Process door moving device and semiconductor process equipment

Abstract

The invention discloses a process door moving device and semiconductor process equipment, and relates to the technical field of semiconductor preparation, the disclosed process door moving device comprises a box body and a moving mechanism, the moving mechanism comprises a supporting part and a moving part, the supporting part is arranged in the box body, the moving part is in sliding connection with the supporting part, a notch is formed in the side wall of the box body, and the notch is arranged in the box body. The moving part can move in the length extending direction of the notch so as to drive a to-be-conveyed component outside the box body to execute corresponding actions. Through the arrangement of the box body, pollutants such as friction scraps and lubricating grease volatile particles generated in the operation process of the moving mechanism can be restrained in the box body to a certain extent, so that the probability that the pollutants are diffused to the outside of the box body and pollute the area where the wafer is located is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a process gate moving device and semiconductor process equipment. Background Art

[0002] As a semiconductor device that can process a large number of wafers in batches, the vertical furnace tube equipment plays an important role in the wafer manufacturing process. The wafers will undergo process reactions in the furnace body of the vertical furnace tube equipment.

[0003] In the related art, a space for loading and unloading wafers is provided in the vertical furnace tube equipment. At the same time, a driving device for controlling the opening or closing of the furnace door is also provided in the space, and the carrying boat can be placed on the furnace door. In order to avoid contamination of the wafers, the space needs to maintain a high cleanliness level. However, the friction debris, grease volatilization particles and other pollutants generated by the above-mentioned driving device during operation will spread into the space, posing a risk of contaminating the wafers. Summary of the invention

[0004] The present application discloses a process gate moving device and a semiconductor process equipment to solve the problem in the related art that pollutants generated by a driving device during operation may contaminate a wafer.

[0005] In order to solve the above technical problems, this application is implemented as follows: In a first aspect, an embodiment of the present application discloses a process door moving device, which is applied to semiconductor process equipment, and the process door moving device includes a box body and a moving mechanism; A notch is provided on the side wall of the box body. The moving mechanism comprises a supporting part and a moving part. The supporting part is provided in the box body. The moving part is slidably connected with the supporting part and can move along the length extension direction of the notch.

[0006] In a second aspect, an embodiment of the present application discloses a semiconductor process equipment, wherein the disclosed semiconductor process equipment includes a housing, a process chamber, a process door, and the above-mentioned process door moving device; The casing is provided with a first installation space and a second installation space which are adjacently arranged, the process chamber is arranged in the first installation space, and the outer wall of the process chamber and the inner wall of the casing form the exhaust passage; The process door moving device is arranged in the second installation space, and one end of the moving part is connected to the process door to drive the process door to switch between the first position and the second position; When the process door is in the first position, the process door covers the opening of the process chamber, and when the process door is in the second position, the process door is separated from the process chamber.

[0007] The technical solution adopted in this application can achieve the following technical effects: The process door moving device disclosed in the embodiment of the present application improves the related art. The disclosed process door moving device includes a box and a moving mechanism. The moving mechanism includes a support part and a moving part. The support part is arranged in the box, and the moving part is slidably connected with the support part. The side wall of the box is provided with a notch. The moving part can move along the length extension direction of the notch to drive the parts to be transferred outside the box to perform corresponding actions. By setting up the box, the friction debris, grease volatile particles and other pollutants generated by the moving mechanism during operation can be constrained in the box to a certain extent, thereby reducing the probability of the pollutants spreading to the outside of the box and causing pollution to the area where the wafer is located. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the present application; Figure 2 for Figure 1 The view along direction A in the figure; Figure 3 for Figure 1 The cross-sectional view along the BB direction; Figure 4 A schematic diagram of the airflow direction inside the box disclosed in the embodiment of the present application; Figure 5 This is one of the front structural schematic diagrams of the process door moving device disclosed in the embodiment of the present application; Figure 6 for Figure 5 Cross-sectional view along CC direction; Figure 7 for Figure 6 The enlarged view of point a in the middle; Figure 8 for Figure 5 The cross-section along the DD direction; Fig. 9 for Figure 8 The enlarged image of point b in the middle; Fig.10 It is a schematic diagram of the side structure of the process door moving device disclosed in the embodiment of the present application; Fig.11 for Fig.10 The enlarged image at c in the middle; Fig.12 A partial cross-sectional view of a process door moving device disclosed in an embodiment of the present application; Fig.13 for Fig.12 The cross-section along the EE direction; Fig.14 It is a schematic diagram of the assembly structure of the moving part and the shielding part disclosed in the embodiment of the present application; Fig.15 for Fig.14 The cross-sectional view along the FF direction; Fig.16 This is a schematic diagram of the assembly structure of the guide assembly and the bearing assembly disclosed in the embodiment of the present application; Fig.17 for Fig.16 The cross-section along the GG direction; Fig.18 for Fig.16 Cross-sectional view along the HH direction; Fig.19 This is the second front structural schematic diagram of the process door moving device disclosed in the embodiment of the present application; Fig. 20 for Fig.19 The cross-sectional view along direction II; Fig.21 This is the third front structural schematic diagram of the process door moving device disclosed in the embodiment of the present application; Fig. 22 for Fig.21 The cross-section along the JJ direction; Fig.23 for Fig.21 The enlarged image at point d in the middle; Fig.24 for Fig.21 The enlarged view at e in the middle; Fig.25 for Fig.21 The enlarged image at point f in the middle; Fig.26 This is the fourth front structural schematic diagram of the process door moving device disclosed in the embodiment of the present application; Fig. 27 This is the fifth front structural schematic diagram of the process door moving device disclosed in the embodiment of the present application; Fig.28 for Fig. 27 Cross-sectional view along the KK direction.

