Batch processing method and system for blind holes of PCB (Printed Circuit Board)

Abstract

The invention discloses a PCB blind hole batch processing method and system, and relates to the technical field of PCBs, and the method comprises the steps: determining the blind hole batch processing information of a blind hole processing tool based on a three-dimensional model of a PCB, corresponding blind hole processing requirements and a plurality of blind hole processing positions; the automatic optimization of the blind hole batch machining information of the blind hole machining tool is ensured, and then the precision of the plane moving path and the corresponding blind hole machining depth is ensured. Further, determining a plurality of blind hole processing combinations based on blind hole batch processing information of the blind hole processing tool, model information of the plurality of PCBs and blind hole processing depths of the plurality of PCBs; according to the method, the working sequence table of the blind hole machining tools is determined according to the multiple blind hole machining combinations, the priorities of the multiple PCBs and the service life of the blind hole machining tools, the working sequence table of the blind hole machining tools is introduced, automatic machining of the multiple PCBs by the blind hole machining tools is conveniently controlled, and the rationality of batch machining of the blind holes of the PCBs is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB boards, and in particular to a method and system for batch processing blind holes of PCB boards. Background Art

[0002] With the development of science and technology, PCB boards are gradually applied to people's lives and are used as core components of electronic devices. PCB boards are provided with multiple blind holes, which are processed by blind hole processing tools. In the prior art, PCB processing equipment contains a supporting platform, which processes a single blind hole for multiple PCB boards of the same model, and cannot perform batch processing for PCB boards of different models, which affects the independent processing of multiple PCB boards by the blind hole processing tool. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art. The present invention provides a method and system for batch processing blind holes of PCB boards.

[0004] An embodiment of the present invention provides a method for batch processing blind holes of PCB boards, comprising: determining the center positions of multiple PCB boards based on a top view of a support platform, wherein multiple PCB boards in a clamped state exist in the same support platform; Determine a processing space for the multiple PCB boards based on the support platform and the center positions of the multiple PCB boards; Determine multiple blind hole processing positions according to the processing space of multiple PCB boards, the relative distance between the multiple PCB boards, and the three-dimensional models of the multiple PCB boards; Determine the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; Determine multiple blind hole processing combinations based on blind hole batch processing information of a blind hole processing tool, model information of multiple PCB boards, and blind hole processing depths of multiple PCB boards; A work sequence list of blind hole processing tools is determined according to multiple blind hole processing combinations, priorities of multiple PCB boards and the service life of the blind hole processing tools. The processing difficulty coefficients of multiple blind hole processing items in the work sequence list are gradually increased.

[0005] An embodiment of the present invention provides a system for batch processing blind holes of PCB boards. The system for batch processing blind holes of PCB boards is applied to the above-mentioned method for batch processing blind holes of PCB boards. The system for batch processing blind holes of PCB boards comprises: A center position module, used to determine the center positions of multiple PCB boards based on a top view of the support platform, where multiple PCB boards in a clamped state exist in the same support platform; A processing space module, used to determine the processing space of multiple PCB boards based on the support platform and the center positions of the multiple PCB boards; A blind hole processing position module is used to determine a plurality of blind hole processing positions according to the processing spaces of the plurality of PCB boards, the relative distances between the plurality of PCB boards, and the three-dimensional models of the plurality of PCB boards; A blind hole processing depth module is used to determine the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions. The blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; A blind hole processing combination module is used to determine multiple blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of multiple PCB boards, and the blind hole processing depths of multiple PCB boards; The work sequence list module is used to determine the work sequence list of the blind hole processing tool according to multiple blind hole processing combinations, the priorities of multiple PCB boards and the service life of the blind hole processing tool. The processing difficulty coefficients of multiple blind hole processing items in the work sequence list are gradually increased.

[0006] In an embodiment of the present invention, through the method in the embodiment of the present invention, the center positions of multiple PCB boards are determined based on the top view of the supporting platform, at this time, there are multiple PCB boards in a clamped state in the same supporting platform; the processing space of the multiple PCB boards is determined based on the center position of the supporting platform and the multiple PCB boards; the multiple blind hole processing positions are determined according to the processing space of the multiple PCB boards, the relative distance between the multiple PCB boards and the three-dimensional model of the multiple PCB boards; the blind hole batch processing information of the blind hole processing tool is determined based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the multiple blind hole processing positions, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth, is compatible with the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the overall consideration of the multiple blind hole processing positions, ensures the autonomous optimization of the blind hole batch processing information of the blind hole processing tool, and thus ensures the accuracy of the plane moving path and the corresponding blind hole processing depth.

[0007] Furthermore, multiple blind hole processing combinations are determined based on the blind hole batch processing information of the blind hole processing tool, the model information of multiple PCB boards, and the blind hole processing depths of the multiple PCB boards, thereby achieving precise control of the multiple blind hole processing combinations.

[0008] Therefore, a working sequence list of the blind hole processing tool is determined according to multiple blind hole processing combinations, the priorities of multiple PCB boards and the service life of the blind hole processing tool. The processing difficulty coefficients of multiple blind hole processing items in the working sequence list are gradually increased. A working sequence list of the blind hole processing tool is introduced to facilitate the management and control of the autonomous processing of multiple PCB boards by the blind hole processing tool, thereby further improving the rationality of the batch processing of blind holes on PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of an application scenario of a method for batch processing blind holes of a PCB board in one embodiment; Figure 2 1 is a schematic flow chart of a method for batch processing blind holes of PCB boards in an embodiment of the present invention; Figure 3 Schematic diagram of the structure of a blind hole batch processing system for PCB boards in an embodiment of the present invention; Figure 4 The figure is a hardware diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0010] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0011] Embodiment 1

[0012] The method for batch processing of blind holes in PCB boards provided in this application can be applied to Figure 1 In the application environment shown, the computer 102 communicates with the server 104 through the network. The terminal 102 can be, but is not limited to, various personal computers, servers, and PCB processing equipment, and the server 104 can be implemented as an independent server or a server cluster composed of multiple servers.

