Heat dissipation assembly, heat dissipation system and automobile
By designing a heat dissipation component including a shell, elastic parts and liquid-cooled veneer, the problems of poor heat dissipation and coolant leakage caused by large gap between the SOC and the cold plate are solved, and more efficient heat dissipation and better sealing are achieved.
Patent Information
- Application Number
- CN202311222973.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-20
- Publication Date
- 2025-03-21
AI Technical Summary
Due to the large gap between the SOC and the cold plate, the thermal resistance of the thermal interface material is large, which in turn deteriorates the heat dissipation effect of the chip, and there is a risk of overtemperature or burning. At the same time, when the spring member squeezes the cold plate close to the SOC, it is easy to cause deformation of the coolant circulation pipeline and liquid leakage.
A heat dissipation component is designed, including a shell, an elastic member and a liquid-cooled veneer. A thermal conductive layer is provided on the liquid-cooled veneer. The elastic member drives the liquid-cooled veneer to approach the chip, so that the thermal conductive layer is in full contact with the chip and reduces thermal resistance. At the same time, by installing seals at the inlet and outlet pipes of the liquid-cooled veneer, cooling liquid is prevented from leaking into the inside of the housing.
It improves the sealing of the heat dissipation component, avoids the problem of coolant leakage, enhances the heat dissipation effect of the chip, reduces the risk of overtemperature or burning, and improves the overall performance of the component.
Smart Images
Figure CN119673890A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat dissipation component, a heat dissipation system and a car. Background Art
[0002] In-vehicle systems usually use cold plates to dissipate heat for system-on-chips (SOCs). Setting a thermal interface material (TIM) between the cold plate and the SOC can improve the heat dissipation effect. The SOC is mounted on a circuit board, and the cold plate is fixed to the circuit board by screw columns. Due to the height tolerance of the SOC and the height tolerance of the screw columns, the gap between the SOC and the cold plate is about 1 to 2 mm. Due to the large gap, the thermal resistance of the thermal interface material (TIM) filled in the gap is large, which will deteriorate the heat dissipation of the chip and create the risk of overheating or burning. Therefore, a spring member is usually set on the cold plate to squeeze the spring member so that the cold plate is close to the SOC and the thickness of the TIM is squeezed, thereby avoiding the problem of deterioration of the heat dissipation of the SOC. However, when the spring member squeezes the cold plate close to the SOC, the coolant circulation pipeline (usually a hard tube) set on the cold plate will be deformed, which is prone to liquid leakage, and the leaked liquid may cause damage or short circuit to the SOC. Summary of the invention
[0003] The present application provides a heat dissipation component, a heat dissipation system and a car, thereby improving the sealing of the heat dissipation component, avoiding the problem of coolant leakage, and protecting the chip from being corroded by the liquid.
[0004] In a first aspect, the present application provides a heat dissipation component, which includes a shell, an elastic member and at least one liquid-cooled board. A heat-conducting layer is provided on each liquid-cooled board, and the side of the heat-conducting layer facing away from the liquid-cooled board is used to set the corresponding chip. The shell has a accommodating cavity, and the at least one liquid-cooled board and the elastic member are arranged in the accommodating cavity. The elastic member corresponding to each liquid-cooled board is used to drive the liquid-cooled board close to the corresponding chip, so that the liquid-cooled board and the chip are respectively in full contact with the heat-conducting layer. In this way, the liquid-cooled board is thermally connected to the chip in a floating installation manner, so that the liquid-cooled board compresses the heat-conducting layer as much as possible to fit the chip, so that the thermal resistance of the heat-conducting layer is small, thereby improving the heat dissipation effect of the heat dissipation component. The liquid-cooled single board also includes a first liquid inlet pipe and a first liquid outlet pipe, which are respectively used to connect to the liquid cooling system. The shell has a first through hole and a second through hole. The first liquid inlet pipe extends to the outside of the shell through the first through hole, and the first liquid outlet pipe extends to the outside of the shell through the second through hole. The first liquid inlet pipe and the first liquid outlet pipe extend out of the accommodating cavity, and a sealing member is provided between the outer wall of the first liquid inlet pipe and the inner wall of the first through hole, and a sealing member is provided between the outer wall of the first liquid outlet pipe and the inner wall of the second through hole, so as to reduce the situation where the cooling liquid enters the internal accommodating cavity of the shell and damages the chip when leakage occurs at the pipe openings of the first liquid inlet pipe and the first liquid outlet pipe.
[0005] In a technical solution, the elastic member can be a spring or a spring sheet. Accordingly, the elastic member is installed along the elastic direction at one end on the first side of the liquid cooling board away from the heat conducting layer, and the other end is installed on a side of the housing opposite to the first side of the liquid cooling board. Using the spring or spring sheet as the elastic member has a simple structure and low cost.
[0006] In another technical solution, the elastic member may also include a spring and a screw, and the screw includes a screw rod and a screw head. Correspondingly, the liquid cooling board has a third through hole. When the chip is set on the circuit board, the screw rod passes through the third through hole to be connected to the circuit board, and the spring is sleeved on the outer wall of the screw rod and is located between the screw head and the liquid cooling board. The spring screw is used as an elastic member, which is flexible to install. During installation, the fixing position of the spring screw can be determined according to the remaining space of the accommodating cavity of the shell. In this solution, when the space between the liquid cooling board and the top of the shell is large, the screw rod can be connected to the circuit board through the third through hole, and the spring is located between the screw head and the liquid cooling board.