[0009] Description of reference numerals: 100-process door moving device, 110-box, 111-gap, 112-air inlet, 113-air outlet, 120-support part, 130-moving part, 131-bearing component, 1311-transmission member, 1312-mounting plate, 1313-connecting member, 132-guide component, 1321-first supporting pulley, 1321a-pulley body, 1321b-pulley bracket, 1321c-support rod, 1321d-elastic member, 1322-second supporting pulley, 1323-first steering pulley, 1324-second steering pulley, 140-fan, 150-shielding part, 160-driving part, 161-motor, 162-screw, 163-nut, 164-nut connecting block, 165-screw bearing seat; 200 - semiconductor process equipment, 210 - housing, 211 - first installation space, 212 - second installation space, 213 - exhaust channel, 220 - process chamber, 230 - process door, 240 - carrying boat, 250 - air cooling mechanism, 260 - pipeline assembly. DETAILED DESCRIPTION

[0010] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0011] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0012] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0013] In the semiconductor preparation process, especially in the semiconductor heat treatment process, vertical furnace tube equipment is widely used due to its small footprint and high processing efficiency. Vertical furnace tube equipment is usually provided with a process chamber installation area and a wafer loading and unloading area. The wafer loading and unloading area is located below the process chamber installation area. The carrying boat loads and unloads wafers in the wafer loading and unloading area, and then the process door moving device in the wafer loading and unloading area drives the process door and the carrying boat to move up and down to transfer the wafer to be reacted into the process chamber or transfer the reacted wafer to the wafer loading and unloading area for cooling.

[0014] To avoid contamination of the wafers, the wafer loading and unloading area needs to maintain a high cleanliness level. However, the friction debris, grease volatilization particles and other pollutants generated by the process door moving device during operation will spread to the wafer loading and unloading area, posing a risk of contaminating the wafers.

[0015] Based on the above, please refer to Figures 1 to 28 As shown, the embodiment of the present application discloses a process door moving device 100, which is applied to a semiconductor process equipment 200. The disclosed process door moving device 100 may include a box 110 and a moving mechanism. The box 110 is the installation base of the moving mechanism, and at least part of the moving mechanism may be arranged in the box 110.

[0016] The moving mechanism may include a support portion 120 and a moving portion 130. The support portion 120 is disposed in the box body 110. The support portion 120 is mainly used to provide a reliable installation foundation for the moving portion 130. The support portion 120 may be connected to the inner wall of the box body 110 by welding, bolting, etc. The moving portion 130 is slidably connected to the support portion 120. A slide rail, a pulley, etc. may be disposed between the moving portion 130 and the support portion 120 to reduce the sliding friction between the moving portion 130 and the support portion 120. At the same time, the extension direction of the support portion 120 is consistent with the moving direction of the moving portion 130, which may also improve the stability of the operation of the moving portion 130.

[0017] One end of the moving part 130 needs to be connected to the part to be transferred, such as the process door 230, the carrying boat 240 and other parts. In order to smoothly assemble the moving part 130 and the part to be transferred, a notch 111 can be provided on the side wall of the box 110, and the length extension direction of the notch 111 is consistent with the moving direction of the moving part 130, so that the moving part 130 can move along the length extension direction of the notch 111, thereby driving the part to be transferred outside the box 110 to move. The assembly methods between the moving part 130 and the part to be transferred can include the following two methods: first, one end of the moving part 130 extends out of the box 110 through the notch 111 and then connects to the part to be transferred; second, the part to be transferred extends into the box 110 through the notch 111 and then connects to the moving part 130.

[0018] It should be noted that the length extension direction of the notch 111 can be horizontal or vertical, and correspondingly, the moving direction of the moving part 130 can be horizontal or vertical, which can be selected according to the actual process type. For example, if a vertical furnace tube device is used in the process, the length extension direction of the notch 111 and the moving direction of the moving part 130 can be vertical; if a horizontal furnace is used in the process, the length extension direction of the notch 111 and the moving direction of the moving part 130 can be horizontal.

[0019] In a specific usage scenario, taking the vertical furnace tube equipment as an example, the process door moving device 100 needs to be installed in the wafer loading and unloading area. The cleanliness requirement of the wafer loading and unloading area is relatively high. During the relative sliding of the support part 120 and the moving part 130, friction debris will inevitably be generated, and the high temperature inside the process chamber 220 will also cause the grease in the moving mechanism to be heated and produce volatile organic compounds. If the above-mentioned pollutants diffuse into the wafer loading and unloading area, it will cause contamination to the wafer. In this application, by arranging the support part 120 and the moving part 130 in a box, the friction debris, grease volatile particles and other pollutants generated by the support part 120 and the moving part 130 during operation can be confined in the box to a certain extent, thereby reducing the probability of pollutants diffusing to the outside of the box and causing contamination to the area where the wafer is located.