[0013] Embodiment 2

[0014] See also Figures 1 to 4 A method for batch processing of blind holes of PCB boards is applied to the batch processing of blind holes of PCB boards. The method for batch processing of blind holes of PCB boards includes: Step S11: determining the center positions of multiple PCB boards based on the top view of the support platform, where multiple PCB boards in a clamped state exist in the same support platform; Step S12: determining a processing space of the plurality of PCB boards based on the supporting platform and the center positions of the plurality of PCB boards; Step S13: determining a plurality of blind hole processing positions according to the processing spaces of the plurality of PCB boards, the relative distances between the plurality of PCB boards, and the three-dimensional models of the plurality of PCB boards; Step S14: determining the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the multiple blind hole processing positions, wherein the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; Step S15: determining a plurality of blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of the plurality of PCB boards, and the blind hole processing depths of the plurality of PCB boards; Step S16: determining a work sequence list of blind hole processing tools according to multiple blind hole processing combinations, priorities of multiple PCB boards and the service life of the blind hole processing tools, wherein the processing difficulty coefficients of the multiple blind hole processing items in the work sequence list are gradually increased.

[0015] In step S11, the center positions of the multiple PCB boards are determined based on the top view of the support platform. At this time, there are multiple PCB boards in a clamped state in the same support platform; In the specific implementation process of the present invention, the specific steps are: S111: In the PCB processing equipment, the spatial position of the support platform is collected; S112: determining a top view of the support platform according to multi-angle detection of the spatial position of the support platform, wherein a plurality of PCB boards in a clamped state exist in the same support platform; S113: Determine the outer contours of the plurality of PCB boards based on traversing the top view of the support platform; S114: marking model information of the PCB boards in the outer contours of the multiple PCB boards, and determining corresponding center position learning models according to the outer contours of the multiple PCB boards and the model information of the multiple PCB boards; S115: Determine the center positions of the multiple PCB boards according to the outer contours of the multiple PCB boards and the corresponding center position learning model.

[0016] In an embodiment of the present application, in a PCB processing device, the spatial position of a support platform is collected, and the spatial position of the support platform is subsequently controlled.

[0017] Specifically, the PCB processing equipment performs blind hole processing on the PCB board and manages the PCB processing equipment. At this time, in the PCB processing equipment, a camera is used to capture an image of the support platform, and its edges and contours are extracted through an image processing algorithm to determine the spatial position of the support platform, so as to facilitate the positioning of multiple PCBs on the support platform.

[0018] Furthermore, a top view of the supporting platform is determined based on multi-angle detection of the spatial position of the supporting platform. At this time, there are multiple PCB boards in a clamped state in the same supporting platform. The outer contours of the multiple PCB boards are determined based on the traversal of the top view of the supporting platform, thereby ensuring the accuracy of the outer contours of the multiple PCB boards, so as to facilitate subsequent identification of the multiple PCB boards.

[0019] At this time, the support platform is photographed from multiple angles using a camera. The camera photographs the support platform at different positions of the device to ensure that comprehensive information of the support platform can be captured, so that the images taken from different angles are spliced ​​and merged to generate a complete top view of the support platform. Optionally, the camera photographs the support platform from top to bottom. Optionally, the generated top view is optimized to improve its clarity and accuracy.

[0020] At the same time, the top view of the support platform is traversed to identify multiple PCB boards therein. Optionally, the top view of the support platform is divided into multiple areas to facilitate simultaneous identification of the multiple areas to determine whether there are PCB boards in each area, thereby presenting multiple PCB boards in the top view of the support platform.

[0021] After identifying the PCB board, its outer contour is extracted using an image processing algorithm, and the extracted outer contour is introduced to optimize the extracted outer contour to improve its accuracy and smoothness. The outer contour data of multiple PCB boards extracted are recorded and output to subsequent steps. These data can be used for subsequent processing, positioning, detection and other operations.

[0022] Therefore, the model information of the PCB boards is marked in the outer contours of the multiple PCB boards, and the corresponding center position learning model is determined according to the outer contours of the multiple PCB boards and the model information of the multiple PCB boards; the center positions of the multiple PCB boards are determined according to the outer contours of the multiple PCB boards and the corresponding center position learning model, thereby ensuring the accuracy of the center positions of the multiple PCB boards.

[0023] At this time, after identifying the outer contours of multiple PCB boards, it is necessary to mark the model information on each PCB board, which is usually achieved by reading the barcode, QR code or text logo on the PCB board. The model information includes key data such as the size, version number, and production batch of the PCB board. At the same time, the outer contours of multiple PCB boards and the model information of multiple PCB boards are introduced, and the outer contours of multiple PCB boards and the model information of multiple PCB boards are matched to output a preset center position learning model, and the outer contours of multiple PCB boards are targetedly identified through the center position learning model.

[0024] Optionally, in the process of training the center position learning model, a large amount of PCB board data is collected, including its outer contour, model information and actual center position coordinates. Through these data, the center position learning model can learn the relationship between the shape, size and center position of the PCB board, thereby achieving accurate prediction of the center position of the new PCB board.

[0025] Furthermore, the outer contours of multiple PCB boards are input into the center position learning model, and the center position learning model predicts the center position of the PCB board. The center position of each PCB board is determined based on the prediction result of the center position learning model.

[0026] In step S12, a processing space of the plurality of PCB boards is determined based on the support platform and the center positions of the plurality of PCB boards; In the specific implementation process of the present invention, the specific steps are: S121: Obtain the center positions of multiple PCB boards; S122: Determine relative positions between the multiple PCB boards according to the center positions of the multiple PCB boards; S123: Associating the spatial range of the support platform, the relative positions between the multiple PCB boards, and the moving range of the blind hole processing tool; S124: determining a first space coefficient according to a space range of the support platform and relative positions between the plurality of PCB boards; determining a second space coefficient according to relative positions between the plurality of PCB boards and a moving range of a blind hole processing tool; S125: Determine a processing space for the multiple PCB boards based on the first space coefficient, the second space coefficient, and the space enclosed by the multiple PCB boards.

