Laser processing method, device and equipment and computer readable storage medium

Abstract

The invention discloses a laser processing method, device and equipment and a computer readable storage medium, and relates to the technical field of laser processing, the method is applied to a laser processing system, the laser processing system comprises a laser device and a galvanometer, and the method comprises the steps that the galvanometer is controlled to move at a preset speed at a constant speed; monitoring the real-time position of the galvanometer; and when the real-time position is matched and consistent with a preset galvanometer position corresponding to a preset initial chip on the wafer to be processed, a laser is controlled to intermittently emit laser beams so that the laser beams reflected by the galvanometer can sequentially shoot down the chips to be processed on the wafer to be processed. According to the invention, the laser processing efficiency of each chip on the wafer can be improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing method, device, equipment and computer-readable storage medium. Background Art

[0002] Wafers are the basic materials of integrated circuits, and a large number of chips are placed on their surface. In order to meet the requirements of different packaging products for wafer size, it is necessary to transfer the chips on a wafer of one size to a wafer of another size, and ensure that the transferred chips maintain their original functions on the new wafer, so that the new wafer can be used in packaging products that match its size.

[0003] At present, dot matrix processing is usually used to achieve mass transfer of chips on wafers. The core steps of this dot matrix processing method include: first start the galvanometer motor to move the galvanometer to a galvanometer position corresponding to a point to be processed, and then control the laser to emit a laser beam so that the laser beam reflected by the galvanometer can shoot down the chip at the current point to be processed on the original wafer. After completing the processing of one point, control the galvanometer motor to restart, move the galvanometer to the galvanometer position corresponding to the next point to be processed, and repeat the above steps of laser shooting down the chip until all chips on the original wafer are shot down. However, when processing each chip on the original wafer one by one, it is necessary to control the galvanometer motor to start and stop frequently, which leads to the problem of low wafer processing efficiency.

[0004] Therefore, how to improve the efficiency of laser processing of each chip on the wafer is a problem that needs to be solved urgently. Summary of the invention

[0005] The main purpose of this application is to provide a laser processing method, device, equipment and computer-readable storage medium, aiming to improve the efficiency of laser processing of each chip on a wafer.

[0006] To achieve the above-mentioned purpose, the present application provides a laser processing method, which is applied to a laser processing system, wherein the laser processing system includes a laser and a galvanometer, and the laser processing method includes:

[0007] Controlling the galvanometer to move at a preset speed;

[0008] Monitoring the real-time position of the galvanometer;

[0009] When the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, the laser is controlled to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down each chip to be processed on the wafer to be processed.

[0010] In one embodiment, after the step of monitoring the real-time position of the galvanometer, the method further comprises:

[0011] The real-time position is matched with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, wherein the galvanometer position is a position where the laser beam reflected by the galvanometer can knock down the preset starting chip.

[0012] In one embodiment, after the step of matching the real-time position with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, the method further includes:

[0013] When the real-time position matches the galvanometer position, the galvanometer is controlled to run along a preset chip processing trajectory, wherein the chip processing trajectory takes the galvanometer position as a starting position.

[0014] In one embodiment, the laser processing system further includes a control module, and the control module has a position synchronization output function.

[0015] In one embodiment, the step of controlling the galvanometer to move at a constant speed at a preset speed comprises:

[0016] Sending a start command to the galvanometer through the control module;

[0017] The operating parameters of the galvanometer motor in the galvanometer are obtained, and the motion state of the galvanometer is monitored based on the operating parameters until the galvanometer moves at a constant speed at a preset speed.

[0018] In one embodiment, the step of controlling the laser to intermittently emit a laser beam comprises:

[0019] The laser is controlled to emit a laser beam once at a preset time interval.

[0020] In one embodiment, the method further comprises:

[0021] Obtaining the spacing distance between the galvanometer positions corresponding to the adjacent chips on the wafer to be processed;

[0022] The preset time duration is obtained by dividing the interval distance by the preset speed.

[0023] In addition, to achieve the above-mentioned purpose, the present application also provides a laser processing device, which is applied to a laser processing system, wherein the laser processing system includes a laser and a galvanometer, and the laser processing device includes:

[0024] A control module, used for controlling the galvanometer to move at a preset speed;

[0025] A monitoring module, used for monitoring the real-time position of the galvanometer;

[0026] The processing module is used to control the laser to intermittently emit a laser beam when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, so that the laser beam reflected by the galvanometer can sequentially shoot down each chip to be processed on the wafer to be processed.

