A separation device and method for cleaning and drying wafers of multiple sizes

Abstract

The present invention relates to a separation device and method for cleaning and drying wafers of multiple sizes. The device includes a carrier moving component, a tool moving component, a linear driving component, and a cam-linkage component. The carrier moving component includes a connection platform and a bearing platform disposed below the connection platform and used for bearing carriers of different sizes. A first pushing mechanism is provided between the connection platform and the bearing platform. The tool moving component includes a first separation platform disposed above the connection platform and a second separation platform disposed above the first separation platform. A first tool for separating large-sized wafers is provided on the first separation platform, and a second tool for separating small-sized wafers is provided on the second separation platform. A second pushing mechanism is provided between the first separation platform and the second separation platform. The linear driving component is connected to the second separation platform. The cam-linkage component is disposed on the linear driving component and is used to cooperate with the linear driving component to drive the carrier moving component and the tool moving component to move reciprocally in the vertical direction.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning and drying, and particularly relates to a separating device and method for cleaning and drying wafers of multiple sizes. Background Art

[0002] In the process of semiconductor device production, the cleaning and drying of wafers is a key process, and trace contaminants may cause device failure. The main purpose of cleaning is to remove contaminants on the wafer surface, including organic substances, inorganic substances, and particulate matters, etc. These contaminants may exist in the form of atomic state, ionic state, thin film or particles, and will cause various defects. After wafer cleaning, a high-precision robotic arm or a wafer separating device in the non-process area is required to complete the separation of the wafer from the carrier, so as to carry out further drying procedures.

[0003] However, the existing wafer separating devices are usually only applicable to wafers of a single size, and have poor compatibility with wafers of different sizes. This limitation restricts the application range of the device and is difficult to meet the requirements of compatibility and efficient processing of wafers of various specifications in current semiconductor production. Summary of the Invention

[0004] The purpose of the present invention is to provide a separating device and method for cleaning and drying wafers of multiple sizes, which can separate wafers and carriers of different sizes.

[0005] To achieve the above object, according to the first aspect of the present invention, there is provided a separating device for cleaning and drying wafers of multiple sizes, including:

[0006] A carrier moving assembly, including a connection platform and a bearing platform arranged below the connection platform, the bearing platform is used to bear detachable carriers of different sizes, and a first pushing mechanism is arranged between the connection platform and the bearing platform;

[0007] A tool moving assembly, including a first separating platform arranged above the connection platform and a second separating platform arranged above the first separating platform, a first tool for separating large-sized wafers is arranged on the first separating platform, a second tool for separating small-sized wafers is arranged on the second separating platform, and a second pushing mechanism is arranged between the first separating platform and the second separating platform;

[0008] A linear driving assembly, connected to the second separating platform;

[0009] A cam-linkage assembly, arranged on the linear driving assembly, and used to cooperate with the linear driving assembly to drive the carrier moving assembly and the tool moving assembly to move reciprocally in the vertical direction.

[0010] Optionally, a first tool carrier is disposed between the first separation platform and the first tool, and a second tool carrier is disposed between the second separation platform and the second tool.

[0011] Optionally, the tops of the first tool and the second tool are located on the same vertical plane as the bottommost part of the wafer.

[0012] Optionally, a carrier bracket is provided on the carrying platform, and two groups of oppositely arranged limiting blocks are provided on the carrier bracket, and the carrier is arranged between the two groups of limiting blocks.

[0013] Optionally, the first tool carrier, the second tool carrier and the carrier bracket are arranged in a staggered manner in the horizontal direction.

[0014] Optionally, the linear drive assembly includes a support frame, a vertical lead screw and a vertical guide rail provided on the support frame. The vertical lead screw is connected to the second separation platform, and the carrying platform, the connection platform, the first separation platform and the second separation platform are slidably arranged on the vertical guide rail in sequence from bottom to top.

