Display panel and manufacturing method thereof

Abstract

The application relates to a display panel and a manufacturing method thereof. The display panel comprises a substrate, a first photoresist layer and a first light-emitting functional part. The substrate is provided with a plurality of first electrodes arranged at intervals and a plurality of first pixel openings for at least partially exposing the corresponding first electrodes. The first photoresist layer is arranged on the substrate. The first photoresist layer is provided with a first evaporation opening communicated with the first pixel opening. The first light-emitting functional part is arranged in the first evaporation opening and the first pixel opening and covers the corresponding first electrode. The application exposes at least part of the first electrode through the plurality of first evaporation openings communicated with the first pixel opening, forms the first light-emitting functional part on the first electrode through the first evaporation opening, and correspondingly forms a sub-pixel of a corresponding color. Thus, a metal mask plate is not needed, and the problem that the aperture ratio of the manufactured display panel is limited and large-size display panels are difficult to manufacture is avoided.

Description

Display Panel and its Manufacturing Method Technical Field

[0001] This application relates to the field of display panel technology, and in particular to a display panel and a method for manufacturing the same. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are a display technology that utilizes the light-emitting principle of organic materials. They are widely used in smartphones, televisions, watches, automotive displays, and many other fields, and continue to drive the development of display technology.

[0003] The display panel manufacturing methods in related technologies have limitations in the PPI (Pixels Per Inch) of the manufactured display panels, making it difficult to manufacture large-size display panels. Summary of the Invention

[0004] Therefore, it is necessary to address the problem that the manufacturing methods of display panels in related technologies have limitations in the PPI (Pixels Per Inch) of the manufactured display panels, making it difficult to manufacture large-size display panels, and to provide a display panel and its manufacturing method.

[0005] A display panel, the display panel comprising:

[0006] A substrate having a plurality of first electrodes arranged at intervals thereon, and a plurality of first pixel openings for at least partially exposing the corresponding first electrodes.

[0007] A first photoresist layer is disposed on the substrate, and a first vapor deposition opening communicating with the first pixel opening is provided on the first photoresist layer to expose the first electrode;

[0008] The first light-emitting functional part is disposed in the first vapor deposition opening and the first pixel opening, and is covered on the corresponding first electrode.

[0009] In one embodiment, the first light-emitting functional part includes a first light-emitting part and a second electrode stacked on the first electrode in a direction away from the substrate;

[0010] The substrate is provided with a plurality of first wiring structures corresponding to the second electrode. The first wiring structure is located outside the corresponding first pixel opening and inside the corresponding first vapor deposition opening, so as to be electrically connected to the part of the second electrode located inside the corresponding first vapor deposition opening.

[0011] Optionally, the substrate is provided with a first power signal line, the display panel has a display area, and the substrate is further provided with a first via connection structure located in the display area;

[0012] The first wiring structure is electrically connected to the first power signal line through the first through-hole connection structure; or

[0013] The substrate is provided with a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate is also provided with a second via connection structure located in the border area;

[0014] The first wiring structure is electrically connected to the first power signal line through the second via connection structure.

[0015] In one embodiment, the substrate is further provided with a plurality of third electrodes spaced apart from the plurality of first electrodes, and a plurality of second pixel openings for at least partially exposing the corresponding third electrodes;

[0016] The display panel includes a second photoresist layer and a second light-emitting functional part. The second photoresist layer is disposed on the side of the first photoresist layer away from the substrate. The second photoresist layer has a second evaporation opening that penetrates the first photoresist layer and communicates with the second pixel opening to expose the third electrode.

[0017] The second light-emitting functional part is disposed in the second vapor deposition opening and the second pixel opening, and is covered on the corresponding third electrode;

[0018] Optionally, the display panel includes a first encapsulation layer disposed between the first light-emitting functional part and the second photoresist layer.

[0019] In one embodiment, the second light-emitting functional part includes a second light-emitting part and a fourth electrode stacked on the third electrode in a direction away from the substrate;

[0020] The substrate is provided with a plurality of second wiring structures corresponding to the fourth electrode. The second wiring structures are located outside the corresponding second pixel opening and inside the corresponding second vapor deposition opening, so as to be electrically connected to the part of the fourth electrode located inside the corresponding second vapor deposition opening.

[0021] Optionally, the substrate is provided with a first power signal line, the display panel has a display area, and the substrate is further provided with a third via connection structure located in the display area;

[0022] The second wiring structure is electrically connected to the first power signal line through the third via connection structure; or

[0023] The substrate is provided with a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate is also provided with a fourth via connection structure located in the border area;

[0024] The second wiring structure is electrically connected to the first power signal line through the fourth via connection structure.

[0025] In one embodiment, the substrate is provided with a fifth electrode spaced apart from the plurality of first electrodes and the plurality of third electrodes, and a plurality of third pixel openings for at least partially exposing the corresponding fifth electrode;

[0026] The display panel includes a third photoresist layer and a third light-emitting functional part. The third photoresist layer is disposed on the side of the second photoresist layer away from the substrate. The third photoresist layer has a third evaporation opening that penetrates the first photoresist layer and communicates with the third pixel opening to expose the fifth electrode.

[0027] The third light-emitting functional part is disposed in the third vapor deposition opening and the third pixel opening, and is covered on the corresponding fifth electrode;

[0028] Optionally, the display panel includes a second encapsulation layer disposed between the second light-emitting functional part and the third photoresist layer.

[0029] In one embodiment, the third light-emitting functional part includes a third light-emitting part and a sixth electrode stacked on the fifth electrode in a direction away from the substrate;

[0030] The substrate is provided with a plurality of third wiring structures corresponding to the sixth electrode. The third wiring structures are located outside the corresponding third pixel opening and inside the corresponding third vapor deposition opening, so as to be electrically connected to the part of the sixth electrode located inside the corresponding third vapor deposition opening.

[0031] Optionally, the substrate is provided with a first power signal line, the display panel has a display area, and the substrate is further provided with a fifth via connection structure located in the display area;

[0032] The third wiring structure is electrically connected to the first power signal line through the fifth via connection structure; or

[0033] The substrate is provided with a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate is also provided with a sixth via connection structure located in the border area;

[0034] The third wiring structure is electrically connected to the first power signal line through the sixth via connection structure;

[0035] Optionally, two adjacent electrodes among the second electrode, the fourth electrode, and the sixth electrode are electrically connected to each other;

[0036] Optionally, two adjacent wiring structures in the first, second, and third wiring structures are electrically connected to each other.

[0037] According to another aspect of this application, a method for manufacturing a display panel is provided, the method comprising:

[0038] A substrate is provided, wherein a plurality of first electrodes are arranged at intervals on the substrate, and a plurality of first pixel openings are respectively corresponding to the plurality of first electrodes; the first pixel openings are used to at least partially expose the corresponding first electrodes.

[0039] A first photoresist layer is formed on the substrate, and the first photoresist layer fills the first pixel opening;

[0040] At least the portion of the first photoresist layer located within the first pixel opening is removed to form a plurality of first vapor deposition openings on the first photoresist layer. The first vapor deposition openings are connected to the corresponding first pixel openings to expose the first electrode.

[0041] A first light-emitting layer is formed on the substrate. The first light-emitting layer includes a first light-emitting functional part, which is disposed in the first evaporation opening and the first pixel opening, and covers the first electrode.

