Circuit board assembling equipment and assembling method thereof

By designing a circuit board assembly device that includes a tilting mechanism and visual guidance device, the problem of the board being injured due to stress squeeze during assembly is solved, and the safe installation of the circuit board is achieved.

CN119658328APending Publication Date: 2025-03-21XFUSION DIGITAL TECH CO LTD
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Patent Information

Application Number
CN202411748187.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-21

AI Technical Summary

Technical Problem

During the server assembly process, the circuit board is susceptible to stress squeeze during installation, resulting in injury to the board.

Method used

Design a circuit board assembly device, including an operating platform, a circuit board material picking device and a visual guide device. The circuit board material picking device tilts the circuit board through an inclination mechanism, and after a predetermined height, it is placed flat on the mounting surface of the machine frame, thereby avoiding the circuit board scratches and stress squeezes.

Benefits of technology

It effectively prevents the circuit board from being stressed by mounting on the frame or scratching the frame during assembly, solving the problem of circuit board injury.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides circuit board assembling equipment and an assembling method thereof. The circuit board assembling equipment comprises an operation platform, a circuit board taking device and a visual guiding device. The circuit board taking device comprises a first moving mechanism installed on the operation platform, an inclined mechanism connected to the driving end of the first moving mechanism and a first picking mechanism installed on the inclined mechanism. Before the circuit board is placed on the machine frame, the circuit board is moved to be aligned with the machine frame under the guidance of the visual guiding device, the inclining mechanism drives the first picking mechanism to move till the circuit board inclines relative to the installation face, and after the circuit board descends to the preset height, the circuit board is flatly placed and placed on the installation face. Therefore, the circuit board can be prevented from scratching the machine frame in the process that the circuit board enters the machine frame, the circuit board can be prevented from being stressed due to the fact that the circuit board is lapped on the machine frame or the machine frame is scratched, and the problem that the circuit board is damaged in the assembling process is solved.
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Description

Technical Field

[0001] The present application relates to the field of automated production technology, and in particular to a circuit board assembly device and an assembly method thereof. Background Art

[0002] When assembling a server, a circuit board (eg, a motherboard) needs to be installed flat in a frame. During the installation process, when the circuit board is placed on the frame, the circuit board will be subjected to stress compression during the subsequent fixing process, thereby causing damage to the board. Summary of the invention

[0003] The embodiments of the present application provide a circuit board assembly device and an assembly method thereof, which are intended to solve the problem of circuit board damage during the assembly process.

[0004] In a first aspect, an embodiment of the present application provides a circuit board assembly device, which includes an operating platform, a circuit board picking device, and a visual guidance device.

[0005] The operating platform is used to carry a machine frame, and the machine frame includes a mounting surface; the circuit board picking device includes a first moving mechanism, a tilting mechanism and a first picking mechanism, the first moving mechanism is installed on the operating platform, the driving end of the first moving mechanism can move in the space above the operating platform, the tilting mechanism is connected to the driving end of the first moving mechanism, the first picking mechanism is installed on the side of the tilting mechanism facing the mounting surface, and the driving end of the first moving mechanism can drive the first picking mechanism to pick up the circuit board and move it above the machine frame; the tilting mechanism can drive the first picking mechanism to move until the circuit board is inclined relative to the mounting surface, and after the first moving mechanism drives the first picking mechanism to descend to a predetermined height, the tilting mechanism drives the first picking mechanism to move until the circuit board is parallel to the mounting surface; the visual guidance device is used to provide visual guidance during the process of the first picking mechanism picking up the circuit board and moving it above the machine frame.

[0006] In the embodiment of the present application, before the circuit board is placed in the machine frame, the tilting mechanism drives the first picking mechanism to move the circuit board to be tilted relative to the mounting surface. After the circuit board is lowered to a preset height, the circuit board is laid flat and placed on the mounting surface. This prevents the circuit board from scratching the machine frame during the process of the circuit board entering the machine frame, thereby preventing the circuit board from being subjected to stress due to resting on the machine frame or scratching the machine frame, thereby solving the problem of circuit board damage caused by the assembly process.

[0007] In some embodiments, the tilting mechanism includes a tilting drive assembly, a first connecting plate and a second connecting plate, the second connecting plate and the first connecting plate being arranged relative to each other and spaced apart, the second connecting plate being rotatable relative to the first connecting plate, the first connecting plate being connected to a driving end of the first moving mechanism, the tilting drive assembly being mounted on the first connecting plate, and the driving end of the tilting drive assembly being connected to the second connecting plate, the first picking mechanism being connected to a side of the second connecting plate facing away from the first connecting plate, the tilting drive assembly being used to drive the second connecting plate to rotate relative to the first connecting plate until the second connecting plate is tilted relative to the mounting surface, or being used to drive the second connecting plate to rotate relative to the first connecting plate until the second connecting plate is parallel to the mounting surface.

[0008] In some embodiments, the tilting mechanism further includes a first limiting assembly, wherein the first limiting assembly is connected to one of the first connecting plate and the second connecting plate;

[0009] When the second connecting plate is parallel to the mounting surface, the first limiting assembly is abutted against the other of the first connecting plate and the second connecting plate; and when the second connecting plate is inclined relative to the mounting surface, the first limiting assembly is opposite to and spaced from the other of the first connecting plate and the second connecting plate.

[0010] In some embodiments, the first connecting plate has a first portion and a second portion, the first portion and the second portion are located on opposite sides of a rotation axis of the second connecting plate, the second connecting plate has a third portion and a fourth portion, the third portion and the fourth portion are located on opposite sides of a rotation axis of the second connecting plate, and the first portion is disposed opposite to the third portion, and the second portion is disposed opposite to the fourth portion;

[0011] The tilting mechanism further includes a second limiting assembly, wherein the first limiting assembly and the second limiting assembly are located on opposite sides of the rotation axis of the second connecting plate; the second limiting assembly is connected to one of the second part and the fourth part;

[0012] When the second connecting plate is parallel to the mounting surface, the second limiting assembly is opposite to and spaced from the other of the second part and the fourth part; and when the second connecting plate is inclined relative to the mounting surface, the second limiting assembly abuts against the other of the second part and the fourth part.

[0013] In some embodiments, the circuit board picking device further includes a pressure sensor for monitoring the pressure exerted on the circuit board picking device, and the pressure sensor is connected to the second connecting plate.

[0014] In some embodiments, the visual guidance device includes a controller, a first camera and a second camera, the first camera is used to capture an image of the machine frame, and the second camera is used to capture an image of the circuit board picked up by the first picking mechanism. The controller can generate a first driving signal based on the image captured by the first camera and the image captured by the second camera to drive the first moving mechanism to move to adjust the position of the circuit board.

[0015] In some embodiments, the first camera is mounted on a driving end of the first moving mechanism.

[0016] In some embodiments, the circuit board assembly equipment also includes a locking device, which includes a second moving mechanism installed on the operating platform and a second picking mechanism connected to the driving end of the second moving mechanism, and the driving end of the second moving mechanism can move in the space above the operating platform to drive the second picking mechanism to pick up the fixing part and drive the fixing part to pass through the circuit board and the machine frame in sequence.

[0017] In some embodiments, the circuit board assembly equipment also includes a height measuring mechanism, which is arranged on the locking device. The height measuring mechanism is used to detect the distance between the circuit board in the frame and the height measuring mechanism, so that the controller can determine whether the circuit board is placed flat on the installation surface.

[0018] To achieve the above-mentioned purpose, the technical solution adopted in the second embodiment of the present application is: a circuit board assembly method, comprising:

[0019] The visual guidance device guides the circuit board picking device to pick up the circuit board and transport the circuit board to above the mounting surface on the machine frame;

[0020] The circuit board picking device drives the circuit board to tilt, so that one side of the circuit board is tilted relative to the mounting surface;

[0021] The circuit board picking device drives the inclined circuit board into the machine frame;

[0022] The circuit board taking device lays the circuit board in the frame flat and places it on the installation surface.

