PCB VCUT processing anti-leakage forming processing detection method

Abstract

The invention discloses a PCB VCUT processing anti-leakage forming processing detection method comprising the following steps: obtaining a PCB, and forming a metal strip on the surface of the PCB; a broken line groove is formed in the board surface of the PCB, and the main body part of the metal strip is removed when the broken line groove is formed; detecting the connectivity of the remaining metal strips to judge whether a broken wire slot is generated or not; according to the method, the VCUT is used for carrying out process treatment, the metal strip is removed while the broken wire slot is formed, whether the broken wire slot is generated or not is judged by detecting the retention condition of the metal strip, the omission condition is effectively prevented, the metal strip is effectively removed, the phenomenon that the appearance of the board surface of the PCB is affected due to the residual condition is avoided, and the production efficiency is improved. And the processing severity is greatly reduced.

Description

Technical Field

[0001] The invention relates to the field of printed circuit board production, and in particular to a PCB board VCUT processing leak-proof molding processing detection method. Background Art

[0002] As PCB boards are widely used, in the process of PCB board production, PCB boards will be designed as units and pieced together on a large board. After completing the corresponding functional graphics, solder mask ink coverage and corresponding surface treatment, the large board will be cut into required small units by molding. When using it, users only need to apply a simple force to obtain a PCB board of the target size. In order to prevent omissions in the VCUT process, the prior art, such as the invention patent with Chinese application number CN201410332403.6, discloses a PCB leak-proof molding detection method. In this scheme, at least two detection pads connected by connecting wires are set on the broken edge. After the VCUT is processed, the connecting wires are cut. In the detection stage, the omission of the VCUT is determined by detecting whether the two pads are in a conductive state. However, the above scheme is complicated to process, and it is necessary to set the pads and connecting wires in sequence. After the detection is completed, the area of ​​the pads is large, so the position of the detection sheet is generally set at the broken edge, and the adding position is relatively strict. If it is arranged on the PCB board, it is also necessary to remove it manually, which increases the production time and easily damages the board surface of the PCB board. Therefore, a more reasonable leak-proof molding detection method is urgently needed, which can simplify the process while facilitating detection and leaving fewer residual traces, so as to improve the deficiencies in the prior art. Summary of the invention

[0003] The present invention provides a solution to the technical problems that in the prior art, the VCUT processing detection is performed by using a detection pad method, resulting in complex procedures, strict pad processing positions, and difficulty in removing pad residues.

[0004] To achieve the above object, the present invention provides a PCB board VCUT processing leak-proof molding processing detection method, comprising the following steps: Obtain a PCB board, and form a metal strip on a surface of the PCB board; Generating a break line groove on the board surface of the PCB board, and the break line groove is generated so that the main part of the metal strip is removed; The connectivity of the remaining metal strip is detected to determine whether the break line groove is generated.

[0005] As an improved solution of the present invention, before forming the metal strip, the method further includes: Forming a marking line on the board surface of the PCB board, wherein the metal strip intersects with the marking line; Using the marking line as a cutting line to generate the break, while also removing the middle portion of the metal strip; During the detection stage, the remaining parts of the two ends of the metal strip are tested for connectivity. When the circuit is on, the metal strip is judged to exist and the broken wire groove is not generated; when the circuit is off, the metal strip is judged to not exist and the broken wire groove is generated.

[0006] As an improved solution of the present invention, the removed portion of the metal strip accounts for 80-90% of its total volume.

[0007] As another implementation scheme of the present invention, a break line groove is generated on the board surface of the PCB board, and the break line groove is generated so that the metal strip is completely removed; Detecting whether the remaining metal strip exists to determine whether the break line groove is generated.

