Redundant metal filling method and device, electronic equipment and readable storage medium
By dividing the layout to be filled into areas with different densities and filling them with redundant metals with different densities, the problem of poor density uniformity in the area in the prior art is solved, and a more efficient filling effect and a faster design verification cycle are achieved.
Patent Information
- Application Number
- CN202311207534.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-18
- Publication Date
- 2025-03-18
AI Technical Summary
When existing redundant metal filling methods fill redundant metals on the layout, the metal density uniformity in each region is poor, especially when the regional density difference is large.
By obtaining the layout to be filled and dividing it into a first density region and a second density region, the first redundant metal and the second redundant metal are respectively filled, so that the filled metal pattern density is within the preset target metal pattern density range.
It improves the uniformity of metal patterns in various areas of the layout, improves the filling efficiency, and reduces the design verification cycle.
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Figure CN119647399A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the semiconductor field, and in particular to a redundant metal filling method, device, electronic device and computer-readable storage medium. Background Art
[0002] Integrated circuits usually include multi-layer circuit structures, and circuit structures of different layers are connected through metal through-holes. The flatness of the circuit surface has an important impact on the yield of integrated circuits. In order to obtain good flatness, chemical mechanical polishing is usually used for flattening. The basic principle of chemical mechanical polishing is to rotate the workpiece to be polished relative to a polishing pad under a certain pressure and in the presence of polishing liquid, and use mechanical grinding and chemical oxidant corrosion to complete the material removal on the workpiece surface and obtain a smooth and flat surface.
[0003] Chemical mechanical polishing can achieve flatness, but it can also cause defects, such as abrasion defects and dishing defects. These defects may cause changes in the electrical characteristics of critical circuits and deteriorate the timing of the circuit. Redundant metal filling helps to improve the consistency of interconnection pattern density and is an important method to optimize the chemical mechanical polishing process. Currently, when filling redundancy on the layout, the layout is divided into multiple areas, and then each area is filled. The metal filled in each area is the same. Due to the different original metal density of each area, especially when the density difference between each area in the layout is large, the metal density uniformity of each area after filling is poor.
[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Summary of the invention
[0005] The purpose of this application is to provide a redundant metal filling method, device, electronic device and computer-readable storage medium to improve the uniformity of metal patterns in various areas of the layout while improving the filling efficiency.
[0006] In order to solve the above technical problems, the present application provides a redundant metal filling method, comprising:
[0007] Acquire a layout to be filled, the layout to be filled comprising a first density region and a second density region; wherein the density of the logic metal pattern in the first density region is greater than the density of the logic metal pattern in the second density region;
[0008] Filling the first density region with a first redundant metal so that the metal pattern density of the first density region after filling is within a preset target metal pattern density range;
[0009] Filling the second density region with a second redundant metal so that the metal pattern density of the second density region after filling is within the preset target metal pattern density range;
[0010] The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0011] Optionally, obtaining the layout to be filled includes:
[0012] Get the map;
[0013] Dividing the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size;
[0014] Determining the logic metal pattern density of each of the regions;
[0015] Determine whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold;
[0016] If the logic metal pattern density is greater than the preset metal pattern density threshold, determining the corresponding area as the first density area;
[0017] If the logic metal pattern density is not greater than the preset metal pattern density, the corresponding area is determined to be the second density area.
[0018] Optionally, dividing the layout includes:
[0019] The layout is divided according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.
[0020] Optionally, determining the logic metal pattern density of each of the regions includes:
[0021] The logic metal pattern density of each of the regions is determined according to a first preset formula, wherein the first preset formula is:
[0022] ρ = S1 / S2;
[0023] Wherein, ρ is the logic metal pattern density of the region, S1 is the area of the metal in the region, and S2 is the area of the region.
[0024] Optionally, the shape of the first redundant metal includes a triangle, a rectangle, a square, a polygon, a circle, and an ellipse, wherein the number of sides of the polygon is more than five.
