Processing method for avoiding deformation of elliptical hole in PCB (Printed Circuit Board)

Abstract

The invention discloses a processing method for avoiding deformation of an elliptical hole in a PCB (Printed Circuit Board), which comprises the following steps of: acquiring the PCB, and processing a guide hole in advance before the elliptical hole is processed; on the basis of the guide hole, further processing the elliptical hole, forming the elliptical hole in the PCB, and making the elliptical hole accord with the design size based on the guide hole; in the process of machining the oval hole in the PCB, the guide hole is preset, the oval hole is drilled based on the guide hole, deviation of the hole position and overall deformation of the oval hole are prevented, the consumable cost of the PCB is reduced, and the production quality and the manufacturing precision are improved; the method is simple and easy to implement, easy integration can be achieved in an existing PCB manufacturing process, additional equipment and cost do not need to be added, the position and size of the guide hole can be adjusted according to actual needs, and the method is suitable for oval holes of different sizes and shapes and has wide applicability.

Description

Technical Field

[0001] The invention relates to the technical field of PCB processing, and in particular to a processing method for preventing an elliptical hole on a PCB from deforming. Background Art

[0002] PCB (Printed Circuit Board) is a substrate used to connect and support electronic components in electronic devices. It realizes the electrical connection between electronic components by printing conductive lines on insulating materials. PCB is an indispensable part of modern electronic devices and is widely used in various electronic products, such as computers, mobile phones, televisions, cars, etc.

[0003] In the manufacturing process of PCB boards, drilling is an important process. Especially for some applications that require high precision, such as high-frequency communication, precision sensors, etc., the demand for elliptical holes is increasing. However, in the drilling process, the elliptical holes are often prone to deformation due to overlapping drilling during drilling production, which affects the performance and quality of the product. The existing technology is to pre-determine the position of the elliptical hole under high-precision equipment, and then directly process the two ends of the elliptical hole, and then drill inward along the two ends until the elliptical hole is drilled. However, the above processing method is prone to offset, resulting in the entire elliptical hole position offset and deformation. Therefore, a reasonable method for processing elliptical holes on PCB boards is urgently needed to solve the above-mentioned technical problems. Summary of the invention

[0004] In view of the disadvantage that the oval hole in the above-mentioned technology is easily offset and deformed during processing, the present invention provides a processing method for preventing the oval hole on the PCB board from being deformed.

[0005] To achieve the above object, the present invention provides a processing method for preventing deformation of an elliptical hole on a PCB board, comprising the following steps: Obtain a PCB board, and pre-process a guide hole before processing the elliptical hole; On the basis of the guide hole, the elliptical hole is further processed to form an elliptical hole on the PCB board, and the elliptical hole is made to meet the design size based on the guide hole.

[0006] As an improved solution of the present invention, the processing steps of the guide hole include: According to the designed size and position of the elliptical hole, a first guide hole and a second guide hole are respectively processed at both ends of the major axis or the minor axis of the elliptical hole.

[0007] As an improved solution of the present invention, the processing step of drilling the elliptical hole based on the guide hole includes: S1, based on the first guide hole and the second guide hole, processing a first circular hole and a second circular hole according to design dimensions; S2, machining a new circular hole along the major axis or the minor axis between the first circular hole and the second circular hole; Repeat steps S1 and S2 until no new circular holes can be formed, and then remove the remaining burrs of the plate between adjacent circular holes to form the complete elliptical hole.

[0008] As an improved solution of the present invention, the diameter of the guide hole is smaller than the minimum diameter of the elliptical hole.

[0009] As an improved solution of the present invention, the drilling depth of the guide hole is greater than or equal to the drilling depth of the elliptical hole.

[0010] As an improved solution of the present invention, after the elliptical hole is processed, the PCB board is cleaned and inspected to ensure the quality of the PCB board.

[0011] As an improved solution of the present invention, the equipment for processing the elliptical hole includes a drilling machine or a laser processing equipment.

[0012] As an improved solution of the present invention, the PCB board is cleaned mainly by airflow, vacuum cleaning, and non-destructive cleaning agents.

[0013] As an improved solution of the present invention, the size and shape of the elliptical hole of the PCB board, the surface flatness of the PCB board, and the continuity of the circuit are detected.

[0014] The beneficial effects of the present invention are as follows: compared with the prior art, the present invention provides a processing method for avoiding deformation of an elliptical hole on a PCB board. In the process of processing an elliptical hole on a PCB board, a guide hole is preset and an elliptical hole is drilled based on the guide hole, thereby preventing the hole position from being offset and the overall deformation of the elliptical hole, reducing the consumables cost of the PCB board, and improving the production quality and manufacturing accuracy. The method of the present invention is simple and easy to implement, and can be easily integrated into the existing PCB manufacturing process without adding additional equipment and costs. In addition, the position and size of the guide hole can be adjusted according to actual needs, and is suitable for elliptical holes of different sizes and shapes, and has wide applicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a process flow chart of the present invention; Figure 2 It is a schematic diagram of the processing steps of the present invention.

