Substrate transfer apparatus and substrate processing apparatus

Abstract

The invention provides a substrate conveying device which can grasp the shape of a substrate so as to avoid bad conditions caused by the shape of the substrate. A substrate transport device is provided with a sensor holding member (21) that is separate from an acquisition hand (11a) for transporting a substrate (W), the sensor holding member (21) having a first sensor (41) and a second sensor (42). According to the present invention, when a first substrate in a carrier is to be transported, a sensor holding member (21) is first brought into a space between the first substrate and a second substrate. The distance between the first substrate and the second substrate is then measured. When the acquisition hand part (11a) enters between the first substrate and the second substrate, the entering height of the acquisition hand part (11a) is adjusted so that the gap between the acquisition hand part (11a) and the first substrate and the gap between the acquisition hand part (11a) and the second substrate are both greater than a predetermined value.

Description

Technical Field

[0001] The present invention relates to a substrate transporting device and a substrate processing device for transporting various substrates such as semiconductor substrates, substrates for liquid crystal displays, FPD (Flat Panel Display) substrates such as organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. Background Art

[0002] The substrate processing device described in Patent Document 1 includes a stage on which a carrier capable of stacking and storing substrates with gaps therebetween is placed, and a substrate transport device that transports the substrate from the carrier. The substrate processing device of Patent Document 1 includes a mapping sensor that detects the form in which the substrate is stacked on the carrier. The mapping sensor generates mapping data that is referenced when the substrate is transported from the carrier.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-72384 Summary of the invention

[0006] The existing substrate transport device can only know the distribution of the substrates in the carrier, that is, which part of the carrier the substrate has entered, but cannot know the width of the gap between the upper and lower substrates caused by the shape of the substrate, specifically the thickness or warping of the substrate. If the substrate is transported without considering the shape of the substrate, the substrate transport hand may come into contact with the substrate.

[0007] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a substrate transporting device that can grasp the shape of a substrate to avoid a problem caused by the shape of the substrate.

[0008] The present invention adopts the following configuration in order to solve the above-mentioned problems.

[0009] That is, the present invention is a substrate transport device, characterized in that it includes:

[0010] A hand that holds and transports substrates one by one by entering between upper and lower adjacent substrates from a carrier that stores a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction, wherein an opening for taking out and storing substrates is provided on one side of the carrier;

[0011] a sensor holding member that enters between upper and lower adjacent substrates and includes a first sensor for measuring the distance to the upper substrate and a second sensor for measuring the distance to the lower substrate; and

[0012] a control unit configured to control the hand and the sensor holding member so as to move forward and backward from the opening of the carrier relative to the upper and lower adjacent substrates,

[0013] The control unit causes the sensor holding member to enter between a first substrate to be conveyed and a second substrate located below the first substrate, and measures the minimum distance between the substrates based on the sum of a first minimum distance and a second minimum distance, wherein the first minimum distance is the distance between the first sensor and the substrate at a first measurement position closest to the first substrate, and the second minimum distance is the distance between the second sensor and the substrate at a second measurement position closest to the second substrate.

[0014] When the control unit causes the hand to enter between the first substrate and the second substrate, the control unit adjusts the entry height of the hand according to the minimum distance between the substrates so that the distance from the hand to the first substrate and the distance from the hand to the second substrate are both above a specified value.

[0015] [Function / Effect] The above-mentioned substrate conveying device and the hand for conveying the substrate separately include a sensor holding component having a first sensor and a second sensor. When it is desired to convey the first substrate in the carrier, according to the present invention, the sensor holding component is first allowed to enter between the first substrate and the second substrate. Then the distance between the first substrate and the second substrate is measured. Since the loading position of the substrate on the carrier is determined, the distance between the first substrate and the second substrate should be fixed. However, in reality, the first substrate and the second substrate are not necessarily flat. Therefore, when the distance between the first substrate and the second substrate is actually measured, the minimum distance between the substrates is larger or smaller than expected. At the same time, the middle position between the substrates is higher or lower than expected.

[0016] According to the present invention, when the hand is inserted between the first substrate and the second substrate, the insertion height of the hand is adjusted so that the gap between the hand and the first substrate and the gap between the hand and the second substrate are both greater than a specified value. With this configuration, since the hand is too close to the first substrate, the hand will not contact the portion other than the edge of the first substrate. Similarly, since the hand is too close to the second substrate, the hand will not contact the portion other than the edge of the second substrate.

[0017] Preferably, in the above-mentioned substrate transport device,

[0018] The front end of the hand is provided with a guide member for the end of the substrate to abut against.

[0019] The first sensor and the second sensor are provided at the front end portion of the sensor holding member.

[0020] The thickness of the front end portion of the sensor holding member in the height direction is smaller than the thickness of the front end portion of the hand in the height direction.

[0021] [Function / Effect] In the above-mentioned structure, the thickness of the front end of the sensor holding member composed of the first sensor and the second sensor is smaller than the thickness of the front end of the hand composed of the guide member. With this structure, the sensor holding member can enter even between substrates that the hand cannot enter, and the minimum distance between the substrates can be reliably measured.

[0022] Preferably, in the above-mentioned substrate transport device,

[0023] The first sensor measures the distance while moving from the end of the first substrate located at the opening of the carrier toward the inner side of the carrier.

[0024] The second sensor measures the distance while moving from the end of the second substrate located at the opening of the carrier toward the inner side of the carrier.

[0025] The control unit adjusts the entry height of the hand so that at the first measuring position where the first substrate is closest to the first sensor and at the second measuring position where the second substrate is closest to the second sensor, the distance from the hand to the first substrate and the distance from the hand to the second substrate are both above a specified value.

[0026] [Function / Effect] In the above-mentioned structure, the entry height of the hand is adjusted so that the gap between the hand and the first substrate and the gap between the hand and the second substrate are both greater than the specified value at the position where the first substrate and the second substrate are closest. With this structure, the hand will not contact the substrates at the position where the first substrate and the second substrate are closest.

[0027] Preferably, in the above-mentioned substrate transport device,

[0028] The control unit adjusts the entry height of the hand so that a distance from the hand to the first substrate at the first measurement position is equal to a distance from the hand to the second substrate at the second measurement position.

[0029] [Function / Effect] In the above-mentioned structure, the entry height of the hand is adjusted so that the gap between the hand and the first substrate is the same as the gap between the hand and the second substrate. With this structure, a sufficient distance can be ensured not only between the hand and the first substrate but also between the hand and the second substrate for conveying the substrate, so that the hand can convey the substrate more reliably.

[0030] Preferably, in the above-mentioned substrate transport device,

[0031] The sensor holding member does not transport the substrate.

[0032] [Function / Effect] In the above-mentioned structure, the sensor holding member does not transport the substrate. With this structure, it is not necessary to provide a guide member for holding the substrate on the sensor holding member, and the sensor holding member can easily enter between the substrates.

[0033] Preferably, in the above-mentioned substrate transport device,

[0034] When the distance between the first substrate and the second substrate is short and the distance from the hand to the first substrate at the first measurement position and the distance from the hand to the second substrate at the second measurement position cannot be simultaneously greater than the specified value, the hand is inserted between the first substrate and the second substrate.

[0035] [Function / Effect] In the above configuration, when the distance between the first substrate and the second substrate is short and the gap between the hand and the first substrate and the gap between the hand and the second substrate cannot be made equal to or greater than the specified value at the same time, it is determined that the first substrate cannot be conveyed and the hand will not enter between the first substrate and the second substrate. With this configuration, it is possible to more reliably suppress the contact between the hand and the substrate other than the edge.

[0036] Preferably, in the above-mentioned substrate transport device,

[0037] The upper surface of the sensor holding member is located above the lower end of the first sensor.

[0038] A lower surface of the sensor holding member is located below an upper end of the second sensor.

[0039] [Function / Effect] In the above configuration, the protrusion amount of the first sensor and the second sensor can be reduced according to the thickness of the sensor holding member. Therefore, the height of the sensor holding member can be suppressed as much as possible, and the possibility that the sensor holding member cannot enter between the substrates is reduced.

[0040] In the above-mentioned substrate transport device, it is characterized in that:

[0041] The hand includes a first holding body for holding one end of the substrate and a second holding body for holding the other end of the substrate.

[0042] The sensor holding member includes at least two sensor groups consisting of the first sensor and the second sensor.

[0043] The first sensor group measures the distance between the first substrate and the second substrate at the entry position of the first holding body.

[0044] The second sensor group measures the distance between the first substrate and the second substrate at the entry position of the second holding body.

[0045] [Function / Effect] In the above configuration, the first sensor group for measuring the minimum distance between substrates at the position of the first holding body of the hand is provided on the sensor holding member, and the second sensor group for measuring the minimum distance between substrates at the position of the second holding body of the hand is provided on the sensor holding member. This configuration can more reliably avoid contact between the hand and the portion other than the edge of the substrate.

[0046] In the above-mentioned substrate transport device, it is characterized in that:

[0047] The sensor holding member includes a first protrusion extending corresponding to the first holding body and a second protrusion extending corresponding to the second holding body.

[0048] [Function / Effect] In the above configuration, the sensor holding member includes a first protrusion extending in the first direction corresponding to the first holding body and a second protrusion extending in the first direction corresponding to the second holding body. By making the shape of the sensor holding member similar to the hand in this way, information on the distance required for conveyance can be obtained more reliably.

[0049] Preferably, in the above-mentioned substrate transport device,

[0050] The sensor holding member includes the sensor group at the front end of the first protrusion, and includes the sensor group at the front end of the second protrusion.

[0051] [Function / Effect] In the above-mentioned structure, the sensor holding member has a sensor group at the front end of the first protrusion and a sensor group at the front end of the second protrusion. With this structure, the minimum distance between substrates in the deep part (inside) of the carrier can be measured by a slight movement of the sensor holding member.

[0052] Preferably, in the above-mentioned substrate transport device,

[0053] The sensor holding member includes the first sensor and the second sensor at the same position of the first protrusion.

[0054] The first sensor and the second sensor are provided at the same position of the second protrusion.

[0055] [Function / Effect] In the above-mentioned structure, the sensor holding component includes the first sensor and the second sensor at the same position of the first protrusion with respect to the first direction. In addition, the sensor holding component includes the first sensor and the second sensor at the same position of the second protrusion. With this structure, the substrate (first substrate) on the upper side of the sensor holding component and the substrate (second substrate) on the lower side of the sensor holding component can be measured under the same conditions, so the minimum distance between the substrates can be calculated more accurately.

[0056] Preferably, in the above-mentioned substrate transport device,

[0057] When the distance between the first substrate and the second substrate is short and the sensor holding member cannot be inserted between the first substrate and the second substrate, the control unit causes the hand to enter between the first substrate and the second substrate.

[0058] [Function / Effect] In the above configuration, when the distance between the first substrate and the second substrate is short and the sensor holding member cannot enter between the first substrate and the second substrate, it is determined that the first substrate cannot be conveyed, and the hand is not allowed to enter between the first substrate and the second substrate. With this configuration, it is possible to more reliably prevent the hand from contacting the portion other than the edge of the substrate.

[0059] Preferably, in the above-mentioned substrate transport device,

[0060] The control unit controls the hand to transport the first substrate when the first substrate remains in the carrier after the second substrate is transported from the carrier.

[0061] [Function / Effect] In the above configuration, after the second substrate is transferred from the carrier, if the first substrate previously determined to be untransferable remains in the carrier, the hand transfers the first substrate. With this configuration, the first substrate will not remain in the carrier.

[0062] Preferably, in the above-mentioned substrate transport device,

[0063] The control unit causes the sensor holding member to enter between the first substrate and the second substrate at a first speed,

[0064] The hand is caused to enter between the first substrate and the second substrate at a second speed that is faster than the first speed.

[0065] [Function / Effect] In the above-mentioned structure, since the sensor holding member enters between the substrates at a faster speed than the hand, the effect of speeding up the substrate transfer process can be achieved.

[0066] Preferably, in the above-mentioned substrate transport device,

[0067] The sensor holding member is located at the same position as the hand before entering between the substrates.

[0068] [Function / Effect] In the above-mentioned structure, the sensor holding member is located at the same position as the hand before entering the substrate space. With this structure, the present invention can be realized by using a single robot separately using the hand and the sensor holding member.

