12-inch wafer full-automatic visual inspection machine

Abstract

The invention discloses a full-automatic visual inspection machine for a 12-inch wafer. The full-automatic visual inspection machine comprises a rack, a calibration device; a detection device; provided is a transfer manipulator. On one hand, the wafer carrying frame and / or the rotating mechanism are / is arranged on the adjusting seat in a front-back sliding mode, and the wafer is driven by the first power piece and the second power piece to conduct front-back overturning and left-right deflection adjustment, so that it is ensured that the wafer can be located in a proper visual inspection interval at any angle, observation of a visual inspector is facilitated, and the visual inspection efficiency is improved. The accuracy of a detection result is improved; and on the other hand, continuous and automatic feeding and discharging, edge searching calibration and visual inspection of the wafers are achieved, the wafer loading precision is greatly improved, meanwhile, the automation degree is high, and the visual inspection efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor equipment, and in particular relates to a 12-inch wafer fully automatic visual inspection machine. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. It is a silicon wafer formed by grinding, polishing, and slicing silicon crystal rods. In fact, the wafers produced by enterprises are not purely round, but have uniform notches or edges to facilitate the positioning of the wafer by the equipment. Only in this way can the direction be better determined when the CPU core is made and cut. Therefore, when the wafer is processed, it is necessary to detect microscopic particles, scratches, pollution, etc. on the wafer. Therefore, manual visual inspection machines have appeared on the market.

[0003] At present, the inspection system of the manual visual inspection machine mainly includes a wafer carrier and an online visual inspection mechanism, wherein the wafer is loaded on the wafer carrier, and the online visual inspection mechanism mainly includes a strong light that can illuminate the surface of the wafer. When inspecting, the light from the strong light is illuminated on the surface of the wafer to observe particles, scratches, contamination, etc. on the surface of the wafer.

[0004] However, in the actual detection process, the existing technology has the following technical defects:

[0005] 1. The wafer carrier or wafer needs to be rotated online in real time to perform inspection at different angles. However, during the rotation, the position of each inspection area on the wafer relative to the visual inspection window changes (for example, it is far away from the visual inspection window after flipping), and the light beam is easily disturbed by the clamping structure on the wafer carrier at different angles, which makes it inconvenient for the visual inspector to perform inspection at the visual inspection window, affecting the accuracy of the final inspection result.

[0006] 2. Traditional visual inspection machines cannot accurately control the direction of the wafer notch during visual inspection, and there is a high probability that the clamping mechanism will be clamped at the wafer notch position, which can easily cause damage to the wafer. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide an improved wafer inspection device for a 12-inch wafer fully automatic visual inspection machine.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A 12-inch wafer fully automatic visual inspection machine, comprising:

[0010] The frame has a feeding area, a calibration area and a visual inspection area which are sequentially connected from the back to the front, wherein a visual inspection window is provided at the front side of the visual inspection area;

[0011] A feeding device, which is arranged in the feeding area and is used to supply wafers;

[0012] A calibration device, which is arranged in the calibration area and is used for edge-finding calibration of the wafer;

[0013] A detection device is arranged in a visual inspection area and comprises a wafer carrier for loading wafers, a rotating mechanism for driving the wafer carrier to rotate, an irradiation mechanism and an adjustment mechanism, wherein the irradiation mechanism comprises a light source that can be moved and arranged along the front-back direction; the adjustment mechanism comprises an adjustment seat and a power device, wherein the wafer carrier and / or the rotating mechanism can be relatively slidably arranged on the adjustment seat along the front-back direction; the power device comprises a first power member and a second power member, wherein the first power member is used to drive the wafer carrier and / or the rotating mechanism to slide forward and backward relative to the adjustment seat and drive the wafer to flip forward and backward, and the second power member drives the adjustment seat to rotate around a vertical center line and drives the wafer to deflect left and right, and the wafer keeps the part to be detected in the irradiation area formed by the light source at any angle;

[0014] The transfer robot is used to transfer wafers between the feeding area, the calibration area and the visual inspection area.

[0015] According to a specific implementation and preferred aspect of the present invention, the transfer robot comprises a robot arm, a robot finger arranged at the movable end of the robot arm, wherein the robot finger comprises a finger body with an abutment portion formed at one end, and a clamping block movably arranged on the finger body away from the abutment portion, when taking the material, the wafer abuts against the abutment portion from the edge, and the clamping block clamps the wafer along the wafer radial direction. Here, the wafer abutment positioning is implemented first, and then clamping is implemented, and the clamping is accurate and efficient.

