Workpiece machining method and related device

Abstract

The invention discloses a workpiece machining method and a related device.The workpiece machining method is achieved through a target machining machine tool, the target machining machine tool comprises a ram and a plurality of displacement detection sensors arranged on the ram, and the workpiece machining method comprises the steps that reference position information of a to-be-machined workpiece in space is obtained, determining target size data set for the to-be-machined workpiece; based on the reference position information and the target size data, a machining mode matched with the to-be-machined workpiece is determined; the to-be-machined workpiece is machined in the machining mode, and real-time size data, detected by the displacement detection sensor, of the to-be-machined workpiece in the machining process are obtained; and the machining mode is corrected based on the real-time size data until the real-time size data is consistent with the target size data, and a machined target workpiece is obtained. In this way, the precision of workpiece machining can be improved.

Description

Technical Field

[0001] The present application relates to the field of machine tool processing technology, and in particular to a workpiece processing method and related devices. Background Art

[0002] During the machining process, the workpiece needs to be measured to ensure machining accuracy. Currently, the main measurement method is offline measurement. When measuring the workpiece using this method, it is easy to cause time loss due to shutdown detection, and secondary positioning errors will inevitably occur when continuing machining after removing the workpiece for measurement, resulting in large errors in the final workpiece after machining.

[0003] In view of this, how to propose a workpiece processing method with higher processing accuracy has become an urgent problem to be solved. Summary of the invention

[0004] The main technical problem solved by the present application is to provide a workpiece processing method and related devices, which can improve the accuracy of workpiece processing.

[0005] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a workpiece processing method, the workpiece processing method is implemented by using a target processing machine tool, the target processing machine tool includes a slide and a plurality of displacement detection sensors arranged on the slide, the workpiece processing method includes: obtaining reference position information of the workpiece to be processed in space, and determining target size data set for the workpiece to be processed; based on the reference position information and the target size data, determining a processing method matching the workpiece to be processed; processing the workpiece to be processed by using the processing method, and obtaining real-time size data of the workpiece to be processed detected by the displacement detection sensor during the processing; correcting the processing method based on the real-time size data until the real-time size data is consistent with the target size data, and obtaining the processed target workpiece.

[0006] To solve the above technical problems, another technical solution adopted in the present application is: to provide an electronic device, comprising a memory and a processor coupled to each other, wherein the memory stores program instructions, and the processor is used to execute the program instructions to implement the workpiece processing method mentioned in the above technical solution.

[0007] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a computer-readable storage medium, comprising: storing program instructions that can be executed by a processor, wherein the program instructions are used to implement the workpiece processing method mentioned in the above technical solution.

[0008] To solve the above technical problems, another technical solution adopted in the present application is: to provide a target processing machine tool, comprising: a slide and a plurality of displacement detection sensors arranged on the slide, and the electronic device mentioned in the above technical solution, wherein the electronic device is coupled to the displacement detection sensor.

[0009] The beneficial effect of the present application is that, different from the prior art, the workpiece processing method proposed in the present application obtains the reference position information of the workpiece to be processed and determines the target size data set for the workpiece to be processed, so as to determine the processing method matching the workpiece to be processed according to the reference position information and the target size data. In the process of processing the workpiece to be processed using the above processing method, the real-time size data of the workpiece to be processed detected by the displacement detection sensor is obtained in real time, and the processing method matching the workpiece to be processed is corrected in real time according to the real-time size data, so as to improve the processing accuracy of the workpiece to be processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them: Figure 1 It is a schematic flow chart of an implementation method of a workpiece processing method of the present application; Figure 2 yes Figure 1 Step S101 corresponds to a flow chart of another implementation method; Figure 3 yes Figure 2 Step S201 corresponds to a flow chart of another implementation method; Figure 4 yes Figure 2 Step S203 corresponds to a flow chart of another implementation method; Figure 5 yes Figure 1 Step S103 corresponds to a flow chart of another implementation method; Figure 6 It is a structural schematic diagram of an embodiment of the electronic device of the present application; Figure 7 It is a structural schematic diagram of an implementation method of a computer-readable storage medium of the present application. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments, and different embodiments can be adaptively combined. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0012] See also Figure 1 , Figure 1 The workpiece processing method is implemented by using a target processing machine tool, the target processing machine tool includes a ram and a plurality of displacement detection sensors arranged on the ram, and the workpiece processing method includes: S101: Acquire reference position information of a workpiece to be processed in space, and determine target size data set for the workpiece to be processed.