[0020] According to the above, when there are many pollutants accumulated inside the box 110, the pollutants will inevitably escape from the notch 111 of the box 110 to the outside of the box 110. Based on this, Figure 4 and Figure 5 As shown, the process door moving device 100 may further include a shielding portion 150, which is disposed in the box body 110. The shielding portion 150 may be assembled with the inner wall of the box body 110 by bolt connection, clamping, etc. The shielding portion 150 is a thin strip structure, which may be a steel strip, or may be made of other high temperature resistant and curlable materials. At least part of the shielding portion 150 covers the notch 111, so that the notch 111 can be covered and sealed to reduce the probability of pollutants escaping from the notch 111 to the outside of the box body 110.

[0021] The notch 111 of the box body 110 described above is used to provide a space required for the moving part 130 to move. Providing the shielding part 150 at the notch 111 will introduce a new problem. The shielding part 150 will interfere with the moving part 130, thereby hindering the movement of the moving part 130. To solve this problem, Figures 10 to 18As shown, since the movable part 130 needs to pass between the shielding part 150 and the notch 111, the support cooperation between the movable part 130 and the shielding part 150 can be utilized to make a part of the shielding part 150 protrude in the direction away from the notch 111 and form an escape space, and the escape space is utilized to accommodate the movable part 130. It should be noted that the escape space only needs to accommodate a part of the movable part 130, and the part refers to the portion of the movable part 130 located between the shielding part 150 and the notch 111.

[0022] The specific method of supporting and cooperating between the movable part 130 and the shielding part 150 may include: setting a bracket on the side of the movable part 130 facing the shielding part 150, the bracket contacts and cooperates with the side of the shielding part 150 close to the notch 111, and supports a part of the shielding part 150 to protrude in the direction away from the notch 111, so as to form an escape space; or, a magnetic part may be set on the side of the movable part 130 facing the shielding part 150, and a corresponding magnetic part is also set on the shielding part 150, the magnetic poles of the two magnetic parts repel each other, and the magnetic repulsion force is used to drive a part of the shielding part 150 to protrude in the direction away from the notch 111, so as to form an escape space.

[0023] Since the movable part 130 needs to move along the length extension direction of the notch 111, the position of the avoidance space also needs to change synchronously with the movement of the movable part 130. For example, taking the above-mentioned scheme of setting a bracket on the side of the movable part 130 facing the shielding part 150 as an example, the movable part 130 will drive the bracket to move synchronously during the movement, so the supporting position of the bracket on the shielding part 150 will also change accordingly. Correspondingly, the position of the formed avoidance space will also change accordingly, thereby enabling the movable part 130 and the shielding part 150 to achieve good dynamic coordination.

[0024] It should be noted that, taking the vertical furnace tube equipment as an example, the length extension direction of the notch 111 can be the vertical direction. Correspondingly, the movable part 130 can be lifted and lowered in the vertical direction, and the shielding part 150 is also extended in the vertical direction and at least partially covers the notch 111.

[0025] like Figures 10 to 18As shown, the above-mentioned moving part 130 may include a bearing assembly 131 and a guide assembly 132. The bearing assembly 131 is slidably connected to the supporting part 120. One end of the bearing assembly 131 may be located in the box body 110, or may extend out of the box body 110 through the notch 111. The bearing assembly 131 may move along the length extension direction of the notch 111. The guide assembly 132 may be arranged on a side of the bearing assembly 131 close to the shielding part 150. The guide assembly 132 supports and cooperates with the shielding part 150 to support a part of the shielding part 150 to protrude in the direction away from the notch 111, and form the above-mentioned avoidance space, which is specifically used to accommodate the part of the bearing assembly 131 located between the shielding part 150 and the notch 111. The guide assembly 132 and the shielding part 150 are in contact with each other and slidably connected. In order to reduce the sliding friction between the guide assembly 132 and the shielding part 150, structures such as pulleys and bearings may be arranged on the guide assembly 132.

[0026] like Figures 10 to 18 As shown, the guide assembly 132 may include a support pulley, which is connected to the bearing assembly and can be assembled by bolt connection, clamping, etc. The support pulley extends in a direction opposite to the notch 111, and the shielding portion 150 is wound around the support pulley. Under the support of the support pulley, a part of the shielding portion may protrude in a direction opposite to the notch 111, thereby forming an escape space. By providing the support pulley, the sliding friction between the guide assembly 132 and the shielding portion 150 can be reduced.