[0042] In one embodiment, the first light-emitting functional part includes a first light-emitting part and a second electrode stacked on the first electrode in a direction away from the substrate;

[0043] After providing a substrate, and before forming the first photoresist layer on the substrate, the method further includes:

[0044] A plurality of first wiring structures corresponding to the second electrode are formed on the substrate, wherein the first wiring structure is disposed outside the corresponding first pixel opening and inside the corresponding first vapor deposition opening, for electrical connection with the portion of the second electrode located inside the corresponding first vapor deposition opening;

[0045] Optionally, the first light-emitting layer includes a first light-emitting sacrificial portion, which covers the first photoresist layer. After forming the first light-emitting layer on the substrate, the first light-emitting sacrificial portion is removed.

[0046] In one embodiment, the substrate is provided with third electrodes arranged at intervals from a plurality of first electrodes, and second pixel openings corresponding to the plurality of third electrodes respectively; the second pixel openings are used to at least partially expose the corresponding third electrodes;

[0047] A second photoresist layer is formed on the substrate, and the second photoresist layer fills the second pixel opening;

[0048] At least the portion of the second photoresist layer corresponding to the second pixel opening is removed to form a plurality of second vapor deposition openings on the second photoresist layer. The second vapor deposition openings are connected to the corresponding second pixel openings to expose the third electrode.

[0049] A second light-emitting layer is formed on the substrate. The second light-emitting layer includes a second light-emitting functional part, which is disposed in the second evaporation opening and the second pixel opening, and covers the third electrode.

[0050] Optionally, before forming the second photoresist layer on the substrate, the method further includes: forming a first encapsulation layer on the substrate, wherein the first encapsulation layer is disposed on the side of the first light-emitting layer away from the substrate;

[0051] Optionally, the second light-emitting functional part includes a second light-emitting part and a fourth electrode stacked on the third electrode in a direction away from the substrate;

[0052] After providing a substrate, and before forming the first photoresist layer on the substrate, the method further includes:

[0053] A plurality of second wiring structures corresponding to the fourth electrode are formed on the substrate, wherein the second wiring structures are disposed outside the corresponding second pixel opening and inside the corresponding second vapor deposition opening, for electrical connection with the portion of the fourth electrode located inside the corresponding second vapor deposition opening;

[0054] Optionally, the second light-emitting layer includes a second light-emitting sacrificial portion, which covers the second photoresist layer. After forming the second light-emitting layer on the substrate, the process further includes removing the second light-emitting sacrificial portion.

[0055] In one embodiment, the substrate is provided with fifth electrodes arranged at intervals from a plurality of first electrodes, and third pixel openings corresponding to the plurality of fifth electrodes respectively; the third pixel openings are used to at least partially expose the corresponding fifth electrodes;

[0056] A third photoresist layer is formed on the substrate, and the third photoresist layer fills the third pixel opening;

[0057] At least the portion of the third photoresist layer corresponding to the third pixel opening is removed to form a plurality of third vapor deposition openings on the third photoresist layer. The third vapor deposition openings are connected to the corresponding third pixel openings to expose the fifth electrode.

[0058] A third light-emitting layer is formed on the substrate. The third light-emitting layer includes a third light-emitting functional part, which is disposed in the third evaporation opening and the third pixel opening, and covers the fifth electrode.

[0059] Optionally, before forming the third photoresist layer on the substrate, the method further includes: forming a second encapsulation layer on the substrate, wherein the second encapsulation layer is disposed on the side of the second light-emitting layer away from the substrate;

[0060] Optionally, the third light-emitting functional part includes a third light-emitting part and a sixth electrode stacked on the fifth electrode in a direction away from the substrate;

[0061] After providing a substrate, and before forming the first photoresist layer on the substrate, the method further includes:

[0062] A plurality of third wiring structures corresponding to the sixth electrode are formed on the substrate, wherein the third wiring structures are disposed outside the corresponding third pixel opening and inside the corresponding third vapor deposition opening, for electrical connection with the portion of the sixth electrode located inside the corresponding third vapor deposition opening;

[0063] Optionally, the third light-emitting layer includes a third light-emitting sacrificial portion that covers the third photoresist layer, and after the third light-emitting layer is formed on the substrate, the process further includes removing the third light-emitting sacrificial portion.

[0064] The aforementioned display panel and its manufacturing method form multiple first evaporation openings on a first photoresist layer to connect to the first pixel openings and expose at least a portion of the first electrode. This allows the formation of a first light-emitting functional part on the first electrode through the first evaporation openings, which in turn can form sub-pixels of corresponding colors. Thus, there is no need to use a metal mask (FMM), avoiding the problems of limited PPI (Pixels Per Inch) and difficulty in manufacturing large-size display panels that exist when using a metal mask to manufacture display panels. This method can improve the aperture ratio of the display panel and reduce the manufacturing cost of the display panel. Attached Figure Description

[0065] Figure 1 shows a schematic diagram of the structure of the display panel of this application.

[0066] Figure 2 shows a side sectional view of the substrate provided in this application.

[0067] Figure 3 shows a top view of a first wiring structure, a second wiring structure, and a third wiring structure according to an embodiment of this application.

[0068] Figure 4 shows a side cross-sectional view of the substrate of this application having a first via connection structure.

[0069] Figure 5 shows a top view of a first wiring structure, a second wiring structure, and a third wiring structure according to another embodiment of this application.

[0070] Figures 6-8 illustrate the flowchart of the manufacturing method of the display panel provided in this application.

[0071] Figures 9(a)-9(j) illustrate schematic diagrams of the process of manufacturing a display panel using the manufacturing method of the display panel provided in this application.

[0072] Explanation of reference numerals in the attached figures:

[0073] 10. Display panel;

[0074] 11. Substrate; 12. Anode planarization layer; 13. Pixel definition layer; 14. First pixel opening; 15. Second pixel opening; 16. Third pixel opening;

[0075] 110. First electrode; 120. Second electrode; 121. First wiring structure; 122. First via connection structure; 130. Third electrode; 140. Fourth electrode; 141. Second wiring structure; 150. Fifth electrode; 160. Sixth electrode; 161. Third wiring structure; 171. Bottom layer; 172. Conductive layer; 173. Top layer;

[0076] 210, First photoresist layer; 211, First vapor deposition opening; 220, Second photoresist layer; 221, Second vapor deposition opening; 230, Third photoresist layer; 231, Third vapor deposition opening; 240, Fourth photoresist layer;

[0077] 310, First light-emitting layer; 311, First light-emitting part; 320, Second light-emitting layer; 321, Second light-emitting part; 330, Third light-emitting layer; 331, Third light-emitting part;

[0078] 410, First encapsulation layer; 420, Second encapsulation layer; 430, Third encapsulation layer. Detailed Implementation

[0079] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0080] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0082] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0083] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0084] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0085] OLED (Organic Light Emitting Diode) display technology has broad application prospects in the display field due to its advantages such as self-emissive properties, high contrast, low power consumption, and flexibility. Current technologies for manufacturing OLED display panels typically involve using a mask to vapor-deposit organic light-emitting materials and metal electrode materials onto specific locations. However, the use of masks presents several challenges, such as maintaining high-precision pattern alignment, ensuring the flatness and cleanliness of the mask, and achieving uniform vapor deposition on large-size substrates. Ultimately, this results in limitations on the PPI (Pixels Per Inch) of the manufactured display panel and difficulties in manufacturing large-size display panels.

[0086] Based on this, this application provides a display panel and a method for manufacturing the same, which can solve the problem of limited PPI of the display panel and reduce the manufacturing difficulty of large-size display panels.

