Circuit board manufacturing method and device, electronic equipment and storage medium

Abstract

The invention discloses a circuit board manufacturing method and device, electronic equipment and a storage medium. The method comprises the following steps of obtaining a plurality of to-be-windowed hole sites and laser windowing depths in a second board body; according to the laser windowing depth, performing laser windowing on the second plate body through the to-be-windowed hole site; obtaining a circuit board pressing sequence; according to the circuit board pressing sequence, the first board body and the second board body are stacked and combined, lamination curing is carried out, and a to-be-windowed circuit board is obtained; and laminating and curing the circuit board to be windowed to obtain the circuit board. The manufacturing process of the circuit board can be optimized, the yield of the circuit board can be improved, the laser windowing effect of the circuit board can be improved, adverse effects generated by a rigid-flex board inner layer bonding pad resistance welding process in a traditional process can be effectively avoided, the production efficiency of the circuit board can be improved, and the method can be widely applied to the technical field of circuit board production.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board production, and in particular to a circuit board production method, device, electronic equipment and storage medium. Background Art

[0002] At present, in the traditional process of rigid-flex boards in circuit boards, the inner soft board pads must be laminated after solder mask. At the same time, a high-energy laser is used for laser window opening, which is prone to quality problems such as incomplete window opening ink removal and jagged edges. In addition, the traditional process has a long production cycle and has defects such as offset, copper leakage, printing omission, scratches, and oil loss. There is also a risk of ink falling off after the product is uncovered. The product production cost is high, the output is low, and there are many undesirable factors. Summary of the invention

[0003] The main purpose of the embodiments of the present application is to propose a circuit board manufacturing method, device, electronic device and storage medium, which can optimize the manufacturing process of the circuit board, improve the yield of the circuit board, and enhance the laser window opening effect of the circuit board.

[0004] On the one hand, an embodiment of the present application provides a method for manufacturing a circuit board, including a first board body and a second board body, and the method includes the following steps:

[0005] Get the circuit board pressing sequence;

[0006] According to the circuit board pressing sequence, the first board body and the second board body are stacked and combined, and lamination and curing are performed to obtain the circuit board to be opened with a window;

[0007] Obtaining a number of hole positions to be opened and laser window opening depths in the circuit board to be opened;

[0008] According to the laser window opening depth, laser window opening is performed on the circuit board to be windowed through each of the hole positions to be windowed to obtain a circuit board.

[0009] In some embodiments, the method further comprises:

[0010] Acquire multiple component units of the second plate body and a plate body assembly sequence;

[0011] According to the assembly sequence of the plate bodies, the component units are stacked and assembled to obtain the second plate body.

[0012] In some embodiments, the second board body includes a first cover layer, a first soft board body, a first inner pad, a second cover layer, a second soft board body, and a second inner pad, and the second board body is obtained by stacking and combining the component units according to the board body assembly sequence, specifically including:

[0013] According to the board assembly sequence, the first cover layer, the first inner pad, the first soft board body, the second soft board body, the second inner pad and the second soft board body are sequentially stacked and assembled from top to bottom to obtain the second board body.

[0014] In some embodiments, the first plate body includes a first hard plate, a first semi-cured layer, a second hard plate and a second semi-cured layer, and the first plate body and the second plate body are stacked and combined according to the circuit board lamination sequence, and laminated and cured to obtain the circuit board to be opened, specifically including:

[0015] Processing the first hard board and the second hard board, including at least circuit etching and circuit assembly welding;

[0016] According to the circuit board pressing sequence, the processed first hard board, the first semi-cured layer, the processed second board body, the second semi-cured layer and the second hard board are stacked and combined from top to bottom in sequence, laminated and cured, and the circuit board to be opened with windows is obtained.

[0017] In some embodiments, the obtaining of the plurality of hole positions to be opened and the laser window opening depth in the circuit board to be opened specifically includes:

[0018] Acquire a plurality of first hole positions to be opened on the first rigid board and a plurality of second hole positions to be opened on the second rigid board;

[0019] Determine a first laser window opening depth and a second laser window opening depth, wherein the first laser window opening depth is the distance between the upper surface of the first hard board and the upper surface of the first inner layer pad, and the first laser window opening depth is the distance between the lower surface of the second hard board and the lower surface of the second inner layer pad.

[0020] In some embodiments, the laser windowing is performed on the circuit board to be windowed through each of the hole positions to be windowed according to the laser windowing depth to obtain the circuit board, specifically including:

[0021] According to the first laser window opening depth, laser window opening is performed on the circuit board to be windowed using each of the first hole positions to be windowed;

[0022] According to the second laser window opening depth, laser window opening is performed on the circuit board to be windowed using each of the second hole positions to be windowed.