[0023] The beneficial effect of the circuit board assembly method provided by the present application is that before the circuit board is placed in the machine frame, the circuit board picking device can pick up the circuit board under the guidance of the visual guidance device and move the circuit board to align with the machine frame, which can prevent the circuit board from resting on the machine frame during the process of the circuit board entering the machine frame; at the same time, the circuit board picking device drives the circuit board to tilt so that one side of the circuit board is tilted relative to the mounting surface, and the circuit board picking device drives the tilted circuit board into the machine frame, and then lays the circuit board flat and places it on the mounting surface, which can prevent the circuit board from scratching the machine frame during the process of the circuit board entering the machine frame, thereby avoiding the circuit board from being subjected to stress due to resting on the machine frame or scratching the machine frame, and solving the problem of circuit board damage caused by the assembly process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0025] Figure 1 is a schematic structural diagram of a circuit board assembly device in one of the embodiments of the present application;

[0026] Figure 2 yes Figure 1 A partial structural schematic diagram of a circuit board picking device in a circuit board assembly device shown;

[0027] Figure 3 yes Figure 2 A schematic structural diagram of a tilting mechanism and a first picking mechanism in a circuit board picking device shown;

[0028] Figure 4 yes Figure 2 A schematic structural diagram of the circuit board picking device from another perspective shown;

[0029] Figure 5 yes Figure 4 A schematic structural diagram of a tilting mechanism and a first picking mechanism in a circuit board picking device shown;

[0030] Figure 6 yes Figure 1 A partial structural schematic diagram of a locking device in a circuit board assembly device shown;

[0031] Figure 7 yes Figure 1 A schematic structural diagram of a first moving mechanism, a second moving mechanism and a part of a supporting frame in a circuit board assembly device shown;

[0032] Figure 8 yes Figure 1 A schematic structural diagram of a frame loading device in a circuit board assembly device shown;

[0033] Fig. 9 yes Figure 8 A structural schematic diagram of the frame feeding device from another perspective shown;

[0034] Fig.10 is a flow chart of a circuit board assembly method in one embodiment of the present application;

[0035] Fig.11 yes Fig.10 A schematic diagram of a part of the assembly process of the circuit board assembly method shown;

[0036] Fig.12 yes Fig.10 Step S100 shown is a flowchart of a visual guidance device guiding a circuit board picking device to pick up a circuit board and transport the circuit board to above a mounting surface on a machine frame;

[0037] Fig.13 yes Fig.12 The flowchart of step S120 shown is that the circuit board picking device picks up the circuit board and transports the circuit board to the top of the second camera;

[0038] Fig.14 yes Fig.10 Step S400 is shown as a flow chart showing that the circuit board taking device lays the circuit board in the frame flat and places it on the mounting surface;

[0039] Fig.15 yes Fig.10 The flowchart of step S500 is shown: the visual guidance device guides the locking device to pick up the fixing component and transport the fixing component to the top of the circuit board in the frame.

[0040] Reference numerals:

[0041] 1. Operating platform; 11. Support table;

[0042] 2. Support frame;

[0043] 3. Frame loading device; 31. Carrier plate; 32. Transmission mechanism; 321. Driving motor; 322. Transmission shaft; 323. Support side plate; 33. Position adjustment mechanism; 331. Stop assembly; 332. Side push assembly; 34. Lifting mechanism; 341. Support frame; 342. Lifting cylinder; 35. Intercepting mechanism;

[0044] 4. Circuit board picking device; 41. First moving mechanism; 411. First three-axis linear module; 412. Rotation drive assembly; 42. Tilt mechanism; 421. Tilt drive assembly; 4211. First linear drive member; 4212. First rack; 4213. First gear; 422. First connecting plate; 4221. First part; 4222. Second part; 423. Second connecting plate; 4231. Third part; 4232. Fourth part; 424. First limiting assembly; 425. Second limiting assembly; 426. Rotation assembly; 4261. First connecting part; 4262. Second connecting part; 4263. Rotation shaft; 43. First picking mechanism; 431. Suction assembly; 432. Clamping assembly; 44. First slide cylinder; 45. Pressure sensor;

[0045] 5. Locking device; 51. Second picking mechanism; 52. Second moving mechanism; 53. Second slide cylinder;

[0046] 6. Feeding device; 61. Material bin; 611. Support block; 62. Lifting mechanism;

[0047] 71, first camera; 72, second camera; 73, third camera;

[0048] 8. Height measuring mechanism;

[0049] 9. Circuit board;

[0050] 10. Machine frame. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0053] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0054] References to "one embodiment", "some embodiments" or "an embodiment" described in the specification of this application mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some other embodiments", "in some other embodiments", etc., which appear at different places in this specification, do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. In addition, in one or more embodiments, particular features, structures or characteristics may be combined in any suitable manner.

[0055] The embodiments of the present application provide a circuit board assembly device and an assembly method thereof, which are intended to solve the problem of circuit board damage during the assembly process.

[0056] In order to illustrate the technical solution of the present application, a description is given below with reference to specific drawings and embodiments.

[0057] Please refer to Figure 1 An embodiment of the present application provides a circuit board assembly device, including an operating platform 1, a circuit board picking device 4 and a visual guidance device.

[0058] The operating platform 1 is used to carry the machine frame 10 ( Figure 1 Not shown, please refer to Fig.11 ), the machine frame 10 includes a mounting surface; the circuit board 9 picking device 4 includes a first moving mechanism 41, a tilting mechanism 42 and a first picking mechanism 43, the first moving mechanism 41 is installed on the operating platform 1, the driving end of the first moving mechanism 41 can move in the space above the operating platform 1, the tilting mechanism 42 is connected to the driving end of the first moving mechanism 41, the first picking mechanism 43 is installed on the side of the tilting mechanism 42 facing the mounting surface, the driving end of the first moving mechanism 41 can drive the first picking mechanism 43 to pick up the circuit board 9 and move it above the machine frame 10; the tilting mechanism 42 can drive the first picking mechanism 43 to move until the circuit board 9 is inclined relative to the mounting surface, and after the first moving mechanism 41 drives the first picking mechanism 43 to descend to a predetermined height, the tilting mechanism 42 drives the first picking mechanism 43 to move until the circuit board 9 is parallel to the mounting surface; the visual guidance device is used for visual guidance in the process of the first picking mechanism 43 picking up the circuit board 9 and moving it above the machine frame 10.

[0059] It should be noted that the visual guidance device is a mechanism that captures an image of an object and identifies the position and posture of the object through image processing technology, and guides the device to work according to the identification result to adjust the position of the object. It is also commonly referred to as a "visual servo control system" or a "visually guided motion system". In the embodiment of the present application, the visual guidance device performs visual guidance by capturing images of the frame 10 and the circuit board 9, and using image processing technology to respectively determine the position and posture of the frame 10, the position and posture of the circuit board 9, and the relative distance and relative posture between the circuit board 9 and the frame 10; the visual guidance device then guides the circuit board picking device 4 to move according to the above results to adjust the position of the circuit board 9 so that the circuit board 9 is aligned with the frame 10.

[0060] In the assembly device provided by the present application, before the circuit board 9 is placed on the frame 10, the tilting mechanism 42 drives the first picking mechanism 43 to move until the circuit board 9 is tilted relative to the mounting surface. After the circuit board 9 is lowered to a preset height, the circuit board 9 is laid flat and placed on the mounting surface. This can prevent the circuit board 9 from scratching the frame 10 during the process of the circuit board 9 entering the frame 10, thereby preventing the circuit board 9 from being subjected to stress due to resting on the frame 10 or scratching the frame 10, thereby solving the problem of circuit board damage caused by the circuit board 9 during the assembly process.

[0061] Please refer to Figure 2 In some embodiments, the tilting mechanism 42 includes a tilting drive assembly 421, a first connecting plate 422 and a second connecting plate 423. The second connecting plate 423 is arranged relative to the first connecting plate 422 and spaced apart from each other. The second connecting plate 423 can rotate relative to the first connecting plate 422. The first connecting plate 422 is connected to the driving end of the first moving mechanism 41. The tilting drive assembly 421 is installed on the first connecting plate 422, and the driving end of the tilting drive assembly 421 is connected to the second connecting plate 423. The first picking mechanism 43 is connected to the side of the second connecting plate 423 away from the first connecting plate 422. The tilting drive assembly 421 is used to drive the second connecting plate 423 to rotate relative to the first connecting plate 422 until the second connecting plate 423 is inclined relative to the installation surface, or to drive the second connecting plate 423 to rotate relative to the first connecting plate 422 until the second connecting plate 423 is parallel to the installation surface.

