Top electrode assembly and semiconductor process equipment

Abstract

The embodiment of the application provides an upper electrode assembly and a semiconductor process equipment, and relates to the technical field of semiconductor processes, wherein the upper electrode assembly comprises a center electrode, an edge electrode, a first driving device and a second driving device; the edge electrode is sleeved outside the center electrode; the first driving device is drivingly connected with the center electrode to drive the center electrode to lift and lower; and the second driving device is drivingly connected with the edge electrode to drive the edge electrode to lift and lower. The upper electrode assembly has the functions of independently adjusting the distance between the center electrode and a lower electrode and the distance between the edge electrode and the lower electrode.

Description

Technical Field

[0001] This application relates to the field of semiconductor process technology, and in particular to an upper electrode assembly and semiconductor process equipment. Background Technology

[0002] Semiconductor process equipment includes a cavity, a top electrode, and a bottom electrode. During semiconductor processing, it is sometimes necessary to adjust the distance between the top and bottom electrodes to change process parameters. Related technologies generally use an adjustment bracket to elevate the entire top electrode to adjust the distance between the top and bottom electrodes. This requires preparing adjustment brackets of different heights and raising the entire top electrode. Therefore, this technology has the problem of being inconvenient for adjusting the distance between the top and bottom electrodes. Summary of the Invention

[0003] This application provides an upper electrode assembly and semiconductor process equipment to solve the problems existing in the background art.

[0004] In a first aspect, embodiments of this application provide an upper electrode assembly.

[0005] The upper electrode assembly provided in this application includes: a center electrode, an edge electrode, a first driving device, and a second driving device; the edge electrode is sleeved outside the center electrode, the first driving device is driven to the center electrode to drive the center electrode to rise and fall, and the second driving device is driven to the edge electrode to drive the edge electrode to rise and fall.

[0006] Optionally, the upper electrode assembly includes a substrate; the first driving device includes a first rotary driver and a first rotary shaft, the first rotary driver is driven to the first rotary shaft, the first rotary shaft is vertically positioned within the substrate, and the first rotary shaft is threadedly connected to the center electrode in the vertical direction.

[0007] Optionally, the first driving device further includes a first ring gear and at least two first gears, the first rotary driver is driven connected to the first ring gear, each of the first gears meshes with the first ring gear, the number of the first gears is equal to the number of the first rotating shafts, and the first gears are connected to the first rotating shafts one by one.

[0008] Optionally, the substrate includes a pressure plate and a support plate, the first ring gear is disposed on the support plate and pressed under the pressure plate; the first rotating shaft is vertically positioned between the pressure plate and the support plate.

[0009] Optionally, the top end of the first rotating shaft abuts against the pressure plate, and the first rotating shaft is provided with a first abutting surface, which abuts against the bearing plate.

[0010] Optionally, the support plate is a cooling plate.

[0011] Optionally, the first gear is provided with a first through hole, the top of the first rotating shaft passes through the first through hole, and the first gear and the first rotating shaft are connected by a first circumferential limiting member.

[0012] Optionally, the upper electrode assembly further includes an air intake structure and a central adjusting ring; the air intake structure is located vertically between the substrate and the central electrode, the air intake structure includes a spray disc, and the central adjusting ring is sleeved on the outside of the spray disc; the first rotating shaft is threadedly connected to the central adjusting ring, and the central adjusting ring is connected to the central electrode.

[0013] Optionally, the central adjusting ring has a first protrusion on the side near the first rotating shaft, and the first rotating shaft is threadedly connected to the first protrusion.

[0014] Optionally, the first rotating shaft passes through the air intake structure; the upper electrode assembly further includes a first telescopic sleeve, which is sleeved outside the first rotating shaft, with one end of the first telescopic sleeve connected to the central adjusting ring and the other end connected to the air intake structure.