[0023] In some embodiments, the method further comprises:

[0024] The circuit board is processed, including at least sandblasting and gold immersion processing.

[0025] On the other hand, an embodiment of the present application provides a circuit board manufacturing device, the device comprising:

[0026] The first module is used to obtain the pressing sequence of the circuit board;

[0027] The second module is used to stack and combine the first plate body and the second plate body according to the circuit board pressing sequence, perform lamination and curing, and obtain the circuit board to be opened with a window;

[0028] The third module is used to obtain a number of hole positions to be opened and the laser window opening depth in the circuit board to be opened;

[0029] The fourth module is used to perform laser windowing on the circuit board to be windowed through each of the hole positions to be windowed according to the laser windowing depth to obtain a circuit board.

[0030] On the other hand, an embodiment of the present application provides an electronic device, which includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the circuit board manufacturing method described above when executing the computer program.

[0031] On the other hand, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the circuit board manufacturing method described above is implemented.

[0032] The embodiments of the present application include at least the following beneficial effects: the present application provides a circuit board manufacturing method, device, electronic device and storage medium, which obtains a number of hole positions to be opened and laser windowing depth in the second plate body, performs laser windowing on the second plate body through the hole positions to be opened according to the laser windowing depth, obtains the circuit board pressing sequence, and superimposes and combines the first plate body and the second plate body according to the circuit board pressing sequence to obtain the circuit board to be opened, and laminates and solidifies the circuit board to be opened to obtain the circuit board. The present application can optimize the manufacturing process of the circuit board, improve the yield rate of the circuit board, improve the laser windowing effect of the circuit board, effectively avoid the adverse effects of the solder mask process of the inner layer pad of the soft-hard combination board in the traditional process, and improve the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0035] Figure 1 It is a flow chart of a circuit board manufacturing method provided in an embodiment of the present application;

[0036] Figure 2 is a schematic structural diagram of the second plate body in an embodiment of the present application;

[0037] Figure 3 This is a schematic diagram of the structure of the circuit board to be opened in the embodiment of the present application;

[0038] Figure 4 Schematic diagram of the position of the window to be opened in the embodiment of the present application;

[0039] Figure 5 is a schematic diagram of a circuit board in an embodiment of the present application;

[0040] Figure 6 It is a structural schematic diagram of a circuit board manufacturing device provided in an embodiment of the present application;

[0041] Figure 7 It is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of the present application. They are only examples of devices and methods consistent with some aspects of the embodiments of the present application as detailed in the attached claims.

[0043] It is understood that the terms "first", "second", etc. used in this application can be used to describe various concepts in this article, but unless otherwise specified, these concepts are not limited by these terms. These terms are only used to distinguish one concept from another concept. For example, without departing from the scope of the embodiment of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the words "if" and "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determination".

[0044] The terms "at least one", "multiple", "each", "any", etc. used in this application, at least one includes one, two or more, multiple includes two or more, each refers to each of the corresponding multiple, and any refers to any one of the multiple.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0046] Before describing the embodiments of the present application in detail, some nouns and terms involved in the embodiments of the present application are first described. The nouns and terms involved in the embodiments of the present application are subject to the following explanations.

[0047] 1) SMT tinning: SMT tinning refers to the process of using a solder paste printer to print a layer of solder paste on the PCB (printed circuit board) during the SMT (surface mount technology) process, and then sticking the electronic components to the PCB through the equipment, and fixing the components on the PCB through reflow soldering.

[0048] Reference Figure 1 , Figure 1 It is an optional flow chart of a circuit board manufacturing method provided in an embodiment of the present application, including a first board body and a second board body. The method may include but is not limited to steps S101 to S105:

[0049] Step S101, obtaining a circuit board pressing sequence;

[0050] Step S102, according to the circuit board pressing sequence, the first board body and the second board body are stacked and combined, and lamination and curing are performed to obtain the circuit board to be opened with a window;

[0051] Step S103, obtaining a number of hole positions to be opened in the circuit board to be opened and the laser opening depth;

[0052] Step S104, laser windowing is performed on the circuit board to be windowed through each hole to be windowed according to the laser windowing depth to obtain a circuit board.

[0053] In some embodiments, the circuit board manufacturing method may also include but is not limited to steps S201 to S202:

[0054] Step S201, obtaining a plurality of component units of a second board and a board assembly sequence;

[0055] Step S202: According to the assembly order of the board bodies, the component units are stacked and assembled to obtain a second board body.

