Power conversion device

Abstract

The invention provides a power conversion device. In the power conversion device, the cover portion includes: a cover portion for a boost conversion unit disposed so as to include an arrangement region for the boost conversion unit; and a cover part for the DC-DC conversion unit, which is disposed closer to the DC-DC conversion unit than the cover part for the boost conversion unit in such a manner that the cover part for the DC-DC conversion unit includes an arrangement region for the DC-DC conversion unit, does not include an arrangement region for the boost conversion unit, and overlaps the cover part for the boost conversion unit.

Description

Technical Field

[0001] The invention relates to a power conversion device. Background Art

[0002] Conventionally, there is known a power conversion device including a base portion having a cooling flow path formed therein. Such a power conversion device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2023-53944.

[0003] Japanese Patent Publication No. 2023-53944 discloses a power conversion device having a base portion, the base portion including a cooling portion main body portion having a cooling flow path formed therein and a cover portion configured to cover the cooling flow path of the cooling portion main body portion. The power conversion device disclosed in Japanese Patent Publication No. 2023-53944 includes a boost converter portion and a DC converter portion configured on the base portion. In addition, in the power conversion device disclosed in Japanese Patent Publication No. 2023-53944, the cover portion includes a configuration area for the boost converter portion and a configuration area for the DC converter portion. The DC converter portion includes a semiconductor switch element.

[0004] Among them, although it is not recorded in Japanese Patent Publication No. 2023-53944, in the previous power conversion device recorded in the above-mentioned patent document 1, there is a case where the semiconductor switch element of the DC-DC conversion unit is bonded to the cover part by an adhesive. In this case, when replacing the semiconductor switch element, it is necessary to remove the DC-DC conversion unit including the semiconductor switch element and the cover part from the cooling unit body as a whole. In addition, the cover part is not only provided with a DC-DC conversion unit, but also provided with a boost conversion unit, so it is necessary to remove the boost conversion unit from the cover part before removing the DC-DC conversion unit and the cover part as a whole from the cooling unit body. In addition, there are many parts of the DC-DC converter, so it is not limited to the case where the semiconductor switch element of the DC-DC conversion unit installed on the cover part is bonded to the cover part by an adhesive, and there is also a case where the DC-DC conversion unit and the cover part are to be removed from the cooling unit body as a whole. Therefore, it is desired that the DC-DC conversion unit and the cover part can be removed from the cooling unit body as a whole without removing the boost conversion unit from the cover part. Summary of the invention

[0005] The present invention is made to solve the above-mentioned problems, and one object of the present invention is to provide a power conversion device in which a DC-DC converter and a cover can be integrally removed from a cooling unit main body without removing a boost converter from the cover.

[0006] In order to achieve the above-mentioned purpose, a power conversion device of a technical solution of the present invention comprises: a boost converter, which boosts the DC power input from a DC power supply; an inverter, which converts the DC power boosted by the boost converter into AC power and supplies it to a load; a DC-DC converter, which transforms the DC power input from the DC power supply; and a base, which is configured with the boost converter, the inverter and the DC-DC converter, the base including: a cooling unit body, which is formed of metal and has a cooling flow path; and a cover, which is formed of metal and is configured to cover the cooling flow path of the cooling unit body, the cover including: a cover for the boost converter, which is configured to include a configuration area of ​​the boost converter; and a cover for the DC-DC converter, which is configured to include the configuration area of ​​the DC-DC converter and does not include the configuration area of ​​the boost converter, and is overlapped with the cover for the boost converter to a position closer to the DC-DC converter than the cover for the boost converter.