[0027] In an embodiment of the present application, the center positions of multiple PCB boards are obtained; the relative positions between the multiple PCB boards are determined according to the center positions of the multiple PCB boards, and the relative positions between the multiple PCB boards are introduced to facilitate subsequent control of the relative positions between the multiple PCB boards.

[0028] Among them, for multiple PCBs on the supporting platform, the center positions of multiple PCB boards are introduced, and the center positions of the multiple PCB boards are controlled so as to determine the relative positions between the multiple PCB boards according to the comparison of the center positions of the multiple PCB boards.

[0029] Specifically, a unified coordinate system is established based on the support platform to describe the center position of each PCB board in the coordinate system. The coordinate system can be two-dimensional (such as a plane rectangular coordinate system) or three-dimensional (such as a space rectangular coordinate system). After the coordinate system is established, the relative positions of each PCB board can be determined by calculating the coordinates of the center position of each PCB board in the coordinate system, which usually involves the calculation of distance and direction.

[0030] Furthermore, the spatial range of the supporting platform, the relative positions between the multiple PCB boards, and the moving range of the blind hole processing tool are associated; the first spatial coefficient is determined according to the spatial range of the supporting platform and the relative positions between the multiple PCB boards; and the second spatial coefficient is determined according to the relative positions between the multiple PCB boards and the moving range of the blind hole processing tool.

[0031] Specifically, the spatial range of the support platform, the relative positions between multiple PCB boards, and the moving range of the blind hole processing tool are introduced. The spatial range of the support platform refers to the physical area or space that supports the PCB boards for processing operations, which usually includes the size of the platform (such as length, width and height) and the processable area.

[0032] The relative position between multiple PCB boards refers to their layout and spacing relationship on the support platform. The definition of the relative position between multiple PCB boards involves parameters such as the center distance, parallelism and verticality between PCB boards. These parameters are crucial to ensure that the processing tool can operate accurately on the PCB board. The moving range of the blind hole processing tool refers to the area or path that the tool can move during the processing.

[0033] At the same time, the spatial range of the support platform, the relative positions between multiple PCB boards, and the moving range of the blind hole processing tool are comprehensively considered. For the first spatial coefficient, the first spatial coefficient reflects the matching degree between the spatial range of the support platform and the relative positions between multiple PCB boards, and considers the ratio of the actual occupied area of ​​the PCB board on the support platform to the available area, and whether the spacing between the PCB boards is sufficient for the tool to pass. A higher first spatial coefficient means that the PCB board layout is compact and efficient, but it also needs to ensure that it will not hinder the movement of the tool.

[0034] For the second space factor, the second space factor measures the adaptability between the relative positions of multiple PCB boards and the movement range of the blind hole processing tool. It takes into account the ratio of the minimum movement space required by the tool during the processing and the actual spacing between the PCB boards. A lower second space factor means that the tool will encounter more restrictions and challenges during the processing.

[0035] Optional, first space factor: Assuming the three PCBs have a total area of ​​600mm x 600mm (360,000 square millimeters), they occupy 36% of the total support platform area (1,000,000 square millimeters). Taking into account the additional space required for tool movement (at least 5mm on each side), the actual available space can be calculated and the calculation of the first space factor adjusted accordingly.

[0036] Second Space Factor: Assume that the minimum spacing between PCBs is 20mm, and the tool needs to move at least 15mm (10mm diameter plus at least 2.5mm of additional space on each side). In this example, the second space factor will be close to 1 (that is, the space required for the tool to move is close to the actual spacing between the PCBs), indicating that the tool will encounter some limitations during processing.

[0037] Therefore, the processing space of multiple PCB boards is determined based on the first space coefficient, the second space coefficient and the space enclosed by the multiple PCB boards, which is compatible with the overall consideration of the first space coefficient, the second space coefficient and the space enclosed by the multiple PCB boards, and realizes the precise control of the processing space of multiple PCB boards.

[0038] At this time, the first space coefficient, the second space coefficient and the space enclosed by multiple PCB boards are introduced. The space enclosed by multiple PCB boards refers to a closed or partially closed space area formed between multiple PCB boards and between multiple PCB boards and the edge of the supporting platform. This space area can be a two-dimensional plane area (if only the top or bottom projection of the PCB board is considered) or a three-dimensional space (if the height of the PCB board and the vertical spacing between them are considered).

[0039] At the same time, the first space coefficient and the second space coefficient are used to evaluate the overall efficiency and adaptability of the PCB board layout, and a processing space suitable for blind hole processing is determined accordingly. This processing space should ensure that the tool can move smoothly between the PCB boards without exceeding the boundary of the support platform or colliding with other obstacles.

[0040] Optionally, the current PCB layout is compact but has a low second space coefficient, indicating that the tool will be restricted during processing. In order to optimize the layout, it was decided to adjust the spacing between the PCB boards to ensure that the tool can move smoothly. The adjusted layout has higher first and second space coefficient values, indicating that it is both compact and efficient while meeting the needs of tool movement. Based on this optimized layout and tool movement range, a specific processing space area was determined, and subsequent processing operations were performed accordingly.

[0041] In addition, the first space coefficient, the second space coefficient, and the space enclosed by multiple PCB boards are weighted, and for each PCB board, its score is calculated according to the first space coefficient, the second space coefficient, and the size of the enclosed space at its location. At this time, the calculation formula is: score = S1 × weight coefficient 1 + S2 × weight coefficient 2 + V × weight coefficient 3, weight coefficient 3: set according to the degree of influence of the enclosed space on the processing space; S1 is the first space coefficient, and S2 is the second space coefficient. Further, according to the calculated scores, all PCB boards are sorted, and PCB boards with higher scores are selected as the priority processing objects, or PCB boards within a specific score range are selected according to the processing requirements. According to the sorting results, the layout of the PCB boards can be adjusted to optimize the processing space.