[0015] Optionally, the cam link assembly includes:

[0016] A cam plate is provided on the support frame. The side edge of the cam plate is divided into a synchronous section with a vertical structure and a separation section with an arc structure;

[0017] A first link, one end of the first link is rotatably connected to the second separation platform;

[0018] A second link, one end of the second link is rotatably connected to the connection platform, and the other end of the second link is rotatably connected to the other end of the first link;

[0019] An idler wheel is provided at the connection of the first link and the second link and is rotatably provided at the side edge of the cam plate;

[0020] The cam link assembly is configured to drive the carrier moving assembly and the tool moving assembly to move upward synchronously in cooperation with the linear drive assembly when the idler wheel is located in the synchronous section;

[0021] When the idler wheel is located in the separation section, it drives the tool moving assembly to move upward in cooperation with the linear drive assembly to separate the wafer and the carrier.

[0022] According to the second aspect of the present invention, a separation method for cleaning and drying multi-size wafers is provided, including the following steps:

[0023] When separating the large-size wafer and the carrier, controlling the first pushing mechanism to open and extend, pushing the carrying platform downward so that the first cutter and the second cutter contact the bottom of the large-size wafer;

[0024] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly and the carrier moving assembly to move upward synchronously so that the large-size wafer and the carrier are in an initial separation position;

[0025] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to continue to move and drive the tool moving assembly to move upward to eject the large-size wafer from the carrier and separate it into a drying box located above the carrier;

[0026] The linear drive assembly is controlled to cooperate with the cam connecting rod assembly to move in the opposite direction so that the separation device returns to a state where the large-size wafer and the carrier are in an initial separation position.

[0027] Optionally, the separation method for cleaning and drying multi-size wafers further comprises the following steps:

[0028] When separating the small-sized wafer and the carrier, controlling the first pushing mechanism to close and retract, driving the carrying platform to move upward so that the small-sized wafer and the carrier are in an initial separation position;

[0029] Controlling the second pushing mechanism to open and extend, pushing the first separation platform to move downward so that the first tool avoids the small-sized carrier;

[0030] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly to move upward to eject the small-sized wafer from the carrier and separate it into a drying box located above the carrier;

[0031] The linear drive assembly is controlled to cooperate with the cam-link assembly to move in the opposite direction, and the second pushing mechanism is controlled to close and retract, so that the separation device returns to a state where the small-size wafer and the carrier are in an initial separation position.

[0032] The beneficial effects of the present invention are as follows: by setting a connecting platform, a carrying platform and a first pushing mechanism, the positions of carriers of different sizes can be adjusted without interfering with the state of the cam-connecting rod assembly, so that wafers of different sizes and the top of the carrier are on the same target reference plane, the initial separation position is unified, and by setting a first tool and a second tool, in cooperation with a linear drive assembly and a cam-connecting rod assembly, wafers of different sizes can be ejected and separated from the carrier; at the same time, by setting a first separation platform, a second separation platform and a second pushing mechanism, the first separation platform can be pushed downward to allow the first tool to avoid small-sized carriers.

[0033] The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and implement it in accordance with the content of the specification, the following describes in detail with reference to the preferred embodiments of the present invention and the accompanying drawings. Description of the Drawings

[0034] Figure 1 It is a schematic structural diagram of a separation device for cleaning and drying multi-size wafers shown in an embodiment of the present invention;

[0035] Figure 2 It is a schematic three-dimensional structural diagram of a separation device for cleaning and drying multi-size wafers shown in an embodiment of the present invention;

[0036] Figure 3 It is a schematic structural diagram at the tool moving assembly of a separation device for cleaning and drying multi-size wafers shown in an embodiment of the present invention;

[0037] Figure 4 It is a schematic flow chart of a separation method for cleaning and drying multi-size wafers shown in an embodiment of the present invention;

[0038] In the figure: 1, carrier moving assembly; 11, connection platform; 12, bearing platform; 13, carrier; 14, first pushing mechanism; 15, carrier bracket; 151, limit block; 2, tool moving assembly; 21, first separation platform; 22, second separation platform; 23, first tool; 24, second tool; 25, second pushing mechanism; 26, first tool bracket; 27, second tool bracket; 3, linear drive assembly; 31, support frame; 32, vertical lead screw; 33, vertical guide rail; 4, cam link assembly; 41, cam plate; 411, synchronous section; 412, separation section; 42, first link; 43, second link; 44, idler wheel. Detailed Embodiment