[0087] Referring to Figures 1 and 2, the display panel 10 provided in this application includes a substrate 11, a first photoresist layer 210, and a first light-emitting functional unit. The substrate 11 has a plurality of first electrodes 110 arranged at intervals, and a plurality of first pixel openings 14 for at least partially exposing the corresponding first electrodes 110. The first photoresist layer 210 is disposed on the substrate 11, and has a first evaporation opening 211 communicating with the first pixel openings 14, so as to expose the first electrodes 110 through the first evaporation opening 211. Referring here to Figure 9(a) for better understanding, the first light-emitting functional unit is disposed within the first evaporation opening 211 and the first pixel opening 14, and covers the corresponding first electrode 110. Optionally, the thickness of the first photoresist layer 210 is 0.5µm-1µm.

[0088] This application enables the formation of a first evaporation opening 211 through the setting of the first photoresist layer 210. The first light-emitting functional part is formed on the first electrode 110 through the first evaporation opening 211, and corresponding sub-pixels of the corresponding colors can be formed. This eliminates the need to use a metal mask (FMM), avoiding the problems of limited PPI (Pixels Per Inch) and difficulty in manufacturing large-size display panels 10 that exist when using a metal mask to manufacture the display panel 10.

[0089] The first light-emitting functional unit includes a first light-emitting part 311 and a second electrode 120 stacked on the first electrode 110 along a direction away from the substrate 11. The substrate 11 has a plurality of first wiring structures 121 corresponding to the second electrode 120. The first wiring structures 121 are located outside the corresponding first pixel opening 14 and inside the corresponding first evaporation opening 211 for electrical connection with the portion of the second electrode 120 located inside the corresponding first evaporation opening 211. In some embodiments, the first electrode 110 is an anode, the second electrode 120 is a cathode, and the first light-emitting part 311 is located between the first electrode 110 and the second electrode 120. The first light-emitting part 311 emits light when a voltage is applied between the anode and cathode to inject charge carriers into the first light-emitting part 311. The first wiring structure 121 is a connection structure for connecting the second electrode 120 and the corresponding power signal line (such as a VSS signal line) to provide a corresponding low-level voltage signal (i.e., a VSS signal) to the second electrode 120 through the first wiring structure 121. Meanwhile, the first wiring structure 121 can also serve as an isolation mechanism, isolating the corresponding first light-emitting part 311 to prevent light leakage between adjacent light-emitting parts, thereby improving the display quality of the display panel 10.

[0090] Referring to FIG1, the substrate 11 is also provided with a plurality of third electrodes 130 spaced apart from the plurality of first electrodes 110 and a plurality of fifth electrodes 150 spaced apart from the plurality of first electrodes 110. Correspondingly, the substrate 11 is also provided with a plurality of second pixel openings 15 for at least partially exposing the corresponding third electrodes 130 (refer to FIG9(a) for understanding) and a plurality of third pixel openings 16 for at least partially exposing the corresponding fifth electrodes 150.

[0091] Referring to Figure 2, an anode planarization layer 12 is provided on the substrate 11. A first electrode 110, a third electrode 130, and a fifth electrode 150 are disposed on the anode planarization layer 12 at intervals. A pixel definition layer 13 is also provided on the anode planarization layer 12. The pixel definition layer 13 at least covers the first electrode 110, the third electrode 130, and the fifth electrode 150. The pixel definition layer 13 has a first pixel opening 14, a second pixel opening 15, and a third pixel opening 16, so that the first electrode 110 is at least partially exposed through the first pixel opening 14, the third electrode 130 is at least partially exposed through the second pixel opening 15, and the fifth electrode 150 is at least partially exposed through the third pixel opening 16. Optionally, both the anode planarization layer 12 and the pixel definition layer 13 are made of photoresist.

[0092] Referring again to Figure 1, the display panel 10 includes a second photoresist layer 220 and a second light-emitting functional unit. The second photoresist layer 220 is disposed on the side of the first photoresist layer 210 away from the substrate 11. The second photoresist layer 220 has a second evaporation opening 221 that penetrates the first photoresist layer 210 and communicates with the second pixel opening 15, so as to expose the third electrode 130 through the second evaporation opening 221. Referring here to Figure 9(f) for better understanding, the second light-emitting functional unit is disposed in the second evaporation opening 221 and the second pixel opening 15, and covers the corresponding third electrode 130. Optionally, the thickness of the second photoresist layer 220 is 0.5um-1um.

[0093] By setting the second photoresist layer 220, a second evaporation opening 221 can be formed, penetrating the portion of the first photoresist layer 210 corresponding to the second evaporation opening 221 and the second pixel opening 15, so that the second pixel opening 15 is connected to the second evaporation opening 221, thereby forming a second light-emitting functional part within the second evaporation opening 221 and the second pixel opening 15. This eliminates the need for a photomask, avoiding the limitations on PPI (Pixels Per Inch) and difficulties in manufacturing large-size display panels that occur when using metal photomasks. It also increases the aperture ratio of the display panel and reduces its manufacturing cost.

[0094] Optionally, the display panel 10 includes a first encapsulation layer 410, which is disposed between the first light-emitting functional part and the second photoresist layer 220 to encapsulate the first light-emitting functional part, thereby improving the quality of the display panel 10 and thus improving the display quality. Optionally, the thickness of the first encapsulation layer 410 is 10nm-50nm.

[0095] The second light-emitting functional unit includes a second light-emitting part 321 and a fourth electrode 140 stacked on the third electrode 130 along a direction away from the substrate 11. The substrate 11 has a plurality of second wiring structures 141 corresponding to the fourth electrode 140. The second wiring structures 141 are located outside the corresponding second pixel opening 15 and inside the corresponding second evaporation opening 221 for electrical connection with the portion of the fourth electrode 140 located within the corresponding second evaporation opening 221. Correspondingly, the third electrode 130 is the anode, the fourth electrode 140 is the cathode, and the second light-emitting part 321 is located between the third electrode 130 and the fourth electrode 140. The second light-emitting part 321 emits light when a voltage is applied between the anode and cathode to inject charge carriers. The second wiring structure 141 is a connection structure for connecting the fourth electrode 140 to the corresponding power signal line (such as the VSS signal line), so as to provide the fourth electrode 140 with a corresponding low-level voltage signal (i.e., the VSS signal) through the second wiring structure 141. Meanwhile, the second wiring structure 141 can also serve as an isolation mechanism, isolating the corresponding second light-emitting part 321 to prevent light leakage between adjacent light-emitting parts, thereby improving the display quality of the display panel 10.

[0096] The second light-emitting part 321 is configured to emit light of a different color than that emitted by the first light-emitting part 311, so as to realize the light emission of different colored pixels.

[0097] Referring again to Figure 1, the display panel 10 includes a third photoresist layer 230 and a third light-emitting functional unit. The third photoresist layer 230 is disposed on the side of the second photoresist layer 220 away from the substrate 11. The third photoresist layer 230 has a third evaporation opening 231 that penetrates the first photoresist layer 210 and communicates with the third pixel opening 16, so as to expose the fifth electrode 150 through the third evaporation opening 231. Referring here to Figure 9(i) for better understanding, the third light-emitting functional unit is disposed in the third evaporation opening 231 and the third pixel opening 16, and covers the corresponding fifth electrode 150. Optionally, the thickness of the third photoresist layer 230 satisfies 0.5um-1um.

[0098] By setting the third photoresist layer 230, a third evaporation opening 231 can be formed, penetrating the portions of the first photoresist layer 210 and the second photoresist layer 220 corresponding to the second evaporation opening 221 and the second pixel opening 15, so that the third pixel opening 16 is connected to the third evaporation opening 231, thereby forming a third light-emitting functional part within the third evaporation opening 231 and the third pixel opening 16. This eliminates the need for a photomask, avoiding the limitations on PPI (Pixels Per Inch) and difficulties in manufacturing large-size display panels that arise from using metal photomasks.