[0016] Preferably, a grid-supporting surface is formed on the inner side of the abutting portion, and the grid-supporting surface is arranged to fit the edge contour of the wafer; and / or, there are at least two abutting portions, and the clamping blocks correspond to the abutting portions one by one, and the clamping force formed is directed toward the corresponding abutting portions; and / or, the robot arm and the robot finger constitute a transfer group, and the transfer group has at least two and is arranged up and down. Here, the transfer operation of multiple wafers can be carried out simultaneously.

[0017] According to another specific implementation and preferred aspect of the present invention, the calibration device includes a calibrator, a material receiving rack forming a material receiving area, and a rotating lifting bracket forming a positioning area that matches the material receiving area, wherein the rotating lifting bracket can respectively move up and down and rotate around a vertical center line, and the transfer robot places the wafer in the material receiving area, and the rotating lifting bracket moves the wafer between the material receiving area and the positioning area during the lifting movement, and drives the wafer located in the positioning area to rotate during the rotational movement to complete the calibration. Here, through the cooperation of the material receiving rack and the rotating lifting bracket, when calibrating, the robot first places the wafer on the material receiving rack, and then the movement of the rotating lifting bracket transfers the wafer from the material receiving area to the positioning area for positioning, and then performs edge-finding calibration, thereby improving the calibration accuracy.

[0018] Preferably, the receiving rack includes a rack body, a plurality of receiving modules arranged on the rack body and distributed around the wafer, wherein each receiving module forms a receiving surface extending from the outside to the inside and tilted downward, and a receiving area is formed between the plurality of receiving surfaces, and when receiving the material, the wafer contacts the receiving surface from the edge; and / or, the rotating lifting rack includes a lifting rack seat, a rotating rack plate arranged on the lifting rack seat, and a plurality of supporting rack rods connected to the rotating rack plate at one end and distributed around the wafer, wherein a positioning module is provided at the other end of each supporting rack rod, and a positioning area is formed between the plurality of positioning modules; each supporting rack rod can be extended and retracted along the radial direction of the wafer, and each positioning module is formed with a first surface extending vertically, and a second surface extending inwardly and tilted downward from the bottom edge of the first surface, and the wafer contacts the first surface from the side and supports the second surface from the bottom edge. Here, the wafer is automatically and gradually positioned by the extension and retraction of the supporting rack rod and the cooperation of the first and second surfaces. It should be particularly noted that when the wafer is positioned, the center line of the wafer coincides with the center line of the positioning area.

[0019] According to a specific implementation and preferred aspect of the present invention, a guide rail extending forward and backward is formed on the adjustment seat, the rotating mechanism is slidably connected to the guide rail, and the wafer carrier is connected to the top of the rotating mechanism and moves synchronously with the rotating mechanism.

[0020] Preferably, the guide rail is in a downwardly arched arc shape, and as the rotating mechanism slides forward and backward along the guide rail, the wafer carrier is synchronously flipped forward or backward around the center of the circle corresponding to the guide rail. Here, the wafer carrier is flipped forward or backward to achieve a tilted state to ensure that the light beam is irradiated on the part to be tested on the wafer, which is convenient for the visual inspector to observe.

[0021] Specifically, the angle range of the wafer carrier flipping forward and backward is 0° to 60°. It should be particularly noted that in some specific embodiments, the two ends of the arc-shaped guide rail are the lowest point and the highest point respectively, and when the rotating mechanism flips to the lowest point of the arc-shaped guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 0°, and when the rotating mechanism flips to the highest end of the arc-shaped guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 60°.

[0022] Preferably, the adjustment seat comprises a bottom plate, two side plates fixedly mounted on the bottom plate and spaced side by side, wherein the top surface of each side plate is an arc surface matching the guide rail, and a guide rail is fixedly mounted on the inner wall or outer wall of each side plate, thereby avoiding interference with the movement of the flip structure.

[0023] Preferably, the first power member includes a power screw extending forward and backward, a movable seat sleeved on the power screw and moving forward and backward along the power screw, and a transmission rod, wherein the transmission rod is rotatably connected to the movable seat and the rotating mechanism at both ends.