[0015] Optionally, the second driving device includes a second rotary driver, a second rotary shaft, a second ring gear, and at least two second gears. The second rotary driver is driven to the second ring gear, each of the second gears meshes with the second ring gear, and the second gears are connected to the second rotary shaft in a one-to-one correspondence. The second rotary shaft is vertically positioned on the base and is threadedly connected to the edge electrode in a vertical direction.

[0016] Optionally, the second ring gear is disposed on the bearing plate and pressed under the pressure plate, and the second ring gear is sleeved outside the first ring gear.

[0017] Secondly, embodiments of this application provide a semiconductor process apparatus.

[0018] The semiconductor process equipment provided in this application includes any of the upper electrode components provided in this application.

[0019] Optionally, the semiconductor process equipment further includes a cavity, a cavity cover, and a lower electrode; the cavity cover is disposed on the cavity, the upper electrode assembly is disposed on the cavity cover, and the center electrode, the edge electrode, and the lower electrode are all disposed in the cavity, with the lower electrode opposite to the center electrode.

[0020] Optionally, the cavity cover has a through hole, the support plate of the upper electrode assembly is supported on the cavity cover, and the support plate seals the through hole. The air intake structure of the upper electrode assembly is disposed opposite to the support plate on both sides of the cavity cover.

[0021] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects:

[0022] In the embodiments of this application, since the first driving device is driven and connected to the center electrode, the center electrode can be driven to rise and fall using the first driving device to adjust the distance between the center electrode and the lower electrode. Since the second driving device is driven and connected to the edge electrode, the edge electrode can be driven to rise and fall using the second driving device to adjust the distance between the edge electrode and the lower electrode. Furthermore, the first and second driving devices can be used to achieve the effect of adjusting the distance between the center electrode and the lower electrode, and the distance between the edge electrode and the lower electrode, according to different requirements, so that the process parameters of the semiconductor process equipment equipped with the upper electrode assembly can be better matched with the process requirements. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of an upper electrode assembly provided in an embodiment of this application;

[0025] Figure 2 for Figure 1 A partial schematic diagram of the upper electrode assembly is shown in the figure;

[0026] Figure 3 for Figure 1 A partial schematic diagram of the upper electrode assembly is shown in the figure;

[0027] Figure 4 for Figure 1 The top view of the upper electrode assembly shown in the figure;

[0028] Figure 5 for Figure 1The top view of the upper electrode assembly shown in the image shows the case where the pressure plate is hidden;

[0029] Figure 6 This is a schematic diagram of a semiconductor process equipment provided in an embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10 - Semiconductor process equipment; 100 - Upper electrode assembly; 110 - Center electrode; 120 - Edge electrode; 130 - First drive device; 131 - First rotary actuator; 132 - First rotating shaft; 133 - First ring gear; 134 - First gear; 135 - First circumferential limiting member; 140 - Second drive device; 141 - Second rotary actuator; 142 - Second rotating shaft; 143 - Second ring gear; 144 - Second gear ; 145-Second circumferential limiting component; 150-Base; 151-Pressure plate; 152-Bearing plate; 160-Inlet structure; 161-Spray plate; 162-Inlet plate; 171-Center adjusting ring; 1711-First protrusion; 172-Edge adjusting ring; 1721-Second protrusion; 181-First telescopic sleeve; 182-Second telescopic sleeve; 210-Cavity; 220-Cavity cover; 300-Lower electrode; 400-Plasma confinement ring. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] Furthermore, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application specification may have been selected by the applicant at his or her own discretion, and their detailed meanings are explained in the relevant sections of this description.

[0035] Furthermore, this application is required to be understood not only through the actual terms used, but also through the meaning implied by each term.

[0036] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0037] This application provides an upper electrode assembly. (See reference...) Figures 1 to 6 The upper electrode assembly 100 provided in this application embodiment includes: a center electrode 110, an edge electrode 120, a first driving device 130, and a second driving device 140.

