Packaging device based on integrated circuit chip

Abstract

The invention relates to the technical field of chip packaging, in particular to a packaging device based on an integrated circuit chip, which comprises a sealing unit and a turnover unit, the sealing unit comprises a mounting frame and a film material output part, the film material output part is erected above the mounting frame, a film material sealing part is arranged on one side of the mounting frame, and the film material sealing part is in butt joint with a packaging film at the output end of the film material output part and used for closing the packaging film; the turnover unit comprises a rotating unit, a plurality of turnover supports installed on the rotating unit and pneumatic suction cups installed on the turnover supports. The turnover supports drive the pneumatic suction cups to rotate and are in butt joint with the packaging film in the inner frame area of the film material sealing piece. The sealing unit further comprises a discharging guide part, and a film pressing assembly is further arranged at the bottom of the mounting frame and arranged at the input end of the discharging guide part. According to the invention, the packaging efficiency can be improved, the packaging speed of the chip is obviously improved through an automatic and continuous operation process, and the labor cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to a packaging device based on an integrated circuit chip. Background Art

[0002] Chip packaging is an indispensable part of integrated circuit production. It refers to the process of processing the exposed integrated circuit chip into a package with protection and connection functions through packaging technology. After the chip and the clamping plate are assembled, it is often necessary to coat the outer surface of the overall package support plate to complete the outer surface packaging process and the overall packaging process.

[0003] The outer surface coating packaging process in the prior art is generally composed of components such as a pressure roller, a composite knife, and a composite groove. The film and the material to be coated are firmly combined together by pressure and heat pressing. This overall operation efficiency is low and it is easy to form a bottleneck station for batch processing and production processes. Summary of the invention

[0004] The object of the present invention is to provide a packaging device based on an integrated circuit chip to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A packaging device based on integrated circuit chips, including a sealing unit and a turnover unit; the sealing unit includes a mounting frame and a film material output piece, the film material output piece is mounted above the mounting frame, a film material sealing piece is arranged on one side of the mounting frame, the film material sealing piece is connected to the packaging film at the output end of the film material output piece and is used to close the packaging film; the turnover unit includes a rotating unit, a plurality of turnover supports mounted on the rotating unit and a pneumatic suction cup mounted on the turnover supports, the turnover supports are arranged on the other side of the mounting frame and are rotatably mounted, the turnover supports drive the pneumatic suction cup to rotate and connect with the packaging film in the inner frame area of ​​the film material sealing piece; the sealing unit also includes a material unloading guide, the output end of the material unloading guide is externally connected to a transmission platform, and a film pressing assembly is also arranged at the bottom of the mounting frame, and the film pressing assembly is arranged at the input end of the material unloading guide.

[0007] As a further solution of the present invention: the film material output part comprises a support frame, a support roller is arranged on the top of the support frame, and a guide roller, a support roller, a direction-changing roller and an output roller are arranged on the bottom of the support frame respectively, and the packaging film is wound on the support roller and is successively directed to the film material sealing part after being changed by the guide roller, the support roller, the direction-changing roller and the output roller;

[0008] As a further solution of the present invention: the film material sealing part includes a folding frame and a closing frame, and the folding frame and the closing frame are fixedly installed on the mounting frame through a first fixing plate and a second fixing plate respectively; the folding frame is a bucket-shaped structure and the upper opening of the folding frame is connected to the output roller, and the closing frame is a bucket-shaped structure and is arranged below the folding frame and connected to the folding frame.

[0009] As a further solution of the present invention: the packaging film is folded through a folding frame and then closed in a closing frame, a workpiece inlet is provided on the mounting frame, the folded opening of the packaging film faces toward the workpiece inlet, and the feeding side of the pneumatic suction cup is connected to the workpiece inlet.

[0010] As a further solution of the present invention: the bottom edge of the mounting frame is provided with a lower extension frame and an edge banding wheel set installed on the lower extension frame, and the edge of the closed packaging film is pressed into the gap of the edge banding wheel set.

