Scraper tool and chip gluing tool
By designing a scraper tool with concave grooves and combining it with the chip glue coating tool, the existing glue coating methods are solved, and the uniform coverage and thickness control of conductive adhesive at the bottom of the chip is achieved, which improves the quality and efficiency of chip bonding.
Patent Information
- Application Number
- CN202411568073.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-03-21
AI Technical Summary
The existing glue coating methods are inefficient and it is difficult to accurately control the glue coating spot and glue coating amount, resulting in unstable chip bonding quality.
A scraper tool is designed with a concave groove with a width of the same as the chip bonding area and a depth of half the thickness of the chip. The tool is combined with the chip glue coating tool, and the scraper tool can move freely above the chip bonding area through the slide rail and the slide rail mounting, achieving uniform scraping and smoothing control of the conductive glue.
Through the design of the scraper tool, the conductive adhesive on the bottom of the chip can be ensured to cover the entire bonding surface, control the thickness of the conductive adhesive, avoiding the situation of hollows at the bottom of the chip or the amount of local glue is too low, and the chip bonding quality and efficiency are improved.
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Figure CN119657428A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of chip bonding, in particular to a scraper tool and a chip glue coating tool. Background Art
[0002] The bare chip in the microwave component is bonded to the component housing by conductive adhesive. Good bonding effect provides reliable physical support and heat dissipation for the bare chip. Therefore, in the microelectronics assembly process, the special process of conductive adhesive bonding has high requirements for the control of the amount of adhesive applied, which directly affects the quality of the pasted bare chip.
[0003] The commonly used glue coating methods in the micro-assembly industry are manual glue coating and needle glue dispensing. Among them, the manual glue coating method is to flatten the conductive glue in the installation area with a coating needle under a high-power microscope. This operation method is inefficient and difficult to control the consistency of the coating amount. That is, if the conductive glue layer is too thin, it is easy to cause gaps around the chip or voids at the bottom of the chip, resulting in insufficient chip bonding; if the conductive glue layer is too thick, it is easy to cause conductive glue overflow around the chip, causing the chip to short-circuit. In addition, the chip bonding process stipulates that no gaps are allowed around the bonded chip, and the climbing height of the conductive glue should be less than 2 / 3 of the thickness of the adhesive, so it is more appropriate to control the thickness of the adhesive layer to 1 / 2 of the device height. The needle glue dispensing method is to apply glue in the chip installation area in the form of local dotting or local scribing, and after placing the chip in the installation area, press and four-way friction are used to fill the uncoated area. This operation method causes the conductive glue to easily climb onto the chip surface when pressed or rubbed, causing a short circuit. The area without glue is filled by squeezing and rubbing, and the spread of the conductive glue at the bottom of the chip cannot be directly known, which may cause the conductive glue to not completely fill the entire bonding surface or the conductive glue layer in some areas to be too thin. The needle tube dispensing method has high requirements for the location of glue dispensing and the control of the amount of glue dispensing, and is difficult to operate. In summary, the existing glue coating method is inefficient and it is difficult to accurately control the glue coating point and amount.
[0004] In view of this, this application is hereby filed. Summary of the invention
[0005] The technical problem to be solved by the present invention is that the existing glue coating method has low efficiency and is difficult to accurately control the glue coating point and glue coating amount.
[0006] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:
[0007] In a first aspect, a scraper tool is provided, comprising a blade head and a blade body; the tail end of the blade head is connected to the blade body, and the head end of the blade head has a concave groove; the width of the concave groove = the width of the chip bonding area, and the depth of the concave groove = half the thickness of the chip.
[0008] Furthermore, the blade body includes a handle and a connecting mechanism; the blade head is connected to the handle via the connecting mechanism.
[0009] Furthermore, one end of the knife handle is provided with an external thread; one end of the connecting mechanism is fixedly connected to the tail of the knife head, and the other end of the connecting mechanism is provided with an internal thread, and the other end of the connecting mechanism is threadedly connected to one end of the knife handle.