[0038] An edge electrode 120 is sleeved outside the center electrode 110. A first driving device 130 is driven by the center electrode 110 to drive the center electrode 110 to rise and fall. A second driving device 140 is driven by the edge electrode 120 to drive the edge electrode 120 to rise and fall. It should be noted that the center electrode 110 and the edge electrode 120 can be configured with reference to the upper electrode in related technologies. In other words, the center electrode 110 and the edge electrode 120 are equivalent to the upper electrode in related technologies, obtained by "segmenting" the upper electrode.

[0039] In this manner, in the embodiments of this application, since the first driving device 130 is driven to connect with the center electrode 110, the center electrode 110 can be driven to rise and fall using the first driving device 130 to adjust the distance between the center electrode 110 and the lower electrode 300. Since the second driving device 140 is driven to connect with the edge electrode 120, the edge electrode 120 can be driven to rise and fall using the second driving device 140 to adjust the distance between the edge electrode 120 and the lower electrode 300. Furthermore, the first driving device 130 and the second driving device 140 can be used to achieve differentiated adjustment of the distance between the center electrode 110 and the lower electrode 300, and the distance between the edge electrode 120 and the lower electrode 300, according to requirements, so that the process parameters of the semiconductor process equipment 10 equipped with the upper electrode assembly 100 can be better matched with process requirements.

[0040] refer to Figure 1In some embodiments, the upper electrode assembly 100 includes a base 150. The first driving device 130 includes a first rotary driver 131 and a first rotary shaft 132. The first rotary driver 131 is drivenly connected to the first rotary shaft 132, which is vertically positioned within the base 150 and threadedly connected to the center electrode 110. It should be noted that the first rotary shaft 132 can be directly threaded to the center electrode 110. Alternatively, the first rotary shaft 132 can be indirectly threaded to the center electrode 110 via a transition structure. For example, the center electrode 110 may have a transition plate, and the first rotary shaft 132 is threadedly connected to the transition plate, so that the rotating first rotary shaft 132 drives the transition plate to move the center electrode 110 up and down.

[0041] For example, the first rotary actuator 131 can be a rotary motor, a pneumatic motor, or a hydraulic motor, etc. For example, the first rotary actuator 131 can be directly connected to the first rotating shaft 132 to drive the first rotating shaft 132 to rotate. For example, the first rotary actuator 131 can be driven to rotate the first rotating shaft 132 via a gear transmission mechanism. Thus, during the process of the first rotary actuator 131 driving the first rotating shaft 132 to rotate, the center electrode 110, which is threadedly connected to the first rotating shaft 132, can move along the axial direction of the first rotating shaft 132. Therefore, the effect of using the first rotary actuator 131 to drive the center electrode 110 to rise and fall can be achieved.

[0042] refer to Figure 5 In some embodiments, the first drive device 130 further includes a first ring gear 133 and at least two first gears 134. A first rotary driver 131 is driven to the first ring gear 133. Exemplarily, the first power output shaft of the first rotary driver 131 may be driven to the first transmission gear, which may mesh with the first ring gear 133, thereby allowing the first rotary driver 131 to drive the first ring gear 133 to rotate.

[0043] Furthermore, each of the first gears 134 meshes with a first ring gear 133, and the number of first gears 134 is equal to the number of first rotating shafts 132. Each of the first gears 134 is connected to a first rotating shaft 132 in a one-to-one correspondence. In this way, during the process of the first rotating driver 131 driving the first ring gear 133 to rotate, the rotating first ring gear 133 can drive the first rotating shaft 132 connected to the first gear 134 to rotate synchronously, thereby driving the center electrode 110 threadedly connected to the first rotating shaft 132 to rise and fall, so as to adjust the distance between the center electrode 110 and the lower electrode 300.