[0027] In a specific embodiment of the present application, Figures 10 to 18 As shown, the above-mentioned support pulley may specifically include a first support pulley 1321 and a second support pulley 1322, and the first support pulley 1321 and the second support pulley 1322 are respectively connected to the bearing assembly 131, and can be assembled by bolt connection, clamping, etc. The first support pulley 1321 and the second support pulley 1322 are both arranged inside the box body 110, and protrude and extend in a direction away from the notch 111, and the shielding portion 150 is respectively wound around the first support pulley 1321 and the second support pulley 1322, and the side of the shielding portion 150 close to the notch 111 is supported by the first support pulley 1321 and the second support pulley 1322. The shielding portion 150 should originally be arranged in a straight line along the extension direction of the notch 111. When supported by the first support pulley 1321 and the second support pulley 1322, a portion of the shielding portion 150 will bend along the end surfaces of the first support pulley 1321 and the second support pulley 1322 to change the extension direction, thereby protruding in the direction away from the notch 111.

[0028] The first support pulley 1321 and the second support pulley 1322 are arranged at intervals along the lifting direction of the bearing assembly 131, and form an escape space under the support and cooperation with the shielding part 150. It can be understood that the escape space actually refers to the space surrounded by the first support pulley 1321, the second support pulley 1322 and the convex curved part of the shielding part 150. When the first support pulley 1321 and the second support pulley 1322 cooperate with the shielding part 150, since the pulleys themselves can rotate, the sliding friction between the shielding part 150 and the guide assembly 132 can be reduced, and more friction debris can be avoided.

[0029] Under the support of the first support pulley 1321 and the second support pulley 1322, the shielding portion 150 protrudes in the direction away from the notch 111 to form an escape space. However, the escape space is on both sides of the moving direction of the bearing assembly 131, and a large gap is generated between the shielding portion 150 and the notch 111, which makes it easy for pollutants to escape to the outside of the box body 110 through the gap. In order to reduce the gap between the shielding portion 150 and the notch 111, so that the shielding portion 150 and the notch 111 fit better, as shown in FIG. Figures 10 to 16 As shown, the guide assembly 132 may further include a first steering pulley 1323 and a second steering pulley 1324. The first steering pulley 1323 and the second steering pulley 1324 are respectively connected to the bearing assembly 131. The specific connection method may include bolt connection, clamping, etc.

[0030] The first steering pulley 1323 and the second steering pulley 1324 are respectively located on both sides of the avoidance space along the moving direction of the bearing component 131 and close to the notch 111. The shielding portion 150 is located in the gap between the first steering pulley 1323 and the second steering pulley 1324 and the notch 111. Under the limiting action of the first steering pulley 1323 and the second steering pulley 1324, the other parts of the shielding portion 150 except the avoidance space can be pressed toward the notch 111 to improve the fit between the shielding portion 150 and the notch 111, so that the gap between the shielding portion 150 and the notch 111 is reduced.

[0031] The first deflection pulley 1323 and the second deflection pulley 1324 can also provide a guiding function for the shielding portion 150. The shielding portion 150 can be bent along the end surface of the first deflection pulley 1323 and the end surface of the second deflection pulley 1324, respectively, and extend in the direction opposite to the notch 111, and then be respectively wound around the first support pulley 1321 and the second support pulley 1322. It can be understood that the shielding portion 150 can include two parts, one part is a part that fits with the notch 111, and the other part is a part that needs to be raised in the direction opposite to the notch 111 and encloses a evacuation space. There is a difference in the extension direction of these two parts. The first deflection pulley 1323 and the second deflection pulley 1324 are used to provide a guiding function when the shielding portion 150 needs to be turned and bent, so that the shielding portion 150 can be bent at an angle of approximately 90° under the guiding action of the first deflection pulley 1323 and the second deflection pulley 1324, and the part of the shielding portion 150 that needs to fit with the notch 111 will not be pulled too much.

[0032] In actual installation, Figures 10 to 16 As shown, the shielding portion 150 originally fits with the notch 111, and first penetrates from the side of the first steering pulley 1323 close to the notch 111. The first steering pulley 1323 performs a first bend and turn on the shielding portion 150 to make the shielding portion 150 extend in a direction away from the notch 111, and then is wrapped around the end face of the first supporting pulley 1321 for a second bend and turn. The shielding portion 150 continues to extend to the second supporting pulley 1322 and performs a third bend and turn, and finally passes through the second steering pulley 1324 to achieve a fourth bend and turn to restore to a state of fitting with the notch 111.

[0033] like Figures 15 to 18 As shown, the structures of the first support pulley 1321 and the second support pulley 1322 may be the same, and both include a pulley body 1321a, a pulley bracket 1321b, a support rod 1321c and an elastic member 1321d, and the assembly relationship of the above components is as follows: The pulley body 1321a is mounted on the pulley bracket 1321b and is rotatably connected to the pulley bracket 1321b through a rotating shaft. The pulley bracket 1321b is connected to the bearing assembly 131 through a support rod 1321c. A mounting hole can be set on the bearing assembly 131, and one end of the support rod 1321c is inserted into the mounting hole for installation. Moreover, the support rod 1321c can slide relative to the bearing assembly 131 along its own axial direction, so that the position of the pulley body 1321a can be adjusted, and the size of the avoidance space can be flexibly adjusted, and the tension of the shielding portion 150 can also be adjusted. In order to prevent the support rod 1321c from coming off the bearing assembly 131, a locking nut can be set at the end of the support rod 1321c.

