Semiconductor laser macro-channel submodule sintering clamp

Abstract

The invention discloses a semiconductor laser macro-channel submodule sintering clamp which is characterized in that two groups of parallel guide rails are respectively fixed on two sides of a bottom plate, and two ends of at least one group of positioning plates are sleeved on the guide rails; the bottom plate is further provided with an elastic connecting piece, and the two ends of the positioning plate are fixedly connected to the bottom plate from the same side through the elastic connecting piece. Positioning grids are arranged above the positioning plates, the positioning plates can slide between two adjacent cross rods below square grooves of the positioning grids, the cross rods of the positioning grids are fixed on the bottom plate, pressure strips with the same number as the positioning plates are arranged above the positioning grids, one end of each pressure strip is sleeved on one guide rail, and the other end of each pressure strip is clamped with the other guide rail; a clamping block matched with the square groove of the positioning grating is arranged in the middle, one side, adjacent to the positioning plate, of the clamping block is connected with an elastic pressing block, a containing cavity for containing the sub-module is formed between the positioning plate and the square groove on one side away from the elastic pressing block, and the elastic pressing block extrudes the positioning plate to apply proper pressure to the sub-module to be sintered. According to the invention, a plurality of sub-modules can be packaged at one time, and the packaging efficiency is greatly improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor laser fixtures, and in particular relates to a semiconductor laser macro channel submodule sintering fixture.

[0002] The present invention belongs to the 1.3.3 New Components and Semiconductor Laser Devices in the 1.3.3 Electronic Core Industry Key Direction of the 1.3.3 New Components and Devices in the Catalogue of Strategic New Industries, the 1.7 New Generation Information Technology Industry. Background Art

[0003] like Figure 7 As shown, the semiconductor laser macro-channel submodule is generally welded by clamping a semiconductor laser array chip with two electrode sheets. The two electrode sheets serve as the positive and negative electrodes of the chip respectively. The chip is in strip shape, 10mm long and 1mm-1.5mm wide. When clamping, the forces at both ends of the chip must be uniform, and during sintering, a certain pressure must be maintained between the electrode sheets, welding sheets and the chip. It takes 10-20 of the above macro-channel submodules to package a macro-channel laser. Most of the existing sintering fixtures can only package one submodule, and a few fixtures can package several submodules at a time, resulting in a limited number of submodules that can be sintered in a eutectic furnace at one time, so the packaging efficiency is very low. Summary of the invention

[0004] In order to improve packaging efficiency and package multiple sub-modules at one time, the present invention provides a semiconductor laser macro channel sub-module sintering fixture.

[0005] The object of the present invention is achieved in the following manner: a semiconductor laser macro channel submodule sintering fixture, comprising a base plate, a guide rail, a positioning plate, a positioning grid, a pressure bar and an elastic pressing block, two sets of parallel guide rails are respectively fixed on both sides of the upper surface of the base plate, and two ends of at least one set of positioning plates are respectively sleeved on the two guide rails; at least one set of elastic connectors is also arranged on the base plate, and each set of elastic connectors connects the two ends of the positioning plate to the base plate from the same side; a positioning grid is placed on the positioning plate, and square grooves are evenly distributed on the positioning grid. The positioning plate can slide between two adjacent cross bars under the square grooves of the positioning grid, and the cross bars are fixedly connected to the base plate; pressure bars with the same number as the positioning plates are arranged above the positioning grid, and the pressure bars are clamped into the square grooves, one end of the pressure bar is sleeved on the guide rail, and the other end is clamped with another guide rail, and a clamping block adapted to the square groove of the positioning grid is also arranged in the middle of the pressure bar, and the side of the clamping block adjacent to the positioning plate is connected to the elastic pressing block, and a receiving cavity for placing the submodule is formed between the positioning plate and the square groove on the side away from the elastic pressing block, and the elastic pressing block squeezes the positioning plate to press the submodule tightly.

[0006] The elastic connecting member is a spring connected through a fixing block.

[0007] Each set of guide rails has two, the two ends of the positioning plate are respectively sleeved on the two inner guide rails, and the two ends of the pressure bar are respectively connected to the two outer guide rails.

