Capacitor assembly packaging structure

Abstract

The invention provides a capacitor assembly packaging structure. The capacitor assembly packaging structure comprises a first bottom end electrode structure, a second bottom end electrode structure, a capacitor assembly and an insulation packaging body. The second bottom electrode structure and the first bottom electrode structure are separated from each other. The capacitor assembly is disposed on the first bottom electrode structure and the second bottom electrode structure. The capacitor assembly includes a plurality of capacitor elements electrically connected to each other, and each capacitor element has a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package is configured to cover a plurality of capacitor elements of the capacitor assembly. Each capacitor element has a raised structure disposed on the anode portion, and the raised structure of each capacitor element can be configured to reduce the shortest vertical distance between the anode portion and the cathode portion of the capacitor element.

Description

Technical Field

[0001] The invention relates to a packaging structure, in particular to a capacitor assembly packaging structure. Background Art

[0002] Capacitors have been widely used as basic components in consumer home appliances, computer motherboards and their peripherals, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase shifting, etc., making them one of the indispensable components in electronic products. According to different materials and uses, capacitors include aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, film capacitors, etc. In the prior art, solid electrolytic capacitors have the advantages of small size, large capacitance, and superior frequency characteristics, and can be applied to the decoupling function of the power circuit of the central processing unit. Generally speaking, a solid electrolytic capacitor with high capacitance can be formed by stacking multiple capacitor units. The stacked solid electrolytic capacitor in the prior art includes multiple capacitor units and a lead frame. Each capacitor unit includes an anode portion, a cathode portion, and an insulating portion, and the insulating portion electrically insulates the anode portion and the cathode portion from each other. In particular, the cathode portions of the capacitor units are stacked on each other, and a conductive layer is provided between two adjacent capacitor units so that multiple capacitor units can be electrically connected to each other. However, the stacked capacitor in the prior art still has room for improvement. Summary of the invention

[0003] The problem to be solved by the present invention is to provide a capacitor assembly packaging structure to address the deficiencies of the prior art, so that the raised protruding structure of each capacitor element can be configured to reduce the shortest vertical distance between the positive electrode portion and the negative electrode portion of the capacitor element.

[0004] In order to solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a capacitor assembly packaging structure, which includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package. The second bottom electrode structure is separated from the first bottom electrode structure. The capacitor assembly is arranged on the first bottom electrode structure and the second bottom electrode structure, and the capacitor assembly includes a plurality of capacitor elements electrically connected to each other, each capacitor element having a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating package is configured to cover the plurality of capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure arranged on the positive electrode portion, and the raised protruding structure is arranged on at least one of the upper surface and the lower surface of the positive electrode portion; wherein the two positive electrode portions of two adjacent capacitor elements are separated from each other by the raised protruding structure, thereby reducing the shortest vertical distance between the positive electrode portion and the negative electrode portion of the capacitor element.

[0005] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide a capacitor assembly packaging structure, which includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating packaging body. The second bottom electrode structure is separated from the first bottom electrode structure. The capacitor assembly is arranged on the first bottom electrode structure and the second bottom electrode structure, and the capacitor assembly includes a plurality of capacitor elements electrically connected to each other, each capacitor element having a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure. The insulating packaging body is configured to cover the plurality of capacitor elements of the capacitor assembly. Each capacitor element has a raised protruding structure arranged on the positive electrode portion, and the raised protruding structure of each capacitor element is configured to reduce the shortest vertical distance between the positive electrode portion and the negative electrode portion of the capacitor element.

[0006] One of the beneficial effects of the present invention is that the capacitor assembly packaging structure provided by the present invention can be configured to reduce the shortest vertical distance between the positive electrode and the negative electrode of the capacitor element through the technical solution of "each capacitor element has a raised protruding structure arranged on the positive electrode portion".

[0007] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1A cross-sectional schematic diagram of a first capacitor element provided in accordance with a first embodiment of the present invention.

[0009] Figure 2 It is a partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a first embodiment of the present invention.

[0010] Figure 3 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a first embodiment of the present invention disposed on a circuit substrate.

[0011] Figure 4 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a second embodiment of the present invention.

[0012] Figure 5 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a third embodiment of the present invention.

[0013] Figure 6 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a third embodiment of the present invention disposed on a circuit substrate.

[0014] Figure 7 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a fourth embodiment of the present invention.

[0015] Figure 8 It is a partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided by a fifth embodiment of the present invention.

[0016] Fig. 9 A partial cross-sectional schematic diagram of a capacitor assembly packaging structure provided in a fifth embodiment of the present invention disposed on a circuit substrate.

[0017] Fig.10 A cross-sectional schematic diagram of a second capacitor element provided in accordance with a sixth embodiment of the present invention. DETAILED DESCRIPTION

[0018] The following is an explanation of the implementation of the "capacitor assembly packaging structure" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0019] [First embodiment]