[0034] The telescopic sliding of the support rod 1321c can adjust the position of the pulley body 1321a. In order to enable the pulley body 1321a to stably support the shielding portion 150, the elastic member 1321d can be sleeved on the support rod 1321c, and the two ends of the elastic member 1321d can respectively abut against the pulley bracket 1321b and the bearing assembly 131 to elastically support between the pulley bracket 1321b and the bearing assembly 131, so that the pulley body 1321a can apply a certain tension force to the shielding portion 150. In addition, the elastic member 1321d can also play a certain buffering role to avoid rigid contact between the shielding portion 150 and the pulley body 1321a.

[0035] like Figures 6 to 9 As shown, the bearing assembly 131 may include a transmission member 1311, a mounting plate 1312 and a connecting member 1313. The transmission member 1311 is slidably connected to the support portion 120, and one end of the transmission member 1311 is connected to the mounting plate 1312, thereby driving the mounting plate 1312 to move synchronously. At least part of the mounting plate 1312 is arranged in the notch 111, and the mounting plate 1312 is clearance-matched with the box walls on both sides of the notch 111. The connecting member 1313 is stacked with the mounting plate 1312, and the connecting member 1313 is arranged on the surface of the mounting plate 1312 facing away from the box body 110, and at least partly protrudes from the outer wall of the box body 110, and the connecting member 1313 is used to connect the components to be transmitted. The assembly method between the transmission member 1311 and the mounting plate 1312, and between the mounting plate 1312 and the connecting member 1313 may include bolt connection, welding, riveting, etc.

[0036] The mounting plate 1312 is mainly used to provide a mounting position for the guide assembly 132, and the guide assembly 132 can be arranged on a side of the mounting plate 1312 close to the shielding portion 150. During actual assembly, the shielding portion 150 is located on a side of the notch 111 close to the inside of the box body 110, the connector 1313 is located on a side of the notch 111 close to the outside of the box body 110, and the mounting plate 1312 is also arranged in the notch 111. Under the triple combination, the sealing performance at the notch 111 can be further improved.

[0037] like Fig. 9As shown, the width of the notch 111 of the box body 110 is w, and the width of the shielding portion 150 is w1. In order to allow the shielding portion 150 to stably cover the notch 111, the shielding portion 150 can protrude from the edges of the notch 111 on both sides along its width direction. The width w of the notch 111 can be 40mm-60mm, such as 40mm, 45mm, 50mm, 60mm, etc., and the width w1 of the shielding portion 150 can be 48mm-72mm, such as 48mm, 50mm, 60mm, 72mm, etc. In addition, in order to avoid frequent friction between the shielding portion 150 and the box walls on both sides of the notch 111, a matching gap s1 can be reserved between the shielding portion 150 and the box wall, and the size of the gap s1 can be 1mm-2mm, such as 1mm, 1.5mm, 2mm, etc.

[0038] like Figure 7 As shown, a first direction is first defined, which is parallel to the side wall of the box body 110 where the notch 111 is located, and is perpendicular to the moving direction of the moving part 130. In order to allow the mounting plate 1312 to smoothly extend into the notch 111, along the first direction, the size w2 of the mounting plate 1312 can be 28mm-52mm, and the connecting member 1313 needs to cover the outside of the notch 111. To ensure stable coverage, the size w3 of the connecting member 1313 can be 48mm-72mm, such as 48mm, 50mm, 60mm, 72mm, etc. In addition, in order to avoid friction between the connecting member 1313 and the outer wall of the box body 110, the gap s2 between the connecting member 1313 and the outer wall of the box body 110 can be 2mm-4mm, such as 2mm, 3mm, 4mm, etc.

[0039] like Figures 19 to 25 As shown, the moving mechanism may further include a driving unit 160, which is at least partially disposed in the housing 110 and connected to the moving unit 130 to drive the moving unit 130 to slide relative to the supporting unit 120. The driving unit 160 may be a combination of a motor and a lead screw, a combination of a cylinder and a connecting rod, or a combination of magnetic transmission.

[0040] In an optional embodiment of the present application, Figure 22 to Figure 25As shown, the driving part 160 may include a motor 161, a lead screw 162, a nut 163, a nut connecting block 164, and a lead screw bearing seat 165. The lead screw bearing seat 165 may be installed on the inner wall of the box body 110, and the lead screw bearing seat 165 may be arranged near the top and bottom of the box body 110. The lead screw 162 may be installed through the lead screw bearing seat 165. The motor 161 may be installed on the top of the box body 110, the top of the lead screw 162 passes through the top plate of the box body 110 and is connected to the output end of the motor 161, the nut 163 is sleeved on the lead screw 162 and is threadedly connected with the lead screw 162 to form a sliding pair, the nut connecting block 164 is connected to the nut 163, and the nut 163 is connected to the moving part 130 through the nut connecting block 164. When the motor 161 drives the lead screw 162 to rotate, the rotational motion of the lead screw 162 is converted into a lifting motion through the nut 163, thereby driving the moving part 130 to lift and lower.

