A cutting device and a cutting method

Abstract

The present invention discloses a cutting device and a cutting method. The cutting device includes a cutting tool, an energy supply component, and a liquid guiding component. The cutting tool is used for cutting a workpiece to be machined, and the material of the cutting tool is a light-transmitting material. The energy supply component is configured to be able to emit laser light, and the laser light passes through the cutting tool and irradiates the machining part at the cutting position of the cutting tool. The liquid guiding component is adapted to supply a reaction liquid to the machining part, and the reaction liquid is configured to react with the machining part under the irradiation of the laser light so as to modify the material of the machining part, thereby improving the machinability of the material of the machining part, so that the cutting tool can remove the material of the machining part of the workpiece to be machined. In the present application, under the dual action of the energy field provided by the energy supply component and the physical and chemical reactions of the reaction liquid, the material properties of the machining part are rapidly and accurately changed, and the controllability of material modification is achieved on the premise of ensuring the machining quality, and the material modification efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of cutting equipment, and particularly relates to a cutting device and a cutting method. Background Art

[0002] The traditional mechanical processing methods for materials are: cutting processing (turning, milling), grinding processing (grinding, polishing). In addition, non-traditional energy field processing methods can also be adopted: thermal energy processing (such as laser processing), electrical energy processing (such as electrical discharge machining), acoustic energy processing (such as ultrasonic machining), and chemical energy and electrochemical energy processing (such as chemical milling and electrochemical machining). These processing methods can be used to process most materials, but for the processing of brittle and hard materials, the processing efficiency is extremely low, and the processing quality is very poor, making it extremely difficult to meet the use requirements.

[0003] The manufacturing of optical parts is mainly divided into two categories. Classified by the final formed structure of the parts, they are plane (rotationally symmetric parts) and free-form surface (non-rotationally symmetric parts). Classified by the machinability of the parts, they are plastic easy-to-machine materials and hard and brittle difficult-to-machine materials. For plastic easy-to-machine (plane and free-form surface) materials, the above-mentioned mechanical processing methods and energy field processing methods can all be realized. However, for brittle and hard processing materials, using traditional mechanical processing methods will result in high cutting forces, causing the workpiece to break during the cutting process (if the cutting force is reduced, it will lead to the inability to remove the material), and problems such as high temperature during the cutting process, rapid tool wear, low material removal rate, low machining accuracy, poor surface finish, and machining defects. When using non-traditional energy field processing methods, on the one hand, brittle and hard materials cannot be processed into free-form surfaces, and on the other hand, even if they can be processed, the processing efficiency is low, the product quality is inconsistent, the heat affected zone during the processing is large, the energy consumption is high, and the processing cost is high. Currently, there is no good processing method to carry out processing while ensuring processing efficiency, shape accuracy, surface quality, and subsurface quality. In short, the existing processing methods either cannot be made or the quality is poor and cannot be used. Summary of the Invention

[0004] The main object of the present invention is to propose a cutting device and a cutting method, aiming to solve the technical problem of how to improve the processing efficiency while ensuring the processing quality of brittle and hard materials.

[0005] To achieve the above object, the present invention proposes a cutting device, including:

[0006] A tool for performing cutting processing on a workpiece to be processed. The material of the tool is a light-transmitting material. A liquid flow channel is provided inside the tool, and the liquid flow channel is configured to direct a reaction liquid to the processing part. The tool includes an edge for cutting the processing part, and the outlet of the liquid flow channel is provided at the edge.

[0007] An energy supply component, the energy supply component is configured to emit a laser, the laser passes through the tool and irradiates the processing part at the cutting position of the tool;

[0008] a liquid guiding component, adapted to provide the reaction liquid to the processing part or the liquid flow channel, wherein the reaction liquid is configured to react with the processing part under the irradiation of the laser so as to modify the material of the processing part;

[0009] A plurality of liquid flow channels are arranged inside the tool, and the laser penetrates into the tool and forms a light spot at the cutting edge, and the light spot at least covers an outlet of one of the liquid flow channels.

[0010] In some embodiments, the cutting device further comprises a reaction liquid, and the liquid guide assembly comprises a liquid storage portion, and the liquid storage portion is used to store the reaction liquid;

[0011] The workpiece to be processed is a glass material, and the reaction liquid is an alkaline solution;

[0012] or,

[0013] The workpiece to be processed is a metal material, and the reaction liquid is an acidic solution.

[0014] In some embodiments, the reaction solution is a sodium hydroxide solution;

[0015] or,

[0016] The reaction liquid is a hydrogen peroxide solution;

[0017] or,

[0018] The reaction solution is a potassium hydroxide solution;

[0019] or,

[0020] The reaction solution is a sodium carbonate solution;

[0021] or,

[0022] The reaction liquid is a hydrofluoric acid solution.

[0023] In some embodiments, the tool comprises a cutting edge and a zoom curved surface, the zoom curved surface is located on a side of the tool away from the cutting edge, and the energy supply component is further configured to change the path of the laser in response to a change in a cutting point of the cutting edge;

[0024] The zoom curved surface is configured so that the focus of the laser light is located at the cutting point of the cutting edge after the path of the laser light is switched.

[0025] In some embodiments, the energy supply component includes a laser generator and a galvanometer component. The laser generator is used to generate the laser, and the galvanometer component is used to change the path of the laser. The laser has an emission section and a reflection section. The emission section is located between the laser generator and the galvanometer component, and the reflection section passes through the tool and irradiates the machining part.

[0026] In some embodiments, the galvanometer component includes a first reflector and a second reflector. The first reflector is configured to rotate about a first axis, and the second reflector is configured to rotate about a second axis. The first axis intersects the second axis. The emission section is reflected by the first reflector to the second reflector and then reflected by the second reflector to form the reflection section.

[0027] The second aspect of the present invention also provides a cutting method, which is applicable to controlling the cutting device described in any of the above embodiments. The cutting method includes:

[0028] Controlling the liquid guiding component to provide the reaction liquid so that the reaction liquid contacts the machining part;

[0029] Controlling the energy supply component to apply the energy field to the machining part so that the reaction liquid reacts with the material of the machining part.

[0030] Compared with the prior art, the beneficial effects of the present invention are:

[0031] In the technical solution of the present invention, the cutting device includes a tool for cutting a workpiece to be machined, an energy supply component, and a liquid guiding component. Among them, the energy supply component is configured to be able to emit a laser. The laser passes through the tool and irradiates the machining part at the cutting position of the tool, and the laser is configured to be able to modify the material of the machining part. The liquid guiding component is adapted to supply a reaction liquid to the machining part, and the reaction liquid is configured to be able to react with the machining part under the irradiation of the laser of the energy supply component so as to modify the material of the machining part, thereby reducing the machinability of the material of the machining part, so as to facilitate the tool to remove the material of the machining part of the workpiece to be machined. Compared with the prior art solution of reducing the brittleness of the workpiece by heating, in the present application, in addition to being modified under the action of the laser, the reaction liquid can also react with the machining part under the condition of the energy field to further modify the material of the machining part. In other words, under the dual physical and chemical actions of the laser provided by the energy supply component and the reaction liquid, the material properties of the machining part are controllably, precisely, and rapidly changed, improving the efficiency of material modification, and then realizing the machinability of difficult-to-machine materials, effectively improving the machining efficiency while ensuring the machining quality. Description of the Drawings

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0033] Figure 1 Schematic structural diagram of a tool in an embodiment of the present invention;

[0034] Figure 2 Schematic structural diagram of a tool from a first perspective in another embodiment of the present invention;

[0035] Figure 3 Schematic structural diagram of a tool from a second perspective in another embodiment of the present invention;

[0036] Figure 4 In another embodiment of the present invention, the tool is at Figure 3 Enlarged schematic diagram of local area A;

[0037] Figure 5 Schematic structural diagram of a tool assembled on a tool carrier in an embodiment of the present invention;