[0039] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] Please refer to Figures 1 to 3 , a separation device for cleaning and drying multi-size wafers shown in a preferred embodiment of the present application includes a carrier 13, a moving assembly 1, a tool moving assembly 2, a linear driving assembly 3, and a cam-link assembly 4. The carrier 13 moving assembly 1 includes a connecting platform 11 and a bearing platform 12 disposed below the connecting platform 11. The bearing platform 12 is used to carry detachable carriers 13 of different sizes. A first pushing mechanism 14 is disposed between the connecting platform 11 and the bearing platform 12. The tool moving assembly 2 includes a first separation platform 21 disposed above the connecting platform 11 and a second separation platform 22 disposed above the first separation platform 21. A first tool 23 for separating large-size wafers is disposed on the first separation platform 21, and a second tool 24 for separating small-size wafers is disposed on the second separation platform 22. A second pushing mechanism 25 is disposed between the first separation platform 21 and the second separation platform 22. The linear driving assembly 3 is connected to the second separation platform 22. The cam-link assembly 4 is disposed on the linear driving assembly 3 and is used to cooperate with the linear driving assembly 3 to drive the carrier 13 moving assembly 1 and the tool moving assembly 2 to reciprocate vertically.

[0043] According to the solution of the embodiment of the present invention, by providing a connection platform 11, a bearing platform 12, and a first pushing mechanism 14, the position of carriers 13 of different sizes can be adjusted without interfering with the state of the cam-link assembly 4, so that wafers of different sizes and the tops of the carriers 13 are on the same target reference plane, unifying the initial separation position. By providing a first cutter 23 and a second cutter 24, and cooperating with the linear drive assembly 3 and the cam-link assembly 4, wafers of different sizes can be ejected and separated from the carriers 13. At the same time, by providing a first separation platform 21, a second separation platform 22, and a second pushing mechanism 25, the first separation platform 21 can be pushed downward to enable the first cutter 23 to avoid the small-sized carrier 13.

[0044] The following will be described in detail with specific embodiments:

[0045] Please refer to Figure 2 , the linear drive assembly 3 includes a support frame 31, a vertical lead screw 32 provided on the support frame 31, and a vertical guide rail 33. The vertical lead screw 32 is connected to the second separation platform 22. The bearing platform 12, the connection platform 11, the first separation platform 21, and the second separation platform 22 are slidably provided on the vertical guide rail 33 in sequence from bottom to top. Please refer to Figure 1 and Figure 2 , the cam-link assembly 4 includes a cam plate 41, a first link 42, a second link 43, and a idler wheel 44. The cam plate 41 is provided on the support frame 31. The side edge of the cam plate 41 is divided into a vertical synchronous section 411 and an arc-shaped separation section 412. One end of the first link 42 is rotatably connected to the second separation platform 22. One end of the second link 43 is rotatably connected to the connection platform 11. The other end of the second link 43 is rotatably connected to the other end of the first link 42. The idler wheel 44 is provided at the connection of the first link 42 and the second link 43 and is rollably provided at the side edge of the cam plate 41. The cam-link assembly 4 is configured such that when the idler wheel 44 is located in the synchronous section 411, it cooperates with the linear drive assembly 3 to drive the carrier moving assembly 1 and the tool moving assembly 2 to move upward synchronously. When the idler wheel 44 is located in the separation section 412, it cooperates with the linear drive assembly 3 to drive the tool moving assembly 2 to move upward to separate the wafer and the carrier 13.