[0007] In a power conversion device of a technical solution of the present invention, as described above, the cover includes: a cover for a boost converter, which is configured in a manner including a configuration area of ​​the boost converter; and a cover for a DC converter, which is configured to a position closer to the DC converter than the cover for the boost converter in a manner including the configuration area of ​​the DC converter and not including the configuration area of ​​the boost converter, and overlapping with the cover for the boost converter. Thus, the cover for the DC converter, which includes the configuration area of ​​the DC converter and does not include the configuration area of ​​the boost converter, is configured to a position closer to the DC converter than the cover for the boost converter. Therefore, in a state where the boost converter is configured on the cover for the boost converter, the DC converter and the cover for the DC converter configured with the DC converter can be integrally removed from the cooling unit main body. As a result, the DC converter and the cover can be integrally removed from the cooling unit main body without removing the boost converter from the cover.

[0008] In the power conversion device of the above-mentioned technical solution, it is preferred that the cover for the boost converter includes a through hole formed at a position corresponding to the cover for the DC converter, and the cover for the DC converter is arranged at a position closer to the DC converter than the cover for the boost converter in a manner that the through hole is blocked by the cover for the DC converter. As long as it is configured in this way, the thickness of the cover becomes the thickness of the DC converter in the portion where the through hole is blocked by the cover for the DC converter, and therefore, even if the cover for the DC converter and the cover for the boost converter are arranged overlapping, the thickness of the cover can be suppressed from increasing in the portion that becomes the DC converter and the cover for the boost converter. As a result, it is possible to suppress the reduction in heat dissipation of the cover due to the overlapping arrangement of the cover for the DC converter and the cover for the boost converter.

[0009] In the structure in which the cover for the DC-DC converter is arranged at a position closer to the DC-DC converter than the cover for the boost converter in a manner in which the through hole is blocked by the cover for the DC-DC converter, it is preferred that cooling fins are formed on the surface of the cover for the DC-DC converter on the cooling flow path side in a manner that penetrates the through hole of the cover for the boost converter and protrudes into the cooling flow path. As long as it is configured in this way, the cooling fins can be used to efficiently cool the cover for the DC-DC converter by the cooling liquid flowing in the cooling flow path. As a result, the heat generated from the cover for the DC-DC converter can be efficiently dissipated to the cooling flow path covered by the cover for the DC-DC converter.

[0010] In the structure in which a cooling fin is formed on the surface of the DC-DC converter cover on the cooling flow path side, it is preferred that the cooling fin protruding into the cooling flow path through the through hole bends along the flow direction of the cooling liquid in the cooling flow path. As long as it is configured in this way, the surface area of ​​the cooling fin becomes larger by an amount corresponding to the bending of the cooling fin, so that the cooling liquid flowing in the cooling flow path can be used to cool the DC-DC converter cover more efficiently.

[0011] In the structure in which the DC / DC converter cover is arranged at a position closer to the DC / DC converter side than the boost converter cover in a manner that the through hole is blocked by the DC / DC converter cover, it is preferred that a sealing groove is formed around the through hole on the surface of the boost converter cover on the DC / DC converter side, and the power conversion device further includes a sealing member arranged in the sealing groove in a manner that seals the boost converter cover and the DC / DC converter cover. As long as it is constructed in this way, even if the DC / DC converter cover is arranged at a position closer to the DC / DC converter side than the boost converter cover in a manner that the through hole is blocked by the DC / DC converter cover, the boost converter cover and the DC / DC converter cover can be easily sealed by the sealing member.

[0012] In the power conversion device of the above-mentioned technical solution, it is preferred that the DC-DC converter includes a semiconductor switch element configured in a manner bonded to the DC-DC converter cover. When replacing the semiconductor switch element, it is necessary to remove the DC-DC converter including the semiconductor switch element and the DC-DC converter cover to which the semiconductor switch element is bonded from the cooling unit body as a whole. Therefore, as long as the DC-DC converter includes a semiconductor switch element configured in a manner bonded to the DC-DC converter cover as described above, the structure in which the DC-DC converter and the cover can be removed from the cooling unit body as a whole without removing the step-up converter from the cover is effective. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1This is a circuit diagram of a power conversion device according to one embodiment of the present invention.