[0099] Optionally, the display panel 10 includes a second encapsulation layer 420, which is disposed between the second light-emitting functional part and the third photoresist layer 230 to encapsulate the second light-emitting functional part, thereby improving the quality of the display panel 10 and thus improving the display quality. Optionally, the thickness of the second encapsulation layer 420 is 10nm-50nm.

[0100] The third light-emitting functional unit includes a third light-emitting part 331 and a sixth electrode 160 stacked on the fifth electrode 150 along a direction away from the substrate 11. The substrate 11 has a plurality of third wiring structures 161 corresponding to the sixth electrode 160. The third wiring structures 161 are located outside the corresponding third pixel opening 16 and inside the corresponding third evaporation opening 231 for electrical connection with the portion of the sixth electrode 160 located within the corresponding third evaporation opening 231. Correspondingly, the fifth electrode 150 is the anode, the sixth electrode 160 is the cathode, and the third light-emitting part 331 is located between the fifth electrode 150 and the sixth electrode 160. The third light-emitting part 331 emits light when a voltage is applied between the anode and cathode to inject charge carriers. The third wiring structure 161 is a connection structure for connecting the sixth electrode 160 to the corresponding power signal line (such as the VSS signal line), so as to provide the sixth electrode 160 with a corresponding low-level voltage signal (i.e., the VSS signal) through the third wiring structure 161. Furthermore, the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 of this application can also isolate the corresponding light-emitting parts, or isolate the pixels, to prevent light leakage from the display panel 10 and improve the display effect of the display panel 10.

[0101] The third light-emitting part 331 can be configured to emit light of a different color than that emitted by the first light-emitting part 311 and the second light-emitting part 321. In some embodiments, the first light-emitting part 311 is configured to emit red light, the second light-emitting part 321 is configured to emit green light, and the third light-emitting part 331 is configured to emit blue light. Under the isolation effect of the corresponding wiring structure, the first light-emitting part 311, the second light-emitting part 321 and the third light-emitting part 331 can have a better light emission effect, avoid cross-lighting between adjacent light-emitting parts, and improve the display effect of the display panel 10.

[0102] In some embodiments, the display panel 10 further includes a fourth photoresist layer 240, which is disposed on the side of the third photoresist layer 230 away from the substrate 11 and covers the third light-emitting functional part to protect the third light-emitting functional part. At the same time, the fourth photoresist layer 240 fills the third vapor deposition opening 231 to make the display panel 10 flat.

[0103] Optionally, the display panel 10 further includes a third encapsulation layer 430, which is disposed between the third light-emitting functional part and the fourth photoresist layer 240 to encapsulate and protect the third light-emitting functional part, thereby improving the quality of the display panel 10 and thus improving the display quality. Optionally, the thickness of the third encapsulation layer 430 is 50nm-150nm.

[0104] The first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 of this application can be configured to be relatively independent of each other and electrically connected to each other through a first power signal line, so that adjacent pairs of the second electrode 120, the fourth electrode 140, and the sixth electrode 160 are electrically connected to each other to form a cathode network. Referring to FIG3, the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 of the embodiment shown in FIG3 are relatively independent of each other and are arranged at intervals in pairs.

[0105] As shown in the embodiment of FIG3, the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 can all be configured to include an inner ring structure and an outer ring structure surrounding the corresponding first electrode 110, third electrode 130 or fifth electrode 150 and electrically connected to each other. The double-ring structure can improve the isolation effect of the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161, and avoid light leakage between the pixels formed in the end, so as to improve the display effect of the display panel 10.

[0106] In the embodiment shown in FIG3, and in conjunction with FIG4, optionally, a first power signal line is provided on the substrate 11, the display panel 10 has a display area, and a first via connection structure 122 located in the display area is also provided on the substrate 11. The first wiring structure 121 is electrically connected to the first power signal line through the first via connection structure 122. The first power signal line is electrically connected to the first wiring structure 121 through the first via connection structure 122 and then electrically connected to the second electrode 120 to supply power to the second electrode 120. The corresponding first electrode 110 is also connected to the corresponding power signal line to inject electrons and holes into the first light-emitting part 311 through the first electrode 110 and the second electrode 120, so that the first light-emitting part 311 is excited to generate light.

[0107] Correspondingly, the substrate 11 is also provided with a third via connection structure and a fifth via connection structure located in the display area. The second wiring structure 141 is electrically connected to the first power signal line through the third via connection structure, and the third wiring structure 161 is electrically connected to the first power signal line through the fifth via connection structure. That is, the first power signal line is electrically connected to the second wiring structure 141 through the third via connection structure and then electrically connected to the fourth electrode 140 to supply power to the fourth electrode 140. At this time, the third electrode 130 is also connected to the corresponding power signal line to inject electrons and holes into the second light-emitting part 321 through the third electrode 130 and the fourth electrode 140, so that the second light-emitting part 321 is excited to generate light. Correspondingly, the first power signal line is electrically connected to the third wiring structure 161 through the fifth via connection structure and then electrically connected to the sixth electrode 160 to supply power to the sixth electrode 160. Correspondingly, the fifth electrode 150 is also electrically connected to the corresponding power signal line. Electrons and holes are injected into the third light-emitting part 331 through the fifth electrode 150 and the sixth electrode 160, so that the third light-emitting part 331 is excited to generate light.

[0108] As shown in Figure 4, the first via connection structure 122 can be disposed on the side of the corresponding first wiring structure 121 facing the substrate 11. The first power signal line is disposed in the direction of the first wiring structure 121 facing the substrate 11. A first through hole is provided on at least one of the anode planarization layer 12 and the pixel definition layer 13. The first via connection structure 122 passes through the first through hole and connects between the first power signal line and the first wiring structure 121, realizing the conduction of the second electrode 120 and the corresponding power signal line, or in other words, realizing the conduction of the cathode network. In some embodiments, the first via connection structure 122 can also be disposed on the side of the first wiring structure 121 away from the substrate 11. In this case, the first power signal line is disposed in the direction of the first wiring structure 121 away from the substrate 11. The first via connection structure 122 passes through each layer structure disposed on the side of the first wiring structure 121 away from the substrate 11 and connects between the first power signal line and the first wiring structure 121, realizing the conduction of the second electrode 120 and the corresponding power signal line, or in other words, realizing the conduction of the cathode network.

[0109] Correspondingly, the third via connection structure has the same structural configuration as the first via connection structure 122, which can be understood by referring to the schematic diagram of the first via connection structure 122 shown in Figure 4. The third via connection structure can be located on the side of the corresponding second wiring structure 141 facing the substrate 11. A second through hole is provided on at least one of the anode planarization layer 12 and the pixel definition layer 13. The third via connection structure passes through the second through hole and connects between the first power signal line and the second wiring structure 141, realizing the conduction of the fourth electrode 140 and the corresponding power signal line, or in other words, the conduction of the cathode network. The third via connection structure can also be located on the side of the second wiring structure 141 away from the substrate 11. The third via connection structure passes through the layers on the side of the second wiring structure 141 away from the substrate 11 and connects between the first power signal line and the second wiring structure 141, realizing the conduction of the fourth electrode 140 and the corresponding power signal line, or in other words, realizing the conduction of the cathode network.