[0025] Optionally, filling the second density region with a second redundant metal so that the metal pattern density of the filled second density region is within the preset target metal pattern density range includes:
[0026] determining whether the density of the logic metal pattern in the second density area is zero;
[0027] If the density of the logic metal pattern in the second density area is equal to zero, determining the corresponding second density area as a blank area;
[0028] If the density of the logic metal pattern in the second density area is not equal to zero, determining the corresponding second density area as a non-blank area;
[0029] Filling the blank area with a third redundant metal so that the metal pattern density of the filled blank area is within the preset target metal pattern density range;
[0030] Filling the non-blank area with a fourth redundant metal so that the metal pattern density of the non-blank area after filling is within the preset target metal pattern density range;
[0031] Wherein, the metal pattern density of the third redundant metal is greater than the metal pattern density of the fourth redundant metal.
[0032] The present application also provides a redundant metal filling device, comprising:
[0033] An acquisition module, used for acquiring a layout to be filled, wherein the layout to be filled includes a first density area and a second density area; wherein the density of the logic metal pattern in the first density area is greater than the density of the logic metal pattern in the second density area;
[0034] A first filling module, used for filling the first density area with a first redundant metal, so that the metal pattern density of the first density area after filling is within a preset target metal pattern density range;
[0035] A second filling module, used for filling the second density area with a second redundant metal, so that the metal pattern density of the second density area after filling is within the preset target metal pattern density range;
[0036] The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0037] Optionally, the acquisition module includes:
[0038] An acquisition unit, used for acquiring a layout;
[0039] A division unit, used for dividing the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size;
[0040] A first determining unit, configured to determine the logic metal pattern density of each of the regions;
[0041] A first judging unit, configured to judge whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold;
[0042] The second determination unit is used to determine that the corresponding area is the first density area if the logic metal pattern density is greater than the preset metal pattern density threshold; if the logic metal pattern density is not greater than the preset metal pattern density, determine that the corresponding area is the second density area.
[0043] The present application also provides an electronic device, including:
[0044] Memory for storing computer programs;
[0045] A processor is used to implement the steps of any of the above-mentioned redundant metal filling methods when executing the computer program.
[0046] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned redundant metal filling methods are implemented.
[0047] A redundant metal filling method provided in the present application includes: obtaining a layout to be filled, the layout to be filled including a first density area and a second density area; wherein the logic metal pattern density of the first density area is greater than the logic metal pattern density of the second density area; filling the first density area with a first redundant metal so that the metal pattern density of the first density area after filling is within a preset target metal pattern density range; filling the second density area with a second redundant metal so that the metal pattern density of the second density area after filling is within the preset target metal pattern density range; wherein the metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0048] It can be seen that the redundant metal filling method in the present application divides the layout to be filled into the first density area and the second density area according to the density of the logical metal pattern, and then fills it. When filling, the first density area with a larger density of the logical metal pattern is filled with the first redundant metal with a smaller metal pattern density, and the second density area with a smaller density of the logical metal pattern is filled with the second redundant metal with a larger metal pattern density, so that the metal pattern density of the first density area and the second density area after filling are both within the preset target metal pattern density range, thereby improving the uniformity of the metal pattern in each area of the layout, improving the filling effect, and at the same time, greatly improving the filling efficiency and reducing the design verification cycle.
[0049] In addition, the present application also provides a device, an electronic device and a computer-readable storage medium having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS
[0050] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0051] Figure 1 A redundant metal filling method provided in the embodiment of the present application Figure 1 ;
[0052] Figure 2 A schematic diagram of a layout to be filled provided in an embodiment of the present application;
[0053] Figure 3 A schematic diagram of a filled layout provided in an embodiment of the present application;
[0054] Figure 4 A redundant metal filling method provided in the embodiment of the present application Figure 2 ;
[0055] Figure 5 A schematic diagram of a layout provided in an embodiment of the present application;
[0056] Figure 6 A schematic diagram of a divided layout provided in an embodiment of the present application;
[0057] Figure 7 A schematic diagram of a filled layout provided in an embodiment of the present application;
[0058] Figure 8 A structural block diagram of a redundant metal filling device provided in an embodiment of the present application;
[0059] Fig. 9 A structural block diagram of an electronic device provided in an embodiment of the present application;
[0060] In the figure, the plate to be filled Figure 1 , , 2. Redundant graphic prohibited filling area, 3. Main graphic area, 4. Area, 5. First redundant metal, 6. Second redundant metal, 7. Third redundant metal, 8. Fourth redundant metal, 41. Blank area, 42. Non-blank area. DETAILED DESCRIPTION
[0061] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0062] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0063] As mentioned in the background technology section, when filling redundancy on a layout, the layout is currently divided into multiple areas, and then each area is filled. The metal filled in each area is the same, but due to the different original metal densities of each area, especially when the density of each area in the layout is greatly different, the uniformity of the metal density of each area after filling is poor.