[0007] In another technical solution, the elastic member may also include a spring and a screw, and the screw includes a screw rod and a screw head. When the chip is arranged on the circuit board, the circuit board has a fourth through hole. The screw rod passes through the fourth through hole and is connected to the corresponding liquid cooling single board, and the spring is sleeved on the outer wall of the screw rod and is located between the screw head and the circuit board. The spring screw is used as the elastic member, and the installation is flexible. During installation, the fixing position of the spring screw can be determined according to the remaining space of the accommodating cavity of the shell. The spring screw is used as the elastic member, and the installation is flexible. During installation, the fixing position of the spring screw can be determined according to the remaining space of the accommodating cavity of the shell. In this solution, when the space between the circuit board and the bottom of the shell is large, the screw rod can be passed through the fourth through hole and connected to the corresponding liquid cooling single board, and the spring is located between the screw head and the circuit board.
[0008] In one technical solution, the shell is a shell having a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe are arranged on the side of the shell away from the accommodating cavity, and the second liquid inlet pipe and the second liquid outlet pipe are connected to the hollow cavity to form a coolant flow channel. The second liquid inlet pipe and the second liquid outlet pipe are used to connect to the liquid cooling system. The shell dissipates heat through the coolant, which can effectively reduce the temperature in the accommodating cavity. In addition, when the accommodating cavity is provided with a chip mounted on a circuit board and other heat source devices, the shell can also dissipate heat for other heat source devices.
[0009] In a technical solution, the heat dissipation assembly may further include a plurality of fins, and the plurality of fins are arranged on the surface of the housing away from the accommodating cavity. Optionally, the plurality of fins may be evenly arranged on the surface of the housing away from the accommodating cavity. The arrangement of the plurality of fins increases the surface area of the housing in a disguised manner, which is conducive to improving the heat dissipation efficiency of the heat dissipation assembly.
[0010] In the second aspect, the present application also provides a heat dissipation system, which includes a liquid cooling system and a heat dissipation component in any possible technical solution in the first aspect, and the heat dissipation component is connected to the liquid cooling system through a pipeline, and the pipeline is a flexible pipe. Since the heat dissipation component in any possible technical solution in the first aspect can improve the heat dissipation effect and reduce the situation where the coolant enters the internal accommodating cavity of the shell and damages the chip when leakage occurs at the pipe openings of the first liquid inlet pipe and the first liquid outlet pipe, the heat dissipation system here also has these technical effects. In addition, a flexible pipe is used to connect the heat dissipation component and the liquid cooling system, and no bridging force will be generated at the connection between the first liquid inlet pipe and the second liquid outlet pipe and the pipeline, avoiding the existing risk of stress on the chip caused by the bridge force generated by directly setting the pipeline on the liquid cooling board.
[0011] In one technical solution, the liquid cooling system includes a first liquid outlet and a first liquid inlet, the first liquid outlet is connected to the first liquid inlet pipe through a pipeline, and the first liquid inlet is connected to the first liquid outlet pipe through a pipeline. The liquid cooling board and the liquid cooling system are connected through a pipeline to form a coolant loop, and the coolant circulates in the loop to dissipate heat for the chip, with a good heat dissipation effect.
[0012] In a technical solution, the heat dissipation system further includes a first connector and a second connector. The first connector and the second connector have the same structure, and are both multi-way connectors. The first connector specifically includes a first main opening and at least one first branch opening, the first main opening is connected to the first liquid outlet through a pipeline, and each first branch opening is connected to the first liquid inlet pipe of the corresponding liquid cooling board through a pipeline. The second connector specifically includes a second main opening and at least one second branch opening, the second main opening is connected to the first liquid inlet through a pipeline, and each second branch opening is connected to the first liquid outlet pipe of the corresponding liquid cooling board through a pipeline. The first connector diverts the coolant flowing through the liquid cooling system, and the diverted coolant enters each liquid cooling board, so that the pressure of the cooling liquid is balanced. The second connector makes the coolant flowing out of the liquid cooling board converge and then return to the liquid cooling system. The liquid cooling system is connected to the liquid cooling board through the first connector and the second connector, so that multiple liquid cooling boards can be in parallel with each other, reducing the flow resistance of the coolant in the liquid cooling board.
[0013] In one technical solution, the shell is a shell having a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe are provided on the side of the shell facing away from the accommodating cavity, and the second liquid inlet pipe and the second liquid outlet pipe are connected to the hollow cavity to form a cooling liquid flow channel. The second liquid inlet pipe and the second liquid outlet pipe are used to be connected to a liquid cooling system. The liquid cooling system includes a second liquid outlet and a second liquid inlet, the second liquid outlet is connected to the second liquid inlet pipe through a pipeline, and the second liquid inlet is connected to the second liquid outlet pipe through a pipeline. The shell dissipates heat through the coolant, which can effectively reduce the temperature in the accommodating cavity of the shell, and helps to improve the heat dissipation effect of the chip or other heat source devices arranged in the accommodating cavity.