[0014] Figure 2 It is a perspective view of a power conversion device according to one embodiment of the present invention.

[0015] Figure 3 It is a side view of the power conversion device according to one embodiment of the present invention.

[0016] Figure 4 It is a perspective view of a cover for a boost converter unit and a cover for a DC / DC converter unit according to an embodiment of the present invention.

[0017] Figure 5 It is a perspective view of a state where a cover for a boost converter unit and a cover for a DC converter unit according to an embodiment of the present invention are overlapped.

[0018] Figure 6 This is a perspective view of a boost converter cover and a DC converter cover according to an embodiment of the present invention as viewed from the back side.

[0019] Figure 7 This is a perspective view showing a state in which a cover for a step-up converter unit and a cover for a DC / DC converter unit according to an embodiment of the present invention are overlapped, as viewed from the back side.

[0020] Figure 8 It is a cross-sectional view along the YZ direction of the seal groove portion and the seal member according to one embodiment of the present invention.

[0021] Fig. 9 1 is a cross-sectional view taken along the YZ direction, showing a contact portion between the reactor and the boost converter unit cover according to the embodiment of the present invention.

[0022] Fig.10 This is a perspective view of the reactor according to one embodiment of the present invention as viewed from the back side.

[0023] Fig.11 1 is a cross-sectional view taken along the YZ direction and showing a switching element for a converter according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0025] Reference Figures 1 to 11 , the configuration of a power conversion device 100 according to an embodiment of the present invention will be described. The power conversion device 100 is mounted on a vehicle, for example.

[0026] (Circuit Configuration of Power Converter)

[0027] like Figure 1As shown, the power conversion device 100 converts DC power input from the DC power supply 200 via the connector 101 and supplies the DC power to the load 300 via the connector 102. A switch 201 is provided between the power conversion device 100 and the DC power supply 200.

[0028] The power conversion device 100 includes an inverter unit 10 , a boost converter unit 20 , a capacitor C1 , a resistor R, and a DC / DC converter unit 30 .

[0029] The inverter unit 10 converts DC power input from the DC power supply 200 into AC power and supplies the AC power to the load 300 .

[0030] The inverter unit 10 includes a switching element module 11. The switching element module 11 converts DC power into AC power. The switching element module 11 includes semiconductor switching elements Q1, Q2, and Q3 constituting an upper arm and semiconductor switching elements Q4, Q5, and Q6 constituting a lower arm.

[0031] The inverter 10 includes a first inverter 10a and a second inverter 10b. The switch element module 11 includes a first switch element module 11a included in the first inverter 10a and a second switch element module 11b included in the second inverter 10b. In addition, the load 300 includes a first load 300a and a second load 300b. The first inverter 10a converts the DC power input from the DC power supply 200 into AC power and supplies it to the first load 300a via the connector 102. The second inverter 10b converts the DC power input from the DC power supply 200 into AC power and supplies it to the second load 300b via the connector 102.

[0032] The boost converter 20 is arranged on the input side of the inverter 10. The boost converter 20 boosts the DC power input from the DC power supply 200 via the connector 101. The boost converter 20 supplies the boosted voltage to the inverter 10. That is, the inverter 10 converts the DC power boosted by the boost converter 20 into AC power and supplies it to the load 300.

[0033] The boost converter 20 includes a boost switch element module 21 and a reactor 22. The boost switch element module 21 includes a boost switch element Q11 and a boost switch element Q12. The boost switch element Q11 and the boost switch element Q12 constitute an upper arm and a lower arm, respectively. In addition, the boost converter 20 includes a capacitor C2. The reactor 22 is provided between the positive side of the DC power supply 200 and a connection point, which is a connection point between the boost switch element Q11 and the boost switch element Q12. The capacitor C2 is provided in parallel with the boost switch element Q12.