[0062] In the above embodiment, the first moving mechanism 41 drives the first connecting plate 422 to move to the frame 10 ( Figure 2 Not shown, please refer to Fig.11), so that the circuit board 9 is arranged above the machine frame 10 and aligned with the machine frame 10, and the circuit board 9 is parallel to the mounting surface, the tilting drive component 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422 until the second connecting plate 423 is tilted relative to the mounting surface, so that the circuit board 9 is tilted relative to the mounting surface above the machine frame 10; the first moving mechanism 41 drives the first connecting plate 422 to approach the mounting surface, so that the circuit board 9 enters the machine frame 10 at an angle, and then the tilting drive component 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422 until the second connecting plate 423 is parallel to the mounting surface, so that the circuit board 9 located in the machine frame 10 is parallel to the mounting surface.

[0063] Optionally, the tilt drive assembly 421 drives the second connecting plate 423 to rotate until the second connecting plate 423 is tilted relative to the mounting surface, so that when the circuit board 9 is tilted relative to the mounting surface above the frame 10, the tilt angle of the circuit board 9 relative to the mounting surface can be 20°, 30°, 60°, etc.

[0064] In some embodiments, a rotating boss is provided on the first connecting plate 422, and a rotating hole is opened on the second connecting plate 423; or, a rotating hole is opened on the first connecting plate 422, and a rotating boss is provided on the second connecting plate 423; the rotating boss is rotatably arranged in the rotating hole, so that the second connecting plate 423 can rotate relative to the first connecting plate 422.

[0065] Please refer to Figure 5 In some embodiments, the tilting drive mechanism also includes a rotating component 426, which includes a first connecting portion 4261, a second connecting portion 4262 and a rotating shaft 4263. The first connecting portion 4261 is installed on the first connecting plate 422, and the second connecting portion 4262 is installed on the second connecting plate 423. The first connecting portion 4261 and the second connecting portion 4262 are alternately arranged, and the rotating shaft 4263 is rotatably penetrated through the first connecting portion 4261, and the rotating axis 4263 line of the rotating shaft 4263 is parallel to the installation surface. The second connecting portion 4262 is fixedly sleeved on the rotating shaft 4263, and the tilting drive component 421 is connected to the second connecting plate 423. The tilting drive component 421 is used to drive the rotating shaft 4263 and the second connecting plate 423 to rotate relative to the first connecting plate 422.

[0066] Please refer to Figure 3 and Figure 4 There are two groups of rotating components 426, and the two groups of rotating components 426 are arranged at intervals in the axial direction of the rotating shaft 4263.

[0067] Please refer to Figure 2 and Figure 3In some embodiments, the tilt drive assembly 421 includes a first linear drive member 4211, a first rack 4212 and a first gear 4213. The first gear 4213 is sleeved on one of the rotating shafts 4263. The first linear drive member 4211 is installed on the first connecting plate 422. The first rack 4212 is connected to the driving end of the first linear drive member 4211. Driven by the first linear drive member 4211, the first rack 4212 can move back and forth in the direction of the mounting surface, and the first rack 4212 is meshed with the first gear 4213.

[0068] In the above embodiment, when the first linear drive member 4211 drives the first rack 4212 to move, the first rack 4212 will drive the first gear 4213 to rotate, and the rotating first gear 4213 can drive the rotating shaft 4263 and the second connecting plate 423 to rotate, so that the second connecting plate 423 rotates until the second connecting plate 423 is tilted relative to the mounting surface, thereby making the circuit board 9 tilted relative to the mounting surface, or the second connecting plate 423 rotates until the second connecting plate 423 is parallel to the mounting surface, thereby making the circuit board 9 parallel to the mounting surface.

[0069] Optionally, the first linear drive 4211 may be a screw drive, a synchronous belt drive, a linear motor, etc.

[0070] It should be noted that the composition of the tilt driving assembly 421 is not limited to the structure defined in the above embodiment.

[0071] Optionally, the tilt drive assembly 421 may also include a first rotating drive member, a second rack and a second gear, the first rotating drive member is mounted on the first connecting plate 422, the second gear is coaxially arranged with the driving end of the first rotating drive member, and the rotation axis of the second gear and the driving end of the first rotating drive member is parallel to the mounting surface, the second rack is meshed with the second gear, and the second rack extends in the direction of the mounting surface, and the second connecting plate 423 is connected to the second rack.

[0072] In the above embodiment, the first rotating drive member drives the second gear to rotate, and the second gear drives the second rack to move back and forth in the direction of the mounting surface. The moving second rack can drive the rotating shaft 4263 and the second connecting plate 423 to rotate, so that the second connecting plate 423 rotates until the second connecting plate 423 is tilted relative to the mounting surface, thereby making the circuit board 9 tilted relative to the mounting surface, or the second connecting plate 423 rotates until the second connecting plate 423 is parallel to the mounting surface, thereby making the circuit board 9 parallel to the mounting surface.

[0073] Optionally, the first rotation driving member may be a servo motor, a stepping motor, etc.

[0074] Optionally, the tilt drive assembly 421 may also include a second linear drive member, which is mounted on the first connecting plate 422 , and the driving end of the second linear drive member can reciprocate in the direction of the mounting surface, and the driving end of the second linear drive member is connected to the second connecting plate 423 .

[0075] In the above embodiment, when the driving end of the second linear drive member makes linear motion, the rotating shaft 4263 and the second connecting plate 423 can rotate, so that the second connecting plate 423 rotates to the point where the second connecting plate 423 is tilted relative to the mounting surface, thereby tilting the circuit board 9 relative to the mounting surface, or rotates to the point where the second connecting plate 423 is parallel to the mounting surface, thereby making the circuit board 9 parallel to the mounting surface.

[0076] Optionally, the second linear drive may be a screw drive, a synchronous belt drive, a linear motor, etc.

[0077] Optionally, the tilt drive assembly 421 may further include a second rotation drive member, which is mounted on the first connecting plate 422 , and a driving end of the second rotation drive member is connected to one of the rotating shafts 4263 .

[0078] In the above embodiment, when the driving end of the second rotating driving member makes a rotational motion, the rotating shaft 4263 and the second connecting plate 423 can rotate, so that the second connecting plate 423 rotates until the second connecting plate 423 is tilted relative to the mounting surface, thereby making the circuit board 9 tilted relative to the mounting surface, or rotates until the second connecting plate 423 is parallel to the mounting surface, thereby making the circuit board 9 parallel to the mounting surface.

[0079] Optionally, the second rotation driving member may be a servo motor, a stepping motor, etc.

[0080] Please refer to Figures 2 to 6 In some embodiments, the tilting mechanism 42 also includes a first limiting component 424, which is connected to one of the first connecting plate 422 and the second connecting plate 423; when the second connecting plate 423 is parallel to the mounting surface, the first limiting component 424 is abutted against the other of the first connecting plate 422 and the second connecting plate 423; and when the second connecting plate 423 is tilted relative to the mounting surface, the first limiting component 424 is opposite to and spaced from the other of the first connecting plate 422 and the second connecting plate 423.

[0081] By adopting the above technical solution, when the second connecting plate 423 rotates to the point where the second connecting plate 423 is parallel to the installation surface, that is, when the second connecting plate 423 rotates to the point where the circuit board 9 is parallel to the installation surface, the first limiting component 424 can abut against the first connecting plate 422 or can abut against the second connecting plate 423 to prevent the second connecting plate 423 from rotating too much and affecting the horizontality of the second connecting plate 423, or even causing the first connecting plate 422 to collide with the second connecting plate 423.

[0082] Optionally, in some embodiments, the first connection portion 4261 is located at the end of the first connection plate 422 away from the first moving mechanism 41 , and the second connection portion 4262 is located at the end of the second connection plate 423 away from the first moving mechanism 41 .

[0083] Please refer to Figure 5 Optionally, in some embodiments, the first connection portion 4261 is located in the middle of the first connection plate 422 , and the second connection portion 4262 is located in the middle of the second connection plate 423 .

[0084] Please refer to Figure 5 When the first connecting portion 4261 is located at the middle position of the first connecting plate 422, and the second connecting portion 4262 is located at the middle position of the second connecting plate 423, the first connecting plate 422 has a first part 4221 and a second part 4222, and the first part 4221 and the second part 4222 are located on two opposite sides of the rotation axis (first connecting portion 4261) of the second connecting plate 423, and the second connecting plate 423 has a third part 4231 and a fourth part 4232, and the third part 4231 and the fourth part 4232 are located on two opposite sides of the rotation axis (second connecting portion 4262) of the second connecting plate 423, and the first part 4221 is opposite to the third part 4231, and the second part 4222 is opposite to the fourth part 4232.