[0013] In one embodiment, in order to achieve accurate processing of a workpiece to be processed, reference position information of the workpiece to be processed in space is obtained, and target size data corresponding to the workpiece to be processed is set.

[0014] Specifically, a machine tool coordinate system corresponding to the target processing machine tool is constructed, and the position of the workpiece to be processed is detected by using the sensor on the target processing machine tool to obtain the reference position information of the workpiece to be processed in the machine tool coordinate system. The target size data of the target workpiece obtained after the workpiece to be processed is determined, that is, the target size data is pre-set according to the size at each position on the target workpiece.

[0015] S102: Determine a processing method that matches the workpiece to be processed based on the reference position information and the target size data.

[0016] In one embodiment, a processing method matching the workpiece to be processed is generated according to reference position information corresponding to the workpiece to be processed and predetermined target size data, so that the workpiece to be processed is processed by the processing method to obtain a corresponding target workpiece.

[0017] In one implementation scenario, based on the reference position information and the target size data, the machining stroke of the workpiece to be machined at each position is obtained, the tool data of the target machining machine tool is obtained, and based on the machining stroke and the tool data, a machining method matching the workpiece to be machined is generated.

[0018] Specifically, according to the reference position information of the workpiece to be processed and the target size data corresponding to the target workpiece, the processing stroke at each position on the workpiece to be processed is determined, so that after the corresponding processing stroke is processed at each position on the workpiece to be processed, the target workpiece is obtained. Furthermore, in order to improve the processing accuracy, the tool data corresponding to the processing tool of the target processing machine tool is obtained, and the processing method matching the workpiece to be processed is generated according to the processing stroke and the tool data. Among them, the above-mentioned tool data includes tool length and tool radius, etc., and the processing method is used to control the movement of the processing tool to cut and grind the workpiece to be processed.

[0019] In another embodiment, the machining stroke of the workpiece to be machined at each position is obtained based on the reference position information and the target size data. To further improve the machining accuracy, the tool data and machining compensation data of the target machining machine are obtained, and based on the machining stroke, tool data and machining compensation data, a machining method matching the workpiece to be machined is generated.

[0020] Specifically, the above-mentioned machining compensation data is obtained by controlling the machining tool of the target machining machine tool to perform trial cutting on the workpiece to be machined or other reference workpieces, and the specific process will not be elaborated in detail here.

[0021] S103: Processing the workpiece to be processed using a processing method, and obtaining real-time size data of the workpiece to be processed detected by a displacement detection sensor during the processing.

[0022] In one embodiment, the processing method determined in step S102 is executed to process the workpiece to be processed, and during the processing, the slide of the target processing machine tool is controlled to drive the displacement detection sensor to move to the corresponding position, so that the displacement detection sensor can be used to detect the real-time size data of the workpiece to be processed in real time.

[0023] S104: Correct the processing method based on the real-time dimension data until the real-time dimension data is consistent with the target dimension data, thereby obtaining a processed target workpiece.

[0024] In one embodiment, the processing method is corrected according to the acquired real-time size data until the real-time size data of the workpiece to be processed is consistent with the target size data, the processing of the workpiece to be processed is stopped, and the processed target workpiece is obtained.

