Redundant metal filling optimization method and device, electronic equipment and readable storage medium

Abstract

The invention relates to the field of semiconductors, and discloses a redundant metal filling optimization method and device, electronic equipment and a readable storage medium, and the method comprises the steps: S101, obtaining a to-be-filled layout which comprises a fillable metal region and a plurality of divided window regions with the same size; step S102, filling redundant metal in the fillable metal area to obtain a filled layout; step S103, determining the density of metal patterns in each window area in the filled layout; step S104, determining a new fillable metal area based on the metal pattern density to obtain a new layout to be filled, and entering the step S102 until the new fillable metal area cannot be determined; the metal pattern density of the redundant metal filled at each time is greater than the metal pattern density of the redundant metal filled at the last time. The redundant metal is added progressively according to the density of the metal patterns, the effect of uniform density distribution of the metal patterns on the layout is achieved, and the uniformity of the metal patterns on the layout is improved.

Description

Technical Field

[0001] The present application relates to the semiconductor field, and in particular to a redundant metal filling optimization method, device, electronic device and computer-readable storage medium. Background Art

[0002] In order to improve the chip yield, chemical mechanical polishing is needed to flatten the chip surface. Due to the different removal rates of metal and other surrounding materials, the height of the dielectric layer in the area with denser metal interconnects will be lower than that in the area with sparser metal interconnects, thus affecting the surface flatness.

[0003] In order to improve the flatness of the wafer surface, redundant metal filling can be used. Redundant metal filling is a layout structure that does not affect the logic function of the chip. It helps to improve the consistency of the interconnection pattern density and is an important method for optimizing the chemical mechanical polishing process. At present, when filling redundancy on the layout, the layout is divided into multiple areas, and then each area is filled. The metal filled in each area is the same. Due to the different original metal densities of each area, especially when the density differences between the various areas in the layout are large, the metal density uniformity of each area after filling is poor.

[0004] Therefore, how to solve the above technical problems should be the focus of technical personnel in this field. Summary of the invention

[0005] The purpose of this application is to provide a redundant metal filling optimization method, device, electronic device and computer-readable storage medium to improve the uniformity of the metal pattern of the layout.

[0006] In order to solve the above technical problems, the present application provides a redundant metal filling optimization method, comprising:

[0007] Step S101: obtaining a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size;

[0008] Step S102: Filling redundant metal in the fillable metal area to obtain a filled layout;

[0009] Step S103: determining the metal pattern density in each window area in the filled layout;

[0010] Step S104: based on the metal pattern density, determine a new fillable metal area, obtain a new to-be-filled layout, and proceed to step S102 until no new fillable metal area can be determined;

[0011] The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0012] Optionally, obtaining the layout to be filled includes:

[0013] Determining the fillable metal area on the layout;

[0014] The layout is divided to form a plurality of window areas of the same size to obtain the layout to be filled.

[0015] Optionally, determining the fillable metal area on the layout includes:

[0016] Determine the main graphic area where the metal is located and the redundant graphic forbidden filling area on the layout;

[0017] The area on the layout except the main pattern area and the redundant pattern forbidden filling area is used as the fillable metal area.

[0018] Optionally, based on the metal pattern density, determining a new fillable metal area includes:

[0019] Determining whether the metal pattern density is within a preset target metal pattern density range;

[0020] If the metal pattern density is not within the preset target metal pattern density range, an area on the layout other than the main pattern area, the redundant pattern forbidden filling area and the area filled with redundant metal is determined as a new fillable metal area.

[0021] Optionally, dividing the layout includes:

[0022] The layout is divided according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.