[0046] It can be seen that when the linear drive assembly 3 drives the second separation platform 22 to move upward, the cam link assembly 4 is divided into two motion stages. In the first motion stage, the idle pulley 44 is located in the synchronization section 411. Since the synchronization section 411 is a vertical structure and the included angle between the first link 42 and the second link 43 remains unchanged, the cam link assembly 4 drives the carrier 13 moving assembly 1 and the tool moving assembly 2 to move upward synchronously, so that the wafer and the carrier 13 reach the initial separation position. In the second motion stage, the idle pulley 44 is located in the separation section 412. Since the separation section 412 is an arc structure and the included angle between the first link 42 and the second link 43 gradually increases and opens, the cam link assembly 4 drives the tool moving assembly 2 to move upward alone, and the carrier 13 moving assembly 1 and the carrier 13 remain stationary at the final initial separation position in the first motion stage, so that the tool moving assembly 2 ejects and separates the wafer from the carrier 13 and enters the drying box above the carrier 13. Regardless of the size of the wafer, its separation process follows the above two motion stages.

[0047] Specifically, the wafer and the carrier 13 reach the initial separation position when the top of the wafer and the carrier 13 is at the target reference plane (in this embodiment, the target reference plane is the dehydration liquid level in the reaction tank). From the perspective of the entire separation process, since the first motion stage and the second motion stage are continuous processes, when only the same cam link assembly 4 and linear drive assembly 3 are used, regardless of the size of the wafer being separated, when the wafer and the carrier 13 reach the initial separation position, the idle pulley 44 in the cam link assembly 4 is at the inflection point between the cam synchronization section 411 and the separation section 412, and the position of the bearing platform 12 at this time is the highest and will not move upward anymore. Subsequently, only the tool moving assembly 2 will continue to move upward. If the separation of small-sized wafers is used as the benchmark and large-sized wafers are separated instead, the wafer and the carrier 13 will protrude out of the liquid level at the initial separation position and even touch the upper drying tank, causing motion interference. If the separation of large-sized wafers is used as the benchmark and small-sized wafers are separated instead, the wafer and the carrier 13 will be at a certain distance from the liquid level at the initial separation position, which will increase the subsequent moving stroke of the tool. If the size is too small, the moving range of the cam link assembly 4 may not be sufficient. At the same time, different wafer sizes also have different thicknesses, resulting in different lengths of different-sized wafer groups. Therefore, when only a tool with a shorter length is used to separate a larger-sized wafer group, there will be a situation where some large-sized wafers cannot be ejected and separated from the carrier 13.

[0048] Based on the above problems, in the embodiments of the present invention, taking the separation of large-sized wafers as a benchmark, a cam-linkage assembly 4 and a linear drive assembly 3 are designed, and a connection platform 11, a bearing platform 12, and a first pushing mechanism 14 are provided. Without interfering with the state of the cam-linkage assembly 4, the position of the small-sized carrier 13 can be moved upward, so that the small-sized wafer and the top of the carrier 13 can also be on the same target reference plane (i.e., the dehydration liquid level) at the initial separation position, unifying the initial separation position. At the same time, a first cutting tool 23 and a second cutting tool 24 are designed to correspond to and match the lengths of the large-sized and small-sized wafer groups, so as to ensure that all wafers can be completely separated.

[0049] Please refer to Figure 2 , specifically, in this embodiment, a first cutting tool 23 bracket is provided between the first separation platform 21 and the first cutting tool 23, and a second cutting tool 24 bracket is provided between the second separation platform 22 and the second cutting tool 24. A carrier 13 bracket is provided on the bearing platform 12, and two sets of oppositely arranged limit blocks 151 are provided on the carrier 13 bracket, and the carrier 13 is arranged between the two sets of limit blocks 151.

[0050] Further, please refer to Figure 3 , in this embodiment, the tops of the first cutting tool 23 and the second cutting tool 24 are on the same vertical plane as the bottom of the wafer. By setting it like this, the center of gravity of the wafer lifted by the two cutting tools can be ensured, so that the separation process is more stable.

[0051] Further, please refer to Figure 3 , the first cutting tool 23 bracket, the second cutting tool 24 bracket, and the carrier 13 bracket are arranged in a staggered manner in the horizontal direction. By setting it like this, when the first cutting tool 23 bracket, the second cutting tool 24 bracket, and the carrier 13 bracket move up and down, collisions will occur and cause movement interference.