[0024] Preferably, the rotating mechanism includes a connecting seat connected to the guide rail, a first driving member for driving the wafer carrier to rotate radially around the wafer, and a second driving member for driving the wafer carrier to rotate around a vertical center line, wherein the rotation axis of the first driving member is arranged to intersect with the rotation axis of the second driving member.

[0025] Preferably, the second driving member comprises a motor fixedly arranged on the connecting seat, and a rotating disk connected to the output shaft of the motor, and the first driving member is arranged on the rotating disk. The structure is simple and easy to install and implement.

[0026] Preferably, the rotation axis of the second power member coincides with the rotation axis of the second driving member.

[0027] In addition, the irradiation mechanism also includes a track extending horizontally forward and backward, and the light source includes a lamp holder slidably connected to the track, a flip seat connected to the lamp holder by rotating around a center line extending in the forward and backward directions, and a strong light lamp arranged on the flip seat. Here, the irradiation area of ​​the strong light lamp can be adjusted up and down to flexibly match wafers at any angle.

[0028] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0029] The existing technology requires online real-time rotation of the wafer carrier or the wafer to implement inspection at different angles. However, during rotation, the position of each inspection area on the wafer changes relative to the visual inspection window (for example, it moves away from the visual inspection window after being flipped), and at different angles, it is easy to be affected by the clamping structure on the wafer carrier and cause interference to the light beam, making it inconvenient for visual inspectors to perform inspections at the visual inspection window, affecting the accuracy of the final inspection results. Moreover, during visual inspection, traditional visual inspection machines cannot accurately control the direction of the wafer notch, and there is a high probability that the clamping mechanism is clamped at the wafer notch position, which can easily cause damage to the wafer. The present application carries out an overall design of the structure of the 12-inch wafer fully automatic visual inspection machine, which ingeniously solves the shortcomings and defects of the prior art. After adopting the 12-inch wafer fully automatic visual inspection machine, the transfer robot first takes out the wafer to be inspected from the feeding area, and transfers it to the calibration device for edge calibration; then the transfer robot transfers the calibrated wafer to the visual inspection area and loads it onto the wafer carrier, and drives the wafer carrier to rotate through the rotating mechanism to obtain the required inspection angle, and then, according to the state of the wafer at the current angle, the visual inspector uses the first power member to make the wafer carrier and / or the rotating mechanism slide on the adjustment seat and drive the wafer to flip back and forth, and drives the second power member to make the adjustment seat rotate around the vertical direction and drive the wafer to deflect left and right, so that the wafer is in a suitable visual inspection range and ensures that the part to be inspected of the wafer is in the irradiation area formed by the light source. Therefore, compared with the prior art, the present invention, on the one hand, is based on the wafer carrier and / or rotating mechanism being slid forward and backward on the adjustment seat, and driven by the first power member and the second power member, the wafer is flipped forward and backward and adjusted left and right, thereby ensuring that the wafer can be in a suitable visual inspection range at any angle, facilitating the observation of the visual inspector and improving the accuracy of the inspection results; on the other hand, it realizes continuous and automatic loading and unloading, edge calibration and visual inspection of the wafer, which not only greatly improves the loading accuracy of the wafer, but also has a high degree of automation, greatly improving the visual inspection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the three-dimensional structure of a wafer inspection device used in a 12-inch wafer fully automatic visual inspection machine of the present invention;

[0031] Figure 2 for Figure 1 A schematic diagram of the structure of the calibration device;

[0032] Figure 3 for Figure 1 The enlarged schematic diagram of the structure of the transfer robot;

[0033] Figure 4 for Figure 1 A schematic diagram of the structure of the detection device;

[0034] Figure 5 for Figure 4A magnified schematic diagram of the local structure;

[0035] Figure 6 for Figure 5 A right side schematic diagram of

[0036] Figure 7 for Figure 5 A top view schematic diagram of

[0037] Among them: A, rack; q1, feeding area; q2, calibration area; q3, visual inspection area; q30, visual inspection window; q4, purification area;

[0038] B. Feeding device;

[0039] C, calibration device; C0, calibrator; C1, receiving rack; C10, rack body; C11, receiving module; m0, receiving surface; C2, rotating lifting bracket; C20, lifting bracket seat; C21, rotating rack plate; C22, supporting rack rod; k, positioning module; m1, first surface; m2, second surface;