[0027] In addition, to achieve the above-mentioned purpose, the present application also provides a storage medium, which is a computer-readable storage medium, and a program for implementing the laser processing method is stored on the computer-readable storage medium. The program for implementing the laser processing method is executed by a processor to implement the steps of the laser processing method as described above.

[0028] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, including a computer program, which implements the steps of the laser processing method as described above when executed by a processor.

[0029] The present application provides a laser processing method, which is applied to a laser processing system. The laser processing system includes a laser and a galvanometer. The present application first controls the galvanometer to move at a constant speed at a preset speed, then monitors the real-time position of the galvanometer, and when the real-time position of the galvanometer matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, controls the laser to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down the chips to be processed on the wafer to be processed.

[0030] In summary, compared with the traditional dot matrix processing method that requires frequent start and stop of the galvanometer, the present application monitors whether the galvanometer moves to the galvanometer position corresponding to the preset starting chip on the wafer to be processed after controlling the galvanometer to move at a preset speed. When the galvanometer is monitored to move to the galvanometer position, the laser is controlled to intermittently emit a laser beam so that the laser beam reflected by the galvanometer can sequentially shoot down the chips to be processed on the wafer to be processed. In this way, there is no need to control the galvanometer to start and stop frequently, and the galvanometer is controlled to run at a constant speed. The laser beam is reflected during the uniform operation of the galvanometer to process the chips on the wafer, thereby improving the efficiency of laser processing of each chip on the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0033] Figure 1 This is a schematic diagram of the process of the first embodiment of the laser processing method of the present application;

[0034] Figure 2 This is a schematic diagram of a parameter configuration interface involved in an embodiment of the laser processing method of the present application;

[0035] Figure 3 A schematic diagram of the laser dotting effect involved in an embodiment of the laser processing method of the present application;

[0036] Figure 4 This is a schematic diagram of the module structure of the laser processing device of this application;

[0037] Figure 5 This is a schematic diagram of the equipment structure of the hardware operating environment involved in the laser processing method in the embodiment of the present application.

[0038] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0039] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0040] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0041] The main solution of the present application is: controlling the galvanometer to move at a preset speed; monitoring the real-time position of the galvanometer; when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, controlling the laser to intermittently emit a laser beam so that the laser beam reflected by the galvanometer can sequentially shoot down each chip to be processed on the wafer to be processed.

[0042] At present, in the existing processing technology, there are only two solutions to achieve uniform processing effect: using uniform speed segment processing and dot matrix processing. Using uniform speed segment processing: it is necessary to add a run-up line to increase the speed of the motion module to the uniform speed segment before processing. This inevitably requires sacrificing the products of the front and rear segments, resulting in waste of raw materials; and this processing method is limited to linear processing of rings, and is not applicable to objects with arcs. Using dot matrix processing: it solves the disadvantage of wasting materials in the above uniform speed segment processing, and can effectively and accurately control the processing position. Not only does it improve the accuracy of processing positioning, but it can also perform large-scale one-time processing according to the dot matrix. However, based on the principle of dot matrix processing, the galvanometer processing each point has a start and stop process, so that the processing efficiency is reduced. That is, the core steps of the dot matrix processing method include: first starting the galvanometer motor to move the galvanometer to a galvanometer position corresponding to a point to be processed, and then controlling the laser to emit a laser beam so that the laser beam reflected by the galvanometer can shoot down the chip at the current point to be processed on the original wafer. After completing the processing of one point, the galvanometer motor is controlled to restart, so that the galvanometer moves to the galvanometer position corresponding to the next point to be processed, and the above steps of laser chip shooting are repeated until all chips on the original wafer are shot off. However, when processing each chip on the original wafer one by one, the galvanometer motor needs to be controlled to start and stop frequently, resulting in low wafer processing efficiency.