[0110] Correspondingly, the fifth via connection structure has the same structural configuration as the first via connection structure 122, which can be understood by referring to the schematic diagram of the first via connection structure 122 shown in Figure 4. The fifth via connection structure can be located on the side of the corresponding third wiring structure 161 facing the substrate 11. A third through-hole is provided on at least one of the anode planarization layer 12 and the pixel definition layer 13. The fifth via connection structure passes through the third through-hole and connects between the first power signal line and the third wiring structure 161, realizing the conduction of the sixth electrode 160 and the corresponding power signal line, or in other words, realizing the conduction of the cathode network. The fifth via connection structure can also be located on the side of the third wiring structure 161 away from the substrate 11. The fifth via connection structure passes through the layers on the side of the third wiring structure 161 away from the substrate 11 and connects between the first power signal line and the third wiring structure 161, realizing the conduction of the sixth electrode 160 and the corresponding power signal line, or in other words, realizing the conduction of the cathode network.

[0111] The first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 of this application can also be configured to be directly electrically connected to each other to form a cathode network, that is, adjacent pairs of the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 are directly electrically connected to each other. As shown in FIG5, the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 of the embodiment shown in FIG5 are connected to each other and are electrically conductive to each other.

[0112] In the embodiment shown in Figure 5, the display panel 10 has a display area and a border area adjacent to the display area. The first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 in the display area are directly electrically connected to each other. Therefore, it is not necessary to set additional connecting wires in the display area to realize the electrical connection between the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161. An electrical connection structure is set in the border area to connect the first wiring structure 121, the second wiring structure 141, and the third wiring structure 161 and the corresponding power signal line. The substrate 11 may have a second via connection structure, a fourth via connection structure, and a sixth via connection structure located in the border area. The first wiring structure 121 near the border area is electrically connected to the first power signal line through the second via connection structure. The second wiring structure 141 near the border area is electrically connected to the first power signal line through the fourth via connection structure. The third wiring structure 161 near the border area is electrically connected to the first power signal line through the sixth via connection structure, so as to realize the electrical connection between the entire cathode and the corresponding power signal line.

[0113] In some embodiments, the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 each include a top layer 173, a bottom layer 171 and a conductive layer 172 disposed between the top layer 173 and the bottom layer 171, and the second electrode 120, the fourth electrode 140 and the sixth electrode 160 are all connected to the corresponding conductive layer 172.

[0114] This application also provides a method for manufacturing a display panel 10, which can reduce the manufacturing difficulty of large-size display panels 10 and solve the problem of limited PPI (Pixels Per Inch) in existing display panel manufacturing.

[0115] Referring to Figure 6, and in conjunction with Figures 9(a)-9(e), the method for manufacturing the display panel 10 includes:

[0116] S11. First, a substrate 11 is provided. The substrate 11 has a plurality of first electrodes 110 spaced apart, third electrodes 130 spaced apart from the plurality of first electrodes 110, and fifth electrodes 150 spaced apart from the plurality of first electrodes 110. Alternatively, a plurality of first electrodes 110, a plurality of third electrodes 130, and a plurality of fifth electrodes 150 spaced apart from each other are disposed on the substrate 11. The substrate 11 also has a plurality of first pixel openings 14 corresponding to the plurality of first electrodes 110, a plurality of second pixel openings 15 corresponding to the plurality of third electrodes 130, and a plurality of third pixel openings 16 corresponding to the plurality of fifth electrodes 150.

[0117] In some embodiments, an anode planarization layer 12 is first formed on a substrate 11, and a plurality of first electrodes 110, a plurality of third electrodes 130, and a plurality of fifth electrodes 150 are formed on the anode planarization layer 12. Then, a pixel definition layer 13 is formed on the anode planarization layer 12, the pixel definition layer 13 at least covering the first electrodes 110, third electrodes 130, and fifth electrodes 150. Subsequently, a plurality of first pixel openings 14, a plurality of second pixel openings 15, and a plurality of third pixel openings 16 are formed on the pixel definition layer 13. The first pixel openings 14 are used to at least partially expose the corresponding first electrode 110, the second pixel openings 15 are used to at least partially expose the corresponding third electrode 130, and the third pixel openings 16 are used to at least partially expose the corresponding fifth electrode 150. The fabrication of the anode planarization layer 12 facilitates the relatively flat position of the anodes, such as the first electrodes 110, third electrodes 130, and fifth electrodes 150, thereby facilitating the adjustment of the anode position.

[0118] In some embodiments, the dimensions of the first electrode 110, the third electrode 130, and the fifth electrode 150 can be adjusted by taking into account factors such as the lifespan and aperture ratio of the display panel 10, and are not limited herein.

[0119] S12. After providing the above-mentioned substrate 11, a first photoresist layer 210 is formed on the substrate 11. The first photoresist layer 210 fills the first pixel opening 14. Then, at least the portion of the first photoresist layer 210 located in the first pixel opening 14 is removed to form a plurality of first vapor deposition openings 211 on the first photoresist layer 210. The first vapor deposition openings 211 are connected to the corresponding first pixel openings 14 so as to expose the first pixel openings 14 and the first electrode 110 in the first pixel openings 14, so as to facilitate the subsequent formation of the first light-emitting portion 311 and the second electrode 120.

[0120] S13. A first light-emitting layer 310 is formed on the substrate 11. The first light-emitting layer 310 includes a first light-emitting functional part and a first light-emitting sacrificial part. The first light-emitting functional part is disposed within the first evaporation opening 211 and the first pixel opening 14, and covers the first electrode 110. The first light-emitting sacrificial part covers the first photoresist layer 210. The first light-emitting functional part includes a first light-emitting part 311 and a second electrode 120 stacked on the first electrode 110 in a direction away from the substrate 11. Holes and electrons are input to the first light-emitting part 311 through the first electrode 110 and the second electrode 120, so that the first light-emitting part 311 is excited to light.

[0121] In some embodiments, a first light-emitting layer 310 can be formed on the substrate 11 by vapor deposition. For example, after forming a first photoresist layer 210 and a first vapor deposition opening 211, a first light-emitting material layer is vapor deposited. The portion of the first light-emitting material layer corresponding to the first electrode 110 in the first vapor deposition opening 211 and the first pixel opening 14 is the first light-emitting portion 311, and the remaining portion is the first light-emitting sacrificial portion. Then, a second electrode 120 is formed on the first light-emitting portion 311 to form the first light-emitting layer 310.

[0122] S14. After forming the first light-emitting layer 310 on the substrate 11 and before forming the second photoresist layer 220 on the substrate 11, a first encapsulation layer 410 is formed on the substrate 11. The first encapsulation layer 410 is disposed on the side of the first light-emitting layer 310 away from the substrate 11 to encapsulate the first light-emitting layer 310, or to encapsulate the pixel unit corresponding to the formed first light-emitting layer 310, so as to improve the display effect.

[0123] Correspondingly, referring to Figure 7 and in conjunction with Figures 9(e)-9(g), the method for manufacturing the display panel 10 further includes:

[0124] S21. After forming the first light-emitting layer 310 on the substrate 11, a second photoresist layer 220 is formed on the substrate 11. The second photoresist layer 220 fills the second pixel opening 15. At least the portion of the second photoresist layer 220 corresponding to the second pixel opening 15 is removed to form a plurality of second evaporation openings 221 on the second photoresist layer 220. The second evaporation openings 221 are connected to the corresponding second pixel openings 15 so as to expose the third electrode 130 inside the second pixel opening 15, so as to facilitate the subsequent formation of the second light-emitting part 321 and the fourth electrode 140.