[0085] In the above embodiment, the tilting mechanism 42 also includes a second limit assembly 425, and the first limit assembly 424 and the second limit assembly 425 are located on opposite sides of the rotation axis (the first connecting part 4261, the second connecting part 4262) of the second connecting plate 423; the second limit assembly 425 is connected to one of the second part 4222 and the fourth part 4232; when the second connecting plate 423 is parallel to the mounting surface, the second limit assembly 425 is opposite to and spaced from the other of the second part 4222 and the fourth part 4232, and when the second connecting plate 423 is tilted relative to the mounting surface, the second limit assembly 425 is abutted against the other of the second part 4222 and the fourth part 4232.

[0086] In the above embodiment, the first limiting component 424 is connected to one of the first part 4221 and the third part 4231; when the second connecting plate 423 is parallel to the mounting surface, the first limiting component 424 is abutted against the other of the first part 4221 and the third part 4231; and when the second connecting plate 423 is inclined relative to the mounting surface, the first limiting component 424 is opposite to and spaced from the other of the first part 4221 and the third part 4231.

[0087] By adopting the above technical solution, when the second connecting plate 423 rotates to the point where the second connecting plate 423 is inclined relative to the mounting surface, that is, when the second connecting plate 423 rotates to the point where the circuit board 9 is inclined relative to the mounting surface, the second limiting component 425 can abut against the first connecting plate 422 or the second connecting plate 423 to limit the inclination angle of the second connecting plate 423, and can also prevent the first connecting plate 422 and the second connecting plate 423 from colliding; when the second connecting plate 423 rotates to the point where the second connecting plate 423 is parallel to the mounting surface, that is, when the second connecting plate 423 rotates to the point where the circuit board 9 is parallel to the mounting surface, the first limiting component 424 can abut against the first connecting plate 422 or the second connecting plate 423 to prevent the second connecting plate 423 from rotating at an excessively large angle and affecting the horizontality of the second connecting plate 423, or even causing the first connecting plate 422 and the second connecting plate 423 to collide.

[0088] In some embodiments, the ends of the first limiting assembly 424 and the second limiting assembly 425 between the first connecting plate 422 and the second connecting plate 423 are both provided with an elastic structure, which can play a buffering role to prevent the first connecting plate 422 or the second connecting plate 423 from being damaged due to collision. Optionally, the elastic structure can be a rubber pad, a foam pad, etc.

[0089] In some embodiments, the second stopper assembly 425 is adjustably connected to one of the first connecting plate 422 and the second connecting plate 423, and the length of the second stopper assembly 425 between the first connecting plate 422 and the second connecting plate 423 is adjustable. In this embodiment, the second stopper assembly 425 can be adjusted according to actual production requirements to adjust the tilt angle of the circuit board 9.

[0090] In some embodiments, the second position limiting assembly 425 includes a resisting member, a first locking member, and a second locking member, and the first locking member and the second locking member are both threadedly connected to the resisting member. The resisting member movably passes through the first connecting plate 422, and the first locking member and the second locking member are both threadedly connected to the resisting member, and the first locking member and the second locking member are resisted against two opposite surfaces of the first connecting plate 422; or, the resisting member movably passes through the second connecting plate 423, and the first locking member and the second locking member are both threadedly connected to the resisting member, and the first locking member and the second locking member are resisted against two opposite surfaces of the second connecting plate 423.

[0091] It should be noted that the composition structure of the second stopper assembly 425 is not limited to the structure defined in the above embodiment. For example, the second stopper assembly 425 can be directly threadedly connected to the first connecting plate 422 or the second connecting plate 423.

[0092] In some embodiments, the first stopper assembly 424 is adjustably connected to one of the first connecting plate 422 and the second connecting plate 423, and the length of the first stopper assembly 424 between the first connecting plate 422 and the second connecting plate 423 is adjustable. In this embodiment, the first stopper assembly 424 can be adjusted according to actual production requirements to adjust the horizontality of the second connecting plate 423.

[0093] The composition structure of the first limiting component 424 may refer to the composition structure of the second limiting component 425 described above, and will not be described in detail here.

[0094] Please refer to Figure 5 In some embodiments, the first stopper assembly 424 is connected to the first portion 4221 of the first connecting plate 422, and the second stopper assembly 425 is connected to the second portion 4222 of the first connecting plate 422. With the above arrangement, the load of the tilt driving assembly 421 can be reduced.

[0095] Please refer to Figure 4 In some embodiments, the first picking mechanism 43 includes a suction component 431 and a clamping component 432. The suction component 431 and the clamping component 432 are both arranged on the second connecting plate 423, and the suction surface of the suction component 431 faces the machine frame 10 ( Figure 4 Not shown, please refer to Fig.11 ) on the mounting surface, and the clamping end of the clamping component 432 also faces the mounting surface on the frame 10.

[0096] In the above embodiment, the suction component 431 is used to contact and adsorb the blank area on the circuit board 9, and the clamping component 432 is used to clamp the handle on the circuit board 9. The suction material picking method is combined with the clamping material picking method to increase the force of the first picking mechanism 43 and prevent the circuit board 9 from falling when the first moving mechanism 41 drives the first picking mechanism 43 to move.

[0097] In some embodiments, the suction component 431 includes a suction cup and a vacuum generator. The suction cup has an air channel, and the vacuum generator is connected to the air channel. The vacuum generator can extract the air in the air channel so that the suction cup can absorb the circuit board 9; the vacuum generator can also inject air into the air channel so that the suction cup releases the circuit board 9.

[0098] In some embodiments, the clamping assembly 432 includes a clamping cylinder and at least two clamping jaws. The clamping cylinder can drive the clamping jaws closer to each other so that the clamping jaws can clamp the handles on the circuit board 9; the clamping cylinder can drive the clamping jaws away from each other so that the clamping jaws can release the handles on the circuit board 9.

[0099] Please refer to Figure 4 In some embodiments, the second connecting plate 423 includes a hollow portion, and the suction assembly 431 includes a plurality of suction cups, which are slidably disposed in the hollow portion of the second connecting plate 423, and the suction cups can slide relative to the second connecting plate 423 along the X direction, the Y direction, and the Z direction. The position of the suction cup can be adjusted according to the size of the circuit board 9 to adapt to different circuit boards 9.

[0100] The first connecting plate 422 is also provided with a hollow portion, and the hollow portion of the first connecting portion is arranged opposite to the hollow portion of the second connecting portion, so as to avoid the pipeline connected between the suction cup and the vacuum generator, so that the distance between the first connecting plate and the second connecting plate can be set smaller, which is convenient for miniaturization and flexibility of the entire circuit board material removal device. It can be understood that the pipeline connected between the suction cup and the vacuum generator is led out through the hollow portion of the first connecting plate, which is also convenient for connection with the vacuum generator.

[0101] Please refer to Figure 7 In some embodiments, the first moving mechanism 41 includes a first three-axis linear module 411 installed on the operating platform 1 and a rotation drive assembly 412 connected to the driving end of the first three-axis linear module 411, the tilting mechanism 42 is connected to the driving end of the rotation drive assembly 412, the first three-axis linear module 411 is used to drive the tilting mechanism 42 and the first picking mechanism 43 to move to any position in space, and the rotation drive assembly 412 is used to drive the tilting mechanism 42 and the first picking mechanism 43 to rotate around a rotation axis perpendicular to the mounting surface.

[0102] In the above embodiment, the first three-axis linear module 411 can adjust the position of the circuit board 9 picked up by the circuit board picking device 4 to any position in space, and the rotation driving component 412 can adjust the posture of the circuit board 9 .

[0103] Please refer to Figure 3 In some embodiments, the circuit board picking device 4 further includes a pressure sensor 45 for monitoring the pressure on the circuit board picking device 4 , and the pressure sensor 45 is connected to the second connecting plate 423 .

[0104] It should be noted that the circuit board 9 and the frame 10 ( Figure 3 Not shown, please refer to Fig.11) in the case where the circuit board 9 is aligned with the frame 10, the circuit board 9 will not encounter any resistance or encounter only a small resistance when the circuit board 9 is placed into the frame 10, so the pressure on the circuit board picking device 4 is also small; when the circuit board 9 is not aligned with the frame 10, the circuit board 9 will collide with the frame 10 when the circuit board 9 is placed into the frame 10, resulting in a large pressure on the circuit board picking device 4.