[0023] Optionally, based on the metal pattern density, a new fillable metal area is determined to obtain a new layout to be filled, and the process proceeds to step S102 until a new fillable metal area cannot be determined, including:

[0024] Determining whether the metal pattern density is within a preset target metal pattern density range;

[0025] If the metal pattern density is not within the preset target metal pattern density range, determining a first fillable metal region;

[0026] Filling a first redundant metal in the first fillable metal region to obtain a first filled layout;

[0027] Determine the density of the first metal pattern in each of the window areas in the first filled layout;

[0028] Determining whether the first metal pattern density is within the preset target metal pattern density range;

[0029] If the first metal pattern density is not within the preset target metal pattern density range, determining a second fillable metal region;

[0030] Filling a second redundant metal in the second fillable metal region to obtain a second filled layout;

[0031] Determine the density of the second metal pattern in each of the window areas in the second filled layout;

[0032] Determining whether the second metal pattern density is within the preset target metal pattern density range;

[0033] If the second metal pattern density is within the preset target metal pattern density range, then stop executing the redundant metal filling optimization method;

[0034] The metal pattern density of the second redundant metal is greater than the metal pattern density of the first redundant metal, and the metal pattern density of the first redundant metal is greater than the metal pattern density of the redundant metal.

[0035] Optionally, determining the metal pattern density in each of the window areas in the filled layout includes:

[0036] The metal pattern density in each window area of ​​the filled layout is determined according to a first preset formula, wherein the first preset formula is:

[0037] ρ = S1 / S2;

[0038] Where ρ is the metal pattern density in the window area, S1 is the total area of ​​metal in the area, and S2 is the area of ​​the window area.

[0039] The present application also provides a redundant metal filling optimization device, comprising:

[0040] An acquisition module is used to execute step S101: acquiring a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size;

[0041] A filling module, configured to execute step S102: filling redundant metal in the fillable metal area to obtain a filled layout;

[0042] A first determination module is used to execute step S103: determining the metal pattern density in each of the window areas in the filled layout;

[0043] An iteration module, configured to execute step S104: determining a new fillable metal region based on the metal pattern density, obtaining a new to-be-filled layout, and entering step S102 until no new fillable metal region can be determined;

[0044] The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0045] The present application also provides an electronic device, comprising:

[0046] Memory for storing computer programs;

[0047] A processor is used to implement the steps of any of the above-mentioned redundant metal filling optimization methods when executing the computer program.

[0048] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned redundant metal filling optimization methods are implemented.

[0049] A redundant metal filling optimization method provided in the present application includes: step S101: obtaining a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size; step S102: filling redundant metal in the fillable metal area to obtain a filled layout; step S103: determining the metal pattern density in each of the window areas in the filled layout; step S104: determining a new fillable metal area based on the metal pattern density to obtain a new layout to be filled, and entering step S102 until a new fillable metal area cannot be determined; wherein the metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0050] It can be seen that the redundant metal filling optimization method in the present application determines the fillable area on the layout to be filled and the divided window area when filling the layout to be filled, fills the fillable area with redundant metal, and then determines a new fillable area according to the metal pattern density of each window area, and performs redundant metal filling again until there is no fillable area. The metal pattern density of the redundant metal filled each time gradually increases, that is, redundant metal is progressively added to the layout to be filled, thereby achieving the effect of uniform distribution of metal pattern density in each window area on the layout, and improving the uniformity of the metal pattern of the layout.

[0051] In addition, the present application also provides a device, an electronic device and a computer-readable storage medium having the above advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present application or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0053] Figure 1 A process of a redundant metal filling optimization method provided in an embodiment of the present application Figure 1 ;

[0054] Figure 2 A schematic diagram of the structure of a layout to be filled provided in an embodiment of the present application;

[0055] Figure 3 A process of a redundant metal filling optimization method provided in an embodiment of the present application Figure 2 ;

[0056] Figure 4 A schematic diagram of the structure of a layout provided in an embodiment of the present application;

[0057] Figure 5 A schematic diagram of a filled layout after a redundant metal filling provided in an embodiment of the present application;

[0058] Figure 6 A schematic diagram of a filled layout after two redundant metal fillings provided in an embodiment of the present application;

[0059] Figure 7 A structural block diagram of a redundant metal filling optimization device provided in an embodiment of the present application;

[0060] Figure 8 A structural block diagram of an electronic device provided in an embodiment of the present application;

[0061] In the figure, 1. the layout to be filled, 2. the area prohibited from filling by redundant graphics, 3. the main graphics area, 4. the area that can be filled with metal, 5. the window area, 6. the redundant metal, 7. the first redundant metal. DETAILED DESCRIPTION

[0062] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0063] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0064] As mentioned in the background technology section, when filling redundancy on a layout, the layout is currently divided into multiple areas, and then each area is filled. The metal filled in each area is the same, but due to the different original metal densities of each area, especially when the density of each area in the layout is greatly different, the uniformity of the metal density of each area after filling is poor.