[0034] The voltage step-up converter 20 includes a current sensor 23. The current sensor 23 measures the current flowing to the voltage step-up converter 20. The current sensor 23 is provided between the voltage step-up switching element module 21 and the reactor 22.

[0035] The capacitor C1 and the resistor R are provided between the boost converter 20 and the inverter 10. The capacitor C1 and the resistor R are provided in parallel with each other.

[0036] The DC-DC converter 30 transforms the DC voltage input from the DC power supply 200 . The DC-DC converter 30 supplies the transformed voltage to the output terminal 103 .

[0037] (Structure of Power Conversion Device)

[0038] like Figure 2 As shown, the power conversion device 100 includes a base 40 on which a boost converter 20, an inverter 10, and a DC converter 30 are arranged. The boost converter 20 and the DC converter 30 are arranged on the front side (Z1 side) of the base 40. The inverter 10 is arranged on the back side (Z2 side) of the base 40.

[0039] The base portion 40 includes: a cooling portion body portion 50, which is formed of metal and has a cooling flow path 51 formed therein; and a cover portion 60, which is formed of metal and is arranged so as to cover the cooling flow path 51 of the cooling portion body portion 50. The cooling flow path 51 is a space inside the base portion 40 formed by the cooling portion body portion 50 and the cover portion 60 arranged so as to cover an opening portion (not shown) formed in the cooling portion body portion 50. A cooling liquid such as water or antifreeze flows into the cooling flow path 51. The cooling portion body portion 50 and the cover portion 60 are formed of a metal having a relatively high thermal conductivity such as aluminum. The cooling liquid flows into the cooling flow path 51, so that the boost converter 20, the inverter portion 10, and the DC-DC converter 30 arranged in the base portion 40 are cooled.

[0040] The cooling liquid flowing out of the cooling flow path 51 is cooled by the heat dissipation portion 53. The cooling liquid cooled by the heat dissipation portion 53 is supplied by the pump 54 and flows into the cooling flow path 51 again. The heat dissipation portion 53 includes a heat exchanger and is cooled by external air. The heat dissipation portion 53 is, for example, a radiator. In addition, the pump 54 may be arranged between the outlet of the cooling flow path 51 and the heat dissipation portion 53, and the cooling liquid before the heat dissipation by the heat dissipation portion 53 is supplied by the pump 54.

[0041] <Structure of the cover>

[0042] like Figure 3As shown in FIG. 1 , the cover 60 includes an inverter cover 61, a boost converter cover 62, and a DC / DC converter cover 63. The inverter cover 61 is disposed on the back side (Z2 side) of the cooling unit main body 50 so as to include the configuration area of ​​the inverter 10. The boost converter cover 62 is disposed on the back side (Z2 side) of the cooling unit main body 50 so as to include the configuration area A1 (see FIG. 1 ) of the boost converter 20. Figure 4 ) is arranged on the surface side (Z1 side) of the cooling unit main body 50. The DC / DC converter cover 63 includes the arrangement area A2 (see Figure 4 ) is arranged on the surface side (Z1 side) of the cooling unit main body 50. The cooling liquid flows into the cooling flow path 51, so that the inverter unit 10 arranged on the inverter unit cover 61, the boost converter unit 20 arranged on the boost converter unit cover 62, and the DC-DC converter unit 30 arranged on the DC-DC converter unit cover 63 are cooled.

[0043] The DC-DC converter cover 63 is located in the arrangement area A1 (see Figure 4 ), and is arranged at a position closer to the DC-DC converter 30 side (Z1 side) than the boost converter cover 62 in a manner overlapping with the boost converter cover 62. Specifically, Figure 4 As shown, the boost converter cover 62 is arranged on the entire surface side (Z1 side) of the cooling unit main body 50 in a manner that includes the configuration area A1 of the boost converter 20 and overlaps at least partially with the configuration area A2 of the DC converter 30 when viewed from the Z direction. In addition, the DC converter cover 63 is arranged on the surface side (Z1 side) of the cooling unit main body 50 only on the X1 side in a manner that includes the configuration area A2 of the DC converter 30 and does not include the configuration area A1 of the boost converter 20. In addition, the X1 side portions of the DC converter cover 63 and the boost converter cover 62 are arranged in sequence in the Z direction from the Z1 side toward the Z2 side.