[0011] As a further solution of the present invention: the revolving support includes a rotating seat, a rotating pillar installed on the rotating seat and a working revolving plate arranged on the rotating pillar, a plurality of suction cup mounting seats are arranged on the outer edge of the bottom plane of the plate body of the suction cup mounting seat, the suction cup mounting seats are arranged at equal angles on the bottom plane of the plate body of the suction cup mounting seat, a suction cup mounting base plate is installed on the suction cup mounting seat through a discharge adjustment piece, and the pneumatic suction cup is fixedly mounted on the suction cup mounting base plate through a mounting bolt.

[0012] As a further solution of the present invention: the film pressing assembly includes a front fixed plate and a rear fixed plate, and the front fixed plate and the rear fixed plate are arranged on the two outer sides of the upper edge of the frame of the unloading guide, and the plate body of the rear fixed plate is provided with an axis mounting seat, and the axis mounting seat is provided with a bearing sleeve; two bearing sleeves are provided and arranged in parallel, and rollers are mounted between the bearing sleeves and the front fixed plates, and full-arc soft rollers and semi-arc soft rollers are respectively provided on the two rollers; mutually meshing transmission gears are provided on the shaft body of the roller shaft, and the shaft end of the roller shaft for installing the full-arc soft roller is externally connected to a power input shaft.

[0013] As a further solution of the present invention: a bucket-shaped cavity is arranged in the frame of the unloading guide, a guide gasket is arranged at the middle line position of the inner frame of the bucket-shaped cavity, the guide gasket is located directly below the roller body gap between the full-arc soft roller and the semi-arc soft roller, and the inner frame of the bucket-shaped cavity is provided with a side wing bracket supporting the guide gasket.

[0014] As a further solution of the present invention: a buffer support and a limiting ring arranged on the buffer support are installed on the frame plate of the front fixed plate, a buffer sleeve is arranged on the limiting ring, the other axial end of the roller shaft is limited in the buffer sleeve, and a buffer spring is arranged between the limiting ring and the frame wall of the front fixed plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The film material output part continuously outputs the packaging film, and the film material is folded to the top of the chip in a "Y"-shaped path to form a preliminary coverage. Subsequently, the film material continues to extend downward, enters the closing frame, and completes the final closing process inside it, ensuring the smooth transmission and precise coverage of the film material, and improving the accuracy and reliability of the packaging. The turnover unit is driven by a rotating unit and includes multiple rotatable turnover supports. The pneumatic suction cups on the supports firmly adsorb the chip through air pressure to achieve precise positioning and stable transmission. The film pressing assembly is located at the input end of the unloading guide, and pressure is applied to ensure that the film material fits tightly to the chip. The unloading guide outputs the packaged chip, and its external transfer table automatically transports it to the next process or storage area.

[0017] The present invention can improve packaging efficiency. Through the automated and continuous operation process, the device significantly improves the chip packaging speed and reduces labor costs. The precise control of the film sealing parts and the pressure applied by the film pressing assembly ensure the close fit between the packaging film and the chip surface, reducing defects in the packaging process; it can adapt to the packaging needs of chips of different sizes and types, increasing the versatility and flexibility of the equipment; the overall equipment cost is low, easy to maintain, and reduces the needs of modern manufacturing.

[0018] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings herein are incorporated into and constitute a part of the specification to illustrate embodiments consistent with the present application and are used together with the specification to explain the principles of the present application. At the same time, these drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application for those skilled in the art by referring to specific embodiments.

[0020] Figure 1 A schematic diagram of the overall structure of a packaging device based on an integrated circuit chip provided in an embodiment of the present invention.

[0021] Figure 2 A schematic structural diagram of a sealing unit provided in an embodiment of the present invention.

[0022] Figure 3 A schematic structural diagram of a film material output component and a film material sealing component provided in an embodiment of the present invention.

[0023] Figure 4 A schematic structural diagram of a revolving support provided in an embodiment of the present invention.

[0024] Figure 5It is a schematic diagram of the structure of region A in the present invention.

[0025] Figure 6 A schematic structural diagram of a film pressing assembly provided in an embodiment of the present invention.

[0026] Figure 7 It is a schematic diagram of the structure of region B in the present invention.