[0043] Compared with the traditional dot matrix processing method that requires frequent start and stop of the galvanometer, the present application monitors whether the galvanometer moves to the galvanometer position corresponding to the preset starting chip on the wafer to be processed after controlling the galvanometer to move at a preset speed. When the galvanometer is detected to move to the galvanometer position, the laser is controlled to intermittently emit a laser beam so that the laser beam reflected by the galvanometer can sequentially shoot down the chips to be processed on the wafer to be processed. In this way, there is no need to control the galvanometer to start and stop frequently, and the galvanometer is controlled to run at a constant speed. During the uniform operation of the galvanometer, the laser beam is reflected to process the chips on the wafer, thereby improving the efficiency of laser processing of each chip on the wafer.

[0044] It should be noted that the execution subject of the method in each embodiment of the laser processing method of the present application may be a laser processing system, or a laser processing device capable of realizing the above functions, etc., and this embodiment does not specifically limit this. The laser processing system includes a laser and a galvanometer. The following takes the laser processing system as an example to illustrate this embodiment and the following embodiments.

[0045] Based on this, the present application proposes a laser processing method of the first embodiment, please refer to Figure 1 , the laser processing method comprises steps S10 to S30:

[0046] Step S10, controlling the galvanometer to move at a preset speed;

[0047] It should be noted that the laser processing system of the present application includes a laser and a galvanometer, wherein the laser is used to emit laser light, and the galvanometer is used to work in conjunction with the laser to reflect the laser light emitted by the laser to a specific point. The speed of the uniform motion of the galvanometer is preset, that is, the above-mentioned preset speed, wherein the embodiment of the present application does not limit the specific size of the above-mentioned preset speed.

[0048] For example, in a laser processing system, controlling the galvanometer to move at a preset speed is the core link to ensure processing accuracy and efficiency. The specific implementation method involves using advanced control systems and precision sensors to accurately adjust the movement of the galvanometer. First, the control system sets the target speed of the galvanometer according to preset processing parameters, which is determined according to the specific requirements of the processing task and the material properties. Subsequently, the control system sends a precise control signal to the galvanometer motor to start the motor and gradually accelerate to the preset speed. During this process, the system monitors the operating parameters of the galvanometer motor, such as speed, current, and voltage, in real time through sensors to ensure that the motion state of the galvanometer matches the preset requirements.

[0049] In this embodiment, the laser processing system further includes a control module, and the control module has a position synchronization output function.

[0050] It should be noted that the laser processing system also includes a control card, that is, the above-mentioned control module. The control card is respectively connected to the laser and the galvanometer for controlling the cooperation of the laser and the galvanometer so that the laser beam falls on a specific point, so as to use the laser beam to hit points with equal spacing. It should be understood that the control module has a PSO (Position Synchronized Output) function, and PSO can specifically be vPSO, where v represents the product function code. That is, the embodiment of the present application adds the position synchronized output technology to the galvanometer control. The laser is provided with an external interface TRIG / GATE, which belongs to a BNC (Bayonet Neill-Concelman, bayonet nut connector) interface for receiving trigger signals and control signals.

[0051] In this embodiment, the step S10 may include:

[0052] Step S101, sending a start instruction to the galvanometer through the control module;

[0053] Step S102, obtaining operating parameters of a galvanometer motor in the galvanometer, and monitoring the motion state of the galvanometer based on the operating parameters until the galvanometer moves at a constant speed at a preset speed.

[0054] It should be noted that the galvanometer motor is installed inside the galvanometer to drive the galvanometer to move. The control module can refer to the dynamic parameters of the galvanometer motor to determine whether the galvanometer moves at a preset speed.

[0055] A start command is sent to the galvanometer through the control module, and the command is used to activate the galvanometer motor and instruct the galvanometer motor to start accelerating, and then the operating parameters of the galvanometer motor in the galvanometer are obtained, wherein the operating parameters include but are not limited to motor speed, current, voltage, and possible position encoder feedback. Based on the operating parameters, the motion state of the galvanometer is monitored until the galvanometer is detected to move at a preset speed, that is, the galvanometer is considered to have accelerated to the preset speed and is moving at a constant speed.

[0056] Step S20, monitoring the real-time position of the galvanometer;

[0057] After determining that the galvanometer moves at a constant speed at a preset speed, the control module monitors the real-time position of the galvanometer.