[0044] The step-up converter cover 62 includes a through hole 62a formed at a position corresponding to the DC converter cover 63. The DC converter cover 63 is arranged closer to the DC converter 30 side (Z1 side) than the step-up converter cover 62 in such a manner that the through hole 62a is blocked by the DC converter cover 63. Figure 5 As shown, the DC / DC converter cover 63 and the boost converter cover 62 are fixed by fastening the fastening portion 63b of the DC / DC converter cover 63 and the fastening portion 62b of the boost converter cover 62 by a fastening member (not shown) in a state where the through hole 62a of the boost converter cover 62 is blocked by the DC / DC converter cover 63.

[0045] like Figure 6As shown, a cooling fin 62c protruding into the cooling flow path 51 is formed on the surface of the boost converter cover 62 on the cooling flow path 51 side (Z2 side) at a position corresponding to the contact portion 62e (discussed later). Figure 6 and Figure 7 As shown, cooling fins 63c are formed on the surface of the DC-DC converter cover 63 on the cooling flow path 51 side (Z2 side) so as to penetrate the through hole 62a of the boost converter cover 62 and protrude into the cooling flow path 51. The cooling fins 62c and the cooling fins 63c are bent along the flow direction of the cooling liquid in the cooling flow path 51.

[0046] like Figure 4 As shown in FIG. 1 , a sealing groove 62d is formed around the through hole 62a on the surface of the boost converter cover 62 on the DC converter cover 63 side (Z1 side). Figure 8 As shown, the power conversion device 100 includes a sealing member 70 arranged in the sealing groove 62d so as to seal between the boost converter cover 62 and the DC converter cover 63. The sealing member 70 is, for example, an O-ring made of rubber.

[0047] <Reactor Structure>

[0048] like Figure 2 As shown, the reactor 22 is disposed in the configuration area A1 (see Figure 4 ) is arranged on the X1 side and the Y1 side. In addition, the step-up switching element module 21 is arranged on the X2 side and the Y2 side relative to the reactor 22 in the arrangement region A1 of the step-up converter 20.

[0049] like Fig. 9 As shown, the reactor 22 is resin-molded in such a manner that the coil portion 22b is partially exposed. Specifically, the reactor 22 includes a core portion 22a that is annular when viewed from the Z direction and two coil portions 22b wound around the core portion 22a. The two coil portions 22b each have an annular shape when viewed from the X direction. The reactor 22 is resin-molded in such a manner that the ends of the two coil portions 22b on the Z2 side are exposed when viewed from the X direction. Fig.10 As shown, an opening 22 c is formed on the surface on the Z2 side of the resin-molded reactor 22 so that the ends on the Z2 side of each of the two coil portions 22 b are exposed.

[0050] like Fig. 9 As shown, the reactor 22 is arranged so that the coil exposed portion EP exposed from the resin in the coil portion 22b contacts the contact portion 62e in the step-up converter cover 62 for contacting the reactor 22. The contact portion 62e is formed so as to protrude from the step-up converter cover 62 toward the coil exposed portion EP side (Z1 side).

[0051] The coil exposed portion EP is the end portion on the Z2 side of the annular coil portion 22b as viewed from the X direction, and therefore has a convex shape protruding toward the step-up converter cover 62 side (Z2 side). In contrast, the contact portion 62e is provided at a position corresponding to the convex shape of the coil exposed portion EP, and has a concave shape recessed toward the step-up converter cover 62 side. Specifically, the end portion on the Z1 side of the contact portion 62e protruding from the step-up converter cover 62 toward the Z1 side has a concave shape recessed toward the Z2 side.