[0008] As an improved solution of the present invention, before forming the metal strip, the method further includes: A marking line is formed on the board surface of the PCB board, and the metal strip is overlapped and arranged on the marking line; Using the marking line as a cutting line to generate the breaking line groove, the width of the breaking line groove is greater than the width of the metal strip; During the detection phase, the position of the metal strip is detected. If a metal reaction occurs, the metal strip is judged to exist and the break line groove is judged not to be generated; if no metal reaction occurs, the metal strip is judged not to exist and the break line groove is judged to be generated.

[0009] As an improved solution of the present invention, before generating the break line groove, the method further includes: The thickness of the PCB board is obtained, and the slot depth of the break line slot is calculated based on the thickness; the parameter of the slot depth is less than the thickness parameter of the PCB board.

[0010] As an improved solution of the present invention, the groove depth is 1 / 2 of the thickness; the bottom of the break wire groove is provided with a plurality of through holes arranged at intervals, and any of the through holes passes through the bottom surface of the PCB board.

[0011] As an improved solution of the present invention, two opposite inner walls of the break line groove are inclined to each other.

[0012] As an improved solution of the present invention, the metal strip is made of copper.

[0013] As an improved solution of the present invention, the thickness of the metal strip is 0.05-0.08 mm.

[0014] The beneficial effect of the present invention is as follows: compared with the prior art, the present invention provides a PCB board VCUT processing leak-proof molding detection method, which uses VCUT to perform process processing, removes the metal strip while forming the broken wire groove, and determines whether the broken wire groove is generated by detecting the remaining condition of the metal strip, thereby effectively preventing omissions and effectively removing the metal strip without residual conditions that affect the appearance of the PCB board surface, thereby greatly reducing the severity of processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a flow chart of the present invention; Figure 2 is a flow chart of another embodiment of the present invention; Figure 3 One of the flow diagrams of the present invention; Figure 4 This is the second schematic diagram of the process of the present invention; Figure 5 This is the third schematic diagram of the process of the present invention; Figure 6 This is one of the flow charts of another embodiment of the present invention; Figure 7 This is another flow chart of another embodiment of the present invention; Figure 8 It is a diagram showing a cross section of a PCB board of the present invention.

[0017] The main component symbols are described as follows: 1. PCB board; 2. Marking line; 3. Metal strip; 4. Break wire trough; 5. Perforation. DETAILED DESCRIPTION

[0018] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0019] In the following description, the example details are given to provide a deeper understanding of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. It should be understood that the specific embodiments are only used to explain the present invention and are not used to limit the present invention.

[0020] It should be understood that when the terms "include" and / or "comprises" are used in this specification, they indicate the existence of the stated features, integers, steps, operations, elements or components, but do not exclude the existence or addition of one or more other features, integers, steps, operations, elements, components or combinations thereof.

[0021] In view of the technical problems that the VCUT processing detection in the prior art uses the detection pad method to detect the VCUT processing, resulting in complex processes, strict pad processing positions, and difficult removal of pad residues, this application provides a PCB board VCUT processing leak-proof molding processing detection method, please refer to the attached Figure 1 , Figure 3 , Figure 4 and Figure 5 , including the following steps: Obtain a PCB board 1, and form a metal strip 3 on a surface of the PCB board 1; A break wire groove 4 is generated on the board surface of the PCB board 1, and the break wire groove 4 is generated so that the main part of the metal strip 3 is removed; The connectivity of the remaining metal strip 3 is detected to determine whether the break line groove 4 is generated.

[0022] It can be seen that by using VCUT to perform process processing, the metal strip 3 is removed while the broken wire groove 4 is formed. The presence or absence of the broken wire groove 4 is determined by detecting the remaining condition of the metal strip 3, thereby effectively preventing omissions and effectively removing the metal strip 3. No residue will occur to affect the appearance of the PCB board 1, which greatly reduces the severity of the processing, that is, the metal strip 3 can be directly arranged on the board surface of the PCB board 1.

