Silicon wafer polishing composition and preparation process thereof
By using specially treated silica watersols, organic alkalis and anionic water-soluble polymers in the silicon wafer in the silicon wafer, the problem of particles residues and corrosion of the medium-spreading liquid on the surface of the silicon wafer is solved, and more efficient silicon wafer surface polishing and quality improvement are achieved.
Patent Information
- Application Number
- CN202411848148.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-03-21
AI Technical Summary
In the process of casting liquid in existing silicon wafers, it is difficult to effectively reduce the residue of particles on the surface of the silicon wafer during casting, and it is easy to cause corrosion to the surface of the silicon wafer, affecting the surface quality of the fine casting.
Using a silicon wafer polishing composition, including specially treated silica watersol, organic base, anionic water-soluble polymer and water, by adjusting the pH value and adding a specific surfactant, the Si-OH group on the surface of the silicon oxide particles is reduced, and the chemical bond formation with the surface of the silicon wafer is reduced, thereby reducing particle residue.
The particle residues of 26nm and above of the silicon wafer surface after polishing are significantly reduced, the wafer surface quality is improved, and the pressure on fine casting is reduced.