[0025] The workpiece processing method proposed in the present application obtains reference position information of the workpiece to be processed and determines target size data set for the workpiece to be processed, so as to determine a processing method matching the workpiece to be processed according to the reference position information and the target size data. In the process of processing the workpiece to be processed using the above processing method, the real-time size data of the workpiece to be processed detected by the displacement detection sensor is obtained in real time, and the processing method matching the workpiece to be processed is corrected in real time according to the real-time size data, so as to improve the processing accuracy of the workpiece to be processed.

[0026] See also Figure 2 , Figure 2 yes Figure 1 Step S101 in the figure corresponds to a flow chart of another embodiment. Specifically, the process of obtaining the reference position information of the workpiece to be processed in space in step S101 includes: S201: Acquire initial position information of a workpiece to be processed in space; wherein the initial position information includes positions of multiple reference points on the workpiece to be processed.

[0027] In one embodiment, after the workpiece to be processed is placed on a target processing machine tool, position detection is performed on the workpiece to be processed to obtain initial position information of the workpiece to be processed in a machine tool coordinate system.

[0028] Specifically, at least one target sensor is provided on the target processing machine tool, and the target sensor is used to collect data from multiple reference points on the workpiece to be processed to determine the position of each reference point in the machine tool coordinate system. Thus, the position of each reference point is used as the initial position information corresponding to the workpiece to be processed.

[0029] In one implementation scenario, the target sensor is a displacement detection sensor disposed on the slide, and the position of each reference point is detected by the displacement detection sensor by controlling the movement of the slide; alternatively, the target sensor may be other types of detection sensors, such as a radar sensor.

[0030] S202: Based on the initial position information, a reference distance between each reference point on the workpiece to be processed and a correction position is obtained; wherein the correction position is determined based on a spindle position of a target processing machine tool.

[0031] In one embodiment, a predetermined correction position is obtained. In response to the initial position information including the positions of multiple reference points on the workpiece to be processed, a reference distance between each reference point and the correction position is determined according to the positions of the multiple reference points on the workpiece to be processed. The correction position is determined according to the position of the spindle of the target processing machine tool.

[0032] In one implementation scenario, the workpiece to be processed is set on the carrier table of the target processing machine tool. The carrier table is matched with a corresponding rotation axis, which is perpendicular to the carrying surface of the carrier table and parallel to the main axis of the target processing machine tool. The above-mentioned correction position is the position of the rotation axis of the carrier table.

[0033] S203: Performing position correction on the workpiece to be processed based on the reference distance, and acquiring reference position information of the workpiece to be processed after the position correction.

[0034] In one embodiment, a target deviation between the workpiece to be processed and the correction position is determined based on the reference distance. The position of the workpiece to be processed on the target processing machine is corrected based on the target deviation. In response to completing the correction of the workpiece to be processed, data is collected on the workpiece to be processed using a target sensor to obtain reference position information of the workpiece to be processed after the position correction.

[0035] The above scheme performs position correction on the workpiece to be processed according to the predetermined correction position and the positions of various reference points on the workpiece to be processed, so that the target processing machine tool can process the workpiece to be processed after the position correction, thereby improving the processing accuracy.

[0036] See also Figure 3 , Figure 3 yes Figure 2 Step S201 in the figure corresponds to a flow chart of another embodiment. Specifically, the target processing machine tool also includes a reflective displacement sensor, and the implementation process of step S201 includes: S301: Acquire the current angle of the workpiece to be processed relative to the reflective displacement sensor, and determine the positions of multiple reference points corresponding to the current angle.

[0037] In one embodiment, the target sensor provided on the target processing machine tool is a reflection displacement sensor, and the reflection displacement sensor is fixedly provided on the target processing machine tool. After the workpiece to be processed is provided on the carrier of the target processing machine tool, the current angle of the workpiece to be processed relative to the reflection displacement sensor at the current moment is determined. The workpiece to be processed is used to collect data from multiple reference points on the workpiece to be processed at the current angle to determine the positions of the multiple reference points corresponding to the current angle.