[0069] Preferably, in the above-mentioned substrate transport device,

[0070] The hand also serves as the sensor holding member,

[0071] The first sensor and the second sensor are mounted on the hand.

[0072] [Function / Effect] In the above-mentioned structure, the sensor group is provided at the front end of the hand body relative to the guide member. By adopting such a structure, the sensor holding member can be omitted and a substrate transport device with a simple structure can be provided.

[0073] This specification discloses the following inventions in addition to the above-mentioned inventions.

[0074] That is, the present invention is a substrate transport device, characterized in that it includes:

[0075] A first hand for high-speed transport, which transports substrates one by one from a carrier, the carrier storing a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction;

[0076] a second hand for low-speed transport, which transports substrates one by one from a carrier that stores a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction; and

[0077] The control unit controls the first hand or the second hand so as to move forward and backward relative to the substrate in a first direction.

[0078] [Function / Effect] The substrate transport device has two hands, a first hand for high-speed transport and a second hand for low-speed transport, and is provided with a control unit for separately using the first hand and the second hand to transport the substrate. By configuring in this way, when the shape of the substrate is close to flat, the first hand can be used to transport it at a high speed, and when the warping of the substrate is large, the second hand can be used to transport it at a low speed. In other words, according to the substrate transport device of the present invention, the substrate can be transported in a method that is more in line with the actual situation of the substrate accommodated in the carrier.

[0079] In the above-mentioned substrate transport device, it is characterized in that:

[0080] The first hand has a first guide member at the front end thereof for contacting the end of the substrate.

[0081] The front end of the second hand is provided with a second guide member for the end of the substrate to abut against.

[0082] The thickness of the front end portion of the second hand in the height direction is smaller than the thickness of the front end portion of the first hand in the height direction.

[0083] [Function / Effect] According to the above configuration, the thickness of the front end of the second hand in the height direction is smaller than the thickness of the front end of the first hand in the height direction. With this configuration, even when the warp of the substrate is large and the minimum distance between the substrates is shortened, the second hand can be used to more reliably transport the substrate to be transported.

[0084] In the above-mentioned substrate transport device, it is characterized in that:

[0085] The first hand includes a first holding body that holds one end of the substrate and extends in a first direction, and a second holding body that holds the other end of the substrate and extends in the first direction.

[0086] The second hand includes a first blade that holds one end of the substrate and extends in the first direction, and a second blade that holds the other end of the substrate and extends in the first direction.

[0087] The space between the first holding body and the second holding body is smaller than the space between the first blade and the second blade.

[0088] [Function / Effect] According to the above-mentioned structure, the space between the first holding body and the second holding body in the first hand is smaller than the space between the first blade and the second blade in the second hand. By configuring in this way, the first hand can hold the substrate more reliably, so that the substrate can be transported at a high speed. On the other hand, the second hand can reliably hold the substrate in a warped shape between the first blade and the second blade.

[0089] In the above-mentioned substrate transport device, it is characterized in that:

[0090] The first hand has a push rod for holding the substrate.

[0091] The second hand does not have the putter.

[0092] [Function / Effect] According to the above structure, the first hand has a push rod for holding the substrate. Thus, the first hand can reliably hold the substrate and transport it at high speed. In addition, the second hand does not have a push rod. Thus, the device structure can be simplified and the thickness of the second hand in the height direction can be reduced.

[0093] Effects of the Invention

[0094] The substrate transfer device of the present invention does not cause problems due to the shape of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] Figure 1 It is a plan view illustrating the overall structure of the substrate processing apparatus according to the first embodiment.

[0096] Figure 2 This is a front view illustrating the structure of the carrier of Example 1.

[0097] Figure 3 This is a schematic diagram for explaining the structure of the indexer robot of Example 1.

[0098] Figure 4 (a) is a schematic diagram illustrating the sensor holding component and hand of Example 1.

[0099] Figure 4 (b) is a schematic diagram illustrating the sensor holding component and hand of Example 1.

[0100] Figure 5 This is a top view illustrating the acquisition hand and the return hand of Example 1.

[0101] Figure 6 It is a top view illustrating the sensor holding component of the first embodiment.

[0102] Fig. 7A This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0103] Figure 7B This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0104] Figure 7C This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0105] Fig. 8A This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0106] Figure 8B This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0107] Figure 8C This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0108] Fig. 9A This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0109] Fig. 9BThis is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0110] Fig. 10A This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0111] Fig. 10B This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0112] Fig. 10C This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0113] Fig.11A This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0114] Fig. 11B This is a schematic diagram for explaining the operation of the indexer robot of Example 1.

[0115] Fig.12 This is a flowchart illustrating the operation of the substrate processing apparatus according to the first embodiment.

[0116] Fig.13 It is a top view for explaining the operation of the substrate processing apparatus according to the first embodiment.

[0117] Fig.14 This is a schematic diagram for explaining the structure of the indexer robot of Example 2.

[0118] Fig.15 (a) is a schematic diagram illustrating the sensor holding component and hand of Example 2.

[0119] Fig.15 (b) is a schematic diagram illustrating the sensor holding component and hand of Example 2.

[0120] Fig.16 It is a top view illustrating the first acquisition hand and the first return hand of Example 2.

[0121] Fig.17 This is a top view illustrating the second acquisition hand and the second return hand of Example 2.

[0122] Fig.18 This is a flowchart illustrating the operation of the substrate processing apparatus according to the second embodiment.

[0123] Fig.19 It is a schematic diagram for explaining the structure of a modified example of the present invention.

[0124] Fig. 20 It is a schematic diagram for explaining the structure of a modified example of the present invention.

[0125] Fig.21It is a schematic diagram for explaining the structure of a modified example of the present invention.

[0126] Fig. 22 It is a schematic diagram for explaining the structure of a modified example of the present invention. DETAILED DESCRIPTION

[0127] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. The following embodiment is a substrate processing device equipped with a substrate conveying device of the present invention. The substrate conveying device of the present invention is equivalent to the indexer module in the substrate processing device of the embodiment. The indexer module has an indexer robot, which includes a hand for conveying substrates and a sensor holding component for measuring the distance between substrates.

[0128] Example 1

[0129] 1. Overall composition

[0130] like Figure 1 As shown, the substrate processing apparatus 1 of this example has a loading port 10, a divider module 3 and a processing module 5. The substrate processing apparatus 1 of this example relates to a single-chip substrate processing, and is configured to obtain horizontal substrates W one by one from a carrier C, and return the substrates W one by one to the carrier after performing substrate processing.

[0131] In this specification, for the sake of convenience, the direction in which the indexer module 3 and the processing module 5 in the substrate processing device 1 are arranged is referred to as the "front-to-back direction X". The front-to-back direction X extends horizontally. The direction in the front-to-back direction X from the processing module 5 in the substrate processing device 1 toward the indexer module 3 is referred to as the "front". The direction on the opposite side to the front is referred to as the "rear". The direction that is orthogonal to the front-to-back direction X and extends horizontally is referred to as the "width direction Y". For the sake of convenience, one direction of the "width direction Y" is referred to as the "right", and for the sake of convenience, the other direction is referred to as the "left". For the sake of convenience, the direction (height direction) orthogonal to the front-to-back direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, for reference, the front, back, right, left, top, and bottom are appropriately shown.

[0132] The load port 10 is a carrier loading rack for loading a carrier C. A plurality of load ports 10 are arranged in a row in the width direction Y, and one carrier C can be loaded on each of the load ports.

[0133] The carrier C stores a plurality of substrates W in a horizontal position at predetermined intervals along the vertical direction Z. In addition, an opening for taking out and storing substrates is provided on one side of the carrier C. A plurality of (for example, 25) substrates W are stored in a horizontal position in a stacked manner at predetermined intervals in one carrier C. Figure 22 is a cross-sectional view illustrating the structure of the carrier C. The carrier C is provided with a comb-shaped component 7 having a plurality of protrusions for mounting the substrate W at both ends of the carrier frame. The protrusions of the comb-shaped component 7 are the components for mounting the end of the substrate W. The protrusions extend in the front-to-back direction X. The protrusions are arranged at intervals of 1 cm. As the carrier C, for example, there is a closed FOUP (Front Opening Unify Pod). In the present invention, an open container may also be used as the carrier C.

[0134] The indexer module 3 is equivalent to the substrate conveying device of the present invention. The indexer module 3 is a rectangle extending in the width direction Y. An indexer robot IR is provided on the indexer module 3. The indexer robot IR can move horizontally in the width direction Y. The indexer robot IR has a hand that can hold the substrate W and convey it. The hand is a multi-joint arm that can rotate, move up and down, and move forward and backward. The indexer robot IR can enter the carrier C on the loading port 10 and the transfer part (pass) 24 provided in front of the processing module 5. The indexer robot IR can perform two actions: the action of taking the substrates W in a horizontal posture from the carrier C one by one and placing them on the transfer part 24, and the action of taking the substrates W in a horizontal posture placed on the transfer part 24 one by one and returning them to the carrier C. The unprocessed substrates W held in the carrier C are conveyed to the transfer part 24 by the indexer robot IR. Then, the processed substrates W are placed on the transfer part 24 and returned to the carrier C by the indexer robot IR.

[0135] The processing module 5 is equivalent to the processing unit of the present invention. The processing module 5 is a structure for performing a predetermined process on the substrate W. The processing module 5 is arranged with a plurality of single-wafer processing chambers 5a. That is, three single-wafer processing chambers 5a are respectively arranged in the middle layer area, the upper layer area, and the lower layer area to form a stack. Two stacks are arranged along the front-to-back direction on the right side of the processing module 5. Similarly, two stacks are arranged along the front-to-back direction on the left side of the processing module 5. Therefore, the processing module 5 is equipped with 12 single-wafer processing chambers 5a. A substrate conveying area extending in the front-to-back direction X is provided in the central part of the processing module 5. The central robot CR can move back and forth in the substrate conveying area, and can obtain the substrates W in a horizontal posture one by one from the transfer unit 24 and convey them to one of the single-wafer processing chambers 5a. In addition, the central robot CR can obtain the substrates W in a horizontal posture maintained by the single-wafer processing chamber 5a one by one and return them to the transfer unit 24. In this way, the central robot CR can enter each single-wafer processing chamber 5a and the transfer unit 24.

[0136] Examples of substrate processing performed in the single-wafer processing chamber 5a include substrate cleaning processing. The substrate processing apparatus 1 of this example may be configured to perform various substrate processing using chemical solutions in addition to the substrate cleaning processing.

[0137] 2. The composition of the indexer robot

[0138] Figure 3 The front end portion of the indexer robot IR related to substrate holding is schematically shown. The indexer robot IR includes a receiving hand 11a, a returning hand 11b, and a sensor holding component 21. The returning hand 11b, the receiving hand 11a, and the sensor holding component 21 are held on the arm 12 in a stacked state in the vertical direction Z. The arm 12 enables the returning hand 11b, the receiving hand 11a, and the sensor holding component 21 to move forward and backward independently in the front-to-back direction X. Before entering between the substrates W, the sensor holding component 21 is set at the same height position as the receiving hand 11a and the returning hand 11b in the front-to-back direction X. Figure 3 In the configuration of , the returning hand 11b, the acquiring hand 11a, and the sensor holding member 21 are arranged in this order from top to bottom, but the arrangement order of the components can be changed appropriately.

[0139] The acquisition hand 11a is equivalent to the hand of the present invention. The acquisition hand 11a holds unprocessed substrates W one by one by entering between upper and lower adjacent substrates W and conveys them from the carrier C to the transfer part 24. The acquisition hand 11a has a hand body 31 and a guide part 32. The hand body 31 is formed in a flat shape so as to be able to enter between substrates. The guide part 32 is located at the front end of the acquisition hand 11a and is a structure for the end of the substrate W to abut. That is, the guide part 32 is a protrusion provided at the front end of the hand body 31 and is a part that contacts the substrate W. The guide part 32 is provided on the upper surface of the hand body 31. Therefore, the guide part 32 is a structure that holds the upper substrate W from the lower side. The guide part 32 has a thick wall part and a thin wall part. Therefore, the thickness of the guide part 32 in the height direction is locally different. The wall part of the thick wall part of the guide part 32 that faces the base end of the acquisition hand 11a can contact the end (inclined part) of the substrate W. The upward flat portion of the thin-walled portion of the guide member 32 can contact the peripheral edge of the lower surface of the substrate. The guide member is also provided at the base end portion of the hand body 31 (at Figure 3 The guide member constitutes a contact portion with the substrate W in the acquisition hand 11 a.