[0105] The circuit board material taking device 4 drives the inclined circuit board 9 into the machine frame 10 (see Fig.11 ) and lays the circuit board 9 in the frame 10 flat and places it on the mounting surface, the pressure sensor 45 will monitor the pressure on the circuit board picking device 4 in real time. When the pressure value exceeds the preset range, it can be determined that the circuit board 9 is not aligned with the frame 10. To avoid damaging the circuit board 9, the circuit board assembly equipment stops and alarms. When the pressure always remains outside the preset range, the circuit board picking device 4 lays the circuit board 9 in the frame 10 flat and places it on the mounting surface, and then moves away from the frame 10.

[0106] Please refer to Figure 1 In some embodiments, the circuit board assembly equipment further includes a support frame 2, a frame loading device 3, a locking device 5 and a feeding device 6.

[0107] The operating platform 1 has a support table 11 facing the Z direction in the figure, and the machine frame loading device 3 is arranged on the support table 11. The machine frame loading device 3 and the feeding device 6 are distributed in the X direction in the figure.

[0108] The support frame 2 is arranged on the operating platform 1, and the support frame 2 is located on one side of the operating platform 1 in the Z direction. The circuit board picking device 4 can be slidably arranged on the support frame 2 along the X direction in the figure. The circuit board picking device 4 can slide relative to the support frame 2 to above the feeding device 6, so that the circuit board picking device 4 can pick up the circuit board 9 in the feeding device 6. The circuit board picking device 4 can slide relative to the support frame 2 to above the machine frame loading device 3, so that the circuit board picking device 4 can transport the circuit board 9 to above the machine frame 10.

[0109] The locking device 5 can be slidably arranged on the support frame 2 along the X direction in the figure. The locking device 5 is used to pick up the fixing parts and transport the fixing parts to the top of the machine frame 10 and the circuit board 9. The locking device 5 is also used to sequentially pass the fixing parts through the fixing holes on the circuit board 9 and the fixing holes on the machine frame 10. The visual guidance device is also used to provide visual guidance during the process of the locking device 5 picking up the fixing parts and transporting the fixing parts to the top of the machine frame 10 and the circuit board 9.

[0110] In the above embodiment, since the visual guidance device can provide visual guidance during the operation of the circuit board picking device 4 and the locking device 5, before placing the circuit board 9 on the machine frame 10, the circuit board picking device 4 can pick up the circuit board 9 under the guidance of the visual guidance device and move the circuit board 9 to align with the machine frame 10, which can prevent the circuit board 9 from being placed on the machine frame 10 during the process of the circuit board 9 entering the machine frame 10. Before the fixing part is inserted into the circuit board 9 and the machine frame 10, the locking device 5 can pick up the fixing part under the guidance of the visual guidance device and move the fixing part to align with the fixing hole on the circuit board 9, which can prevent the fixing part from being misplaced, thereby preventing the fixing part from damaging the circuit board 9.

[0111] In some embodiments, the visual guidance device includes a controller, a first camera 71 and a second camera 72. The first camera 71 is used to capture an image of the machine frame 10, and the second camera 72 is used to capture an image of the circuit board 9 picked up by the first picking mechanism 43. The controller can generate a first driving signal based on the image captured by the first camera 71 and the image captured by the second camera 72 to drive the first moving mechanism 41 to move to adjust the position of the circuit board 9.

[0112] In the above embodiment, the controller can generate a first position signal according to the image captured by the first camera 71, and the controller can generate a second position signal according to the image captured by the second camera 72. When the first position signal and the second position signal are different (for example, the coordinate in the X direction of the first position signal is different from the coordinate in the X direction of the second position signal and / or the coordinate in the Y direction of the first position signal is different from the coordinate in the Y direction of the second position signal), it can be determined that the circuit board 9 is not aligned with the frame 10, and the first drive signal generated by the controller includes a direction to be moved and a distance to be moved. The first moving mechanism 41 moves the distance to be moved in the direction to be moved according to the first drive signal to align the circuit board 9 with the frame 10. When the first position signal and the second position signal are the same (for example, the coordinate in the X direction of the first position signal is the same as the coordinate in the X direction of the second position signal and the coordinate in the Y direction of the first position signal is the same as the coordinate in the Y direction of the second position signal), it can be determined that the circuit board 9 is aligned with the frame 10, and the first drive signal generated by the controller drives the first moving mechanism 41 to remain in place.

[0113] Please refer to Figure 4 In some embodiments, the first camera 71 is installed at the driving end of the first moving mechanism 41 .

[0114] In the above embodiment, the first camera 71 can move along with the circuit board picking device 4, so that when the circuit board picking device 4 moves to the feeding device 6, the first camera 71 can identify the position of the circuit board 9 in the feeding device 6, so that the circuit board picking device 4 can pick up the circuit board 9 in the feeding device 6.

[0115] Please refer to Figure 4 In some embodiments, the first camera 71 can be slidably disposed on the circuit board picking device 4 along the direction of the mounting surface.

[0116] In the above embodiment, before the circuit board picking device 4 picks up the circuit board 9, the first camera 71 captures the image of the frame 10 located on the frame loading device 3, and then the first camera 71 follows the circuit board picking device 4 to move to the feeding device 6. By slidably setting the first camera 71 on the circuit board picking device 4 along the Z direction in the figure, when it is necessary to capture the image of the frame 10 located on the frame loading device 3, the first camera 71 can be moved in the direction opposite to the Z direction, so that the first camera 71 approaches the frame 10 to shoot, and after the shooting is completed, the first camera 71 moves in the Z direction, so as to prevent the first picking mechanism 43 or the circuit board 9 picked up by the first picking mechanism 43 from hitting the first camera 71.

[0117] In the above embodiment, the circuit board picking device 4 also includes a first slide cylinder 44, which is connected to the driving end of the first three-axis linear module 411, and the first camera 71 is connected to the driving end of the first slide cylinder 44. The first slide cylinder 44 is used to drive the first camera 71 to slide along the direction of the installation surface.

[0118] Please refer to Figure 1 In some embodiments, the second camera 72 is disposed on the frame loading device 3 , so that the second camera 72 can capture an image of the circuit board 9 located above the frame loading device 3 (on one side in the Z direction).

[0119] Please refer to Figure 6 In some embodiments, the visual guidance device also includes a third camera 73 electrically connected to the controller. The third camera 73 is arranged on the locking device 5. The third camera 73 is used to capture the image of the circuit board 9 in the frame 10. The controller can determine the position of the fixing hole on the circuit board 9 in the frame 10 based on the image captured by the third camera 73.

[0120] In the above embodiment, before the locking device 5 drives the fixing part to pass through the circuit board 9 and the frame 10 in sequence, the third camera 73 is used to capture the image of the circuit board 9 in the frame 10, and the controller determines the position of the fixing hole on the circuit board 9 in the frame 10 based on the image captured by the third camera 73. The controller then drives the locking device 5 to drive the fixing part to move, which can prevent the fixing part from deviating from the positioning hole.

[0121] Please refer to Figure 1 and Figure 6In some embodiments, the locking device 5 includes a second moving mechanism 52 installed on the operating platform 1 and a second picking mechanism 51 connected to the driving end of the second moving mechanism 52. The driving end of the second moving mechanism 52 can move in the space above the operating platform 1 to drive the second picking mechanism 51 to pick up the fixing part and drive the fixing part to pass through the circuit board 9 and the frame 10 in sequence.

[0122] Please refer to Figure 6 In some embodiments, the second picking mechanism 51 is slidably disposed on the second moving mechanism 52, and the sliding direction of the second picking mechanism 51 is parallel to the distribution direction of the locking device 5 and the mounting surface (Z direction in the figure).

[0123] In the above embodiment, the second pick-up mechanism 51 can slide to protrude from the second moving mechanism 52, so that when the second pick-up mechanism 51 drives the fixing member to sequentially pass through the circuit board 9 and the frame 10, the second moving mechanism 52 will not interfere with the operation of the second pick-up mechanism 51, and the second moving mechanism 52 will not contact the frame 10. The second pick-up mechanism 51 can slide to be flush with the second moving mechanism 52 or to be located on the side of the second moving mechanism 52 away from the mounting surface, so that when the second pick-up mechanism 51 moves, the second pick-up mechanism 51 can be prevented from being damaged by collision.

[0124] Please refer to Figure 6 In the above embodiment, the locking device 5 also includes a second slide cylinder 53, the second slide cylinder 53 is connected to the driving end of the second moving mechanism 52, the second picking mechanism 51 is connected to the driving end of the second slide cylinder 53, and the second slide cylinder 53 is used to drive the second picking mechanism 51 to slide along the direction of the installation surface.