[0008] The elastic pressure block comprises a square plate, a positioning pin is fixedly connected to the center of one side of the square plate, compression springs are symmetrically arranged on both sides of the positioning pin, a mounting hole is arranged at the center of the block of the pressure bar, and the positioning pin is inserted into the mounting hole for fixing.

[0009] Compared with the prior art, the present invention installs the positioning plate on the guide rail, and connects the two ends of the positioning plate to the bottom plate through a fixed connector, places the positioning grid on the positioning plate, so that the positioning plate can just move between the two adjacent cross bars under the square groove of the positioning grid, fixes the cross bars of the positioning grid to the bottom plate, and then installs the pressure bar with the elastic pressure block installed on the guide rail, and forms a receiving cavity for placing the submodule between the positioning plate and the square groove away from the side of the elastic pressure block. During packaging, the electrode sheet, the welding sheet and the chip are placed in the receiving cavity in sequence, and the elastic pressure block installed on the pressure bar provides a pressing force to the positioning plate, so that the positioning plate squeezes the electrode sheet, the welding sheet and the chip to prevent the electrode sheet, the welding sheet and the chip from moving, and gives the submodule to be sintered with appropriate pressure; after sintering in a eutectic furnace, the electrode sheet, the welding sheet and the chip become one, that is, a semiconductor laser macro channel submodule. By replacing different springs, the pressure provided to the submodule to be sintered can be adjusted. The present invention can encapsulate multiple submodules at a time, and the size of the clamp can be designed according to the size of the eutectic furnace, which greatly improves the packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of the present invention.

[0011] Figure 2 It is a structural diagram of the base plate.

[0012] Figure 3 It is a structural schematic diagram of the positioning plate.

[0013] Figure 4 It is a structural diagram of the positioning grid.

[0014] Figure 5 It is a schematic diagram of the structure of the pressure bar.

[0015] Figure 6 It is a schematic diagram of the structure of the briquette.

[0016] Figure 7 It is a structural schematic diagram of a semiconductor laser macro channel submodule.

[0017] In the figure: 1-bottom plate, 2-guide rail, 21-first guide rail, 22-second guide rail, 23-third guide rail, 24-fourth guide rail, 3-positioning plate, 4-positioning grid, 41-square groove, 42-accommodating cavity, 43-cross bar, 44-longitudinal bar, 5-fixed connecting piece, 6-pressure bar, 61-circular opening, 62-mounting hole, 63-first card slot, 64-card block, 65-second card slot, 66-third card slot, 7-elastic pressure block, 71-square plate, 72-positioning pin, 73-compression spring, 8-submodule. DETAILED DESCRIPTION

[0018] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention. After reading the content of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the present invention.

[0019] like Figure 1-6As shown, a semiconductor laser macro channel submodule sintering fixture includes a base plate 1, a guide rail 2, a positioning plate 3, a positioning grid 4, a pressure bar 6 and an elastic pressing block 7. A group of guide rails 2 are fixed on both sides of the upper surface of the base plate. Each group of guide rails 2 has two and are arranged in parallel. The first guide rail 21 and the second guide rail 22 form a group, and the third guide rail 23 and the fourth guide rail 24 form a group. The first guide rail 21 and the fourth guide rail 24 are on the outside, and the second guide rail 22 and the third guide rail 23 are on the inside. The middle part of the positioning plate 3 is a limit groove, and a circular installation opening is set at each end. The two ends of the four groups of positioning plates 3 are sleeved on the second guide rail 22 and the third guide rail 23 through the circular installation opening. At least four groups of elastic connectors 5 are also set on the base plate 1, and each group has two elastic connectors 5, which connect the two ends of the positioning plate 3 to the base plate 1 from the same side. The positioning grid 4 is formed by five cross bars 43 and six longitudinal bars 44, which are cross-crossed to form four rows of five square grooves 41 in each row. The five cross bars 43 are raised relative to the longitudinal bars 44. The positioning grid 4 is placed on the positioning plate 3. The positioning plate 3 can slide freely between two adjacent cross bars 43 below the square grooves 41. At this time, the cross bars 43 are in contact with the bottom plate 1. The positioning grid 4 is fixedly connected to the bottom plate 1 through bolts or other mechanisms at the contact surface. Four pressure bars 6 are arranged above the positioning grid 4. A circular opening 61 is arranged at one end of the pressure bar 6, and a first card slot 63 is arranged at the other end. Five spaced card blocks 64 are formed in the middle part. A second card slot 65 is formed between each card block 64. A third card slot 66 is formed between the two outer card blocks 64 and the circular opening 61 and the first card slot 63, respectively. The middle part of the pressure bar 6 (i.e., the five card blocks 64) is inserted into the square groove 41. One end of the pressure bar 6 is sleeved on the fourth guide rail 24 through the circular opening 61, so that the pressure bar 6 can be used as the fourth guide rail 24. The shaft rotates and can move along its axial direction. The other end is clamped with the first guide rail 21 through the first clamping groove 63. After the pressure bar 6 clamps the guide rail through the first clamping groove 63, the pressure bar 6 is fixed and cannot move in the axial direction of the guide rail (the two ends of the pressure bar 6 can also be reversed, one end is sleeved with the first guide rail 21, and the other end is clamped with the fourth guide rail 24). The clamping block 64 and the second clamping groove 65 are adapted to the size of the square groove 41 of the positioning grid 4. The clamping blocks 64 and the second clamping groove 65 arranged at intervals allow the pressure bar 6 to move only along the length direction of the guide rail. The side of the clamping block 64 adjacent to the positioning plate 3 is connected to the elastic pressing block 7. The positioning plate 3 and the square groove 41 on the side away from the elastic pressing block 7 form a receiving cavity 42. The submodule 8 is placed in the receiving cavity 42. The elastic pressing block 7 squeezes the positioning plate 3 to press the submodule to be sintered.