[0016] The main component symbols are explained as follows: 1. Elliptical hole; 2. First guide hole; 3. Second guide hole; 4. First circular hole; 5. Second circular hole; 6. Third circular hole; 7. Fourth circular hole; 8. Burr; 9. PCB board. DETAILED DESCRIPTION

[0017] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0018] In the following description, the example details are given to provide a deeper understanding of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. It should be understood that the specific embodiments are only used to explain the present invention and are not used to limit the present invention.

[0019] It should be understood that when the terms "include" and / or "comprises" are used in this specification, they indicate the existence of the stated features, integers, steps, operations, elements or components, but do not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0020] See also Figure 1-Figure 2 The present invention provides a processing method for preventing deformation of an elliptical hole on a PCB board, comprising the following steps: Obtain a PCB board 9, and pre-process a guide hole before processing the elliptical hole 1; On the basis of the guide hole, an elliptical hole 1 is further processed to form an elliptical hole 1 on the PCB board 9, and the elliptical hole 1 is made to meet the design size based on the guide hole; as for the processing equipment, high-precision processing equipment such as a drilling machine or laser processing equipment is generally used. On the basis of the guide hole, the elliptical hole 1 is further processed. Due to the existence of the guide hole, the position of the hole drilled in the PCB board 9 is fixed, and the subsequent processing will be guided and constrained by the guide hole, thereby reducing the deformation and dislocation of the elliptical hole 1.

[0021] In one embodiment of the present invention, the processing step of the guide hole specifically includes: According to the design size and position of the elliptical hole 1, the first guide hole 2 and the second guide hole 3 are respectively processed at the two ends of the major axis or minor axis of the elliptical hole 1. By pre-processing the first guide hole 2 and the second guide hole 3, the position of the elliptical hole 1 is fixed. In subsequent processing, the elliptical hole 1 can be accurately processed based on the guidance and constraint of the first guide hole 2 and the second guide hole 3.

[0022] In a further processing scheme, the processing steps of drilling the elliptical hole 1 based on the guide hole specifically include: S1, based on the first guide hole and the second guide hole, a first circular hole and a second circular hole are processed according to the design size. The first guide hole 2 and the second guide hole 3 can not only reduce the force on the PCB board, but also ensure the accuracy when processing the circular holes to prevent deviation; S2, machining a new circular hole along the major axis or the minor axis between the first circular hole and the second circular hole; Repeating steps S1 and S2 until no new circular holes can be formed, removing the remaining burrs of the plate between adjacent circular holes to form the complete elliptical hole; When processing circular holes, each circular hole is tangent to the hole wall of the elliptical hole 1 to achieve maximum processing efficiency. Since there are still unremoved burrs or burrs 8 on the wall surface of the hole between adjacent circular holes, and these burrs 8 will affect the product quality of the PCB board and have a certain impact on the conduction of the circuit and component units, it is necessary to remove the residual burrs 8 between adjacent circular holes. The size of the first circular hole 4, the second circular hole 5, the third circular hole 6 and the fourth circular hole and the subsequent processing of new circular holes are tangent to the elliptical hole 1, which can save the time of cleaning the burrs 8 and improve the processing efficiency.

[0023] The diameter of the guide hole is smaller than the minimum diameter of the elliptical hole 1. It can be understood that in the actual processing process, the diameter of the guide hole should be slightly smaller than the minimum diameter of the elliptical hole 1, so as to increase the guidance of the guide hole and ensure that when drilling the elliptical hole 1, the drill can further expand the diameter of the hole based on the guide hole until it meets the design size requirements.

[0024] In this embodiment, the drilling depth of the guide hole is greater than or equal to the drilling depth of the elliptical hole 1, so that the processing guidance of the guide hole is stronger. If the depth of the guide hole is less than the depth of the elliptical hole 1, the elliptical hole 1 needs to be further processed, and the subsequent processing will most likely cause deformation and dislocation of the elliptical hole 1.

[0025] In this embodiment, after the oval hole processing is completed, the PCB board is cleaned and inspected to ensure the quality of the PCB board. Since the oval hole is processed on the PCB, there will be a lot of debris on the board surface that cannot be observed by the naked eye. At this time, it is necessary to remove it through a specific method to avoid circuit breaking and affecting the accuracy of subsequent detection. The oval hole also needs to be inspected to observe whether it meets the design size and whether there is a large processing error, so as to avoid the quality and performance of the PCB board being reduced due to the oval hole size being too large or too small, affecting the circuit connectivity.