[0038] Specifically, the distance between each reference point corresponding to the current angle on the workpiece to be processed and the reflective displacement sensor is determined by emitting a laser beam using the reflective displacement sensor and receiving the reflected light, and the position of the corresponding reference point is determined based on the distance.

[0039] S302: Rotate the workpiece to be processed along the rotation axis by a preset angle, adjust the current angle, and obtain positions of multiple reference points corresponding to the adjusted current angle; wherein the rotation axis is parallel to the main axis of the target processing machine tool.

[0040] In one embodiment, the carrier of the target processing machine tool is matched with a corresponding rotation axis, which is perpendicular to the carrier surface of the carrier and parallel to the main axis of the target processing machine tool. The angle of the workpiece to be processed on the carrier is changed by controlling the carrier to rotate around the rotation axis at a preset angle. The specific value of the preset angle can be set according to actual conditions.

[0041] Specifically, the support platform is rotated along the rotation axis by a preset angle to adjust the current angle corresponding to the workpiece to be processed, and the positions of multiple reference points corresponding to the adjusted current angle are acquired using a reflective displacement sensor.

[0042] S303: Return to the step of rotating the workpiece to be processed by a preset angle along the rotation axis, adjusting the current angle, and obtaining the positions of multiple reference points corresponding to the adjusted current angle, until the positions of all reference points corresponding to the workpiece to be processed are obtained, and the positions of all reference points are used as initial position information.

[0043] In one embodiment, return to the above-mentioned step S302, continue to control the support platform to rotate along the rotation axis by a preset angle to adjust the current angle corresponding to the workpiece to be processed, and use the reflective displacement sensor to obtain the positions of multiple reference points corresponding to the adjusted current angle until the repeated reference point position is obtained.

[0044] Furthermore, the positions of all the detected reference points are used as initial position information.

[0045] The above scheme arranges the workpiece to be processed on the carrier of the target processing machine tool, and controls the rotation of the carrier to obtain the position of the corresponding reference point by changing the current angle corresponding to the workpiece to be processed.

[0046] See also Figure 4 , Figure 4 yes Figure 2 Step S203 in the flowchart corresponds to another implementation. Specifically, the implementation process of step S203 includes: S401: Based on all reference distances, the center axis of the current workpiece to be processed is obtained.

[0047] In one embodiment, the central axis of the workpiece to be processed is determined based on the acquired reference distances between each reference point and the correction position.

[0048] Specifically, the first height and the second height of the workpiece to be processed relative to the surface of the carrier are determined. For the first height, according to the positions of the multiple reference points corresponding to the workpiece to be processed at the first height, multiple reference points at the first height are fitted to obtain the corresponding first circumscribed circle, and the first center of the first circumscribed circle is determined. And, for the second height, according to the positions of the multiple reference points corresponding to the workpiece to be processed at the second height, multiple reference points at the second height are fitted to obtain the corresponding second circumscribed circle, and the second center of the second circumscribed circle is determined. The straight line where the first center and the second center are located is used as the central axis of the current workpiece to be processed.

[0049] In another embodiment, the implementation process of the above step S401 may also include: determining multiple reference heights of the workpiece to be processed relative to the surface of the support platform. For each reference height, multiple reference points at the reference height are fitted according to the positions of multiple reference points corresponding to the workpiece to be processed at the reference height to obtain a corresponding reference circumscribed circle, and the reference center of the reference circumscribed circle is determined. Linear fitting is performed on the reference centers corresponding to all reference heights to obtain the central axis of the current workpiece to be processed perpendicular to the surface of the support platform. Among them, the number and specific values ​​of the reference heights can be set according to the actual height of the workpiece to be processed.

[0050] S402: Based on the central axis and the rotation axis, a target position deviation corresponding to the workpiece to be processed is obtained.