[0044] refer to Figure 2 and Figure 3In some embodiments, the base 150 includes a pressure plate 151 and a support plate 152. A first ring gear 133 is disposed on the support plate 152 and pressed down on the pressure plate 151. In other words, the first ring gear 133 is sandwiched between the support plate 152 and the pressure plate 151 in a vertical direction. Exemplarily, the support plate 152 can be a cooling plate. For example, the support plate 152 can be a water-cooled plate. The first ring gear 133 can be supported on the cooling plate and pressed down on the pressure plate 151.

[0045] refer to Figures 2 to 5 In some embodiments, the first rotating shaft 132 is vertically positioned between the pressure plate 151 and the support plate 152. Exemplarily, the first rotating shaft 132 can be vertically positioned between the pressure plate 151 by having its top end abut against the pressure plate 151, the first rotating shaft 132 having a first abutment surface supported by the support plate 152. Exemplarily, the first rotating shaft 132 connected to the first gear 134 can be vertically positioned between the pressure plate 151 and the support plate 152 by clamping the first gear 134 between the pressure plate 151 and the support plate 152.

[0046] refer to Figure 3 In some embodiments, the first gear 134 has a first through hole, and the top of the first rotating shaft 132 passes through the first through hole. The first gear 134 and the first rotating shaft 132 are connected by a first circumferential limiting member 135. Exemplarily, the first circumferential limiting member 135 may include components such as a pin or a key. Thus, by connecting the first gear 134 and the first rotating shaft 132 through the first circumferential limiting member 135, the first gear 134 and the first rotating shaft 132 can rotate synchronously.

[0047] refer to Figure 1 and Figure 2 In some embodiments, the upper electrode assembly 100 further includes an air intake structure 160 and a central adjustment ring 171. The air intake structure 160 is located vertically between the base 150 and the central electrode 110, and includes a spray plate 161. It should be noted that the air intake structure 160 can supply process gas to the spray plate 161. The central electrode 110 and the edge electrode 120 are provided with multiple small holes so that the process gas output from the spray plate 161 can be transported to the process chamber through the central electrode 110 and the edge electrode 120. It should also be noted that the specific construction of the air intake structure 160, and how to provide small holes on the central electrode 110 and the edge electrode 120 for other process gases to pass through, can be found in relevant technologies, and therefore will not be described in detail here.

[0048] refer to Figure 1 and Figure 2A central adjusting ring 171 is sleeved on the outside of the spray plate 161. A first rotating shaft 132 is threadedly connected to the central adjusting ring 171, and the central adjusting ring 171 is connected to the central electrode 110. In other words, the first rotating shaft 132 is indirectly threadedly connected to the central electrode 110 through the central adjusting ring 171, so that the rotating first rotating shaft 132 drives the central adjusting ring 171 to rise and fall, thereby driving the central electrode 110 connected to the central adjusting ring 171 to rise and fall.

[0049] refer to Figure 2 In some embodiments, a first protrusion 1711 is provided on the side of the central adjusting ring 171 near the first rotating shaft 132, and the first rotating shaft 132 is threadedly connected to the first protrusion 1711. In this way, by providing the first protrusion 1711 on the side of the central adjusting ring 171 near the first rotating shaft 132, the thread height of the threaded connection between the central adjusting ring 171 and the first rotating shaft 132 is increased, thereby improving the lifting range of the central electrode 110.

[0050] refer to Figure 2 In some embodiments, a first rotating shaft 132 passes through an air intake structure 160. Exemplarily, the air intake structure 160 includes an air intake disk 162 for supplying process gas to a spray disk 161. The air intake disk 162 has a through hole through which the first rotating shaft 132 passes.

[0051] In some embodiments, the upper electrode assembly 100 further includes a first telescopic sleeve 181. Exemplarily, the first telescopic sleeve 181 may be a first bellows. The first telescopic sleeve 181 is sleeved around the first rotating shaft 132, with one end connected to the central adjusting ring 171 and the other end connected to the air intake structure 160. Exemplarily, the end of the first telescopic sleeve 181 near the air intake structure 160 may be connected to the air intake disc 162. Thus, the first telescopic sleeve 181 can be used to seal the end of the first rotating shaft 132.