[0027] In the figure: 10, sealing unit; 11, mounting frame; 12, film material output part; 13, film material sealing part; 14, film pressing assembly; 15, material unloading guide; 16, transmission platform; 20, turnover unit; 21, rotating unit; 22, turnover support; 23, pneumatic suction cup; 30, packaging film; 31, support frame; 32, support roller; 33, guide roller; 34, support roller; 35, change direction roller; 36, output roller; 41, first fixed plate; 42, folding frame; 43, second fixed plate; 44, closing frame; 45, workpiece inlet; 46, lower extension frame; 47, Edge banding wheel assembly; 51. rotating seat; 52. rotating pillar; 53. working turntable; 54. suction cup mounting seat; 55. material discharge adjustment piece; 56. mounting bolt; 57. suction cup mounting base plate; 61. front fixing plate; 62. rear fixing plate; 63. shaft mounting seat; 64. bearing sleeve; 65. roller shaft; 66. power input shaft; 67. full arc soft roller; 68. half arc soft roller; 69. transmission gear; 71. bucket cavity; 72. side bracket; 73. guide gasket; 81. buffer support; 82. limit ring; 83. buffer shaft sleeve; 84. buffer spring. DETAILED DESCRIPTION

[0028] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0029] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0031] For example, see Figure 1 and Figure 2, provides a packaging device based on integrated circuit chips, including a sealing unit 10 and a turnover unit 20; the sealing unit 10 includes a mounting frame 11 and a film material output member 12, the film material output member 12 is mounted above the mounting frame 11, and a film material sealing member 13 is arranged on one side of the mounting frame 11, the film material sealing member 13 is connected to the packaging film 30 at the output end of the film material output member 12 and is used to close the packaging film 30; the turnover unit 20 includes a rotating unit 21, a plurality of rotating units installed on the rotating unit 21, and a plurality of rotating units installed on the rotating unit 21. A rotating support 22 and a pneumatic suction cup 23 installed on the rotating support 22, wherein the rotating support 22 is arranged on the other side of the mounting frame 11 and is rotatably installed, and the rotating support 22 drives the pneumatic suction cup 23 to rotate and connect with the packaging film 30 in the inner frame area of ​​the film sealing member 13; the sealing unit 10 also includes a material unloading guide 15, and the output end of the material unloading guide 15 is externally connected to a transmission platform 16, and a film pressing assembly 14 is also arranged at the bottom of the mounting frame 11, and the film pressing assembly 14 is arranged at the input end of the material unloading guide 15.

[0032] This embodiment is dedicated to optimizing the outer surface coating process of the chip (including the packaging support plate) on the basis of the chip packaging process, so as to achieve the effect of efficient and rapid implementation, so as to carry out efficient batch processing for non-precision chips. The core components of the sealing unit 10 include a sturdy and durable mounting frame 11, which is made of high-strength steel to ensure the stability of the entire sealing process. The film output member 12 is composed of a reel and a tension control system, which is mounted above the mounting frame 11 and is used to continuously and smoothly output the packaging film 30. The packaging film 30 is a kind of outer sealing film material specially designed for chip protection, which has excellent moisture-proof, dust-proof and shock-proof properties. The film material sealing member 13 is located on one side of the mounting frame 11. Through a precise mechanical structure and a heating element, the output packaging film 30 is closed above the chip to form a complete package. The turnover unit 20 is driven by a rotating unit 21, and includes a plurality of rotatable turnover supports 22, each of which is equipped with one or more pneumatic suction cups 23. The pneumatic suction cup 23 is controlled by air pressure and can firmly absorb the chip to ensure accurate positioning and stable transmission during the packaging process. The design of the revolving support 22 allows them to rotate around the center point, so that the pneumatic suction cup 23 can be efficiently moved from one workstation to another, including connecting with the packaging film 30 in the inner frame area of ​​the film sealing member 13 to perform chip packaging operations. The film pressing assembly 14 is installed at the bottom of the mounting frame 11, located at the input end of the unloading guide 15. The function of the film pressing assembly 14 is to apply appropriate pressure to the packaging film 30 before it is closed, to ensure that the film material fits tightly with the chip surface, eliminate bubbles and wrinkles, and improve the packaging quality. The unloading guide 15 is responsible for guiding the packaged chips out of the sealing unit 10, and the external transfer table 16 at its output end can automatically transport the packaged chips to the next process or storage area.