[0056] In step S202 of some embodiments, the second board body includes a first covering layer, a first soft board body, a first inner layer pad, a second covering layer, a second soft board body and a second inner layer pad. Specifically, according to the board body combination order, the first covering layer, the first inner layer pad, the first soft board body, the second soft board body, the second inner layer pad and the second soft board body are stacked and combined from top to bottom in sequence to obtain the second board body. Specifically, the first covering layer, the first soft board body and the first inner layer pad constitute the first soft board. Similarly, the second covering layer, the second soft board body and the second inner layer pad constitute the second soft board. Both the first soft board and the second soft board are flexible circuit boards. The first covering layer and the second covering layer are covering films on the surface of the flexible circuit board. The first inner layer pad and the second inner layer pad are inner layer pads of the flexible circuit board.

[0057] In some embodiments, reference Figure 2 , Figure 2 It is an optional structural schematic diagram of the second board body in the embodiment of the present application, which includes a first covering layer 1, a first inner layer pad 2, a first soft board body 3, a second soft board body 4, a second inner layer pad 5, and a second inner layer covering layer 6. The first covering layer 1, the first inner layer pad 2, the first soft board body 3, the second soft board body 4, the second inner layer pad 5, and the second inner layer covering layer 6 are stacked and combined from top to bottom in sequence to obtain a second board body 7.

[0058] In some embodiments, a photolithography laser machine is used to use laser energy to control the depth of cutting of the first covering layer and the second covering layer in the second board body, thereby etching away the first covering layer and the second covering layer to expose the required first inner layer pads and the second inner layer pads, so as to facilitate SMT tinning parts during subsequent assembly, and then the second board body with the exposed inner layer pads is laminated and cured with the first hard board, the first semi-cured layer, the second hard board and the second semi-cured layer.

[0059] In some embodiments, the first board includes a first hard board, a first semi-cured layer, a second hard board and a second semi-cured layer, and step S102 may include but is not limited to steps S301 to S302:

[0060] Step S301, processing the first hard board and the second hard board, including at least circuit etching and circuit assembly welding;

[0061] Step S302, according to the circuit board pressing sequence, the processed first hard board, the first semi-cured layer, the processed second board body, the second semi-cured layer and the second hard board are sequentially stacked and combined from top to bottom, and laminated and cured to obtain the circuit board to be opened.

[0062] In some embodiments, the required circuits are etched on the first hard board and the second hard board through the reaction of the dry film and the chemical solution to complete the circuit etching, and the ink is printed on the etched circuits in the first hard board and the second hard board through a screen. After the ink reacts with the chemical solution and solidifies, the circuit assembly welding is completed to achieve the effect of protecting the circuit and effectively preventing oxidation and scratching.

[0063] In some embodiments, lamination and curing are performed by high temperature and high pressure using a laminator, and both the first hard board and the second hard board are rigid circuit boards, such as copper clad boards. Optionally, both the first semi-cured layer and the second semi-cured layer are PP sheets.

[0064] Reference Figure 3 , Figure 3 It is an optional structural schematic diagram of a circuit board to be opened with a window in an embodiment of the present application, including a first hard board 8, a first semi-cured layer 9, a second board body 7, a second semi-cured layer 10 and a second hard board 11. The first hard board 8, the first semi-cured layer 9, the second board body 7, the second semi-cured layer 10 and the second hard board 11 are stacked and combined from top to bottom in sequence, laminated and cured, to obtain the circuit board to be opened with a window.

[0065] In some embodiments, step S103 may include but is not limited to steps S401 to S402:

[0066] Step S401, obtaining a plurality of first hole positions to be opened on a first hard board and a plurality of second hole positions to be opened on a second hard board;

[0067] Step S402, determine the first laser window opening depth and the second laser window opening depth, wherein the first laser window opening depth is the distance between the upper surface of the first hard board and the upper surface of the first inner layer pad, and the first laser window opening depth is the distance between the lower surface of the second hard board and the lower surface of the second inner layer pad.

[0068] In some embodiments, reference Figure 4 , Figure 4 It is an optional schematic diagram of the hole positions to be opened in the embodiment of the present application, wherein the first hard board 8 has multiple hole positions 12 to be opened, and the second hard board 11 also has multiple hole positions 12 to be opened. Laser opening is performed on the circuit board to be opened through the multiple hole positions to be opened.

[0069] In some embodiments, when laser windowing is performed on a circuit board to be windowed, the corresponding laser device output power is determined based on the first laser windowing depth and the second laser windowing depth, so that the windowing depth error is within a preset error range. After laser windowing, the exposed portions of the first inner layer solder pad and the second inner layer solder pad are subjected to oxidation, carbonization and over-sandblasting treatments to avoid solder pad cuts, oxidation, carbonization, CV residual adhesive sticking to the copper surface, etc., which may cause quality risks.

