminals. The execution subject can be a processor or server of the computer terminal or smart terminal.

[0047] In actual application, circuit board testing mainly relies on manual measurement by technicians. Manual measurement requires operators to measure various parameters on the circuit board one by one, such as voltage, current, resistance, etc. For complex circuit boards, there are many measurement points, and manual operation will take a lot of time. For example, when mass-producing circuit boards, manual measurement will seriously slow down the production progress and cannot meet the needs of large-scale production. Manual measurement is difficult to measure multiple parameters at the same time, and usually requires measurement one by one in sequence, which further reduces the measurement efficiency.

[0048] Furthermore, the accuracy of manual measurements is also limited, and the accuracy of manual measurements depends largely on the skills and experience of the operator. Operator fatigue, lack of concentration, or unskilled operation may lead to measurement errors. For example, when reading the value of a multimeter, different operators may have different readings, especially when measuring small voltages or currents. This error is more obvious.

[0049] Manual measurement also has limited instrument accuracy. For example, manual measurement usually uses handheld measuring instruments, which are generally less accurate than professional automatic test equipment. For high-precision circuit board measurements, manual measurement is difficult to meet the requirements.

[0050] There are also inconveniences in recording and managing manually measured data. For example, manually measured data is usually recorded manually by operators, which is prone to recording errors, unclear handwriting, or incomplete records. For example, when recording a large amount of measurement data, data may be missed or the location may be wrong. In addition, manually recorded data is difficult to store and manage effectively. When it is necessary to trace data or perform data analysis, the workload of finding and sorting data is large and the efficiency is low.

[0051] Manual measurement has poor repeatability. It is difficult to ensure that the conditions for each measurement are completely consistent. Factors such as probe contact pressure and measurement environment will affect the measurement results. For example, the position and pressure of the probe contacting the circuit board are different each time, which may cause fluctuations in the measurement results. Different operators have different measurement techniques and habits, which will lead to poor repeatability of the measurement results and is not conducive to quality control.

[0052] In summary, manual measurement of circuit board parameters has obvious drawbacks in terms of efficiency, accuracy, data management and repeatability, and is gradually unable to meet the needs of the modern electronics manufacturing industry. Therefore, there is an urgent need for an automatic measurement method that can achieve high efficiency and high accuracy in batches.

[0053] Combine the following Figure 1 , introduces an optional system architecture that can realize various indicators of automatic testing circuits given in the embodiments of the present application, such as Figure 1As shown, the system architecture may include a test mold, an electronic test device, and a computing device; wherein the test mold may be connected to the electronic test device and the computing device, respectively.

[0054] The test mold includes a power supply and a control module. The test mold can be used to place the object to be tested; the power supply is used to power the test mold; the control module has at least one test circuit built in, and each test circuit can be used to test at least one indicator to be tested of the object to be tested.

[0055] For example, the indicators to be tested may include frequency, burning, voltage, current, and resistance of the object to be tested.

[0056] For example, the following types of test circuits may be included in the control module:

[0057] 1. Voltage test circuit:

[0058] (1) DC voltage test circuit: voltage divider circuit and operational amplifier circuit;

[0059] The voltage divider circuit is a simple and common circuit consisting of two resistors in series. By measuring the voltage across one of the resistors, the input voltage can be calculated based on the voltage distribution principle of the series circuit. For example, in a voltage divider circuit consisting of 10kΩ and 20kΩ resistors in series, if the voltage across the 10kΩ resistor is measured to be 5V, the input voltage is 15V. This circuit is suitable for measuring higher DC voltages, and the measurement range can be changed by selecting the appropriate resistance value.

[0060] The operational amplifier circuit uses the voltage follower or proportional amplification characteristics of the operational amplifier to measure voltage. The voltage follower (such as an operational amplifier such as LM324) can output the input voltage with almost no attenuation, which is used to buffer and isolate the measured voltage to improve the measurement accuracy. The proportional amplifier circuit can amplify or reduce the input voltage as needed, which is convenient for measuring small or large voltages.