[0125] In some embodiments, the second picking mechanism 51 is an intelligent electric screwdriver, which is used to fix the screws on the circuit board 9 and the frame 10. The intelligent electric screwdriver can monitor its own torque and number of rotations during the screwing process to ensure that the torque and number of rotations are within a normal range to avoid damaging the circuit board 9.

[0126] Please refer to Figure 7 In some embodiments, the second moving mechanism 52 includes a second three-axis linear module, which is slidably arranged on the support frame 2 along the X direction, and the second picking mechanism 51 is connected to the driving end of the second three-axis linear module, and the second three-axis linear module is used to drive the second picking mechanism 51 to move to any position in space.

[0127] Please refer to Figure 6 In some embodiments, the circuit board assembly device further includes a height measuring mechanism 8, which is disposed on the locking device 5 and is used to detect the frame 10 ( Figure 6 Not shown, please refer to Fig.11 ) and the distance between the circuit board 9 and the height measuring mechanism, so that the controller can determine whether the circuit board 9 is placed flat on the installation surface.

[0128] By providing the height measuring mechanism 8 , it is possible to avoid the fixing member from sequentially passing through the circuit board 9 and the frame 10 when the circuit board 9 is not laid flat, thereby avoiding damage to the circuit board 9 .

[0129] In some embodiments, driven by the locking device 5, the height measuring mechanism 8 can detect the distance between multiple points on the circuit board 9 in the frame 10 (for example, the four corners of the circuit board 9) and the height measuring mechanism 8. The controller determines whether the circuit board 9 is placed flat on the installation surface by comparing the distance between the above-mentioned multiple points and the height measuring mechanism 8.

[0130] Optionally, the height measuring mechanism 8 includes a distance measuring sensor, for example, a laser distance measuring sensor or an infrared distance measuring sensor.

[0131] Please refer to Figure 8 and Fig. 9 In some embodiments, the frame loading device 3 includes a carrier plate 31 and a transmission mechanism 32 . The transmission mechanism 32 is disposed on the support table 11 , and the carrier plate 31 is disposed on the transmission mechanism 32 .

[0132] In the above embodiment, the transmission mechanism 32 can drive the machine frame 10 on the carrier plate 31 to move, so as to achieve loading and unloading of the machine frame 10 .

[0133] Optional, please refer to Figure 8 The transmission mechanism 32 may be a transmission belt transmission mechanism, which includes a driving motor 321, a transmission shaft 322 and two supporting side plates 323. Each supporting side plate 323 is provided with a driving wheel (not shown in the figure), a driven wheel (not shown in the figure) and a transmission belt (not shown in the figure) sleeved on the driving wheel and the driven wheel. The carrier 31 is placed on the transmission belt, and the transmission shaft 322 is coaxially arranged with the two driving wheels, and the transmission shaft 322 is coaxially arranged with the driving end of the driving motor 321. When the driving motor 321 drives the transmission shaft 322 to rotate, the transmission belt can drive the carrier 31 to move. By changing the rotation direction of the transmission shaft 322, the moving direction of the carrier 31 can be changed to realize the loading and unloading of the machine frame 10.

[0134] Please refer to Figure 8 In some embodiments, the frame loading device 3 also includes a position adjustment mechanism 33, the position adjustment mechanism 33 includes a side push assembly 332 and at least two stop assemblies 331, the carrier plate 31 has a first end and a second end that are relatively arranged, at least two stop assemblies 331 are arranged at intervals at the first end, the side push assembly 332 is arranged at the second end, and the driving end of the side push assembly 332 can push the frame 10 on the carrier plate 31 close to the stop assembly 331.

[0135] In the above embodiment, when the side push assembly 332 pushes the machine frame 10 on the carrier 31 to approach the stop assembly 331, the stop assemblies 331 arranged at intervals can support the machine frame 10 to achieve the positioning of the machine frame 10, and the machine frame 10 can be clamped between the side push assembly 332 and the stop assembly 331 to fix the machine frame 10.

[0136] Please refer to Figure 8 The stopper assembly 331 and the side-thrust assembly 332 are both side-thrust cylinders. When the driving end of the side-thrust cylinder is extended, the carrier plate 31 can be clamped to achieve positioning.

[0137] Please refer to Fig. 9 In some embodiments, the frame loading device 3 further includes a lifting mechanism 34, which is disposed on the supporting table 11, and is used to drive the carrier plate 31 to move in the Z direction in the figure.

[0138] In the above embodiment, before the fixing parts are passed through the circuit board 9 and the frame 10 in sequence, the lifting mechanism 34 drives the carrier plate 31 to move in the Z direction in the figure to separate from the transmission mechanism 32, which can reduce the force on the transmission mechanism 32, thereby reducing the degree of damage to the transmission mechanism 32 and extending the service life of the transmission mechanism 32.

[0139] Please refer to Fig. 9 In some embodiments, the lifting mechanism 34 includes a support frame 341, a lifting cylinder 342 and a connecting plate (not shown in the figure), the support frame 341 is arranged on the support table 11, the lifting cylinder 342 is arranged on the support frame 341, the connecting plate is connected to the driving end of the lifting cylinder 342, and the connecting plate is supported on the support frame 341.

[0140] Please refer to Figure 8 In some embodiments, the frame loading device 3 further includes an interception mechanism 35, which is disposed on the support table 11, and in the Y direction in the figure, the interception mechanism 35 can be horizontally disposed on the moving path of the carrier 31 to stop the carrier 31.

[0141] In the above embodiment, the interception mechanism 35 includes an interception member, and the interception member is used to resist the carrier plate 31 .

[0142] Optionally, the intercepting member may be directly disposed on the supporting table 11 , and in the Z direction in the figure, the intercepting member protrudes from the transmission belt.

[0143] Optionally, the interception mechanism 35 may also include an interception cylinder, and the interception piece is connected to the driving end of the interception cylinder. When the transmission mechanism 32 drives the carrier plate 31 to move along the Y direction, the interception cylinder drives the interception piece to move until it protrudes from the transmission belt to stop the carrier plate 31; after the lifting mechanism 34 drives the carrier plate 31 to move in the Z direction in the figure until it is separated from the transmission mechanism 32, the interception cylinder drives the interception piece to return to its position to avoid the interception piece interfering with the locking device 5.

[0144] Please refer to Figure 1 In some embodiments, the feeding device 6 includes a silo 61 and a lifting mechanism 62. The two opposite inner walls of the silo 61 are provided with support blocks 611 for supporting the circuit board 9. There are multiple support blocks 611 on the two inner walls and they are arranged at intervals in the Z direction, so that multiple circuit boards 9 can be placed in the silo 61 at the same time. The silo 61 can be slidably arranged on the operating platform 1 along the Z direction in the figure, and the lifting mechanism 62 is used to drive the silo 61 to slide along the Z direction.

[0145] In the above embodiment, a plurality of circuit boards 9 spaced apart in the Z direction are placed in the material bin 61. After the circuit board picking device 4 picks up the circuit board 9 located above, the lifting mechanism 62 drives the material bin 61 to move in the Z direction so that the circuit board picking device 4 can pick up the circuit board 9 located below.

[0146] Please refer to Fig.10 and Fig.11 To achieve the above purpose, the technical solution adopted in the second embodiment of the present application is: a circuit board assembly method, comprising at least the following steps:

[0147] S100 : The visual guidance device guides the circuit board picking device 4 to pick up the circuit board 9 and transport the circuit board 9 to above the mounting surface on the machine frame 10 .

[0148] S200: The circuit board picking device 4 drives the circuit board 9 to tilt, so that one side of the circuit board 9 is tilted relative to the installation surface.

[0149] S300 : the circuit board taking device 4 drives the inclined circuit board 9 to enter the machine frame 10 .

[0150] S400: The circuit board taking device 4 lays the circuit board 9 in the frame 10 flat and places it on the installation surface.

[0151] In the above-mentioned circuit board assembly method, before the circuit board 9 is placed in the machine frame 10, the circuit board picking device 4 can pick up the circuit board 9 under the guidance of the visual guidance device and move the circuit board 9 to align with the machine frame 10, which can prevent the circuit board 9 from resting on the machine frame 10 during the process of the circuit board 9 entering the machine frame 10; at the same time, the circuit board picking device 4 drives the circuit board 9 to tilt so that one side of the circuit board 9 is tilted relative to the mounting surface, and the circuit board picking device 4 drives the tilted circuit board 9 to enter the machine frame 10, and then the circuit board 9 is laid flat and placed on the mounting surface, which can prevent the circuit board 9 from scratching the machine frame 10 during the process of the circuit board 9 entering the machine frame 10, thereby avoiding the circuit board 9 from being subjected to stress due to resting on the machine frame 10 or scratching the machine frame 10, thereby solving the problem of circuit board damage caused by the circuit board 9 during the assembly process.