[0038] Figure 6 Schematic structural diagram of a tool from a third perspective in an embodiment of the present invention;

[0039] Figure 7 In an embodiment of the present invention, the tool is along Figure 6 Enlarged schematic diagram of the cutting edge after being sectioned along the B - B direction; wherein, a liquid flow channel for allowing the reaction liquid to flow towards the workpiece is provided inside the tool;

[0040] Figure 8 Working principle diagram of a cutting device in the first embodiment of the present invention; wherein, the cutting device includes a galvanometer assembly;

[0041] Figure 9 Working principle diagram of a cutting device in the second embodiment of the present invention; wherein, the reaction liquid can flow towards the workpiece through the liquid flow channel provided inside the tool;

[0042] Figure 10 Working principle diagram of a cutting device in the third embodiment of the present invention; wherein, the laser adjustment device includes a refraction part;

[0043] Figure 11 Working principle diagram of a cutting device in the fourth embodiment of the present invention; wherein, the laser adjustment device includes a reflection part;

[0044] Figure 12It is the working principle diagram of the cutting device in the fifth embodiment of the present invention; wherein, the galvanometer assembly includes a first mirror;

[0045] Figure 13 It is the working principle diagram of the cutting device in the sixth embodiment of the present invention; wherein, the galvanometer assembly includes a first mirror and a second mirror;

[0046] Figure 14 It is the schematic flowchart of the cutting method in an embodiment of the present invention;

[0047] Figure 15 It is the surface topography diagram of the workpiece to be machined before machining;

[0048] Figure 16 It is the surface topography diagram of the workpiece to be machined after being machined by the cutting device;

[0049] Figure 17 It is the first actual shot diagram when the workpiece to be machined is being machined by the cutting device;

[0050] Figure 18 It is the second actual shot diagram when the workpiece to be machined is being machined by the cutting device; wherein, for the convenience of observation, the laser generator is turned off.

[0051] Explanation of the reference numerals in the drawings:

[0052] Cutting device 100;

[0053] Tool 110;

[0054] Cutting edge 111; Zoom surface 112; First end 113; Second end 114; Liquid flow channel 115;

[0055] Energy supply component 120;

[0056] Laser generator 121; Laser regulator 122; Reflection part 1221; Refraction part 1222; Laser 123; Light spot 1231; Exit section 1232; Reflection section 1233; Galvanometer assembly 124; First mirror 1241; Second mirror 1242;

[0057] Tool carrier 130;

[0058] Liquid guiding component 140; Liquid storage part 141;

[0059] Reaction liquid 150;

[0060] Workpiece to be machined 200;

[0061] First direction X.

[0062] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0063] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0064] In the manufacturing process of non-planar optical parts, due to the irregular shape and small size of non-planar parts, a fast tool servo system is usually used to process such parts. After the traditional fast tool servo system processes workpieces with excellent material properties, formability, and machinability, parts with surface topography and surface accuracy meeting the product use requirements can be obtained. However, the traditional fast tool servo system is difficult to process materials with high hardness, high brittleness, and low fracture toughness. Brittle and hard materials mainly refer to brittle materials such as aerospace hard metals, optical glass, silicon carbide, diamond chip substrates, etc. These materials have poor formability and machinability, and will break irregularly during the cutting process, resulting in discontinuous material removal, making it difficult to control the product quality and the cutting efficiency is very low.

[0065] In other words, brittle and hard materials have low elasticity and plasticity, or even basically no elasticity and plasticity. These characteristics cause that when a certain external force is applied to these materials, there is basically no plastic deformation or elastic deformation. Therefore, when the external force reaches a certain level, the stressed part of the parts made of this material will suddenly break down, and there is no obvious plastic deformation when it breaks down. The existence of these characteristics causes irregular and uncontrollable breakage during the cutting process of the workpiece, resulting in discontinuous material removal, endangering the surface quality and subsurface quality, and ultimately making it difficult for the surface topography and surface accuracy of the processed parts to meet the product use requirements and difficult to control the product quality.

[0066] The applicant found that when a laser beam irradiates the surface of a brittle and hard material, its energy will be absorbed and converted into heat energy, rapidly heating the material surface. As the temperature rises, the moisture and gas on the material surface evaporate, forming a "vapor film", which can effectively prevent heat conduction and prevent the heat inside the material from diffusing to the surface, thereby forming a high temperature inside the material. At high temperatures, the strength and hardness of brittle and hard materials decrease and become easier to cut. In other words, under the action of the thermal effect of the laser, the atomic or molecular thermal motion of the irradiated material is enhanced, so that the brittle and hard properties of the material are changed and it is easier to be removed. However, in the process of heating the workpiece to modify its material, there are the following defects:

[0067] 1. The high temperature resistance of the processed material and the tool is different, and laser assistance cannot be used. Specifically, the high temperature resistance of some materials may be as high as 2000 degrees Celsius. The high temperature resistance of diamond tools is usually only about 600 degrees Celsius. In order to avoid the temperature damage of the diamond tool by the laser, the radiation temperature of the laser is usually controlled to be lower than the high temperature resistance index of the diamond tool, but at this temperature, the cutting performance of the material changes very little or may not change. If the radiation temperature of the laser is controlled at 2000 degrees Celsius, it is easy for the cutting performance of the material to change before the turning tool has melted or oxidized. Therefore, laser-assisted processing can only be carried out within the temperature range allowed by the tool, usually below 600 degrees Celsius. However, when processing optical materials, the most important indicator of optical materials is the heat resistance index. Taking optical glass as an example, the material modification temperature of optical glass is about 1500 degrees Celsius. Therefore, the cutting process of the workpiece cannot be assisted by laser in the conventional scheme.

[0068] 2. Even if cutting can be achieved with the assistance of laser, the tool wears and oxidizes very quickly under high temperatures, and the material and manufacturing costs of the tool are very high, which leads to low economic efficiency.

[0069] 3. The use of laser irradiation to modify materials may cause problems with the heat-affected zone (HAZ) of the material, resulting in degradation of the performance of the processed material: some materials may undergo microstructural changes (such as grain coarsening and phase change) at high temperatures, resulting in performance degradation.

[0070] The presence of heat-affected zones may cause microcracks or thermal cracks in the workpiece: the uneven thermal expansion and contraction of various parts of the workpiece may cause thermal stress and lead to crack formation, especially for materials with a large thermal expansion coefficient, which are very prone to microcracks or thermal cracks.

[0071] 4. Side reactions such as oxidation and chemical reactions lead to very unsatisfactory processing quality. During laser processing, if the material is exposed to air, high temperature will cause surface oxidation or other chemical reactions, which may have an adverse effect on the processing quality of the workpiece. For example, the oxide layer may reduce the performance of the product or introduce surface defects. For some sensitive materials (such as silicon carbide), secondary phases may form on the surface, affecting the quality of the processed surface.

[0072] Although there are laser and liquid-assisted processing methods in related technologies, namely water-guided laser processing, liquid laser ablation, laser-induced back wet etching, and etching-assisted laser modification processing, the above laser-compounded liquid methods mainly rely on the thermal effect of the laser and the impact force of the liquid; or the processing technology that combines laser-induced material modification with chemical corrosion selective removal, the material removal amount is at the nanometer level, that is, the material removal amount is extremely low, and the processing efficiency is very low.

[0073] Specifically, in the related art, the workpiece is usually immersed in a composite liquid and then laser ablation is used to remove the material. However, this will cause all parts of the workpiece immersed in the composite liquid to be affected, making it difficult to effectively process the specified position of the workpiece, and the quality of the processed product is low.