[0010] In a second aspect, a chip coating tool is provided, comprising a microwave component mounting module, a first slide rail mounting member, a second slide rail mounting member, a positioning slide rail and a scraper tool as described in the first aspect; the microwave component mounting module is clamped between the first slide rail mounting member and the second slide rail mounting member; the positioning slide rail is clamped between the first slide rail mounting member and the second slide rail mounting member, the positioning slide rail is located above the microwave component mounting module, and the positioning slide rail can slide back and forth between the first slide rail mounting member and the second slide rail mounting member; the scraper tool is arranged on the positioning slide rail, and the chip bonding area is located in the concave groove of the tool head.
[0011] Furthermore, the microwave component mounting module is clamped at the bottom of the first slide rail mounting member and the second slide rail mounting member; a first strip slide groove is provided on the upper portion of the first slide rail mounting member, and a second strip slide groove is provided on the upper portion of the second slide rail mounting member, the first strip slide groove and the second strip slide groove are arranged opposite to each other, the first strip slide groove and the second strip slide groove are parallel, and the first strip slide groove and the second strip slide groove are located at the same height; one end of the positioning slide rail is located in the first strip slide groove, and the other end of the positioning slide rail is located in the second strip slide groove; a mounting hole is provided on the positioning slide rail, and the scraper tool is installed in the mounting hole.
[0012] Furthermore, the chip coating tooling also includes a base; the base includes an operating table, and a strip groove is provided on the surface of the operating table; the bottom of the first slide rail mounting component and the bottom of the second slide rail mounting component are both provided with protrusions; the protrusion of the first slide rail mounting component and the protrusion of the second slide rail mounting component are both located in the strip groove.
[0013] Furthermore, the base includes a first side wall and a second side wall; the first slide rail mounting component is connected to the first side wall via a plurality of locking screws; and the second slide rail mounting component is connected to the second side wall via a plurality of the locking screws.
[0014] Compared with the prior art, the present invention has the following advantages and beneficial effects:
[0015] 1. The blade of the scraper tool is designed with a concave groove. The width of the concave groove is the same as the width of the chip bonding area. The concave groove of the blade can be used to scrape the pre-applied conductive glue flat to ensure that the conductive glue at the bottom of the chip covers the entire chip bonding surface. In addition, the depth of the concave groove is set to half the thickness of the chip. While scraping the conductive glue flat, the thickness of the conductive glue can be controlled according to the depth of the concave groove, so that the chip can be pressed synchronously after installation to ensure that the overflow height of the conductive glue is not higher than 2 / 3 of the chip thickness, and to ensure that there will be no voids or insufficient glue at the bottom of the chip.
[0016] 2. The chip glue coating tool can make the scraper tool move freely above the chip bonding area through the slide rail and the slide rail mounting part, so as to facilitate the scraping of the conductive glue. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 A schematic structural diagram of a scraper tool provided by an embodiment of the present invention;
[0019] Figure 2 A schematic structural diagram of a chip gluing tooling provided in an embodiment of the present invention.
[0020] Marks and corresponding parts names in the attached drawings:
[0021] 1-scraper tool, 2-microwave component mounting module, 3-first slide rail mounting piece, 4-second slide rail mounting piece, 5-positioning slide rail, 6-base, 7-locking screw, 11-knife head, 12-blade body, 61-operating table, 62-strip groove, 63-first side wall, 64-second side wall, 121-knife handle, 122-connecting mechanism. DETAILED DESCRIPTION
[0022] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The exemplary embodiments of the present invention and their description are only used to explain the present invention and are not intended to limit the present invention.
[0023] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to one of ordinary skill in the art that these specific details are not necessarily employed to practice the present invention. In other embodiments, in order to avoid obscuring the present invention, well-known structures, circuits, materials, or methods are not specifically described.