[0051] In one embodiment, a target position deviation corresponding to the workpiece to be processed is obtained according to the position of the central axis and the position of the rotation axis corresponding to the workpiece to be processed.

[0052] Specifically, the position difference between the central axis position and the rotation axis position is obtained, and the position difference is used as the target position deviation corresponding to the workpiece to be processed.

[0053] S403: Based on the target position deviation, the position of the workpiece to be processed is adjusted to obtain reference position information of the workpiece to be processed after adjustment.

[0054] In one embodiment, the position of the workpiece to be processed on the carrier is adjusted using the determined target position deviation, so that the center axis corresponding to the adjusted workpiece to be processed is consistent with the position of the rotation axis.

[0055] Furthermore, the target sensor is used to collect data on the workpiece to be processed after the position adjustment, so as to obtain the reference position information of the workpiece to be processed. The specific method of obtaining the reference position information can refer to the corresponding implementation method above, and will not be elaborated in detail here.

[0056] In another embodiment, the position of the workpiece to be processed on the carrier is adjusted using the determined target position deviation, so that the position difference between the center axis and the rotation axis corresponding to the workpiece to be processed after adjustment is less than a preset distance threshold. The preset distance threshold is obtained by estimation, or can also be obtained by reverse deduction by relevant technicians after multiple experiments.

[0057] The above scheme obtains the target position deviation and uses the target position deviation to adjust the position of the workpiece to be processed on the support table, so that the adjusted workpiece to be processed is located in a relatively central position of the support table, which is convenient for subsequent processing and reduces the difficulty of the spindle tool in processing the workpiece to be processed.

[0058] See also Figure 5 , Figure 5 yes Figure 1 Step S103 in the flowchart corresponds to another embodiment. Specifically, the implementation process of step S103 includes: S501: Drive the target processing machine tool to execute the processing mode.

[0059] In one embodiment, the target processing machine tool is driven to execute a processing mode to process the workpiece to be processed.

[0060] S502: Detect first detection data of the workpiece to be processed in the first direction using a first displacement detection sensor, and detect second detection data of the workpiece to be processed in the second direction using a second displacement detection sensor; wherein the first direction is perpendicular to the second direction, the plane where the first direction is located is parallel to the horizontal plane, and the plane where the second direction is located is perpendicular to the horizontal plane.

[0061] In one embodiment, a first displacement detection sensor and a second displacement detection sensor are provided on a ram of a target processing machine tool, and the ram is used to drive the first displacement detection sensor and the second displacement detection sensor to move. The ram is controlled to move to a corresponding position, so as to obtain first detection data of a workpiece to be processed in a first direction by using the first displacement detection sensor, and to obtain second detection data of the workpiece to be processed in a second direction by using the second displacement detection sensor.

[0062] In one implementation scenario, the target processing machine tool is matched with corresponding X-axis and Z-axis, the X-axis is parallel to the horizontal plane, and the Z-axis is perpendicular to the horizontal plane. The positive direction of the X-axis is taken as the first direction, and the positive direction of the Z-axis is taken as the second direction. The first displacement detection sensor and the second displacement detection sensor are driven to move by controlling the slide to detect the first detection data of the workpiece to be processed in the first direction, and the second detection data of the workpiece to be processed in the second direction.

[0063] In a specific application scenario, the first displacement detection sensor and the second displacement detection sensor are laser displacement detection sensors.

[0064] S503: Based on the first detection data and the second detection data, determine the real-time size data of each target point on the workpiece to be processed.

[0065] In one embodiment, the coordinate information of each target point on the workpiece to be processed in the machine tool coordinate system is determined by combining the first detection data and the second detection data obtained. The real-time size data of each target point is determined according to the coordinate information of each target point.

[0066] Specifically, according to the coordinate information of each target point, the real-time distance between each target point and the central axis of the workpiece to be processed is determined, and the real-time distance corresponding to each target point is used as the real-time dimension data.