[0152] Please refer to Fig.12 In some embodiments, step S100: the visual guidance device guides the circuit board picking device 4 to pick up the circuit board 9 and transport the circuit board 9 to the top of the mounting surface on the frame 10, including at least the following steps:

[0153] S110 : The first camera 71 captures an image of the machine frame 10 .

[0154] S120 : the circuit board picking device 4 picks up the circuit board 9 and transports the circuit board 9 to above the second camera 72 .

[0155] S130 : the second camera 72 captures an image of the circuit board 9 picked up by the circuit board picking device 4 .

[0156] S140 : The controller generates a first driving signal according to the image captured by the first camera 71 and the image captured by the second camera 72 to drive the circuit board picking device 4 to move to adjust the position of the circuit board 9 .

[0157] In the above process, the controller can generate a first position signal according to the image of the machine frame 10 located on the machine frame loading device 3 captured by the first camera 71, and the controller can generate a second position signal according to the image of the circuit board 9 picked up by the circuit board picking device 4 captured by the second camera 72. When the first position signal and the second position signal are different (for example, the coordinate in the X direction of the first position signal is different from the coordinate in the X direction of the second position signal and / or the coordinate in the Y direction of the first position signal is different from the coordinate in the Y direction of the second position signal), it can be determined that the circuit board 9 is not aligned with the machine frame 10, and the first drive signal generated by the controller includes the direction to be moved and the distance to be moved, and the controller drives the circuit board picking device 4 to move the distance to be moved in the direction to be moved to align the circuit board 9 with the machine frame 10; when the first position signal and the second position signal are the same (for example, the coordinate in the X direction of the first position signal is the same as the coordinate in the X direction of the second position signal and the coordinate in the Y direction of the first position signal is the same as the coordinate in the Y direction of the second position signal), it can be determined that the circuit board 9 is aligned with the machine frame 10, and the first drive signal generated by the controller drives the circuit board picking device 4 to remain in place.

[0158] In some embodiments, the first camera 71 is disposed on the circuit board picking device 4 , and thus the following steps are further included before step S110 : the circuit board picking device 4 drives the first camera 71 to move above the machine frame 10 .

[0159] Please refer to Fig.13 In some embodiments, step S120: the circuit board picking device 4 picks up the circuit board 9, which at least includes the following steps:

[0160] S121: The circuit board picking device 4 moves to above the feeding device 6.

[0161] S122 : The first camera 71 captures an image of the circuit board 9 in the feeding device 6 .

[0162] S123 : The controller generates a second driving signal according to the image captured by the first camera 71 to drive the circuit board picking device 4 to move to adjust the position of the circuit board picking device 4 .

[0163] S124 : the circuit board picking device 4 picks up the circuit board 9 in the feeding device 6 .

[0164] In the above process, the controller can determine the position of the circuit board 9 in the feeding device 6 based on the image of the circuit board 9 in the feeding device 6 captured by the first camera 71. The controller can drive the circuit board picking device 4 to move according to the position of the circuit board 9 in the feeding device 6 to adjust the position of the circuit board picking device 4 so that the circuit board picking device 4 can pick up the circuit board 9 more accurately.

[0165] In some embodiments, step S200: the circuit board picking device 4 drives the circuit board 9 to tilt so that one side of the circuit board 9 is tilted relative to the mounting surface, which means: the tilting drive component 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422 around a rotation axis parallel to the mounting surface, so that the second limiting component 425 is against the first connecting plate 422 or the second connecting plate 423.

[0166] Please refer to Fig.14 In some embodiments, step S400: the circuit board taking device 4 lays the circuit board 9 in the frame 10 flat and places it on the mounting surface, which at least includes the following steps:

[0167] S410: The tilt driving assembly 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422 around a rotation axis parallel to the mounting surface, so that the first limiting assembly 424 abuts against the first connecting plate 422 or the second connecting plate 423;

[0168] S420 : the first picking mechanism 43 releases the circuit board 9 .

[0169] Please refer to Fig. 9 In some embodiments, the circuit board assembly method further comprises the following steps:

[0170] S500 : The visual guidance device guides the locking device 5 to pick up the fixing component and transport the fixing component to above the circuit board 9 in the frame 10 .

[0171] S600: The locking device 5 drives the fixing member to pass through the circuit board 9 and the frame 10 in sequence.

[0172] Please refer to Fig.15 In some embodiments, step S500: the visual guidance device guides the locking device 5 to pick up the fixing part and transport the fixing part to the top of the circuit board 9 in the frame 10, at least including the following steps:

[0173] S510 : the locking device 5 drives the third camera 73 to move above the frame 10 .

[0174] S520: The third camera 73 captures an image of the circuit board 9 located on the mounting surface.

[0175] S530: The controller generates a third driving signal according to the image captured by the third camera 73 to drive the locking device 5 to move to adjust the position of the fixing member.

[0176] In the above process, the controller can determine the position of the fixing hole on the circuit board 9 on the mounting surface based on the image of the circuit board 9 on the mounting surface captured by the third camera 73, and the controller can drive the locking device 5 to move according to the position of the fixing hole on the circuit board 9 on the mounting surface to adjust the position of the fixing part so that the fixing part can pass through the fixing hole on the circuit board 9 on the mounting surface more accurately.

[0177] Please refer to Figure 1 In one embodiment of the circuit board assembly device shown, the circuit board assembly method includes the following steps:

[0178] The circuit board 9 is inserted into the material bin 61 , and the lifting mechanism 62 drives the material bin 61 to move in the Z direction, so that the circuit board 9 located at the uppermost layer in the material bin 61 moves upward, so that the circuit board picking device 4 can pick up the circuit board 9 .

[0179] The machine frame 10 is placed on the carrier plate 31 in the machine frame loading device 3, the transmission mechanism 32 drives the carrier plate 31 to move along the Y direction, and the interception mechanism 35 stops the carrier plate 31; the side push assembly 332 pushes the machine frame 10, and the side push assembly 332 and the stop assembly 331 clamp the machine frame 10 to achieve rough positioning of the machine frame 10; the lifting mechanism 34 drives the carrier plate 31 to move along the Z direction until it is separated from the transmission mechanism 32.

[0180] The circuit board picking device 4 moves to above the carrier 31, and the first camera 71 located on the circuit board picking device 4 moves toward the direction close to the carrier 31. The first camera 71 captures the image of the machine frame 10 located on the carrier 31, and the controller generates a first position signal based on the image of the machine frame 10 located on the carrier 31 captured by the first camera 71.

[0181] The circuit board picking device 4 moves to the feeding device 6, and the first camera 71 located on the circuit board picking device 4 captures the image of the circuit board 9 in the feeding device 6. The controller generates a third position signal according to the image of the circuit board 9 in the feeding device 6 captured by the first camera 71. Then, the first camera 71 moves away from the feeding device 6, and the controller generates a second drive signal according to the third position signal to drive the first moving mechanism 41 to move to adjust the position of the first picking mechanism 43, so that the first picking mechanism 43 picks up the circuit board 9 in the feeding device 6; driven by the first moving mechanism 41, the first picking mechanism 43 drives the circuit board 9 to move above the second camera 72, and the second camera 72 captures the image of the circuit board 9 picked up by the first picking mechanism 43. The controller generates a second position signal according to the image of the circuit board 9 picked up by the first picking mechanism 43 captured by the second camera 72, and the controller generates a first drive signal according to the first position signal and the second position signal to drive the first moving mechanism 41 to move to adjust the position of the first picking mechanism 43, so that the circuit board 9 is located above the machine frame 10 and aligned with the machine frame 10.

[0182] The tilting drive assembly 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422, so that the circuit board 9 is tilted, and the second limiting assembly 425 is abutted against the first connecting plate 422 or the second connecting plate 423, and the first moving mechanism 41 drives the circuit board 9 to move downward until the circuit board 9 enters the machine frame 10, and the tilting drive assembly 421 drives the second connecting plate 423 to rotate relative to the first connecting plate 422, and the first limiting assembly 424 is abutted against the first connecting plate 422 or the second connecting plate 423, so that the circuit board 9 is restored to a horizontal state, and the circuit board picking device 4 is away from the machine frame 10.