[0061] (2) AC voltage test: rectification-filtering-voltage divider circuit and true RMS conversion circuit;

[0062] Rectification-filtering-voltage divider circuit For AC voltage measurement, the AC is first converted to DC through a rectifier circuit (such as a bridge rectifier), and then the ripple is removed by a filter capacitor, and then measured through a voltage divider circuit. For example, in a simple AC voltage measurement circuit, the AC voltage is rectified by a rectifier bridge, filtered by a large-capacity capacitor, and then passed through a voltage divider composed of 1kΩ and 9kΩ resistors. The voltage across the 1kΩ resistor is measured, and the effective value of the AC voltage is obtained based on calculation.

[0063] True RMS conversion circuit In some situations where the effective value of AC voltage needs to be accurately measured, a true RMS conversion chip (such as AD637) is used. This circuit can convert an AC signal of any waveform into a DC signal proportional to its effective value, without being affected by the signal waveform, thereby accurately measuring the AC voltage.

[0064] 2. Current test circuit

[0065] (1) Series resistance method test circuit: The series resistance method is the simplest current measurement method. A precision resistor with a small resistance value (called a sampling resistor) is connected in series in the current branch to be measured. The voltage across the sampling resistor is measured and the current is calculated according to Ohm's law. For example, if a 0.1Ω sampling resistor is connected in series and the voltage across it is measured to be 0.5V, the current is 5A. This method is suitable for DC and AC current measurement, but it may introduce large errors for small current measurement.

[0066] (2) Current transformer circuit: For large AC current measurement, the current transformer circuit is a commonly used circuit. It consists of a primary coil (connected in series in the current branch to be measured) and a secondary coil. According to the principle of electromagnetic induction, the secondary coil induces a current proportional to the primary current, and the primary current is indirectly measured by measuring the secondary current. For example, if the transformation ratio of a current transformer is 100:1, if the current measured by the secondary coil is 0.5A, then the primary current is 50A.

[0067] (3) Hall effect current sensor circuit: Hall effect current sensor has a good application in both DC and AC current measurement. It is based on the Hall effect. When current passes through a current-carrying conductor, a Hall voltage is generated in the direction perpendicular to the current and magnetic field. The current is determined by measuring the Hall voltage. For example, in a linear Hall effect current sensor, its output voltage is linearly related to the measured current, and the current can be accurately measured based on the sensitivity coefficient of the sensor.

[0068] 3. Resistance test circuit

[0069] (1) Wheatstone bridge circuit: The Wheatstone bridge circuit is a classic resistance measurement circuit. It consists of four resistors forming a quadrilateral bridge, one of which is the resistor to be measured, and the other three are standard resistors with known resistance values. By adjusting one of the standard resistors (usually a variable resistor) to balance the bridge (i.e., the potentials at both ends of the diagonal are equal), the resistance value of the resistor to be measured is calculated based on the bridge balance condition (such as R1 / R2=R3 / R4). For example, in a Wheatstone bridge, R1=100Ω, R2=200Ω, R3 is the variable resistor, and R4 is the resistor to be measured. When R3 is adjusted to 200Ω to balance the bridge, R4 can be calculated to be 400Ω.

[0070] (2) Ohmmeter circuit: The most common is the ohmmeter circuit in a multimeter. It generally uses a constant current source and a voltmeter. The constant current source provides a known current through the resistor being measured, and then the voltage across the resistor is measured by the voltmeter, and the resistance value is calculated according to Ohm's law. For example, if the constant current source outputs 1mA current and the voltage across the resistor is 5V, then the resistance value is 5kΩ.

[0071] 4.Logic function test circuit

[0072] (1) Logic analyzer circuit: This is a complex test circuit used to analyze logic signals in digital circuits. It can simultaneously collect multiple digital signal channels and record signal level changes, timing relationships, etc. For example, when testing a complex digital system (such as a CPU chip), the logic analyzer can capture the signal changes of the chip pins and analyze these signals to determine whether the logic function is correct, such as checking whether the data transmission complies with the protocol and whether the control signals are executed in sequence.

[0073] (2) Simple logic level test circuit: For simple logic circuits, a light-emitting diode (LED) and a current-limiting resistor can be used to form a test circuit. Connect the anode of the LED to the logic high level output terminal, and the cathode to the ground through a current-limiting resistor. If the output is high level and the LED is on, it means that the logic output is correct; if the LED is not on, there may be a logic error. This circuit is simple and intuitive, and is suitable for preliminary inspection of the output status of the logic circuit.