[0040] D. Detection device; 1. Wafer carrier; 2. Rotation mechanism; 20. Connecting seat; 21. First driving member; 210. Connecting bracket; 211. Turning motor; 22. Second driving member; 220. Motor; 221. Turntable; 3. Illumination mechanism; 30. Track; 31. Light source; 310. Lamp holder; 311. Turning seat; 312. Strong light; 313. Yellow light group; 4. Adjustment mechanism; 40. Adjustment seat; 400. Bottom plate; 401. Side plate; g. Guide rail; 41. Power device; 411. First power member; a0. Power screw rod; a1. Moving seat; a2. Transmission rod; 412. Second power member;

[0041] E, transfer robot; E0, robot arm; E1, robot finger; E11, finger body; b, abutment part; E12, clamping block;

[0042] Y. Wafer. DETAILED DESCRIPTION

[0043] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0044] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0045] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0046] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] In the present application, unless otherwise expressly specified and limited, the first feature "above" or "below" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature "below", "below" and "below" the second feature may be that the first feature is directly below or obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. It should be noted that when an element is referred to as "fixed to" or "set on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0048] like Figures 1 to 7 As shown, the 12-inch wafer fully automatic visual inspection machine of this embodiment includes a frame A, a feeding device B, a calibration device C, a detection device D, and a transfer robot E.

[0049] Specifically, the rack A has a feeding area q1, a calibration area q2 and a visual inspection area q3 which are connected in sequence from back to front, wherein a visual inspection window q30 is provided on the front side of the visual inspection area q3; at the same time, the rack A also has a purification area q4 located above the calibration area q2 and the visual inspection area q3, respectively, and each purification area q4 is provided with a purifier to remove floating dust inside the visual inspection machine.

[0050] In this example, the feeding device B is arranged in the feeding area q1 and is used to supply wafers, and the feeding device B adopts a conventional wafer feeding device, and the present application is provided with two feeding devices B to meet the respective feeding and returning requirements.

[0051] In this example, the calibration device C is set in the calibration area q2 and is used for edge-finding calibration of the wafer. The calibration device C includes a calibrator C0, a receiving rack C1 forming a receiving area, and a rotating lifting bracket C2 forming a positioning area that matches the receiving area, wherein the rotating lifting bracket C2 can respectively move up and down and rotate around the vertical center line. The transfer robot E places the wafer in the receiving area, and the rotating lifting bracket C2 moves the wafer between the receiving area and the positioning area during the lifting movement, and drives the wafer in the positioning area to rotate during the rotation movement to complete the calibration. Here, through the cooperation of the receiving rack and the rotating lifting bracket, when calibrating, the robot first places the wafer on the receiving rack, and then the movement of the rotating lifting bracket transfers the wafer from the receiving area to the positioning area for positioning before performing edge-finding calibration, thereby improving the calibration accuracy.

[0052] In some specific embodiments, the receiving rack C1 includes a rack body C10, a plurality of receiving modules C11 arranged on the rack body C10 and distributed around the wafer, wherein each receiving module C11 forms a receiving surface m0 extending from the outside to the inside and tilted downward, and a receiving area is formed between the plurality of receiving surfaces m0. When receiving the material, the wafer contacts the receiving surface m0 from the edge; the rotating lifting rack C2 includes a lifting rack seat C20, a rotating rack plate C21 arranged on the lifting rack seat C20, and one end of the rotating rack The disk C21 is connected to a plurality of support rods C22 distributed circumferentially around the wafer, wherein a positioning module k is provided at the other end of each support rod C22, and a positioning area is formed between the plurality of positioning modules k; each support rod C22 can be extended and retracted along the radial direction of the wafer, and each positioning module k is formed with a first surface m1 extending vertically, and a second surface m2 extending inward and downward from the bottom edge of the first surface m1, and the wafer is supported on the first surface m1 from the side and supported on the second surface m2 from the bottom edge. Here, the wafer is automatically and gradually positioned by the extension and retraction of the support rods and the coordination of the first and second surfaces. It should be particularly noted that when the wafer is positioned, the center line of the wafer coincides with the center line of the positioning area.

[0053] In this example, the detection device D includes a wafer carrier 1 for loading a wafer Y, a rotating mechanism 2 for driving the wafer carrier 1 to rotate, an irradiation mechanism 3 and an adjustment mechanism 4 .

[0054] Specifically, the wafer carrier 1 adopts the wafer carrier involved in another patent of the applicant with publication number CN111863671A, so it will not be described here.