[0042] Optionally, assume that the support platform is a square area of ​​1000mm x 1000mm, with three PCB boards located at different positions. The diameter of the blind hole processing tool is 10mm, and the processing path requires at least 5mm of additional space. Based on these conditions, the first space coefficient and the second space coefficient of each PCB board can be calculated, and the weight coefficients are assumed to be 0.5, 0.3 and 0.2 respectively (just as an example).

[0043] At this time, the area and position of each PCB board are measured, the total occupied area and the actual spacing between the PCB boards are calculated, the minimum moving space requirement of the tool is determined according to the tool specifications and processing requirements, the first space coefficient and the second space coefficient of each PCB board are calculated, and the score of each PCB board is calculated according to the weight coefficient and the coefficient value. The PCB boards are sorted according to the scores and the PCB boards with higher scores are selected as the priority processing objects.

[0044] In step S13, a plurality of blind hole processing positions are determined according to the processing spaces of the plurality of PCB boards, the relative distances between the plurality of PCB boards, and the three-dimensional models of the plurality of PCB boards; In the specific implementation process of the present invention, the specific steps are: S131: Acquire processing spaces of multiple PCB boards; S132: Determine the relative distance between the multiple PCB boards based on the distance detection of the multiple PCB boards; S133: determining an image acquisition system of each PCB board according to the relative distances between the multiple PCB boards, the relative positions between the multiple PCB boards, and the outer contours of the PCB boards; determining an image set of the multiple PCB boards based on the image acquisition system of each PCB board and the center positions of the multiple PCB boards, and constructing a three-dimensional model of the multiple PCB boards according to the image set of the multiple PCB boards; S134: Collecting blind hole positioning systems, matching the three-dimensional models of each PCB board with the corresponding blind hole positioning systems; S135: Determine multiple blind hole processing positions according to the processing spaces of the multiple PCB boards, the three-dimensional models of the multiple PCB boards, and the blind hole positioning system.

[0045] In an embodiment of the present application, a processing space of a plurality of PCB boards is acquired; based on distance detection of the plurality of PCB boards, a relative distance between the plurality of PCB boards is determined, and the relative distance between the plurality of PCB boards is precisely controlled.

[0046] At this time, the processing space of multiple PCB boards is introduced, and the processing space of multiple PCB boards is subsequently controlled. At the same time, the distance detection of multiple PCB boards is performed, and the top view of the supporting platform is introduced. The top view of the supporting platform and the relative positions between the multiple PCBs are further processed, so as to calculate the relative distance between the multiple PCB boards through the image processing algorithm.

[0047] Furthermore, an image acquisition system of each PCB board is determined according to the relative distance between the multiple PCB boards, the relative positions between the multiple PCB boards, and the outer contours of the PCB boards; an image set of the multiple PCB boards is determined based on the image acquisition system of each PCB board and the center positions of the multiple PCB boards, and a three-dimensional model of the multiple PCB boards is constructed according to the image set of the multiple PCB boards, thereby ensuring the accuracy of the three-dimensional model of the multiple PCB boards.

[0048] At this point, the relative distance between multiple PCB boards, the relative position between multiple PCB boards, and the outer contour of the PCB board are introduced. At the same time, the relative distance between multiple PCB boards determines the focal length and shooting range of the camera. PCB boards that are closer require a shorter focal length or a larger shooting range to ensure that the entire board surface can be captured clearly. The relative position between multiple PCB boards determines the layout and shooting angle of the camera. For example, if the PCB boards are arranged in a straight line, the camera can be arranged along this straight line; if the PCB boards are distributed on a plane, the camera needs to be shot from above or from the side. The outer contour of the PCB board determines the field of view and shooting range of the camera. PCB boards with complex shapes or edge features require more precise shooting and image processing algorithms to ensure the accuracy of the image. The outer contour of the PCB board also affects the selection and configuration of the camera, such as the need to select a camera with higher resolution or a larger field of view to adapt to PCB boards of different shapes.

[0049] The image acquisition system of each PCB board is determined based on the relative distance between multiple PCB boards, the relative position between multiple PCB boards and the outer contour of the PCB board. The image acquisition system of each PCB board refers to a complete image acquisition solution designed for each PCB board according to its specific relative distance, relative position, outer contour and other information.

[0050] Based on the relative distances between multiple PCBs, the relative positions between multiple PCBs, and the outer contours of the PCBs, the following image acquisition system can be determined: Camera selection: Choose the right camera type and quantity based on the size, shape, and number of PCB boards. For example, for smaller PCB boards, you can choose a compact camera with high resolution; for larger PCB boards or when you need to shoot multiple boards at the same time, you can choose a camera with a larger field of view or one that supports multi-lens stitching.

[0051] Camera layout: The layout of the camera is determined based on the relative position and distance between the PCB boards. For example, the camera can be fixed on a bracket and aimed at each PCB board at an appropriate angle and distance; or the camera can be installed on a movable platform so that the shooting position and angle can be adjusted as needed.

[0052] Shooting parameter settings: According to the material, reflectivity and lighting conditions of the PCB board, set the camera's exposure time, white balance and gain parameters. The settings of these parameters will directly affect the brightness and contrast of the image, thereby affecting the accuracy and efficiency of subsequent image processing.

[0053] Considering the differences between PCB boards, it is necessary to set shooting parameters for each PCB board individually or use an adaptive adjustment algorithm to automatically adjust the parameters.

[0054] Image processing algorithms: Select appropriate image processing algorithms to extract and analyze the image features of PCB boards. For example, you can use edge detection algorithms to identify the contours and edge features of PCB boards; use template matching algorithms to compare the similarities between different PCB boards; or use machine learning algorithms to automatically identify defects and anomalies on PCB boards.