[0074] When the composite liquid is poured onto the surface of the workpiece, since a liquid film will be formed on the surface of the workpiece after the liquid covers the surface of the workpiece, this liquid film will block the contact between the laser and the surface of the workpiece, resulting in the failure of the laser's function. Moreover, when the laser passes through the dynamic liquid film, there will be irregular refraction and reflection, and it cannot be accurately focused on the actual machined surface required, resulting in laser scattering and defocusing, and finally the laser modification effect is lost during the processing. Especially when the workpiece is rotating, the composite liquid can form a dynamic and irregular liquid film to cover the surface of the workpiece, completely blocking the laser. In the related art, in order to overcome the influence of the liquid film on the laser, water-guided laser is used to process the workpiece, that is, the liquid wraps the laser and shoots it onto the surface of the workpiece synchronously, and the laser modifies the workpiece material, and the liquid on the outer peripheral side of the laser provides an impact force to achieve material removal. Although this reduces the influence of the liquid on the laser, the processing efficiency is low, and it can only be used for cutting workpieces and cannot machine the surface shape of the workpiece.

[0075] In view of this, please refer to Figures 1 to 11, the present invention provides a cutting device 100, which includes a cutting tool 110, an energy supply component 120, and a liquid guiding component 140. The cutting tool 110 is used to perform cutting on a workpiece to be machined 200, specifically, the removal of material is achieved by the contact and movement of its cutting edge 111 with the surface of the workpiece to be machined 200. It should be noted that the movement of the cutting edge 111 relative to the surface of the workpiece to be machined 200 can be the movement of the cutting tool 110 relative to the workpiece to be machined 200, or the movement of the workpiece to be machined 200 relative to the cutting tool 110, or both the cutting tool 110 and the workpiece to be machined 200 move. The movement mode of the cutting tool 110 includes but is not limited to movement, etc. The energy supply component 120 is used to provide an energy field so that at least the machining part of the workpiece to be machined 200 can be located within the energy field, wherein the energy field is configured to be able to modify the material of the machining part. It should be noted that the energy field includes but is not limited to a light field (laser field), an electric field, a magnetic field, an ion field, a radiation field, an electromagnetic wave energy field, and a mechanical wave energy field, etc. For the convenience of description, the following will be described taking the laser field as an example. The liquid guiding component 140 is responsible for guiding the reaction liquid 150 to the machining part. Under the condition of the energy field provided by the energy supply component 120, the reaction liquid 150 can chemically or physically react with the machining part, thereby changing the material properties of the machining part, improving its brittleness, and facilitating cutting. It should be noted that the reaction degree of the reaction liquid 150 with the workpiece to be machined 200 under normal conditions is less than the reaction degree of the reaction liquid 150 with the workpiece to be machined 200 under the condition of the energy field of the energy supply component 120. It can be considered that "the reaction liquid 150 reacts with the machining part under the condition of the energy field".

[0076] Compared with the related art in which laser is used to irradiate the workpiece to modify the material for easy cutting, in the present application, the energy field can modify the material, and at the same time, the reaction liquid 150 can react with the material of the machining part under the condition of the energy field, so that the microstructure, the bond energy between atoms and molecules, the lattice structure, the physical properties, etc. of the material of the workpiece to be machined 200 are modified under the combined action of the energy field and the reaction liquid 150, making the cutting performance of hard and brittle materials better, the material modification efficiency higher, and the material modification degree better. At this time, the cutting tool 110 can easily remove the material of the workpiece to be machined 200, improving the machining efficiency while ensuring the machining quality of the product, and reducing the wear degree of the cutting tool 110.

[0077] In the related art, the modification of the heating auxiliary material is adopted, or the laser is used to modify the material. Due to the uncontrollability of local heating and the high density of laser energy, it is easy to cause the material to be overburned instantaneously, and the material is liquefied or vaporized, resulting in damage to the material, and the modification degree of the material cannot be accurately controlled. In this application, the energy field and the reaction liquid 150 are used to modify the material, which can improve the controllability of the material modification of the processing part, and the modification area of the workpiece 200 to be processed is more accurately controlled. Moreover, the efficiency of the material modification is higher, and the degree of the material modification is better.

[0078] In addition, under the combined action of the energy field and the reaction liquid 150, the material of the tool 110 can be made of a material with a lower hardness, thereby reducing the cost of the tool 110. Therefore, the tool 110 in this application can be made of a transparent material such as single crystal silicon carbide that can transmit a specific wavelength of laser, so that the cost of the tool 110 can be greatly reduced, and the processing cost can be further reduced. In the related art, in order to be able to remove materials with a relatively high hardness, turning tools are usually made of materials with extremely high hardness such as diamond and sapphire, which are extremely costly.

[0079] It should be noted that the reaction liquid 150 in this application is different from the coolant in the workpiece turning process in the related art. The coolant in the related art mainly plays a role in cooling and lubricating during the workpiece processing, while the reaction liquid 150 in this application can modify the material of the processing part. In addition, in some embodiments, the formula of the reaction liquid 150 can be adjusted so that the reaction liquid 150 has the functions of cooling, lubricating, and slag removal at the same time.

[0080] The cutting device 100 further includes a tool carrier 130, which is used to carry the tool 110 so that the tool 110 can be installed on the cutting device 100. That is, in the specific embodiment, the tool 110 is located at the tip of the tool carrier 130, and it can directly contact the workpiece and cut the workpiece.

[0081] For ease of description, the following takes the energy supply component 120 for providing a laser field (laser 123) as an example for illustration. In some embodiments, the energy supply component 120 can irradiate the workpiece 200 to be processed with the laser 123 so that when the cutting tool 110 cuts the machining part, the laser 123 can just cover the position to be processed. At the same time, under the combined action of the reaction liquid 150 and the laser 123, the material to be processed is modified, and material removal is carried out through the cutting movement of the cutting tool 110. The power of the laser 123 and the size of the light spot 1231 formed by the laser 123 at the processed position determine the degree of material modification. At the same time, the nature and concentration of the reaction liquid 150 also determine the degree of material modification. Taking face cutting as an example, the length A of the cutting edge used for cutting (defining the cutting edge as the part of the edge 111 actually used for cutting) satisfies the following relationship with the cutting depth B and the arc radius C of the cutting tool 110: A is proportional to B×C. That is to say, the greater the cutting depth B of the cutting tool 110 and the greater the arc radius C of the cutting tool 110, the greater the cutting edge length A.

[0082] In other words, after ensuring that the diameter of the light spot 1231 formed by the laser 123 on the workpiece surface can completely cover the actual cutting position (or the light spot 1231 covers the cutting edge length), the greater the power of the laser 123, the higher the material modification efficiency. Taking the processed material as quartz glass, the laser 123 device as an infrared laser, and the chemical liquid as sodium hydroxide solution as an example. When the cutting depth B is 0.5 mm, for the cutting tool 110 with an arc radius C of 0.5 mm of the cutting tool 110. The radius of the light spot 1231 of the laser 123 is configured to be 200 microns, and the power of the laser 123 is configured in the range of 2 - 40 W to effectively react with the workpiece material. When the power of the laser 123 is less than 2 W, the material modification effect is not obvious, and it hardly reacts with the workpiece material.

[0083] Therefore, during the process of adjusting and positioning the laser 123, the power of irradiating the machining part with the laser 123 can be configured to be less than 2 W, so that the laser 123 does not react with the workpiece, avoiding affecting the subsequent machining accuracy, thereby ensuring the cutting quality and cutting efficiency of the workpiece, and at the same time improving the safety of the machining process of the workpiece 200 to be processed. It should be noted that when the power of the laser 123 is greater than 40 W, the reaction effect between the laser 123 and the workpiece material will decrease. Thus, when the power of the laser 123 is configured in the range of 2 - 40 W, it can ensure that the greater the power of the laser 123, the higher the modification efficiency and the better the cutting effect.

