Vacuum gauge heat dissipation system and PECVD (plasma enhanced chemical vapor deposition) equipment

Abstract

The invention discloses a vacuum gauge heat dissipation system and PECVD equipment, the heat dissipation system comprises a vacuum gauge body and a pipeline connected with the vacuum gauge body, and the heat dissipation system further comprises a first heat dissipation device arranged on the surface of the pipeline. The first heat dissipation device is arranged on the surface of the pipeline, so that the temperature of the pipeline can be reduced, the heat radiation degree of the vacuum gauge is reduced, the heat dissipation effect of the vacuum gauge can be improved, and the process stability of the PECVD equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a vacuum gauge heat dissipation system and PECVD equipment. Background Art

[0002] A vacuum gauge is an instrument used to measure the vacuum degree or air pressure, mainly by measuring the changes in certain physical effects under different air pressures. In the PECVD (Plasma Enhanced Chemical Vapor Deposition) system, the vacuum gauge is used in the pressure control system in the reaction chamber. When there is no reaction in the chamber, the vacuum gauge reading is a vacuum state between 0.0005-0.003.

[0003] In existing PECVD systems, the heat-resistant temperature of a vacuum gauge using 10 torr (Tor, a unit of pressure, mainly used to indicate the degree of vacuum) usually needs to be controlled below 40°C. However, in conventional liquid source machines, the pipelines through which the liquid source in the reaction source flows generally need to be insulated by heating belts and other means to prevent the liquid source from condensing. The vacuum gauge in the pressure control system is close to the heating belt of the pipeline, and under the relatively closed conditions of the machine installation enclosure, the surface temperature of the vacuum gauge usually rises due to thermal radiation. The increase in the temperature of the vacuum gauge will cause deviations in the machine pressure control, thereby affecting the stability of the process and the repeatability of the machine.

[0004] like Figure 1 As shown in Table 1, when the temperature of different points of the vacuum gauge is detected, it is the detected temperature of each point when the machine is idle and the detected temperature of each point in the process. It can be seen that the maximum temperature of the vacuum gauge when the machine is idle can reach 49°C, while in the process, the maximum temperature of the vacuum gauge can reach 52°C, which exceeds the safe operating temperature of the vacuum gauge (i.e., below 40°C). This can easily lead to inaccurate pressure control of PECVD equipment, and then lead to inaccurate pressure control, thereby affecting the stability of the process and equipment.

[0005]

[0006] Table 1

[0007] Therefore, how to improve the heat dissipation effect of the vacuum gauge and thereby ensure the overall equipment process stability is a problem that technical personnel in this field need to solve. Summary of the invention

[0008] The embodiments of the present invention provide a vacuum gauge heat dissipation system and a PECVD device, aiming to improve the heat dissipation effect of the vacuum gauge, thereby improving the process stability of the PECVD device.

[0009] An embodiment of the present invention provides a vacuum gauge heat dissipation system, comprising a vacuum gauge body and a pipeline connected to the vacuum gauge body, the heat dissipation system further comprising:

[0010] The first heat dissipation device is arranged on the surface of the pipeline.

[0011] Furthermore, the first heat dissipation device is a heat dissipation fin.

[0012] Furthermore, the heat dissipation fins are circumferentially arranged on the surface of the pipeline.

[0013] Furthermore, the heat dissipation fins are radially arranged on the surface of the pipeline.

[0014] Furthermore, the heat dissipation fins and the pipeline are integrally arranged.

[0015] Furthermore, the surface area of ​​the heat dissipation fins is 5-6 times the surface area of ​​the pipeline.

[0016] Furthermore, the distance between adjacent fins in the heat dissipation fins is 2-3 times the thickness of each fin.

[0017] An embodiment of the present invention further provides a PECVD device, comprising the vacuum gauge heat dissipation system as described in any one of the above items.

[0018] Furthermore, it also includes a machine enclosure, and a second heat dissipation device is provided on a side of the machine enclosure close to the vacuum gauge body.

[0019] Furthermore, the second heat dissipation device is a fan.

[0020] The embodiment of the present invention provides a vacuum gauge heat dissipation system and a PECVD device, wherein the heat dissipation system includes a vacuum gauge body and a pipeline connected to the vacuum gauge body, and the heat dissipation system further includes: a first heat dissipation device, which is arranged on the surface of the pipeline. The embodiment of the present invention arranges the first heat dissipation device on the surface of the pipeline, so that the temperature of the pipeline itself can be reduced, thereby reducing the degree of heat radiation received by the vacuum gauge, thereby improving the heat dissipation effect of the vacuum gauge, thereby improving the process stability of the PECVD device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0022] Figure 1This is a schematic diagram of temperature detection of a vacuum gauge;

[0023] Figure 2 A schematic diagram of the structure of a vacuum gauge heat dissipation system provided by an embodiment of the present invention;

[0024] Figure 3 Another structural schematic diagram of a vacuum gauge heat dissipation system provided by an embodiment of the present invention;

[0025] Figure 4 A schematic diagram of the structure of a machine enclosure in a PECVD device provided in an embodiment of the present invention;

[0026] Figure 5 An example diagram of experimental results of a vacuum gauge heat dissipation system provided by an embodiment of the present invention;

[0027] Figure 6 Another example diagram of experimental results of a vacuum gauge heat dissipation system provided in an embodiment of the present invention.