[0064] In view of this, this application provides a redundant metal filling method, please refer to Figure 1 ,include:
[0065] Step S101: Acquire a layout to be filled, wherein the layout to be filled includes a first density area and a second density area; wherein the density of the logic metal pattern in the first density area is greater than the density of the logic metal pattern in the second density area.
[0066] To be filled Figure 1 The schematic diagram is as follows Figure 2 As shown, it may include a main pattern area (mainpattern) 3 where the logic metal is located and a redundant pattern forbidden filling area (dummy block) 2. Figure 1 It is divided into a plurality of regions 4 of the same size. The number and shape of the regions 4 are not limited in this application and can be set at will. Figure 2 In the figure, the number of regions 4 is 16 and the shape of region 4 is a rectangle.
[0067] The logic metal pattern density is the ratio of the logic metal area to the area of each region, that is, the density of the metal in the region when no redundant metal is filled.
[0068] Step S102: filling the first density region with a first redundant metal so that the metal pattern density of the first density region after filling is within a preset target metal pattern density range.
[0069] The preset target metal pattern density range is not limited in this application and can be set at will.
[0070] There is usually a preset optimal value for the metal graphic density of an area in a layout. The optimal value varies for different layouts, different devices, etc. The preset target metal graphic density range can fluctuate around the optimal value, and the fluctuation range can be ±5% of the optimal value, that is, the lower limit of the preset target metal graphic density range is 95% of the optimal value, and the upper limit is 105% of the optimal value; or, the fluctuation range can be ±8% of the optimal value, that is, the lower limit of the preset target metal graphic density range is 92% of the optimal value, and the upper limit is 108% of the optimal value; or other fluctuation ranges.
[0071] The shape of the first redundant metal includes, but is not limited to, a triangle, a rectangle, a square, a polygon, a circle, and an ellipse, wherein the number of sides of the polygon is more than five.
[0072] Step S103: filling the second density region with a second redundant metal so that the metal pattern density of the filled second density region is within the preset target metal pattern density range;
[0073] The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0074] It should be noted that the order of steps S102 and S103 can be interchanged.
[0075] The shape of the second redundant metal includes, but is not limited to, a triangle, a rectangle, a square, a polygon, a circle, and an ellipse, wherein the number of sides of the polygon is more than five.
[0076] like Figure 3 As shown, since the metal pattern density in the first density area is relatively large, the metal pattern density of the filled first redundant metal 5 is relatively small, and the gap between the first redundant metal patterns is relatively large; since the metal pattern density in the second density area is relatively small, the metal pattern density of the filled second redundant metal 6 is relatively large, and the gap between the first redundant metal patterns is relatively small.
[0077] The redundant metal filling method in this embodiment divides the layout to be filled into a first density area and a second density area according to the density of the logic metal pattern, and then fills it. When filling, the first density area with a larger logic metal pattern density is filled with the first redundant metal with a smaller metal pattern density, and the second density area with a smaller logic metal pattern density is filled with the second redundant metal with a larger metal pattern density, so that the metal pattern density of the first density area and the second density area after filling are both within the preset target metal pattern density range, thereby improving the uniformity of the metal pattern in each area of the layout, improving the filling effect, and at the same time, greatly improving the filling efficiency and reducing the design verification cycle.
[0078] Please refer to Figure 4 Based on the above embodiments, in one embodiment of the present application, the redundant metal filling method includes:
[0079] Step S201: Obtain the layout.
[0080] The schematic diagram of the layout is as follows Figure 5 As shown, it may include a main graphic area 3 where the logic metal is located and a redundant graphic forbidden filling area 2.