[0084] For ease of description, the following takes the energy supply component 120 for providing thermal energy as an example for illustration. In some embodiments, the energy supply component 120 can heat the workpiece to be processed, so that when the cutting tool 110 cuts the processing part, the temperature range of the processing part is between 40 and 600 °C. Within this range, the reaction degree between the reaction liquid 150 and the processing part is conducive to the cutting process of the cutting tool 110. In other embodiments, the reaction liquid 150 can be configured such that when the temperature of the processing part is less than 40, it does not react with the processing component, avoiding affecting the processing accuracy, thereby ensuring the cutting quality and efficiency while improving the safety of the workpiece 200 during the processing. It should be noted that the cutting tool 110 can be made of a material that does not react with the reaction liquid 150, or the cutting tool 110 is made of a material whose reaction degree with the reaction liquid 150 is much lower than the reaction degree between the reaction liquid 150 and the workpiece, or the material used for the cutting tool 110 reacts with the reaction liquid 150 at a temperature higher than the temperature range of 40 - 600 °C, thereby ensuring the service life of the cutting tool 110.

[0085] The cutting tool 110 can be made of cemented carbide, having good wear resistance and hardness, and also having high thermal conductivity, suitable for high-precision cutting tasks. In some embodiments, the energy supply component 120 can be in the form of a resistance heating wire or a ceramic heating sheet, etc., and is directly installed near the cutting tool 110 or integrated inside the cutting tool 110 to ensure that heat can be effectively transferred to the processing part. In other embodiments, the energy supply component 120 is configured to be able to emit a laser 123, and the laser 123 can be irradiated on the processing part, thereby realizing the heating of the processing part. In some embodiments, the energy supply component 120 can also be designed to surround the cutting tool 110, so that the entire processing area can be uniformly heated. At the same time, in order to improve the utilization rate and effect of the reaction liquid 150, a liquid guiding component 140 in the form of a nozzle can be provided above the processing part, which can not only ensure that the reaction liquid 150 accurately reaches the target position, but also control the flow rate and enhance the reaction efficiency. The liquid guiding component 140 can include a pump and pipelines, etc. The pump extracts the reaction liquid 150 from the liquid storage container and precisely transports it to the processing part through the pipeline.

[0086] Similarly, according to the different energy fields, an electric field, a magnetic field, or a high-energy ray field such as ions or radiation can be arranged to provide energy field conditions for the processed area, greatly stimulating the combined modification effect of the energy field and the chemical liquid.

[0087] To further understand the relationship between material modification and removal strength and laser properties, cutting parameters, reaction liquid properties, and workpiece material properties, the following relational expressions are established:

[0088] First, regarding the material modification strength aspect:

[0089]

[0090] II. Regarding the material removal strength:

[0091]

[0092] Among them, the reaction solution 150 includes a modifying substance and a base solution; is the wavelength factor of the laser 123, and its value range is: [0, 10]; t is the time factor of the laser 123 irradiating on the surface of the workpiece, and its value range is: [0, 8]; P is the power factor of the laser 123, and its value range is: [0, 78]; v is the cutting speed factor, and its value range is: [0, 5000]; A is the tool cutting depth factor, and its value range is: [0, 200]; f is the tool cutting feed speed factor, and its value range is: [0, 200]; q is the property factor of the modifying substance, and its value range is: [0, 10]. The properties of the modifying substance include but are not limited to the composition of the modifying substance and the particle size of the modifying substance, etc.; w is the concentration factor of the reaction solution 150, and its value range is: [0, 100]; is the material property factor of the workpiece to be machined, and its value range is: (0, 10]. The larger the values of these factors within a certain range, the better the material removal strength of the workpiece. d is the diameter factor of the light spot 1231 formed by the laser 123 on the surface of the workpiece, and its value range is: (0, 5000]; l is the length factor of the cutting edge, and its value range is: (0, 500], that is, the length of the part of the cutting edge actually used to cut the workpiece; is the property factor of the base solution, and its value range is: (0, 10]. The lower the diameter of the light spot 1231, the length of the cutting edge, and the base solution factor of the reaction solution 150, the better the material removal strength of the workpiece. α is a regulation factor that controls the influence rate of the modification strength on the material itself and the material removal rate, and its value range is: (0, 100].

[0093] It should be noted that the materials of the workpiece 200 to be machined include but are not limited to inorganic glass, organic glass, and amorphous semiconductor glass, etc. In some embodiments, the material of the workpiece 200 to be machined can also be a metal material, etc.

[0094] In some embodiments, the cutting device 100 further includes a reaction liquid 150, wherein the liquid guiding assembly 140 includes a liquid storage portion 141 for storing the reaction liquid 150. This design makes the cutting device 100 a complete system, which not only has the ability to perform cutting operations, but also integrates the supply function of the reaction liquid 150, facilitating the operator to select the appropriate type of reaction liquid 150 according to different processing requirements and ensuring that the reaction liquid 150 can be supplied to the processing site in a timely manner when needed. In some embodiments, the liquid storage portion 141 may be a sealed tank body with a stirring device built therein for keeping the components of the reaction liquid 150 evenly distributed. In addition, the liquid storage portion 141 may also be equipped with a liquid level sensor to monitor the remaining amount in real time and remind the user to replenish when necessary. In some embodiments, the liquid storage portion 141 may also adopt heat preservation measures or add an anti-corrosion coating to extend the shelf life of the reaction liquid 150, so that the reaction liquid 150 can be applicable to scenarios where it is prone to volatilization or sensitive to external environmental changes.

[0095] It should be noted that the liquid guiding assembly 140 further includes a liquid guiding pipe, and the liquid guiding pipe is connected to the liquid inlet of the liquid storage portion 141 so as to be able to replenish the reaction liquid 150 to the liquid storage portion 141. The liquid guiding pipe is connected to the outlet of the liquid storage portion 141 and can be used to discharge the reaction liquid 150 inside the liquid storage portion 141. The liquid guiding pipe and the liquid storage portion 141 are made of a material of polytetrafluoroethylene and metal composite. In some embodiments, the inside of the liquid guiding pipe and the inside of the liquid storage portion 141 are made of polytetrafluoroethylene material, and the outer wall of the liquid guiding pipe and the outer wall of the liquid storage portion 141 are made of metal material.

[0096] In some embodiments, considering that different types of workpieces 200 to be processed may require the use of a variety of different reaction liquids 150, multiple independent liquid storage portions 141 can be provided on the cutting device 100, and each liquid storage portion 141 is equipped with its own liquid guiding channel and control valve. In this way, the type of reaction liquid 150 used can be flexibly switched according to actual needs, without the need to frequently replace external containers, improving the work efficiency while reducing the pollution risk. In addition, in order to further simplify the operation process, an automatic proportioning system can be introduced to allow the user to set a specific ratio to mix more than two reaction liquids 150 to adapt to more complex processing conditions.

[0097] In some embodiments, when the workpiece 200 to be processed is a glass-like material, the reaction liquid 150 used can be an alkaline solution or hydrofluoric acid (HF). Specifically, in the process of processing glass products, sodium hydroxide (NaOH) or a similar strong base is used as the reaction liquid 150, and a chemical reaction occurs after it contacts the glass surface. This reduces the brittleness of the material of the workpiece 200 to be processed, making it convenient for the cutting tool 110 to perform cutting processing on it.

[0098] Due to the relatively stable nature of glass materials and their resistance to ordinary chemicals, using an alkaline solution at a specific concentration and temperature can achieve local modification without affecting the overall integrity. For example, in the manufacture of certain special types of optical lenses, this method helps to form a smoother, more transparent, and scratch-resistant surface.

[0099] In addition, for different types of glass materials (such as soda-lime glass, borosilicate glass, etc.), alkaline solutions with different component ratios can be selected to optimize the reaction effect. At the same time, to ensure safety and prevent excessive corrosion, a pH monitoring system can be introduced to adjust the strength of the reaction solution 150 in real time.

[0100] In some other embodiments, if the workpiece 200 to be processed is a metal material, an acidic solution can be selected as the reaction solution 150. Exemplarily, when the workpiece 200 to be processed is an iron-based alloy material, the reaction solution 150 can be dilute sulfuric acid (H2SO4) or hydrochloric acid (HCl). These acidic solutions can react with the metal surface oxide layer under appropriate conditions to remove impurities and improve the surface quality. In some embodiments, to avoid the reaction solution 150 from affecting the material of the machine tool, a protective cover can be set during the process of using the reaction solution 150 to modify the workpiece, so that the machine tool is isolated from the reaction solution 150 to prevent the reaction solution 150 from contacting the machine tool.