[0125] When forming the second vapor deposition opening 221 and connecting it to the second pixel opening 15, it is necessary to sequentially remove the portion of the second photoresist layer 220 corresponding to the second pixel opening 15, remove the portion of the first encapsulation layer 410 corresponding to the second vapor deposition opening 221 and the second pixel opening 15, remove the portion of the first light-emitting material layer corresponding to the second vapor deposition opening 221 and the second pixel opening 15, and remove the portion of the first photoresist layer 210 corresponding to the second vapor deposition opening 221 and the second pixel opening 15, so that the second vapor deposition opening 221 is connected to the second pixel opening 15.

[0126] S22. After forming the second vapor deposition opening 221, a second light-emitting layer 320 is formed on the substrate 11. The second light-emitting layer 320 includes a second light-emitting functional part and a second light-emitting sacrificial part. The second light-emitting functional part is disposed within the second vapor deposition opening 221 and the second pixel opening 15, and covers the third electrode 130. The second light-emitting sacrificial part covers the second photoresist layer 220. The second light-emitting functional part includes a second light-emitting part 321 and a fourth electrode 140 stacked on the third electrode 130 in a direction away from the substrate 11. Holes and electrons are input to the second light-emitting part 321 through the third electrode 130 and the fourth electrode 140, causing the second light-emitting part 321 to be excited by light.

[0127] In some embodiments, the second light-emitting layer 320 can be formed on the substrate 11 by vapor deposition. For example, after forming the second photoresist layer 220 and the second vapor deposition opening 221, a second light-emitting material layer is then vapor-deposited. The portion of the second light-emitting material layer corresponding to the third electrode 130 within the second vapor deposition opening 221 and the second pixel opening 15 is the second light-emitting portion 321, and the remaining portion is the second light-emitting sacrificial portion. Then, a fourth electrode 140 is formed on the second light-emitting portion 321 to form the second light-emitting layer 320. The color of the light emitted by the second light-emitting material layer can be different from the color of the light emitted by the first light-emitting material layer to form pixels of different colors.

[0128] S23. After forming the second light-emitting layer 320 on the substrate 11 and before forming the third photoresist layer 230 on the substrate 11, a second encapsulation layer 420 is formed on the substrate 11. The second encapsulation layer 420 is disposed on the side of the second light-emitting layer 320 away from the substrate 11 to encapsulate the second light-emitting layer 320, or to encapsulate the pixel unit corresponding to the formed second light-emitting layer 320, so as to improve the display effect.

[0129] Correspondingly, referring to Figure 8 and in conjunction with Figures 9(h)-9(j), the method for manufacturing the display panel 10 further includes:

[0130] S31. After forming the second light-emitting layer 320 on the substrate 11, a third photoresist layer 230 is formed on the substrate 11. The third photoresist layer 230 fills the third pixel opening 16, and at least the portion of the third photoresist layer 230 corresponding to the third pixel opening 16 is removed, so as to form a plurality of third evaporation openings 231 on the third photoresist layer 230. The third evaporation openings 231 are connected to the corresponding third pixel openings 16, so as to expose the third pixel openings 16 and the fifth electrode 150 inside the third pixel openings 16, so as to facilitate the subsequent formation of the third light-emitting part 331 and the sixth electrode 160.

[0131] In some embodiments, when forming the third vapor deposition opening 231 and connecting it to the third pixel opening 16, it is necessary to sequentially remove the portion of the third photoresist layer 230 corresponding to the third pixel opening 16, remove the portion of the second encapsulation layer 420 corresponding to the third vapor deposition opening 231 and the third pixel opening 16, remove the portion of the second light-emitting material layer corresponding to the third vapor deposition opening 231 and the third pixel opening 16, remove the portion of the second photoresist layer 220 corresponding to the third vapor deposition opening 231 and the third pixel opening 16, remove the portion of the first encapsulation layer 410 corresponding to the third vapor deposition opening 231 and the third pixel opening 16, remove the portion of the first light-emitting material layer corresponding to the third vapor deposition opening 231 and the third pixel opening 16, and remove the portion of the first photoresist layer 210 corresponding to the third vapor deposition opening 231 and the third pixel opening 16, so that the third vapor deposition opening 231 and the third pixel opening 16 are connected.

[0132] S32. A third light-emitting layer 330 is formed on the substrate 11. The third light-emitting layer 330 includes a third light-emitting functional part and a third light-emitting sacrificial part. The third light-emitting functional part is disposed within the third evaporation opening 231 and the third pixel opening 16, and covers the fifth electrode 150. The third light-emitting sacrificial part covers the third photoresist layer 230. The third light-emitting functional part includes a third light-emitting part 331 and a sixth electrode 160 stacked on the third electrode 130 in a direction away from the substrate 11. Holes and electrons are input to the third light-emitting part 331 through the fifth electrode 150 and the sixth electrode 160, causing the third light-emitting part 331 to be excited by light.

[0133] In some embodiments, a third light-emitting layer 330 may be formed on the substrate 11 by vapor deposition. For example, after forming a third photoresist layer 230 and a third vapor deposition opening 231, a third light-emitting material layer is vapor deposited. The portion of the third light-emitting material layer corresponding to the fifth electrode 150 in the third vapor deposition opening 231 and the third pixel opening 16 is the third light-emitting portion 331, and the remaining portion is the third light-emitting sacrificial portion. Then, a sixth electrode 160 is formed on the third light-emitting portion 331 to form the third light-emitting layer 330.

[0134] S33. After forming the third light-emitting layer 330 on the substrate 11 and before forming the fourth photoresist layer 240 on the substrate 11, a third encapsulation layer 430 is also formed on the substrate 11. The third encapsulation layer 430 is disposed on the side of the third light-emitting layer 330 away from the substrate 11 to encapsulate the third light-emitting layer 330, or to encapsulate the pixel unit corresponding to the formed third light-emitting layer 330, so as to improve the display effect.

[0135] In some embodiments, the first encapsulation layer 410 and the second encapsulation layer 420 are processed using atomic deposition, and the third encapsulation layer 430 can be processed using either atomic deposition or chemical vapor deposition. In some embodiments, the thickness of the first encapsulation layer 410 and the second encapsulation layer 420 is 10 nm to 50 nm, and the thickness of the third encapsulation layer 430 is 50 nm to 100 nm.

[0136] In some embodiments, the thickness of the first photoresist layer 210, the second photoresist layer 220, and the third photoresist layer 230 can all be 0.5-1 μm.

[0137] In some embodiments, when forming the first vapor deposition opening 211, the second vapor deposition opening 221, or the third vapor deposition opening 231, etching or developing processes can be used to form the corresponding openings on the first photoresist layer 210, the second photoresist layer 220, or the third photoresist layer 230. When removing the corresponding portions on the first encapsulation layer 410 or the second encapsulation layer 420, fluoride ions can be used to facilitate the removal of the corresponding portions on the first encapsulation layer 410 or the second encapsulation layer 420. That is, the corresponding encapsulation material can be cleaned away using a fluoride ion chamber. For example, the corresponding encapsulation layer prepared by atomic layer deposition technology can be cleaned away using a fluoride ion chamber. This can replace the harsh chamber environment of dry etching, which is beneficial to improving the quality of the display panel 10. Combined with the above-mentioned etching or developing processes, the connection between the first pixel opening 14 and the first vapor deposition opening 211, the connection between the second pixel opening 15 and the second vapor deposition opening 221, and the connection between the third pixel opening 16 and the third vapor deposition opening 231 can be achieved.

[0138] In some embodiments, after forming the third light-emitting layer 330 on the substrate 11, a fourth photoresist layer 240 is also formed on the substrate 11. The fourth photoresist layer 240 covers the third light-emitting layer 330 and fills the third vapor deposition opening 231, so as to make the upper part of the third light-emitting layer 330 flat, which is beneficial to the subsequent encapsulation of the display panel 10.