[0140] The return hand 11b has the same structure as the above-mentioned acquisition hand 11a. That is, the return hand 11b has a hand body 31 and a guide part 32. In the return hand 11b, the structure in which the guide part 32 is provided at the front end and the base of the hand body 31 and the structure in which the guide part 32 has a thick wall part and a thin wall part are the same as the structure of the acquisition hand 11a. The return hand 11b of this example is provided for conveying a clean substrate W that has completed the cleaning process. By using the hands separately on the outgoing path and the returning path in the reciprocating movement of the substrate W, it is not necessary to use the hand that holds the substrate W before the cleaning process to hold the substrate W after the cleaning process. Therefore, by providing the return hand 11b, the cleanliness of the substrate W that has completed the cleaning process can be ensured.

[0141] Figure 3 The sensor holding component 21 in the figure is a component that enters between upper and lower adjacent substrates W. The sensor holding component 21 holds a first sensor 41 for measuring the distance to the upper substrate W and a second sensor 42 for measuring the distance to the lower substrate W. The sensor holding component 21 has a sensor group 43 consisting of a first sensor 41 and a second sensor 42. The sensor holding component 21 is formed in a flat shape so as to be able to enter between substrates. The first sensor 41 and the second sensor 42 are located at the front end of the sensor holding component 21. The sensor holding component 21 does not transport the substrate W. The sensor holding component 21 and the first sensor 41 and the second sensor 42 do not contact the substrate W. The holding component body 23 is a component that supports the first sensor 41 and the second sensor 42. The length of the first sensor 41 protruding relative to the holding component body 23 is equal to the length of the second sensor 42 protruding relative to the holding component body 23.

[0142] The second sensor 42 is provided at the lower part of the first sensor 41. Therefore, the first sensor 41 and the second sensor 42 are stacked in the vertical direction Z to form a sensor group 43. The upper surface of the sensor holding member 21 is located above the lower end of the first sensor 41. That is, a part of the first sensor 41 is buried in the sensor holding member 21. Similarly, the lower surface of the sensor holding member 21 is located below the upper end of the second sensor 42. That is, a part of the second sensor 42 is buried in the sensor holding member 21. The sensor holding member 21 is provided with a through hole for embedding the sensor group 43, and the sensor group 43 is held in the sensor holding member 21 through the through hole. By configuring in this way, the protrusion amount of the first sensor 41 and the second sensor 42 relative to the sensor holding member 21 can be minimized.

[0143] Specifically, the first sensor 41 and the second sensor 42 can be ultrasonic distance sensors (distance measuring sensors). The first sensor 41 emits ultrasonic waves upward from the sensor holding member 21, and the second sensor 42 emits ultrasonic waves downward from the sensor holding member 21. The first sensor 41 receives ultrasonic waves reflected by the upper substrate W and returned to the first sensor 41, and measures the distance from the sensor holding member 21 to the upper substrate W. The second sensor 42 receives ultrasonic waves reflected by the lower substrate W and returned to the second sensor 42, and measures the distance from the sensor holding member 21 to the lower substrate W. Therefore, the distance from the substrate W above the sensor holding member 21 to the substrate W below the sensor holding member 21 can be detected based on the outputs of the first sensor 41 and the second sensor 42.

[0144] Figure 4 (a) shows the front end of the acquisition hand 11a and the return hand 11b. Figure 4 B shows the front end of the sensor holding member 21. The thickness A1 of the front end of the acquisition hand 11a and the return hand 11b in the vertical direction Z is the distance from the upper end of the thick wall portion of the guide member 32 to the lower end of the hand body 31. On the other hand, the thickness A2 of the front end of the sensor holding member 21 in the vertical direction Z is the distance from the upper end of the first sensor 41 to the lower end of the second sensor 42. In this way, the thickness of the front end of the sensor holding member 21 in the height direction is smaller than the thickness of the front end of the acquisition hand 11a and the return hand 11b in the height direction. The sensor holding member 21 is provided to measure whether the acquisition hand 11a and the return hand 11b can enter between the substrates. Therefore, the sensor holding member 21 may enter the gap between the substrates W that the acquisition hand 11a and the return hand 11b cannot enter. By reducing the thickness of the sensor holding member 21, the sensor holding member 21 can enter even a smaller gap. On the other hand, the thickness of the acquisition hand 11a is large enough. Therefore, the receiving hand 11 a and the returning hand 11 b can reliably transport the substrate W.

[0145] Figure 5 1 is a top view for explaining the acquisition hand 11a and the return hand 11b. The acquisition hand 11a and the return hand 11b include a base 36 and a first holding body 33a and a second holding body 33b formed by branching the base 36. The first holding body 33a is a member extending in the front-rear direction X for holding one end of the substrate W, and the second holding body 33b is a member extending in the front-rear direction X for holding the other end of the substrate W. The guide member 32 is provided at the front end of the first holding body 33a and the second holding body 33b.

[0146] A guide member 34 is provided at the base of the first holding body 33a and the second holding body 33b, respectively. The guide member 34, like the above-mentioned guide member 32, has a thick wall portion constituting a wall portion capable of contacting the end portion (inclined portion) of the substrate W and a thin wall portion constituting a flat portion capable of contacting the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide member 34 is the same as the thickness of the thick wall portion of the guide member 32. The thickness of the thin wall portion of the guide member 34 is the same as the thickness of the thin wall portion of the guide member 32. The wall portions of the guide members 32 and 34 are configured to belong to an imaginary circle slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W constituted by the thin wall portions in the guide members 32 and 34.

[0147] The push rod 35 is provided at the front end of the base 36, and can push the substrate W held by the guide members 32 and 34 forward. The push rod 35 can be moved backward to be in an open state, and can also be moved forward to be in a closed state. In order to hold the substrate W by the first holding body 33a and the second holding body 33b, the push rod 35 is first set to an open state and the substrate W is held by the guide members 32 and 34. Then, the push rod 35 is set to a closed state and the substrate W is clamped by the guide members 32 and the push rod 35. In this way, the substrate W is held.

[0148] Figure 6 2 is a top view for explaining the sensor holding member 21. The sensor holding member 21 includes a first protrusion 25a and a second protrusion 25b formed by branching the base 26. The first protrusion 25a and the second protrusion 25b are members extending in the front-rear direction X. The sensor holding member 21 includes at least two sensor groups 43 consisting of a first sensor 41 and a second sensor 42. That is, the first sensor group 43a is provided at the front end of the first protrusion 25a. And, the second sensor group 43b is provided at the front end of the second protrusion 25b.

[0149] Reference Figure 5 , Figure 6It can be seen that the sensor holding part 21 has the same structure as the acquisition hand 11a and the return hand 11b. That is, the sensor holding part 21 has a first protrusion 25a extending in the front-to-back direction X corresponding to the first holding body 33a and a second protrusion 25b extending in the front-to-back direction corresponding to the second holding body 33b. Therefore, the position of the first protrusion 25a of the sensor holding part 21 is located at the same position as the position of the first holding body 33a of the acquisition hand 11a and the return hand 11b in the width direction. The first sensor group 43a of the first protrusion 25a measures the distance between the substrate W as the conveyance object at the entry position of the first holding body 33a and the substrate W below. Similarly, the position of the second protrusion 25b of the sensor holding part 21 is located at the same position as the position of the second holding body 33b of the acquisition hand 11a and the return hand 11b in the width direction. The second sensor group 43b of the second protrusion 25b measures the distance between the substrate W to be transported at the entry position of the second holding body 33b and the substrate W below.

[0150] In addition, refer to Figure 3 , Figure 4 A. Figure 4 As can be seen from FIG. 1 , in this example, the first sensor 41 and the second sensor 42 are provided at the same position in the front-rear direction X in the first protruding portion 25a, and the first sensor 41 and the second sensor 42 are provided at the same position in the front-rear direction X in the second protruding portion 25b. With such a configuration, the distance from the substrate W to be transported to the sensor holding member 21 and the distance from the lower substrate W to the sensor holding member 21 can be measured at the same position in the front-rear direction X, so that the minimum distance between the substrates can be accurately measured.

[0151] 3. Movement of the indexer manipulator

[0152] The operation of the indexer robot IR is described below. In order to transport the substrate W, first, Fig. 7A As shown, the indexer robot IR moves the arm 12 in the width direction Y, and firstly makes the position of the sensor holding member 21 in the width direction Y coincide with the position of the substrate W. In this state, when the acquisition hand 11a is moved in the front direction X, the acquisition hand 11a can approach the substrate W in the carrier C. In this example, before the acquisition hand 11a is moved in the front direction X, the minimum distance between the substrates is measured by moving the sensor holding member 21 between the substrates.

[0153] Next, the indexer robot IR Figure 7BAs shown, the arm 12 is moved in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The intermediate height position is a pre-set height position for each substrate W and is stored in a storage unit attached to the control unit 100 of the device. Figure 7B The first substrate W1 and the second substrate W2 in the carrier C are flat and not formed into a warped shape. Therefore, the minimum distance between the substrates is the same regardless of the position in the front-to-back direction X. The distance D1 is the ideal minimum distance between the substrates determined by the comb-shaped component 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped component 7. The distance between the protrusions of the comb-shaped component 7 is consistent with the distance from the lower surface of the first substrate W1 to the lower surface of the second substrate W2. When transporting the first substrate W1 using the acquisition hand 11a, it is necessary to know the distance from the lower surface of the first substrate W1 to the upper surface of the second substrate W2. Therefore, the minimum distance between the substrates is shorter than the distance between the protrusions of the comb-shaped component 7 by a distance corresponding to the thickness of the second substrate W2. Figure 7B The position of the sensor holding member 21 in FIG. 1 is located at a position higher than the second substrate W2 by half the distance D1 (distance d1). Therefore, the sensor holding member 21 is located at a position lower than the first substrate W1 by the distance d1.

[0154] The specific position of the sensor holding member 21 with respect to the vertical direction Z is described. A reference position is determined on the sensor holding member 21 with respect to the vertical direction Z. The reference position is set to a position corresponding to the midpoint between the upper end of the first sensor 41 described later and the lower end of the second sensor 42 described later. Therefore, the distance from the upper end of the first sensor 41 to the reference position is equal to the distance from the reference position to the lower end of the second sensor 42.

[0155] Then, the indexer robot IR moves the sensor holding component 21 in the forward direction X and starts measuring the minimum distance between substrates. That is, the sensor holding component 21 enters between the first substrate W1 to be transported and the second substrate W2 located below the first substrate W1. Then, the minimum distance between substrates is measured based on the sum of the first minimum distance Umim of the substrate W at the first measuring position s1 where the first sensor 41 is closest to the first substrate W1 and the second minimum distance Lmin of the substrate W at the second measuring position s2 where the second sensor 42 is closest to the second substrate W2. Specifically, the sensor holding component 21 moves from Figure 7CThe rear end of the first substrate W1 shown in the figure enters the front end while continuously measuring the minimum distance between the substrates at each position on the line extending along the front-to-back direction X. More specifically, the first sensor 41 identifies the distance from the first sensor 41 to the first substrate W1 as d2 by emitting a measuring wave from the upper surface of the first sensor 41. Similarly, the second sensor 42 measures the distance from the second sensor to the second substrate W2 by emitting a measuring wave from the lower surface of the second sensor 42. Figure 7C In the embodiment, since the first substrate W1 and the second substrate W2 are flat, the distance to the first substrate W1 measured by the first sensor 41 is fixed to d2 regardless of the position in the front-rear direction X. In addition, since the sensor holding member 21 enters between the first substrate W1 and the second substrate W2, the distance from the first substrate W1 to the first sensor 41 is equal to the distance from the second substrate W2 to the second sensor 42. Therefore, the second sensor 42 recognizes that the distance from the second sensor 42 to the second substrate W2 is d2. The distance to the second substrate W2 measured by the second sensor 42 is fixed to d2 regardless of the position in the front-rear direction X.