[0101] In some embodiments, the reaction solution 150 can be selected from sodium hydroxide solution, hydrogen peroxide solution, potassium hydroxide solution, sodium carbonate solution, and hydrofluoric acid solution, etc. These solutions all have good chemical activity and can be applicable to different application scenarios and technical requirements, ensuring applicability.

[0102] Sodium hydroxide solution: Suitable for surface modification of glass materials and silicon-containing materials. Under the laser irradiation condition of the energy supply component 120, it can quickly modify the glass materials, facilitating the cutting process of the tool 110. In addition, for other wetted parts of the workpiece 200 that are not covered by the energy field provided by the energy supply component 120, this solution can also effectively improve the physical and chemical properties of the glass surface.

[0103] Hydrogen peroxide solution: As a mild but highly efficient oxidant, hydrogen peroxide can be used for cleaning and passivation treatment of metal surfaces. It removes surface contaminants of the workpiece 200 through oxidation, which is beneficial for the energy of the energy supply component 120 to act on the surface of the workpiece. At the same time, after the energy of the energy supply component 120 acts on the hydrogen peroxide solution, the material of the processing part is modified, facilitating the cutting of the tool 110. For other areas outside the processing part of the workpiece 200, a dense protective film can be formed on the surface under the action of the hydrogen peroxide solution, enhancing the corrosion resistance. It is especially suitable for products with high requirements for subsequent painting, such as automotive parts, household appliance casings, etc.

[0104] Potassium hydroxide solution: Similar to sodium hydroxide, potassium hydroxide is also a strong base, but it has a higher solubility. When processing glass components with a larger thickness or complex structure, the potassium hydroxide solution can provide better permeability and reaction rate, thereby further improving the processing efficiency. In addition, for some metals, such as aluminum and its alloys, the potassium hydroxide solution is also applicable.

[0105] In some embodiments, the mixed reaction liquid 150 can also be customized according to the specific conditions of different types of workpieces to be processed. For example, mixing a certain proportion of hydrogen peroxide with an alkaline substance (such as sodium hydroxide or potassium hydroxide) can not only maintain a strong oxidation ability but also adjust the pH value to an appropriate range, thereby expanding the applicable range and improving the processing efficiency. In addition, considering the requirements of environmental protection, the reaction liquid 150 can be a combination of a biodegradable surfactant and a weak alkaline substance, which not only ensures good processing effects but also reduces the impact on the environment.

[0106] Exemplarily, when the workpiece 200 to be processed is fused silica glass, the reaction liquid 150 can adopt a sodium hydroxide solution. When the workpiece 200 to be processed is a zinc sulfide material, the reaction liquid 150 can adopt a hydrogen peroxide solution. When the workpiece 200 to be processed is a silicon semiconductor material, the reaction liquid 150 can adopt a potassium hydroxide solution.

[0107] In some embodiments, the energy supply component 120 is configured to be able to emit a laser 123, and the laser 123 directly irradiates the processing part of the workpiece 200 to be processed. The characteristic of the laser 123 for material modification is that its highly concentrated energy can transfer the energy to the processing part in an extremely short time. Under the irradiation conditions of the laser 123, the reaction liquid 150 can react with the processing part without affecting the material properties of the parts of the workpiece 200 other than the processing part.

[0108] In some embodiments, the energy supply component 120 includes a laser generator 121 for emitting the laser 123, and the laser generator 121 can be of types such as a CO2 laser, a fiber laser, or a Nd:YAG (neodymium-doped yttrium aluminum garnet) laser. These lasers have different wavelength and power ranges, and the wavelength and emission time can be selected according to the absorption characteristics of the material to be processed. For example, when processing metal materials, a solid laser with a shorter wavelength and higher power can be selected; while when processing non-metal materials such as glass, a laser with a longer wavelength but moderate power can be selected.

[0109] To ensure that the laser 123 acts accurately on the machining area, a fine-tuning platform can be installed near the tool 110, allowing the operator to manually adjust the position and angle of the laser beam. In addition, an autofocus system can be equipped to detect the distance change of the machining surface using a sensor and feed it back to the control system in real time to keep the focus of the laser 123 always at the optimal position (the focus of the laser 123 can move with the change of the actual machining area of the workpiece 200 to be machined). This can not only improve the machining accuracy but also effectively avoid product quality problems caused by focus shift.

[0110] In some embodiments, in addition to the basic static laser 123 irradiation, a dynamic adjustment mechanism can be introduced, that is, dynamically adjust the laser 123 parameters such as power, frequency, pulse width, etc. according to the actual situation during the machining process. For example, when it is detected that the surface of the workpiece 200 to be machined is uneven or the temperature fluctuates greatly, the local irradiation effect can be strengthened by increasing the pulse frequency; conversely, if it is found that some areas have reached the ideal modification state, the power can be appropriately reduced to reduce unnecessary energy consumption to further optimize the machining quality and efficiency.

[0111] In addition, considering the different absorption rates of different materials for the laser 123, in some embodiments, multiple types of laser sources can be integrated on the same device, and different laser 123 modes can be switched to meet diverse machining requirements. For example, first use a low-power continuous-wave laser 123 for preheating treatment, and then switch to a high-power pulsed laser 123 to complete the final modification process. Such a combination method not only ensures the process flexibility but also improves the overall performance.

[0112] In some embodiments, the material of the tool 110 is a light-transmitting material, and the energy supply component 120 is configured to be able to emit the laser 123, and the laser 123 is configured to be able to pass through the tool 110 and irradiate the machining area, so as to irradiate the machining area, and at the same time the reaction liquid 150 reacts with the material of the machining area, enabling the material of the machining area to be rapidly modified, so that the tool 110 can perform cutting machining on it. The energy supply component 120 directly uses the laser 123 to modify the material of the machining area without additionally setting up a complex optical transmission path, simplifying the device structure and improving the working efficiency.

[0113] In addition, in the solution of the present application, during the process of the tool 110 approaching the workpiece and cutting the machining area, please refer to Figure 8, the cutting tool 110 can cut off the liquid film formed by the reaction liquid 150 on the surface of the workpiece. Thus, the laser 123 can penetrate from the cutting edge 111 of the cutting tool 110 and act on the machining part, so as to modify the material of the machining part, facilitating the cutting process of the cutting tool 110. Under the action of the liquid guiding component 140, the reaction liquid 150 can be continuously supplied to the workpiece. Therefore, the reaction liquid 150 still exists near the contact position of the cutting edge 111 of the cutting tool 110 on the workpiece to be machined 200. These reaction liquids 150 react with the material of the machining part under the radiation of the energy of the laser 123, further improving the degree of material modification of the machining part, and then improving the material removal efficiency of the cutting tool 110 for the workpiece. That is, the solution of the present application overcomes the technical barrier that the laser cannot act on the workpiece under the obstruction of the liquid film in the related art, and the solution of the present application has a more accurate and higher efficiency in the modification area of the workpiece material, and can well ensure the quality of the machined surface of the material.

[0114] Please refer to Figure 7 and Figure 9 , in some embodiments, a liquid flow channel 115 is provided inside the cutting tool 110. The outlet of the liquid flow channel 115 is located at the cutting edge 111 part (it should be noted that the outlet of the liquid flow channel 115 is within a certain range near the cutting edge 111, and the reaction liquid 150 can act on the machining part through this outlet, then it can be considered that the outlet of the liquid flow channel 115 is located at the cutting edge 111 part). The liquid guiding component 140 can guide the reaction liquid 150 to the liquid flow channel 115, so that the reaction liquid 150 can accurately act on the machining part of the workpiece to be machined 200, further improving the cutting quality of the cutting device. The number and diameter of the liquid flow channels 115 can be set according to the cutting requirements, and the inlet position of the liquid flow channels 115 can be set at a position convenient for machining according to the requirements.