[0014] In a third aspect, the present application also provides a car, which includes a car body, a chip, a circuit board, and a heat dissipation system in any possible technical solution in the second aspect, wherein the chip, the circuit board, and the heat dissipation system are all installed in the car body. The chip is installed on the circuit board, and a liquid cooling board is arranged on the side of the circuit board with the chip, and the heat dissipation system dissipates heat from the chip through the liquid cooling board. Since the heat dissipation effect of the above-mentioned heat dissipation system is good and the reliability of the chip can be improved, the heat dissipation effect of the car is also good and the operating performance is stable. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a schematic diagram of an existing heat dissipation structure;
[0016] Figure 2 This is a schematic diagram of the structure of a heat dissipation component, a chip, and a circuit board in one embodiment of the present application;
[0017] Figure 3 This is a schematic structural diagram of a heat dissipation component, a chip, and a circuit board in another embodiment of the present application;
[0018] Figure 4 This is a schematic structural diagram of a heat dissipation component, a chip, and a circuit board in another embodiment of the present application;
[0019] Figure 5 This is a schematic diagram of the structure of a heat dissipation system in one embodiment of the present application;
[0020] Figure 6 This is a schematic diagram of the structure of a five-way joint in an embodiment of the present application;
[0021] Figure 7 FIG. 1 is a schematic diagram of a heat dissipation system in another embodiment of the present application.
[0022] Reference numerals:
[0023] 100-fixed plate; 200-cold plate; 201-pressing plate; 300-sealing ring; 400-SOC; 1-housing; 2-circuit board; 3-elastic member; 4-chip; 5-liquid cooling board; 6-heat conducting layer; 51-first liquid inlet pipe; 52-first liquid outlet pipe; 7-liquid cooling system; 71-first liquid outlet; 72-first liquid inlet; 8-pipeline; 11-first housing; 12-second housing; 111-first through hole; 112-second through hole; 9-sealing member; 110-top wall; 31- Spring; 32-screw; 321-screw rod; 322-screw head; 50-third through hole; 20-fourth through hole; 13-bracket; 14-heat source device; 113-heat conductive boss; 101-first connector; 102-second connector; 1011-first main opening; 1012-first branch opening; 1021-second main opening; 1022-second branch opening; 501-first liquid-cooled board; 502-second liquid-cooled board; 503-third liquid-cooled board; 504-fourth liquid-cooled board. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship, and they do not represent the true proportion.
[0025] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific implementation methods disclosed below.
[0026] In order to facilitate understanding of the heat dissipation assembly, heat dissipation system and automobile provided in the embodiments of the present application, their application scenarios are first introduced below.
[0027] The automotive electrical and electronic architecture (EE) refers to the overall layout of the vehicle's electrical and electronic systems, which is to connect the wiring harnesses of various sensor processors in the car to the electrical and electronic distribution system and integrate the software and hardware together to achieve the functional computing power and energy distribution of the vehicle. The EE architecture includes multiple electronic control units (ECUs). Multiple ECUs with different functions will be installed on a central computing platform, which will cause the system-on-chip (SOC) of the central computing platform to consume a lot of power. In addition, the internationally accepted level of automotive autonomous driving is divided into six levels from L0 to L5 according to different degrees, from zero to full automation. With each increase in the level of autonomous driving, the computing power required by the central computing platform increases exponentially, resulting in an increase in the power consumption of the SOC and the heat generation. Therefore, the heat dissipation of the SOC has become a focus of attention.
[0028] The heat dissipation component usually uses a cold plate to dissipate heat for the SOC, and a thermal interface material (TIM) is set between the cold plate and the SOC. The SOC is installed on the circuit board, and the cold plate is installed on the circuit board through screw columns. Due to the height tolerance of the SOC and the height tolerance of the screw column of the cold plate, the gap distance between the SOC and the cold plate is large, thereby making the thickness of the thermal interface material (TIM) set between the cold plate and the SOC large, so that the thermal resistance of the TIM is large, resulting in poor heat dissipation effect of the heat dissipation component. Therefore, a spring member is usually set on the cold plate, and the elastic force of the spring member is used to make the cold plate close to the SOC, squeezing the thickness of the TIM, making the TIM thinner and having a smaller thermal resistance, thereby avoiding the problem of deterioration of the heat dissipation of the SOC. However, when the spring member squeezes the cold plate close to the SOC, the coolant circulation pipeline set on the cold plate will be deformed, which is prone to liquid leakage, and the leaked liquid may cause damage or short circuit to the SOC.
[0029] in addition, Figure 1 is a schematic diagram of an existing heat dissipation structure, such as Figure 1 As shown, in the prior art, in order to isolate the SOC400 from the leaked coolant, the cold plate 200 is fixedly mounted on a fixed plate 100, a pressure plate 201 is arranged on the peripheral side of the cold plate 200, and a sealing ring 300 is arranged between the pressure plate 201 and the fixed plate 100 to prevent the leaked coolant from flowing from the gap between the fixed plate 100 and the cold plate 200 to the SOC400. The use of this waterproof structure results in a larger size of the cold plate 200. When the SOC400 on the circuit board are arranged densely, the cold plates 200 will interfere with each other, and the pressure plate 201 makes the processing technology of the cold plate 200 more complicated.