[0023] In a specific solution, before forming the metal strip 3, the following steps are also included: A marking line 2 is formed on the surface of the PCB board 1, and the metal strip 3 intersects with the marking; the marking line 2 is used as a cutting line to generate a break wire groove 4, and the middle part of the metal strip 3 is also removed; in the detection stage, the remaining parts at both ends of the metal strip 3 are tested for connectivity. When the circuit is on, the metal strip 3 is judged to exist, and the break wire groove 4 is judged to be not generated; when the circuit is off, the metal strip 3 is judged to not exist, and the break wire groove 4 is judged to be generated.

[0024] The marking line 2 can help the user to judge the position of the broken wire groove 4 to prevent the PCB board 1 from being cut incorrectly at an undesired cutting position; in the detection process, the electrical connection test is performed on the two ends of the metal strip 3, so that the qualification of the broken wire groove 4 can be quickly understood, which is convenient and quick, and the residual area is also smaller; in a further scheme, the removed part of the metal strip 3 occupies 80-90% of its total amount. For example, if the length of the metal strip 3 is 0.5cm, the removed part is 0.4-0.45cm, and the removed part is the width of the broken wire groove 4. By using electrical detection equipment such as a multimeter and a PCB board 1 detection machine to determine whether the remaining part of the metal strip 3 is in a pure conductive state, it can be detected whether the broken wire groove 4 is successfully opened; when the total amount of the metal strip 3 is removed to 80-90%, the remaining part can be easily used to detect the conductive state of the wire.

[0025] For another implementation, see the attached Figure 2 , Figure 3 , Figure 6 and Figure 7 : Obtain a PCB board 1, and form a metal strip 3 on a surface of the PCB board 1; A break wire groove 4 is generated on the board surface of the PCB board 1, and the break wire groove 4 is generated so that the metal strip 3 is completely removed; Check whether the remaining metal strip 3 exists to determine whether the broken wire groove 4 is generated; the continued existence of the metal strip 3 can be achieved by relying on visual detection and infrared detection solutions; in this implementation, the appearance of the PCB board 1 can be further protected and no residue will appear.

[0026] In a specific solution, before forming the metal strip 3, the following steps are also included: A marking line 2 is formed on a surface of a PCB board 1, and a metal strip 3 is overlapped and arranged on the marking line 2; The marking line 2 is used as a cutting line to generate a breaking line groove 4, and the width of the breaking line groove 4 is greater than the width of the metal strip 3; In the detection stage, the position of the metal strip 3 is detected. If a metal reaction occurs, the metal strip 3 is judged to exist, and the broken line groove 4 is judged not to be generated; if no metal reaction occurs, the metal strip 3 is judged not to exist, and the broken line groove 4 is judged to be generated; The marking line 2 can help the user to determine the position of the broken wire groove 4, thereby preventing the PCB board 1 from being cut incorrectly at an undesired cutting position. During the inspection process, the position of the metal strip 3 corresponding to the PCB board 1 is visually inspected to determine the removal of the metal strip 3. The visual inspection equipment is cheaper than the PCB board 1 inspection machine, and in this solution, the remaining part of the metal strip 3 is cleaner, further ensuring the aesthetics of the PCB board 1.

[0027] In a further scheme, before generating the broken wire groove 4, it also includes: obtaining the thickness of the PCB board 1, and calculating the groove depth of the broken wire groove 4 based on the thickness; the parameter of the groove depth is less than the thickness parameter of the PCB board 1; because the circuit layout of the PCB board 1 between each factory batch may be different, the thickness of the PCB board 1 is first measured on site to prevent poor production caused by the continuation of the thickness parameter.

[0028] In this embodiment, the groove depth is 1 / 2 of the thickness; the bottom of the broken line groove 4 is provided with multiple through holes arranged at intervals, and any through hole passes through the bottom surface of the PCB board 1; with this design, downstream users can quickly separate the sub-unit board products in the PCB board 1 into suitable sizes.