[0020] See also Figures 1 to 3 As shown, the first embodiment of the present invention provides a capacitor component packaging structure Z (such as a solid electrolytic capacitor, but the present invention is not limited thereto), which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating packaging body 4, a first bottom electrode structure 5 (such as a first lead frame structure), a second bottom electrode structure 6 (such as a second lead frame structure), a first outermost reinforcement structure 7 (such as a first auxiliary functional structure) and a second outermost reinforcement structure 8 (such as a second auxiliary functional structure). For example, the insulating packaging body 4 includes a bottom insulating packaging layer 41 and a top insulating packaging layer 42 connected to the bottom insulating packaging layer 41, the bottom insulating packaging layer 41 can be configured to connect the first bottom electrode structure 5 and the second bottom electrode structure 6, and the top insulating packaging layer 42 can be configured to cover the capacitor component 1. Furthermore, in the process of manufacturing the capacitor component packaging structure Z, the present invention can pre-connect the bottom insulating packaging layer 41 to the first bottom electrode structure 5 and the second bottom electrode structure 6, and then stack the capacitor component 1 on the first bottom electrode structure 5 and the second bottom electrode structure 6. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0021] First, cooperate Figure 1 and Figure 2 As shown, the capacitor assembly 1 includes a plurality of capacitor elements 10 (or capacitor units) electrically connected to each other, and each capacitor element 10 has a positive electrode portion 10P (or anode portion) and a negative electrode portion 10N (or cathode portion). Further, each capacitor element 10 has a raised protruding structure 106 (or pin support structure) disposed on the positive electrode portion 10P, and the raised protruding structure 106 is disposed on at least one of the upper surface and the lower surface of the positive electrode portion 10P ( Figure 1 The raised protruding structure 106 can be disposed on the lower surface of the positive electrode portion 10P. In addition, the raised protruding structure 106 of each capacitor element 10 has a bearing plane 1060, and the bearing plane 1060 of the raised protruding structure 106 can be configured to contact the first bottom electrode structure 5 or the positive electrode portion 10P of the adjacent capacitor element 10 (i.e., the exposed pin portion of the adjacent capacitor element 10). Figure 2As shown, the two positive electrode portions 10P of two adjacent capacitor elements 10 can be separated from each other by a raised protruding structure 106 (that is, the raised protruding structure 106 is used as a spacer between the two positive electrode portions 10P of the two adjacent capacitor elements 10), thereby reducing the shortest vertical distance between the positive electrode portion 10P and the negative electrode portion 10N of the capacitor element 10 or the bending angle of the positive electrode portion 10P of the capacitor element 10 relative to the negative electrode portion 10N (that is, the raised protruding structure 106 of each capacitor element 10 can be configured to reduce the shortest vertical distance or the shortest spacing distance between the positive electrode portion 10P and the negative electrode portion 10N of the capacitor element 10, or the curvature of the bending point of the positive electrode portion 10P of the capacitor element 10). For example, a plurality of capacitor elements 10 may be stacked in sequence, and each capacitor element 10 may include a metal foil 101 (e.g., Al foil), an insulating surrounding layer 102, a conductive polymer layer 103, a carbon paste layer 104, and a silver paste layer 105. Specifically, the insulating surrounding layer 102 is disposed surroundingly on the metal foil 101, the conductive polymer layer 103 covers a portion of the metal foil 101 and contacts the insulating surrounding layer 102, the carbon paste layer 104 covers the conductive polymer layer 103 and contacts the insulating surrounding layer 102, and the silver paste layer 105 covers the carbon paste layer 104 and contacts the insulating surrounding layer 102. In addition, dielectric layers (or oxide layers) are formed on opposite surfaces of the metal foil 101, and the dielectric layers have a dielectric constant (or relative permittivity) between 5 and 300. In addition, the raised protrusion structure 106 of each capacitor element 10 can be formed on the positive electrode portion 10P by printing, coating, electroplating or any other processing method with a conductive material (such as copper, tin, silver or any conductive material). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0022] As mentioned above, it is worth noting that the height of the raised protruding structure 106 of each capacitor element 10 (that is, the height of the raised protruding structure 106 relative to the metal foil 101) can be greater than, less than, or equal to the height of the insulating surrounding layer 102 (that is, the height of the outer surrounding surface of the insulating surrounding layer 102 relative to the metal foil 101), so that the bearing plane 1060 of the raised protruding structure 106 can be aligned with or not aligned with an outer surrounding surface of the insulating surrounding layer 102. In addition, the bending angle of the positive electrode portion 10P of each capacitor element 10 relative to the insulating surrounding layer 102 can be less than 5 degrees (or in other words, the bending angle of the positive electrode portion 10P of each capacitor element 10 relative to the negative electrode portion 10N can be less than 5 degrees), for example, the bending angle can be less than any positive integer within 5 degrees. Of course, a bending angle less than 6 degrees or less than 7 degrees is also one of the selectable ranges.

[0023] As mentioned above, it is worth noting that since the raised protruding structure 106 of each capacitor element 10 can be configured to reduce the shortest vertical distance or the shortest spacing distance between the positive electrode portion 10P and the negative electrode portion 10N of the capacitor element 10, the multiple positive electrode portions 10P of the multiple capacitor elements 10 do not need to be excessively bent and pulled when they are stacked in sequence for welding, thereby avoiding the positive electrode portion 10P (i.e., the exposed pin portion) of the capacitor element 10 from causing "cracks of the exposed pin portion itself" and "cracks of the connection interface between the exposed pin portion and the insulating package body 4" due to bending the exposed pin portion, thereby preventing leakage (that is, the capacitor assembly packaging structure Z provided by the present invention can reduce leakage current). Furthermore, since the multiple positive electrode portions 10P of the multiple capacitor elements 10 do not need to be excessively bent and pulled when they are stacked in sequence for welding, the number of stacked layers of the multiple capacitor elements 10 can also be increased by about 8 to 10 layers (that is, the capacitor assembly packaging structure Z provided by the present invention can increase the capacitance).