[0081] Step S202: Divide the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size.
[0082] As an implementable method, dividing the layout includes:
[0083] The layout is divided according to a grid pattern.
[0084] Among them, the grid pattern may include multiple rectangles or multiple squares or other shapes, etc., and it can mainly divide the layout into multiple areas of the same size, which is not specifically limited in this embodiment.
[0085] The schematic diagram after the layout is divided is as follows Figure 2 shown.
[0086] The size of the area affects the time consumption of the redundant metal filling method. When other factors are fixed, when the size of the area is larger, the time consumption of the redundant metal filling method can be shortened. When the size of the area is smaller, the time consumption of the redundant metal filling method increases.
[0087] Step S203: Determine the logic metal pattern density of each of the regions.
[0088] As an implementation method, determining the logic metal pattern density of each of the regions includes:
[0089] The logic metal pattern density of each of the regions is determined according to a first preset formula, wherein the first preset formula is:
[0090] ρ=S1 / S2 (1)
[0091] Wherein, ρ is the logic metal pattern density of the region, S1 is the area of the metal in the region, and S2 is the area of the region.
[0092] Step S204: determining whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold.
[0093] It should be pointed out that the preset metal pattern density threshold is not limited in the present application and can be set at will.
[0094] The size of the preset metal graphic density threshold affects the time consumption of the redundant metal filling method. When other factors are fixed, when the preset metal graphic density threshold is large, the number of first density areas is small and the number of second density areas is large, which increases the time consumption of the redundant metal filling method; when the preset metal graphic density threshold is small, the number of first density areas is large and the number of second density areas is small, which can shorten the time consumption of the redundant metal filling method.
[0095] Step S205: If the logic metal pattern density is greater than the preset metal pattern density threshold, determining the corresponding area as the first density area.
[0096] Step S206: If the logic metal pattern density is not greater than the preset metal pattern density, determining the corresponding area as the second density area.
[0097] Step S207: filling the first density region with a first redundant metal so that the metal pattern density of the first density region after filling is within a preset target metal pattern density range.
[0098] Step S208: filling the second density region with a second redundant metal so that the metal pattern density of the filled second density region is within the preset target metal pattern density range;
[0099] The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0100] Based on any of the above embodiments, in one embodiment of the present application, filling the second density region with a second redundant metal so that the metal pattern density of the filled second density region is within the preset target metal pattern density range includes:
[0101] Step S301: determining whether the density of the logic metal pattern in the second density area is zero.
[0102] Step S302: If the density of the logic metal pattern in the second density area is equal to zero, then the corresponding second density area is determined to be a blank area.
[0103] Step S303: If the density of the logic metal pattern in the second density area is not equal to zero, then determining that the corresponding second density area is a non-blank area.
[0104] Please refer to Figure 6When the density of the logic metal pattern is zero, that is, there is no logic metal in the area, so it is called a blank area 41; when the density of the logic metal pattern is not zero, that is, there is logic metal in the area, so it is called a non-blank area 42.
[0105] Step S304: filling the blank area with a third redundant metal so that the metal pattern density of the filled blank area is within the preset target metal pattern density range.
[0106] Step S305: filling the non-blank area with a fourth redundant metal so that the metal pattern density of the non-blank area after filling is within the preset target metal pattern density range;
[0107] Wherein, the metal pattern density of the third redundant metal is greater than the metal pattern density of the fourth redundant metal.
[0108] like Figure 7 As shown, the first density area is filled with the first redundant metal 5 , the non-blank area is filled with the fourth redundant metal 8 , and the blank area is filled with the third redundant metal 7 .
[0109] In this embodiment, the area where the density of the logic metal pattern is less than the preset metal pattern density threshold is further divided into a blank area and a non-blank area.