[0156] The minimum distance between substrates can be calculated based on the data output by the first sensor 41 and the data output by the second sensor 42. That is, the minimum distance between substrates is a value obtained by adding the first minimum distance Umin(d2) from the first sensor 41 to the first substrate W1, the second minimum distance Lmin(d2) from the second sensor 42 to the second substrate W2, and the thickness of the sensor group 43. Figure 7C , the minimum distance between the substrates is calculated to be distance D1.

[0157] Fig. 8A It is shown Figure 7C The sensor group 43 measures the minimum distance between substrates at the rear end of the substrate W according to this figure. Figure 8B The state in which the minimum distance between substrates at the front end of the substrate W is measured is shown. The sensor group 43 is located at a position protruding from the front end of the substrate W at this time. Figure 8C It is shown Figure 8B FIG. 1 is a top view of the sensor holding member 21 in a state. According to the figure, the sensor holding member 21 appears to overlap with the substrate W. Then, the sensor holding member 21 retreats, and this time the hand 11a enters between the first substrate W1 and the second substrate W2. Specifically, the indexer robot IR moves the arm 12 in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below.

[0158] At this time, the amount of movement of the arm 12 in the vertical direction Z is determined based on the minimum distance between the substrates measured by the sensor holding part 21. That is, when the acquisition hand 11a is made to enter between the first substrate W1 and the second substrate W2, the entry height of the acquisition hand 11a is adjusted according to the minimum distance between the substrates so that the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 are both greater than the specified value. Specifically, the entry height of the acquisition hand 11a is adjusted so that the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 are the same.

[0159] Fig. 9A The figure shows the situation when the entry height of the acquisition hand 11a is adjusted based on the minimum distance between the substrates actually measured. The minimum distance between the substrates actually measured is the distance D1. The arm 12 adjusts the height of the acquisition hand 11a so that the distance from the lower surface of the acquisition hand 11a to the upper surface of the second substrate W2 is the same as the distance from the upper surface of the thick wall portion of the guide member 32 of the acquisition hand 11a to the lower surface of the first substrate W1. Fig. 9A As shown, when the minimum distance between the substrates is D1, the reference position of the acquisition hand 11a only needs to be located above the second substrate W2 at a distance of half (d1) of the minimum distance D1 between the substrates. The height of the protrusion of the comb-shaped component 7 of the carrier C coincides with the lower end of the second substrate W2. In addition, the thickness of the second substrate W2 can be measured by referring to the distance measured by the second sensor 42. Therefore, the reference position of the acquisition hand 11a coincides with the position obtained by adding half (d1) of the measured distance D1 to the position of the thickness of the second substrate W2 from the upper end of the protrusion supporting the second substrate W2. The reference position of the acquisition hand 11a in the vertical direction Z is the middle position of the acquisition hand 11a having a specified thickness. The length from the reference position to the upper end of the thick wall portion of the guide component 32 is equal to the length from the reference position to the lower end of the hand body 31. Therefore, the reference position is equivalent to the midpoint between the upper end of the thick wall portion of the guide component 32 and the lower end of the hand body 31.

[0160] The acquisition hand 11a positioned in the vertical direction Z moves forward through the arm 12 and enters the middle position of the gap between the substrates. The distance from the first substrate W1 at this time to the thick-walled portion of the guide component 32 of the acquisition hand 11a is d3. In addition, the distance from the second substrate W2 to the lower end of the hand body 31 of the acquisition hand 11a is the same d3. In this example, the reference position of the acquisition hand 11a is determined based on the thick-walled portion of the guide component 32. This part is the thickest part of the acquisition hand 11a. According to this example, it is set so that the guide component 32 in the acquisition hand 11a, especially at the front end, does not collide with the substrate W. The guide component 32 is the component of the acquisition hand 11a that is most likely to collide with the substrate W. According to this example, the guide component 32 is optimized so that it does not collide with the substrate W.

[0161] When the front end of the acquisition hand 11a moves to the front end of the first substrate W1, the acquisition hand 11a rises a predetermined amount, so that the first substrate W1 moves onto the comb-shaped member 7. At this time, the end (inclined portion) of the first substrate W1 faces the wall portion of the thick wall portion of the guide member 32 and the guide member 34. Then, the push rod 35 in the open state is closed, and the first substrate W1 is grasped by the acquisition hand 11a. In this state, when the acquisition hand 11a moves backward, the first substrate W1 is released from the carrier C. In this way, the first substrate W1 is transported.

[0162] 4. Movement of the indexer robot (when the substrate is warped)

[0163] Fig. 9B and Figure 7B In this example, the first substrate W1 and the second substrate W2 to be transported are warped. In this example, the first substrate W1 can also be properly transported. Figure 7B Similarly, first, the indexer robot IR Fig. 9B As shown in FIG. 1 , the arm 12 is moved in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is the ideal minimum distance between substrates determined by the comb-shaped member 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped member 7. Fig. 9B The position of the sensor holding member 21 in FIG. 1 is located at a position higher than the second substrate W2 by half the distance D1 (distance d1). Therefore, the sensor holding member 21 is located at a position lower than the first substrate W1 by the distance d1.

[0164] In this way, the position of the sensor holding component 21 is determined based on the ideal minimum distance between the substrates. Therefore, when the sensor holding component 21 measures the minimum distance between the substrates, the result is not necessarily the ideal value, that is, the distance D1. However, it can also be considered that the minimum distance between the substrates at the ends of the substrates is the distance D1. This is because the peripheral edge of the substrate W is held by the comb-shaped component 7 of the carrier C. As an example of the warping method of the first substrate W1 at this time, there is a spherical warping method in which the center of the substrate W is recessed. In addition, as an example of the warping method of the second substrate W2 at this time, there is a spherical warping method that is the same as the first substrate W1. According to this warping method, the first substrate W1 and the second substrate W2 become rotating bodies, and therefore, the height of the left and right ends of the substrate W held by the comb-shaped component 7 is the same as the height of the front and rear ends of the substrate W that are not held by the comb-shaped component 7. Therefore, in Fig. 9B In the figure, the distance between the substrates at the ends of the substrates is shown as distance D1.

[0165] However, since the first substrate W1 is warped, the distance U from the first sensor 41 to the first substrate W1 varies depending on the position of the first substrate W1. Fig. 10A The figure shows the situation when the front end of the sensor holding member 21 moves to the center of the first substrate W1. At this time, the first sensor 41 is closest to the first substrate W1. That is, the distance between the first sensor 41 and the first substrate W1 becomes the first minimum distance Umin. The position of the first substrate W1 where the distance between the first sensor 41 and the first substrate W1 becomes the first minimum distance Umin is called the first measurement position s1.

[0166] Similarly, since the second substrate W2 is warped, the distance L from the second sensor 42 to the second substrate W2 differs depending on the position of the second substrate W2. Fig. 9B The figure shows a situation when the front end of the sensor holding member 21 is located at the front end of the first substrate W1. At this time, the second sensor 42 is closest to the second substrate W2. That is, the distance between the second sensor 42 and the second substrate W2 becomes the second minimum distance Lmin. The position of the second substrate W2 where the distance between the second sensor 42 and the second substrate W2 becomes the second minimum distance Lmin is called the second measurement position s2.

[0167] The first sensor 41 in the sensor holding part 21 of the present example measures the distance while moving from the end of the first substrate W1 located at the opening of the carrier C to the depth (inside) of the carrier C. Similarly, the second sensor 42 measures the distance while moving from the end of the second substrate W2 located at the opening of the carrier C to the depth (inside) of the carrier C. However, the first sensor 41 in the present example measures the distance while moving from the rear end to the front end of the first substrate W1. Similarly, the second sensor 42 measures the distance while moving from the rear end to the front end of the second substrate W2. Then, the first sensor 41 and the second sensor 42 measure the minimum distance between the substrates based on the distance between the substrates at the first measurement position s1 and the distance between the substrates at the second measurement position s2.

[0168] Here, the minimum distance D2 between the first substrate W1 and the second substrate W2 is the minimum distance in the height direction between the two substrates W1 and W2 when the first substrate W1 and the second substrate W2 are observed from the direction where the sensor holding part 21 enters between the substrates (i.e., from the rear end toward the front end in the X direction). The distance in the height direction between the two substrates W1 and W2 is the distance between the lower end portion of the upper substrate W1 (the portion located at the bottom: the first measurement position s1) and the upper end portion of the lower substrate W2 (the portion located at the top: the second measurement position s2). For example, Fig. 10A As shown in FIG. 1 , when the upper and lower substrates W1 and W2 are warped, the portion detected as the minimum distance d4 between the first sensor 41 and the first substrate W1 is the lower end portion of the upper substrate W1. Fig. 10A In FIG. 1 , the center portion of the substrate W1 is the lower end portion of the substrate W1. On the other hand, the portion detected as the minimum distance d2 between the second sensor 42 and the second substrate W2 is the upper end portion of the lower substrate W2. Fig. 10A In the figure, the rear end of the substrate W2 in the X direction is the upper end of the substrate W2. Also, the sum of the minimum distance d4 and the minimum distance d2 is the minimum distance D2 between the two substrates W1 and W2.

[0169] When the measurement between substrates is finished, the sensor holding member 21 moves backward, and the acquisition hand 11a enters between the substrates. At this time, the entry height of the acquisition hand 11a is adjusted so that the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 are the same. In order to calculate the entry height of the acquisition hand 11a, the minimum distance D2 between the substrates is referred to.

[0170] When the acquisition hand 11a enters between the first substrate W1 and the second substrate W2, the acquisition hand 11a is most likely to collide with the first substrate W1 at the first measurement position s1. In addition, when the acquisition hand 11a enters between the first substrate W1 and the second substrate W2, the acquisition hand 11a is most likely to collide with the second substrate W2 at the second measurement position s2. The substrate transport device of this embodiment adjusts the entry height of the acquisition hand 11a so that the substrate W is not likely to collide with the acquisition hand 11a at both the first measurement position s1 and the second measurement position s2.

[0171] Fig. 10B The following shows a case where the entry height of the acquisition hand 11a is adjusted based on the minimum distance between the substrates measured. The minimum distance between the substrates measured is D2. The arm 12 adjusts the height of the acquisition hand 11a so that the distance from the lower surface of the acquisition hand 11a to the upper surface of the second substrate W2 (usually the upper end of the second substrate W2) is the same as the distance from the upper surface of the thick wall portion of the guide member 32 of the acquisition hand 11a to the lower surface of the first substrate W1 (usually the lower end of the first substrate W1). The arm 12 adjusts the height of the acquisition hand 11a so that the distance between the first substrate W1 and the acquisition hand 11a is d5 at the first measurement position s1 where the first substrate W1 and the acquisition hand 11a are closest. Furthermore, the arm 12 adjusts the height of the acquisition hand 11a so that the distance between the second substrate W2 and the acquisition hand 11a is d5 at the second measurement position s2 where the second substrate W2 and the acquisition hand 11a are closest. That is, Fig. 10B As shown, when the minimum distance between the substrates is D2, the reference position of the acquisition hand 11a only needs to be located at a distance from the second substrate W2 to about half (d5) of the minimum distance D2 between the substrates. The height of the protrusion of the comb-shaped component 7 of the carrier C is consistent with the lower end of the second substrate W2. In addition, the thickness of the second substrate W2 can be measured with reference to the distance measured by the second sensor 42. Therefore, the reference position of the acquisition hand 11a is consistent with the position obtained by adding about half (d5) of the measured minimum distance D2 to the thickness of the second substrate W2 from the upper end of the protrusion supporting the second substrate W2. As described above, in this example, the entry height of the acquisition hand 11a is adjusted to the first measurement position s1 closest to the first sensor 41 at the lower end of the first substrate W1, so that the distance from the acquisition hand 11a to the lower end of the first substrate W1 is greater than the specified value. Similarly, the entry height of the acquiring hand 11a is adjusted so that the distance from the acquiring hand 11a to the upper end of the second substrate W2 is greater than a specified value at the second measurement position s2 where the upper end of the second substrate W2 is closest to the second sensor 42.