[0052] Please refer to Figure 4 , the present invention also provides a separation method for cleaning and drying multi-size wafers, including the following steps:

[0053] S10: When separating the large-sized wafer and the carrier 13, control the first pushing mechanism 14 to open and extend, and push the bearing platform 12 downward to make the first cutting tool 23 and the second cutting tool 24 contact the bottom of the large-sized wafer;

[0054] S20: Control the linear drive assembly 3 to cooperate with the cam-linkage assembly 4 to move to drive the cutting tool moving assembly 2 and the carrier 13 moving assembly 1 to move upward synchronously so that the top of the large-sized wafer and the carrier 13 are on the target reference plane and reach the initial separation position;

[0055] S30: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to continue moving, driving the tool moving assembly 2 to move upward so that the first tool 23 and the second tool 24 eject and separate the large-sized wafer from the carrier 13 and enter the drying box located above the carrier 13;

[0056] S40: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to move in the reverse direction so that the separating device returns to the state where the large-sized wafer and the carrier 13 are at the initial separation position.

[0057] S50: When separating the small-sized wafer and the carrier 13, control the first pushing mechanism 14 to close and retract, driving the bearing platform 12 to move upward so that the small-sized wafer and the carrier 13 are at the target reference plane and reach the initial separation position;

[0058] S60: Control the second pushing mechanism 25 to open and extend, pushing the first separating platform 21 downward to enable the first tool 23 to avoid the small-sized carrier 13;

[0059] S70: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to move, driving the tool moving assembly 2 to move upward so that the second tool 24 ejects and separates the small-sized wafer from the carrier 13 and enters the drying box located above the carrier 13;

[0060] S80: Control the linear drive assembly 3 to cooperate with the cam link assembly 4 to move in the reverse direction, and control the second pushing mechanism 25 to close and retract so that the separating device returns to the state where the small-sized wafer and the carrier 13 are at the initial separation position.

[0061] In this step S10, after the first pushing mechanism 14 opens and extends, the first tool 23, the second tool 24, and the carrier 13 bracket are in a substantially flush state.

[0062] In this step S40, the first pushing mechanism 14 is in the open and extended state, which is convenient for closing and retracting the first pushing mechanism 14 when separating the small-sized wafer and the carrier 13 subsequently.

[0063] In this step S50, since the first tool 23, the second tool 24, and the horizontal part of the carrier 13 bracket are in a substantially flush state at this time, by closing and retracting the first pushing mechanism 14, the bearing platform 12 can be driven to move upward to make up for the height difference between the small-sized wafer and the large-sized wafer, so that the small-sized wafer and the carrier 13 can also reach the target reference plane and reach the initial separation position. During this process, the first tool 23 and the second tool 24 move downward relative to the horizontal part of the carrier 13 bracket, so they will not contact the wafer and cause interference.

[0064] In step S60, since the length of the first tool 23 corresponds to the length of the large-size wafer group and the carrier 13, if the first tool 23 and the second tool 24 are synchronously moved upward when separating the small-size wafer and the carrier 13, the first tool 23, due to its longer length, cannot extend into the small-size carrier 13 and will tip over the carrier 13. Therefore, through this step, the first tool 23 is arranged to be displaced downward relative to the second tool 24, so as to avoid the small-size carrier 13. In step S70, although the first tool 23 and the second tool 24 are synchronously moved upward driven by the linear drive assembly 3 and the cam link assembly 4, due to the avoidance arrangement in the previous step, only the second tool 24 enters the carrier 13 to eject and separate the small-size wafer.

[0065] Regardless of the size of the wafer and the carrier 13 being separated, after separation and the execution of the drying process, it will return to the initial separation position for subsequent separation of the wafer and the carrier 13.