[0055] At the same time, an image set of the multiple PCB boards is determined based on the image acquisition system of each PCB board and the center positions of the multiple PCB boards, and a three-dimensional model of the multiple PCB boards is constructed according to the image set of the multiple PCB boards.

[0056] Optionally, according to the image acquisition system of each PCB board, each PCB board is photographed, all relevant images are collected, and the collected images are preprocessed, including denoising, contrast enhancement, distortion correction, etc. to improve image quality, and key feature points or edges are extracted from the preprocessed images. These feature points or edges will be used for subsequent three-dimensional reconstruction. According to the extracted feature points or edge information, a three-dimensional model of each PCB board is constructed, and the constructed three-dimensional model is optimized, including smoothing, removing redundant information, etc., to improve the accuracy and usability of the model.

[0057] Specifically, four PCB board image sets were taken, and the image sets of the four PCB boards were preprocessed and feature extracted. Then, a three-dimensional reconstruction algorithm based on stereo matching was used to build a three-dimensional model of each PCB board according to the extracted feature point information. During the construction process, the model was also smoothed and optimized to remove redundant information to ensure the accuracy and usability of the model. Finally, four accurate three-dimensional PCB board models were obtained.

[0058] Furthermore, a blind hole positioning system is collected, and the three-dimensional model of each PCB board is matched with the corresponding blind hole positioning system; multiple blind hole processing positions are determined according to the processing space of multiple PCB boards, the three-dimensional models of multiple PCB boards and the blind hole positioning system, thereby achieving the marking of multiple blind hole processing positions.

[0059] At this time, a blind hole positioning system was introduced, and the three-dimensional model of each PCB board was further controlled so that the corresponding blind hole positioning system could be matched according to the three-dimensional model of each PCB board. The blind hole positioning system is a system used to accurately locate the position of the blind hole.

[0060] The processing space of multiple PCB boards, the three-dimensional models of multiple PCB boards and the blind hole positioning system are introduced. By combining the three-dimensional models of multiple PCB boards and the blind hole positioning system, the position of each blind hole on the PCB board can be accurately determined, which usually involves converting the blind hole position information in the model into coordinates in the actual processing coordinate system.

[0061] Optionally, a preset blind hole position prediction model is collected, and the preprocessed three-dimensional model data is used as input, and the actual position of the blind hole is used as output to train the model. At the same time, the trained model is applied to new PCB board data to predict the processing position of the blind hole, and the predicted position is adjusted and optimized in combination with the processing space and the blind hole positioning system to ensure the accuracy and feasibility of the processing.

[0062] In addition, a blind hole position matching table is made based on the three-dimensional models of multiple PCB boards and the blind hole positioning system. The blind hole position matching table should contain information such as the unique identification of the PCB board, the number of the blind hole, the position coordinates (such as X, Y, Z coordinates) and processing requirements. During the processing, the processing position of the blind hole on the corresponding PCB board is found according to the matching table.

[0063] In step S14, based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions, the blind hole batch processing information of the blind hole processing tool is determined, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; In the specific implementation process of the present invention, the specific steps are: S141: Determine the information space of the corresponding PCB board based on the three-dimensional model of the PCB board, the model information of the PCB board, and the PCB board database; S142: Determine corresponding blind hole processing requirements based on traversal of the information space of the PCB board; S143: Determine a corresponding blind hole processing depth according to the blind hole processing requirement and multiple blind hole processing positions; S144: determining a first processing path of a blind hole processing tool based on the processing spaces of the multiple PCB boards, the three-dimensional model of the PCB boards, and the multiple blind hole processing positions, and constructing a second processing path based on the multiple blind hole processing positions and the corresponding blind hole processing depths; S145: Determine blind hole batch processing information of the blind hole processing tool according to the first processing path, the second processing path and the blind hole processing tool, where the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth.

[0064] At this time, the information space of the corresponding PCB board is determined based on the three-dimensional model of the PCB board, the model information of the PCB board and the PCB board database; the corresponding blind hole processing requirements are determined based on the traversal of the information space of the PCB board, thereby ensuring the accuracy of each blind hole processing requirement.

[0065] Specifically, the three-dimensional model of the PCB board, the model information of the PCB board and the PCB board database are introduced. The model information of the PCB board is the unique identifier of the PCB board, which usually includes the product number, version number, etc. This information is used to find the corresponding PCB board design data and processing requirements in the PCB board database. The PCB board database is a database that stores a variety of PCB board design data and processing requirements. By inputting the model information of the PCB board, the corresponding PCB board design data and processing requirements, such as material type, number of layers, copper thickness, blind hole specifications, etc., can be found in the database.

[0066] After obtaining the three-dimensional model of the PCB board, the model information of the PCB board and the design data in the PCB board database, it is necessary to integrate this information to form a virtual space or data set containing all relevant design parameters and processing requirements of the PCB board, that is, the information space of the PCB board. This information space of the PCB board provides the necessary guidance and basis for subsequent processing steps.

[0067] After determining the information space of the PCB board, it is necessary to check and analyze each element or parameter one by one, including checking the material type, number of layers, copper thickness and other information of the PCB board, as well as the processing requirements such as the position, diameter and depth of the blind hole. By traversing the information space, the specific processing requirements of each blind hole can be determined. These specific processing requirements include the diameter tolerance, depth tolerance, surface roughness, position accuracy, etc. of the blind hole, which will directly affect the selection of the processing method and process parameters of the blind hole.