[0115] Specifically, please refer to Figure 7, the laser 123 irradiates the tool 110 and forms a light spot 1231 at the cutting edge 111. A plurality of liquid flow channels 115 are provided inside the tool 110. During the process that the position of the light spot 1231 at the cutting edge 111 changes with the actual cutting position of the cutting edge 111, at least one outlet of the liquid flow channels 115 is within the coverage range of the light spot 1231 at the cutting edge 111. For the convenience of description, the plane where the light spot 1231 is located is defined as the projection plane. The adjacent two liquid flow channels 115 form a first projection and a second projection on this projection plane, and the third projection formed by the light spot 1231 on this projection plane covers the first projection and the second projection. The projections formed by the outlets of the other liquid flow channels 115 except the aforementioned adjacent two liquid flow channels 115 on the projection plane are defined as the fourth projection, and the fourth projection is outside the range of the third projection. In this way, it is ensured that there is always an outlet of the liquid flow channel 115 in the area irradiated by the light spot 1231, so as to ensure that the reaction liquid 150 can contact the machining part while ensuring that the laser 123 can effectively act on the machining part.

[0116] In some embodiments, the plurality of liquid flow channels 115 are evenly distributed in the tool 110. During the cutting process of the tool 110 on the workpiece 200 to be machined, the reaction liquid 150 can be introduced into each of the liquid flow channels 115 simultaneously. Alternatively, each of the liquid flow channels 115 can be independently controlled whether to introduce the reaction liquid 150 through the liquid guiding assembly 140. In other words, the liquid flow channel 115 closest to the actual cutting position of the cutting edge 111 among each of the liquid flow channels 115 can supply the reaction liquid 150 to the machining part, and the other liquid flow channels 115 temporarily stop introducing the reaction liquid 150. Thus, during the process that the light spot 1231 moves along the trajectory of the cutting edge 111 as the actual cutting position of the cutting edge 111 changes, there is always an outlet of the liquid flow channel 115 within the range of the light spot 1231, so that the laser 123 and the reaction liquid 150 can act on the machining part together.

[0117] Compared with the solution in the related art where the tool has no liquid flow channel, the liquid flow channel 115 provided inside the tool 110 in the present application can generate a local high pressure in the cutting area, and the effect of the reaction liquid 150 is better and more stable. It can better synchronize the photo-chemical-mechanical action on the material (area) to be removed. It is equivalent to modifying the material (area) to be removed while removing the material. Compared with the related art where pre-modification is performed on the area to be processed, for example, when laser-assisted modification is used on the area to be processed, overheating may occur and the processed surface may be burned. The scope of the chemical corrosion effect may exceed the thickness of the material to be removed, resulting in damage to the processed surface. In other words, the pre-treatment of modifying the workpiece material in the related art, or the energy field-assisted machining may both lead to instability of the modified layer, such as incomplete removal or the modified layer affecting the processed surface. The solution of the present application can keep the modification process from damaging the processed surface and the modified layer is precisely removed by the tool 110 through the synchronous action of the photo-chemical-mechanical action on the material to be removed.

[0118] It should be noted that in the related art, for the processing method where the tool (the part for milling and grinding) rotates (such as milling and grinding), it is difficult to synchronize the laser, chemical modification, and mechanical processing. Only pre-modification can be performed first, and then removal. Moreover, it is difficult for the part of the tool for milling and grinding in the related art to achieve the follow-up of the laser focus, and it is even more impossible to implement the design of setting a liquid flow channel. Exemplarily, the part of the milling cutter actually used for milling has multiple cutting edges, each cutting edge is arranged in a spiral shape, and there is a chip removal space between adjacent cutting edges, which makes it impossible to additionally design other structures, such as liquid flow channels, at each cutting edge.

[0119] In one embodiment, the material used for the tool 110 can be a transparent material with respect to a specific wavelength of laser. In another embodiment, the material used for the tool 110 can also be other light-transmitting materials with colors. In some embodiments, the tool 110 can be made of a superhard alloy material with light-transmitting characteristics. In other embodiments, the tool 110 can also be made of a crystalline material with light-transmittance, and the crystalline material can be quartz, or diamond, etc.

[0120] In some embodiments, the cutter 110 may use transparent ceramic as a substrate, so that the cutter 110 not only has good mechanical strength and wear resistance, but also has excellent optical transmittance, and can effectively transmit the light emitted from the laser generator 121. In order to further ensure that the laser 123 can smoothly reach the processing part, in some embodiments, the cutter 110 can use a transparent ceramic material suitable for the penetration of the laser 123 of a specific wavelength, including but not limited to aluminum oxide (Al2O3), silicon nitride (Si3N4), etc., so that the cutter 110 has good transmittance in the visible light and near-infrared regions. The shape of the cutter 110 can adopt a conical or wedge-shaped structure, so that the laser 123 can propagate to the cutting edge 111 along a predetermined path after entering the cutter 110. At the same time, a reflective surface or a light-guiding fiber can be provided inside the cutter 110 to help guide the laser 123 to the specified position.

[0121] In some embodiments, in order to avoid local high temperature of the tool 110 caused by the irradiation of the laser 123, an effective heat dissipation method can be adopted to prevent the tool 110 from overheating and deforming. A cooling channel can be arranged inside the tool 110, and a coolant can be passed through to remove excess heat; or a heat insulation coating can be applied to the outer surface to reduce the conduction of heat to other parts.

[0122] In other embodiments, a special coating, such as an anti-reflection film or an anti-reflection film, may be added to the surface of the tool 110 to improve the transmission efficiency of the laser 123 and reduce energy loss. At the same time, according to different types of reaction liquids 150 and their chemical properties, an anti-corrosion or anti-oxidation coating may be selectively applied to protect the tool 110 from erosion and extend its service life.

[0123] See also Figures 1 to 4 In some embodiments, the tool 110 includes not only a cutting edge 111 for cutting, but also a zoom surface 112, which is located on the side of the tool 110 away from the cutting edge 111. The energy supply component 120 is also configured to change the path of the laser 123 in response to the change of the cutting point of the cutting edge 111, and the zoom surface 112 is configured to make the focus of the laser 123 located at the cutting point of the cutting edge 111 after the path of the laser 123 is switched. That is, no matter how the cutting point of the cutting edge 111 on the workpiece 200 to be processed changes, under the action of the zoom surface 112, it can always ensure that the focus of the laser 123 is located at the current cutting point. This design enables the laser 123 to accurately act on the processing part that needs to be modified during the processing, no matter how the position of the cutting edge 111 changes, thereby improving the processing accuracy and efficiency.

[0124] In some embodiments, the zoom curved surface 112 may be located on a side of the tool 110 away from the cutting edge 111. In other embodiments, the zoom curved surface 112 may also be disposed on any side of the tool 110 adjacent to the cutting edge 111.

[0125] The zoom surface 112 refers to a curved lens structure with a special design that can focus light onto a point, but the position of this point can be changed. By changing the shape and position of the curved surface, the position of the focal point can be changed, thereby achieving the effect of a zoom lens. That is, the zoom surface 112 can focus the transmitted laser 123 so that the focal point of the laser 123 passing through the zoom surface 112 can be located at the cutting point of the cutting edge 111.

[0126] It should be noted that the cutting point will change with the change of the shape of the workpiece being processed. Specifically, since the processed surface of the workpiece is not always in a flat or curved surface, it may be a surface with steps, twists, or unevenness. During the machining process of the tool 110, the contact position between the cutting edge 111 and the workpiece surface will change with the change of the characteristics of the workpiece surface. Therefore, the actual position where the cutting edge 111 plays a cutting role (i.e., the cutting point) is variable.