[0067] The above scheme uses the first displacement detection sensor and the second displacement detection sensor to obtain the real-time dimensional data corresponding to each target point during the processing, so as to realize real-time monitoring of the workpiece to be processed during the processing, so as to help adjust the processing process according to the real-time dimensional data later, thereby improving the processing accuracy.

[0068] In another embodiment, after determining the real-time size data of the workpiece to be processed during the processing through the above corresponding embodiments, the specific implementation process of step S104 also includes: determining the target position information corresponding to each target point based on the target size data.

[0069] Specifically, according to the target size data, the target distance between each target point on the target workpiece after processing and the central axis of the target workpiece is determined, and the target distance is used as the target position information of the corresponding target point.

[0070] Furthermore, in response to the real-time dimension data of all target points being consistent with the corresponding target position information, a processed target workpiece is obtained.

[0071] Specifically, for each target point corresponding to the workpiece to be processed, the comparison relationship between the corresponding target distance and the corresponding real-time distance is obtained. In response to the target distance being consistent with the corresponding real-time distance, the processing method is corrected so that the subsequent processing process no longer processes the target point. Alternatively, in response to the target distance being less than the corresponding real-time distance, the target processing machine tool is driven to execute the processing method to process the corresponding target point. Alternatively, in response to the target processing machine tool executing the processing method to complete the processing at the corresponding target point, and the target distance is still less than the corresponding real-time distance, the processing method is corrected to drive the target processing machine tool to continue processing the corresponding target point until the corresponding target distance is consistent with the real-time distance. By correcting the processing method according to the target size data and the real-time size data, the flexibility of the target processing machine tool in processing the workpiece to be processed is improved.

[0072] See also Figure 6 , Figure 6 1 is a schematic diagram of the structure of an embodiment of an electronic device of the present application. The electronic device comprises: a memory 10 and a processor 20 coupled to each other. The memory 10 stores program instructions, and the processor 20 is used to execute the program instructions to implement the method mentioned in any of the above embodiments. Specifically, the electronic device includes but is not limited to: a desktop computer, a laptop computer, a tablet computer, a server, etc., which are not limited here. In addition, the processor 20 can also be called a CPU (Center Processing Unit). The processor 20 may be an integrated circuit chip with signal processing capabilities. The processor 20 may also be a general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field-programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. In addition, the processor 20 may be implemented by an integrated circuit chip.

[0073] See also Figure 7 , Figure 7 It is a structural diagram of an embodiment of a computer-readable storage medium of the present application. The computer-readable storage medium 30 stores program instructions 40 that can be executed by a processor. When the program instructions 40 are executed by the processor, the method mentioned in any of the above embodiments is implemented.

[0074] In the several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0075] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0076] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0077] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor to execute all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program code.

[0078] In another embodiment, the present application further proposes a target processing machine tool, which includes a slide and a plurality of displacement detection sensors arranged on the slide, and Figure 6 The electronic device shown is coupled to the slide and the displacement detection sensor.

[0079] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A workpiece processing method, characterized in that: The workpiece processing method is implemented by using a target processing machine tool, the target processing machine tool includes a ram and a plurality of displacement detection sensors arranged on the ram, and the workpiece processing method includes: Obtaining reference position information of the workpiece to be processed in space, and determining target size data set for the workpiece to be processed; Determining a processing method matching the workpiece to be processed based on the reference position information and the target size data; Processing the workpiece to be processed by using the processing method, and obtaining real-time size data of the workpiece to be processed detected by the displacement detection sensor during the processing; The processing method is corrected based on the real-time size data until the real-time size data is consistent with the target size data, thereby obtaining a processed target workpiece.