[0024] Furthermore, cooperation Figure 1 and Figure 2As shown, the first internal conductive structure 2 electrically contacts the positive electrode portion 10P of each capacitor element 10, and the first internal conductive structure 2 has a first exposed bottom end 2000. In addition, the second internal conductive structure 3 electrically contacts the negative electrode portion 10N of each capacitor element 10, and the second internal conductive structure 3 has a second exposed bottom end 3000. More specifically, the positive electrode portion 10P of each capacitor element 10 has a side surface, and the first internal conductive structure 2 electrically contacts (for example, through conductive glue or without other additional conductive medium) the side surface of the positive electrode portion 10P of each capacitor element 10. In addition, the negative electrode portion 10N of each capacitor element 10 has a side surface, and the second internal conductive structure 3 electrically contacts (for example, through conductive glue or without other additional conductive medium) the side surface of the negative electrode portion 10N of each capacitor element 10. For example, according to different requirements, the first internal conductive structure 2 can be a prefabricated first internal conductive sheet (for example, a prefabricated copper sheet, aluminum sheet or conductive sheet made of any material) or a first inner conductive layer formed by curing (for example, a conductive material is first formed by dipping, and then the conductive material is cured to form a conductive layer, so the first internal conductive layer can be a silver layer, a copper layer or a conductive layer made of any material), and the second internal conductive structure 3 can be a prefabricated second internal conductive sheet (for example, a prefabricated copper sheet, aluminum sheet or conductive sheet made of any material) or a second inner conductive layer formed by curing (for example, a conductive material is first formed by dipping, and then the conductive material is cured to form a conductive layer, and the second internal conductive layer can be a silver layer, a copper layer or a conductive layer made of any material). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0025] In addition, if Figure 2As shown, the insulating package 4 can be configured to encapsulate the plurality of capacitor elements 10 of the capacitor assembly 1, so that the plurality of capacitor elements 10 can be completely encapsulated inside the insulating package 4, the first internal conductive structure 2 can be completely encapsulated inside the insulating package 4 except for the first exposed bottom end 2000, and the second internal conductive structure 3 can be completely encapsulated inside the insulating package 4 except for the second exposed bottom end 3000. For example, according to different requirements, the first internal conductive structure 2 can vertically or obliquely contact a top end of the first bottom electrode structure 5, and the second internal conductive structure 3 can vertically or obliquely contact a top end of the second bottom electrode structure 6. In addition, according to different requirements, the bottom insulating package layer 41 and the top insulating package layer 42 can use two identical insulating material layers or two different insulating material layers, and the insulating package 4 can be silicone resin, epoxy resin or any insulating package material. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0026] Furthermore, when the material density of the bottom insulating encapsulation layer 41 is greater than the material density of the top insulating encapsulation layer 42 (for example, the molding pressure applied when forming the bottom insulating encapsulation layer 41 is greater than the molding pressure applied when forming the top insulating encapsulation layer 42), the airtightness between the bottom insulating encapsulation layer 41 and the first bottom electrode structure 5 can be greater than the airtightness between the top insulating encapsulation layer 42 and the first bottom electrode structure 5, and the airtightness between the bottom insulating encapsulation layer 41 and the second bottom electrode structure 6 can be greater than the airtightness between the top insulating encapsulation layer 42 and the first bottom electrode structure 5. In other words, since the bonding between the bottom insulating encapsulation layer 41 and the first bottom electrode structure 5 is better, the bottom insulating encapsulation layer 41 is not likely to have material vacancies or cracks at the connection interface with the first bottom electrode structure 5. The same principle applies. Since the bonding between the bottom insulating packaging layer 41 and the second bottom electrode structure 6 is better, the bottom insulating packaging layer 41 is not likely to have material vacancies or cracks at the connection interface with the second bottom electrode structure 6, thereby improving the reliability of the capacitor assembly packaging structure Z. It is worth noting that the multiple capacitor elements 10 will not be damaged during the process of forming the bottom insulating packaging layer 41, so a larger molding pressure can be used when forming the bottom insulating packaging layer 41, but a smaller molding pressure must be used when forming the top insulating packaging layer 42 to avoid the multiple capacitor elements 10 being squeezed by the top insulating packaging layer 42 and being damaged, which may affect the electrical characteristics that the capacitor assembly packaging structure Z can provide. For example, the bottom insulating encapsulation layer 41 may be made of a material having a viscosity between 5000cps and 25000cps (e.g., any positive integer between 5000cps and 25000cps), a material curing temperature between 150°C and 200°C (e.g., any positive integer between 150°C and 200°C), and a molding pressure between 40kgf / cm 2 Up to 70kgf / cm 2 Between (e.g. between 40kgf / cm 2 Up to 70kgf / cm 2 The top insulating packaging layer 42 may be made of an insulating material having a viscosity between 5000cps and 25000cps (e.g., any positive integer between 5000cps and 25000cps), a curing temperature between 150°C and 200°C (e.g., any positive integer between 150°C and 200°C), and a molding pressure between 20kgf / cm 2 Up to 40kgf / cm 2 However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0027] In addition, if Figure 2 As shown, the first bottom electrode structure 5 and the second bottom electrode structure 6 are separated from each other by a predetermined distance, and the capacitor assembly 1 is disposed on the first bottom electrode structure 5 and the second bottom electrode structure 6, so that the positive electrode portion 10P and the negative electrode portion 10N of each capacitor element 10 are respectively electrically connected to the first bottom electrode structure 5 and the second bottom electrode structure 6. In addition, the first bottom electrode structure 5 is disposed on the bottom end 4000 of the insulating package 4 and electrically contacts the first exposed bottom end 2000 of the first internal conductive structure 2, and the second bottom electrode structure 6 is disposed on the bottom end 4000 of the insulating package 4 and electrically contacts the second exposed bottom end 3000 of the second internal conductive structure 3. For example, the first bottom electrode structure 5 has a first upper surface electroplating layer (not shown) electrically connected to the positive electrode portion 10P of the capacitor element 10 and a first lower surface electroplating layer (not shown) corresponding to the first upper surface electroplating layer (not shown), and the second bottom electrode structure 6 has a second upper surface electroplating layer (not shown) electrically connected to the negative electrode portion 10N of the capacitor element 10 and a second lower surface electroplating layer (not shown) corresponding to the second upper surface electroplating layer. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0028] Furthermore, if Figure 2As shown, the positive electrode portion 10P of each capacitor element 10 can be electrically connected to the first bottom electrode structure 5 through the first internal conductive structure 2, thereby forming a first shortest conductive path (that is, a first vertical conductive path, which is located between the positive electrode portion 10P of each capacitor element 10 and the first bottom electrode structure 5). In addition, the negative electrode portion 10N of each capacitor element 10 can be electrically connected to the second bottom electrode structure 6 through the second internal conductive structure 3, thereby forming a second shortest conductive path (that is, a second vertical conductive path, which is located between the negative electrode portion 10N of each capacitor element 10 and the second bottom electrode structure 6). It is worth noting that the first shortest conductive path does not need to pass through the first outermost reinforcement structure 7, and the second shortest conductive path does not need to pass through the second outermost reinforcement structure 8. That is to say, the first internal conductive structure 2 can be electrically connected to the first bottom electrode structure 5 without passing through the first outermost reinforcement structure 7 (or, the first shortest conductive path does not need to be laterally moved outward to the first outermost reinforcement structure 7 and then returned to the first bottom electrode structure 5), and the second internal conductive structure 3 can be electrically connected to the second bottom electrode structure 6 without passing through the second outermost reinforcement structure 8 (or, the second shortest conductive path does not need to be laterally moved outward to the second outermost reinforcement structure 8 and then returned to the second bottom electrode structure 6). For example, only the bottom surfaces of both the first bottom electrode structure 5 and the second bottom electrode structure 6 are exposed from the insulating package 4, and the second bottom electrode structure 6 extends to the vicinity of the central position of the capacitor component package structure Z, thereby enhancing the supporting force of the second bottom electrode structure 6 for the plurality of capacitor elements 10, thereby effectively increasing the overall structural strength of the capacitor component package structure Z, and the bottom of the second bottom electrode structure 6 has a recessed space that can be filled by the insulating package 4. The first bottom electrode structure 5 and the second bottom electrode structure 6 can be made of copper material, aluminum material or any conductive material. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0029] Furthermore, if Figure 2As shown, the first outermost reinforcement structure 7 is adjacent to the first bottom electrode structure 5 and is disposed on a first side surface 4001 of the insulating package body 4, and the first bottom electrode structure 5 and the first outermost reinforcement structure 7 are separated from each other by a predetermined distance (or in other words, the first bottom electrode structure 5 and the first outermost reinforcement structure 7 are not in contact with each other). In addition, the second outermost reinforcement structure 8 is adjacent to the second bottom electrode structure 6 and is disposed on a second side surface 4002 of the insulating package body 4, and the second bottom electrode structure 6 and the second outermost reinforcement structure 8 are separated from each other by a predetermined distance (or in other words, the second bottom electrode structure 6 and the second outermost reinforcement structure 8 are not in contact with each other). Further, the first outermost reinforcement structure 7 can be configured to provide a first outermost exposed surface 7000 in contact with the outside world, and the second outermost reinforcement structure 8 can be configured to provide a second outermost exposed surface 8000 in contact with the outside world. For example, the first outermost reinforcing structure 7 may be a prefabricated first outermost conductive sheet (e.g., a prefabricated copper sheet, aluminum sheet, or conductive sheet made of any material) or a first outermost conductive layer formed by curing (e.g., a conductive material is first formed by dipping, and then the conductive material is cured to form a conductive layer, so the first outermost conductive layer may be a silver layer, a copper layer, or a conductive layer made of any material), and the second outermost reinforcing structure 8 may be a prefabricated second outermost conductive sheet (e.g., a prefabricated copper sheet, aluminum sheet, or conductive sheet made of any material) or a second outermost conductive layer formed by curing (e.g., a conductive material is first formed by dipping, and then the conductive material is cured to form a conductive layer, so the second outermost conductive layer may be a silver layer, a copper layer, or a conductive layer made of any material). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0030] In addition, with Figure 2 and Figure 3 As shown, when the capacitor assembly packaging structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can be electrically connected to a first pad P101 of the circuit substrate P through a first conductive material M1 (e.g., solder ball, solder paste, or any conductive material), and the second bottom electrode structure 6 can be electrically connected to a second pad P102 of the circuit substrate P through a second conductive material M2 (e.g., solder ball, solder paste, or any conductive material). More specifically, as Figure 3As shown, when the capacitor component packaging structure Z is set on the circuit substrate P, part or all of the first outermost exposed surface 7000 of the first outermost reinforcement structure 7 can be covered by the first conductive material M1 (that is, the first conductive material M1 can pass through the first outermost exposed surface 7000 to produce a first tin creeping structure), and part or all of the second outermost exposed surface 8000 of the second outermost reinforcement structure 8 can be covered by the second conductive material M2 (that is, the second conductive material M2 can pass through the second outermost exposed surface 8000 to produce a second tin creeping structure), thereby increasing the contact area between the first outermost reinforcement structure 7 and the first conductive material M1, and increasing the contact area between the second outermost reinforcement structure 8 and the second conductive material M2.