[0074] 5.Simulation function test circuit

[0075] (1) Amplifier test circuit: For amplifiers, the main tests are its amplification factor, bandwidth and other performance. A signal generator can be used to provide an input signal, and then an oscilloscope can be used to measure the amplitude of the input and output signals to calculate the amplification factor. For example, the signal generator outputs a 10mV sine wave signal, and the amplifier output is a 1V sine wave signal measured by an oscilloscope, then the amplification factor is 100 times. The bandwidth test is performed by changing the frequency of the input signal and observing the frequency when the output signal amplitude drops to about 0.707 times, which is the bandwidth of the amplifier.

[0076] (2) Filter test circuit: For filters, a signal generator is also used to provide input signals, and an oscilloscope is used to observe the waveform and amplitude changes of the input and output signals. For example, for a low-pass filter, when the signal generator outputs a high-frequency signal, the output signal amplitude is observed to be significantly reduced through the oscilloscope, thereby verifying the filtering characteristics of the filter. At the same time, the frequency response curve of the filter can be plotted by changing the input signal frequency to accurately evaluate its performance.

[0077] In addition, if Figure 2As shown in the schematic diagram of the test mold effect, the test mold may also include: a base 1, a frame 2, a test platform 3, a test head 4, and a handle 5;

[0078] The control module is built into the control box of the base 1; the electrical connection lines inside the control module are responsible for connecting the probes, power supply, signal generator and other test equipment of the test head. These lines usually use well-insulated wires and are wired according to certain rules, such as layered wiring or junction box wiring. Layered wiring can reduce electromagnetic interference between lines, and junction box wiring facilitates centralized management and maintenance of lines.

[0079] In actual application, the test mold can be provided with various interfaces on the outside for connecting external test equipment (such as computers, oscilloscopes, power supplies, etc.). These interfaces may include USB interfaces, RS-232 interfaces, power supply interfaces, etc. The USB interface facilitates data transmission and control command transmission with the computer; the RS-232 interface is used to communicate with some traditional test equipment; and the power supply interface is used to connect to an external power supply to provide power for the electrical components and test circuits inside the test mold.

[0080] The base 1 is a rectangular base, which is a rectangular flat plate made of solid metal (such as aluminum alloy). Among them, the aluminum alloy material has the characteristics of light weight and high strength, and can withstand the weight and pressure of other parts of the mold and the circuit board during the test process. There are four supporting feet at the corners of the base to ensure the stability of the test mold during work. There is a handle on each side of the base to facilitate the handling and movement of the test mold; further, rubber anti-skid pads can be installed at the four corners of the bottom of the base. These anti-skid pads can increase the friction between the mold and the placement plane, prevent the mold from shifting due to operation or vibration during the test, and ensure the accuracy and safety of the test.

[0081] There are some regularly arranged fixing holes on the base 1, which are used to fix the mold on the test platform 3. These holes can be tightly connected to the test platform by bolts, further enhancing the stability of the mold during operation.

[0082] The frame 2 is a metal frame, which is located above the base. The frame 2 is composed of two vertical bakelite, two vertical metal pillars and two horizontal bakelite beams to form a stable support structure; the frame 2 is generally a three-dimensional structure formed by welding or bolting metal profiles (such as stainless steel or aluminum alloy square tubes). This structure can provide sufficient strength and rigidity to support the internal test components and withstand possible external force impacts. In actual application, the frame not only plays a supporting role, but also plays a certain protective role for the internal electrical components and test circuits. It can prevent dust, foreign matter, etc. from entering the mold, affecting the test accuracy or damaging electrical equipment. At the same time, some openings or transparent observation windows can also be set on the side of the frame 2 to facilitate operators to observe the test process and the working status of internal components.

[0083] The test platform 3 is arranged in the middle of the frame 2. The test platform 3 can be used to place the object to be tested. There are a plurality of fixing holes on the test platform 3 for fixing the object to be tested to ensure that the object to be tested does not move during the test. The test platform is a flat metal plate (such as a copper plate or an aluminum plate). The metal material is conducive to the discharge of static electricity and avoids static electricity from damaging the circuit board. Its surface is specially treated, such as anodizing or nickel plating, to improve the wear resistance and conductivity of the surface. In addition, precise positioning pins or positioning grooves are provided on the test platform for quickly and accurately placing the circuit board. These positioning devices can ensure that the position of the circuit board is consistent each time, thereby ensuring the accurate contact between the test probe and the test point of the circuit board and improving the repeatability of the test.