[0172] After being positioned in the vertical direction Z, the acquisition hand 11a moves forward through the arm 12 and enters the middle position of the gap between the substrates. At this time, the distance from the first substrate W1 to the thick wall portion of the guide part 32 of the acquisition hand 11a is d6. In addition, the distance from the second substrate W2 to the lower end of the hand body 31 in the acquisition hand 11a is d7, which is shorter than d6. As the front end of the acquisition hand 11a enters between the substrates, the first substrate W1 gradually approaches the front end of the acquisition hand 11a. Specifically, the distance from the front end of the acquisition hand 11a to the first substrate W1 takes d6 as the initial value and decreases to d7. This is because the first substrate W1 becomes a shape that is warped toward the second substrate W2 side. On the other hand, even if the front end of the acquisition hand 11a enters between the substrates, the second substrate W2 will not approach the front end of the acquisition hand 11a. Therefore, the distance from the front end of the acquisition hand 11a to the second substrate W2 is not less than d7. Fig. 10C The figure shows the situation when the first substrate W1 is closest to the front end of the acquisition hand 11a. That is, the distance from the lower end of the first substrate W1 to the upper end of the thick wall portion of the guide member 32 is d7, and the distance from the lower end of the hand body 31 to the upper end of the second substrate W2 is longer than d7. Since d7 is greater than the distance required for substrate transport, the acquisition hand 11a will not collide with the first substrate W1 or the second substrate W2 when entering between the substrates.

[0173] As the user uses the hand 11a to Fig. 10C The state further extends to the front end of the first substrate W1, and the distance from the first substrate W1 to the front end of the acquisition hand 11a increases from d7. Therefore, in this action, the acquisition hand 11a will not collide with the first substrate W1 or the second substrate W2.

[0174] 5. The movement of the indexer robot (to obtain the situation that cannot be entered by hand)

[0175] In this example, the configuration is such that the acquiring hand 11a is not allowed to enter between the first substrate W1 and the second substrate W2 when the result of measuring the minimum distance between the substrates is as follows: the distance between the first substrate W1 and the second substrate W2 is short, and the distance from the acquiring hand 11a to the first substrate W1 at the first measuring position s1 and the distance from the acquiring hand to the second substrate W2 at the second measuring position s2 cannot simultaneously satisfy or exceed the specified values.

[0176] Fig.11A The minimum distance between the substrates is D3. The minimum value D3 is shorter than the minimum distance D2 mentioned above. Fig. 9B In contrast, the first substrate W1 is warped to a greater extent. The operation of the indexer robot IR in this case will be described below.

[0177] First, the indexer robot IR moves the arm 12 in the vertical direction Z so that the sensor holding component 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is an ideal distance between substrates determined by the comb-shaped component 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped component 7. The position of the sensor holding component 21 is located at a position that is half the distance D1 (distance d1) higher than the second substrate W2. Therefore, the sensor holding component 21 is located at a position that is a distance d8 lower than the first substrate W1.

[0178] Since the first substrate W1 is warped, the minimum distance between the substrates varies depending on the position of the substrate W. Fig.11A The figure shows the situation when the front end of the sensor holding component 21 moves to the center of the first substrate W1. At this time, the first sensor 41 is closest to the first substrate W1. That is, the distance between the first sensor 41 and the first substrate W1 is d8. On the other hand, since the second substrate W2 is flat, the distance between the second sensor 42 and the second substrate W2 is d2. The sensor holding component 21 measures the minimum value D3 of the distance between the first substrate W1 and the second substrate W2 based on d8 and d2. That is, the minimum value D3 is the value obtained by adding the thickness of the sensor group 43 in the vertical direction Z and d8 and d2. The portions of the substrates that are close to each other at the minimum value D3 are most likely to collide with the acquisition hand 11a when the substrates are transported.

[0179] The minimum value D3 is smaller than the length obtained by adding twice the specified value to the thickness of the acquisition hand 11a, and the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 cannot simultaneously meet the specified value or more. In this case, the indexer robot IR of this example will not allow the acquisition hand 11a to enter between the first substrate W1 and the second substrate W2. In this way, the collision between the first substrate W1 and the acquisition hand 11a during the transportation of the first substrate W1 can be prevented.

[0180] 6. Movement of the indexer robot (when the sensor holding part cannot enter)

[0181] In this example, when the result of measuring the minimum distance between the substrates is that the distance between the first substrate W1 and the second substrate W2 is short and the sensor holding component 21 cannot enter between the first substrate W1 and the second substrate W2, the acquisition hand 11a is not allowed to enter between the first substrate W1 and the second substrate W2.

[0182] Fig. 11B The minimum distance between the substrates is D4. The minimum value D4 is shorter than the minimum value D3 mentioned above. Fig.11AIn contrast, the first substrate W1 is warped to a greater extent. The operation of the indexer robot IR in this case will be described below.

[0183] First, the indexer robot IR moves the arm 12 in the vertical direction Z so that the sensor holding component 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is the ideal minimum distance between substrates determined by the comb-shaped component 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped component 7. The position of the sensor holding component 21 is located at a position that is half the distance D1 (distance d1) higher than the second substrate W2. Therefore, the sensor holding component 21 is located at a position that is a distance d1 lower than the first substrate W1.

[0184] Since the first substrate W1 is warped, the minimum distance between the substrates varies depending on the position of the substrate W. Fig. 11B The figure shows the situation when the front end of the sensor holding component 21 moves to the center of the first substrate W1. At this time, before the first sensor 41 is closest to the first substrate W1, the distance between the first sensor 41 and the first substrate W1 is d9. On the other hand, since the second substrate W2 is flat, the distance between the second sensor 42 and the second substrate W2 is d2. The substrate conveying device of this example is configured to stop measuring the minimum distance between substrates and move the sensor holding component 21 backward at the time point when the distance between the first sensor 41 and the first substrate W1 becomes d9. Similarly, the substrate conveying device of this example is configured to stop measuring the minimum distance between substrates and move the sensor holding component 21 backward at the time point when the distance between the second sensor 42 and the second substrate W2 becomes d9. By configuring in this way, the sensor holding component 21 will not collide with the substrate W.

[0185] Fig. 11B This is an example in which the entry of the sensor holding member 21 is stopped because the first substrate W1 approaches the first sensor 41. When the distance between the second substrate W2 and the second sensor 42 becomes d9 due to the warping of the second substrate W2, the entry of the sensor holding member 21 is also stopped.

[0186] When the sensor holding member 21 is turned back and cannot be placed between the first substrate W1 and the second substrate W2, the acquisition hand 11a is not placed between the first substrate W1 and the second substrate W2. That is, at the time when the distance d9 is detected by the first sensor 41 or the second sensor, it is determined that the acquisition hand 11a does not transport the first substrate W1. In this way, it is possible to prevent the first substrate W1 from colliding with the acquisition hand 11a when the first substrate W1 is transported.

[0187] 7. Other components

[0188] Reference Figure 1 As can be seen, the substrate transport device of this example includes a control unit 100. The control unit 100 is composed of, for example, a CPU (Central Processing Unit). The specific structure of the control unit 100 is not limited, for example, the control unit 100 may be composed of a single processor or may be composed of independent processors.

[0189] As control related to the control unit 100, there is control related to the indexer robot IR, for example. That is, the control unit 100 controls the forward and backward movement of the sensor holding member 21, the forward and backward movement of the acquisition hand 11a and the return hand 11b, the opening and closing movement of the push rod 35, the movement of the arm 12 in the vertical direction Z, the mapping sensor described later, and the moving mechanism of the mapping sensor. In particular, the control unit 100 is configured to move the acquisition hand 11a, the return hand 11b, and the sensor holding member 21 forward and backward relative to the substrate W in the forward and backward direction.

[0190] Although Figure 1 Although not shown in the figure, the substrate transport device of this example has a storage unit that can be accessed by the control unit 100. The storage unit stores programs and parameters related to the control. In addition, the storage unit stores the minimum distance between each substrate measured by the above-mentioned sensor component 21. The storage unit can be composed of a single device or can be composed of independent devices corresponding to each control unit. In addition, the substrate transport device of this example does not particularly limit the composition of the device that realizes the storage unit.

[0191] 8. Substrate transport process

[0192] Fig.12 This is a flowchart for explaining the operation of the substrate transfer device of the present invention. Hereinafter, the operation of the substrate transfer device when a substrate cleaning process is performed by the substrate processing apparatus 1 of the present invention will be explained. Fig.13 1 shows a state where a substrate W is transported in the substrate processing apparatus 1. In the following description, reference is also made to Fig.13 .

[0193] Step S1: When the carrier C of the processing object is placed on the loading port 10, the substrate conveying device starts the mapping action of the substrate W. The substrate conveying device includes a mapping sensor for performing the action and a moving mechanism of the mapping sensor. The moving mechanism can move the mapping sensor in the vertical direction Z. The mapping sensor is a non-contact sensor that can sense the presence or absence of the substrate W. Specifically, the mapping action is performed by moving the mapping sensor in the vertical direction Z relative to the carrier C. Thereby, it is possible to know on which part of the comb-shaped component 7 of the carrier C the substrate W is placed. The mapping action is an action to obtain the distribution of the substrate W in the carrier C.

[0194] Step S2: The indexer robot IR moves to the rear of the carrier C, and the sensor holding component 21 enters the carrier C. When the substrates W are spaced 1 cm apart and supported by the comb-shaped component 7, the sensor holding component 21 enters between the substrates W. 1 cm is the arrangement pitch of the protrusions of the comb-shaped component 7. When 25 substrates W are arranged on the carrier C at intervals of 1 cm, the sensor holding component 21 sequentially enters each gap between the substrates at 24 locations. The minimum distance between the substrates obtained by the sensor holding component 21 is stored in the storage unit. When the substrates W are supported on the carrier C at intervals of more than 2 cm, it can be said that the minimum distance between the substrates is sufficient for conveyance even without measurement, so the entry action of the sensor holding component 21 can be omitted. How the substrates W are arranged in the carrier C can be known by referring to the results of the mapping action.

[0195] Step S3: The height of the reference position in the acquisition hand 11a is determined based on the measurement result between the substrates of the sensor holding member 21. And the parameters related to the control of the acquisition hand 11a are changed so that the reference position of the acquisition hand 11a becomes the determined height. Specifically, this action is realized by rewriting the hand height offset value that determines the height of the acquisition hand 11a.

[0196] Step S4: The arm 12 of the indexer robot IR moves in the vertical direction so that the acquisition hand 11a is located at the height of the substrate W to be transported. The height of the acquisition hand 11a at this time becomes a height suitable for transporting the substrate W to be transported. The acquisition hand 11a grasps the substrate W to be transported and delivers it to the transfer unit 24 (see Fig.13 Arrow a).

[0197] Step S5: The unprocessed substrate W held on the transfer unit 24 is transferred to the single-wafer processing chamber 5a by the central robot CR (see Fig.13 The single-wafer processing chamber 5a performs a cleaning process on the substrate W. The processed substrate W is transported to the transfer unit 24 by the central robot CR (see Fig.13 arrow c).

[0198] Step S6: The cleaned substrate W that has completed the cleaning process is transported by the return hand 11b. First, the height of the reference position in the return hand 11b is determined based on the measurement result between the substrates of the sensor holding part 21. That is, the parameters related to the control of the return hand 11b are changed so that the reference position of the return hand 11b becomes the determined height. Specifically, this action is achieved by rewriting the hand height offset value that determines the height of the return hand 11b.

[0199] The hand height offset value associated with the acquisition hand 11a can be used again to rewrite the hand height offset value associated with the return hand 11b. Each substrate W held in the carrier C is returned to the carrier C in a state where the arrangement order is maintained after the substrates are processed. Therefore, the height of the return hand 11b when returning the substrate W to the carrier C is the same as the height of the acquisition hand 11a when acquiring the carrier C from the substrate W. The height of the acquisition hand 11a is a value inherent to each substrate W held by the carrier C. When returning the substrate W to the carrier C, the height of the acquisition hand 11a is reproduced by the return hand 11b based on these inherent values. In this way, when returning the substrate W, the front end of the return hand 11b will not collide with the substrate W.

[0200] Step S7: The returning hand 11b acquires the substrate W to be transported from the transfer unit 24. The arm 12 of the indexer robot IR moves in the vertical direction so that the returning hand 11b is located at the height determined in step S6. The height of the returning hand 11b when the substrate W is placed on the carrier C and returned to the substrate transport device is the same as that of the acquiring hand 11a when the substrate W is acquired from the carrier C. This is because the acquiring hand 11a and the returning hand 11b operate based on a common hand height offset value. The returning hand 11b transports the substrate W to be transported from the transfer unit 24 to the carrier C (see Fig.13 d). The substrate W held by a certain protrusion in the comb-shaped member 7 of the carrier C is returned to the same protrusion through the substrate acquisition operation and the substrate return operation.