[0030] Figure 2FIG. 1 is a schematic diagram of the structure of a heat dissipation component, a chip and a circuit board in an embodiment of the present application. Figure 2 As shown, in order to solve the above problems, an embodiment of the present application provides a heat dissipation component, which includes a shell 1, an elastic member 3 and at least one liquid-cooled single board 5. The shell 1 has a receiving cavity, and the liquid-cooled single board 5 and the elastic member 3 are arranged in the receiving cavity. Each liquid-cooled single board 5 is provided with a heat-conducting layer 6, and the heat-conducting layer 6 can be fixed to the surface of the liquid-cooled single board 5 in the form of coating or pasting. The side of the heat-conducting layer 6 facing away from the liquid-cooled single board 5 is used to set the corresponding chip 4, and the liquid-cooled single board 5 is used to dissipate heat for the chip 4. The elastic member 3 is used to drive the liquid-cooled single board 5 to approach the chip 4, so that the liquid-cooled single board 5 presses the heat-conducting layer 6, so that the thickness of the heat-conducting layer 6 is thinner, the thermal resistance of the heat-conducting layer 6 is smaller, and the heat conduction effect is better, thereby improving the heat dissipation efficiency of the heat dissipation component.
[0031] The chip 4 is a high-power chip, such as a SOC. The chip 4 is mounted on the surface of the circuit board 2. A plurality of chips 4 can be arranged on the circuit board 2. Each liquid cooling board 5 in the heat dissipation assembly dissipates heat for a corresponding chip 4.
[0032] The above-mentioned heat-conducting layer 6 is made of a heat-conducting interface material, and is used to reduce the contact thermal resistance between the liquid-cooling board 5 and the chip 4, so that the heat generated by the chip 4 can be transferred to the liquid-cooling board 5 faster and more effectively. The heat-conducting layer 6 can be slightly deformed under the action of pressure. The liquid-cooling board 5 is heat-conductingly connected to the chip 4 in a floating installation manner, and the elastic member 3 provides the liquid-cooling board 5 with a thrust toward the chip 4, so that the liquid-cooling board 5 and the chip 4 are fully in contact with the heat-conducting layer 6 respectively, and the heat-conducting layer 6 is made thinner, which reduces the thermal resistance of the heat-conducting layer 6, thereby achieving a better heat dissipation effect of the heat dissipation component.
[0033] The above-mentioned heat-conducting layer 6 includes but is not limited to any one or more of the following heat-conducting interface materials: thermal grease, thermal silicone sheet, thermal phase change material, thermal double-sided tape, and thermal graphite sheet.
[0034] The liquid cooling board 5 can be a water cooling head or a cold plate. The liquid cooling board 5 has a channel for liquid flow inside, and the channel is filled with cooling liquid. The liquid cooling board 5 includes a first liquid inlet pipe 51 and a first liquid outlet pipe 52, and the first liquid inlet pipe 51 and the first liquid outlet pipe 52 are used to connect with the external liquid cooling system 7. The cooling liquid is transported to the liquid cooling system 7 through a power device such as a hydraulic pump. After the liquid cooling system 7 cools the cooling liquid, it is driven by the power device to flow back to the liquid cooling board 5, thereby taking away the heat generated by the chip 4, thereby cooling the chip 4.
[0035] The housing 1 has a first through hole 111 and a second through hole 112, which can be located on the top wall 110 of the housing 1. The first liquid inlet pipe 51 and the first liquid outlet pipe 52 are both located on the side of the liquid cooling board 5 facing the top wall 110. The first liquid inlet pipe 51 extends to the outside of the housing 1 through the first through hole 111, and the first liquid outlet pipe 52 extends to the outside of the housing 1 through the second through hole 112. Since the pipe openings of the first liquid inlet pipe 51 and the first liquid outlet pipe 52 are located outside the housing 1, when leakage occurs at the pipe openings, the cooling liquid will not directly flow into the housing 1 to damage the chip 4.
[0036] A seal 9 is provided between the outer wall of the first liquid inlet pipe 51 and the inner wall of the first through hole 111, and a seal 9 is also provided between the outer wall of the first liquid outlet pipe 52 and the inner wall of the second through hole 112. The seal 9 may be a sealing ring or a sealant, which seals the gap between the first liquid inlet pipe 51 and the hole wall of the first through hole 111, and the gap between the first liquid outlet pipe 52 and the hole wall of the second through hole 112, so that the housing 1 is sealed to prevent the coolant from entering the housing 1 when the liquid cooling system 7 leaks accidentally, causing damage to the chip 4 and other devices. The housing 1 is made of dustproof and waterproof material, and its dustproof and waterproof protection level is at least IP52.
[0037] The structure and installation method of the elastic member 3 are described below.