[0084] In order to fix the circuit board during the test and prevent it from moving, the test platform 3 can also be equipped with a clamping device. Common clamping methods include mechanical clamps, pneumatic clamps or electromagnetic clamps. Mechanical clamps clamp the circuit board by manually rotating the screw, which is simple to operate but inefficient; pneumatic clamps use compressed air to drive the clamp to clamp, which is fast and has uniform clamping force; electromagnetic clamps use electromagnetic force to absorb the circuit board, which is suitable for circuit board testing that has no effect on magnetic materials.

[0085] Regardless of which clamping method is used, the clamping device on the test platform 3 can adjust the clamping force. Appropriate clamping force can ensure that the circuit board does not move during the test process, and does not damage the components or circuits on the circuit board due to excessive clamping.

[0086] In actual application, the test platform 3 can support the simultaneous measurement of at least two indicators to be tested of the object to be tested.

[0087] The test head 4 is deployed on the top of the frame 2 , and there are multiple probes under the test head 4 for contacting various test points of the object to be tested; the test head 4 is connected to the handle 5 , and the handle 5 is used to operate the test head 4 .

[0088] In actual application, the test head can be installed on a mechanical device that can move up and down, such as a screw drive mechanism or a linear guide mechanism. The screw drive mechanism moves the test head up and down by rotating the screw, which has high precision and stability; the linear guide mechanism can make the test head move smoothly along a straight line, which is convenient for rapid positioning.

[0089] The height of the test head can be adjusted by a manual knob or an electric adjustment device. The manual knob is easy to operate and is suitable for small batches and tests that do not require particularly high precision; the electric adjustment device can be driven by a motor to achieve more precise height adjustment and can be integrated with the automated test system.

[0090] The probe is a key component of the test head, which is used to contact the test points on the circuit board. The probe is usually made of high-hardness, high-conductivity metal materials (such as tungsten steel or beryllium copper). There are many shapes, the most common ones are needle-shaped or spring-shaped. Needle-shaped probes are suitable for test points with a large contact area, while spring-shaped needle probes are elastic and can better adapt to test points of different heights, and can compensate for contact pressure to a certain extent.

[0091] The probes are arranged on the test head according to the layout of the test points on the circuit board. In order to ensure that multiple points can be tested at the same time, the arrangement of the probes needs to match the design of the circuit board. In some high-precision test molds, the layout of the probes may be made according to the CAD drawings of the circuit board through precision machining or 3D printing to ensure that each probe can accurately contact the corresponding test point.

[0092] In actual application, manual control, semi-automatic control or fully automatic control can be used to control the test head to test the object to be tested. For example, the movement of the test head, the start and stop of the test, etc. can be operated by various knobs, buttons and switches; semi-automatic control combines the characteristics of manual and automatic, and some operations (such as the positioning of the test head) can be completed automatically, while other operations (such as the setting of test parameters) need to be performed manually; fully automatic control is through pre-programming, so that the entire test process is automatically completed under the control of the computer or controller without human intervention.

[0093] The electronic test equipment is used to display the test results of the object to be tested; for example, the electronic test equipment may be an oscilloscope or a multimeter, which can be used to display the test results of the object to be tested.

[0094] In actual application, when the test object is a circuit board, the quality of the circuit board can be traced by saving the test results of the circuit board. For each circuit board, there is a detailed test data record to make it clear whether it meets the quality standards. For example, in the mass production of electronic products, if a batch of circuit boards has quality problems, the root cause of the problem can be found by consulting the previously saved test results, whether it is a general abnormality of a specific test indicator or a special case of an individual circuit board.

[0095] Furthermore, analyzing the test results of circuit boards helps establish quality control standards. Based on historical test data, we can determine a reasonable range of test indicators and the degree of impact of different indicators on the overall quality of the product. For example, for high-precision electronic equipment circuit boards, by analyzing the test results of parameters such as voltage and current, we can determine a more stringent quality control range to ensure the stability of product quality.