[0110] Please refer to Figure 7 , the density of the logical metal pattern corresponding to the first density area, the non-blank area, and the blank area decreases in turn. The redundant metal pattern gap filled in the first density area is the largest, and the redundant metal pattern density is the smallest. The redundant metal pattern gap filled in the non-blank area is medium, and the redundant metal pattern density is medium. The redundant metal pattern gap filled in the blank area is the smallest, and the redundant metal pattern density is the largest. The relationship between the gap and density of the redundant metal pattern and the density of the logical metal pattern is shown in Table 1. Among them, the dotted box A corresponds to the redundant metal pattern size size1, the dotted box B corresponds to the redundant metal pattern size size3, and the dotted box C corresponds to the redundant metal pattern size size2.
[0111] Table 1
[0112]
[0113] The redundant metal filling device provided in an embodiment of the present application is introduced below. The redundant metal filling device described below and the redundant metal filling method described above can be referenced to each other.
[0114] Figure 8 The structural block diagram of the redundant metal filling device provided in the embodiment of the present application is shown in FIG. Figure 8 Redundant metal filling devices may include:
[0115] An acquisition module 100 is used to acquire a layout to be filled, wherein the layout to be filled includes a first density region and a second density region; wherein the density of the logic metal pattern in the first density region is greater than the density of the logic metal pattern in the second density region;
[0116] A first filling module 200 is used to fill the first density area with a first redundant metal so that the metal pattern density of the first density area after filling is within a preset target metal pattern density range;
[0117] A second filling module 300 is used to fill the second density area with a second redundant metal so that the metal pattern density of the second density area after filling is within the preset target metal pattern density range;
[0118] The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
[0119] The redundant metal filling device of this embodiment is used to implement the aforementioned redundant metal filling method. Therefore, the specific implementation method of the redundant metal filling device can be seen in the embodiment part of the redundant metal filling method in the previous text. For example, the acquisition module 100, the first filling module 200, and the second filling module 300 are respectively used to implement steps S101, S102, and S103 in the aforementioned redundant metal filling method. Therefore, its specific implementation method can refer to the description of the corresponding various partial embodiments and will not be repeated here.
[0120] As an implementable method, the acquisition module 100 includes:
[0121] An acquisition unit, used for acquiring a layout;
[0122] A division unit, used for dividing the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size;
[0123] A first determining unit, configured to determine the density of the logic metal pattern in each of the regions;
[0124] A first judging unit, configured to judge whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold;
[0125] The second determination unit is used to determine that the corresponding area is the first density area if the logic metal pattern density is greater than the preset metal pattern density threshold; if the logic metal pattern density is not greater than the preset metal pattern density, determine that the corresponding area is the second density area.
[0126] As an implementable embodiment, the division module is specifically used to divide the layout according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.
[0127] As an implementable method, the first determining unit is specifically used to determine the logic metal pattern density of each of the regions according to a first preset formula, wherein the first preset formula is:
[0128] ρ=S1 / S2 (1)
[0129] Wherein, ρ is the logic metal pattern density of the region, S1 is the area of the metal in the region, and S2 is the area of the region.
[0130] As an implementable embodiment, the second filling module 300 includes:
[0131] A second judging unit, configured to judge whether the density of the logic metal pattern in the second density area is zero;
[0132] A third determining unit, configured to determine that the corresponding second density area is a blank area if the density of the logic metal pattern in the second density area is zero;
[0133] a fourth determining unit, configured to determine that the corresponding second density area is a non-blank area if the density of the logic metal pattern in the second density area is not equal to zero;
[0134] A first filling unit, used for filling the blank area with a third redundant metal, so that the metal pattern density of the blank area after filling is within the preset target metal pattern density range;
[0135] A second filling unit, used for filling the non-blank area with a fourth redundant metal, so that the metal pattern density of the non-blank area after filling is within the preset target metal pattern density range;
[0136] Wherein, the metal pattern density of the third redundant metal is greater than the metal pattern density of the fourth redundant metal.
[0137] The electronic device provided in the embodiment of the present application is introduced below. The electronic device described below and the redundant metal filling method described above can be referenced to each other.
[0138] Fig. 9 The structural block diagram of the electronic device provided in the embodiment of the present application includes:
[0139] A memory 11, used for storing computer programs;
[0140] The processor 12 is used to implement the steps of the redundant metal filling method described in any of the above embodiments when executing the computer program.
[0141] The computer-readable storage medium provided in an embodiment of the present application is introduced below. The computer-readable storage medium described below and the redundant metal filling method described above can be referenced to each other.