[0052] For example, the number of first gears 134 can be 2, 3, 4, etc. Of course, in some embodiments, when there is only one first gear 134 and one first rotating shaft 132, the center electrode 110 threadedly connected to the first rotating shaft 132 can be driven to rise and fall by driving the first rotating shaft 132 to adjust the distance between the center electrode 110 and the lower electrode 300.

[0053] It should be noted that in other embodiments, the first driving device 130 may also be a first linear actuator. Exemplarily, the first linear actuator may be a device capable of outputting linear driving force, such as a linear motor, a pneumatic cylinder, or a hydraulic cylinder. Exemplarily, the first linear actuator may also include: a device capable of outputting rotational driving force, such as a rotary motor, a pneumatic motor, or a hydraulic motor, and a transmission mechanism capable of converting rotational motion into linear motion, such as a rack and pinion mechanism.

[0054] refer to Figure 5 In some embodiments, the second driving device 140 includes a second rotary driver 141 and a second rotary shaft 142. The second rotary driver 141 is drivenly connected to the second rotary shaft 142. The second rotary shaft 142 is vertically positioned on the base 150 and is threadedly connected to the edge electrode 120 in the vertical direction.

[0055] For example, the second rotary actuator 141 can be a rotary motor, a pneumatic motor, or a hydraulic motor, etc. For example, the second rotary actuator 141 can be directly connected to the second rotary shaft 142 to drive the second rotary shaft 142 to rotate. For example, the second rotary actuator 141 can be driven to rotate the second rotary shaft 142 via a gear transmission mechanism. Furthermore, during the process of the second rotary actuator 141 driving the second rotary shaft 142 to rotate, the edge electrode 120, which is threadedly connected to the second rotary shaft 142, can move along the axial direction of the second rotary shaft 142. Thus, the effect of using the second rotary actuator 141 to drive the edge electrode 120 to lift and lower can be achieved.

[0056] Furthermore, the second drive device 140 may further include a second ring gear 143 and at least two second gears 144. The second rotary driver 141 is drivenly connected to the second ring gear 143. Exemplarily, the second power output shaft of the second rotary driver 141 may be drivenly connected to a second transmission gear, which may mesh with the second ring gear 143, thereby driving the second ring gear 143 to rotate using the second rotary driver 141. Each second gear 144 meshes with the second ring gear 143, and each second gear 144 is connected to the second rotating shaft 142 in a one-to-one correspondence. Therefore, the second rotary driver 141 can drive the second rotating shaft 142 to rotate.

[0057] In some embodiments, when the upper electrode assembly 100 includes a base 150, and the base 150 includes a pressure plate 151 and a support plate 152, the second ring gear 143 may be disposed on the support plate 152 and pressed under the pressure plate 151, and the second ring gear 143 is sleeved outside the first ring gear 133. In other words, the second ring gear 143 is sleeved outside the first ring gear 133, and the second ring gear 143 is clamped between the support plate 152 and the pressure plate 151 in a vertical direction. Exemplarily, the support plate 152 may be a cooling plate. For example, the support plate 152 may be a water-cooled plate. The second ring gear 143 may be supported on the cooling plate and pressed under the pressure plate 151.

[0058] refer to Figures 2 to 5 In some embodiments, the second rotating shaft 142 is vertically positioned between the pressure plate 151 and the support plate 152. Exemplarily, the second rotating shaft 142 can be vertically positioned between the pressure plate 151 by having its top end abut against the pressure plate 151, the second rotating shaft 142 having a second abutment surface that supports the support plate 152. Exemplarily, the second rotating shaft 142 connected to the second gear 144 can be vertically positioned between the pressure plate 151 and the support plate 152 by clamping the second gear 144 between the pressure plate 151 and the support plate 152.