[0058] For example, in a laser processing system, monitoring the real-time position of the galvanometer is a key technology that ensures that the laser beam can accurately act on the chip on the wafer to be processed according to the predetermined trajectory. The specific implementation method is as follows: First, the system sends a start command to the galvanometer through the control module to activate the galvanometer motor and start the acceleration process. At the same time as the galvanometer motor is started, the system obtains the operating parameters of the galvanometer motor in real time through built-in sensors or interfaces. These parameters may include the motor speed, current, voltage, and feedback information from the position encoder. Using these operating parameters, the system can monitor the motion state of the galvanometer and compare it with the preset speed to confirm whether the galvanometer has reached and maintained a preset uniform motion state.

[0059] In this embodiment, after step S20, the laser processing method of the present application further includes:

[0060] Step A10, matching the real-time position with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, wherein the galvanometer position is a position where the laser beam reflected by the galvanometer can knock down the preset starting chip.

[0061] It should be noted that the original wafer to which the chip needs to be transferred is called the wafer to be processed. Before laser processing the wafer to be processed, the wafer to be processed is first leveled and aligned, and the correspondence between the chip position on the wafer to be processed and the galvanometer position is calibrated, that is, the mapping relationship between the position of the galvanometer and the actual position of the chip when laser processing the chip on the wafer to be processed. Set the first chip to be laser processed on the wafer to be processed, that is, the above-mentioned preset starting chip. Based on the mapping relationship between the actual position of the chip on the wafer to be processed and the position of the galvanometer, determine the preset galvanometer position corresponding to the preset starting chip.

[0062] After monitoring the real-time position of the galvanometer, the real-time position is matched with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, wherein the galvanometer position is the position where the laser beam reflected by the galvanometer can knock down the preset starting chip.

[0063] Step S30, when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, the laser is controlled to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down each chip to be processed on the wafer to be processed.

[0064] When it is detected that the real-time position of the galvanometer matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, the laser is controlled to intermittently emit the laser beam so that the galvanometer reflects the laser beam emitted by the laser to the chip to be processed on the wafer to be processed, thereby knocking down each chip to be processed on the wafer to be processed in turn.

[0065] For example, when it is detected that the real-time position of the galvanometer matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, the control card sends a command to the laser to control the laser to start intermittently emitting a laser beam. It should be noted that the laser has a receiving window for TTL (Transistor-Transistor Logic) signals, and can identify and output a corresponding number of laser pulse beams in real time according to the high-frequency TTL signal given by the control card.

[0066] In this embodiment, after step A10, the laser processing method of the present application further includes:

[0067] Step B10, when the real-time position matches the galvanometer position, controlling the galvanometer to run along a preset chip processing trajectory, wherein the chip processing trajectory takes the galvanometer position as a starting position.

[0068] It should be noted that a suitable chip processing trajectory can be selected in advance according to the chip distribution on the wafer to be processed, wherein the chip processing trajectory characterizes the order in which the chips to be processed are processed, that is, the chip processing trajectory covers the galvanometer positions corresponding to all the chips on the wafer to be processed, and is used to guide the motion trajectory of the galvanometer. In an embodiment of the present application, the chip processing trajectory is set to a bow-shaped surround trajectory. It can be understood that the chips on the wafer to be processed are arranged in a matrix, and the distance between every two adjacent chips is equal. Assuming that a 4 by 5 chip array is distributed on the wafer to be processed, that is, 4 rows, and 5 chips are arranged in each row, then the bow-shaped surround trajectory can be the galvanometer position corresponding to the leftmost chip of the first row as the starting position, and the remaining chips of the first row are processed from left to right in sequence. After processing the rightmost chip of the first row, the rightmost chip of the second row is processed, and then the remaining chips of the second row are processed from right to left in sequence, and so on. The cycle continues until the rightmost chip of the fifth row is processed, that is, the end position of the bow-shaped surround trajectory is the galvanometer position corresponding to the rightmost chip of the fifth row.

[0069] When the real-time position of the galvanometer matches the preset galvanometer position corresponding to the preset starting chip, the galvanometer is controlled to run along the preset chip processing trajectory, wherein the starting position of the chip processing trajectory is the preset galvanometer position corresponding to the preset starting chip.

[0070] In this embodiment, the step S30 may include:

[0071] Step S301, controlling the laser to emit a laser beam once every preset time interval.