[0024] Throughout the specification, references to "one embodiment," "an embodiment," "an example," or "an example" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment of the present invention. Therefore, the phrases "one embodiment," "an embodiment," "an example," or "an example" appearing in various places throughout the specification do not necessarily all refer to the same embodiment or example. In addition, particular features, structures, or characteristics may be combined in one or more embodiments or examples in any suitable combination and / or sub-combination. In addition, it will be appreciated by those of ordinary skill in the art that the figures provided herein are for illustrative purposes and that the figures are not necessarily drawn to scale. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0025] In the description of the present invention, the directions or positional relationships indicated by terms such as “front”, “rear”, “left”, “right”, “up”, “down”, “vertical”, “horizontal”, “high”, “low”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limiting the scope of protection of the present invention.
[0026] Example 1: Figure 1 As shown, this embodiment provides a scraper tool 1, which consists of a blade head 11 and a blade body 12. The first section of the blade head 11 has a concave groove, the width of the concave groove is the same as the width of the chip bonding area, and the depth of the concave groove is half the thickness of the chip. The blade body 12 is divided into a handle 121 and a connecting mechanism 122. The connecting mechanism 122 is a tension nut, and the tail end of the blade head 11 is fixedly connected to one end of the tension nut; the other end of the tension nut has an internal thread. One end of the blade body 12 has an external thread, and the external thread matches the internal thread of the tension nut. The tension nut inlaid with the above-mentioned blade head 11 is threadedly connected to the blade body 12 to form Figure 1 The scraper tool 1 shown in the figure can use the concave groove of the blade head 11 to scrape the pre-applied conductive glue flat, ensuring that the conductive glue at the bottom of the chip covers the entire chip bonding surface, and while scraping the conductive glue flat, the thickness of the conductive glue can be controlled according to the depth of the concave groove, so that after the chip is installed, the chip can be pressed synchronously to ensure that the overflow height of the conductive glue is not higher than 2 / 3 of the chip thickness, and ensure that there will be no voids or insufficient glue at the bottom of the chip.
[0027] Embodiment 2: To facilitate the use of the scraper tool 1 shown in Embodiment 1, this embodiment provides a chip glue coating tool. Figure 2As shown, the chip gluing tooling includes a microwave component mounting module 2, a first slide rail mounting member 3, a second slide rail mounting member 4, a positioning slide rail 5, a base 6 and four locking screws 7. Among them, a first strip slide groove is arranged on the upper part of the first slide rail mounting member 3, a second strip slide groove is arranged on the upper part of the second slide rail mounting member 4, the first strip slide groove and the second strip slide groove are arranged opposite to each other, the first strip slide groove and the second strip slide groove are parallel, and the first strip slide groove and the second strip slide groove are located at the same height. The positioning slide rail 5 is in the shape of a long strip, and a mounting hole for installing the scraper tool 1 is arranged in the middle position of the positioning slide rail 5. The base 6 includes an operating table 61, and a strip groove 62 is arranged on the surface of the operating table 61; correspondingly, the bottom of the first slide rail mounting member 3 and the bottom of the second slide rail mounting member 4 are both provided with bumps; further, the base 6 also includes a first side wall 63 and a second side wall 64.
[0028] refer to Figure 2 , the installation method of the above-mentioned components is as follows: first, place the first slide rail mounting member 3 and the second slide rail mounting member 4 side by side on the operating table 61 of the base 6, so that the protrusions of the first slide rail mounting member 3 and the protrusions of the second slide rail mounting member 4 are both embedded in the strip groove 62 of the operating table 61, and the first slide rail mounting member 3 and the second slide rail mounting member 4 can slide along the track of the strip groove. Then, place the microwave component mounting module 2 on the operating table 61 of the base 6, so that the microwave component mounting module 2 is clamped between the first slide rail mounting assembly and the second slide rail mounting assembly. Next, the positioning slide rail 5 is also clamped between the first slide rail mounting member 3 and the second slide rail mounting member 4. Specifically, one end of the positioning slide rail 5 is embedded in the first strip groove 62, and the other end of the positioning slide rail 5 is embedded in the second strip groove 62, so that the positioning slide rail 5 can slide back and forth between the first slide rail mounting member 3 and the second slide rail mounting member 4. Next, install the scraper tool 1 in the mounting hole so that the chip bonding area is located in the concave groove of the cutter head 11. Finally, the first slide rail mounting member 3 and the second slide rail mounting member 4 are fixed by tightening the four locking screws 7 .