[0139] In some embodiments, after forming the third light-emitting layer 330 on the substrate 11, the third light-emitting sacrificial portion, the second light-emitting sacrificial portion, and the first light-emitting sacrificial portion can be removed sequentially, as shown in FIG1. ​​Specifically, a portion of the third encapsulation layer 430, a portion of the third light-emitting layer 330, a portion of the third photoresist layer 230, a portion of the second encapsulation layer 420, a portion of the second light-emitting layer 320, a portion of the second photoresist layer 220, a portion of the first encapsulation layer 410, and a portion of the first light-emitting layer 310 are removed sequentially to retain the first light-emitting functional portion, the second light-emitting functional portion, and the third light-emitting functional portion, or in other words, to retain the corresponding three pixel portions. Preferably, the first light-emitting sacrificial portion, the second light-emitting sacrificial portion, and the third light-emitting sacrificial portion are not removed to reduce the risk of damage to the first light-emitting portion 311, the second light-emitting portion 321, and the third light-emitting portion 331 during the removal process.

[0140] In some embodiments, the formation of the first light-emitting material layer, the second light-emitting material layer and the third light-emitting material layer on the substrate 11 can be achieved using inkjet printing (IJP) technology.

[0141] Finally, the display panel 10 is encapsulated to form an overall encapsulation layer, which can be achieved using chemical vapor deposition (CVD) technology. Preferably, the thickness of the overall encapsulation layer is about 1 μm.

[0142] After providing a substrate 11 and before forming a first photoresist layer 210 on the substrate 11, the method further includes forming a plurality of first wiring structures 121 corresponding to the second electrode 120, a plurality of second wiring structures 141 corresponding to the fourth electrode 140, and a plurality of third wiring structures 161 corresponding to the sixth electrode 160 on the substrate 11. The first wiring structures 121 are located outside the corresponding first pixel opening 14 and inside the corresponding first vapor deposition opening 211 for electrical connection with the portion of the second electrode 120 located within the corresponding first vapor deposition opening 211. The second wiring structures 141 are located outside the corresponding second pixel opening 15 and inside the corresponding second vapor deposition opening 221 for electrical connection with the portion of the fourth electrode 140 located within the corresponding second vapor deposition opening 221. The third wiring structures 161 are located outside the corresponding third pixel opening 16 and inside the corresponding third vapor deposition opening 231 for electrical connection with the portion of the sixth electrode 160 located within the corresponding third vapor deposition opening 231.

[0143] In some embodiments, referring to FIG2, before forming the first photoresist layer 210 on the substrate 11, a bottom layer 171, a conductive layer 172, and a top layer 173 are sequentially disposed on the pixel definition layer 13 to form corresponding first wiring structures 121, second wiring structures 141, and third wiring structures 161. After the bottom layer 171, conductive layer 172, and top layer 173 are sequentially disposed on the pixel definition layer 13, the conductive layer 172 is etched by etching or other processes, such that the radial dimension of the conductive layer 172 does not exceed the radial dimensions of the bottom layer 171 and the top layer 173, or in other words, the projection range of the conductive layer 172 on the substrate 11 is within the projection range of the bottom layer 171 on the substrate 11, and the projection range of the conductive layer 172 on the substrate 11 is within the projection range of the top layer 173 on the substrate 11, so as to form the corresponding first wiring structures 121, second wiring structures 141, and third wiring structures 161. It is understood that the projection size of the conductive layer 172 is designed to facilitate the subsequent formation of the first, second, and third light-emitting material layers. By adjusting the evaporation angle, the corresponding first, second, or third light-emitting material layer can be disconnected at the corresponding wiring structure, so that the corresponding second electrode 120, fourth electrode 140, or sixth electrode 160 can be connected to the corresponding conductive layer 172.

[0144] After forming the first vapor deposition opening 211 on the substrate 11, when forming the first light-emitting material layer, the vapor deposition angle needs to be adjusted to ensure that the first light-emitting material layer is broken at the first wiring structure 121. Correspondingly, when forming the second light-emitting material layer, the vapor deposition angle is adjusted to ensure that the second light-emitting material layer is broken at the second wiring structure 141, and when forming the third light-emitting material layer, the vapor deposition angle is adjusted to ensure that the third light-emitting material layer is broken at the third wiring structure 161. In this way, when the second electrode 120, the fourth electrode 140 and the sixth electrode 160 are subsequently formed, the second electrode 120 can be connected to the conductive layer 172 of the corresponding first wiring structure 121, the fourth electrode 140 can be connected to the conductive layer 172 of the corresponding second wiring structure 141, and the sixth electrode 160 can be connected to the conductive layer 172 of the corresponding third wiring structure 161. In some embodiments, the first wiring structure 121, the second wiring structure 141 and the third wiring structure 161 can be prepared by photolithography combined with etching, wherein the bottom layer 171 and the top layer 173 both include titanium (Ti) layers, and the conductive layer 172 includes aluminum (Al) layers.

[0145] The display panel 10 and its manufacturing method provided in this application form a plurality of first evaporation openings 211 on the first photoresist layer 210 to connect the first pixel opening 14 and expose at least part of the first electrode 110. This allows the formation of a first light-emitting functional part on the first electrode 110 through the first evaporation openings 211, which in turn can form sub-pixels of corresponding colors. In this way, there is no need to use a metal mask, thus avoiding the problems of limited PPI and difficulty in manufacturing large-size display panels 10 that exist when using a metal mask to manufacture the display panel 10.

[0146] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0147] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: a substrate having a plurality of first electrodes spaced apart and a plurality of first pixel openings for at least partially exposing the corresponding first electrodes; a first photoresist layer disposed on the substrate, the first photoresist layer having a first evaporation opening communicating with the first pixel opening to expose the first electrodes; a first light-emitting functional portion disposed within the first evaporation opening and the first pixel opening, and covering the corresponding first electrode; the substrate also has a plurality of third electrodes spaced apart from the plurality of first electrodes, and a plurality of second pixel openings for at least partially exposing the corresponding third electrodes; the display panel includes a second photoresist layer and a second light-emitting functional portion, the second photoresist layer being disposed on the side of the first photoresist layer away from the substrate, the second photoresist layer having a second evaporation opening penetrating the first photoresist layer and communicating with the second pixel opening to expose the third electrodes; the second light-emitting functional portion being disposed within the second evaporation opening and the second pixel opening, and covering the corresponding third electrode.

2. The display panel according to claim 1, characterized in that, The first light-emitting functional part includes a first light-emitting part and a second electrode stacked on the first electrode in a direction away from the substrate; the substrate is provided with a plurality of first wiring structures corresponding to the second electrode, the first wiring structures are disposed outside the corresponding first pixel opening and inside the corresponding first vapor deposition opening, for electrical connection with the portion of the second electrode located inside the corresponding first vapor deposition opening.

3. The display panel according to claim 2, characterized in that, The substrate has a first power signal line, the display panel has a display area, and the substrate also has a first via connection structure located in the display area; the first wiring structure is electrically connected to the first power signal line through the first via connection structure; or the substrate has a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate also has a second via connection structure located in the border area; the first wiring structure is electrically connected to the first power signal line through the second via connection structure.

4. The display panel according to claim 1, characterized in that, The display panel includes a first encapsulation layer, which is disposed between the first light-emitting functional part and the second photoresist layer.

5. The display panel according to claim 3, characterized in that, The second light-emitting functional part includes a second light-emitting part and a fourth electrode stacked on the third electrode in a direction away from the substrate; the substrate is provided with a plurality of second wiring structures corresponding to the fourth electrode, the second wiring structures are disposed outside the corresponding second pixel opening and inside the corresponding second evaporation opening, for electrical connection with the portion of the fourth electrode located inside the corresponding second evaporation opening.