[0127] In addition, considering that long-term use may cause wear or aging problems of the zoom surface 112, a protective film with wear resistance and good light transmittance can be coated on its surface, which not only does not affect the transmission performance of the laser 123 but also extends the service life. For some application scenarios with high-precision requirements, an adaptive optical system can also be considered to automatically compensate for slight deviations caused by environmental factors (such as temperature and humidity changes) to ensure an ideal laser 123 focusing effect each time.

[0128] In some embodiments, the liquid guiding assembly 140 is configured to be able to spray the reaction liquid 150 towards the machining site, and the position of the liquid guiding assembly 140 relative to the workpiece is configured to change with the change of the cutting point of the tool 110 relative to the workpiece 200 to be machined, so as to ensure that the reaction liquid 150 can always be sprayed on the machining site to modify the material of the machining site. It should be noted that when the liquid guiding assembly 140 can ensure that the reaction liquid 150 is always sprayed on the machining site, the laser 123 does not need to penetrate the tool 110 to irradiate the machining site, so that the cutting device 100 can be applicable to the scenario where the tolerance temperature of the workpiece material is higher than the tolerance temperature of the tool 110. In some embodiments, the cutting device 100 further includes a driving element that can drive the liquid guiding assembly 140 to move so that it can always spray the reaction liquid 150 onto the machining site. In some embodiments, the energy supply assembly 120 emits the laser 123, which can irradiate the workpiece 200 to be machined, and the liquid guiding assembly 140 guides the reaction liquid 150 to the machining site, so that the reaction liquid 150 reacts with the material of the machining site under the energy supply condition of the energy supply assembly 120 to modify the material of the machining site, thereby facilitating the cutting process of the tool 110.

[0129] In some embodiments, the cutting tool 110 is provided with a channel through which the reaction liquid 150 can flow to the machining site. Thus, during the cutting process of the cutting tool 110, the contact position between the reaction liquid 150 and the workpiece 200 to be machined can change with the change of the cutting tool 110 relative to the workpiece 200 to be machined, so as to achieve more precise material modification of the machining site of the workpiece 200 to be machined.

[0130] Please refer to Figure 10 and Figure 11 , in some embodiments, the energy supply component 120 includes a laser generator 121 and a laser regulator 122. The laser generator 121 is responsible for generating the required laser beam, while the laser regulator 122 is used to change the path of the laser 123 to ensure that the laser 123 can irradiate the machining site along a predetermined route. Specifically, the laser regulator 122 is internally provided with a reflection part 1221 and / or a refraction part 1222. Thus, the path of the laser 123 can be changed by reflection and refraction to ensure that the focus of the laser 123 can change with the change of the machining site and the focus of the laser 123 can always irradiate the machining site.

[0131] The laser generator 121 can be arranged on either side of the reflection part 1221. For the convenience of description, hereinafter, the laser generator 121 is arranged on the side of the reflection part 1221 close to the zoom surface 112. The reflection part 1221 in the laser regulator 122 can be composed of a mirror with a high reflectivity and can be moved or rotated along a specific trajectory by a mechanical driving device to effectively control the path of the laser 123. The refraction part 1222 can include a prism or other optical elements with appropriate refractive indices, and they can guide the path change of the laser beam by changing their own angles or positions.

[0132] For example, during the machining process, if the cutting edge 111 moves along a straight path, the reflection part 1221 can keep the path of the laser 123 unchanged by translating in the same direction; if the cutting edge 111 moves in a curve, the refraction part 1222 can rotate around the vertical axis to dynamically adjust the path of the laser 123 to ensure that the laser 123 always accurately irradiates the cutting point. This flexible laser 123 path adjustment mechanism greatly improves the controllability and adaptability during the machining process and is applicable to the machining of workpieces with various complex geometries.

[0133] To further optimize the working performance of the laser regulator 122, a redundant design can be introduced between the reflection part 1221 and the refraction part 1222, that is, both path adjustment methods are available, so that when a certain component fails, it can quickly switch to another mode to continue working and ensure the machining continuity.

[0134] In some embodiments, the laser regulator 122 can also be equipped with dedicated modules. For example, to meet the requirement of large-area uniform irradiation, the laser regulator 122 can be installed with a diffuser plate or a scatterer to make the energy of the laser 123 more evenly distributed in the processing area. For the processing of fine structures, the laser regulator 122 can be configured with small-sized mirrors or refraction prisms to achieve extremely high positioning accuracy. Such a modular design concept not only enhances the functional diversity of the equipment but also provides users with more customized solutions.

[0135] Please refer to Figure 4 and Figure 11 In some embodiments, the cutting edge 111 has a first end 113 and a second end 114 arranged opposite to each other. For the convenience of description, the direction from the first end 113 to the second end 114 is defined as the first direction X. The laser regulator 122 includes a reflection part 1221, and the reflection part 1221 can adjust the laser 123 path by translating along the first direction X. For example, during the actual processing, as the tool 110 moves, the control system will issue instructions according to the change in the position of the cutting edge 111, driving the reflection part 1221 to move correspondingly along the first direction X, so that the laser 123 path changes synchronously, keeping the focus of the laser 123 always located at the cutting point of the cutting edge 111. This design ensures that no matter how the cutting edge 111 moves, the laser 123 can accurately act on the processing part that needs to be modified, improving the processing accuracy and efficiency.

[0136] In some embodiments, the laser regulator 122 includes a refraction part 1222, and the refraction part 1222 can change the laser 123 path by rotating around an axis perpendicular to the first direction X. In this case, the rotation angle of the refraction part 1222 can be dynamically adjusted by the control system according to the position of the cutting edge 111, so that the refracted laser beam can be translated in the first direction X, also achieving the effect of making the focus of the laser 123 follow the movement of the cutting edge 111. Such a design is particularly suitable for processing tasks with complex curves or non-linear paths because the refraction part 1222 can flexibly cope with various different movement trajectories, ensuring that the laser 123 path always remains consistent with the position of the cutting edge 111.

[0137] To further improve the response speed and accuracy of the system, a fast response mechanism such as a piezoelectric ceramic actuator or other high-precision positioning devices can be integrated into the reflection part 1221 or the refraction part 1222. These components can complete position adjustment within milliseconds, significantly reducing the delay time and enhancing the real-time performance of the system. In addition, a closed-loop feedback control system can be introduced, using high-resolution sensors to monitor the actual position of the cutting edge 111 and real-time feedback the data to the main control unit, and calculating the optimal adjustment scheme for the reflection part 1221 or the refraction part 1222 through algorithms, so as to achieve more precise control of the laser 123 path.

[0138] Please refer to Figure 12 and Figure 13 , in some embodiments, the energy supply component 120 includes a laser generator 121 and a galvanometer assembly 124. The laser generator 121 is configured to generate a laser 123, and the galvanometer assembly 124 is configured to change the path of the laser 123. The laser 123 has an outgoing section 1232 and a reflected section 1233. The outgoing section 1232 is located between the laser generator 121 and the galvanometer assembly 124, and the reflected section 1233 passes through the tool 110 and irradiates the machining site. Among them, the galvanometer assembly 124 is configured to be able to change the trajectory of the reflected section 1233 according to the position change of the cutting point of the cutting edge 111, so that the reflected section 1233 can always irradiate the cutting point of the cutting edge 111 (i.e., the machining site), so as to modify the material of the machining site to facilitate cutting, improve the machining efficiency and reduce the machining difficulty of the tool 110 for brittle and hard materials at the same time.

[0139] The galvanometer assembly 124 includes a first mirror 1241 and a second mirror 1242. The first mirror 1241 is configured to rotate around a first axis, and the second mirror 1242 is configured to rotate around a second axis. The first axis intersects the second axis. The outgoing section 1232 is reflected by the first mirror 1241 and then reflected to the second mirror 1242, and is reflected by the second mirror 1242 to form the reflected section 1233. Using the first mirror 1241 and the second mirror 1242 to change the angle and position of the reflected section 1233 entering the tool 110 can reduce the control difficulty of the galvanometer assembly 124.