[0055] In this example, the rotating mechanism 2 includes a connecting seat 20, a first driving member 21 for driving the wafer carrier 1 to rotate radially around the wafer Y, and a second driving member 22 for driving the wafer carrier 1 to rotate around the vertical center line, wherein the rotation axis of the first driving member 21 is arranged to intersect with the rotation axis of the second driving member 22.

[0056] In some specific embodiments, the first driving member 21 includes a connecting bracket 210, a flip motor 211 connected to the top of the connecting bracket 210 and arranged on one side of the wafer carrier 1, and a transmission member for connecting the flip motor 211 to a pivot shaft on one side of the wafer carrier 1, wherein the transmission member is a gear or a pulley.

[0057] The second driving member 22 includes a motor 220 fixedly mounted on the connecting seat 20, and a rotating disk 221 connected to the output shaft of the motor 220, wherein the bottom of the rotating disk 221 is horizontal, and the side extends obliquely upward from the bottom edge, and the connecting bracket 210 is fixedly mounted on the rotating disk 221. The structure is simple, and it is easy to install and implement.

[0058] In this example, the irradiation mechanism 3 includes a track 30 extending horizontally in the front and rear direction, and a light source 31 movably arranged along the front and rear direction, wherein the light source 31 includes a lamp holder 310 slidably connected to the track 30, a flip seat 311 rotatably connected to the lamp holder 310 around a center line extending in the front and rear direction, and a strong light 312 arranged on the flip seat 311. Here, the irradiation area of ​​the strong light can be adjusted up and down to flexibly match the wafer at any angle.

[0059] For the convenience of implementation, during testing, the lamp holder 310 is fixedly connected to the track 30 by bolts; during adjustment, the lamp holder 310 is adjusted after loosening the bolts; at the same time, the rotational connection structure between the flip seat 311 and the lamp holder 310 can be any conventional rotational structure, which will not be elaborated here.

[0060] Meanwhile, the light source 31 further includes a yellow light lamp group 313 disposed above the wafer carrier 1 .

[0061] In this example, the adjustment mechanism 4 includes an adjustment seat 40 and a power device 41, wherein the wafer carrier 1 and / or the rotating mechanism 2 can be relatively slidably arranged on the adjustment seat 40 along the front-to-back direction; the power device 41 includes a first power member 411 and a second power member 412, wherein the first power member 411 is used to drive the wafer carrier 1 and / or the rotating mechanism 2 to slide back and forth relative to the adjustment seat 40 and drive the wafer to flip back and forth, and the second power member 412 drives the adjustment seat 40 to rotate around the vertical center line and drives the wafer to deflect left and right, so that the wafer keeps the part to be detected within the irradiation area formed by the light source 31 at any angle.

[0062] In some specific embodiments, the adjustment seat 40 includes a base plate 400, and two side plates 401 fixedly disposed on the base plate 400 and spaced side by side, wherein a guide rail g extending forward and backward is formed on the adjustment seat 40, the rotating mechanism 2 is slidably connected to the guide rail g through the connecting seat 20, and the wafer carrier 1 is connected to the top of the rotating mechanism 2 and moves synchronously with the rotating mechanism 2.

[0063] A guide rail g is fixedly provided on the inner wall or outer wall of each side plate 401, wherein the guide rail g is in an arc shape that arches downward, and the top surface of each side plate 401 is in an arc surface that matches the guide rail g. As the rotating mechanism 2 slides forward and backward along the guide rail g, the wafer carrier 1 is synchronously flipped forward or backward around the center of the circle corresponding to the guide rail. Here, the wafer carrier is flipped forward or backward to achieve a tilted state, so as to ensure that the light beam is irradiated on the part to be tested on the wafer, which is convenient for the visual inspector to observe.

[0064] At the same time, the angle range of the wafer carrier 1 flipping forward and backward is 0° to 60°. It should be particularly noted that in some specific embodiments, the two ends of the arc-shaped guide rail are respectively the lowest point and the highest point. When the rotating mechanism flips to the lowest point of the arc-shaped guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 0°, and when the rotating mechanism flips to the highest end of the arc-shaped guide rail, the flip angle of the rotating mechanism relative to the vertical direction is 60°.