[0065] In view of this, this application provides a redundant metal filling optimization method, please refer to Figure 1 ,include:

[0066] Step S101: obtaining a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size.

[0067] To be filled Figure 1 The structural diagram is as follows Figure 2 As shown, it may include a main pattern area (main pattern) 3 where the logic metal is located, a redundant pattern forbidden filling area (dummy block) 2, and a fillable metal area 4, that is, the sum of the main pattern area 3, the redundant pattern forbidden filling area 2, and the fillable metal area 4 is the entire board to be filled. Figure 1 .

[0068] The divided multiple window areas 5 are obtained by dividing the entire layout to be filled, that is, the sum of all window areas 5 is the total area of ​​the entire layout to be filled. Figure 1 . Figure 2 16 window areas are shown as an example.

[0069] In this embodiment, the size and shape of the window area 5 are not limited and depend on the situation. The shape of the window area 5 can be a rectangle, a square, a regular hexagon, etc. Figure 2 The shape of the window area 5 is shown as a rectangle.

[0070] The size of the window area 5 affects the time consumption of the redundant metal filling optimization method. When other factors are fixed, when the size of the window area 5 is larger, the time consumption of the redundant metal filling optimization method can be shortened. When the size of the window area 5 is smaller, the time consumption of the redundant metal filling optimization method increases.

[0071] Step S102: Filling redundant metal in the fillable metal area to obtain a filled layout.

[0072] When filling the redundant metal, the pattern of the redundant metal can be set by oneself, for example, the pattern of the redundant metal can be a triangle, a rectangle, a square, a trapezoid, a pentagon, a hexagon, and various irregular patterns and the like.

[0073] Step S103: determining the metal pattern density in each window area in the filled layout.

[0074] As an implementable method, determining the metal pattern density in each window area in the filled layout includes:

[0075] The metal pattern density in each window area of ​​the filled layout is determined according to a first preset formula, wherein the first preset formula is:

[0076] ρ=S1 / S2 (1)

[0077] Wherein, ρ is the metal pattern density in the window area, S1 is the total area of ​​metal in the window area, and S2 is the area of ​​the window area.

[0078] It should be noted that after the redundant metal is filled for the first time, S1 is the sum of the metal area corresponding to the main graphic area in the window area and the area of ​​the redundant metal filled for the first time; after the redundant metal is filled for the second time, S1 is the sum of the metal area corresponding to the main graphic area in the window area, the area of ​​the redundant metal filled for the first time, and the area of ​​the redundant metal filled for the second time, and so on. After the redundant metal is filled for the Nth time, S1 is the metal area corresponding to the main graphic area in the window area and the sum of the areas of all redundant metals filled N times.

[0079] Step S104: based on the metal pattern density, determine a new fillable metal area, obtain a new to-be-filled layout, and proceed to step S102 until no new fillable metal area can be determined;

[0080] The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0081] The present application does not limit the number of times of redundant metal filling until the metal pattern density of all window areas is within a preset target metal pattern density range, that is, there is no new metal area that can be filled.

[0082] The redundant metal filling optimization method in this embodiment determines the fillable area on the layout to be filled and the divided window area when filling the layout to be filled, fills the fillable area with redundant metal, and then determines a new fillable area according to the metal pattern density of each window area, and fills the redundant metal again until there is no fillable area. The metal pattern density of the redundant metal filled each time gradually increases, that is, redundant metal is added progressively on the layout to be filled, so as to achieve the effect of uniform distribution of metal pattern density in each window area on the layout, and improve the uniformity of the metal pattern of the layout.

[0083] Please refer to Figure 3 Based on the above embodiments, in one embodiment of the present application, a redundant metal filling optimization method includes:

[0084] Step S201: Determine the fillable metal area on the layout.