[0031] It is worth noting that, for example, Figure 3 As shown, the first conductive material M1 can also be divided into a first conductive part (providing an electrical conduction function) "electrically connected between the first bottom electrode structure 5 and the first solder pad P101 of the circuit substrate P" and a first creeping tin part (providing a structural strengthening function) "used to cover the first outermost exposed surface 7000 of the first outermost reinforcement structure 7", and the first conductive part of the first conductive material M1 and the first creeping tin part can be separated from each other or connected to each other. In addition, the second conductive material M2 can also be divided into a second conductive part (providing an electrical conduction function) "electrically connected between the second bottom electrode structure 6 and the second solder pad P102 of the circuit substrate P" and a second creeping tin part (providing a structural strengthening function) "used to cover the second outermost exposed surface 8000 of the second outermost reinforcement structure 8", and the second conductive part and the second creeping tin part of the second conductive material M2 can be separated from each other or connected to each other. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0032] [Second embodiment]

[0033] See also Figure 4 As shown, the second embodiment of the present invention provides a capacitor assembly packaging structure Z, which includes: a capacitor assembly 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating packaging body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost reinforcement structure 7 and a second outermost reinforcement structure 8. Figure 4 and Figure 2As can be seen from the comparison, the main difference between the second embodiment and the first embodiment of the present invention is that in the second embodiment, the first internal conductive structure 2 can penetrate the plurality of positive electrode portions 10P of the plurality of capacitor elements 10, thereby electrically contacting the first bottom electrode structure 5. For example, the first internal conductive structure 2 (such as a soldering member or a soldering sheet) can be laser welded or other welding methods to penetrate the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 and electrically connected to the plurality of positive electrode portions 10P of the plurality of capacitor elements 10.