[0065] In addition, the first power member 411 includes a power screw a0 extending forward and backward, a movable seat a1 sleeved on the power screw a0 and moving forward and backward along the power screw a0, and a transmission rod a2, wherein the transmission rod a2 is rotated and connected to the movable seat a1 and the connecting seat 20 at both ends; the second power member 412 adopts a motor, and the output shaft is connected to the base plate 400, and the rotation axis centerline of the second power member 412 coincides with the rotation axis centerline of the second driving member 22.

[0066] In addition, the transfer robot E is used to transfer wafers between the feeding area q1, the calibration area q2 and the visual inspection area q3, including a robot arm E0, a robot finger E1 arranged at the movable end of the robot arm E0, wherein the robot finger E1 includes a finger body E11 with a contact portion b formed at one end, and a clamping block E12 movably arranged on the finger body E11 away from the contact portion. When taking the material, the wafer abuts against the contact portion b from the edge, and the clamping block E12 clamps the wafer along the wafer radial direction. Here, the wafer abutment positioning is implemented first, and then clamping is implemented, and the clamping is accurate and efficient.

[0067] In some specific embodiments, a grid-supporting surface is formed on the inner side of the abutting portion b, and the grid-supporting surface is arranged to fit the edge contour of the wafer; there are at least two abutting portions b, and the clamping blocks E12 correspond to the abutting portions b one by one, and the clamping force formed is directed toward the corresponding abutting portions; the robot arm E0 and the robot finger E1 constitute a transfer group, and the transfer group has at least two and is arranged up and down. Here, the transfer operation of multiple wafers can be implemented simultaneously.

[0068] In summary, after adopting the 12-inch wafer fully automatic visual inspection machine, the transfer robot first takes out the wafer to be inspected from the feeding area and transfers it to the calibration device for edge calibration; then the transfer robot transfers the calibrated wafer to the visual inspection area and loads it onto the wafer carrier, and drives the wafer carrier to rotate through the rotating mechanism to obtain the required inspection angle, and then according to the wafer state at the current angle, the visual inspector uses the first power part to make the wafer carrier and / or the rotating mechanism slide on the adjustment seat and drive the wafer to flip back and forth, and drives the second power part to make the adjustment seat rotate around the vertical direction and drive the wafer to deflect left and right, so that the wafer is in a suitable visual inspection range, and ensures that the part to be inspected of the wafer is in the irradiation area formed by the light source. Therefore, compared with the prior art, the present invention, on the one hand, is based on the wafer carrier and / or rotating mechanism being slid forward and backward on the adjustment seat, and driven by the first power member and the second power member, the wafer is flipped forward and backward and adjusted left and right, thereby ensuring that the wafer can be in a suitable visual inspection range at any angle, facilitating the observation of the visual inspector and improving the accuracy of the inspection results; on the other hand, it realizes continuous and automatic loading and unloading, edge calibration and visual inspection of the wafer, which not only greatly improves the loading accuracy of the wafer, but also has a high degree of automation, greatly improving the visual inspection efficiency.

[0069] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A 12-inch wafer fully automatic visual inspection machine, characterized in that: It includes: A frame having a feeding area, a calibration area and a visual inspection area which are sequentially connected from back to front, wherein a visual inspection window is provided at the front side of the visual inspection area; A feeding device, which is arranged in the feeding area and is used to supply wafers; A calibration device, which is arranged in the calibration area and is used for edge-finding calibration of the wafer; A detection device, which is arranged in a visual inspection area and comprises a wafer carrier for loading wafers, a rotating mechanism for driving the wafer carrier to rotate, an irradiation mechanism and an adjustment mechanism, wherein the irradiation mechanism comprises a light source that can be moved along the front-back direction; the adjustment mechanism comprises an adjustment seat and a power device, wherein the wafer carrier and / or the rotating mechanism can be relatively slidably arranged on the adjustment seat along the front-back direction; the power device comprises a first power member and a second power member, wherein the first power member is used to drive the wafer carrier and / or the rotating mechanism to slide forward and backward relative to the adjustment seat and drive the wafer to flip forward and backward, and the second power member drives the adjustment seat to rotate around the vertical center line and drives the wafer to deflect left and right, and the wafer then keeps the part to be detected within the irradiation area formed by the light source at any angle; The transfer robot is used to transfer wafers between the feeding area, the calibration area and the visual inspection area.