[0041] like Figure 26 to Figure 28 As shown, the semiconductor process equipment 200 may further include a pipeline assembly 260 (tank chain), wherein a cable air tube bundle is arranged inside the pipeline assembly 260, and the cable air tube bundle extends out of the box 110 through the notch 111 and cooperates with the process door 230. The fixed end of the pipeline assembly 260 may be installed on the inner wall of the box 110, and the movable end of the pipeline assembly 260 may be connected to the movable part 130 through a pin shaft. Driven by the movable part 130, the movable end of the pipeline assembly 260 may reciprocate up and down, and the curling position of the cable air tube bundle inside the pipeline assembly 260 may change synchronously with the curling position of the pipeline assembly 260, thereby realizing the reciprocating up and down movement of the cable air tube bundle with the movable part 130, and the pipeline assembly 260 may protect the internal cable air tube bundle.

[0042] To prevent contaminants from accumulating in the housing 110, Figures 1 to 4 As shown, an air outlet 113 can be provided on the box 110, and the air outlet 113 is used to communicate with the exhaust channel 213 of the semiconductor process equipment 200, such as a factory exhaust duct. The fan 140 can be installed on the inner wall of the box 110 through a bracket structure, or can be installed on the outer wall of the box 110. The fan 140 is close to the air outlet 113. The fan 140 can drive the gas flow inside the box 110 and discharge it through the air outlet 113. When the fan 140 is in a working state, it will drive the air flow into the box 110 from the notch 111, and then discharge it to the exhaust channel 213 outside the box 110 through the air outlet 113, so that the pollutants in the box 110 can be discharged into the exhaust channel 213, thereby reducing the probability of the pollutants diffusing to the outside of the box 110 and causing pollution to the area where the wafers are located.

[0043] like Figures 1 to 4As shown, the box body 110 is also provided with an air inlet 112, and the air inlet 112 is connected to the air outlet 113. The setting positions of the air inlet 112 and the air outlet 113 on the box body 110 can be selected according to actual ventilation requirements, such as Figure 1 As shown, the air outlet 113 can be close to the top of the box 110, and the air inlet 112 can be close to the bottom of the box 110, so as to increase the path and coverage area of ​​the air passage, so as to cover the internal space of the box 110 as much as possible to transfer as many pollutants as possible to the exhaust channel 213.

[0044] like Figure 1 and Figure 4 As shown by the arrows in , the airflow in the box 110 can be roughly divided into two paths, one of which is the airflow transmitted from the air inlet 112 to the air outlet 113, and the other is the airflow transmitted from the notch 111 to the air outlet 113. No matter which of the above airflows is used, the pollutants generated in the box 110 can be discharged to the exhaust channel 213 outside the box 110 through the air outlet 113. In addition, since the fan 140 is in the working state, the inside of the box 110 is in a negative pressure environment, which can also prevent pollutants from escaping from the notch 111 of the box 110 to the external wafer loading and unloading area; in addition, the airflow can also take away part of the heat inside the box 110, thereby reducing the thermal impact of thermal radiation on the internal components of the box 110.

[0045] In an optional embodiment of the present application, taking a vertical furnace tube device as an example, the process door moving device 100 is used to drive the process door 230 to move up and down in the vertical direction. Correspondingly, the length extension direction of the notch 111 of the box body 110 is the vertical direction, and the moving part 130 also moves up and down in the vertical direction. The process door 230 can be used to support the carrying boat 240, and the carrying boat 240 is used to carry wafers. The process door 230 will drive the carrying boat 240 to enter and exit the process chamber during the lifting process.

[0046] Please refer to Figures 1 to 28 As shown, the embodiment of the present application further discloses a semiconductor process equipment 200, and the disclosed semiconductor process equipment 200 may include a housing 210, a process chamber 220, a process door 230, a carrier boat 240 and the above-mentioned process door moving device 100, wherein: A partition is arranged inside the casing 210, which divides the interior of the casing 210 into a first installation space 211 and a second installation space 212 which are adjacent to each other. A process chamber 220 is arranged in the first installation space 211, and the process chamber 220 provides a constant process temperature for the process. An opening is arranged on the partition so that the opening of the process chamber 220 can be connected with the second installation space 212.

[0047] The outer wall of the process chamber 220 and the inner wall of the housing 210 form an exhaust passage 213. The process door moving device 100 is arranged in the second installation space 212. The second installation space 212 is used to provide a clean loading and unloading area for the wafer. The air outlet 113 of the box 110 can be connected to the exhaust passage 213 through the flow hole opened on the partition. The fan 140 in the box 110 can drive the air flow from the air inlet 112 to the air outlet 113, and discharge it into the exhaust passage 213 through the flow hole.