[0068] Specifically, suppose there is a PCB board with model number XYZ123, and its information space needs to be determined through its three-dimensional model, model information and PCB board database. First, use the PCB design software to open the three-dimensional model of the PCB board to view its physical size, shape, component layout and other information. Then, enter the model information XYZ123 into the PCB board database to find the corresponding design data and processing requirements. For example, the PCB board uses FR-4 material, has a 6-layer structure, a copper thickness of 1 ounce, a blind hole diameter of 0.3mm, and a depth of 1.5mm. Finally, integrate this information to form an information space containing all relevant design parameters and processing requirements of the XYZ123 PCB board. After traversing its information space, the processing requirements of all blind holes on the PCB board are determined. For example, the position of a blind hole is at (X=10mm, Y=20mm), the diameter is 0.3mm±0.01mm, the depth is 1.5mm±0.1mm, the surface roughness Ra<3.2μm, and the position accuracy is ±0.02mm. These processing requirements will be used as input parameters for subsequent processing steps to guide the processing equipment to complete the precise processing of the blind hole, thereby performing batch processing of blind holes on multiple PCB boards.

[0069] Furthermore, the corresponding blind hole processing depth is determined according to the blind hole processing requirement and a plurality of blind hole processing positions.

[0070] At this time, the blind hole processing requirements and multiple blind hole processing positions are introduced, and the blind hole processing requirements and multiple blind hole processing positions are interacted. Optionally, the blind hole processing requirements usually include key parameters such as the diameter, shape, position accuracy, surface roughness, and processing depth of the blind hole. The processing position of the blind hole is obtained by searching the PCB board database through the three-dimensional model and model information of the PCB board. The processing position of the blind hole is usually expressed in the form of coordinates, which plays a vital role in the manufacturing and processing of the PCB board.

[0071] The processing depth of blind holes is affected by many factors, such as the material type, number of layers, copper thickness of the PCB board, and the component layout around the blind hole. When determining the processing depth of blind holes, these factors need to be considered comprehensively to ensure the processing quality and efficiency of the blind holes. At this time, the processing depth of each blind hole is calculated based on the processing requirements and position information of the blind holes, combined with the specific conditions of the PCB board and the performance of the processing equipment.

[0072] Assume that there is a PCB board on which multiple blind holes need to be processed to meet the needs of circuit connection. The following is a specific example of determining the processing depth of blind holes: Blind hole processing requirements: Blind hole diameter: 0.5mm Blind hole shape: cylindrical Position accuracy: ±0.05mm Surface roughness: Ra<1.6μm Blind hole processing position: Position 1: (X1, Y1) Position 2: (X2, Y2) ...(and so on for other locations) Analysis of factors affecting processing depth: PCB material: FR-4 (epoxy resin glass cloth laminate) Number of layers: 4 Copper thickness: 1 oz (about 35 μm) Component layout around blind holes: relatively dense, need to avoid damaging surrounding components Calculate machining depth: According to the processing requirements and position information of the blind hole, combined with the specific conditions of the PCB board and the performance of the processing equipment, the processing depth of each blind hole is calculated. For example, for the blind hole at position 1, its processing depth may be determined to be 1.2mm.

[0073] Furthermore, a first processing path of a blind hole processing tool is determined based on the processing space of multiple PCB boards, a three-dimensional model of the PCB boards, and multiple blind hole processing positions, and a second processing path is constructed based on the multiple blind hole processing positions and corresponding blind hole processing depths.

[0074] At this time, the processing space of multiple PCB boards, the three-dimensional model of the PCB boards and multiple blind hole processing positions are introduced, and the processing space of multiple PCB boards, the three-dimensional model of the PCB boards and multiple blind hole processing positions are comprehensively considered to facilitate the control of the first processing path of the blind hole processing tool.

[0075] For the first processing path of the blind hole processing tool, the first thing to consider is the layout and arrangement of multiple PCB boards in the processing equipment, as well as the working range and accuracy of the processing equipment, which includes the distance between PCB boards, the movement range of the processing equipment, possible collision risks, etc. Using the three-dimensional model of the PCB board, the specific position, shape and size of each blind hole on the PCB board can be understood. Based on the processing position information of the blind hole, the coordinates of each point that the tool needs to reach can be determined, and these coordinate points will form the basis of the first processing path.

[0076] For the second processing path of the blind hole processing tool, the construction of the second processing path also needs to be based on the processing position information of the blind hole, but at this time, the processing depth of each blind hole needs to be considered to determine the moving distance of the tool in the Z-axis direction; for each blind hole, the depth to which the tool needs to drill can be determined based on its processing depth information, which requires clear marking of each blind hole processing depth and the corresponding Z-axis moving distance in the second processing path.

[0077] Specifically, Assume that there is a batch of four PCB boards, each of which has three blind holes that need to be processed. The following is a specific example of determining the first processing path and the second processing path: Determination of the first processing path: Consider the processing space: Assume that the working range of the processing equipment is 1000mm×1000mm and the size of each PCB board is 200mm×200mm.

[0078] Four PCBs can be placed in a 2×2 layout in the processing equipment, ensuring a certain distance between each PCB to avoid collision.

[0079] Combined with three-dimensional model: Using the three-dimensional model of the PCB board, the specific position of each blind hole can be determined.

[0080] For example, the positions of the three blind vias on the first PCB board are (50,50), (100,100) and (150,150).

[0081] Determine move order and strategy: According to the position information of the blind hole, you can choose to start from the upper left corner and process the blind holes on each PCB board in turn.

[0082] For example, first process the blind hole at position (50,50) on the first PCB board, then move to the blind hole at position (50,50) on the second PCB board, and so on.

[0083] Construction of the second machining path Combined blind hole processing depth: Assume that the processing depth of each blind hole is 1.5mm.

[0084] When constructing the second processing path, it is necessary to mark a processing depth of 1.5 mm below the processing position of each blind hole.

[0085] Build in and out paths: For each blind hole, you can choose to enter vertically and drill the blind hole at an angle of 90 degrees.

[0086] The cutting speed and feed rate can be set according to the performance of the processing equipment and the material characteristics of the blind hole.