2. The 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: The transfer robot includes a robot arm and a robot finger arranged at a movable end of the robot arm, wherein the robot finger includes a finger body with an abutment portion formed at one end, and a clamping block movably arranged on the finger body away from the abutment portion. When taking materials, the wafer abuts against the abutment portion from the edge, and the clamping block clamps the wafer along the radial direction of the wafer.

3. The 12-inch wafer fully automatic visual inspection machine according to claim 2, characterized in that: A grid-resting surface is formed on the inner side of the abutting portion, and the grid-resting surface is arranged to fit the edge contour of the wafer; and / or, there are at least two abutting portions, the clamping blocks correspond to the abutting portions one by one, and the clamping force formed is directed toward the corresponding abutting portions; and / or, the robotic arm and the robotic fingers constitute a transfer group, and the transfer group has at least two and is arranged up and down.

4. The 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: The calibration device includes a calibrator, a material receiving rack forming a material receiving area, and a rotating lifting bracket forming a positioning area cooperating with the material receiving area, wherein the rotating lifting bracket can respectively perform lifting and lowering movements and rotational movements around a vertical center line, the transfer robot places the wafer in the material receiving area, the rotating lifting bracket moves the wafer between the material receiving area and the positioning area during the lifting movement, and drives the wafer located in the positioning area to rotate during the rotational movement to complete the calibration.

5. The 12-inch wafer fully automatic visual inspection machine according to claim 4, characterized in that: The material receiving rack comprises a rack body, a plurality of material receiving modules arranged on the rack body and distributed around the wafer, wherein a material receiving surface extending from the outside to the inside and obliquely downward is formed on each of the material receiving modules, and a material receiving area is formed between the plurality of material receiving surfaces, and when receiving materials, the wafer abuts against the material receiving surface from its edge; and / or the rotating lifting rack comprises a lifting rack seat, a rotating rack plate arranged on the lifting rack seat, a plurality of supporting rack rods connected to the rotating rack plate at one end and distributed around the wafer, wherein a positioning module is provided at the other end of each of the supporting rack rods, and a positioning area is formed between the plurality of positioning modules; each of the supporting rack rods can be extended and retracted along the radial direction of the wafer, and each of the positioning modules is formed with a first surface extending vertically and a second surface extending inwardly and obliquely downward from the bottom edge of the first surface, and the wafer abuts against the first surface from the side and is supported on the second surface from the bottom edge.

6. The 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: A guide rail extending forward and backward is formed on the adjustment seat, the rotating mechanism is slidably connected to the guide rail, and the wafer carrier is connected to the top of the rotating mechanism and moves synchronously with the rotating mechanism; the guide rail is in a downwardly arched arc, and as the rotating mechanism slides forward and backward along the guide rail, the wafer carrier synchronously flips forward or backward around the center of the circle corresponding to the guide rail; the angle range of the wafer carrier flipping forward and backward is 0° to 60°.

7. The 12-inch wafer fully automatic visual inspection machine according to claim 6, characterized in that: The adjustment seat includes a bottom plate, and two side plates fixedly arranged on the bottom plate and spaced side by side, wherein the top surface of each side plate is an arc surface matching the guide rail, and a guide rail is fixedly provided on the inner wall or outer wall of each side plate.

8. The 12-inch wafer fully automatic visual inspection machine according to claim 6, characterized in that: The first power member includes a power screw rod extending forward and backward, a moving seat sleeved on the power screw rod and moving forward and backward along the power screw rod, and a transmission rod, wherein the transmission rod is rotatably connected to the moving seat and the rotating mechanism from both ends.

9. The 12-inch wafer fully automatic visual inspection machine according to claim 6, characterized in that: The rotating mechanism includes a connecting seat connected to the guide rail, a first driving member for driving the wafer carrier to rotate radially around the wafer, and a second driving member for driving the wafer carrier to rotate around a vertical center line, wherein the rotation axis of the first driving member is intersected with the rotation axis of the second driving member; the second driving member includes a motor fixedly arranged on the connecting seat and a turntable connected to the output shaft of the motor, and the first driving member is arranged on the turntable; the rotation axis of the second power member coincides with the rotation axis of the second driving member.

10. The 12-inch wafer fully automatic visual inspection machine according to claim 1, characterized in that: The irradiation mechanism also includes a track extending horizontally forward and backward, and the light source includes a lamp holder slidably connected to the track, a flip seat rotatably connected to the lamp holder around a center line extending in the forward and backward directions, and a strong light lamp arranged on the flip seat.

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