[0085] As an implementable method, determining the fillable metal area on the layout includes:

[0086] Determine the main graphic area where the metal is located and the redundant graphic forbidden filling area on the layout;

[0087] The area on the layout except the main pattern area and the redundant pattern forbidden filling area is used as the fillable metal area.

[0088] The schematic diagram of the layout is as follows Figure 4 As shown, the layout may include a main graphic area 3 where the metal is located and a redundant graphic forbidden filling area 2.

[0089] Step S202: Divide the layout to form a plurality of window areas of the same size to obtain the layout to be filled.

[0090] As an implementable method, dividing the layout includes:

[0091] The layout is divided according to a grid pattern.

[0092] The grid pattern may include multiple rectangles or multiple squares or other shapes, etc., as long as the layout can be divided into multiple window areas of the same size, and is not specifically limited in this embodiment.

[0093] It should be pointed out that the order of steps S201 and S202 in the present application can be swapped, that is, the division can be performed first, and then the fillable metal area on the layout can be determined.

[0094] Step S203: Filling redundant metal in the fillable metal area to obtain a filled layout.

[0095] Step S204: determining the metal pattern density in each of the window regions in the filled layout.

[0096] Step S205: based on the metal pattern density, determine a new fillable metal area, obtain a new to-be-filled layout, and proceed to step S203 until no new fillable metal area can be determined;

[0097] The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0098] For example, when redundant metal filling is performed twice, the metal pattern density of the redundant metal filled for the second time is greater than the metal pattern density of the redundant metal filled for the first time; when redundant metal filling is performed three times, the metal pattern density of the redundant metal filled for the third time is greater than the metal pattern density of the redundant metal filled for the second time, the metal pattern density of the redundant metal filled for the second time is greater than the metal pattern density of the redundant metal filled for the first time, and so on.

[0099] As an implementable method, determining a new fillable metal area based on the metal pattern density includes:

[0100] Step S2051: determining whether the metal pattern density is within a preset target metal pattern density range;

[0101] Step S2052: If the metal pattern density is not within the preset target metal pattern density range, determine the area on the layout other than the main pattern area, the redundant pattern forbidden filling area and the area filled with redundant metal as a new fillable metal area.

[0102] The main graphic area, the redundant graphic forbidden filling area and the area filled with redundant metal cannot be filled with redundant metal again, except that these areas can be used as metal fillable areas.

[0103] Based on any of the above embodiments, in one embodiment of the present application, a redundant metal filling optimization method includes:

[0104] Step S301: obtaining a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size.

[0105] To be filled Figure 1 The structural diagram is as follows Figure 2 As shown, it may include the main graphic area 3 where the metal is located, the redundant graphic forbidden filling area 2 and the metal fillable area 4, that is, the sum of the main graphic area 3, the redundant graphic forbidden filling area 2 and the metal fillable area 4 is the total area of ​​the entire board to be filled. Figure 1 .

[0106] The metal-fillable region determined in this step is the metal-fillable region determined for the first time.

[0107] Step S302: Filling redundant metal in the fillable metal area to obtain a filled layout.

[0108] After the first filling of redundant metal, the layout diagram after filling is as follows Figure 5 As shown, the redundant metal 6 filled for the first time is distributed in the fillable metal region 4 in step S301 .

[0109] Step S303: Determine the metal pattern density in each window area in the filled layout.

[0110] In this step, the metal pattern density in the window area is the ratio of the sum of the redundant metal filled in the window area for the first time and the metal area corresponding to the main pattern area in the window area to the area of ​​the window area.

[0111] Step S304: determining whether the metal pattern density is within a preset target metal pattern density range.

[0112] The preset target metal pattern density range is not limited in this application and can be set at will.

[0113] There is usually a preset optimal value for the metal graphic density in the window area of ​​the layout. The optimal value varies for different layouts, different devices, etc. The preset target metal graphic density range can fluctuate around the optimal value, and the fluctuation range can be ±5% of the optimal value, that is, the lower limit of the preset target metal graphic density range is 95% of the optimal value, and the upper limit is 105% of the optimal value; or, the fluctuation range can be ±8% of the optimal value, that is, the lower limit of the preset target metal graphic density range is 92% of the optimal value, and the upper limit is 108% of the optimal value; or other fluctuation ranges.