[0072] The control module controls the laser to emit a laser beam once every preset time interval, that is, to emit the laser beam intermittently. It should be noted that the duration of each laser beam emission is the time length preset by the user, and the embodiment of the present application does not limit the specific size of the duration of a single laser beam emission.

[0073] For example, in a laser processing system, achieving precise control over the laser beam emitted by the laser is the key to ensuring processing quality and efficiency. The specific implementation method is as follows: the system first sets a preset duration, which is pre-calculated and set according to the processing requirements and material properties to ensure that the laser beam can be emitted at a constant interval. When the galvanometer moves at a constant speed and accurately locates the chip position on the wafer to be processed, the system triggers the laser to emit a laser beam. The emission of the laser is precisely controlled by the control module to ensure that the time interval between each emission matches the preset duration. This control method relies on a high-precision timer and a stable control system to ensure that the emission timing of the laser beam is synchronized with the position of the galvanometer, thereby achieving precise processing of the chip on the wafer.

[0074] In this embodiment, the laser processing method of the present application further includes:

[0075] Step C10, obtaining the spacing distance between the galvanometer positions corresponding to the adjacent chips on the wafer to be processed;

[0076] Step C20: Divide the interval distance by the preset speed to obtain the preset duration.

[0077] It is worth emphasizing that the chips on the wafer to be processed are evenly distributed, and the distance between every two adjacent chips is equal. In addition, the preset processing trajectory refers to a trajectory connecting the galvanometer positions corresponding to each adjacent chip on the wafer to be repaired, so the distance between any two adjacent galvanometer positions on the preset processing trajectory is equal.

[0078] Obtain the spacing between the galvanometer positions corresponding to adjacent chips on the wafer to be processed, and then divide the spacing by the preset speed of the galvanometer when it moves at a constant speed. The result is the time required for the galvanometer to move from one galvanometer position on the preset processing trajectory to an adjacent galvanometer position, that is, the above-mentioned preset time.

[0079] In one feasible implementation, a constant speed of uniform motion of the galvanometer is pre-set, the point spacing between adjacent chips on the wafer to be processed is determined, and the processing trajectory for laser processing of the current wafer to be processed is pre-set, and then the galvanometer is controlled to move at a preset speed, the real-time position of the galvanometer is monitored, and when the real-time position of the galvanometer reaches the galvanometer position corresponding to the preset starting chip on the wafer to be processed, the galvanometer is controlled to move according to the preset processing trajectory, and the laser is controlled to emit a laser beam once every preset time interval, so that the galvanometer reflects the laser beam to the chip on the wafer to be processed. For example, Figure 2 The figure shows a schematic diagram of the parameter configuration interface. The user can pre-set the uniform motion speed of the galvanometer to 3000mm / s, determine the point spacing between chips to 500 microns, preset the processing trajectory to a bow-shaped surround trajectory, and the galvanometer correction accuracy is less than 5 microns, that is, the errors between processing points, between rows, starting point errors, end point errors and total length errors are all controlled within 5 microns, which meets the processing requirements. In addition, since the processing accuracy is affected by the galvanometer correction accuracy, if the processing accuracy is to be improved, the quality of the galvanometer can be appropriately improved to improve the accuracy of the galvanometer correction. The wafer to be processed is laser processed with the above-set parameters to obtain the final laser landing effect, as shown in the figure. Figure 3 The figure shows the effect of laser dotting. The distance between two adjacent dots is 500.20 microns. The error is very small and almost negligible.

[0080] The embodiment of the present application is applied to a laser processing system, which includes a laser and a galvanometer. The present application first controls the galvanometer to move at a constant speed at a preset speed, then monitors the real-time position of the galvanometer, and when the real-time position of the galvanometer matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, controls the laser to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down the chips to be processed on the wafer to be processed.

[0081] Thus, compared with the traditional dot matrix processing method which requires frequent starting and stopping of the galvanometer, the embodiment of the present application monitors whether the galvanometer moves to the galvanometer position corresponding to the preset starting chip on the wafer to be processed after controlling the galvanometer to move at a preset speed. When the galvanometer is detected to move to the galvanometer position, the laser is controlled to emit a laser beam intermittently so that the laser beam reflected by the galvanometer can sequentially shoot down the chips to be processed on the wafer to be processed. In this way, there is no need to control the galvanometer to start and stop frequently, the galvanometer is controlled to run at a constant speed, and the laser beam is reflected during the uniform operation of the galvanometer to process the chips on the wafer, thereby improving the efficiency of laser processing of each chip on the wafer.