[0096] Furthermore, saving the test results of the object to be tested can serve as an important basis for fault diagnosis. For example, when the object to be tested is a circuit board, when the circuit board fails during use, the fault point can be quickly located by comparing the test data of the faulty circuit board with the historical data of the normal circuit board. For example, if the current test result of a circuit board is much higher than the normal range, combined with the previous test data and circuit principles, it may be quickly determined that it is caused by a short circuit in a component or a circuit design defect.

[0097] Furthermore, analyzing the test results can reveal potential trends in quality problems. For example, through statistical analysis, it is possible to observe whether certain test indicators have a tendency to gradually deviate from the normal range, so as to take measures in advance to prevent large-scale failures. For example, if it is found that the capacitance value of a certain model of circuit board gradually decreases in multiple tests, the production process can be adjusted in time or the capacitor supplier can be replaced to avoid circuit board failures caused by capacitor failure.

[0098] Furthermore, analyzing the test results of the object to be tested can provide data support for the improvement of the production process. For example, when the object to be tested is a circuit board, by comparing the test results of circuit boards from different production lines or different production batches, it can be found that certain production links may have an impact on the performance of the circuit board. If the resistance value of the circuit board produced by a production line has a large deviation, there may be problems with the welding process or component selection of the production line, so targeted improvements can be made. In addition, for new production processes or new circuit board designs, the analysis of test results can verify their feasibility. Compare the test results of circuit boards using new processes or new designs with traditional ones to evaluate whether the new process or new design can improve the performance of the circuit board or reduce costs. For example, after introducing a new surface mounting technology, by analyzing the electrical performance test results of the circuit board, determine whether the technology can effectively improve production efficiency and product quality.

[0099] Saving and analyzing test results can help reduce production costs. By accurately locating quality problems, scrap rates can be reduced. For example, if the problem that causes a short circuit in a circuit board can be discovered and solved in a timely manner through analysis of test results, a large number of circuit boards can be avoided from being scrapped due to short circuit failures, thereby saving raw materials and production costs. The test process itself can be optimized based on the test results. If it is found that certain test indicators have almost no abnormalities in multiple tests, or can be indirectly inferred through other indicators, it is possible to consider simplifying these test steps, improving test efficiency, and thus reducing test costs.

[0100] In the R&D stage of a circuit board, saving and analyzing the test results of the circuit board is the key to verifying whether the design meets the requirements. By testing and analyzing the performance indicators of the circuit board under different design schemes, such as signal integrity, frequency response, etc., the best design scheme can be selected. For example, when designing a high-speed digital circuit board, by testing and analyzing the signal integrity test results under different wiring schemes, the wiring method that can achieve the best signal transmission quality can be determined.

[0101] When it is necessary to upgrade the function of the circuit board, previous test results can help engineers understand the performance bottlenecks of the circuit board and the direction of improvement. For example, when adding signal processing functions to the circuit board, by analyzing the previous frequency response test results, it is determined whether it is necessary to modify the existing circuit or add new components to meet the new functional requirements.

[0102] Therefore, the computing device provided in the embodiment of the present application can be used to save and analyze the test results of the object to be tested and form a test analysis report of the object to be tested.

[0103] Combine the following Figure 3 , introduces the process of the circuit testing method given in the embodiment of the present application, such as Figure 1As shown, the process can include the following steps:

[0104] Step S101, placing the object to be tested on a test platform of a test mold.

[0105] Step S102: determining at least one indicator to be tested corresponding to the object to be tested.

[0106] Step S103 , starting the test mold, testing the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtaining test results of each indicator to be tested of the object to be tested.

[0107] Among them, the test instructions of the object to be tested may include the following:

[0108] 1. Electrical parameter test instructions

[0109] (1) Voltage test instructions

[0110] a. DC voltage measurement instructions:

[0111] For example, "MEASURE_DC_VOLTAGE (test point number)", this instruction will connect the test equipment to the specified test point and then measure the DC voltage at that point. During the test process, it may also include voltage range setting instructions, such as "SET_VOLTAGE_RANGE (minimum voltage value, maximum voltage value)", which is used to determine the measurement range and ensure the accuracy of the measurement.