2. The workpiece processing method according to claim 1, characterized in that: The obtaining of reference position information of the workpiece to be processed in space includes: Acquiring initial position information of the workpiece to be processed in space; wherein the initial position information includes positions of multiple reference points on the workpiece to be processed; Based on the initial position information, a reference distance between each reference point on the workpiece to be processed and a correction position is obtained; wherein the correction position is determined based on the spindle position of the target processing machine tool; The position of the workpiece to be processed is corrected based on the reference distance, and the reference position information of the workpiece to be processed after the position correction is obtained.

3. The workpiece processing method according to claim 2, characterized in that: The target processing machine tool includes a reflective displacement sensor, and the obtaining of initial position information of the workpiece to be processed in space includes: Acquire a current angle of the workpiece to be processed relative to the reflective displacement sensor, and determine positions of a plurality of reference points corresponding to the current angle; Rotate the workpiece to be processed by a preset angle along the rotation axis, adjust the current angle, and obtain the positions of the multiple reference points corresponding to the adjusted current angle; wherein the rotation axis is parallel to the main axis of the target processing machine tool; Return to the step of rotating the workpiece to be processed by a preset angle along the rotation axis, adjusting the current angle, and obtaining the positions of multiple reference points corresponding to the adjusted current angle, until the positions of all the reference points corresponding to the workpiece to be processed are obtained, and the positions of all the reference points are used as the initial position information.

4. The workpiece processing method according to claim 3, characterized in that: The step of performing position correction on the workpiece to be processed based on the reference distance and acquiring the reference position information of the workpiece to be processed after the position correction comprises: Based on all the reference distances, obtaining the center axis of the current workpiece to be processed; Based on the central axis and the rotation axis, obtaining a target position deviation corresponding to the workpiece to be processed; Based on the target position deviation, the position of the workpiece to be processed is adjusted to obtain the reference position information of the adjusted workpiece to be processed.

5. The workpiece processing method according to claim 1, characterized in that: The ram of the target processing machine tool is provided with a first displacement detection sensor and a second displacement detection sensor. The processing method is used to process the workpiece to be processed, and real-time size data of the workpiece to be processed detected by the displacement detection sensor during the processing is obtained, including: driving the target processing machine tool to execute the processing method; Using the first displacement detection sensor to detect first detection data of the workpiece to be processed in a first direction, and using the second displacement detection sensor to detect second detection data of the workpiece to be processed in a second direction; wherein the first direction is perpendicular to the second direction, the plane where the first direction is located is parallel to a horizontal plane, and the plane where the second direction is located is perpendicular to the horizontal plane; Based on the first detection data and the second detection data, the real-time dimension data of each target point on the workpiece to be processed is determined.

6. The workpiece processing method according to claim 5, characterized in that: The processing method is corrected based on the real-time size data until the real-time size data is consistent with the target size data to obtain the processed target workpiece, including: Based on the target size data, determine the target position information corresponding to each of the target points; In response to the real-time dimension data of all the target points being consistent with the corresponding target position information, the processed target workpiece is obtained.

7. The workpiece processing method according to claim 1, characterized in that: The step of determining a processing method matching the workpiece to be processed based on the reference position information and the target size data includes: Based on the reference position information and the target size data, obtaining a processing stroke of the workpiece to be processed at each position; The tool data and machining compensation data of the target machining machine tool are acquired, and the machining method matching the workpiece to be machined is generated based on the machining stroke, the tool data and the machining compensation data.

8. An electronic device, characterized in that: It comprises a memory and a processor coupled to each other, wherein the memory stores program instructions, and the processor is used to execute the program instructions to implement the workpiece processing method according to any one of claims 1 to 7.

9. A computer-readable storage medium, characterized in that: include: Program instructions that can be executed by a processor are stored, and the program instructions are used to implement the workpiece processing method according to any one of claims 1 to 7.

10. A target processing machine tool, characterized in that: include: A ram and a plurality of displacement detection sensors disposed on the ram, and the electronic device as claimed in claim 8, wherein the electronic device is coupled to the displacement detection sensors.

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