[0038] Please continue to refer to Figure 2 In a feasible embodiment, the elastic member 3 is specifically a spring or a spring sheet. The elastic member 3 is installed along the elastic direction at one end on the first side of the liquid cooling board 5 away from the heat conducting layer 6, and the other end is installed on a surface of the housing 1 opposite to the first side of the liquid cooling board 5. That is, the elastic member 3 is located between the top wall 110 and the liquid cooling board 5, one end of the elastic member 3 is connected to the side of the top wall 110 facing the liquid cooling board 5, and the other end is connected to the side of the liquid cooling board 5 facing the top wall 110. When installing the elastic member 3, it can be fixed to the top wall 110 and the liquid cooling board 5 by bonding or welding. The top wall 110 is parallel to the chip 4, and the elastic direction of the elastic member 3 is perpendicular to the chip 4. The elastic member 3 has a pre-tightening force under the extrusion of the top wall 110 and the liquid cooling board 5, and the pre-tightening force drives the liquid cooling board 5 to approach the chip 4, so that the liquid cooling board 5 and the chip 4 press the heat conducting layer 6 to improve the heat dissipation effect. Selecting a spring or a spring as the elastic member has a simple structure and low installation cost.
[0039] The elastic member 3 may also be a spring screw, specifically comprising a spring 31 and a screw 32, wherein the screw 32 comprises a screw rod 321 and a screw head 322, and the spring 31 is sleeved on the outer wall of the screw rod 321. By using a spring screw as the elastic member 3, the fixing position of the spring screw and the setting position of the spring can be determined according to the remaining space of the accommodating cavity of the housing 1, and the installation is flexible. There are two specific ways to install the spring screw.
[0040] Figure 3 FIG. 1 is a schematic diagram of the structure of a heat dissipation component, a chip and a circuit board in another embodiment of the present application. Figure 3 As shown, in a feasible embodiment, the liquid cooling board 5 has a third through hole 50. When the chip 4 is mounted on the circuit board 2, the screw 321 passes through the third through hole 50 and is threadedly connected to the circuit board 2, and the spring 31 is located between the screw head 322 and the liquid cooling board 5. The spring 31 has a pre-tightening force under the extrusion of the screw head 322 and the liquid cooling board 5. The pre-tightening force drives the liquid cooling board 5 to approach the chip 4, thereby pressing the heat conducting layer 6 to improve the heat dissipation effect of the liquid cooling board 5. In this solution, the space between the liquid cooling board 5 and the top of the housing 1 is large, so the screw 321 can pass through the third through hole 50 to be connected to the circuit board 2, and the spring 31 is located between the screw head 322 and the liquid cooling board 5.
[0041] Figure 4 FIG. 1 is a schematic diagram of the structure of a heat dissipation component, a chip and a circuit board in another embodiment of the present application. Figure 4 As shown, in another feasible embodiment, when the chip 4 is mounted on the circuit board 2, the circuit board 2 has a fourth through hole 20, the screw 321 passes through the fourth through hole 20 and is threadedly connected to the liquid cooling board 5, and the screw head 322 is located on the side of the circuit board 2 away from the liquid cooling board 5. The spring 31 is located between the screw head 322 and the circuit board 2. The spring 31 has a pre-tightening force under the extrusion of the screw head 322 and the circuit board 2, and the pre-tightening force drives the screw head 322 away from the circuit board 2, so that the liquid cooling board 5 is close to the chip 4, and then the heat conductive layer 6 is pressed to improve the heat dissipation effect of the liquid cooling board 5. In this solution, the space between the circuit board 2 and the bottom of the shell 1 is relatively large, so the screw 321 can pass through the fourth through hole 20 to be connected to the corresponding liquid cooling board 5, and the spring 31 is located between the screw head 322 and the circuit board 2.
[0042] Please refer to Figure 2 to Figure 4 To prevent the circuit board 2 from being damaged, a bracket 13 may be installed on the side of the circuit board 2 facing away from the chip 4. When installing the spring screw, the screw 321 may be fixed to the bracket 13, or when the screw 321 is fixed to the liquid cooling board 5, the spring 31 may be clamped between the bracket and the screw head 322. When installing the circuit board 2, the screw is passed through the bracket 13 and the circuit board 2 and connected to the screw column of the housing 1, so that the circuit board 2 is fixed to the housing 1.
[0043] In one embodiment, when the heat dissipation component dissipates heat for the chip 4, the chip 4 needs to be installed in the accommodating cavity of the shell 1. When the liquid cooling board 5 dissipates heat for the chip 4, the heat that is not dissipated in time will accumulate in the accommodating cavity. The above-mentioned shell 1 can be a shell with a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe (not shown in the figure) are provided on the side of the shell 1 away from the accommodating cavity. The second liquid inlet pipe and the second liquid outlet pipe are connected to the hollow cavity to form a coolant flow channel, and the second liquid inlet pipe and the second liquid outlet pipe are used to connect to the liquid cooling system 7. The shell 1 dissipates heat through the coolant, which can effectively reduce the temperature in the accommodating cavity.
[0044] In another embodiment, the heat dissipation assembly may further include a plurality of fins (not shown in the figure), and the plurality of fins are arranged on the surface of the shell 1 on the side away from the accommodating cavity. The plurality of fins may be evenly arranged on the surface of the shell on the side away from the accommodating cavity. The surface area of the shell 1 is increased in disguise by the arrangement of the plurality of fins, which is beneficial to improving the heat dissipation efficiency of the heat dissipation assembly. The shell 1 is a shell having a hollow cavity, and the hollow cavity is filled with coolant. In this embodiment, the shell 1 adopts a combination of air cooling and liquid cooling to dissipate heat for the accommodating cavity, and the heat dissipation effect is better.