[0112] b. AC voltage measurement instructions:

[0113] Similar to DC voltage measurement, "MEASURE_AC_VOLTAGE (test point number)" is used to measure the effective value of the AC voltage at the specified test point. At the same time, in order to accurately measure the AC voltage, there may be instructions to set the frequency range of the AC signal:

[0114] For example: like "SET_AC_FREQUENCY_RANGE(minimum frequency, maximum frequency)", because the measurement of AC voltage may be affected by the frequency.

[0115] (2) Current test instruction

[0116] a. DC current measurement instructions: such as "MEASURE_DC_CURRENT (branch number)", which is used to measure the DC current of a branch on the circuit board. In actual testing, it is also necessary to set the current measurement range, which is achieved through the instruction "SET_CURRENT_RANGE (minimum current value, maximum current value)". In addition, for some high-precision current measurements, there may be instructions for calibrating the current sensor, such as "CALIBRATE_CURRENT_SENSOR (calibration parameters)".

[0117] b. AC current measurement instruction: "MEASURE_AC_CURRENT (branch number)" is used to measure AC current. It is also necessary to set parameters such as frequency range and current range. Relevant instructions include "SET_AC_CURRENT_FREQUENCY_RANGE (minimum frequency, maximum frequency)" and "SET_AC_CURRENT_RANGE (minimum current value, maximum current value)".

[0118] (3) Resistance test instructions

[0119] a. Single resistance measurement command: For example, "MEASURE_RESISTANCE (resistance element number)" is used to measure the resistance value of a specified resistance element. Before testing, there may be a command to set the precision level of the measured resistance, such as "SET_RESISTANCE_PRECISION (precision level)" to meet different test requirements.

[0120] b. Circuit node resistance measurement instruction:

[0121] You can use the "MEASURE_NODE_RESISTANCE(starting node number, ending node number)" instruction to measure the resistance between two circuit nodes, which is very useful when checking the continuity of a circuit or finding a short circuit fault.

[0122] 2. Functional test instructions

[0123] (1)Logical function test instructions

[0124] a. Single logic gate test instruction: For example, "TEST_LOGIC_GATE (logic gate component number, input logic level combination)", this instruction will input the specified logic level combination into the logic gate component, and then check whether the output logic level conforms to the truth table of the logic gate. For complex digital circuits, there may be instructions to set the test sequence, such as "SET_LOGIC_TEST_SEQUENCE (logic level combination sequence)", which is used to sequentially test circuits composed of multiple logic gates.

[0125] b. Digital circuit function test instruction: "TEST_DIGITAL_CIRCUIT (circuit module number, input test data sequence)" is used to perform functional tests on the entire digital circuit module. The input test data sequence can be a set of binary data to simulate the actual digital signal input, and then check whether the output data meets the design function of the circuit.

[0126] (2) Simulation function test instructions

[0127] a. Amplifier function test instructions: such as "TEST_AMPLIFIER (amplifier component number, input signal frequency, input signal amplitude)", this instruction will input the signal of the specified frequency and amplitude into the amplifier, and then measure the output signal amplitude of the amplifier to calculate the amplification factor. At the same time, there may be instructions to test the bandwidth of the amplifier, such as "TEST_AMPLIFIER_BANDWIDTH (amplifier component number, start frequency, end frequency)", by changing the input signal frequency to scan within the specified range, and observing the change in the output signal amplitude to determine the bandwidth.

[0128] b. Filter function test command: "TEST_FILTER (filter component number, input signal frequency sequence)" is used to test the filter characteristics of the filter. By inputting a series of signals with different frequencies, measuring the output signal amplitude of the filter, and drawing the frequency response curve, the performance of the filter, such as cutoff frequency, passband attenuation, etc., can be evaluated.

[0129] 3. Fault detection and diagnosis instructions

[0130] (1) Short circuit detection command: "DETECT_SHORT_CIRCUIT (test area number)" is used to check whether there is a short circuit fault in the specified area. The test equipment may determine whether there is a short circuit by applying a small current signal and then monitoring the voltage. If a short circuit is detected, an alarm signal may be issued or the short circuit location information may be returned.