[0140] Please refer to Figure 13 , during the process of driving the tool 110 to move and perform cutting on the workpiece, the position of the tool 110 relative to the galvanometer assembly 124 changes, which may cause the laser 123 to not accurately and always irradiate the cutting point of the cutting edge 111. At this time, the first mirror 1241 can rotate around the first axis, and the second mirror 1242 can rotate around the second axis, so as to change the incident angle and / or incident position of the reflected section 1233 entering the tool 110, so as to ensure that the laser 123 entering the tool 110 can always irradiate the cutting point of the cutting edge 111.

[0141] For the cutting device, only the first mirror 1241 is used to change the path and position of the reflected section 1233 entering the tool 110, and the material cost is low. The path and position of the reflected section 1233 of the laser 123 entering the tool 110 change, which can ensure that when the relative position between the tool 110 and the galvanometer assembly 124 changes, the laser 123 can always irradiate the cutting point of the cutting edge 111 (the laser 123 passing through this cutting point can irradiate the machined position of the workpiece, so that the material properties of the machined position of the workpiece change, so as to facilitate cutting by the tool 110).

[0142] Please refer to Figure 12 , in some embodiments, the first mirror 1241 is configured to be rotatable about a first axis and also about a second axis. In other words, the incident angle and / or the incident position of the reflected segment 1233 of the laser 123 entering the tool 110 can be adjusted by adjusting the rotation angle of the first mirror 1241 about the first axis and the rotation angle of the second axis, so as to ensure that the laser 123 entering the tool 110 can always irradiate the cutting point of the cutting edge 111.

[0143] Please refer to Figure 14 , in some embodiments, a second aspect of the present invention further provides a cutting method, which is applicable to controlling the cutting device 100 described in any of the foregoing embodiments. The cutting method includes:

[0144] S101: Control the liquid guide assembly 140 to provide the reaction liquid 150 so that the reaction liquid 150 contacts the processing part;

[0145] S102: Control the energy supply assembly 120 to apply an energy field to the processing part so that the reaction liquid 150 reacts with the material of the processing part.

[0146] In the specific operation process, when starting a new processing task, the system activates the liquid guide assembly 140 and evenly sprays an appropriate amount of the reaction liquid 150 onto the processing part according to a preset program. Then, the energy supply assembly 120 (such as a laser source) is started to make the energy generated by it directly act on the processing part. At this time, due to the combined action of the presence of the reaction liquid 150 and the energy field provided by the energy supply assembly 120, the material of the processing part will undergo chemical or physical changes to achieve the purpose of modification.

[0147] In some embodiments, for the convenience of description, taking the energy field provided by the energy supply assembly 120 as the laser 123 as an example for illustration, that is, the energy supply assembly 120 can emit the laser 123, and the laser 123 can act on the processing part. Specifically, before controlling the liquid guide assembly 140 to provide the reaction liquid 150, the energy supply assembly 120 can also supply energy to the processing part first. Thus, when the reaction liquid 150 is guided to the workpiece 200 to be processed, the reaction liquid 150 can reduce the influence range of the heat affected zone, avoid the workpiece 200 to be processed from being burned by the temperature of the energy supply assembly 120, and at the same time can ensure the modification of the material of the processing part.

[0148] Embodiment

[0149] Use a white light interferometer to photograph the workpiece 200 to be processed before processing (the material of the workpiece 200 to be processed is fused silica glass), please refer to Figure 15, which is a surface topography diagram of the workpiece 200 to be machined. Among the surface roughness parameters of the workpiece 200 to be machined, the surface arithmetic mean height Sa is 1.073 μm, the root mean square deviation Sq of the surface roughness is 1.488 μm, and the maximum height Sz of the surface roughness is 24.636 μm.

[0150] After using the cutting method of the present application to control the cutting device 100 (the turning feed rate is 20 μm, the cutting depth is 50 μm, the power of the laser 123 is 10 W, and the wavelength is 1064 nm) to machine the workpiece 200 to be machined, the workpiece is photographed again using a white light interferometer. Among them, the material of the cutting tool 110 is diamond, the rake angle of the cutting tool 110 is -35°, and the clearance angle is 20°. The reaction liquid 150 uses a sodium hydroxide solution. Please refer to Figure 16 , which is a surface topography diagram of the machined workpiece. Among them, the surface arithmetic mean height Sa of the workpiece is 0.575 μm, the root mean square deviation Sq of the surface roughness is 0.740 μm, and the maximum height Sz of the surface roughness is 15.143 μm. Thus, the cutting device 100 of the present application can effectively improve the surface quality of the workpiece.

[0151] Among them Figure 17 and Figure 18 are actual photos of the cutting device 100 cutting fused silica glass, and the photographing device is a high-speed camera.

[0152] For ease of understanding, the following takes the workpiece 200 to be machined with fused silica glass and silicon wafers as examples for illustration. The processing conditions corresponding to workpieces of different material types are shown in Table 1 below;

[0153] Table 1 Processing conditions of the workpiece to be machined

[0154]

[0155] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0156] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, such descriptions of "first", "second", etc. are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or", "or / and", or "and / or" appear throughout the text, their meanings include three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0157] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included within the scope of patent protection of the present invention.

Claims

1. A cutting device, characterized in that, Comprising: A cutting tool for machining a workpiece to be machined, the material of the cutting tool being a light-transmitting material, a liquid flow channel being provided inside the cutting tool, the liquid flow channel being configured to direct a reaction liquid to a machining site, and the cutting tool including an edge for cutting the machining site; An energy supply component configured to emit a laser, the laser passing through the cutting tool and irradiating the machining site at the cutting position of the cutting tool; A liquid guiding component adapted to supply the reaction liquid to the liquid flow channel, the reaction liquid being configured to react with the machining site under the irradiation of the laser to modify the material of the machining site; A plurality of the liquid flow channels are provided inside the cutting tool, the outlets of the liquid flow channels are all located at the edge, the laser penetrates into the cutting tool and forms a light spot at the edge, and during the process that the position of the light spot at the edge changes with the change of the actual cutting position of the edge, at least one outlet of the liquid flow channels is within the coverage range of the light spot at the edge, and the laser can penetrate out from the edge and act on the machining site to modify the material of the machining site.

2. The cutting device according to claim 1, wherein: The cutting device further includes a reaction liquid, the liquid guiding component includes a liquid storage part for storing the reaction liquid; The workpiece to be machined is a glass-like material, and the reaction liquid is an alkaline solution.

3. The cutting device according to claim 2, wherein: The reaction liquid is a sodium hydroxide solution; Or, The reaction liquid is a potassium hydroxide solution; Or, The reaction liquid is a sodium carbonate solution.

4. The cutting device according to claim 1, wherein: The cutting tool includes an edge and a zoom surface, the zoom surface is located on a side of the cutting tool away from the edge, and the energy supply component is further configured to change the path of the laser corresponding to the change of the cutting point of the edge; The zoom surface is configured to make the focus of the laser located at the cutting point of the edge after the path of the laser is switched.

5. The cutting device according to claim 1, wherein: The energy supply component includes a laser generator and a galvanometer assembly, the laser generator is used to generate the laser, the galvanometer assembly is used to change the path of the laser, the laser has an emission section and a reflection section, the emission section is located between the laser generator and the galvanometer assembly, and the reflection section passes through the cutting tool and irradiates the machining site.

6. The cutting device according to claim 5, wherein: The galvanometer assembly includes a first reflector and a second reflector, the first reflector is configured to rotate around a first axis, the second reflector is configured to rotate around a second axis, the first axis intersects the second axis, and the emission section is reflected by the first reflector and then reflected to the second reflector and forms the reflection section by being reflected by the second reflector.

7. A cutting method, characterized in that, Applicable to controlling the cutting device according to any one of claims 1-6, the cutting method includes: Control the liquid guiding component to provide the reaction liquid so that the reaction liquid contacts the processing part; Control the energy supply component to apply an energy field to the processing part so that the reaction liquid reacts with the material of the processing part.

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