[0045] In another embodiment, the housing 1 may also be a solid metal die-cast housing, the metal material has good thermal conductivity, and a plurality of fins are arranged on the surface of the housing away from the accommodating cavity, and the plurality of fins may be evenly arranged on the surface of the housing 1 away from the accommodating cavity. In this embodiment, the housing 1 adopts the form of air cooling and heat dissipation, and the surface area of the housing 1 is increased in disguise by the arrangement of a plurality of fins, which is conducive to improving the heat dissipation efficiency of the heat dissipation component.
[0046] In addition to the high-power chip 4 that needs to dissipate heat, the circuit board 2 may also be equipped with a plurality of heat source devices 14, such as CPU, GPU, ASIC chip, etc. These heat source devices 14 will also generate heat when working, and the generated heat will increase the temperature in the accommodation cavity.
[0047] Please refer to Figure 2 to Figure 4 In order to dissipate heat from the heat source device 14 and reduce the over-high temperature in the accommodation cavity, in one embodiment, a heat-conducting boss 113 may be provided on the side of the housing 1 facing the accommodation cavity, and the heat-conducting boss 113 corresponds to the position of the heat source device 14. A heat-conducting layer 6 may be provided between the heat-conducting boss 113 and the heat source device 14 to reduce the thermal resistance between the heat source device 14 and the heat-conducting boss 113. The heat-conducting layer 6 may be a gel or a heat-conducting pad.
[0048] In one embodiment, the housing 1 includes a first housing 11 and a second housing 12, which are buckled together to form a receiving cavity, and a seal (not shown in the figure) may also be provided at the connection between the first housing 11 and the second housing 12 to improve the sealing of the housing 1. The housing 1 adopts a split design, and the first housing 11 and the second housing 12 can be respectively configured as housings with a hollow cavity and connected to a liquid cooling system according to heat dissipation requirements, or the first housing 11 and the second housing 12 can be respectively configured as metal die-cast housings with fins. The split housing 1 improves the flexibility of heat dissipation.
[0049] The heat source device 14 may be installed on the side of the circuit board 2 facing the first shell 11 , or on the side of the circuit board 2 facing the second shell 12 , or on both sides of the circuit board 2 .
[0050] Based on the same inventive concept, an embodiment of the present application also provides a heat dissipation system. Figure 5 FIG. 1 is a schematic diagram of the structure of a heat dissipation system in one embodiment of the present application. Figure 5 As shown, the heat dissipation system includes a liquid cooling system 7 and a heat dissipation component in any of the above-mentioned embodiments, and the heat dissipation component is connected to the liquid cooling system 7 through a pipeline 8. The above-mentioned pipeline 8 is a flexible tube. When a rigid tube, such as an aluminum tube, is used, one end of the aluminum tube is fixed and the other end is connected to the liquid cooling single board 5. The floatingly installed liquid cooling single board 5 will move up and down, so the end of the aluminum tube connected to the liquid cooling single board 5 will also move up and down with the liquid cooling single board 5. Since the aluminum tube has a certain plastic deformation ability, when the liquid cooling single board 5 moves up and down, a bridging force will be generated at the connection between the aluminum tube and the first liquid inlet pipe 51 and the first liquid outlet pipe 52, and the chip 4 is subjected to the combined force of the driving force of the spring and the bridging force of the aluminum tube. The aluminum tube deforms under long-term stress, and the bridging force will also change at this time. In this case, since the bridging force is variable, the calculation of the combined force on the chip 4 is complicated, resulting in the difficulty in controlling the force on the chip 4. In the embodiment of the present application. The above-mentioned pipeline 8 can be a flexible tube. Compared with a rigid tube, the flexible tube can be bent freely without generating a bridging force. Therefore, the chip 4 is only subjected to the driving force from the spring on the liquid cooling board 5 , so that the force on the chip 4 is controllable, thereby reducing the stress risk of the chip 4 .
[0051] In a feasible implementation manner, the first liquid inlet pipe 51 and the first liquid outlet pipe 52 are respectively connected to the pipeline 8 by plugging, and a seal (not shown in the figure) can also be arranged between the first liquid inlet pipe 51 and the pipeline 8 and between the first liquid outlet pipe 52 and the pipeline 8 to reduce the gap at the connection position between the first liquid inlet pipe 51 and the first liquid outlet pipe 52 and the pipeline 8, which may cause leakage of the coolant.
[0052] In one embodiment, the liquid cooling system includes a first liquid outlet 71 and a first liquid inlet 72, the first liquid outlet 71 is connected to the first liquid inlet pipe 51 of the liquid cooling board 5 through a pipeline 8, and the first liquid inlet 72 is connected to the first liquid outlet pipe 52 of the liquid cooling board 5 through a pipeline 8.
[0053] The liquid cooling system 7 also includes a second liquid outlet and a second liquid inlet (not shown in the figure), the second liquid outlet is connected to the second liquid inlet pipe through a pipeline 8, and the second liquid inlet is connected to the second liquid outlet pipe through a pipeline 8. In the present embodiment, the shell 1 is a shell having a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe (not shown in the figure) are arranged on the side of the shell 1 away from the accommodating cavity, and the second liquid inlet pipe and the second liquid outlet pipe are connected to the hollow cavity to form a coolant flow channel. The shell 1 is connected to the liquid cooling system 7 to form a coolant circuit, which can dissipate heat for the accommodating cavity and further enhance the heat dissipation effect of the heat dissipation component. The coolant circuit where the shell 1 is located is independent of the coolant circuit where the liquid cooling board 5 is located, which is convenient for maintenance.