[0070] In some embodiments, step S104 may include but is not limited to steps S501 to S502:

[0071] Step S501, laser windowing is performed on the circuit board to be windowed using each first hole position to be windowed according to the first laser windowing depth;

[0072] Step S502 , laser windowing is performed on the circuit board to be windowed using each second hole position to be windowed according to the second laser windowing depth.

[0073] In some embodiments, reference Figure 5 , Figure 5 It is an optional schematic diagram of the circuit board in the embodiment of the present application, wherein, according to the first laser window opening depth, a photolithography laser machine is used to open circuit windows on the circuit board through multiple first window opening holes, using laser energy to expose the first inner layer pads 2 required in the circuit board, and obtain multiple first through holes 13, the hole depth of the first through holes 13 is consistent with the first laser window opening depth, and then the circuit board is flipped over. Similarly, according to the first laser window opening depth, a photolithography laser machine is used to open circuit windows on the circuit board through multiple second window opening holes, using laser energy to expose the second inner layer pads 5 required in the circuit board, and obtain multiple second through holes 14, the hole depth of the second through holes 14 is consistent with the second laser window opening depth.

[0074] In some embodiments, the circuit board manufacturing method may further include step S601:

[0075] Step S601, processing the circuit board, including at least sandblasting and immersion gold processing.

[0076] In some embodiments, after laser window opening is performed on the circuit board, the circuit board is sandblasted and gold plated. Specifically, sandblasting is used to clean the carbon powder left on the surface of the circuit board during laser window opening to increase the cleanliness and roughness of the board surface. The gold plated treatment is specifically as follows: surface treatment is performed on the first inner layer pad and the second inner layer pad that need to be punched in the circuit board, and gold is plated on the inner layer pad. Gold can effectively block copper metal and air to prevent oxidation, thereby increasing welding performance.

[0077] Reference Figure 6 , Figure 6 : is an optional structural diagram of a circuit board manufacturing device provided in an embodiment of the present application, the device is used to implement the above-mentioned circuit board manufacturing method, and the device may include:

[0078] The first module is used to obtain the pressing sequence of the circuit board;

[0079] The second module is used to stack and combine the first plate body and the second plate body according to the circuit board pressing sequence, perform lamination and curing, and obtain the circuit board to be opened;

[0080] The third module is used to obtain a number of hole positions to be opened in the circuit board to be opened and the laser window opening depth;

[0081] The fourth module is used to perform laser windowing on the circuit board to be windowed through each hole to be windowed according to the laser windowing depth to obtain the circuit board.

[0082] It can be understood that the contents of the above method embodiments are all applicable to the present device embodiments, the functions specifically implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0083] The embodiment of the present application also provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the above-mentioned circuit board manufacturing method when executing the computer program. The electronic device can be any smart terminal including a tablet computer.

[0084] It can be understood that the contents of the above method embodiments are all applicable to the present device embodiments, the functions specifically implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0085] See also Figure 7 , Figure 7 The hardware structure of an electronic device of another embodiment is illustrated, and the electronic device includes:

[0086] The processor 901 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0087] The memory 902 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 902 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 902, and the processor 901 calls and executes the circuit board manufacturing method of the embodiment of this application;

[0088] Input / output interface 903, used to implement information input and output;

[0089] Communication interface 904, used to realize communication interaction between the device and other devices, which can be realized by wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.);

[0090] A bus 905 that transmits information between various components of the device (e.g., the processor 901, the memory 902, the input / output interface 903, and the communication interface 904);

[0091] The processor 901 , the memory 902 , the input / output interface 903 and the communication interface 904 are connected to each other in communication within the device via a bus 905 .

[0092] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the above-mentioned circuit board manufacturing method is implemented.

[0093] It can be understood that the contents of the above method embodiments are all applicable to the present storage medium embodiments, the functions specifically implemented by the present storage medium embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0094] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0095] The embodiments of the present application provide a circuit board manufacturing method, device, electronic device and storage medium, which obtains a number of hole positions to be opened and laser windowing depth in a second plate body, performs laser windowing on the second plate body through the hole positions to be opened according to the laser windowing depth, obtains the circuit board pressing sequence, and superimposes and combines the first plate body and the second plate body according to the circuit board pressing sequence to obtain the circuit board to be opened, and laminates and solidifies the circuit board to be opened to obtain the circuit board. The embodiments of the present application can optimize the manufacturing process of the circuit board, improve the yield rate of the circuit board, enhance the laser windowing effect of the circuit board, effectively avoid the adverse effects of the solder mask process of the inner layer pad of the soft-hard combination board in the traditional process, and improve the production efficiency of the circuit board.