[0020] Furthermore, the specific structure of the clamping block 64 connecting the elastic pressure block 7 is as follows: a mounting hole 62 is set at the center of the clamping block 64, and the elastic pressure block 7 includes a square plate 71. A positioning pin 72 is fixedly connected to the center of one side of the square plate 71. Compression springs 73 are symmetrically set on both sides of the positioning pin 72. The positioning pin 72 extends into the mounting hole 62 and is fixed. After the positioning pin 72 is fixed in the mounting hole 62, the pressure bar 6 can move in the length direction of the guide rail. The moving pressure bar 6 compresses the spring 73 to drive the square plate 71 to squeeze the positioning plate 3, thereby achieving the compression of the submodule 8. When the pressure is appropriate, one end of the pressure bar 6 with the first clamping groove 63 is clamped to the guide rail to keep the spring at a certain pressure.

[0021] Furthermore, the elastic connector 5 is a spring connected by a fixed block. The submodule to be sintered is placed in the accommodating cavity 42, and the elastic pressure block 7 provides a clamping force for the positioning plate 3 and the submodule. When the submodule to be sintered is not placed in the accommodating cavity 42, the spring of the elastic connector 5 can bounce the positioning plate 3 away by a certain distance, leaving enough space for placing the submodule. After the pressure bar 6 is moved to make the elastic pressure block 7 contact the positioning plate 3, due to the presence of the spring of the elastic connector 5, the continuous clamping force of the submodule is buffered and damped to prevent the submodule from being overly stressed.

[0022] As shown in the figure, four groups of positioning plates 3 are sleeved on the guide rail 2, and four groups of pressure bars 6 are set correspondingly. There are four rows of accommodating cavities 42 on the positioning grid 4, and each row has five square grooves 41. Twenty accommodating cavities 42 are formed between the positioning plates 3 and the square grooves 41. There are five blocks 64 in the middle of the pressure bars 6 corresponding to the square grooves 41. Figure 1 The sintering fixture shown can clamp 20 submodules at a time. According to the size of the eutectic furnace, the size of the sintering fixture can be adjusted, that is, the number of the positioning plates 3 groups is increased or decreased, and the corresponding pressure bars 6 increase or decrease with the positioning plates 3, and keep consistent with the number of the positioning plates 3 groups. The corresponding positioning grid 4 also increases or decreases the number of square grooves 41, resulting in a corresponding increase or decrease in the accommodating cavity 42. Of course, the number of the clamping blocks 64 and the second clamping grooves 65 of the pressure bar also increases or decreases accordingly.

[0023] As shown in the figure, each group of guide rails 2 has two, but each group of guide rails may have only one, and the ends of the positioning plate 3 and the pressure bar 6 are arranged on the same guide rail.