[0082] The embodiment of the present application realizes chip transfer by leveling and aligning the wafer to be processed, determining the minimum spacing between two adjacent chips, performing laser processing at a constant speed, triggering a laser beam at a set position, and shooting the Micro LED (Micro Light Emitting Diode) at the corresponding position onto the download board. In addition, during the entire processing process, since the galvanometer works at a constant speed, the time for starting and stopping the galvanometer motor is saved, thereby improving the chip transfer efficiency.

[0083] The present application also provides a laser processing device, please refer to Figure 4 The laser processing device is applied to a laser processing system, the laser processing system includes a laser and a galvanometer, and the laser processing device includes:

[0084] A control module 10 is used to control the galvanometer to move at a preset speed;

[0085] A monitoring module 20, used for monitoring the real-time position of the galvanometer;

[0086] The processing module 30 is used to control the laser to intermittently emit a laser beam when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, so that the laser beam reflected by the galvanometer can sequentially shoot down each chip to be processed on the wafer to be processed.

[0087] Optionally, the laser processing device further includes a matching module, and the matching module is used to:

[0088] The real-time position is matched with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, wherein the galvanometer position is a position where the laser beam reflected by the galvanometer can knock down the preset starting chip.

[0089] Optionally, the laser processing device further includes a galvanometer control module, and the galvanometer control module is used to:

[0090] When the real-time position matches the galvanometer position, the galvanometer is controlled to run along a preset chip processing trajectory, wherein the chip processing trajectory takes the galvanometer position as a starting position.

[0091] Optionally, the laser processing system further comprises a control module, and the control module has a position synchronization output function.

[0092] Optionally, the control module 10 is further used for:

[0093] Sending a start command to the galvanometer through the control module;

[0094] The operating parameters of the galvanometer motor in the galvanometer are obtained, and the motion state of the galvanometer is monitored based on the operating parameters until the galvanometer moves at a constant speed at a preset speed.

[0095] Optionally, the processing module 30 is further used for:

[0096] The laser is controlled to emit a laser beam once at a preset time interval.

[0097] Optionally, the laser processing device further includes a duration determination module, and the duration determination module is used to:

[0098] Obtaining the spacing distance between the galvanometer positions corresponding to the adjacent chips on the wafer to be processed;

[0099] The preset time duration is obtained by dividing the interval distance by the preset speed.

[0100] The laser processing device provided in the embodiment of the present application adopts the laser processing method in the above embodiment, which can solve the technical problem of how to improve the efficiency of laser processing of each chip on the wafer. Compared with the prior art, the beneficial effects of the laser processing device provided in the embodiment of the present application are the same as the beneficial effects of the laser processing method provided in the above embodiment, and the other technical features in the laser processing device are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0101] The present application provides a laser processing device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the laser processing method in the above-mentioned embodiment one.

[0102] Reference below Figure 5 , which shows a schematic structural diagram of a laser processing device suitable for implementing an embodiment of the present application. Figure 5 The laser processing equipment shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0103] like Figure 5 As shown, the laser processing device may include a processing device 1001 (e.g., a central processing unit, a graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM: Read Only Memory) 1002 or a program loaded from a storage device 1003 to a random access memory (RAM: Random Access Memory) 1004. In RAM1004, various programs and data required for the operation of the laser processing device are also stored. The processing device 1001, ROM1002, and RAM1004 are connected to each other through a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Generally, the following systems can be connected to the I / O interface 1006: an input device 1007 including, for example, a touch screen, a touch pad, a keyboard, a mouse, an image sensor, a microphone, an accelerometer, a gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD: Liquid Crystal Display), a speaker, a vibrator, etc.; a storage device 1003 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 1009. The communication device 1009 can allow the laser processing device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows a laser processing device with various systems, it should be understood that it is not required to implement or have all the systems shown. More or fewer systems can be implemented or have alternatively.