[0033] This embodiment can improve packaging efficiency. Through the automated and continuous operation process, the device significantly improves the chip packaging speed and reduces labor costs. The precise control of the film sealing member 13 and the pressure applied by the film pressing assembly 14 ensure that the packaging film 30 is closely attached to the chip surface, reducing defects in the packaging process; it can adapt to the packaging requirements of chips of different sizes and types, increasing the versatility and flexibility of the equipment; the overall equipment cost is low, easy to maintain, and reduces the requirements of modern manufacturing.

[0034] Example 2, based on the contents of the above example, please refer to Figure 1 and Figure 3 As for the specific implementation structure of the film material output component 12 and the film material sealing component 13, this embodiment is designed as follows:

[0035] The film material output part 12 includes a support frame 31, a support roller 32 is arranged on the top of the support frame 31, and a guide roller 33, a support roller 34, a change roller 35 and an output roller 36 are arranged at the bottom of the support frame 31. The packaging film 30 is rolled up on the support roller 32 and is guided to the film material sealing part 13 after being changed in direction by the guide roller 33, the support roller 34, the change roller 35 and the output roller 36 in sequence; the design of the film material output part 12 fully considers the stable output and precise guidance of the packaging film 30, the support roller 32 is an output structure, when the reel starts to rotate, the packaging film 30 will unfold along the surface of the support roller 32, and through a series of guide and support devices, the smooth transmission of the film material is ensured; the guide roller 33 is located at the bottom of the support frame 31, and its main function is to guide the packaging film 30 to extend downward from the support roller 32, while maintaining the stability of the tension of the film material. The support roller 34 further supports the film material to prevent it from sagging or wrinkling during the transmission process. The design of the change-direction roller 35 is particularly critical, as it enables the packaging film 30 to change the transmission direction smoothly, ensuring that the film material can be accurately guided to the output roller 36. The output roller 36, as the last link of the film material output part 12, accurately delivers the packaging film 30 to the film material sealing part 13.

[0036] The film material sealing component 13 includes a folding frame 42 and a closing frame 44, and the folding frame 42 and the closing frame 44 are fixedly mounted on the mounting frame 11 by means of a first fixing plate 41 and a second fixing plate 43 respectively; the folding frame 42 is a bucket-shaped structure and the upper opening of the folding frame 42 is connected to the output roller 36, and the closing frame 44 is a bucket-shaped structure and is arranged below the folding frame 42 and connected to the folding frame 42.

[0037] The folding frame 42 presents a bucket-shaped structure. This design not only ensures that the packaging film 30 can smoothly enter the folding frame 42 from the output roller 36, but also guides the packaging film 30 to be folded to the periphery of the chip at a specific angle. At the same time, the side walls and bottom of the folding frame 42 are designed with appropriate slope angles to adapt to the deformation of the packaging film 30 during the folding process to avoid wrinkles or tears. The closing frame 44 also adopts a bucket-shaped structure design. After the packaging film 30 is folded in the folding frame 42, it will continue to extend downward and enter the closing frame 44. In the folding frame 42, the film material is folded to the top of the chip in a "Y"-shaped path to form a preliminary coverage. Subsequently, the film material continues to extend downward and enters the closing frame 44, and completes the final closing process inside it, ensuring the smooth transmission and precise coverage of the film material, and improving the accuracy and reliability of the package. In addition, the bottom of the closing frame 44 can also be equipped with a heating element to further enhance the bonding force between the packaging film 30 and the chip.

[0038] The overall design of this embodiment is ingenious, and can efficiently and quickly meet the packaging requirements of outer surface coating, and can also adapt to chip packaging of different sizes and types, thereby improving the versatility and flexibility of the equipment.

[0039] In one case of this embodiment, a workpiece inlet 45 is provided on the frame of the mounting frame 11 , the folded opening of the packaging film 30 faces the workpiece inlet 45 , and the feeding side of the pneumatic suction cup 23 is connected to the workpiece inlet 45 .