[0024] Installation process of sintering fixture: The cam 4 is provided with a plurality of cams 46, 48 and 49 for holding the plurality of moving parts 36. The plurality of moving parts 36 are provided with a plurality of cams 47. The plurality of moving parts 36 are provided with a plurality of cams 48. The plurality of moving parts 36 are provided with a plurality of cams 47. The plurality of moving parts 36 are provided with a plurality of cams 47.

[0025] The present invention installs the positioning plate on the guide rail, and connects the two ends of the positioning plate to the bottom plate through a fixed connector, places the positioning grid on the positioning plate, allows the positioning plate to slide freely between two adjacent cross bars just below the square groove of the positioning grid, fixes the positioning grid to the bottom plate, and then installs the pressure bar with the elastic pressure block installed on the guide rail. During packaging, the electrode sheet, welding sheet and chip are placed in the accommodating cavity in order, and the elastic pressure block installed on the pressure bar provides a clamping force to the positioning plate, and the positioning plate squeezes the electrode sheet, welding sheet and chip to prevent the electrode sheet, welding sheet and chip from moving; after sintering in a eutectic furnace, the electrode sheet, welding sheet and chip become one, that is, a semiconductor laser macro channel submodule. By replacing different springs, the pressure provided to the submodule to be sintered can be adjusted. The present invention can encapsulate multiple submodules at a time, and the size of the clamp can be designed according to the size of the eutectic furnace, which greatly improves the packaging efficiency.

[0026] The above is only a preferred embodiment of the present invention. It should be pointed out that for those skilled in the art, several changes and improvements can be made without departing from the overall concept of the present invention, which should also be regarded as the scope of protection of the present invention.

Claims

1. A semiconductor laser macro channel submodule sintering fixture, characterized by: The invention comprises a bottom plate (1), a guide rail (2), a positioning plate (3), a positioning grille (4), a pressure bar (6) and an elastic pressure block (7), wherein two sets of parallel guide rails (2) are respectively fixed on both sides of the upper surface of the bottom plate (1), and two ends of at least one set of positioning plates (3) are respectively sleeved on the two guide rails (2); at least one set of elastic connecting members (5) is also provided on the bottom plate (1), and each set of elastic connecting members (5) connects two ends of the positioning plate (3) to the bottom plate (1) from the same side; a positioning grille (4) is placed on the positioning plate (3), and square grooves (41) are evenly distributed on the positioning grille (4), and the positioning plate (3) can slide between two adjacent cross bars (43) under the square grooves (41) of the positioning grille. The cross bar (43) is fixedly connected to the bottom plate (1); pressure bars (6) having the same number as the positioning plate (3) are arranged above the positioning grid (4); the pressure bars (6) are inserted into the square grooves (41); one end of the pressure bar (6) is sleeved on the guide rail, and the other end is engaged with another guide rail; a clamping block (64) adapted to the square groove (41) of the positioning grid (4) is also arranged in the middle of the pressure bar (6); the side of the clamping block (64) adjacent to the positioning plate (3) is connected to an elastic pressure block (7); a receiving cavity (42) for placing the submodule is formed between the positioning plate (3) and the square groove (41) on the side away from the elastic pressure block (7); the elastic pressure block (7) presses the positioning plate (3) to press the submodule tightly.

2. The semiconductor laser macro channel submodule sintering fixture according to claim 1, characterized in that: The elastic connecting member (5) is a spring connected via a fixing block.

3. The semiconductor laser macro channel submodule sintering fixture according to claim 1, characterized in that: Each set of guide rails (2) has two guide rails, the two ends of the positioning plate (3) are respectively sleeved on the two inner guide rails, and the two ends of the pressure bar (6) are respectively connected to the two outer guide rails.

4. The semiconductor laser macro channel submodule sintering fixture according to claim 1, characterized in that: The elastic pressure block (7) comprises a square plate (71), a positioning pin (72) is fixedly connected to the center of one side of the square plate (71), compression springs (73) are symmetrically arranged on both sides of the positioning pin (72), a mounting hole (62) is arranged at the center of the clamping block (64) of the pressure bar (6), and the positioning pin (72) extends into the mounting hole (62) and is fixed.

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