[0054] When the heat dissipation assembly includes a plurality of liquid-cooled boards 5, in order to ensure that the pressure of the coolant in each liquid-cooled board 5 is consistent, the liquid cooling system 7 is connected to each liquid-cooled board 5 through a first connector 101 and a second connector 102. The first connector 101 includes a first main opening 1011 and at least one first branch opening 1012, the first main opening 1011 is connected to the first liquid outlet 71 through a pipeline 8, and each first branch opening 1012 is connected to the first liquid inlet pipe 51 of the corresponding liquid-cooled board 5 through a pipeline 8. The second connector 102 includes a second main opening 1021 and at least one second branch opening 1022, the second main opening 1021 is connected to the first liquid inlet 72 through a pipeline 8, and each second branch opening 1022 is connected to the first liquid outlet pipe 52 of the corresponding liquid-cooled board 5 through a pipeline 8. The first connector 101 divides the cooling liquid of the liquid cooling system 7 and evenly distributes it to each liquid cooling board 5, and the cooling liquid of each liquid cooling board 5 is then collected and returned to the liquid cooling system 7 through the second connector 102. The liquid cooling system is connected to the liquid cooling board 5 through the first connector 101 and the second connector 102, so that multiple liquid cooling boards 5 can be connected in parallel with each other, reducing the flow resistance of the cooling liquid in the liquid cooling board 5.
[0055] Figure 6 This is a schematic diagram of a five-way joint structure in an embodiment of the present application, combined with Figure 5 and Figure 6In a specific embodiment, the heat dissipation system includes a first connector 101, a second connector 102 and four liquid cooling boards 5 (only two are shown in the figure). The first connector 101 and the second connector 102 have the same structure, both of which are five-way connectors, and the five-way connector includes five openings that are interconnected. Specifically, the first connector 101 includes a first main opening 1011 and four first branch openings 1012, the first main opening 1011 is connected to the first liquid outlet 71 through a pipeline 8, and each first branch opening 1012 is connected to the first liquid inlet pipe 51 of the corresponding liquid cooling board 5 through a pipeline 8, so that the cooled coolant in the liquid cooling system 7 flows into the four liquid cooling boards 5 respectively. The second connector 102 includes a second main opening 1021 and four second branch openings 1022, the second main opening 1021 is connected to the first liquid inlet 72 through a pipeline 8, and each second branch opening 1022 is connected to the first liquid outlet pipe 52 of the corresponding liquid cooling board 5 through a pipeline 8. The second main opening 1021 of the second connector 102 is connected to the liquid inlet of the liquid cooling system 7, and the other four second branch openings 1022 are respectively connected to the first liquid outlet pipes 52 of the four liquid cooling boards 5 through pipelines 8, so that the coolant in the liquid cooling boards 5 converge and flow back into the liquid cooling system 7.
[0056] Figure 7 This is a schematic diagram of a heat dissipation system in another embodiment of the present application, Figure 5 and Figure 7In another specific embodiment, the heat dissipation system includes a first connector 101, a second connector 102 and four liquid-cooled boards. The first connector 101 and the second connector 102 have the same structure and are both three-way connectors. The three-way connector includes three openings that are interconnected, and the three openings include a main opening and two branch openings. The first connector 101 is used to connect the first liquid inlet pipe 51 of the liquid-cooled board 5, and the second connector 102 is used to connect the first liquid outlet pipe 52 of the liquid-cooled board 5. Specifically, the liquid-cooled board 5 includes a first liquid-cooled board 501, a second liquid-cooled board 502, a third liquid-cooled board 503 and a fourth liquid-cooled board 504. Among them, the first liquid-cooled board 501 and the second liquid-cooled board 502 are in a series relationship, and the third liquid-cooled board 503 and the fourth liquid-cooled board 504 are in a series relationship. That is, the first liquid outlet pipe 52 of the first liquid cooling board 501 is connected to the first liquid inlet pipe 51 of the second liquid cooling board 502 through the pipeline 8, and the first liquid outlet pipe 52 of the third liquid cooling board 503 is connected to the first liquid inlet pipe 51 of the second liquid cooling board 502 through the pipeline 8. During installation, the first main opening 1011 of the first connector 101 is connected to the first liquid outlet 71 of the liquid cooling system 7, and the other two second branch openings 1022 are respectively connected to the first liquid inlet pipes 51 of the first liquid cooling board 501 and the third liquid cooling board 503 through the pipeline 8, so that the cooled coolant in the liquid cooling system 7 flows into the four liquid cooling boards 5 respectively. The second main opening 1021 of the second connector 102 is connected to the first liquid inlet 72 of the liquid cooling system 7, and the other two second branch openings 1022 are respectively connected to the first liquid outlet pipes 52 of the second liquid cooling board 502 and the fourth liquid cooling board 504 through the pipeline 8, so that the coolant in the liquid cooling board 5 converges and flows back into the liquid cooling system 7.