[0059] refer to Figure 3 In some embodiments, the second gear 144 has a second through hole, through which the top of the second rotating shaft 142 passes. The second gear 144 and the second rotating shaft 142 are connected by a second circumferential limiting member 145. Exemplarily, the second circumferential limiting member 145 may include a pin or a key. Thus, by connecting the second gear 144 and the second rotating shaft 142 via the second circumferential limiting member 145, the second gear 144 and the second rotating shaft 142 can rotate synchronously.

[0060] refer to Figure 2 In some embodiments, the upper electrode assembly 100 includes an air intake structure 160, a central adjustment ring 171, and an edge adjustment ring 172. The air intake structure 160 is located vertically between the substrate 150 and the central electrode 110, and includes a spray disk 161. The central adjustment ring 171 is sleeved outside the spray disk 161, and the edge adjustment ring 172 is sleeved outside the central adjustment ring 171.

[0061] The second rotating shaft 142 is threadedly connected to the edge adjusting ring 172, which is connected to the edge electrode 120. In other words, the second rotating shaft 142 is indirectly threadedly connected to the edge electrode 120 through the edge adjusting ring 172, so that the rotating second rotating shaft 142 drives the edge adjusting ring 172 to rise and fall, thereby driving the edge electrode 120 connected to the edge adjusting ring 172 to rise and fall.

[0062] refer to Figure 2 In some embodiments, a second protrusion 1721 is provided on the side of the edge adjusting ring 172 near the second rotating shaft 142, and the second rotating shaft 142 is threadedly connected to the second protrusion 1721. In this way, by providing the second protrusion 1721 on the side of the edge adjusting ring 172 near the second rotating shaft 142, the thread height of the threaded connection between the edge adjusting ring 172 and the second rotating shaft 142 is increased, thereby improving the lifting range of the edge electrode 120.

[0063] refer to Figure 2 In some embodiments, the second rotating shaft 142 passes through the air intake structure 160. Exemplarily, the air intake structure 160 includes an air intake disk 162 for supplying process gas to the spray disk 161. The air intake disk 162 has a through hole, through which the second rotating shaft 142 passes.

[0064] In some embodiments, the upper electrode assembly 100 further includes a second telescopic sleeve 182. Exemplarily, the second telescopic sleeve 182 may be a second bellows. The second telescopic sleeve 182 is sleeved around the second rotating shaft 142, with one end connected to the edge adjusting ring 172 and the other end connected to the air intake structure 160. Exemplarily, the end of the second telescopic sleeve 182 near the air intake structure 160 may be connected to the air intake disc 162. Thus, the end of the second rotating shaft 142 can be sealed using the second telescopic sleeve 182.

[0065] For example, the number of second gears 144 can be 2, 3, 4, etc. Of course, in some embodiments, when there is only one second gear 144 and one second rotating shaft 142, the edge electrode 120 threadedly connected to the second rotating shaft 142 can be driven to rise and fall by driving the second rotating shaft 142 to adjust the distance between the edge electrode 120 and the lower electrode 300.

[0066] It should be noted that in other embodiments, the second driving device 140 may also be a second linear actuator. Exemplarily, the second linear actuator may be a device capable of outputting linear driving force, such as a linear motor, a pneumatic cylinder, or a hydraulic cylinder. Exemplarily, the second linear actuator may also include: a device capable of outputting rotational driving force, such as a rotary motor, a pneumatic motor, or a hydraulic motor, and a transmission mechanism capable of converting rotational motion into linear motion, such as a rack and pinion mechanism.

[0067] In some embodiments, the first rotating shaft 132, the first gear 134, or the first ring gear 133 is provided with a first scale indicator, and the base 150 is provided with a corresponding first scale line. This allows the rotation angle of the first rotating shaft 132 to be determined based on the first scale indicator and the first scale line, thereby determining the lifting amount of the center electrode 110. The second rotating shaft 142, the second gear 144, or the second ring gear 143 is provided with a second scale indicator, and the base 150 is provided with a corresponding second scale line. This allows the rotation angle of the second rotating shaft 142 to be determined based on the second scale indicator and the second scale line, thereby determining the lifting amount of the edge electrode 120.