[0034] [Third embodiment]

[0035] See also Figure 5 and Figure 6 As shown, the third embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating packaging body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost reinforcement structure 7 and a second outermost reinforcement structure 8. In addition, when the capacitor component packaging structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can be electrically connected to a first pad P101 of the circuit substrate P through a first conductive material M1, and the second bottom electrode structure 6 can be electrically connected to a second pad P102 of the circuit substrate P through a second conductive material M2. Figure 5 and Figure 2 comparison, and Figure 6 and Figure 3 It can be seen from the comparison that the main difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the first bottom electrode structure 5 and the first outermost reinforcement structure 7 can be connected to each other, and the second bottom electrode structure 6 and the second outermost reinforcement structure 8 can be connected to each other.

[0036] Furthermore, if Figure 5 As shown, when the first bottom electrode structure 5 and the first outermost reinforcement structure 7 are connected to each other, the first bottom electrode structure 5 and the first outermost reinforcement structure 7 can cooperate with each other to form a first L-shaped structure (or a first L-shaped structure). In addition, when the second bottom electrode structure 6 and the second outermost reinforcement structure 8 are connected to each other, the second bottom electrode structure 6 and the second outermost reinforcement structure 8 can cooperate with each other to form a second L-shaped structure (or a second L-shaped structure).

[0037] [Fourth embodiment]

[0038] See also Figure 7As shown, the fourth embodiment of the present invention provides a capacitor assembly packaging structure Z, which includes: a capacitor assembly 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating packaging body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost reinforcement structure 7 and a second outermost reinforcement structure 8. Figure 7 and Figure 5 As can be seen from the comparison, the main difference between the fourth embodiment of the present invention and the third embodiment is that in the fourth embodiment, the first internal conductive structure 2 can penetrate the plurality of positive electrode portions 10P of the plurality of capacitor elements 10, thereby electrically contacting the first bottom electrode structure 5. For example, the first internal conductive structure 2 (such as a soldering member or a soldering sheet) can be laser welded or other welding methods to penetrate the plurality of positive electrode portions 10P of the plurality of capacitor elements 10 and electrically connected to the plurality of positive electrode portions 10P of the plurality of capacitor elements 10.

[0039] [Fifth embodiment]

[0040] See also Figure 8 and Fig. 9 As shown, the fifth embodiment of the present invention provides a capacitor component packaging structure Z, which includes: a capacitor component 1, a first internal conductive structure 2, a second internal conductive structure 3, an insulating packaging body 4, a first bottom electrode structure 5, a second bottom electrode structure 6, a first outermost reinforcement structure 7 and a second outermost reinforcement structure 8. In addition, when the capacitor component packaging structure Z is disposed on a circuit substrate P, the first bottom electrode structure 5 can be electrically connected to a first welding pad P101 of the circuit substrate P through a first conductive material M1, and the second bottom electrode structure 6 can be electrically connected to a second welding pad P102 of the circuit substrate P through a second conductive material M2. Figure 8 and Figure 5 comparison, and Fig. 9 and Figure 6 It can be seen from the comparison that the main difference between the fifth embodiment and the third embodiment of the present invention is that in the fifth embodiment, neither the first outermost reinforcement structure 7 nor the second outermost reinforcement structure 8 extends to a top end 4003 of the insulating package 4.

[0041] Furthermore, if Figure 8As shown, the first bottom electrode structure 5 and the first outermost reinforcement structure 7 can be connected to each other to form a first end structure U1. For example, the first end structure U1 can include a first internal conductive layer U101 covering a first portion of the insulating package body 4, a first intermediate conductive layer U102 covering the first internal conductive layer U101, and a first external conductive layer U103 covering the first intermediate conductive layer U102. In addition, the first internal conductive layer U101 can be at least one of the Ag layer and the Cu layer, the first intermediate conductive layer U102 can be a Ni layer, and the first external conductive layer U103 can be a Sn layer. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0042] Furthermore, if Figure 8 As shown, the second bottom electrode structure 6 and the second outermost reinforcement structure 8 can be connected to each other to form a second end structure U2. For example, the second end structure U2 can include a second inner conductive layer U201 covering a second portion of the insulating package body 4, a second middle conductive layer U202 covering the second inner conductive layer U201, and a second outer conductive layer U203 covering the second middle conductive layer U202. In addition, the second inner conductive layer U201 can be at least one of the Ag layer and the Cu layer, the second middle conductive layer U202 can be a Ni layer, and the second outer conductive layer U203 can be a Sn layer. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0043] [Sixth embodiment]

[0044] See also Fig.10 As shown, the sixth embodiment of the present invention provides another capacitor element 10, and the raised protruding structure 106 of the capacitor element 10 can be disposed on the upper surface of the positive electrode portion 10P. Therefore, according to different requirements, the raised protruding structure 106 of the capacitor element 10 can be disposed on at least one of the upper surface and the lower surface of the positive electrode portion 10P (such as Figure 1 or Fig.10 As shown), or the raised protruding structure 106 of the capacitor element 10 can also be set on the upper surface and the lower surface of the positive electrode part 10P at the same time.

[0045] [Beneficial Effects of Embodiments]

[0046] One of the beneficial effects of the present invention is that the capacitor assembly packaging structure Z provided by the present invention can be configured to reduce the shortest vertical distance between the positive electrode portion 10P and the negative electrode portion 10N of the capacitor element 10 through the technical solution of "each capacitor element 10 has a raised protruding structure 106 arranged on the positive electrode portion 10P".