[0052] The contact portion 62e has a protruding height H that forms a gap G between the portion other than the coil exposed portion EP in the surface of the reactor 22 on the coil exposed portion EP side (Z2 side) and the boost converter cover 62 when the contact portion 62e is in contact with the coil exposed portion EP. The reactor 22 is fixed to the boost converter cover 62 by a fastening member (not shown) when the contact portion 62e is in contact with the coil exposed portion EP and when the portion other than the coil exposed portion EP in the surface on the coil exposed portion EP side is not in contact with the boost converter cover 62.

[0053] like Fig.10 As shown, the coil exposed portion EP has a rectangular shape when viewed from the direction (Z direction) in which the reactor 22 and the step-up converter cover 62 are arranged. Specifically, the coil exposed portion EP has a rectangular shape when viewed from the Z direction, and two coil exposed portions EP are arranged in the direction (Y direction) of the short side of the rectangular shape.

[0054] like Figure 4 As shown, the contact portion 62e has a rectangular shape so as to overlap with the coil exposed portion EP when viewed from the direction (Z direction) in which the reactor 22 and the step-up converter cover 62 are arranged. Specifically, the contact portion 62e has a rectangular shape so as to overlap with the two coil exposed portions EP when viewed from the Z direction, and two contact portions 62e are arranged in the direction (Y direction) of the short side of the rectangular shape.

[0055] like Fig.10 As shown, a plurality of holes 22d are formed in a portion adjacent to the coil exposed portion EP along the Y direction. The plurality of holes 22d are provided to reduce the weight of the resin-molded reactor 22 and to reduce the thick wall portion (of the resin) during the resin molding of the reactor 22. By reducing the thick wall portion during the resin molding of the reactor 22, the generation of sink marks (recesses and pits generated due to molding shrinkage) can be suppressed.

[0056] <Structure of DC-DC converter>

[0057] like Figure 2As shown, the DC-DC converter 30 includes a DC-DC converter substrate 31 and a DC-DC converter element 32 mounted on the DC-DC converter substrate 31. The DC-DC converter substrate 31 has a flat plate shape. The DC-DC converter element 32 includes a converter switching element 32a, a transformer 32b, a resonant inductor 32c, and a smoothing inductor 32d. The converter switching element 32a is provided on the back side (Z2 side) of the DC-DC converter substrate 31. In addition, the converter switching element 32a is an example of a "semiconductor switching element" in the claims.

[0058] like Fig.11 As shown, the converter switching element 32a is connected to the wiring of the DC converter substrate 31 by soldering. The converter switching element 32a is bonded to the surface on the Z1 side of the DC converter cover 63 by an insulating adhesive. That is, the DC converter 30 includes the converter switching element 32a arranged in a manner bonded to the DC converter cover 63.

[0059] (Effects of this embodiment)

[0060] In this embodiment, the following effects can be obtained.

[0061] In the present embodiment, as described above, the cover 60 includes: the cover 62 for the boost converter 20, which is arranged so as to include the arrangement area A1 of the boost converter 20; and the cover 63 for the DC converter 30, which is arranged so as to include the arrangement area A2 of the DC converter 30 and not include the arrangement area A1 of the boost converter 20, and overlap with the cover 62 for the boost converter to a position closer to the DC converter 30 than the cover 62 for the boost converter. Thus, the cover 63 for the DC converter 30, which includes the arrangement area A2 of the DC converter 30 and does not include the arrangement area A1 of the boost converter 20, is arranged at a position closer to the DC converter 30 than the cover 62 for the boost converter. Therefore, in a state where the boost converter 20 is arranged on the cover 62 for the boost converter, the DC converter 30 and the cover 63 for the DC converter 30, which is arranged with the DC converter 30, can be integrally removed from the cooling unit main body 50. As a result, the DC-DC conversion unit can be removed from the cooling unit main body integrally with the cover portion without removing the boost converter from the cover portion.