[0040] The bucket-shaped structural design of the folding frame 42 ensures that the film material can be smoothly folded along its inner wall to the top of the chip. During the folding process, the edges on both sides of the film material will naturally gather inward to form a "Y"-shaped structure with an opening facing the workpiece inlet 45. This opening provides space for the chip to be placed. The feeding side of the pneumatic suction cup 23 is connected to the workpiece inlet 45. During the packaging process, the pneumatic suction cup 23 will first absorb the chip to be packaged and move it to the top of the workpiece inlet 45 along the rotation path of the rotating unit 21. Then, the pneumatic suction cup 23 will release the chip and make it fall smoothly under the packaging film 30. In this process, the precise control and stable transmission of the pneumatic suction cup 23 ensure the accurate positioning and placement of the chip.

[0041] In one case of this embodiment, see Figure 5 The bottom edge of the mounting frame 11 is provided with a lower extension frame 46 and an edge banding wheel set 47 installed on the lower extension frame 46. The edge of the closed packaging film 30 is pressed into the gap of the edge banding wheel set 47. The edges of both sides of the packaging film 30 will be further compacted to form a complete closed structure.

[0042] Example 3, based on the content of the above example, please refer to Figure 1 and Figure 4, with regard to the specific implementation structure of the revolving support 22, this embodiment is designed as follows:

[0043] The revolving support 22 includes a rotating seat 51, a rotating pillar 52 installed on the rotating seat 51, and a working revolving plate 53 arranged on the rotating pillar 52. A plurality of suction cup mounting seats 54 are arranged on the outer edge of the bottom plane of the plate body of the suction cup mounting seat 54. The suction cup mounting seat 54 is the main body of the revolving support 22. The suction cup mounting seats 54 are arranged at equal angles on the bottom plane of the plate body of the suction cup mounting seat 54. A suction cup mounting base plate 57 is installed on the suction cup mounting seat 54 through a discharge adjustment member 55. The pneumatic suction cup 23 is fixedly mounted on the suction cup mounting base plate 57 through a mounting bolt 56.

[0044] The turnover support 22 is responsible for carrying and transporting the chips to be packaged. The entire turnover support 22 consists of three parts: a rotating seat 51, a rotating pillar 52 and a working turnover disk 53. The rotating pillar 52 is connected between the rotating seat 51 and the working turnover disk 53. It can not only support the weight of the working turnover disk 53, but also enable the working turnover disk 53 to rotate in a horizontal plane. Each suction cup mounting seat 54 is designed with an interface and mounting hole that matches the pneumatic suction cup 23 to ensure that the pneumatic suction cup 23 can be stably mounted thereon. At the same time, the suction cup mounting seat 54 also has a certain adjustment function, and the height and angle of the pneumatic suction cup 23 can be adjusted through the discharge adjustment member 55 to adapt to chips of different sizes and shapes. The discharge adjustment member 55 is a device for adjusting the position and height of the pneumatic suction cup 23. It usually includes an adjustable screw or nut, and the precise adjustment of the pneumatic suction cup 23 can be achieved by rotating this screw or nut. The suction cup mounting base plate 57 is the mounting platform of the pneumatic suction cup 23. It is normally a smooth metal plate or plastic plate, which is designed with mounting holes and fixing bolts that match the pneumatic suction cup 23.

[0045] Example 4, based on the contents of the above example, please refer to Figure 1 and Figure 6 , with regard to the specific implementation structure of the film pressing assembly 14, this embodiment is designed as follows:

[0046] The film pressing assembly 14 includes a front fixing plate 61 and a rear fixing plate 62, and the front fixing plate 61 and the rear fixing plate 62 are arranged on the two outer sides of the upper edge of the frame of the unloading guide 15. The plate body of the rear fixing plate 62 is provided with an axis mounting seat 63, and the axis mounting seat 63 is provided with a bearing sleeve 64; two bearing sleeves 64 are provided and arranged in parallel, and roller shafts 65 are mounted between the front fixing plates 61, and the two roller shafts 65 are respectively provided with a full-arc soft roller 67 and a semi-arc soft roller 68; the shaft body of the roller shaft 65 is provided with mutually meshing transmission gears 69, and the shaft end of the roller shaft 65 for installing the full-arc soft roller 67 is externally connected to a power input shaft 66.