[0114] Step S305: If the metal pattern density is not within the preset target metal pattern density range, determining a first fillable metal region.

[0115] The first fillable area is the metal fillable area determined for the second time. The schematic diagram of the layout to be filled corresponding to this step is as follows: Figure 6 shown. Figure 6 The fillable metal region A determined for the first time and the fillable metal region B determined for the second time are shown in a comparative form.

[0116] Step S306: If the metal pattern density is within the preset target metal pattern density range, the corresponding area is not a metal-fillable area.

[0117] Step S307: filling the first fillable metal region with a first redundant metal to obtain a first filled layout.

[0118] The first redundant metal 7 is the redundant metal filled for the second time, and the layout after the first filling is the layout after the redundant metal is filled twice, such as Figure 6 As shown, the metal pattern density of the first redundant metal 7 is greater than the metal pattern density of the redundant metal 6 filled in S302.

[0119] Step S308: Determine the density of the first metal pattern in each of the window areas in the first filled layout.

[0120] In this step, the metal pattern density in the window area is the ratio of the sum of the redundant metal filled twice in the window area and the metal area corresponding to the main pattern area in the window area to the area of ​​the window area.

[0121] Step S309: determining whether the first metal pattern density is within the preset target metal pattern density range.

[0122] Step S310: If the first metal pattern density is within the preset target metal pattern density range, the corresponding window area is not a metal-fillable area.

[0123] Step S311: if the first metal pattern density is not within the preset target metal pattern density range, determining a second fillable metal region.

[0124] The second fillable area is the metal fillable area determined for the third time.

[0125] Step S312: filling a second redundant metal in the second fillable metal area to obtain a second filled layout.

[0126] The second redundant metal is the redundant metal filled for the third time, and the second filled layout is the layout after the redundant metal is filled three times. The metal pattern density of the second redundant metal is greater than the metal pattern density of the first redundant metal.

[0127] Step S313: determining the density of the second metal pattern in each of the window areas in the second filled layout.

[0128] In this step, the metal pattern density in the window area is the ratio of the sum of the redundant metal filled three times in the window area and the metal area corresponding to the main pattern area in the window area to the area of ​​the window area.

[0129] Step S314: determining whether the second metal pattern density is within the preset target metal pattern density range.

[0130] Step S315: if the second metal pattern density is within the preset target metal pattern density range, then stop executing the redundant metal filling optimization method;

[0131] The metal pattern density of the second redundant metal is greater than the metal pattern density of the first redundant metal, and the metal pattern density of the first redundant metal is greater than the metal pattern density of the redundant metal.

[0132] In this embodiment, the optimization method of filling redundant metal three times and then ending redundant metal filling is described as an example.

[0133] It is understandable that if the second metal pattern density is not within the preset target metal pattern density range, the third fillable metal area is determined and filled, and the process is repeated. Usually, filling two or three times of redundant metal can achieve that the metal pattern density of each window area is within the preset target metal pattern density range.

[0134] The redundant metal filling optimization device provided in an embodiment of the present application is introduced below. The redundant metal filling optimization device described below and the redundant metal filling optimization method described above can be referenced to each other.

[0135] Figure 7 The structural block diagram of the redundant metal filling optimization device provided in the embodiment of the present application is shown in FIG. Figure 7 Redundant metal fill optimization devices may include:

[0136] The acquisition module 100 is used to execute step S101: acquiring a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size;

[0137] The filling module 200 is used to execute step S102: fill redundant metal in the fillable metal area to obtain a filled layout;

[0138] The determination module 300 is used to execute step S103: determine the metal pattern density in each window area of ​​the filled layout;

[0139] Iteration module 400 is used to execute step S104: determine a new fillable metal area based on the metal pattern density, obtain a new to-be-filled layout, and enter step S102 until no new fillable metal area can be determined;

[0140] The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

[0141] The redundant metal filling optimization device of this embodiment is used to implement the aforementioned redundant metal filling optimization method. Therefore, the specific implementation method of the redundant metal filling optimization device can be seen in the embodiment part of the redundant metal filling optimization method in the previous text. For example, the acquisition module 100, the filling module 200, the determination module 300, and the iteration module 400 are respectively used to implement steps S101, S102, S103 and S104 in the aforementioned redundant metal filling optimization method. Therefore, its specific implementation method can refer to the description of the corresponding various parts of the embodiment, which will not be repeated here.