[0047] Furthermore, the present invention provides a capacitor component packaging structure Z, which can be achieved through the technical solutions of "the second bottom electrode structure 6 and the first bottom electrode structure 5 are separated from each other", "the insulating packaging body 4 includes a bottom insulating packaging layer 41 and a top insulating packaging layer 42 connected to the bottom insulating packaging layer 41", "the bottom insulating packaging layer 41 is configured to connect the first bottom electrode structure 5 and the second bottom electrode structure 6" and "the top insulating packaging layer 42 is configured to cover the capacitor component 1", so that either the first bottom electrode structure 5 and the second bottom electrode structure 6 and the capacitor component 1 can respectively cooperate with insulating packaging materials with different forming conditions (for example, the bottom insulating packaging layer 41 and the top insulating packaging layer 42 with different material densities).

[0048] Furthermore, the present invention provides a capacitor assembly packaging structure Z, which can be achieved through "the first internal conductive structure 2 electrically contacts the positive electrode portion 10P of each capacitor element 10, and the first internal conductive structure 2 has a first exposed bottom end 2000", "the second internal conductive structure 3 electrically contacts the negative electrode portion 10N of each capacitor element 10, and the second internal conductive structure 3 has a second exposed bottom end 3000", "the first bottom electrode structure 5 is arranged on the bottom end 4000 of the insulating package body 4 and electrically contacts the first exposed bottom end 2000 of the first internal conductive structure 2", "the second bottom electrode structure 6 is arranged on the bottom end 4000 of the insulating package body 4 and electrically contacts the second exposed bottom end 3000 of the second internal conductive structure 3", "the first outermost reinforcement structure 7 is adjacent to the first bottom The technical scheme of "the second outermost reinforcement structure 8 is adjacent to the second bottom electrode structure 6 and is arranged on a second side 4002 of the insulating package 4" is adopted, so that the positive electrode portion 10P of each capacitor element 10 can be electrically connected to the first bottom electrode structure 5 through the first internal conductive structure 2 (thereby forming a first shortest conductive path between the positive electrode portion 10P of each capacitor element 10 and the first bottom electrode structure 5), and the negative electrode portion 10N of each capacitor element 10 can be electrically connected to the second bottom electrode structure 6 through the second internal conductive structure 3 (thereby forming a second shortest conductive path between the negative electrode portion 10N of each capacitor element 10 and the second bottom electrode structure 6).

[0049] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.

Claims

1. A capacitor assembly packaging structure, characterized in that: The capacitor assembly packaging structure comprises: a first bottom electrode structure; a second bottom electrode structure, the second bottom electrode structure being separated from the first bottom electrode structure; a capacitor assembly, the capacitor assembly being disposed on the first bottom electrode structure and the second bottom electrode structure, the capacitor assembly comprising a plurality of capacitor elements electrically connected to each other, each of the capacitor elements having a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure; and an insulating package body, the insulating package body being configured to enclose a plurality of capacitor elements of the capacitor assembly; Each of the capacitor elements has a raised protruding structure disposed on the positive electrode portion, and the raised protruding structure is disposed on at least one of the upper surface and the lower surface of the positive electrode portion; The two positive electrode portions of two adjacent capacitor elements are separated from each other by the raised protruding structure, so as to reduce the shortest vertical distance between the positive electrode portion and the negative electrode portion of the capacitor element.

2. The capacitor assembly packaging structure according to claim 1, characterized in that: The capacitor assembly packaging structure further includes: a first internal conductive structure, the first internal conductive structure electrically contacts the positive electrode portion of each of the capacitor elements, the first internal conductive structure having a first exposed bottom end; a second internal conductive structure, the second internal conductive structure electrically contacting the negative electrode portion of each of the capacitor elements, the second internal conductive structure having a second exposed bottom end; a first outermost reinforcement structure, the first outermost reinforcement structure being adjacent to the first bottom electrode structure and disposed on a first side surface of the insulating package; and a second outermost reinforcement structure, the second outermost reinforcement structure being adjacent to the second bottom electrode structure and disposed on a second side surface of the insulating package; wherein the first bottom electrode structure is disposed on the bottom of the insulating package and electrically contacts the first exposed bottom of the first internal conductive structure, and the second bottom electrode structure is disposed on the bottom of the insulating package and electrically contacts the second exposed bottom of the second internal conductive structure; wherein the insulating package is configured to cover the first internal conductive structure and the second internal conductive structure; wherein the positive electrode portion of each of the capacitor elements is electrically connected to the first bottom electrode structure through the first internal conductive structure, so that a first shortest conductive path is formed between the positive electrode portion of each of the capacitor elements and the first bottom electrode structure; wherein the negative electrode portion of each of the capacitor elements is electrically connected to the second bottom electrode structure through the second internal conductive structure, so that a second shortest conductive path is formed between the negative electrode portion of each of the capacitor elements and the second bottom electrode structure; Wherein, the first shortest conductive path does not need to pass through the first outermost reinforcement structure, and the second shortest conductive path does not need to pass through the second outermost reinforcement structure; The first outermost reinforcement structure is configured to provide a first outermost exposed surface in contact with the outside, and the second outermost reinforcement structure is configured to provide a second outermost exposed surface in contact with the outside.

3. The capacitor assembly packaging structure according to claim 2, characterized in that: Each of the capacitor elements comprises a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, wherein the insulating surrounding layer is disposed surroundingly on the metal foil, the conductive polymer layer covers a portion of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue layer completely covers the carbon glue layer and contacts the insulating surrounding layer; The positive electrode portion of each capacitor element has a side surface, and the first internal conductive structure electrically contacts the side surface of the positive electrode portion of each capacitor element; The negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure electrically contacts the side surface of the negative electrode portion of each capacitor element; Among them, multiple capacitor elements are completely enclosed inside the insulating package, the first internal conductive structure is completely enclosed inside the insulating package except the first exposed bottom end, and the second internal conductive structure is completely enclosed inside the insulating package except the second exposed bottom end.