[0048] The carrying boat 240 is arranged above the process door 230 for carrying wafers; one end of the moving part 130 is connected to the process door 230 to drive the process door 230 to switch between the first position and the second position. When the process door 230 is in the first position, the carrying boat 240 enters the process chamber 220, and the process door 230 covers the opening of the process chamber 220 for processing; when the process door 230 is in the second position, the carrying boat 240 and the process door 230 are separated from the process chamber 220, and the carrying boat 240 can return to the second installation space 212 for loading and unloading of wafers.

[0049] From the above, it can be seen that the semiconductor process equipment 200 disclosed in the embodiment of the present application improves the relevant technology. By arranging an air inlet 112, an air outlet 113 and a fan 140 on the box 110 of the process door moving device 100, an air passage can be formed in the box 110. The pollutants generated in the box 110 can be transmitted to the exhaust passage 213 together with the airflow generated in the air passage, thereby reducing the accumulation of pollutants in the box 110, and further reducing the probability of pollutants diffusing to the outside of the box 110 and causing pollution to the area where the wafer is located.

[0050] like Figure 1As shown, the semiconductor process equipment 200 may also include an air cooling mechanism 250, which is disposed in the second installation space 212 and is disposed opposite to the air inlet 112 of the box body 110. On the one hand, the air cooling mechanism 250 is used to cool the wafers, and on the other hand, the air cooling mechanism 250 may also provide clean low-temperature airflow to the air inlet 112, which is beneficial to the discharge of pollutants inside the box body 110 and the cooling of the internal components of the box body 110. In an optional embodiment of the present application, taking the vertical furnace tube equipment as an example, the process door moving device 100 may be used to drive the process door 230 to move up and down in the vertical direction, and the process door 230 is used to support the carrying boat 240, and the first installation space 211 may be located above the second installation space 212. When the process door 230 rises to the first position, the carrying boat 240 enters the process chamber 220, and the process door 230 covers the opening of the process chamber 220 to carry out the process; when the process door 230 descends to the second position, the carrying boat 240 and the process door 230 are separated from the process chamber 220, and the carrying boat 240 can return to the second installation space 212 to load and unload wafers.

[0051] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different technical features between the various embodiments are not contradictory, they can be combined to form more specific embodiments. Considering the simplicity of the text, they will not be repeated here.

[0052] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A process door moving device, applied to semiconductor process equipment, characterized in that: The process door moving device (100) comprises a box body (110) and a moving mechanism; A notch (111) is provided on a side wall of the box body (110); the moving mechanism comprises a supporting portion (120) and a moving portion (130); the supporting portion (120) is provided in the box body (110); the moving portion (130) is slidably connected to the supporting portion (120) and can move along a length extension direction of the notch (111).

2. The process door moving device according to claim 1, characterized in that: The process door moving device (100) further comprises a shielding portion (150), the shielding portion (150) being a thin sheet belt-shaped structure, the shielding portion (150) being arranged in the box body (110) and at least partially covering the notch (111); The moving part (130) is supported and matched with the shielding part (150) so that a part of the shielding part (150) protrudes in a direction away from the notch (111) to form an escape space, the escape space being used to accommodate the moving part (130), and the position of the escape space changes synchronously with the movement of the moving part (130).

3. The process door moving device according to claim 2, characterized in that: The moving part (130) comprises a bearing component (131) and a guiding component (132); the bearing component (131) is slidably connected to the supporting part (120); and the bearing component (131) can move along the length extension direction of the notch (111); The guide component (132) is arranged on a side of the bearing component (131) close to the shielding portion (150), the guide component (132) is slidably connected to the shielding portion (150), and supports a portion of the shielding portion (150) to protrude in a direction away from the notch (111) to form the avoidance space, and the avoidance space is used to accommodate the bearing component (131).

4. The process door moving device according to claim 3, characterized in that: The guide assembly (132) comprises a supporting pulley, the supporting pulley is connected to the bearing assembly (131) and extends in a direction away from the notch (111); The shielding portion (150) is wound around the supporting pulley, and the supporting pulley is used to support a part of the shielding portion (150) to protrude in a direction away from the notch (111).

5. The process door moving device according to claim 4, characterized in that: The supporting pulley comprises a first supporting pulley (1321) and a second supporting pulley (1322); the first supporting pulley (1321) and the second supporting pulley (1322) are respectively connected to the bearing assembly (131) and extend in a direction away from the notch (111); The shielding portion (150) is respectively wound around the first supporting pulley (1321) and the second supporting pulley (1322); the first supporting pulley (1321) and the second supporting pulley (1322) are arranged at intervals along the moving direction of the bearing assembly (131) to support a part of the shielding portion (150) protruding in a direction away from the notch (111).

6. The process door moving device according to claim 5, characterized in that: The guide assembly (132) further comprises a first steering pulley (1323) and a second steering pulley (1324), wherein the first steering pulley (1323) and the second steering pulley (1324) are respectively connected to the bearing assembly (131); The first steering pulley (1323) and the second steering pulley (1324) are respectively located on both sides of the avoidance space along the moving direction of the bearing assembly (131) and close to the notch (111) so as to press the other parts of the shielding portion (150) except the avoidance space toward the notch (111); The shielding portion (150) is bent along the end surface of the first steering pulley (1323) and the end surface of the second steering pulley (1324), and extends in a direction away from the notch (111) so as to be wound around the first supporting pulley (1321) and the second supporting pulley (1322), respectively.