[0142] As an implementable method, the acquisition module 100 includes:

[0143] A determination submodule, used to determine the fillable metal area on the layout;

[0144] The division submodule is used to divide the layout to form a plurality of window areas of the same size to obtain the layout to be filled.

[0145] As an implementable method, the determination submodule includes:

[0146] A first determining unit is used to determine the main graphic area where the metal is located and the redundant graphic forbidden filling area on the layout;

[0147] The second determining unit is used to use the area on the layout other than the main graphic area and the redundant graphic forbidden filling area as the fillable metal area.

[0148] As an implementable embodiment, the iteration module includes:

[0149] A first judging unit, used to judge whether the metal pattern density is within a preset target metal pattern density range;

[0150] The third determining unit is used to determine the area on the layout other than the main graphic area, the redundant graphic prohibited filling area and the area filled with redundant metal as a new fillable metal area if the metal graphic density is not within the preset target metal graphic density range.

[0151] As an implementable embodiment, the division submodule is specifically used to divide the layout according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.

[0152] As an implementable embodiment, the iteration module 400 includes:

[0153] A second judging unit, used to judge whether the metal pattern density is within a preset target metal pattern density range;

[0154] a fourth determining unit, configured to determine a first fillable metal region if the metal pattern density is not within the preset target metal pattern density range;

[0155] A first filling unit, used for filling a first redundant metal in the first fillable metal region to obtain a first filled layout;

[0156] A fifth determining unit, configured to determine the density of the first metal pattern in each of the window regions in the first filled layout;

[0157] A third judging unit, configured to judge whether the first metal pattern density is within the preset target metal pattern density range;

[0158] a sixth determining unit, configured to determine a second fillable metal region if the first metal pattern density is not within the preset target metal pattern density range;

[0159] A second filling unit, used for filling a second redundant metal in the second fillable metal region to obtain a second filled layout;

[0160] A seventh determining unit, configured to determine the density of the second metal pattern in each of the window regions in the second filled layout;

[0161] A fourth determination unit, configured to determine whether the second metal pattern density is within the preset target metal pattern density range;

[0162] A stopping unit, configured to stop executing the redundant metal filling optimization method if the second metal pattern density is within the preset target metal pattern density range;

[0163] The metal pattern density of the second redundant metal is greater than the metal pattern density of the first redundant metal, and the metal pattern density of the first redundant metal is greater than the metal pattern density of the redundant metal.

[0164] As an implementable method, the determination module is specifically used to determine the metal pattern density in each window area of ​​the filled layout according to a first preset formula, wherein the first preset formula is:

[0165] ρ = S1 / S2;

[0166] Wherein, ρ is the metal pattern density in the window area, S1 is the total area of ​​metal in the window area, and S2 is the area of ​​the window area.

[0167] The electronic device provided in the embodiment of the present application is introduced below. The electronic device described below and the redundant metal filling optimization method described above can be referenced to each other.

[0168] Figure 8The structural block diagram of the electronic device provided in the embodiment of the present application includes:

[0169] A memory 11, used for storing computer programs;

[0170] The processor 12 is used to implement the steps of the redundant metal filling optimization method described in any of the above embodiments when executing the computer program.

[0171] The computer-readable storage medium provided in the embodiment of the present application is introduced below. The computer-readable storage medium described below and the redundant metal filling optimization method described above can be referenced to each other.

[0172] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the redundant metal filling optimization method described in any of the above embodiments are implemented.