[0029] For more specific solutions, please refer to the attached Figure 8 The two relative inner walls of the broken wire groove 4 are inclined to each other, and the two inner walls can cooperate with the perforation 5 to form a good force guide, so that the subsequent user can quickly separate the sub-unit board; the material of the metal strip 3 is copper, and copper is the most widely used raw material in the production of PCB board 1. The processing equipment types are rich and complete, and can be better obtained; in a further solution, the thickness of the metal strip 3 is 0.05-0.08mm, which is within this thickness range and is easy to remove and measure later.

[0030] The advantages of the present invention are: By using VCUT to carry out process processing, the metal strips are removed while the broken wire grooves are formed. The presence of the broken wire grooves is determined by detecting the presence of the metal strips, which effectively prevents omissions and effectively removes the metal strips. No residue will affect the appearance of the PCB board surface, which greatly reduces the severity of the processing, that is, it is possible to arrange the metal strips directly on the board surface of the PCB board.

[0031] The above disclosures are only several specific embodiments of the present invention, but the present invention is not limited thereto, and any changes that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A PCB board VCUT processing leak-proof molding processing detection method, characterized in that: The following steps are involved: Obtain a PCB board, and form a metal strip on a surface of the PCB board; Generating a break line groove on the board surface of the PCB board, and the break line groove is generated so that the main part of the metal strip is removed; The connectivity of the remaining metal strip is detected to determine whether the break line groove is generated.

2. The PCB board VCUT processing leak-proof molding processing detection method according to claim 1 is characterized in that: Before forming the metal strip, the method further comprises: Forming a marking line on the board surface of the PCB board, wherein the metal strip intersects with the marking line; Using the marking line as a cutting line to generate the break, while also removing the middle portion of the metal strip; During the detection stage, the remaining parts of the two ends of the metal strip are tested for connectivity. When the circuit is on, the metal strip is judged to exist and the broken wire groove is not generated; when the circuit is off, the metal strip is judged to not exist and the broken wire groove is generated.

3. The PCB board VCUT processing leak-proof molding processing detection method according to claim 2 is characterized in that: The removed portion of the metal strip accounts for 80-90% of its total volume.

4. The PCB board VCUT processing leak-proof molding processing detection method according to claim 1 is characterized in that: Generating a break line groove on the board surface of the PCB board, and the break line groove is generated so that the metal strip is completely removed; Detecting whether the remaining metal strip exists to determine whether the break line groove is generated.

5. The PCB board VCUT processing leak-proof molding processing detection method according to claim 4 is characterized in that: Before forming the metal strip, the method further comprises: A marking line is formed on the board surface of the PCB board, and the metal strip is overlapped and arranged on the marking line; Using the marking line as a cutting line to generate the breaking line groove, the width of the breaking line groove is greater than the width of the metal strip; During the detection phase, the position of the metal strip is detected. If a metal reaction occurs, the metal strip is judged to exist and the break line groove is judged not to be generated; if no metal reaction occurs, the metal strip is judged not to exist and the break line groove is judged to be generated.

6. The PCB board VCUT processing leak-proof molding processing detection method according to any one of claims 1 or 4, characterized in that: Before generating the break line groove, it also includes: The thickness of the PCB board is obtained, and the slot depth of the break line slot is calculated based on the thickness; the parameter of the slot depth is less than the thickness parameter of the PCB board.

7. The PCB board VCUT processing leak-proof molding processing detection method according to claim 6 is characterized in that: The groove depth is 1 / 2 of the thickness; the bottom of the broken wire groove is provided with a plurality of through holes arranged at intervals, and any of the through holes passes through the bottom surface of the PCB board.

8. The PCB board VCUT processing leak-proof molding processing detection method according to claim 7 is characterized in that: The two opposite inner walls of the break line groove are inclined to each other.

9. The PCB board VCUT processing leak-proof molding processing detection method according to any one of claims 1 or 4, characterized in that: The material of the metal strip is copper.

10. The PCB board VCUT processing leak-proof molding processing detection method according to any one of claims 1 or 4, characterized in that: The thickness of the metal strip is 0.05-0.08 mm.

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