[0028] Markings in the figure:

[0029] 1. Vacuum gauge body;

[0030] 2. Pipeline; 21. First heat dissipation device;

[0031] 3. Machine enclosure; 31. Second heat dissipation device. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0034] It should also be understood that the terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the specification of the present invention and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0035] It should be further understood that the term "and / or" used in the present description and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0036] See below Figure 2 and Figure 3 The embodiment of the present invention provides a vacuum gauge heat dissipation system, comprising a vacuum gauge body 1 and a pipeline 2 connected to the vacuum gauge body 1, and the heat dissipation system further comprises:

[0037] The first heat dissipation device 21 is disposed on the surface of the pipeline 2 .

[0038] In this embodiment, by setting a first heat dissipation device 21 on the surface of the pipeline 2, the temperature of the pipeline 2 itself can be reduced, thereby reducing the degree of heat radiation received by the vacuum gauge, thereby improving the heat dissipation effect of the vacuum gauge and thus improving the process stability of the PECVD equipment.

[0039] In one embodiment, the first heat dissipation device 21 is a heat dissipation fin.

[0040] This embodiment uses heat dissipation fins as the first heat dissipation device 21, which can not only improve the heat exchange efficiency, but also reduce the energy consumption of the entire system. Preferably, the surface of the heat dissipation fins can be further coated with heat dissipation materials to enhance the heat dissipation performance and ensure the stable operation of the PECVD equipment in a high temperature environment. On this basis, the structural design also has the advantages of easy maintenance and replacement, which provides a guarantee for the long-term stable operation of the equipment. Of course, in other embodiments, other devices with heat dissipation effects can also be used to dissipate heat and cool the pipeline 2, such as setting a water cooling device on the surface of the pipeline 2, etc.

[0041] Specifically, the heat sink fins and the pipeline 2 are integrated. The integrated arrangement can reduce the difficulty of installing the heat sink fins and reduce the complexity of the pipeline 2 system, making the overall structure more compact and convenient for arrangement in a small equipment space. In addition, the integrated design also helps to improve the airtightness of the system, avoid leakage problems caused by poor bonding, and ensure the normal operation of the PECVD equipment in a vacuum environment.

[0042] In a specific embodiment, the heat dissipation fins are circumferentially arranged on the surface of the pipeline 2 .

[0043] like Figure 2As shown, the circumferential arrangement is adopted to evenly distribute the heat dissipation fins on the surface of the pipe 2, which increases the heat dissipation area, effectively improves the heat flow distribution, and improves the heat exchange efficiency. At the same time, this layout is also conducive to air flow, reduces the internal temperature gradient of the equipment caused by poor heat dissipation, and further improves the overall performance and reliability of the PECVD equipment. On this basis, the heat dissipation system can also reduce the noise and vibration during the operation of the equipment, providing users with a quieter working environment.

[0044] In another specific embodiment, the heat dissipation fins are radially arranged on the surface of the pipeline 2 .

[0045] like Figure 3 As shown, the radial arrangement is adopted to evenly distribute the heat dissipation fins on the surface of the pipe 2, which not only optimizes the heat exchange efficiency, but also reduces the accumulation of heat by increasing the heat dissipation surface area, thereby ensuring the stability of the PECVD equipment in continuous operation. In addition, the radially designed heat dissipation fins are easy to clean and maintain, which reduces the failure rate in long-term operation and prolongs the service life of the equipment. The design of the radially arranged heat dissipation fins also takes into account the adaptability of the equipment under variable working conditions. Its structure can flexibly cope with different temperature and pressure conditions, ensuring that the PECVD equipment still maintains efficient heat dissipation performance in complex environments.

[0046] In one embodiment, the surface area of ​​the heat dissipation fins is 5-6 times the surface area of ​​the pipeline 2 .

[0047] The distance between adjacent fins in the heat dissipation fins is 2-3 times the thickness of each fin.

[0048] In this embodiment, the surface area of ​​the heat dissipation fin is set to 5-6 times the surface area of ​​the pipeline 2, for example, the surface area of ​​the heat dissipation fin is 5 times the surface area of ​​the pipeline 2, and the spacing between adjacent fins in the heat dissipation fin is 2-3 times the thickness of each fin, for example, the distance between each fin is 2 times the thickness of each fin, so that the fin spacing can be moderate, which not only ensures good air circulation, but also avoids the reduction of heat dissipation efficiency caused by excessive spacing. Of course, in actual application scenarios, different multiples or ratios of the surface area of ​​the heat dissipation fin and the surface area of ​​the pipeline 2 can also be set according to actual needs, for example, the surface area of ​​the heat dissipation fin is 3 times the surface area of ​​the pipeline 2, and the distance between each fin is set to each fin thickness. Different multiples or ratios, for example, the distance between each fin is 5 times the thickness of each fin, to adapt to different heat load requirements and equipment space limitations. This flexible design enables the PECVD equipment to achieve efficient heat dissipation in a compact space while meeting different process requirements, providing a strong guarantee for the stable operation of the equipment and the efficient completion of the process.