[0047] The laminating assembly 14 is dedicated to ensuring that the packaging film can be closely and evenly attached to the chip surface. The laminating assembly 14 is mainly composed of a front fixing plate 61, a rear fixing plate 62, an axis mounting seat 63, a bearing sleeve 64, a roller 65, a full-arc soft roller 67, a semi-arc soft roller 68, and a power input shaft 66. The material of the full-arc soft roller 67 and the semi-arc soft roller 68 is soft and has a certain elasticity. They can be closely attached to the chip surface during the laminating process while avoiding damage to the chip. The gear transmission ensures that the full-arc soft roller 67 and the semi-arc soft roller 68 can maintain a consistent speed and pressure during the laminating process.

[0048] The full arc soft roller 67 is used to perform film lamination on one side of the packaging support plate. Its shape is a complete arc and is used to perform full-scale film lamination on the packaging support plate. The semi-arc soft roller 68 is used to perform film lamination on the side where the chip body is assembled. It is used to perform partial lamination on the chip body and the packaging film 30 around it, thereby reducing the direct pressure on the chip body and avoiding affecting the packaging integrity between the chip and the packaging support plate.

[0049] In one case of the present embodiment, a bucket-shaped cavity 71 is provided in the frame of the unloading guide 15, and a guide gasket 73 is provided at the center line position of the inner frame of the bucket-shaped cavity 71. The guide gasket 73 is located directly below the roller gap between the full-arc soft roller 67 and the semi-arc soft roller 68, and the inner frame of the bucket-shaped cavity 71 is provided with a wing bracket 72 supporting the guide gasket 73. The function of the guide gasket 73 is to further guide and support the packaging film 30 to ensure that it maintains the correct position and posture before entering the film pressing area. The material of the guide gasket 73 is usually selected to be soft and wear-resistant to avoid damage to the packaging film 30. The design of the wing bracket 72 ensures the stability and reliability of the guide gasket 73. At the same time, the wing bracket 72 also plays a certain limiting role to ensure that the packaging film 30 will not deviate from the predetermined path during the conveying process.

[0050] In one case of this embodiment, see Figure 6 and Figure 7 A buffer support 81 and a limiting ring 82 arranged on the buffer support 81 are installed on the frame plate of the front fixed plate 61, and a buffer sleeve 83 is arranged on the limiting ring 82. The other axial end of the roller shaft 65 is limited in the buffer sleeve 83, and a buffer spring 84 is arranged between the limiting ring 82 and the frame wall of the front fixed plate 61.

[0051] During the packaging and laminating process, when the roller 65 rotates under the drive of the power input shaft 66, the buffer sleeve 83 and the buffer spring 84 work together to reduce the friction and vibration of the roller 65; the main function of the limit ring 82 is to limit the axial movement of the roller 65 to ensure that it maintains the correct position during the laminating process, and the function of the buffer spring 84 is to provide additional buffering and shock absorption effects to further reduce the vibration and impact of the roller 65 during the laminating process. This design helps to extend the service life of the laminating assembly 14 and improve the stability and quality of packaging.

[0052] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.

[0053] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A packaging device based on an integrated circuit chip, comprising a sealing unit (10) and a turnover unit (20); characterized in that: The sealing unit (10) comprises a mounting frame (11) and a film material output component (12), wherein the film material output component (12) is mounted above the mounting frame (11), and a film material sealing component (13) is arranged on one side of the mounting frame (11), wherein the film material sealing component (13) is connected to the packaging film (30) at the output end of the film material output component (12) and is used to close the packaging film (30); The turnover unit (20) comprises a rotating unit (21), a plurality of turnover supports (22) mounted on the rotating unit (21), and a pneumatic suction cup (23) mounted on the turnover supports (22); the turnover supports (22) are arranged on the other side of the mounting frame (11) and are rotatably mounted; the turnover supports (22) drive the pneumatic suction cup (23) to rotate and contact with the packaging film (30) in the inner frame area of ​​the film material sealing member (13); The sealing unit (10) further comprises a material discharge guide (15), the output end of which is externally connected to a transmission platform (16), and a film pressing assembly (14) is also arranged at the bottom of the mounting frame (11), and the film pressing assembly (14) is arranged at the input end of the material discharge guide (15).