[0087] Optimize the second machining path: After constructing the preliminary second machining path, the tool's movement path can be checked for unnecessary empty travel.

[0088] For example, if two adjacent blind holes are located close to each other, the tool movement path can be adjusted to reduce the idle travel time.

[0089] At the same time, the blind hole batch processing information of the blind hole processing tool is determined according to the first processing path, the second processing path and the blind hole processing tool. The blind hole batch processing information includes the plane movement path and the corresponding blind hole processing depth, and is compatible with the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the overall consideration of multiple blind hole processing positions, thereby ensuring the autonomous optimization of the blind hole batch processing information of the blind hole processing tool, and further ensuring the accuracy of the plane movement path and the corresponding blind hole processing depth.

[0090] The first processing path, the second processing path and the blind hole processing tool are introduced. The first processing path mainly describes the movement path of the tool on the plane, which ensures that the tool can reach the processing position of each blind hole in a predetermined order. The second processing path describes in detail the processing depth of the tool at each blind hole position, as well as the path in and out of the blind hole. By integrating the two together, complete blind hole processing information can be obtained. When integrating the processing paths, the tool movement strategy needs to be considered to ensure processing efficiency and quality. This includes determining parameters such as the tool's movement speed, acceleration, feed rate, and how to quickly and accurately switch between different blind holes.

[0091] At this point, the tool movement path on the plane can be extracted from the integrated processing path, which usually includes a series of coordinate points, indicating each position the tool needs to reach, corresponding to the plane movement path, and each blind hole processing depth needs to be extracted, which ensures that the tool can drill into the correct depth at each blind hole position to meet the design requirements. Finally, the plane movement path and the corresponding blind hole processing depth are integrated together to generate blind hole batch processing information. This is usually presented in a machine-readable format (such as G code) so that the processing equipment can perform processing according to the predetermined program.

[0092] Specifically, suppose there is a PCB board with six blind vias that need to be processed in batches. The following is a specific example of determining the batch processing information of blind vias: Assume that the first machining path and the second machining path have been determined based on the machining position and depth information of the blind hole. The first machining path describes the path of the tool from the starting point to each blind hole position in sequence. The second machining path describes the machining depth of the tool at each blind hole position.

[0093] Assuming the tool moves at a speed of 100mm / s, an acceleration of 500mm / s², and a feed rate of 0.1mm / rev, the tool will switch quickly and accurately between each blind hole position according to the predetermined sequence and strategy.

[0094] From the integrated processing path, extract the movement path of the tool on the plane. For example, the tool will reach coordinate points such as (50,50), (100,100), and (150,50) in sequence. Corresponding to each coordinate point, extract the corresponding blind hole processing depth. For example, the blind hole processing depth at the position of (50,50) is 1.2mm, the blind hole processing depth at the position of (100,100) is 1.5mm, etc. Integrate the plane movement path and the corresponding blind hole processing depth to generate blind hole batch processing information.

[0095] For example, the generated G code may contain the following instructions: G0 X50 Y50 Z0 (rapidly move to above the position (50,50)); G1 Z-1.2 F0.1 (drill to a depth of 1.2mm at a feed rate of 0.1mm / rev); G0 X100 Y100 (rapidly move to above the next blind hole position); G1 Z-1.5 F0.1 (drill to a depth of 1.5mm at a feed rate of 0.1mm / rev); and so on.

[0096] In step S15, a plurality of blind hole processing combinations are determined based on the blind hole batch processing information of the blind hole processing tool, the model information of the plurality of PCB boards, and the blind hole processing depths of the plurality of PCB boards; In the specific implementation process of the present invention, the specific steps are: S151: Obtaining blind hole batch processing information of a blind hole processing tool; S152: matching the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of the plurality of PCB boards, and the model information of the plurality of PCB boards; S153: determining category information of the plurality of PCB boards based on matching of the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of the plurality of PCB boards, and the model information of the plurality of PCB boards; S154: determining blind hole information of the plurality of PCB boards according to model information of the plurality of PCB boards and blind hole processing depths of the plurality of PCB boards; S155: Determine multiple blind hole processing combinations according to the category information of the multiple PCB boards, the blind hole information of the multiple PCB boards, and the blind hole processing tools.

[0097] At this time, the blind hole batch processing information of the blind hole processing tool is obtained; the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of multiple PCB boards, and the model information of multiple PCB boards are matched.

[0098] Specifically, the blind hole batch processing information of the blind hole processing tool is obtained, and the blind hole batch processing information of the blind hole processing tool is further controlled. The blind hole batch processing information of the blind hole processing tool generally includes the tool model, specifications (such as diameter, length), processing parameters (such as rotation speed, feed speed), processing depth of each blind hole, position coordinates and processing sequence, etc.

[0099] At this time, obtain a three-dimensional model of each PCB board, which usually contains all layer information, component layout, routing, etc. of the PCB board. According to the model information of the PCB board, retrieve the processing requirements and blind hole layout corresponding to the model from the database. Compare the obtained batch processing information of the blind hole processing tool with the blind hole layout of the PCB board to ensure that the position, depth and processing sequence of each blind hole meet the requirements. Optionally, if a mismatch is found, such as blind hole position offset, depth mismatch, etc., it is necessary to make adjustments or corrections in time.

[0100] Furthermore, category information of the plurality of PCB boards is determined based on matching of the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of the plurality of PCB boards, and the model information of the plurality of PCB boards.

[0101] The batch processing information of blind hole processing tools and three-dimensional models of multiple PCB boards are introduced, and the batch processing information of blind hole processing tools is matched with the three-dimensional model and model information of the PCB board. This process may involve comparing the blind hole position coordinates in the processing information with the blind hole position in the three-dimensional model to ensure that the two are consistent. At the same time, it is also necessary to verify whether the processing depth, tool specifications and other information are consistent with the model information of the PCB board. According to the matching results, combined with the model information of the PCB board and the features in the three-dimensional model, the category of each PCB board is determined.