4. The capacitor assembly packaging structure according to claim 2, characterized in that: Each of the capacitor elements comprises a metal foil, an insulating surrounding layer, a conductive polymer layer, a carbon glue layer and a silver glue layer, wherein the insulating surrounding layer is disposed surroundingly on the metal foil, the conductive polymer layer covers a portion of the metal foil and contacts the insulating surrounding layer, the carbon glue layer completely covers the conductive polymer layer and contacts the insulating surrounding layer, and the silver glue layer completely covers the carbon glue layer and contacts the insulating surrounding layer; Wherein, the first internal conductive structure metal foil penetrates through the plurality of positive electrode portions of the plurality of capacitor elements to electrically contact the first bottom electrode structure; The negative electrode portion of each capacitor element has a side surface, and the second internal conductive structure electrically contacts the side surface of the negative electrode portion of each capacitor element; Among them, multiple capacitor elements are completely enclosed inside the insulating package, the first internal conductive structure is completely enclosed inside the insulating package except the first exposed bottom end, and the second internal conductive structure is completely enclosed inside the insulating package except the second exposed bottom end.

5. The capacitor assembly packaging structure according to claim 2, characterized in that: The first bottom electrode structure and the first outermost reinforcement structure are connected to each other or separated from each other by a predetermined distance, and the second bottom electrode structure and the second outermost reinforcement structure are connected to each other or separated from each other by a predetermined distance; Wherein, when the first bottom electrode structure and the first outermost reinforcement structure are connected to each other, the first bottom electrode structure and the first outermost reinforcement structure cooperate with each other to form a first L-shaped structure; Wherein, when the second bottom electrode structure and the second outermost reinforcement structure are connected to each other, the second bottom electrode structure and the second outermost reinforcement structure cooperate with each other to form a second L-shaped structure; wherein the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure; wherein the first internal conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcement structure, and the second internal conductive structure does not need to be electrically connected to the second bottom electrode structure through the second outermost reinforcement structure; The first internal conductive structure is a prefabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a prefabricated second internal conductive sheet or a second inner conductive layer formed by curing; The first outermost reinforcement structure is a prefabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforcement structure is a prefabricated second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor assembly packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is arranged on the circuit substrate, part or all of the first outermost exposed surface of the first outermost reinforcement structure is covered by the first conductive material, and part or all of the second outermost exposed surface of the second outermost reinforcement structure is covered by the second conductive material, so as to increase the contact area between the first outermost reinforcement structure and the first conductive material, and increase the contact area between the second outermost reinforcement structure and the second conductive material.

6. The capacitor assembly packaging structure according to claim 2, characterized in that: Neither the first outermost reinforcement structure nor the second outermost reinforcement structure extends to a top end of the insulating package; The first bottom electrode structure and the first outermost reinforcement structure are connected to each other to form a first end structure; The second bottom electrode structure and the second outermost reinforcement structure are connected to each other to form a second end structure; wherein the first end structure comprises a first inner conductive layer covering a first portion of the insulating package, a first middle conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first middle conductive layer, and the second end structure comprises a second inner conductive layer covering a second portion of the insulating package, a second middle conductive layer covering the second inner conductive layer, and a second outer conductive layer covering the second middle conductive layer; The first inner conductive layer and the second inner conductive layer are both at least one of an Ag layer and a Cu layer, the first intermediate conductive layer and the second intermediate conductive layer are both Ni layers, and the first outer conductive layer and the second outer conductive layer are both Sn layers; wherein the first internal conductive structure vertically or obliquely contacts a top end of the first bottom electrode structure, and the second internal conductive structure vertically or obliquely contacts a top end of the second bottom electrode structure; wherein the first internal conductive structure does not need to be electrically connected to the first bottom electrode structure through the first outermost reinforcement structure, and the second internal conductive structure does not need to be electrically connected to the second bottom electrode structure through the second outermost reinforcement structure; The first internal conductive structure is a prefabricated first internal conductive sheet or a first inner conductive layer formed by curing, and the second internal conductive structure is a prefabricated second internal conductive sheet or a second inner conductive layer formed by curing; The first outermost reinforcement structure is a prefabricated first outermost conductive sheet or a first outermost conductive layer formed by curing, and the second outermost reinforcement structure is a prefabricated second outermost conductive sheet or a second outermost conductive layer formed by curing; Wherein, when the capacitor assembly packaging structure is disposed on a circuit substrate, the first bottom electrode structure is electrically connected to a first pad of the circuit substrate through a first conductive material, and the second bottom electrode structure is electrically connected to a second pad of the circuit substrate through a second conductive material; Wherein, when the capacitor component packaging structure is arranged on the circuit substrate, part or all of the first outermost exposed surface of the first outermost reinforcement structure is covered by the first conductive material, and part or all of the second outermost exposed surface of the second outermost reinforcement structure is covered by the second conductive material, so as to increase the contact area between the first outermost reinforcement structure and the first conductive material, and increase the contact area between the second outermost reinforcement structure and the second conductive material.