[0062] In addition, in the present embodiment, as described above, the boost converter cover 62 includes the through hole 62a formed at a position corresponding to the DC converter cover 63. And the DC converter cover 63 is arranged at a position closer to the DC converter 30 side than the boost converter cover 62 in such a manner that the through hole 62a is blocked by the DC converter cover 63. Thus, in the portion where the DC converter cover 63 blocks the through hole 62a, the thickness of the cover 60 becomes the thickness of the DC converter cover 63, and therefore, even if the DC converter cover 63 and the boost converter cover 62 are arranged to overlap, the thickness of the cover 60 can be suppressed from increasing in the portion where the DC converter cover 63 and the boost converter cover 62 are formed. As a result, it is possible to suppress the reduction in heat dissipation of the cover 60 due to the DC converter cover 63 and the boost converter cover 62 being arranged to overlap.

[0063] In addition, in the present embodiment, as described above, cooling fins 63c are formed on the surface of the DC-DC converter cover 63 on the cooling flow path 51 side so as to penetrate the through hole 62a of the boost converter cover 62 and protrude into the cooling flow path 51. Thus, the DC-DC converter cover 63 can be efficiently cooled by the cooling liquid flowing in the cooling flow path 51 using the cooling fins 63c. As a result, the heat generated from the DC-DC converter cover 63 can be efficiently dissipated to the cooling flow path 51 covered by the DC-DC converter cover 63.

[0064] In addition, in the present embodiment, as described above, the cooling fins 63c protruding into the cooling flow path 51 through the through holes 62a are bent along the flow direction of the cooling liquid in the cooling flow path 51. As a result, the surface area of ​​the cooling fins 63c is increased by an amount corresponding to the bending of the cooling fins 63c, and therefore, the DC-DC converter cover 63 can be cooled more efficiently by the cooling liquid flowing in the cooling flow path 51 using the cooling fins 63c.

[0065] In addition, in the present embodiment, as described above, a sealing groove 62d is formed around the through hole 62a on the surface of the boost converter cover 62 on the DC converter cover 63 side. In addition, the power conversion device 100 includes a sealing member 70 arranged in the sealing groove 62d in a manner that seals between the boost converter cover 62 and the DC converter cover 63. Thus, even if the DC converter cover 63 is a structure in which the through hole 62a is blocked by the DC converter cover 63 and arranged at a position closer to the DC converter 30 side than the boost converter cover 62, the sealing member 70 can be used to easily seal between the boost converter cover 62 and the DC converter cover 63.

[0066] In addition, in the present embodiment, as described above, the DC-DC converter 30 includes the converter switch element 32a (semiconductor switch element) configured in a manner bonded to the DC-DC converter cover 63. When replacing the converter switch element 32a, it is necessary to remove the DC-DC converter 30 including the converter switch element 32a and the DC-DC converter cover 63 to which the converter switch element 32a is bonded from the cooling unit main body 50 as a whole. Therefore, the DC-DC converter 30 includes the converter switch element 32a configured in a manner bonded to the DC-DC converter cover 63 as described above, and therefore, a structure in which the DC-DC converter 30 and the cover 60 can be removed from the cooling unit main body 50 as a whole without removing the step-up converter 20 from the cover 60 is effective.

[0067] [Modifications]

[0068] The embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and includes all changes (modifications) within the meaning and scope equivalent to the claims.

[0069] For example, in the above embodiment, the following example is shown, but the present invention is not limited thereto: the DC-DC converter 30 includes the converter switch element 32a (semiconductor switch element) configured in a manner bonded to the DC-DC converter cover 63. In the present invention, the DC-DC converter may not include the semiconductor switch element configured in a manner bonded to the DC-DC converter cover.