7. The process door moving device according to claim 5, characterized in that: The first supporting pulley (1321) and the second supporting pulley (1322) have the same structure, and both comprise a pulley body (1321a), a pulley bracket (1321b), a supporting rod (1321c) and an elastic member (1321d); The pulley body (1321a) is mounted on the pulley bracket (1321b); the pulley bracket (1321b) is connected to the bearing assembly (131) via the support rod (1321c); and the support rod (1321c) can slide relative to the bearing assembly (131) along its own axial direction; The elastic member (1321d) is sleeved on the support rod (1321c), and two ends of the elastic member (1321d) are respectively in contact with the pulley bracket (1321b) and the bearing assembly (131) so as to be elastically supported between the pulley bracket (1321b) and the bearing assembly (131).

8. The process door moving device according to claim 3, characterized in that: The bearing assembly (131) comprises a transmission member (1311), a mounting plate (1312) and a connecting member (1313); The transmission member (1311) is slidably connected to the support portion (120), one end of the transmission member (1311) is connected to the mounting plate (1312), at least a portion of the mounting plate (1312) is disposed in the notch (111), and the connecting member (1313) is disposed on a surface of the mounting plate (1312) that faces away from the box body (110), and at least a portion of the connecting member (1313) protrudes from an outer wall of the box body (110); The guide assembly (132) is arranged on a side of the mounting plate (1312) close to the shielding portion (150).

9. The process door moving device according to claim 2, characterized in that: Both sides of the shielding portion (150) along its width direction respectively protrude beyond the edges of the notch (111).

10. The process door moving device according to claim 2, characterized in that: The width of the notch (111) is 40 mm to 60 mm, and the width of the shielding portion (150) is 48 mm to 72 mm.

11. The process door moving device according to claim 8, characterized in that: Along the first direction, the size of the mounting plate (1312) is 28 mm-52 mm, and the size of the connecting piece (1313) is 48 mm-72 mm; The first direction is parallel to the side wall of the box body (110) where the notch (111) is located, and is perpendicular to the moving direction of the moving part (130).

12. The process door moving device according to claim 1, characterized in that: The moving mechanism further comprises a driving part (160), at least part of which is disposed in the box body (110) and connected to the moving part (130) so as to drive the moving part (130) to slide relative to the supporting part (120).

13. The process door moving device according to claim 12, characterized in that: The driving part (160) comprises a motor (161), a lead screw (162) and a nut (163); the motor (161) is disposed on the housing (110); the lead screw (162) is connected to an output end of the motor (161); the nut (163) is sleeved on the lead screw (162) to form a sliding pair; and the moving part (130) is connected to the nut (163).

14. The process door moving device according to claim 1, characterized in that: It also includes a pipeline assembly (260), the pipeline assembly (260) including a fixed end and a movable end, the fixed end being connected to the inner wall of the box body (110), and the movable end being connected to the movable part (130).

15. The process door moving device according to any one of claims 1 to 14, characterized in that: The process door moving device (100) further comprises a fan (140), the box body (110) is provided with an air outlet (113), the air outlet (113) is used to communicate with an exhaust passage (213) of the semiconductor process equipment, and the fan (140) is arranged in the box body (110) and is close to the air outlet (113).

16. The process door moving device according to claim 15, characterized in that: The box body (110) is also provided with an air inlet (112), the air inlet (112) being connected to the air outlet (113), the air outlet (113) being close to the top of the box body (110), and the air inlet (112) being close to the bottom of the box body (110).

17. The process door moving device according to any one of claims 1 to 14, characterized in that: The process door moving device (100) is used to drive the process door (230) to move up and down in a vertical direction, and the process door (230) is used to support the carrying boat (240).

18. A semiconductor process equipment, characterized in that: It comprises a housing (210), a process chamber (220), a process door (230), and the process door moving device (100) according to any one of claims 1 to 17; The housing (210) is provided with a first installation space (211) and a second installation space (212) which are arranged adjacent to each other; the process chamber (220) is arranged in the first installation space (211); an outer wall of the process chamber (220) and an inner wall of the housing (210) form an exhaust passage (213); The process door moving device (100) is arranged in the second installation space (212), and one end of the moving part (130) is connected to the process door (230) to drive the process door (230) to switch between a first position and a second position; When the process door (230) is in the first position, the process door (230) covers the opening of the process chamber (220), and when the process door (230) is in the second position, the process door (230) is separated from the process chamber (220).

19. The semiconductor process equipment according to claim 18, characterized in that: The semiconductor process equipment (200) further comprises an air cooling mechanism (250), wherein the air cooling mechanism (250) is arranged in the second installation space and is arranged opposite to the air inlet (112) of the box body (110).

20. The semiconductor process equipment according to claim 18 or 19, characterized in that: The process door moving device (100) is used to drive the process door (230) to move up and down in a vertical direction; the process door (230) is used to support the carrying boat (240); and the first installation space (211) is located above the second installation space (212).

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