2. The integrated circuit chip-based packaging device according to claim 1, characterized in that: The film material output component (12) comprises a support frame (31), a support roller (32) is arranged on the top of the support frame (31), and a guide roller (33), a support roller (34), a direction-changing roller (35) and an output roller (36) are arranged on the bottom of the support frame (31). The packaging film (30) is wound on the support roller (32) and is directed to the film material sealing component (13) after being changed in direction by the guide roller (33), the support roller (34), the direction-changing roller (35) and the output roller (36) in sequence.

3. The integrated circuit chip-based packaging device according to claim 2, characterized in that: The film material sealing component (13) comprises a folding frame (42) and a closing frame (44), wherein the folding frame (42) and the closing frame (44) are fixedly mounted on the mounting frame (11) via a first fixing plate (41) and a second fixing plate (43), respectively; the folding frame (42) is in a bucket-shaped structure and the upper opening of the folding frame (42) is in contact with the output roller (36); the closing frame (44) is in a bucket-shaped structure and is arranged below the folding frame (42) and in contact with the folding frame (42); The packaging film (30) is folded by a folding frame (42) and then closed in a closing frame (44); a workpiece inlet (45) is provided on the frame of the mounting frame (11); the folded opening of the packaging film (30) faces toward the workpiece inlet (45); and the feeding side of the pneumatic suction cup (23) is connected to the workpiece inlet (45).

4. The integrated circuit chip-based packaging device according to claim 3, characterized in that: The bottom edge of the mounting frame (11) is provided with a lower extension frame (46) and an edge banding wheel set (47) mounted on the lower extension frame (46); the edge of the closed packaging film (30) is pressed into the gap of the edge banding wheel set (47).

5. The integrated circuit chip-based packaging device according to claim 4, characterized in that: The rotatable support (22) comprises a rotating seat (51), a rotating pillar (52) mounted on the rotating seat (51), and a working rotatable plate (53) arranged on the rotating pillar (52); a plurality of suction cup mounting seats (54) are arranged on the outer edge of the bottom plane of the plate body of the suction cup mounting seat (54); the suction cup mounting seats (54) are arranged at equal angles on the bottom plane of the plate body of the suction cup mounting seat (54); a suction cup mounting base plate (57) is mounted on the suction cup mounting seat (54) via a material discharge adjustment member (55); and the pneumatic suction cup (23) is fixedly mounted on the suction cup mounting base plate (57) via a mounting bolt (56).

6. The integrated circuit chip-based packaging device according to any one of claims 1 to 5, characterized in that: The film pressing assembly (14) comprises a front fixing plate (61) and a rear fixing plate (62), wherein the front fixing plate (61) and the rear fixing plate (62) are arranged on two outer sides of the upper edge of the frame of the material unloading guide (15), and the plate body of the rear fixing plate (62) is provided with a shaft mounting seat (63), and the shaft mounting seat (63) is provided with a bearing sleeve (64); The bearing sleeves (64) are provided with two and arranged in parallel, and roller shafts (65) are mounted between the bearing sleeves (64) and the front fixed plate (61), and the two roller shafts (65) are respectively provided with full-arc soft rollers (67) and semi-arc soft rollers (68); The shaft body of the roller shaft (65) is provided with mutually meshing transmission gears (69), and the shaft end of the roller shaft (65) for mounting the full-arc soft roller (67) is externally connected with a power input shaft (66).

7. The integrated circuit chip-based packaging device according to claim 6, characterized in that: A bucket-shaped cavity (71) is provided in the frame of the material unloading guide (15); a guide gasket (73) is provided at the center line position of the inner frame of the bucket-shaped cavity (71); the guide gasket (73) is located directly below the gap between the roller bodies of the full-arc soft roller (67) and the semi-arc soft roller (68); and a side wing bracket (72) supporting the guide gasket (73) is provided in the inner frame of the bucket-shaped cavity (71).

8. The integrated circuit chip-based packaging device according to claim 7, characterized in that: A buffer support column (81) and a limiting ring (82) arranged on the buffer support column (81) are installed on the frame plate of the front fixed plate (61); a buffer shaft sleeve (83) is arranged on the limiting ring (82); the other shaft end of the roller shaft (65) is limited in the buffer shaft sleeve (83); and a buffer spring (84) is arranged between the limiting ring (82) and the frame wall of the front fixed plate (61).

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