[0049] An embodiment of the present invention further provides a PECVD device, comprising the vacuum gauge heat dissipation system as described above.

[0050] By adopting the above-mentioned vacuum gauge heat dissipation system, the heat dissipation effect of the vacuum gauge can be improved, so that the deviation of the machine pressure control can be reduced or even avoided, thereby further improving the overall process stability of the PECVD equipment.

[0051] Further, such as Figure 4 As shown, the PECVD equipment further includes a machine enclosure 3 , and a second heat dissipation device 31 is provided on a side of the machine enclosure 3 close to the vacuum gauge body 1 .

[0052] In this embodiment, a second heat dissipation device 31 is provided on the machine enclosure 3 facing the vacuum gauge to perform secondary heat dissipation on the vacuum gauge, thereby further improving the heat dissipation effect of the vacuum gauge.

[0053] Specifically, the second heat sink 31 is a fan. That is, a fan for exhaust cooling is used to cool the vacuum gauge. This design not only optimizes the heat management inside the equipment, but also improves the reliability and economy of the overall operation. In actual application scenarios, the installation position and wind direction of the fan need to be accurately calculated to ensure that the cooling airflow can circulate efficiently and reduce heat accumulation. In addition, the fan can also automatically adjust the speed according to temperature changes to adapt to different workloads, further enhancing the flexibility and durability of the PECVD equipment.

[0054] In actual application scenarios, the daily monitoring data and stability data of the machine process are collected, from which it can be found that the process of each day is not stable with the process of the adjacent day (day to day), or the process of each wafer is unstable with the adjacent wafer (wafer to wafer), that is, the THK (Thickness, referring to the thickness of the wafer) suddenly drops in daily monitoring, and the stability shows a downward trend of THK (THK changes within a range of 3%). Figure 5 As shown, it was found that there was a direct correspondence with the change in the cavity background pressure. After actual verification, the change in the cavity background pressure was due to the increase in the temperature of the vacuum gauge, which led to problems in the pressure accuracy control, and then the reaction pressure was 1-2 torr higher (process pressure 5-8 torr). Figure 5 , which is the process performance without adding a heat sink to cause the vacuum gauge to fail. In the process marathon (i.e., the equipment is used and tested for a long time and with high concentration to verify its performance and stability), the process data is shown as follows:

[0055] Base pressure max-Base pressure min=△Base pressure=0.01torr;

[0056] THKmax-THKmin=△THK=60A (2.3%);

[0057] Among them, Base pressure max represents the maximum base pressure, Base pressure min represents the minimum base pressure, △Base pressure represents the base pressure difference, THKmax represents the maximum wafer thickness, THK min represents the minimum wafer thickness, and △THK represents the wafer thickness difference.

[0058] After the vacuum gauge heat dissipation system provided by this embodiment is used, Figure 6 As shown, the process performance after adding heat dissipation is: △Base Pressure = 0.0007torr, which is an order of magnitude lower than 0.01torr, that is, the stability and accuracy of the vacuum gauge are improved. Similarly, THK is also more stable, △THK = 32A (0.5%), which is significantly better than 60A (2.3%). In other words, after the vacuum gauge is cooled and dissipated by the vacuum gauge heat dissipation system provided in this embodiment, not only the heat dissipation effect of the vacuum gauge is improved, but also the stability of the equipment process is further improved.

[0059] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0060] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

Claims

1. A vacuum gauge heat dissipation system, comprising a vacuum gauge body and a pipeline connected to the vacuum gauge body, characterized in that: The heat dissipation system further comprises: The first heat dissipation device is arranged on the surface of the pipeline.

2. The vacuum gauge heat dissipation system according to claim 1, characterized in that: The first heat dissipation device is a heat dissipation fin.

3. The vacuum gauge heat dissipation system according to claim 2, characterized in that: The heat dissipation fins are circumferentially arranged on the surface of the pipeline.

4. The vacuum gauge heat dissipation system according to claim 2, characterized in that: The heat dissipation fins are radially arranged on the surface of the pipeline.

5. The vacuum gauge heat dissipation system according to claim 2, characterized in that: The heat dissipation fins and the pipeline are arranged in one piece.

6. The vacuum gauge heat dissipation system according to claim 2, characterized in that: The surface area of ​​the heat dissipation fins is 5-6 times the surface area of ​​the pipeline.

7. The vacuum gauge heat dissipation system according to claim 2, characterized in that: The distance between adjacent fins in the heat dissipation fins is 2-3 times the thickness of each fin.

8. A PECVD device, characterized in that: It comprises a vacuum gauge heat dissipation system as described in any one of claims 1 to 7.

9. The PECVD device according to claim 8, characterized in that It also includes a machine enclosure, and a second heat dissipation device is arranged on one side of the machine enclosure close to the vacuum gauge body.

10. The PECVD device according to claim 9, characterized in that The second heat dissipation device is a fan.

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