[0131] (2) Open circuit detection command: "DETECT_OPEN_CIRCUIT (test branch number)" is used to detect whether there is an open circuit fault in the specified branch. Usually, the branch is judged to be conductive by measuring the resistance at both ends of the branch or applying a test voltage.

[0132] (3) Component fault diagnosis command: For components suspected of being faulty, you can use the "DIAGNOSE_COMPONENT_FAILURE (component number, test parameter list)" command. This command will perform detailed tests on the component based on the component type and the provided test parameter list, such as testing the transistor's amplification factor, breakdown voltage and other parameters to determine whether the component is damaged.

[0133] Step S104, displaying and saving the test results of each of the indicators to be tested, and analyzing the test results of each of the indicators to be tested to form a test report of the object to be tested.

[0134] It can be seen from the technical solutions introduced above that the circuit testing method provided in the embodiment of the present application can test multiple circuit parameters in parallel. For mass-produced circuit boards, a large number of tests can be completed in a short time. It can be run according to the preset program, and the test results are more accurate and stable. It can be equipped with high-precision test instruments, which can accurately measure tiny voltage and current changes. It has high efficiency and stability, can reduce testing costs, and can promptly detect and eliminate defective circuit boards to prevent defective products from flowing into the next process, thereby reducing scrap rate and rework costs. It can automatically record and store test data for subsequent data analysis and quality traceability, which can help enterprises achieve statistical process control (SPC), optimize production processes, and improve product quality. It can ensure that the conditions and methods of each test are completely consistent, and ensure the repeatability of test results. In summary, the circuit testing system provided in the embodiment of the present application has obvious advantages in efficiency, accuracy, cost, data management and repeatability, and is suitable for large-scale, high-precision circuit board production needs.

[0135] Among them, the specific processing flow of the above circuit testing method can refer to the relevant introduction of the circuit testing system part in the previous text, and will not be repeated here.

[0136] The circuit testing device provided in an embodiment of the present application is described below. The circuit testing device described below and the circuit testing method described above can refer to each other.

[0137] See also Figure 4 , Figure 4 A schematic diagram of the structure of a circuit testing device disclosed in an embodiment of the present application.

[0138] like Figure 4 As shown, the circuit testing device may include:

[0139] A placement unit 101 is used to place the object to be tested on a test platform of a test mold;

[0140] A determination unit 102, configured to determine at least one to-be-tested indicator corresponding to the to-be-tested object;

[0141] A starting unit 103 is used to start the test mold, test the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtain test results of each indicator to be tested of the object to be tested;

[0142] The analyzing unit 104 displays and saves the test results of each of the indicators to be tested, and analyzes the test results of each of the indicators to be tested to form a test report of the object to be tested.

[0143] It can be seen from the technical solutions introduced above that the circuit testing device provided in the embodiment of the present application can test multiple circuit parameters in parallel. For mass-produced circuit boards, a large number of tests can be completed in a short time. It can be run according to the preset program, and the test results are more accurate and stable. It can be equipped with high-precision test instruments, which can accurately measure tiny voltage and current changes. It has high efficiency and stability, can reduce testing costs, and can promptly detect and eliminate defective circuit boards to prevent defective products from flowing into the next process, thereby reducing scrap rate and rework costs. It can automatically record and store test data for subsequent data analysis and quality traceability, which can help enterprises achieve statistical process control (SPC), optimize production processes, and improve product quality. It can ensure that the conditions and methods of each test are completely consistent, and ensure the repeatability of test results. In summary, the circuit testing system provided in the embodiment of the present application has obvious advantages in efficiency, accuracy, cost, data management and repeatability, and is suitable for large-scale, high-precision circuit board production needs.

[0144] Among them, the specific processing flow of each unit included in the above-mentioned circuit testing device can refer to the relevant introduction of the circuit testing method part above, and will not be repeated here.

[0145] The circuit testing device provided in the embodiment of the present application can be applied to circuit testing equipment, such as terminals: mobile phones, computers, etc. Optionally, Figure 5 The hardware structure diagram of the circuit test equipment is shown in FIG. Figure 5 The hardware structure of the circuit testing device may include: at least one processor 1, at least one communication interface 2, at least one memory 3 and at least one communication bus 4.