[0173] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0174] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described in the above description according to function. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0175] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module may be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0176] The redundant metal filling optimization method, device, electronic device and computer-readable storage medium provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A redundant metal filling optimization method, characterized in that: include: Step S101: obtaining a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size; Step S102: Filling redundant metal in the fillable metal area to obtain a filled layout; Step S103: determining the metal pattern density in each window area in the filled layout; Step S104: based on the metal pattern density, determine a new fillable metal area, obtain a new to-be-filled layout, and proceed to step S102 until no new fillable metal area can be determined; The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

2. The redundant metal filling optimization method according to claim 1, characterized in that: Obtaining the layout to be filled includes: Determining the fillable metal area on the layout; The layout is divided to form a plurality of window areas of the same size to obtain the layout to be filled.

3. The redundant metal filling optimization method according to claim 2, characterized in that: Determining the fillable metal area on the layout includes: Determine the main graphic area where the metal is located and the redundant graphic forbidden filling area on the layout; The area on the layout except the main pattern area and the redundant pattern forbidden filling area is used as the fillable metal area.

4. The redundant metal filling optimization method according to claim 3, characterized in that: Based on the metal pattern density, determining a new fillable metal area includes: Determining whether the metal pattern density is within a preset target metal pattern density range; If the metal pattern density is not within the preset target metal pattern density range, an area on the layout other than the main pattern area, the redundant pattern forbidden filling area and the area filled with redundant metal is determined as a new fillable metal area.

5. The redundant metal filling optimization method according to claim 2, characterized in that: Dividing the territory includes: The layout is divided according to a grid pattern, and the grid pattern includes a plurality of rectangles or a plurality of squares.

6. The redundant metal filling optimization method according to claim 1, characterized in that: Based on the metal pattern density, a new fillable metal area is determined to obtain a new layout to be filled, and step S102 is entered until a new fillable metal area cannot be determined, including: Determining whether the metal pattern density is within a preset target metal pattern density range; If the metal pattern density is not within the preset target metal pattern density range, determining a first fillable metal region; Filling a first redundant metal in the first fillable metal region to obtain a first filled layout; Determine the density of the first metal pattern in each of the window areas in the first filled layout; Determining whether the first metal pattern density is within the preset target metal pattern density range; If the first metal pattern density is not within the preset target metal pattern density range, determining a second fillable metal region; Filling a second redundant metal in the second fillable metal region to obtain a second filled layout; Determine the density of the second metal pattern in each of the window areas in the second filled layout; Determining whether the second metal pattern density is within the preset target metal pattern density range; If the second metal pattern density is within the preset target metal pattern density range, then stop executing the redundant metal filling optimization method; The metal pattern density of the second redundant metal is greater than the metal pattern density of the first redundant metal, and the metal pattern density of the first redundant metal is greater than the metal pattern density of the redundant metal.

7. The redundant metal filling optimization method according to claim 1, characterized in that: Determining the density of metal patterns in each of the window regions in the filled layout includes: The metal pattern density in each window area of ​​the filled layout is determined according to a first preset formula, wherein the first preset formula is: ρ = S1 / S2; Wherein, ρ is the metal pattern density in the window area, S1 is the total area of ​​metal in the window area, and S2 is the area of ​​the window area.

8. A redundant metal filling optimization device, characterized in that: include: An acquisition module is used to execute step S101: acquiring a layout to be filled, wherein the layout to be filled includes a fillable metal area and a plurality of window areas of the same size; A filling module, configured to execute step S102: filling redundant metal in the fillable metal area to obtain a filled layout; A determination module, configured to execute step S103: determining the metal pattern density in each of the window regions in the filled layout; An iteration module, configured to execute step S104: determining a new fillable metal region based on the metal pattern density, obtaining a new to-be-filled layout, and entering step S102 until no new fillable metal region can be determined; The metal pattern density of the redundant metal filled each time is greater than the metal pattern density of the redundant metal filled last time.

9. An electronic device, characterized in that: include: Memory for storing computer programs; A processor, configured to implement the steps of the redundant metal filling optimization method as claimed in any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the redundant metal filling optimization method according to any one of claims 1 to 7 are implemented.

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