7. The capacitor assembly packaging structure according to claim 1, characterized in that: The insulating package body comprises a bottom insulating package layer and a top insulating package layer connected to the bottom insulating package layer, wherein the bottom insulating package layer is configured to connect the first bottom electrode structure and the second bottom electrode structure, and the top insulating package layer is configured to cover the capacitor component; Wherein, the bottom insulating packaging layer and the top insulating packaging layer are two identical insulating material layers or two different insulating material layers; Wherein, the material density of the bottom insulating packaging layer is greater than the material density of the top insulating packaging layer; Wherein, the air tightness between the bottom insulating packaging layer and the first bottom electrode structure is greater than the air tightness between the top insulating packaging layer and the first bottom electrode structure; Wherein, the airtightness between the bottom insulating packaging layer and the second bottom electrode structure is greater than the airtightness between the top insulating packaging layer and the first bottom electrode structure; The bottom insulating encapsulation layer is made of a material having a viscosity between 5000cps and 25000cps, a curing temperature between 150°C and 200°C, and a molding pressure between 40kgf / cm 2 Up to 70kgf / cm 2 Made of insulating material between; The top insulating packaging layer is made of a material having a viscosity between 5000cps and 25000cps, a curing temperature between 150°C and 200°C, and a molding pressure between 20kgf / cm 2 Up to 40kgf / cm 2 Made of insulating material between; Wherein, the raised protruding structure of each capacitor element has a bearing plane, and the bearing plane of the raised protruding structure is configured to contact the first bottom electrode structure or the positive electrode portion of the adjacent capacitor element; Each of the capacitor elements includes an insulating surrounding layer, and the height of the raised protruding structure of each of the capacitor elements is greater than, less than or equal to the height of the insulating surrounding layer, so that the bearing plane of the raised protruding structure and an outer surrounding surface of the insulating surrounding layer are aligned or not aligned with each other; Wherein, the bending angle of the positive electrode portion of each capacitor element relative to the insulating surrounding layer is less than 5 degrees.

8. A capacitor assembly packaging structure, characterized in that: The capacitor assembly packaging structure comprises: a first bottom electrode structure; a second bottom electrode structure, the second bottom electrode structure being separated from the first bottom electrode structure; a capacitor assembly, the capacitor assembly being disposed on the first bottom electrode structure and the second bottom electrode structure, the capacitor assembly comprising a plurality of capacitor elements electrically connected to each other, each of the capacitor elements having a positive electrode portion electrically connected to the first bottom electrode structure and a negative electrode portion electrically connected to the second bottom electrode structure; and an insulating package body, the insulating package body being configured to enclose a plurality of capacitor elements of the capacitor assembly; Each of the capacitor elements has a raised protruding structure disposed on the positive electrode portion, and the raised protruding structure of each of the capacitor elements is configured to reduce the shortest vertical distance between the positive electrode portion and the negative electrode portion of the capacitor element.

9. The capacitor assembly packaging structure according to claim 8, characterized in that: The capacitor assembly packaging structure further includes: a first internal conductive structure, the first internal conductive structure electrically contacts the positive electrode portion of each of the capacitor elements, the first internal conductive structure having a first exposed bottom end; a second internal conductive structure, the second internal conductive structure electrically contacting the negative electrode portion of each of the capacitor elements, the second internal conductive structure having a second exposed bottom end; a first outermost reinforcement structure, the first outermost reinforcement structure being adjacent to the first bottom electrode structure and disposed on a first side surface of the insulating package; and a second outermost reinforcement structure, the second outermost reinforcement structure being adjacent to the second bottom electrode structure and disposed on a second side surface of the insulating package; wherein the first bottom electrode structure is disposed on the bottom of the insulating package and electrically contacts the first exposed bottom of the first internal conductive structure, and the second bottom electrode structure is disposed on the bottom of the insulating package and electrically contacts the second exposed bottom of the second internal conductive structure; wherein the insulating package is configured to cover the first internal conductive structure and the second internal conductive structure; wherein the positive electrode portion of each of the capacitor elements is electrically connected to the first bottom electrode structure through the first internal conductive structure, so that a first shortest conductive path is formed between the positive electrode portion of each of the capacitor elements and the first bottom electrode structure; wherein the negative electrode portion of each of the capacitor elements is electrically connected to the second bottom electrode structure through the second internal conductive structure, so that a second shortest conductive path is formed between the negative electrode portion of each of the capacitor elements and the second bottom electrode structure; Wherein, the first shortest conductive path does not need to pass through the first outermost reinforcement structure, and the second shortest conductive path does not need to pass through the second outermost reinforcement structure; The first outermost reinforcement structure is configured to provide a first outermost exposed surface in contact with the outside, and the second outermost reinforcement structure is configured to provide a second outermost exposed surface in contact with the outside.

10. The capacitor assembly packaging structure according to claim 8, characterized in that: The insulating package body comprises a bottom insulating package layer and a top insulating package layer connected to the bottom insulating package layer, wherein the bottom insulating package layer is configured to connect the first bottom electrode structure and the second bottom electrode structure, and the top insulating package layer is configured to cover the capacitor component; Wherein, the bottom insulating packaging layer and the top insulating packaging layer are two identical insulating material layers or two different insulating material layers; Wherein, the material density of the bottom insulating packaging layer is greater than the material density of the top insulating packaging layer; Wherein, the air tightness between the bottom insulating packaging layer and the first bottom electrode structure is greater than the air tightness between the top insulating packaging layer and the first bottom electrode structure; Wherein, the airtightness between the bottom insulating packaging layer and the second bottom electrode structure is greater than the airtightness between the top insulating packaging layer and the first bottom electrode structure; The bottom insulating encapsulation layer is made of a material having a viscosity between 5000cps and 25000cps, a curing temperature between 150°C and 200°C, and a molding pressure between 40kgf / cm 2 Up to 70kgf / cm 2 Made of insulating material between; The top insulating packaging layer is made of a material having a viscosity between 5000cps and 25000cps, a curing temperature between 150°C and 200°C, and a molding pressure between 20kgf / cm 2 Up to 40kgf / cm 2 Made of insulating material between; The raised protruding structure of each capacitor element has a bearing plane, and the bearing plane of the raised protruding structure is configured to contact the first bottom electrode structure or the positive electrode portion of the adjacent capacitor element; Each of the capacitor elements includes an insulating surrounding layer, and the height of the raised protruding structure of each of the capacitor elements is greater than, less than or equal to the height of the insulating surrounding layer, so that the bearing plane of the raised protruding structure and an outer surrounding surface of the insulating surrounding layer are aligned or not aligned with each other; Wherein, the bending angle of the positive electrode portion of each capacitor element relative to the insulating surrounding layer is less than 5 degrees.

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