[0066] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0067] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A separation device for cleaning and drying wafers of multiple sizes, characterized in that, Including: A vehicle moving component, including a connection platform and a bearing platform arranged below the connection platform, the bearing platform being used for bearing vehicles of different sizes that can be detached, and a first pushing mechanism being arranged between the connection platform and the bearing platform; A tool moving component, including a first separation platform arranged above the connection platform and a second separation platform arranged above the first separation platform, a first tool for separating large-size wafers being arranged on the first separation platform, a second tool for separating small-size wafers being arranged on the second separation platform, and a second pushing mechanism being arranged between the first separation platform and the second separation platform; A linear driving component, connected to the second separation platform, the linear driving component including a support frame, a vertical lead screw arranged on the support frame, and a vertical guide rail, the vertical lead screw being connected to the second separation platform, and the bearing platform, the connection platform, the first separation platform, and the second separation platform being slidably arranged on the vertical guide rail in sequence from bottom to top; A cam-linkage component, arranged on the linear driving component, for cooperating with the linear driving component to drive the vehicle moving component and the tool moving component to reciprocate vertically, the cam-linkage component including: A cam plate, arranged on the support frame, the side edge of the cam plate being divided into a vertical synchronous section and an arc-shaped separation section; A first link, one end of the first link being rotatably connected to the second separation platform; A second link, one end of the second link being rotatably connected to the connection platform, and the other end of the second link being rotatably connected to the other end of the first link; An idler wheel, arranged at the connection of the first link and the second link, and being rotatably arranged at the side edge of the cam plate; The cam-linkage component is arranged such that when the idler wheel is located in the synchronous section, it cooperates with the linear driving component to drive the vehicle moving component and the tool moving component to move upward synchronously; When the idler wheel is located in the separation section, it cooperates with the linear driving component to drive the tool moving component to move upward to separate the wafer and the vehicle.

2. The separation device for cleaning and drying multi-size wafers according to claim 1, wherein A first tool bracket is arranged between the first separation platform and the first tool, and a second tool bracket is arranged between the second separation platform and the second tool.

3. The separation device for cleaning and drying multi-size wafers according to claim 2, characterized in that, The tops of the first tool and the second tool are in the same vertical plane as the bottommost part of the wafer.

4. The separating device for cleaning and drying multi-size wafers according to claim 3, characterized in that, A vehicle bracket is arranged on the bearing platform, and two groups of oppositely arranged limit blocks are arranged on the vehicle bracket, and the vehicle is arranged between the two groups of limit blocks.

5. The separating device for cleaning and drying multi-size wafers according to claim 4, wherein, The first tool bracket, the second tool bracket, and the vehicle bracket are arranged offset in the horizontal direction.

6. A separation method for cleaning and drying multi-size wafers as described in any one of claims 1 to 5, characterized in that, Including the following steps: When separating a large-size wafer and a vehicle, control the first pushing mechanism to open and extend, and push the bearing platform downward to make the first tool and the second tool contact the bottom of the large-size wafer; Control the linear driving component to cooperate with the cam-linkage component to move and drive the tool moving component and the vehicle moving component to move upward synchronously so that the tops of the large-size wafer and the vehicle are at the target reference plane, reaching the initial separation position; Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to continue to move and drive the tool moving assembly to move upward so that the first tool and the second tool can eject the large-size wafer from the carrier and separate it and enter the drying box located above the carrier; The linear drive assembly is controlled to cooperate with the cam connecting rod assembly to move in the opposite direction so that the separation device returns to a state where the large-size wafer and the carrier are in an initial separation position.

7. The separation method for multi-size wafer cleaning and drying according to claim 6, characterized in that The following steps are also included: When separating the small-sized wafer and the carrier, controlling the first pushing mechanism to close and retract, driving the carrying platform to move upward so that the small-sized wafer and the carrier are at the target reference plane and reach the initial separation position; Controlling the second pushing mechanism to open and extend, pushing the first separation platform to move downward so that the first tool avoids the small-sized carrier; Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to drive the tool moving assembly to move upward so that the second tool can eject the small-sized wafer from the carrier and separate it into a drying box located above the carrier; The linear drive assembly is controlled to cooperate with the cam-link assembly to move in the opposite direction, and the second pushing mechanism is controlled to close and retract, so that the separation device returns to a state where the small-size wafer and the carrier are in an initial separation position.

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