[0104] In particular, according to the embodiments disclosed in the present application, the process described above with reference to the flowchart can be implemented as a computer software program. For example, the embodiments disclosed in the present application include a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network through a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0105] The laser processing equipment provided by the present application, using the laser processing method in the above embodiment, can solve the technical problem of how to improve the efficiency of laser processing of each chip on the wafer. Compared with the prior art, the beneficial effects of the laser processing equipment provided by the present application are the same as the beneficial effects of the laser processing method provided by the above embodiment, and the other technical features of the laser processing equipment are the same as the features disclosed in the method of the previous embodiment, which will not be repeated here.

[0106] It should be understood that the various parts disclosed in this application can be implemented by hardware, software, firmware or a combination thereof. In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0107] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0108] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the laser processing method in the above-mentioned embodiment.

[0109] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0110] The computer-readable storage medium may be included in the laser processing device; or may exist independently without being assembled into the laser processing device.

[0111] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by the laser processing equipment, the laser processing equipment: controls the galvanometer to move at a preset speed; monitors the real-time position of the galvanometer; when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, controls the laser to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down each chip to be processed on the wafer to be processed. .

[0112] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0113] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0114] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0115] The readable storage medium provided in the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned laser processing method, and can solve the technical problem of how to improve the efficiency of laser processing of each chip on a wafer. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in the present application are the same as the beneficial effects of the laser processing method provided in the above-mentioned embodiment, and will not be repeated here.

[0116] An embodiment of the present application provides a computer program product, including a computer program, which implements the steps of the laser processing method as described above when executed by a processor.

[0117] The computer program product provided in this application can improve the efficiency of laser processing of each chip on a wafer. Compared with the prior art, the beneficial effects of the computer program product provided in the embodiment of this application are the same as the beneficial effects of the laser processing method provided in the above embodiment, which will not be repeated here.

[0118] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent processing scope of the present application.

Claims

1. A laser processing method, characterized in that: The laser processing method is applied to a laser processing system, the laser processing system includes a laser and a galvanometer, and the laser processing method includes: Controlling the galvanometer to move at a preset speed; Monitoring the real-time position of the galvanometer; When the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, the laser is controlled to intermittently emit a laser beam so that the laser beam reflected by the galvanometer sequentially shoots down each chip to be processed on the wafer to be processed.

2. The method according to claim 1, characterized in that After the step of monitoring the real-time position of the galvanometer, the method further comprises: The real-time position is matched with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, wherein the galvanometer position is a position where the laser beam reflected by the galvanometer can knock down the preset starting chip.

3. The method according to claim 2, characterized in that After the step of matching the real-time position with a preset galvanometer position corresponding to a preset starting chip on the wafer to be processed, the method further includes: When the real-time position matches the galvanometer position, the galvanometer is controlled to run along a preset chip processing trajectory, wherein the chip processing trajectory takes the galvanometer position as a starting position.

4. The method according to claim 1, characterized in that The laser processing system further comprises a control module, and the control module has a position synchronization output function.

5. The method according to claim 4, characterized in that The step of controlling the galvanometer to move at a preset uniform speed comprises: Sending a start command to the galvanometer through the control module; The operating parameters of the galvanometer motor in the galvanometer are obtained, and the motion state of the galvanometer is monitored based on the operating parameters until the galvanometer moves at a constant speed at a preset speed.

6. The method according to claim 1, characterized in that The step of controlling the laser to intermittently emit a laser beam comprises: The laser is controlled to emit a laser beam once at a preset time interval.

7. The method according to claim 6, characterized in that The method further comprises: Obtaining the spacing distance between the galvanometer positions corresponding to the adjacent chips on the wafer to be processed; The preset time duration is obtained by dividing the interval distance by the preset speed.

8. A laser processing device, characterized in that: The laser processing device is applied to a laser processing system, the laser processing system includes a laser and a galvanometer, and the laser processing device includes: A control module, used for controlling the galvanometer to move at a preset speed; A monitoring module, used for monitoring the real-time position of the galvanometer; The processing module is used to control the laser to intermittently emit a laser beam when the real-time position matches the preset galvanometer position corresponding to the preset starting chip on the wafer to be processed, so that the laser beam reflected by the galvanometer can sequentially shoot down each chip to be processed on the wafer to be processed.

9. A laser processing device, characterized in that: The laser processing device comprises: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the laser processing method according to any one of claims 1 to 7.

10. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the laser processing method according to any one of claims 1 to 7 are implemented.

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