[0068] This application provides a semiconductor process apparatus. (See reference...) Figure 6 The semiconductor process equipment 10 provided in this application embodiment includes any of the upper electrode components 100 provided in this application embodiment.

[0069] In some embodiments, the semiconductor process apparatus 10 further includes a cavity 210, a cavity cover 220, and a lower electrode 300. The cavity cover 220 covers the cavity 210, and the upper electrode assembly 100 is disposed on the cavity cover 220. The center electrode 110, the edge electrode 120, and the lower electrode 300 are all disposed within the cavity 210. The lower electrode 300 is opposite to the center electrode 110.

[0070] In some embodiments, the cavity cover 220 is provided with a through hole, the support plate 152 of the upper electrode assembly 100 is supported on the cavity cover 220, and the support plate 152 covers the through hole. The air intake structure 160 of the upper electrode assembly 100 is disposed opposite to the support plate 152 on both sides of the cavity cover 220.

[0071] In some embodiments, the semiconductor process apparatus 10 further includes a plasma confinement ring 400. The plasma confinement ring 400 is disposed around the edge electrode 120.

[0072] In this manner, in the embodiments of this application, the center electrode 110 and the edge electrode 120 of the upper electrode assembly 100 of the semiconductor process equipment 10 can be driven to rise and fall by the first driving device 130 and the second driving device 140, respectively, so as to facilitate the differential adjustment of the distance between the center electrode 110 and the lower electrode 300 and the distance between the edge electrode 120 and the lower electrode 300 according to the requirements, so that the process parameters of the semiconductor process equipment 10 equipped with the upper electrode assembly 100 can be better matched with the process requirements.

[0073] It should also be noted that when the semiconductor process equipment 10 is a dielectric etching equipment, for example, during the dielectric etching process, it is often necessary to use the edge electrode 120 to confine the plasma. Therefore, the edge electrode 120 can be driven to move towards the lower electrode 300. During the wafer transfer process, both the center electrode 110 and the edge electrode 120 can be raised to their initial positions to achieve wafer transfer. After the dielectric etching equipment has been running for a certain process time, the center electrode 110 and the edge electrode 120 will be consumed to different degrees. A correspondence between the consumption of the center electrode 110 and the edge electrode 120 and the process time can be established, so that after a certain period of time, the center electrode 110 and the edge electrode 120 can move a preset distance towards the lower electrode 300 respectively.

[0074] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0075] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A top electrode assembly (100) characterized by, include: Center electrode (110), edge electrode (120), first drive device (130), second drive device (140), base (150), air intake structure (160), center adjustment ring (171), edge adjustment ring (172), first telescopic sleeve (181) and second telescopic sleeve (182); The edge electrode (120) is sleeved outside the center electrode (110). The first driving device (130) is driven to connect with the center electrode (110) to drive the center electrode (110) to rise and fall. The second driving device (140) is driven to connect with the edge electrode (120) to drive the edge electrode (120) to rise and fall. The first driving device (130) includes a first rotary driver (131) and a first rotating shaft (132). The first rotary driver (131) is driven to connect with the first rotating shaft (132), and the first rotating shaft (132) is limited to the base (150) in the vertical direction. The second driving device (140) includes a second rotary driver (141) and a second rotary shaft (142), the second rotary driver (141) being drivenly connected to the second rotary shaft (142), and the second rotary shaft (142) being limited in the vertical direction to the base (150). The intake structure (160) is located vertically between the base (150) and the central electrode (110); The first rotating shaft (132) is threadedly connected to the central adjusting ring (171), the central electrode (110) is connected to the side of the central adjusting ring (171) away from the base (150), the first telescopic sleeve (181) is sleeved outside the first rotating shaft (132), one end of the first telescopic sleeve (181) is connected to the central adjusting ring (171), and the other end is connected to the air intake structure (160); The second rotating shaft (142) is threadedly connected to the edge adjusting ring (172), the edge electrode (120) is connected to the side of the edge adjusting ring (172) away from the base (150), the second telescopic sleeve (182) is sleeved on the outside of the second rotating shaft (142), one end of the second telescopic sleeve (182) is connected to the edge adjusting ring (172), and the other end is connected to the air intake structure (160).