[0096] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0097] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0098] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0099] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0100] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0101] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0102] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0103] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0104] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0105] It should be appreciated that embodiments of the present invention may be implemented or enforced by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer-readable memory. The method may be implemented in a computer program using standard programming techniques including a non-transitory computer-readable storage medium configured with a computer program, wherein the storage medium so configured causes the computer to operate in a specific and predefined manner - according to the methods and drawings described in the specific embodiments. Each program may be implemented in a high-level procedural or object-oriented programming language to communicate with a computer system. However, if desired, the program may be implemented in an assembly or machine language. In any case, the language may be a compiled or interpreted language. In addition, the program may be run on a programmed ASIC for this purpose.

[0106] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0107] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A method for manufacturing a circuit board, characterized in that: Comprising a first plate body and a second plate body, the method comprises the following steps: Get the circuit board pressing sequence; According to the circuit board pressing sequence, the first board body and the second board body are stacked and combined, and lamination and curing are performed to obtain the circuit board to be opened with a window; Obtaining a number of hole positions to be opened and laser window opening depths in the circuit board to be opened; According to the laser window opening depth, laser window opening is performed on the circuit board to be windowed through each of the hole positions to be windowed to obtain a circuit board.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The method further comprises: Acquire multiple component units of the second plate body and a plate body assembly sequence; According to the assembly sequence of the plate bodies, the component units are stacked and assembled to obtain the second plate body.

3. The method for manufacturing a circuit board according to claim 2, characterized in that: The second board body comprises a first covering layer, a first soft board body, a first inner pad, a second covering layer, a second soft board body and a second inner pad. The second board body is obtained by stacking and combining the component units according to the board body assembly sequence, specifically comprising: According to the board assembly sequence, the first cover layer, the first inner pad, the first soft board body, the second soft board body, the second inner pad and the second soft board body are sequentially stacked and assembled from top to bottom to obtain the second board body.

4. The method for manufacturing a circuit board according to claim 3, characterized in that: The first plate body includes a first hard plate, a first semi-cured layer, a second hard plate and a second semi-cured layer. The first plate body and the second plate body are stacked and combined according to the circuit board lamination sequence, and laminated and cured to obtain the circuit board to be opened. Specifically, the method includes: Processing the first hard board and the second hard board, including at least circuit etching and circuit assembly welding; According to the circuit board pressing sequence, the processed first hard board, the first semi-cured layer, the processed second board body, the second semi-cured layer and the second hard board are stacked and combined from top to bottom in sequence, laminated and cured, and the circuit board to be opened with windows is obtained.

5. The method for manufacturing a circuit board according to claim 4, characterized in that: The step of obtaining a plurality of hole positions to be opened in the circuit board to be opened and a laser window opening depth specifically includes: Acquire a plurality of first hole positions to be opened on the first rigid board and a plurality of second hole positions to be opened on the second rigid board; Determine a first laser window opening depth and a second laser window opening depth, wherein the first laser window opening depth is the distance between the upper surface of the first hard board and the upper surface of the first inner layer pad, and the first laser window opening depth is the distance between the lower surface of the second hard board and the lower surface of the second inner layer pad.

6. The method for manufacturing a circuit board according to claim 5, characterized in that: According to the laser windowing depth, laser windowing is performed on the circuit board to be windowed through each of the hole positions to be windowed to obtain the circuit board, specifically comprising: According to the first laser window opening depth, laser window opening is performed on the circuit board to be windowed using each of the first hole positions to be windowed; According to the second laser window opening depth, laser window opening is performed on the circuit board to be windowed using each of the second hole positions to be windowed.

7. The method for manufacturing a circuit board according to claim 6, characterized in that: The method further comprises: The circuit board is processed, including at least sandblasting and gold immersion processing.

8. A circuit board manufacturing device, characterized in that: The device comprises: The first module is used to obtain the pressing sequence of the circuit board; The second module is used to stack and combine the first plate body and the second plate body according to the circuit board pressing sequence, perform lamination and curing, and obtain the circuit board to be opened with a window; The third module is used to obtain a number of hole positions to be opened and the laser window opening depth in the circuit board to be opened; The fourth module is used to perform laser windowing on the circuit board to be windowed through each of the hole positions to be windowed according to the laser windowing depth to obtain a circuit board.

9. An electronic device, characterized in that: The electronic device comprises a memory and a processor, the memory stores a computer program, and the processor implements the circuit board manufacturing method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the circuit board manufacturing method according to any one of claims 1 to 7 is implemented.

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