[0146] In the embodiment of the present application, the number of the processor 1 , the communication interface 2 , the memory 3 , and the communication bus 4 is at least one, and the processor 1 , the communication interface 2 , and the memory 3 communicate with each other through the communication bus 4 .

[0147] The processor 1 may be a central processing unit CPU, or an application-specific integrated circuit ASIC (Application Specific Integrated Circuit), or one or more integrated circuits configured to implement the embodiments of the present application, etc.;

[0148] The memory 3 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory;

[0149] The memory stores a program, and the processor can call the program stored in the memory, wherein the program is used to implement each processing flow in the aforementioned terminal circuit test solution.

[0150] An embodiment of the present application further provides a readable storage medium, which can store a program suitable for execution by a processor, wherein the program is used to: implement various processing flows of the aforementioned terminal in the circuit testing scheme.

[0151] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0152] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0153] The above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the present application. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. The various embodiments can be combined with each other. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A circuit testing system, characterized in that: The system includes: a test mold, electronic test equipment and computing equipment; Wherein, the test mold is connected to the electronic test equipment and the computing equipment respectively; The test mold includes a power supply and a control module, and the test mold is used to place the object to be tested; wherein the power supply is used to power the test mold; the control module has at least one test circuit built in, and each test circuit is used to test at least one indicator to be tested of the object to be tested; The electronic testing device is used to display the test results of the object to be tested; The computing device is used to store and analyze the test results of the object to be tested and form a test analysis report of the object to be tested.

2. The circuit testing system according to claim 1, characterized in that: The test mold also includes: a base, a frame, a test platform, a test head, and a handle; in, The control module is built into the control box of the base; The base is a rectangular base with four supporting feet at the corners to ensure the stability of the test mold during operation. There is a handle on each side of the base to facilitate carrying and moving the test mold. The frame is a bakelite and metal frame, the frame is located above the base, and the frame is composed of two vertical bakelite and two vertical metal pillars and two horizontal bakelite beams to form a stable support structure; The test platform is arranged in the middle of the frame, and is used to place the object to be tested, wherein the test platform has a plurality of fixing holes for fixing the object to be tested to ensure that the object to be tested does not move during the test process; The test head is deployed on the top of the frame, and a plurality of probes are provided below the test head for contacting various test points of the object to be tested; The test head is connected to the handle, and the handle is used to operate the test head.

3. The circuit testing system according to claim 2, characterized in that: The test platform supports simultaneous measurement of at least two to-be-tested indicators of the to-be-tested object.

4. The circuit testing system according to claim 2, characterized in that: The test platform comprises a clamping device.

5. A circuit testing method, characterized in that: Applied to any circuit test system of any one of claims 1 to 4, the method comprising: Placing the object to be tested on the test platform of the test mold; Determine at least one indicator to be tested corresponding to the object to be tested; Starting the test mold, testing the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtaining test results of each indicator to be tested of the object to be tested; The test results of each of the indicators to be tested are displayed and saved, and the test results of each of the indicators to be tested are analyzed to form a test report of the object to be tested.

6. The circuit testing method according to claim 5, characterized in that: The indicators to be tested include frequency, burning, voltage, current, and resistance of the object to be tested.

7. The circuit testing method according to claim 5, characterized in that: The test mold includes at least one test circuit.

8. A circuit testing device, characterized in that: A circuit testing method according to any one of claims 5 to 6, the device comprising: A placement unit, used for placing the object to be tested on the test platform of the test mold; A determination unit, used to determine at least one to-be-tested indicator corresponding to the to-be-tested object; A starting unit, used to start the test mold, test the object to be tested according to the test instructions corresponding to the indicators to be tested, and obtain test results of each indicator to be tested of the object to be tested; The analysis unit displays and saves the test results of each of the indicators to be tested, and analyzes the test results of each of the indicators to be tested to form a test report of the object to be tested.

9. A circuit testing device, characterized in that: include: one or more processors, and memory; The memory stores computer-readable instructions, and when the computer-readable instructions are executed by the one or more processors, the steps of the circuit testing method according to claim 5 are implemented.

10. A readable storage medium, characterized in that: The readable storage medium stores computer-readable instructions, and when the computer-readable instructions are executed by one or more processors, the one or more processors implement the steps of the circuit testing method as claimed in claim 5.

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