2. The upper electrode assembly (100) according to claim 1, characterized in that The first driving device (130) further includes a first ring gear (133) and at least two first gears (134). The first rotary driver (131) is driven to connect with the first ring gear (133). Each of the first gears (134) meshes with the first ring gear (133). The number of the first gears (134) is equal to the number of the first rotating shafts (132). The first gears (134) are connected to the first rotating shafts (132) one by one.

3. The upper electrode assembly (100) according to claim 2, characterized in that The base (150) includes a pressure plate (151) and a support plate (152). The first ring gear (133) is disposed on the support plate (152) and pressed under the pressure plate (151). The first rotating shaft (132) is located vertically between the pressure plate (151) and the support plate (152).

4. The upper electrode assembly (100) according to claim 3, characterized in that The top end of the first rotating shaft (132) abuts against the pressure plate (151), and the first rotating shaft (132) is provided with a first abutting surface, which abuts against the bearing plate (152).

5. The upper electrode assembly (100) of claim 3, wherein The support plate (152) is a cooling plate.

6. The upper electrode assembly (100) of claim 2, wherein The first gear (134) is provided with a first through hole, and the top of the first rotating shaft (132) passes through the first through hole. The first gear (134) and the first rotating shaft (132) are connected by a first circumferential limiting member (135).

7. The upper electrode assembly (100) of claim 1, wherein The air intake structure (160) includes a spray disc (161), and the central adjustment ring (171) is sleeved on the outside of the spray disc (161).

8. The upper electrode assembly (100) of claim 7, wherein The central adjusting ring (171) has a first protrusion (1711) on the side near the first rotating shaft (132), and the first rotating shaft (132) is threadedly connected to the first protrusion (1711).

9. The upper electrode assembly (100) of claim 1, wherein The first rotating shaft (132) passes through the air intake structure (160).

10. The upper electrode assembly (100) according to claim 3, characterized in that, The second drive device (140) further includes a second ring gear (143) and at least two second gears (144). The second rotary driver (141) is driven to connect with the second ring gear (143). Each of the second gears (144) meshes with the second ring gear (143). The second gears (144) are connected to the second rotating shaft (142) in a one-to-one correspondence.

11. The upper electrode assembly (100) of claim 10, wherein The second ring gear (143) is disposed on the bearing plate (152) and pressed under the pressure plate (151), and the second ring gear (143) is sleeved outside the first ring gear (133).

12. A semiconductor process apparatus characterized by comprising: Includes the upper electrode assembly (100) as described in any one of claims 1 to 11.

13. The semiconductor process apparatus according to claim 12, wherein The semiconductor process equipment also includes a cavity (210), a cavity cover (220), and a lower electrode (300). The cavity cover (220) is placed over the cavity (210), the upper electrode assembly (100) is disposed on the cavity cover (220), the center electrode (110), the edge electrode (120) and the lower electrode (300) are all disposed inside the cavity (210), and the lower electrode (300) is opposite to the center electrode (110).

14. The semiconductor process apparatus according to claim 13, wherein The cavity cover (220) is provided with a through hole. The support plate (152) of the upper electrode assembly (100) is supported on the cavity cover (220) and the support plate (152) covers the through hole. The air intake structure (160) of the upper electrode assembly (100) is disposed opposite to the support plate (152) on both sides of the cavity cover (220).

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