[0057] Based on the same inventive concept, an embodiment of the present application also provides a car, which includes a car body, a chip 4, a circuit board 2 and a cooling system in any of the above embodiments. The above chip 4, circuit board 2 and cooling system are all installed in the car body (not shown in the figure), the chip 4 is installed on the circuit board 2, and the liquid cooling board 5 is arranged on the side of the circuit board 2 with the chip 4. The cooling system dissipates heat from the chip 4 through the liquid cooling board 5. Since the above cooling system has a good cooling effect and can improve the reliability of the chip 4, the cooling effect of the car is also good and the operating performance is stable.
[0058] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.
[0059] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.
Claims
1. A heat dissipation component, characterized in that: It includes a shell, an elastic member and at least one liquid cooling board; A heat conducting layer is arranged on each of the liquid cooling boards, and a side of the heat conducting layer facing away from the liquid cooling board is used to arrange a corresponding chip; The housing has a receiving cavity, the at least one liquid cooling board and the elastic member are arranged in the receiving cavity, and the elastic member corresponding to each liquid cooling board is used to drive the liquid cooling board to approach the corresponding chip; Each of the liquid-cooled boards includes a first liquid inlet pipe and a first liquid outlet pipe, the first liquid inlet pipe and the first liquid outlet pipe are respectively used to connect to the liquid cooling system, the shell has a first through hole and a second through hole, the first liquid inlet pipe extends to the outside of the shell through the first through hole, and the first liquid outlet pipe extends to the outside of the shell through the second through hole; a seal is provided between the outer wall of the first liquid inlet pipe and the inner wall of the first through hole, and a seal is provided between the outer wall of the first liquid outlet pipe and the inner wall of the second through hole.
2. The heat dissipation assembly according to claim 1, characterized in that: The elastic member is a spring or a spring sheet; The elastic member is installed along the elastic direction at one end on the first side of the liquid cooling board away from the heat conducting layer, and at the other end on a side surface of the shell opposite to the first side of the liquid cooling board.
3. The heat dissipation assembly according to claim 1, characterized in that: The elastic member includes a spring and a screw, and the screw includes a screw rod and a screw head; the liquid cooling single board has a third through hole; When the chip is arranged on a circuit board, the screw rod passes through the third through hole and is connected to the circuit board, and the spring is sleeved on the outer wall of the screw rod and is located between the screw head and the liquid cooling board.
4. The heat dissipation assembly according to claim 1, wherein: The elastic member includes a spring and a screw, and the screw includes a screw rod and a screw head; when the chip is arranged on a circuit board, the circuit board has a fourth through hole; The screw rod passes through the fourth through hole and is connected to the corresponding liquid cooling board. The spring is sleeved on the outer wall of the screw rod and is located between the screw head and the circuit board.
5. The heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The shell is a shell having a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe are arranged on the side of the shell facing away from the accommodating cavity. The second liquid inlet pipe and the second liquid outlet pipe are connected to the hollow cavity to form a coolant flow channel, and the second liquid inlet pipe and the second liquid outlet pipe are used to be connected to the liquid cooling system.
6. The heat dissipation assembly according to any one of claims 1 to 4, characterized in that: It also includes a plurality of fins, which are arranged on a surface of the shell body facing away from the accommodating cavity.
7. A heat dissipation system, characterized in that: It comprises a liquid cooling system and a heat dissipation assembly as claimed in any one of claims 1 to 6, wherein the heat dissipation assembly is connected to the liquid cooling system via a pipeline, and the pipeline is a flexible pipe.
8. The heat dissipation system according to claim 7, characterized in that: The liquid cooling system comprises a first liquid outlet and a first liquid inlet, the first liquid outlet is connected to the first liquid inlet pipe via the pipeline, and the first liquid inlet is connected to the first liquid outlet pipe via the pipeline.
9. The heat dissipation system according to claim 8, characterized in that: Also includes a first connector and a second connector; The first connector includes a first main opening and at least one first branch opening, the first main opening is connected to the first liquid outlet through the pipeline, and each of the first branch openings is connected to the first liquid inlet pipe of the corresponding liquid cooling board through the pipeline; The second connector includes a second main opening and at least one second branch opening, the second main opening is connected to the first liquid inlet through the pipeline, and each second branch opening is connected to the first liquid outlet pipe of the corresponding liquid cooling board through the pipeline.
10. The heat dissipation system according to any one of claims 7 to 9, characterized in that: The shell is a shell having a hollow cavity, and a second liquid inlet pipe and a second liquid outlet pipe are arranged on a side of the shell away from the accommodating cavity, the second liquid inlet pipe and the second liquid outlet pipe are communicated with the hollow cavity to form a coolant flow channel, and the second liquid inlet pipe and the second liquid outlet pipe are used to be connected to the liquid cooling system; The liquid cooling system comprises a second liquid outlet and a second liquid inlet, the second liquid outlet is connected to the second liquid inlet pipe via the pipeline, and the second liquid inlet is connected to the second liquid outlet pipe via the pipeline.
11. A car, characterized in that: It comprises a vehicle body, a chip, a circuit board and a heat dissipation system as claimed in any one of claims 7 to 10, wherein the chip, the circuit board and the heat dissipation system are all installed in the vehicle body, the chip is installed on the circuit board, the liquid cooling board is arranged on a side of the circuit board with the chip, and the heat dissipation system dissipates heat from the chip through the liquid cooling board.