6. The display panel according to claim 5, characterized in that, The substrate has a first power signal line, the display panel has a display area, and the substrate also has a third via connection structure located in the display area; the second wiring structure is electrically connected to the first power signal line through the third via connection structure; or the substrate has a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate also has a fourth via connection structure located in the border area; the second wiring structure is electrically connected to the first power signal line through the fourth via connection structure.

7. The display panel according to claim 5, characterized in that, The substrate is provided with a fifth electrode spaced apart from a plurality of first electrodes and a plurality of third electrodes, and a plurality of third pixel openings for at least partially exposing the corresponding fifth electrodes; the display panel includes a third photoresist layer and a third light-emitting functional part, the third photoresist layer is disposed on the side of the second photoresist layer away from the substrate, and the third photoresist layer is provided with a third vapor deposition opening that penetrates the first photoresist layer and communicates with the third pixel opening to expose the fifth electrode; The third light-emitting functional part is disposed within the third vapor deposition opening and the third pixel opening, and is covered on the corresponding fifth electrode.

8. The display panel according to claim 7, characterized in that, The display panel includes a second encapsulation layer, which is disposed between the second light-emitting functional part and the third photoresist layer.

9. The display panel according to claim 7, characterized in that, The third light-emitting functional part includes a third light-emitting part and a sixth electrode stacked on the fifth electrode in a direction away from the substrate; the substrate is provided with a plurality of third wiring structures corresponding to the sixth electrode, the third wiring structures are located outside the corresponding third pixel opening and inside the corresponding third vapor deposition opening, for electrical connection with the portion of the sixth electrode located inside the corresponding third vapor deposition opening.

10. The display panel according to claim 9, characterized in that, The substrate has a first power signal line, the display panel has a display area, and the substrate also has a fifth via connection structure located in the display area; the third wiring structure is electrically connected to the first power signal line through the fifth via connection structure; or the substrate has a first power signal line, the display panel has a display area and a border area adjacent to the display area, and the substrate also has a sixth via connection structure located in the border area; the third wiring structure is electrically connected to the first power signal line through the sixth via connection structure.

11. The display panel according to claim 10, characterized in that, The second electrode, the fourth electrode, and the sixth electrode are electrically connected to each other.

12. The display panel according to claim 10, characterized in that, The first wiring structure, the second wiring structure, and the third wiring structure are electrically connected to each other.

13. A method for manufacturing a display panel, characterized in that, The method for manufacturing the display panel includes: providing a substrate, wherein the substrate has a plurality of first electrodes arranged at intervals and a plurality of first pixel openings corresponding to the plurality of first electrodes; the first pixel openings are used to at least partially expose the corresponding first electrodes; forming a first photoresist layer on the substrate, the first photoresist layer filling the first pixel openings; removing at least the portion of the first photoresist layer located within the first pixel openings to form a plurality of first evaporation openings on the first photoresist layer, the first evaporation openings being connected to the corresponding first pixel openings to expose the first electrodes; forming a first light-emitting layer on the substrate, the first light-emitting layer including a first light-emitting functional portion, the first light-emitting functional portion being disposed within the first evaporation openings and the first pixel openings, and covering... The substrate is provided with a first electrode; a third electrode is arranged at intervals from the plurality of first electrodes, and a second pixel opening corresponding to the plurality of third electrodes respectively; the second pixel opening is used to at least partially expose the corresponding third electrode; a second photoresist layer is formed on the substrate, the second photoresist layer filling the second pixel opening; at least the portion of the second photoresist layer corresponding to the second pixel opening is removed to form a plurality of second evaporation openings on the second photoresist layer, the second evaporation openings being connected to the corresponding second pixel openings to expose the third electrode; a second light-emitting layer is formed on the substrate, the second light-emitting layer including a second light-emitting functional part, the second light-emitting functional part being disposed in the second evaporation opening and the second pixel opening, and covering the third electrode.

14. The method for manufacturing a display panel according to claim 13, characterized in that, The first light-emitting functional part includes a first light-emitting part and a second electrode stacked on the first electrode in a direction away from the substrate; after providing a substrate, before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of first wiring structures corresponding to the second electrode on the substrate, wherein the first wiring structures are disposed outside the corresponding first pixel opening and inside the corresponding first evaporation opening, for electrical connection with the portion of the second electrode located inside the corresponding first evaporation opening; optionally, the first light-emitting layer includes a first light-emitting sacrificial part, the first light-emitting sacrificial part covers the first photoresist layer, and after forming the first light-emitting layer on the substrate, the method further includes removing the first light-emitting sacrificial part.

15. The method for manufacturing a display panel according to claim 13, characterized in that, Before forming the second photoresist layer on the substrate, the method further includes: forming a first encapsulation layer on the substrate, wherein the first encapsulation layer is disposed on the side of the first light-emitting layer away from the substrate.

16. The method for manufacturing a display panel according to claim 13, characterized in that, The second light-emitting functional part includes a second light-emitting part and a fourth electrode stacked on the third electrode in a direction away from the substrate; After providing a substrate, and before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of second wiring structures corresponding to the fourth electrode on the substrate, wherein the second wiring structures are disposed outside the corresponding second pixel opening and inside the corresponding second evaporation opening, for electrical connection with the portion of the fourth electrode located inside the corresponding second evaporation opening.

17. The method for manufacturing a display panel according to claim 13, characterized in that, The second light-emitting layer includes a second light-emitting sacrificial portion, which covers the second photoresist layer. After the second light-emitting layer is formed on the substrate, the process further includes removing the second light-emitting sacrificial portion.

18. The method for manufacturing a display panel according to claim 15, characterized in that, The substrate is provided with fifth electrodes arranged at intervals from a plurality of first electrodes, and third pixel openings corresponding to the plurality of fifth electrodes respectively; The third pixel opening is used to at least partially expose the corresponding fifth electrode; A third photoresist layer is formed on the substrate, and the third photoresist layer fills the third pixel opening; At least the portion of the third photoresist layer corresponding to the third pixel opening is removed to form a plurality of third vapor deposition openings on the third photoresist layer. The third vapor deposition openings are connected to the corresponding third pixel openings to expose the fifth electrode. A third light-emitting layer is formed on the substrate. The third light-emitting layer includes a third light-emitting functional part, which is disposed within the third evaporation opening and the third pixel opening, and covers the fifth electrode.

19. The method for manufacturing a display panel according to claim 18, characterized in that, Before forming the third photoresist layer on the substrate, the method further includes: forming a second encapsulation layer on the substrate, wherein the second encapsulation layer is disposed on the side of the second light-emitting layer away from the substrate.

20. The method for manufacturing a display panel according to claim 18, characterized in that, The third light-emitting functional part includes a third light-emitting part and a sixth electrode stacked on the fifth electrode in a direction away from the substrate; After providing a substrate, and before forming a first photoresist layer on the substrate, the method further includes: forming a plurality of third wiring structures corresponding to the sixth electrode on the substrate, wherein the third wiring structures are disposed outside the corresponding third pixel opening and inside the corresponding third vapor deposition opening, for electrical connection with the portion of the sixth electrode located inside the corresponding third vapor deposition opening.

21. The method for manufacturing a display panel according to claim 18, characterized in that, The third light-emitting layer includes a third light-emitting sacrificial portion, which covers the third photoresist layer. After the third light-emitting layer is formed on the substrate, the process further includes removing the third light-emitting sacrificial portion.

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