[0201] Step S8: When the return of the substrate W to the carrier C is completed, the scanning operation of the substrate W is performed again in the same manner as in step S1. Thus, the operation of the substrate transport device of this example is completed.

[0202] It should be noted that the above-mentioned description of the operations from step S1 to step S8 focuses on one substrate W. Therefore, when a plurality of substrates W are transported from the carrier C and the substrates W are cleaned, steps S3 and S4 can be repeatedly executed before entering step S5. Similarly, steps S6 and S7 can also be repeatedly executed before entering step S9.

[0203] 9. Effects of Example 1

[0204] As shown above, the substrate conveying device is provided with a sensor holding part 21 having a first sensor 41 and a second sensor 42 in addition to the acquisition hand 11a and the return hand 11b for conveying the substrate W. When the first substrate W1 in the carrier C is to be conveyed, according to the present invention, the sensor holding part 21 first enters between the first substrate W1 and the second substrate W2. Then, the distance between the first substrate W1 and the second substrate W2 is measured. Since the loading position of the substrate W in the carrier C has been determined, the distance between the first substrate W1 and the second substrate W2 should be fixed. But in reality, the first substrate W1 and the second substrate W2 are not necessarily flat. Therefore, when the distance between the first substrate W1 and the second substrate W2 is actually measured, the minimum distance between the substrates is larger or smaller than expected. At the same time, the middle position between the substrates is higher or lower than expected.

[0205] According to the present invention, when the acquisition hand 11a and the return hand 11b enter between the first substrate W1 and the second substrate W2, the entry height of the acquisition hand 11a and the return hand 11b is adjusted so that the gap between the acquisition hand 11a and the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a and the return hand 11b and the second substrate W2 are both above the specified value. With this configuration, the acquisition hand 11a and the return hand 11b will not come into contact with the portion other than the edge of the first substrate W1 due to the acquisition hand 11a and the return hand 11b being too close to the first substrate W1. Similarly, the acquisition hand 11a and the return hand 11b will not come into contact with the portion other than the edge of the second substrate W2 due to the acquisition hand 11a and the return hand 11b being too close to the second substrate W2.

[0206] In the above-mentioned structure, the thickness of the first sensor 41 and the second sensor 42 at the front end of the sensor holding member 21 is smaller than the thickness of the guide member 32 at the front end of the acquisition hand 11a and the return hand 11b. With this structure, the sensor holding member 21 can also enter between the substrates that the acquisition hand 11a and the return hand 11b cannot enter, and the minimum distance between the substrates can be reliably measured.

[0207] In the above configuration, the entry height of the acquisition hand 11a and the return hand 11b is adjusted so that the gap between the acquisition hand 11a, the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a, the return hand 11b and the second substrate W2 are both greater than a specified value when the first substrate W1 and the second substrate W2 are closest. With this configuration, the acquisition hand 11a and the return hand 11b will not contact the substrate W when the first substrate W1 and the second substrate W2 are closest.

[0208] In the above configuration, the entry height of the acquisition hand 11a and the return hand 11b is adjusted so that the gap between the acquisition hand 11a, the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a, the return hand 11b and the second substrate W2 are the same. With this configuration, sufficient distance can be ensured not only between the acquisition hand 11a, the return hand 11b and the first substrate W1, but also between the acquisition hand 11a, the return hand 11b and the second substrate W2 to transport the substrate W, so the hand can transport the substrate W more reliably.

[0209] In the above-mentioned configuration, the sensor holding member 21 does not transport the substrate W. With this configuration, there is no need to provide the guide member 32 for holding the substrate W on the sensor holding member 21, and it is easy to enter between substrates.

[0210] In the above configuration, when the distance between the first substrate W1 and the second substrate W2 is short and the gap between the acquisition hand 11a, the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a, the return hand 11b and the second substrate W2 cannot be simultaneously greater than the specified value, it is determined that the first substrate W1 cannot be conveyed, and the acquisition hand 11a, the return hand 11b will not enter between the first substrate W1 and the second substrate W2. By adopting this configuration, it is possible to more reliably prevent the portion other than the edge of the substrate W from contacting the acquisition hand 11a, the return hand 11b.

[0211] In the above configuration, the protrusion amount of the first sensor 41 and the second sensor 42 can be reduced by the thickness of the sensor holding member 21. Therefore, the height of the sensor holding member 21 can be minimized, and the possibility that the sensor holding member 21 cannot enter between the substrates is reduced.

[0212] In the above configuration, the sensor holding member 21 includes the first sensor group 43 for measuring the minimum distance between substrates at the position of the first holding body 33a of the acquisition hand 11a and the return hand 11b, and the sensor holding member 21 includes the second sensor group 43 for measuring the minimum distance between substrates at the position of the second holding body 33b of the acquisition hand 11a and the return hand 11b. Thus, it is possible to more reliably avoid the acquisition hand 11a and the return hand 11b from contacting the portion other than the edge of the substrate W.

[0213] In the above-mentioned structure, the sensor holding member 21 includes a first protrusion 25a corresponding to the first holding body 33a and extending in the front-rear direction X, and a second protrusion 25b corresponding to the second holding body 33b and extending in the front-rear direction X. In this way, by making the shape of the sensor holding member 21 similar to the acquisition hand 11a and the return hand 11b, it is possible to more reliably acquire information on the distance required for conveyance.

[0214] In the above configuration, the sensor holding member 21 includes the sensor group 43 at the tip of the first protrusion 25a and the sensor group 43 at the tip of the second protrusion 25b. With this configuration, the minimum distance between substrates in the deep part of the carrier C can be measured by a slight movement of the sensor holding member 21.

[0215] In the above-described configuration, the sensor holding member 21 includes the first sensor 41 and the second sensor 42 at the same position of the first protrusion 25a in the front-rear direction X. In addition, the sensor holding member 21 includes the first sensor 41 and the second sensor 42 at the same position of the second protrusion 25b in the front-rear direction X. With this configuration, the substrate (first substrate W1) on the upper side of the sensor holding member 21 and the substrate (second substrate W2) on the lower side of the sensor holding member 21 can be measured under the same conditions, so the minimum distance between the substrates can be calculated more accurately.

[0216] In the above configuration, when the distance between the first substrate W1 and the second substrate W2 is short and the sensor holding member 21 cannot enter between the first substrate W1 and the second substrate W2, it is determined that the first substrate W1 cannot be transported, and the acquisition hand 11a and the return hand 11b will not enter between the first substrate W1 and the second substrate W2. By adopting this configuration, it is possible to more reliably prevent the portion other than the edge of the substrate W from contacting the acquisition hand 11a and the return hand 11b.

[0217] In the above-mentioned structure, the sensor holding member 21 is located at the same position as the acquisition hand 11a and the return hand 11b in the front-rear direction X before entering the substrate W. With this structure, a single robot can use the acquisition hand 11a, the return hand 11b and the sensor holding member 21 separately, thereby realizing the present invention.

[0218] Example 2

[0219] 10. Summary of Example 2

[0220] Embodiment 2 relates to a substrate transport device. As in Embodiment 1, a substrate processing device 1 incorporating the substrate transport device is described as an example. The substrate processing device 1 of Embodiment 2 is used as follows. Figure 1 As described above, the substrate transfer device includes the load port 10, the indexer module 3, and the processing module 5. The substrate transfer device of this example is different from that of the first embodiment in the configuration of the indexer robot IR in the indexer module 3.

[0221] 11. Composition of indexer manipulator

[0222] Fig.14 The front end portion of the indexer robot IR related to substrate holding is schematically shown. The indexer robot IR includes a first acquisition hand 51a, a first return hand 51b, a second acquisition hand 61a, and a second return hand 61b. The first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b are held on the arm 13 in a stacked state in the vertical direction Z. The arm 13 enables the first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b to independently move forward and backward in the front-to-back direction X. Fig.14 In the structure, the second return hand 61b, the second acquisition hand 61a, the first return hand 51b and the first acquisition hand 51a are arranged in order from top to bottom, but the order of arrangement of each component can be changed appropriately.

[0223] The first acquisition hand 51a is equivalent to the first hand of the present invention, and is equivalent to the acquisition hand 11a of Example 1. Therefore, the first acquisition hand 51a holds unprocessed substrates W one by one from the carrier C and transports them to the transfer part 24. The first acquisition hand 51a has a hand body 53 and a first guide part 52. The first guide part 52 for abutting the end of the substrate W is provided at the front end of the first acquisition hand 51a. The hand body 53 has the same structure as the hand body 31 of Example 1. The first guide part 52 has the same structure as the guide part 32 of Example 1. Therefore, the first guide part 52 has a thick wall part and a thin wall part. The thickness of the first guide part 52 in the height direction is partially different. The first acquisition hand 51a is a high-speed transport hand that transports substrates W one by one from the carrier C that stores a plurality of substrates W in a horizontal posture at predetermined intervals along the vertical direction Z.

[0224] The first return hand 51b corresponds to the return hand 11b of the first embodiment and has the same structure as the first acquisition hand 51a described above. The first acquisition hand 51a is a hand for acquiring an unprocessed substrate W from the carrier C, and the first return hand 51b is a hand for returning the cleaned substrate W to the carrier C after the cleaning process is completed.

[0225] The second acquisition hand 61a is equivalent to the second hand of the present invention. The second acquisition hand 61a holds the unprocessed substrates W one by one from the carrier C and transports them to the transfer unit 24. The first acquisition hand 51a and the second acquisition hand 61a have the same function, but the shapes of the hands are different (see Fig.16 , Fig.17 ). The second acquisition hand 61a has a hand body 63 and a second guide component 62. The hand body 63 is formed in a flat shape so that it can enter between the substrates. The second guide component 62 for abutting the end of the substrate W is provided at the front end of the second acquisition hand 61a. The second guide component 62 is a protrusion provided at the front end of the hand body 63, and is a component that contacts the substrate W. The second guide component 62 is provided on the upper surface of the hand body 63. The second guide component 62 has a thick-walled portion and a thin-walled portion in the same manner as the above-mentioned first guide component 52. Therefore, the thickness of the second guide component 62 in the height direction is partially different. The wall portion of the thick-walled portion of the second guide component 62 that faces the base end of the second acquisition hand 61a can contact the end (inclined portion) of the substrate W. The flat portion facing upward in the thin-walled portion of the second guide component 62 can contact the peripheral portion of the lower surface of the substrate. The guide component is also provided at the base end of the hand body 63 (at Fig.14The guide member constitutes a contact portion of the second acquisition hand 61a that contacts the substrate W. The second acquisition hand 61a is a hand for low-speed transport that transports substrates W one by one from a carrier C that stores a plurality of substrates W in a horizontal posture at predetermined intervals along the vertical direction Z.

[0226] The second return hand 61b has the same structure as the second acquisition hand 61a described above. That is, the second return hand 61b has a hand body 63 and a second guide part 62. In the second return hand 61b, the structure in which the second guide part 62 is provided at the front end and the base of the hand body 63 and the structure in which the second guide part 62 has a thick wall part and a thin wall part are the same as the structure of the second acquisition hand 61a. The second return hand 61b of this example is provided for conveying a clean substrate W that has completed the cleaning process. By using the hands separately on the outgoing path and the returning path in the reciprocating motion of the substrate W, it is not necessary to hold the substrate W after the cleaning process by the hand that holds the substrate W before the cleaning process. By providing the second return hand 61b, the cleanliness of the substrate W that has completed the cleaning process can be ensured.

[0227] Fig.15 A shows the front end of the first acquisition hand 51a and the first return hand 51b. Fig.15 B shows the front end of the second acquisition hand 61a and the second return hand 61b. The thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the vertical direction Z is the distance from the upper end of the thick wall portion of the first guide member 52 to the lower end of the hand body 53. Similarly, the thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the vertical direction Z is the distance from the upper end of the thick wall portion of the second guide member 62 to the lower end of the hand body 63. The thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the height direction is smaller than the thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the height direction. Therefore, the second acquisition hand 61a and the second return hand 61b can enter even a gap narrower than the first acquisition hand 51a and the first return hand 51b. Such a configuration is advantageous when the substrates W to be transported are brought close to each other due to warping. On the other hand, the first acquisition hand 51a and the first return hand 51b can realize high-speed substrate transport compared with the second acquisition hand 61a and the second return hand 61b. This will be described later.