[0026] In this embodiment, the equipment for processing the elliptical hole includes a drilling machine or a laser processing equipment.

[0027] In this embodiment, the PCB board is cleaned mainly by airflow, vacuum cleaning, and non-destructive cleaning agents. Both airflow and vacuum cleaning can effectively blow away and adsorb most of the processing chips and residues, while non-destructive cleaning agents can further clean smaller debris in depth.

[0028] In this embodiment, the size and shape of the elliptical hole of the PCB board, the surface flatness of the PCB board, and the continuity of the circuit are detected. The size and shape of the elliptical hole must be consistent with those on the design drawing. It can be measured by a microscope, a transmission electron microscope, a profilometer or other high-precision measuring instruments to ensure the performance of the PCB board. The flatness of the surface of the PCB board needs to be detected to prevent the flatness of the PCB board from changing or bending due to drilling the elliptical hole. Specifically, a surface roughness meter or a laser scanner can be used for detection.

[0029] The following are examples of implementation scenarios involved in the present invention: Embodiment 1: For a high-frequency communication PCB, it is necessary to drill an elliptical hole 1 with a length of 3.0mm and a width of 2.0mm. Before drilling, first drill a guide hole with a diameter of 1.5mm at both ends of the long axis of the elliptical hole 1. The depth of the guide hole is set to 1.5mm, the same as the production board height. Then, based on the guide hole, use high-precision drilling equipment to drill the elliptical hole 1. After drilling, necessary cleaning and testing are carried out to ensure the manufacturing quality and performance of the PCB.

[0030] Embodiment 2: For a precision sensor PCB, it is necessary to drill an elliptical hole 1 with a length of 5.0mm and a width of 3.0mm. Before drilling, first drill a guide hole with a diameter of 2.0mm at each end of the short axis of the elliptical hole 1. The depth of the guide hole can be set to 1.0mm, the same as the production board. Then, based on the guide hole, the elliptical hole 1 is drilled. Subsequent processing also includes cleaning and testing to ensure that the PCB meets manufacturing requirements.

[0031] It can be seen from the above embodiments that the guide hole adding method of the present invention can effectively improve the deformation problem of the elliptical hole 1 during the PCB drilling process, improve the manufacturing accuracy and quality of the product, and has broad application prospects.

[0032] The advantages of the present invention are: 1) In the process of elliptical hole processing on PCB board, the elliptical hole is drilled based on the preset guide hole to prevent the deviation of the hole position and the overall deformation of the elliptical hole, reduce the consumables cost of PCB board, and improve the production quality and manufacturing accuracy 2) The position and size of the guide hole can be adjusted according to actual needs. It is suitable for elliptical holes of different sizes and shapes and has a wide range of applicability.

[0033] 3) The method is simple and easy to implement and can be easily integrated into the existing PCB manufacturing process without adding additional equipment and costs.

[0034] The above disclosures are only several specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A processing method for preventing deformation of an elliptical hole on a PCB, characterized in that: The following steps are involved: Obtain a PCB board, and pre-process a guide hole before processing the elliptical hole; On the basis of the guide hole, the elliptical hole is further processed to form an elliptical hole on the PCB board, and the elliptical hole is made to meet the design size based on the guide hole.

2. A processing method for avoiding deformation of an elliptical hole on a PCB according to claim 1, characterized in that: The processing steps of the guide hole include: According to the designed size and position of the elliptical hole, a first guide hole and a second guide hole are respectively processed at both ends of the major axis or the minor axis of the elliptical hole.

3. A processing method for avoiding deformation of an elliptical hole on a PCB according to claim 2, characterized in that: The processing steps of drilling the elliptical hole based on the guide hole include: S1, based on the first guide hole and the second guide hole, processing a first circular hole and a second circular hole according to design dimensions; S2, machining a new circular hole along the major axis or the minor axis between the first circular hole and the second circular hole; Repeat steps S1 and S2 until no new circular holes can be formed, and then remove the remaining burrs of the plate between adjacent circular holes to form the complete elliptical hole.

4. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 2, characterized in that: The diameter of the guide hole is smaller than the minimum diameter of the elliptical hole.

5. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 2, characterized in that: The drilling depth of the guide hole is greater than or equal to the drilling depth of the elliptical hole.

6. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 2, characterized in that: The equipment for processing the elliptical hole includes a drilling machine or a laser processing equipment.

7. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 3, characterized in that: After the oval hole is processed, the PCB board is cleaned and inspected to ensure the quality of the PCB board.

8. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 7, characterized in that: The PCB board is cleaned mainly by airflow, vacuum cleaning and non-destructive cleaning agents.

9. A processing method for preventing deformation of an elliptical hole on a PCB according to claim 7, characterized in that: The size and shape of the oval holes on the PCB board, as well as the surface flatness and circuit continuity of the PCB board are tested.

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