[0029] use Figure 2 The steps of gluing the chip gluing tool shown are as follows:
[0030] Step 1: Use a dispensing device to apply conductive glue to the die attach area.
[0031] Step 2: Move the positioning rail 5 and use the concave groove on the scraper tool 1 to scrape the conductive glue flat.
[0032] Step 3: Unscrew the four locking screws 7, and remove the first slide rail mounting member 3, the second slide rail mounting member 4, the positioning slide rail 5 and the scraper tool 1.
[0033] Step 4: Use special tweezers to pick up the chip and place it on the chip bonding area.
[0034] Step 5: Use a special pressure array to press the chip to remove bubbles at the bottom of the chip.
[0035] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A scraper tool, characterized in that: The invention comprises a blade head (11) and a blade body (12); the tail end of the blade head (11) is connected to the blade body (12), and the head end of the blade head (11) has a concave groove; the width of the concave groove is equal to the width of the chip bonding area, and the depth of the concave groove is equal to half the thickness of the chip.
2. A scraper tool according to claim 1, characterized in that: The blade body (12) comprises a blade handle (121) and a connecting mechanism (122); the blade head (11) is connected to the blade handle (121) via the connecting mechanism (122).
3. A scraper tool according to claim 2, characterized in that: One end of the knife handle (121) is provided with an external thread; one end of the connecting mechanism (122) is fixedly connected to the tail of the knife head (11), the other end of the connecting mechanism (122) is provided with an internal thread, and the other end of the connecting mechanism (122) is threadedly connected to one end of the knife handle (121).
4. A chip gluing tool, characterized in that: It comprises a microwave component mounting module (2), a first slide rail mounting member (3), a second slide rail mounting member (4), a positioning slide rail (5) and a scraper tool (1) as described in any one of claims 1 to 3; the microwave component mounting module (2) is clamped between the first slide rail mounting member (3) and the second slide rail mounting member (4); the positioning slide rail (5) is clamped between the first slide rail mounting member (3) and the second slide rail mounting member (4), the positioning slide rail (5) is located above the microwave component mounting module (2), and the positioning slide rail (5) can slide back and forth between the first slide rail mounting member (3) and the second slide rail mounting member (4); the scraper tool (1) is arranged on the positioning slide rail (5), and the chip bonding area is located in the concave groove of the tool head (11).
5. A chip glue coating tool according to claim 4, characterized in that: The microwave component mounting module (2) is clamped at the bottom of the first slide rail mounting member (3) and the second slide rail mounting member (4); a first strip slide groove is disposed on the upper portion of the first slide rail mounting member (3), and a second strip slide groove is disposed on the upper portion of the second slide rail mounting member (4); the first strip slide groove and the second strip slide groove are disposed opposite to each other, the first strip slide groove and the second strip slide groove are parallel to each other, and the first strip slide groove and the second strip slide groove are located at the same height; one end of the positioning slide rail (5) is located in the first strip slide groove, and the other end of the positioning slide rail (5) is located in the second strip slide groove; a mounting hole is disposed on the positioning slide rail (5), and the scraper tool (1) is mounted in the mounting hole.
6. A chip gluing tool according to claim 4 or 5, characterized in that: It also includes a base (6); the base (6) includes an operating table (61), and the surface of the operating table (61) is provided with a strip groove (62); the bottom of the first slide rail mounting member (3) and the bottom of the second slide rail mounting member (4) are both provided with a protrusion; the protrusion of the first slide rail mounting member (3) and the protrusion of the second slide rail mounting member (4) are both located in the strip groove (62).
7. A chip gluing tool according to claim 6, characterized in that: The base (6) comprises a first side wall (63) and a second side wall (64); the first slide rail mounting member (3) is connected to the first side wall (63) via a plurality of locking screws (7); and the second slide rail mounting member (4) is connected to the second side wall (64) via a plurality of locking screws (7).