[0228] Fig.161 is a top view illustrating the first acquisition hand 51a and the first return hand 51b. The first acquisition hand 51a and the first return hand 51b have the same structure as the acquisition hand 11a and the return hand 11b of Example 1. That is, the first acquisition hand 51a and the first return hand 51b include a base 56 and a first holding body 53a and a second holding body 53b formed by branching the base 56. The first acquisition hand 51a and the first return hand 51b include a first holding body 53a that holds one end of the substrate W and extends in the front-to-back direction X, and a second holding body 53b that holds the other end of the substrate W and extends in the front-to-back direction X. The first guide member 52 is provided at the front end of the first holding body 53a and the second holding body 53b.

[0229] Guide members 54 are provided at the bases of the first holding body 53a and the second holding body 53b, respectively. The guide members 54, like the above-mentioned first guide member 52, have a thick wall portion constituting a wall portion capable of contacting the end portion (inclined portion) of the substrate W and a thin wall portion constituting a flat portion capable of contacting the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide member 54 is the same as the thickness of the thick wall portion of the first guide member 52. The thickness of the thin wall portion of the guide member 54 is the same as the thickness of the thin wall portion of the first guide member 52. The wall portions of the first guide member 52 and the guide member 54 are arranged in a manner that belongs to an imaginary circle slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W constituted by the thin wall portions in the first guide member 52 and the guide member 54.

[0230] The first acquisition hand 51a and the first return hand 51b have a push rod 55. The push rod 55 is provided at the front end of the base 56 and can push the substrate W held by the first guide member 52 and the guide member 54 forward. The push rod 55 can move backward to be in an open state, and can move forward to be in a closed state. In order to hold the substrate W by the first holding body 53a and the second holding body 53b, first, the push rod 55 is set to an open state and the substrate W is held by the first guide member 52 and the guide member 54. Then, the push rod 55 is set to a closed state, and the substrate W is sandwiched by the first guide member 52 and the push rod 55. In this way, the substrate W is held. On the other hand, the second acquisition hand 61a and the second return hand 61b do not have a push rod. Therefore, there is a gap between the substrates W held on the second guide member 62 of the second acquisition hand 61a and the guide member 64 described later. The second receiving hand 61a conveys the substrate W while maintaining the gap. The same is true for the second returning hand 61b.

[0231] Fig.171 is a top view for explaining the second acquisition hand 61a and the second return hand 61b. The second acquisition hand 61a and the second return hand 61b include a base 66 and a first blade 63a and a second blade 63b formed by branching the base 66. The second acquisition hand 61a and the second return hand 61b include a first blade 63a that holds one end of the substrate W and extends in the front-rear direction X, and a second blade 63b that holds the other end of the substrate W and extends in the front-rear direction X. The second guide member 62 is provided at the front end of the first blade 63a and the second blade 63b.

[0232] A guide component 64 is provided at the base of the first blade 63a and the second blade 63b, respectively. The guide component 64, like the above-mentioned guide component 54, has a thick wall portion constituting a wall portion capable of contacting the end portion (inclined portion) of the substrate W and a thin wall portion constituting a flat portion capable of contacting the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide component 64 is the same as the thickness of the thick wall portion of the second guide component 62. The thickness of the thin wall portion of the guide component 64 is the same as the thickness of the thin wall portion of the second guide component 62. The wall portions of the second guide component 62 and the guide component 64 are arranged in a manner that belongs to an imaginary circle that is slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W constituted by the thin wall portions in the second guide component 62 and the guide component 64.

[0233] The shapes of the first acquisition hand 51a and the second acquisition hand 61a are different from each other. Fig.16 It can be seen that the first holding body 53a and the second holding body 53b of the first acquisition hand 51a are tapered in a manner that the thickness increases from the front end to the base in the width direction Y. By adopting such a configuration, the rigidity of the first acquisition hand 51a is increased, and a higher speed of substrate transport can be achieved. The first return hand 51b also exerts the same effect.

[0234] On the other hand, refer to Fig.17 It can be seen that the first blade 63a and the second blade 63b of the second acquisition hand 61a have a constant thickness from the front end toward the base in the width direction Y. With such a configuration, the space R2 between the first blade 63a and the second blade 63b can be increased. Fig.16 The first acquisition hand 51a shown also has a space R1 between the first holding body 53a and the second holding body 53b, but since the first holding body 53a and the second holding body 53b are set in a tapered shape, it is smaller than the space R2. The space between the first holding body 53a and the second holding body 53b is smaller than the space between the first blade 63a and the second blade 63b.

[0235] In addition, refer to Fig.17It can be seen that the separation distance A22 between the first blade 63a and the second blade 63b in the second acquisition hand 61a is greater than the separation distance A21 between the first holding body 53a and the second holding body 53b in the first acquisition hand 51a (see Fig.17 , Fig.16 ). Thus, the space R2 can be made larger than the space R1. Furthermore, by providing a larger space R2 in the second acquisition hand 61a, a substrate W that is difficult to transport can be reliably transported compared to the first acquisition hand 51a. The substrate W that is difficult to transport is specifically a warped substrate W. The warped substrate W is sometimes deformed into a shape that is concave toward the center of the substrate W, and accordingly, it is easy to contact the hand during transportation. In this regard, the second acquisition hand 61a does not adopt a structure in which the first blade 63a and the second blade 63b are provided in the portion where the warped substrate is considered to contact the hand. Therefore, the second acquisition hand 61a of this example can reliably transport substrates W that are more difficult to transport. The second return hand 61b also has the same effect.

[0236] It should be noted that the separation distance A21 is the distance from the first guide member 52 provided on the first holding body 53a to the first guide member 52 provided on the second holding body 53b. The separation distance A22 is the distance from the second guide member 62 provided on the first blade 63a to the second guide member 62 provided on the second blade 63b.

[0237] When the substrate W is transferred from the carrier C to the transfer unit 24 by the indexer robot IR, the first acquisition hand 51a or the second acquisition hand 61a is used. The first acquisition hand 51a or the second acquisition hand 61a enters between the first substrate W1 as the transfer target held by the carrier C and the second substrate W2 located below it, and then ascends to acquire the first substrate W1. The acquired first substrate W1 is transferred to the transfer unit 24.

[0238] When the substrate W is transferred from the transfer unit 24 to the carrier C by the indexer robot IR, the first return hand 51b or the second return hand 61b is used. The first return hand 51b or the second return hand 61b takes the substrate W as the transfer target held in the transfer unit 24 and puts it into the carrier C. Then, the first return hand 51b or the second return hand 61b lowers to place the substrate W as the transfer target on the carrier C. The first return hand 51b or the second return hand 61b retreats by moving between the transferred substrate W and the substrate W located below it, and detaches from the carrier C.

[0239] 12. Other components

[0240] As Figure 1The control related to the control unit 100 shown in the figure includes, for example, control related to the indexer robot IR. That is, the control unit 100 controls the forward and backward movements of the first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b, the opening and closing movement of the push rod 55, the movement related to the vertical direction Z of the arm 13, and the mapping sensor and the moving mechanism of the mapping sensor described later. In addition, the control unit 100 selects which of the four hands is used for conveying. The storage unit has the same structure as that of the first embodiment.

[0241] 13. Substrate transport process

[0242] Fig.18 The following is a flowchart for explaining the operation of the substrate transfer apparatus of the present invention. The operation of the substrate transfer apparatus when performing a substrate cleaning process using the substrate processing apparatus 1 of the present invention will be described. Fig.13 1 shows a state where a substrate W is transported in the substrate processing apparatus 1. In the following description, reference is made to Fig.13 .

[0243] Step S11: When the carrier C to be processed is placed on the load port 10, the substrate transport device starts the mapping operation of the substrate W. This step is the same as step S1 of the first embodiment, and therefore detailed description thereof is omitted.

[0244] Through this step, it can be known how the comb-shaped component 7 of the carrier C holds the substrate W. There are 25 protrusions on the comb-shaped component 7, and each protrusion can hold a substrate W. For the sake of convenience, it is assumed that less than 25 substrates W are held on the carrier C. The distance from a certain substrate W among the substrates W held by the carrier C to the substrate W located below it is 1 cm. 1 cm is the arrangement pitch of the protrusions in the comb-shaped component 7. In addition, the distance from another substrate W among the substrates W held by the carrier C to the substrate W located below it is 2 cm. Therefore, there are empty protrusions on the comb-shaped component 7 that do not hold substrates W, one substrate W is held by another protrusion at a position 1 cm above the empty protrusion, and another substrate W is held by another protrusion at a position 1 cm below the empty protrusion. Through the mapping action, it is possible to identify which part of the carrier C has a distance of 1 cm between substrates and which part of the carrier C has a distance of 2 cm between substrates.

[0245] exist Fig.18 In the operation description, when the hand enters between the substrates, if the distance between the substrates is 2 cm and there is a margin, the first acquisition hand 51a and the first return hand 51b for high-speed transport are used for transport. On the other hand, when the hand enters between the substrates, if the distance between the substrates is 1 cm and there is no margin, the second acquisition hand 61a and the second return hand 61b for low-speed transport are used for transport.

[0246] Step S12: The indexer robot IR moves to the rear of the carrier C. The arm 13 of the indexer robot IR moves in the vertical direction. When the height between the substrate W to be transported and the substrate W below it is 2 cm, the first acquisition hand 51a is positioned at the height of the substrate W to be transported. The first acquisition hand 51a holds the substrate W to be transported and delivers it to the transfer unit 24 (see Fig.13 The substrate W is conveyed at a high speed. On the other hand, when there is a height of 1 cm between the substrate W to be conveyed and the substrate W below it, the second acquisition hand 61a is located at the height of the substrate W to be conveyed. The second acquisition hand 61a holds the substrate W to be conveyed and sends it to the transfer unit 24. The substrate W is conveyed at a low speed.

[0247] Step S13: The unprocessed substrate W held in the transfer unit 24 is transferred to the single-wafer processing chamber 5a by the central robot CR (see Fig.13 The single-wafer processing chamber 5a performs a cleaning process on the substrate W. The processed substrate W is transported to the transfer unit 24 by the central robot CR (see Fig.13 arrow c).

[0248] Step S14: The cleaned substrate W that has completed the cleaning process is transported by either the first return hand 51b or the second return hand 61b. The substrate W transported to the transfer section 24 by the first acquisition hand 51a in step S12 is returned from the transfer section 24 to the carrier C by the first return hand 51b. The substrate W is transported at a high speed at this time. In addition, the substrate W transported to the transfer section 24 by the second acquisition hand 61a in step S12 is returned from the transfer section 24 to the carrier C by the second return hand 61b (see Fig.13 The substrate W is transported at a low speed. The substrate W held on a certain protrusion of the comb-shaped member 7 of the carrier C is returned to the same protrusion after the substrate acquisition operation and the substrate return operation.

[0249] Step S15: When the return of the substrate W to the carrier C is completed, the scanning operation of the substrate W is performed again in the same manner as in step S11. Thus, the operation of the substrate transport device of this example is completed.

[0250] It should be noted that the operation description from step S1 to step S15 is focused on one substrate W. Therefore, when a plurality of substrates W are transported from the carrier C to be cleaned, step S12 is repeated before entering step S13. Similarly, step S14 is also repeated before entering step S15.

[0251] It should be noted that, in the case where the position of the substrate W with a large warpage in the carrier C is determined in advance, the first acquisition hand 51a and the second acquisition hand 61a can be used separately according to the user's instructions. That is, in the case where, for example, all the substrates W in the carrier C are warped, the arm 13 is controlled to transport all the substrates W by the second acquisition hand 61a. On the other hand, in the case where, for example, all the substrates W in the carrier C are flat, the arm 13 is controlled to transport all the substrates W by the first acquisition hand 51a. If the user inputs information related to the shape of the substrate W at each position in the carrier C into the substrate transport device, the first acquisition hand 51a and the second acquisition hand 61a can be used separately in a single carrier C to perform operations. The shape of the substrate W in this case refers to the warpage condition of the substrate W.