[0142] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the redundant metal filling method described in any of the above embodiments are implemented.
[0143] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.
[0144] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.
[0145] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
[0146] The redundant metal filling method, device, electronic device and computer-readable storage medium provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.
Claims
1. A redundant metal filling method, characterized in that: include: Acquire a layout to be filled, the layout to be filled comprising a first density region and a second density region; wherein the density of the logic metal pattern in the first density region is greater than the density of the logic metal pattern in the second density region; Filling the first density region with a first redundant metal so that the metal pattern density of the first density region after filling is within a preset target metal pattern density range; Filling the second density region with a second redundant metal so that the metal pattern density of the second density region after filling is within the preset target metal pattern density range; The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
2. The redundant metal filling method according to claim 1, characterized in that: Obtaining the layout to be filled includes: Get the map; Dividing the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size; Determining the logic metal pattern density of each of the regions; Determine whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold; If the logic metal pattern density is greater than the preset metal pattern density threshold, determining the corresponding area as the first density area; If the logic metal pattern density is not greater than the preset metal pattern density, the corresponding area is determined to be the second density area.
3. The redundant metal filling method according to claim 2, characterized in that: Dividing the territory includes: The layout is divided according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.
4. The redundant metal filling method according to claim 2, characterized in that: Determining the logic metal pattern density of each of the regions includes: The logic metal pattern density of each of the regions is determined according to a first preset formula, wherein the first preset formula is: ρ = S1 / S2; Wherein, ρ is the logic metal pattern density of the region, S1 is the area of the metal in the region, and S2 is the area of the region.
5. The redundant metal filling method according to claim 1, characterized in that: The shape of the first redundant metal includes a triangle, a rectangle, a square, a polygon, a circle, and an ellipse, wherein the number of sides of the polygon is more than five.
6. The redundant metal filling method according to any one of claims 1 to 5, characterized in that: Filling the second density region with a second redundant metal so that the metal pattern density of the filled second density region is within the preset target metal pattern density range includes: determining whether the density of the logic metal pattern in the second density area is zero; If the density of the logic metal pattern in the second density area is equal to zero, determining the corresponding second density area as a blank area; If the density of the logic metal pattern in the second density area is not equal to zero, determining the corresponding second density area as a non-blank area; Filling the blank area with a third redundant metal so that the metal pattern density of the filled blank area is within the preset target metal pattern density range; Filling the non-blank area with a fourth redundant metal so that the metal pattern density of the non-blank area after filling is within the preset target metal pattern density range; Wherein, the metal pattern density of the third redundant metal is greater than the metal pattern density of the fourth redundant metal.
7. A redundant metal filling device, characterized in that: include: An acquisition module, used for acquiring a layout to be filled, wherein the layout to be filled includes a first density area and a second density area; wherein the density of the logic metal pattern in the first density area is greater than the density of the logic metal pattern in the second density area; A first filling module, used for filling the first density area with a first redundant metal, so that the metal pattern density of the first density area after filling is within a preset target metal pattern density range; A second filling module, used for filling the second density area with a second redundant metal, so that the metal pattern density of the second density area after filling is within the preset target metal pattern density range; The metal pattern density of the first redundant metal is less than the metal pattern density of the second redundant metal.
8. The redundant metal filling device according to claim 7, characterized in that: The acquisition modules include: An acquisition unit, used for acquiring a layout; A division unit, used for dividing the layout to obtain a divided layout, wherein the divided layout includes a plurality of regions of the same size; A first determining unit, configured to determine the logic metal pattern density of each of the regions; A first judging unit, configured to judge whether the logic metal pattern density of each of the regions is greater than a preset metal pattern density threshold; The second determination unit is used to determine that the corresponding area is the first density area if the logic metal pattern density is greater than the preset metal pattern density threshold; if the logic metal pattern density is not greater than the preset metal pattern density, determine that the corresponding area is the second density area.
9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the redundant metal filling method as claimed in any one of claims 1 to 6 when executing the computer program.
10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the redundant metal filling method according to any one of claims 1 to 6 are implemented.