[0070] In addition, in the above-mentioned embodiment, the following example is shown: a sealing groove 62d is formed around the through hole 62a on the surface of the boost converter cover 62 on the side of the DC converter cover 63, and the power converter 100 includes a sealing member 70 arranged in the sealing groove 62d in a manner that seals between the boost converter cover 62 and the DC converter cover 63, but the present invention is not limited to this. In the present invention, it is also possible that a sealing groove is not formed around the through hole on the surface of the boost converter cover on the side of the DC converter cover, and the power converter does not include a sealing member arranged in the sealing groove in a manner that seals between the boost converter cover and the DC converter cover.

[0071] In addition, in the above embodiment, the following example is shown: the cooling fin 63c protruding into the cooling flow path 51 through the through hole 62a is bent along the flow direction of the cooling liquid in the cooling flow path 51, but the present invention is not limited to this. In the present invention, the cooling fin protruding into the cooling flow path through the through hole does not have to be bent along the flow direction of the cooling liquid in the cooling flow path.

[0072] In addition, in the above-mentioned embodiment, the following example is shown: the cooling fins 63c are formed on the surface of the DC-DC converter cover 63 on the cooling flow path 51 side so as to penetrate the through hole 62a of the boost converter cover 62 and protrude into the cooling flow path 51, but the present invention is not limited to this. In the present invention, the cooling fins may not be formed on the surface of the DC-DC converter cover on the cooling flow path side.

[0073] In addition, in the above-mentioned embodiment, the following example is shown: the boost converter cover 62 includes the through hole 62a formed at a position corresponding to the DC converter cover 63, and the DC converter cover 63 is arranged at a position closer to the DC converter 30 than the boost converter cover 62 in a manner that the through hole 62a is blocked by the DC converter cover 63, but the present invention is not limited to this. In the present invention, it is also possible that the boost converter cover does not include the through hole formed at a position corresponding to the DC converter cover, and the DC converter cover is not arranged at a position closer to the DC converter than the boost converter cover in a manner that the through hole is blocked by the DC converter cover.

Claims

1. A power conversion device comprising: a step-up converter for stepping up the voltage of the DC power input from the DC power supply; an inverter unit that converts the DC power boosted by the boost converter unit into AC power and supplies the AC power to a load; a DC-DC converter that transforms the DC power input from the DC power source; as well as a base portion, on which the boost converter, the inverter, and the DC-DC converter are disposed, The base portion comprises: a cooling portion body portion formed of metal and having a cooling flow path; and a cover portion formed of metal and arranged so as to cover the cooling flow path of the cooling portion main body, The cover portion comprises: a cover for a step-up converter, arranged so as to include a region where the step-up converter is arranged; and A DC / DC converter cover is disposed closer to the DC / DC converter than the boost converter cover so as to include the DC / DC converter arrangement region and not include the boost converter arrangement region and overlap with the boost converter cover.

2. The power conversion device according to claim 1, wherein: The step-up converter cover includes a through hole formed at a position corresponding to the DC converter cover. The DC / DC converter cover is disposed closer to the DC / DC converter than the boost converter cover is so that the through hole is blocked by the DC / DC converter cover.

3. The power conversion device according to claim 2, wherein: A cooling fin is formed on a surface of the DC / DC converter cover on the cooling flow path side so as to penetrate the through hole of the boost converter cover and protrude into the cooling flow path.

4. The power conversion device according to claim 3, wherein: The cooling fins protruding into the cooling flow path through the through-holes are bent along a flow direction of the cooling liquid in the cooling flow path.

5. The power conversion device according to claim 2, wherein: A sealing groove is formed around the through hole on a surface of the step-up converter cover on the DC / DC converter cover side. The power conversion device further includes a sealing member disposed in the sealing groove portion so as to seal between the boost converter cover portion and the DC converter cover portion.

6. The power conversion device according to claim 1, wherein: The DC / DC converter includes a semiconductor switch element that is arranged to be bonded to the DC / DC converter cover.

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