[0183] When the first moving mechanism 41 drives the circuit board 9 to move downward until the circuit board 9 enters the machine frame 10 , the pressure sensor 45 outputs pressure data in real time. If the pressure exceeds the limit, the circuit board assembly equipment will shut down and alarm to avoid damaging the circuit board 9 .

[0184] The height measuring mechanism 8 on the locking device 5 detects the distance between multiple points (such as the four corners of the circuit board 9) on the circuit board 9 in the frame 10 and the height measuring mechanism 8. The controller determines whether the circuit board 9 is placed flat on the installation surface by comparing the distances between the above multiple points and the height measuring mechanism 8. If the circuit board 9 is not placed flat, the circuit board assembly equipment stops and alarms. If the circuit board 9 is placed flat, the third camera 73 located on the locking device 5 captures the image of the circuit board 9 in the frame 10. The controller determines the position of the fixing hole on the circuit board 9 in the frame 10 according to the image of the circuit board 9 in the frame 10 captured by the third camera 73, and generates a fourth position signal. The controller generates a third driving signal according to the fourth position signal to drive the second moving mechanism 52 to move to adjust the position of the second picking mechanism 51 so that the fixing part is aligned with the fixing hole on the circuit board 9; driven by the second moving mechanism 52, the second picking mechanism 51 drives the fixing part to pass through the circuit board 9 and the frame 10 in sequence; after the fixing part circuit board 9 is fixed to the frame 10, the locking device 5 is away from the frame 10.

[0185] The lifting mechanism 34 drives the carrier plate 31 to move downward, and the transmission mechanism 32 drives the carrier plate 31 to move in the direction opposite to the Y direction, so that the assembly work can be completed.

[0186] The second picking mechanism 51 is an intelligent electric screwdriver, and the fixing member is a screw. The second picking mechanism 51 drives the fixing member to pass through the circuit board 9 and the frame 10 in sequence, which means that the intelligent electric screwdriver drives the screw to rotate so that the screw is locked on the circuit board 9 and the frame 10. In the process of locking the screws, the intelligent electric screwdriver will also monitor its own torque and number of rotations to ensure that the torque and number of rotations are within a normal range to prevent the circuit board 9 from being damaged.

[0187] In the above-mentioned assembly process, the first picking mechanism 43 can fix the circuit board 9 more stably to prevent the circuit board 9 from falling; and in the above-mentioned assembly process, the circuit board 9 and the frame 10 can be aligned more accurately, and the circuit board 9 can be tilted when the circuit board 9 is placed in the frame 10 to prevent the circuit board 9 from hitting the frame 10; in the process of the first moving mechanism 41 driving the circuit board 9 to move down until the circuit board 9 enters the frame 10, the pressure sensor 45 outputs pressure data in real time. If the pressure exceeds the limit, the circuit board assembly equipment will stop the alarm. When there are foreign objects in the frame 10 or the circuit board 9 is placed on the frame 10, the circuit board 9 will not be subjected to stress compression; when fixing the circuit board 9 and the frame 10, the fixing part and the frame 10 can be aligned more accurately to prevent the fixing part from being displaced; the second picking mechanism 51 is an intelligent electric screwdriver. In the process of locking the screws, the intelligent electric screwdriver will also monitor its own torque and number of rotations to ensure that the torque and number of rotations are within the normal range to prevent the circuit board 9 from being damaged. In summary, the circuit board assembly equipment and circuit board assembly method of the embodiment of the present application can solve the problem of board damage.

[0188] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A circuit board assembly device, characterized in that: include: An operating platform, used to carry a machine frame, wherein the machine frame includes a mounting surface; A circuit board picking device comprises a first moving mechanism, a tilting mechanism and a first picking mechanism, wherein the first moving mechanism is installed on the operating platform, the driving end of the first moving mechanism can move in the space above the operating platform, the tilting mechanism is connected to the driving end of the first moving mechanism, the first picking mechanism is installed on the side of the tilting mechanism facing the mounting surface, the driving end of the first moving mechanism can drive the first picking mechanism to pick up the circuit board and move to above the machine frame; the tilting mechanism can drive the first picking mechanism to move until the circuit board is tilted relative to the mounting surface, and after the first moving mechanism drives the first picking mechanism to descend to a predetermined height, the tilting mechanism drives the first picking mechanism to move until the circuit board is parallel to the mounting surface; The visual guidance device is used for providing visual guidance when the first picking mechanism picks up the circuit board and moves it to the top of the machine frame.

2. The circuit board assembly equipment according to claim 1, characterized in that: The tilting mechanism includes a tilting drive assembly, a first connecting plate and a second connecting plate, the second connecting plate and the first connecting plate being arranged relative to each other and spaced apart, the second connecting plate being rotatable relative to the first connecting plate, the first connecting plate being connected to a driving end of the first moving mechanism, the tilting drive assembly being mounted on the first connecting plate, and the driving end of the tilting drive assembly being connected to the second connecting plate, the first picking mechanism being connected to a side of the second connecting plate facing away from the first connecting plate, the tilting drive assembly being used to drive the second connecting plate to rotate relative to the first connecting plate until the second connecting plate is tilted relative to the mounting surface, or being used to drive the second connecting plate to rotate relative to the first connecting plate until the second connecting plate is parallel to the mounting surface.

3. The circuit board assembly equipment according to claim 2, characterized in that: The tilting mechanism further includes a first limiting assembly, wherein the first limiting assembly is connected to one of the first connecting plate and the second connecting plate; When the second connecting plate is parallel to the mounting surface, the first limiting assembly is abutted against the other of the first connecting plate and the second connecting plate; and when the second connecting plate is inclined relative to the mounting surface, the first limiting assembly is opposite to and spaced from the other of the first connecting plate and the second connecting plate.

4. The circuit board assembly equipment according to claim 3, characterized in that: The first connecting plate comprises a first portion and a second portion, the first portion and the second portion are located on opposite sides of a rotation axis of the second connecting plate, the second connecting plate comprises a third portion and a fourth portion, the third portion and the fourth portion are located on opposite sides of a rotation axis of the second connecting plate, and the first portion is arranged opposite to the third portion, and the second portion is arranged opposite to the fourth portion; The tilting mechanism further includes a second limiting assembly, wherein the first limiting assembly and the second limiting assembly are located on opposite sides of the rotation axis of the second connecting plate, and the second limiting assembly is connected to one of the second part and the fourth part; When the second connecting plate is parallel to the mounting surface, the second limiting assembly is opposite to and spaced from the other of the second part and the fourth part; and when the second connecting plate is inclined relative to the mounting surface, the second limiting assembly abuts against the other of the second part and the fourth part.

5. The circuit board assembly equipment according to claim 2, characterized in that: The circuit board picking device further comprises a pressure sensor for monitoring the pressure on the circuit board picking device, and the pressure sensor is connected to the second connecting plate.

6. The circuit board assembly equipment according to any one of claims 1 to 5, characterized in that: The visual guidance device includes a controller, a first camera and a second camera. The first camera is used to capture an image of the machine frame, and the second camera is used to capture an image of the circuit board picked up by the first picking mechanism. The controller can generate a first driving signal based on the image captured by the first camera and the image captured by the second camera to drive the first moving mechanism to move to adjust the position of the circuit board.

7. The circuit board assembly equipment according to claim 6, characterized in that: The first camera is installed at the driving end of the first moving mechanism.

8. The circuit board assembly equipment according to any one of claims 1 to 5, characterized in that: The circuit board assembly equipment also includes a locking device, which includes a second moving mechanism installed on the operating platform and a second picking mechanism connected to the driving end of the second moving mechanism. The driving end of the second moving mechanism can move in the space above the operating platform to drive the second picking mechanism to pick up the fixing part and drive the fixing part to pass through the circuit board and the machine frame in sequence.

9. The circuit board assembly equipment according to claim 8, characterized in that: The circuit board assembly equipment also includes a height measuring mechanism, which is arranged on the locking device and is used to detect the distance between the circuit board in the frame and the height measuring mechanism, so that the controller can determine whether the circuit board is placed flat on the installation surface.

10. A circuit board assembly method, characterized in that: include: The visual guidance device guides the circuit board picking device to pick up the circuit board and transport the circuit board to above the mounting surface on the machine frame; The circuit board picking device drives the circuit board to tilt, so that one side of the circuit board is tilted relative to the mounting surface; The circuit board picking device drives the inclined circuit board into the machine frame; The circuit board taking device lays the circuit board in the frame flat and places it on the installation surface.