[0252] 14. Effects of Example 2

[0253] The substrate transport device of this example has two types of hands, namely, the first acquisition hand 51a and the first return hand 51b for high-speed transport and the second acquisition hand 61a and the second return hand 61b for low-speed transport, and has a control unit 100 for transporting the substrate W using the first acquisition hand 51a and the first return hand 51b and the second acquisition hand 61a and the second return hand 61b separately. By configuring in this way, when the shape of the substrate W is close to flat, it can be transported at high speed using the first acquisition hand 51a and the first return hand 51b, and when the warpage of the substrate W is large, it can be transported at low speed using the second acquisition hand 61a and the second return hand 61b. That is, according to the substrate transport device of the present invention, the substrate W can be transported in a method that is more in line with the actual situation of the substrate W accommodated in the carrier C.

[0254] In addition, according to this example, the thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the height direction is smaller than the thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the height direction. With this configuration, even if the warp of the substrate W is large and the minimum distance between the substrates is shortened, the substrate W to be transported can be transported more reliably by using the second acquisition hand 61a and the second return hand 61b.

[0255] According to this example, the space R1 between the first holding body 53a and the second holding body 53b in the first acquisition hand 51a and the first return hand 51b is smaller than the space R2 between the first blade 63a and the second blade 63b in the second acquisition hand 61a and the second return hand 61b. By configuring in this way, the first acquisition hand 51a and the first return hand 51b can more reliably hold the substrate W, so that the substrate W can be transported at a high speed. On the other hand, the second acquisition hand 61a and the second return hand 61b can reliably hold the warped substrate W between the first blade 63a and the second blade 63b.

[0256] According to this example, the first acquisition hand 51a and the first return hand 51b have a push rod 55 for holding the substrate W. Thus, the first acquisition hand 51a and the first return hand 51b can reliably hold the substrate W and transport it at a high speed. In addition, the second acquisition hand 61a and the second return hand 61b do not have a push rod. Thus, the device structure can be simplified and the thickness of the second acquisition hand 61a and the second return hand 61b in the height direction can be reduced.

[0257] 15. Modifications of the present invention

[0258] The present invention is not limited to the above-mentioned configuration, and can be implemented in modified forms as described below.

[0259] <Variation 1>

[0260] In the first embodiment, the configuration in which the first substrate W1 determined to be unable to be transported remains on the carrier C is described, but the present invention is not limited to this configuration, and the first substrate W1 may be transported. In this modified example, after the second substrate W2 is transported from the carrier C, when the first substrate W1 remains on the carrier C, the first substrate W1 is transported by the acquisition hand 11a. Fig.19 The figure shows a situation where the first substrate W1 warped downward and the second substrate W2 below it are placed on the comb-shaped component 7 of the carrier C. The third substrate W3 is located below the second substrate W2 in the comb-shaped component 7. The distance between the first substrate W1 and the second substrate W2 is D5 as measured by the sensor holding component 21. The distance D5 is so small that the acquisition hand 11a and the return hand 11b cannot enter between the first substrate W1 and the second substrate W2. Therefore, if the second substrate W2 is present on the carrier C, the first substrate W1 cannot be transported from the carrier C.

[0261] On the other hand, the distance between the second substrate W2 and the third substrate W3 is D1 as measured by the sensor holding member 21. The distance D1 is large enough that the acquisition hand 11a and the return hand 11b can enter between the second substrate W2 and the third substrate W3. Therefore, the second substrate W2 can be transported from the carrier C regardless of the presence or absence of the third substrate W3.

[0262] Fig. 20 The figure shows the situation of the carrier C after the second substrate W2 is transported from the carrier C. After the second substrate W2 is transported, the first substrate W1 and the third substrate W3 remain on the carrier C. There is a hollow protrusion of the comb-shaped component 7 between the first substrate W1 and the third substrate W3. Therefore, the distance D6 between the first substrate W1 and the third substrate W3 is at least greater than the distance D1. In other words, the acquisition hand 11a and the return hand 11b can enter between the first substrate W1 and the third substrate W3. Therefore, even if Fig.19 If the carrier C in the state of being transported sequentially transports the second substrate W2 and the first substrate W1, the first substrate W1 that cannot be transported temporarily can also be transported from the carrier C. It should be noted that when returning the substrate W to the carrier C, the first substrate W1 and the second substrate W2 may be transported sequentially.

[0263] In the above configuration, after the second substrate W2 is transferred from the carrier C, if the first substrate W1 previously determined to be untransferable remains on the carrier C, the first substrate W1 is transferred by the receiving hand 11a and the returning hand 11b. With this configuration, the first substrate W1 will not remain on the carrier C in the end.

[0264] <Variation 2>

[0265] In the above-mentioned first embodiment, there is no mention of the relationship between the entry speed of the sensor holding component 21 into the space between substrates and the entry speed of the acquisition hand 11a and the return hand 11b into the space between substrates. In this regard, the entry speed of the acquisition hand 11a and the return hand 11b can be made faster than the entry speed of the sensor holding component 21. According to this variation, the sensor holding component 21 is made to enter between the first substrate W and the second substrate W2 at the first speed, and the acquisition hand 11a is made to enter between the first substrate W1 and the second substrate W2 at a speed faster than the first speed. In the configuration of this variation, the acquisition hand 11a and the return hand 11b enter between the substrates at a speed faster than the sensor holding component 21, so that the effect of accelerating the substrate transport process can be obtained. In addition, by slowing down the entry speed of the sensor holding component 21, even if the sensor holding component 21 enters at a speed faster than the first speed, the sensor holding component 21 can be accelerated. Fig. 11B Even in the narrow space between substrates described above, the sensor holding member 21 does not contact the substrate W. On the other hand, since the receiving hand 11a and the returning hand 11b do not enter the space between substrates to such an extent that they cannot be transported, the entry speed can be increased.

[0266] <Variation 3>

[0267] In the above-mentioned second embodiment, a configuration further including the sensor holding member 21 of the first embodiment may be adopted. Fig.21The sensor holding component 71 in the figure is a component that enters between mutually adjacent substrates W. The sensor holding component 71 holds the first sensor 81 for measuring the distance to the upper substrate W and the second sensor 82 for measuring the distance to the lower substrate W. By allowing the sensor holding component 71 to enter between the substrates, the minimum distance between the substrates can be measured. It is also possible to adopt a structure that determines which hand is used for conveying the first substrate W1 based on the measured distance. That is, when the warping of the first substrate W1 is large and it is better to convey the substrate at a low speed, the second acquisition hand 61a is used to convey the first substrate W1. In addition, when the warping of the first substrate W1 is small and there is no problem even with high-speed substrate conveyance, the first substrate W1 is conveyed using the first acquisition hand 51a. If the warping of the first substrate W1 is large, the distance between the first substrate W1 and the second substrate W2 is short, so it is preferred to convey the substrate at a low speed. In addition, if the first substrate W1 is greatly warped, the first substrate W1 is easily touched by the hand, so it is preferred to transport the first substrate W1 using the second acquisition hand 61a with a large space R2 between the first blade 63a and the second blade 63b. On the other hand, when the first substrate W1 is flat, it is better to transport the substrate at a high speed. Thus, the processing capacity of the substrate transport device can be improved.

[0268] <Variation 4>

[0269] In the above embodiment 1, Fig. 22 As shown in FIG. 1 , the acquisition hand 11a may also be used as the sensor holding member 21. That is, the acquisition hand 11a is provided with the first sensor 41 and the second sensor 42. According to this configuration, the sensor group 43 is provided at the front end of the hand body 31 relative to the guide member 32. By adopting this configuration, a substrate transport device with a simple configuration can be provided in which the sensor holding member 21 is omitted.

Claims

1. A substrate transport device, characterized in that: include: A hand that holds and transports substrates one by one by entering between upper and lower adjacent substrates from a carrier that stores a plurality of substrates in a horizontal posture at predetermined intervals in a vertical direction, wherein an opening for taking out and storing substrates is provided on one side of the carrier; a sensor holding member that enters between upper and lower adjacent substrates and includes a first sensor for measuring the distance to the upper substrate and a second sensor for measuring the distance to the lower substrate; and a control unit configured to control the hand and the sensor holding member so as to move forward and backward from the opening of the carrier relative to the upper and lower adjacent substrates, The control unit causes the sensor holding member to enter between a first substrate to be conveyed and a second substrate located below the first substrate, and measures the minimum distance between the substrates based on the sum of a first minimum distance and a second minimum distance, wherein the first minimum distance is the distance between the first sensor and the substrate at a first measurement position closest to the first substrate, and the second minimum distance is the distance between the second sensor and the substrate at a second measurement position closest to the second substrate. When the control unit causes the hand to enter between the first substrate and the second substrate, the control unit adjusts the entry height of the hand according to the minimum distance between the substrates so that the distance from the hand to the first substrate and the distance from the hand to the second substrate are both above a specified value.

2. The substrate transport device according to claim 1, wherein: The front end of the hand is provided with a guide member for the end of the substrate to abut against. The first sensor and the second sensor are provided at the front end portion of the sensor holding member. The thickness of the front end portion of the sensor holding member in the height direction is smaller than the thickness of the front end portion of the hand in the height direction.

3. The substrate transport device according to claim 1, wherein: The first sensor measures the distance while moving from the end of the first substrate located at the opening of the carrier toward the inner side of the carrier. The second sensor measures the distance while moving from the end of the second substrate located at the opening of the carrier toward the inner side of the carrier. The control unit adjusts the entry height of the hand so that at the first measuring position where the first substrate is closest to the first sensor and at the second measuring position where the second substrate is closest to the second sensor, the distance from the hand to the first substrate and the distance from the hand to the second substrate are both above a specified value.

4. The substrate transport device according to claim 3, characterized in that: The control unit adjusts the entry height of the hand so that a distance from the hand to the first substrate at the first measurement position and a distance from the hand to the second substrate at the second measurement position become equal.

5. The substrate transport device according to claim 1, wherein: The sensor holding member does not transport the substrate.

6. The substrate transport device according to claim 3, characterized in that: The control unit does not allow the hand to enter between the first substrate and the second substrate when the distance between the first substrate and the second substrate is short and the distance from the hand to the first substrate at the first measuring position and the distance from the hand to the second substrate at the second measuring position cannot be simultaneously greater than a specified value.

7. The substrate transport device according to claim 1, wherein: The upper surface of the sensor holding member is located above the lower end of the first sensor. A lower surface of the sensor holding member is located below an upper end of the second sensor.

8. The substrate transport device according to claim 1, wherein: The hand includes a first holding body for holding one end of the substrate and a second holding body for holding the other end of the substrate. The sensor holding member includes at least two sensor groups consisting of the first sensor and the second sensor. The first sensor group measures the distance between the first substrate and the second substrate at the entry position of the first holding body. The second sensor group measures the distance between the first substrate and the second substrate at the entry position of the second holding body.

9. The substrate transport device according to claim 8, characterized in that: The sensor holding member includes a first protrusion extending corresponding to the first holding body and a second protrusion extending corresponding to the second holding body.

10. The substrate transport device according to claim 9, wherein: The sensor holding member includes the sensor group at the front end of the first protrusion, and includes the sensor group at the front end of the second protrusion.

11. The substrate transporting device according to claim 9, wherein: The sensor holding member includes the first sensor and the second sensor at the same position of the first protrusion. The first sensor and the second sensor are provided at the same position of the second protrusion.

12. The substrate transporting device according to claim 1, wherein: The control unit prevents the hand from entering between the first substrate and the second substrate when the distance between the first substrate and the second substrate is short and the sensor holding member cannot enter between the first substrate and the second substrate.

13. The substrate transporting device according to claim 1, wherein: The control unit controls the hand to transport the first substrate when the first substrate remains in the carrier after the second substrate is transported from the carrier.

14. The substrate transporting device according to claim 1, wherein: The control unit causes the sensor holding member to enter between the first substrate and the second substrate at a first speed, The hand is caused to enter between the first substrate and the second substrate at a second speed faster than the first speed.

15. The substrate transporting device according to claim 1, wherein: The sensor holding member is located at the same position as the hand before entering between the substrates.

16. The substrate transporting device according to claim 1, wherein: The hand also serves as the sensor holding member, The first sensor and the second sensor are mounted on the hand.

17. A substrate processing device, characterized in that: include: The substrate transport device according to claim 1; as well as A processing unit performs a predetermined process on the substrate transported by the substrate transport device.

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