[0102] Specifically, PCB processing equipment needs to process blind holes for different models of smartphone motherboards. These motherboards have different sizes, number of layers, and blind hole layouts. The following are specific steps and examples: Blind hole processing tool information: Use a carbide drill with a diameter of 0.5mm, a rotation speed of 12000rpm, and a feed rate of 0.05mm / rev.

[0103] PCB board 3D model: A 3D model created using CAD software that includes all layer information, component layout, and blind hole layout of the motherboard.

[0104] PCB model information: including main board size (such as 100mm x 150mm), number of layers (such as 6 layers), material type (such as FR-4) and number and type of blind holes (such as 8 blind holes with a depth of 1.2mm).

[0105] Match the information of the blind hole processing tool with the three-dimensional model of the motherboard to ensure that the position coordinates, depth and tool specifications of each blind hole are consistent with the information in the model. Determine the category of each motherboard based on the matching results and model information. For example, a motherboard with 8 blind holes with a depth of 1.2mm, a size of 100mm x 150mm, and 6 layers of FR-4 material may be classified as "High-end smartphone motherboard category A".

[0106] Furthermore, blind hole information of multiple PCB boards is determined according to model information of multiple PCB boards and blind hole processing depths of multiple PCB boards; multiple blind hole processing combinations are determined according to category information of multiple PCB boards, blind hole information of multiple PCB boards and blind hole processing tools, thereby ensuring the accuracy of multiple blind hole processing combinations.

[0107] At this point, the model information of multiple PCB boards and the blind hole processing depths of multiple PCB boards are introduced, and the model information of multiple PCB boards and the blind hole processing depths of multiple PCB boards are interacted to determine the blind hole information of multiple PCB boards. This step aims to integrate the model information of the PCB board and the blind hole processing depth, so as to accurately describe the specific characteristics of the blind hole on each PCB board.

[0108] Optionally, extract data related to blind holes from the model information, such as the number of blind holes, expected positions (although the specific positions may need to be determined by the three-dimensional model in the subsequent steps, the model information may provide relative positions or areas), and associate the processing depth of each blind hole with the corresponding PCB board model. This usually involves consulting the processing specifications or process requirements to ensure that the depth of each blind hole meets the design standards and summarize all key information, including the number of blind holes, positions (if provided in the model information), depths, and possible other related parameters (such as hole diameter).

[0109] Assume there are two PCB board models: XYZ-A1 and XYZ-B2.

[0110] XYZ-A1: This model has 8 blind holes on the PCB, each located in a specific area, and the processing depth of each blind hole is 1.2mm.

[0111] XYZ-B2: This model has 12 blind holes on the PCB, evenly distributed on the board, and the processing depth of each blind hole is 1.5mm.

[0112] At the same time, understand the similarities and differences between different categories of PCB boards, such as material type, number of layers, size, etc. This helps determine which PCB boards can use the same processing strategy. Select the most appropriate processing tools and processing parameters based on the number, location and depth of blind holes. For example, for a large number of blind holes with consistent depth, you may need to choose high-speed and efficient processing tools. Combine category information and blind hole information, as well as available processing tools and processing equipment, to determine the best processing combination. This may involve grouping similar PCB boards together and processing them using the same tools and parameters.

[0113] Specifically, we have two PCB board models, XYZ-A1 and XYZ-B2, and two blind hole processing tools: Tool-1 (suitable for blind holes with a processing depth of 1.2mm) and Tool-2 (suitable for blind holes with a processing depth of 1.5mm).

[0114] Processing combination 1: For the XYZ-A1 model PCB board, since its blind hole processing depth is 1.2mm, we will select Tool-1 for processing.

[0115] Processing combination 2: For the XYZ-B2 model PCB board, since its blind hole processing depth is 1.5mm, we will choose Tool-2 for processing.

[0116] In step S16, a work sequence table of the blind hole processing tool is determined according to the plurality of blind hole processing combinations, the priorities of the plurality of PCB boards and the service life of the blind hole processing tool, wherein the processing difficulty coefficients of the plurality of blind hole processing items in the work sequence table are gradually increased; In the specific implementation process of the present invention, the specific steps are: S161: Acquire multiple blind hole processing combinations; S162: performing multiple interactions on model information of multiple PCB boards, multiple blind hole processing positions, and corresponding blind hole processing depths; S163: Determine priorities of the plurality of PCB boards based on multiple interactions of model information of the plurality of PCB boards, the plurality of blind hole processing positions, and the corresponding blind hole processing depths; S164: locate the blind hole processing tool and collect the service life of the blind hole processing tool; S165: determining a work sequence list of the blind hole processing tool based on the plurality of blind hole processing combinations, the priorities of the plurality of PCB boards, and the service life of the blind hole processing tool; S166: Determine a plurality of blind hole processing projects based on the division of the working sequence list of the blind hole processing tool; determine the processing difficulty coefficients of the plurality of blind hole processing projects according to the plurality of blind hole processing projects and the corresponding blind hole processing tools, and optimize the working sequence list of the blind hole processing tool based on the step-by-step sorting of the processing difficulty coefficients of the plurality of blind hole processing projects.

[0117] At this time, multiple blind hole processing combinations are obtained; multiple interactions are performed on the model information of multiple PCB boards, multiple blind hole processing positions, and corresponding blind hole processing depths; and the priorities of multiple PCB boards are determined based on the multiple interactions of the model information of multiple PCB boards, multiple blind hole processing positions, and corresponding blind hole processing depths.

[0118] Specifically, model information of multiple PCB boards, multiple blind hole processing positions and corresponding blind hole processing depths are introduced, and multiple interactions are performed on the model information of multiple PCB boards, multiple blind hole processing positions and corresponding blind hole processing depths, considering the interaction between the PCB board model, blind hole position and processing depth.

[0119] At the same time, different PCB board models may have different characteristics such as size, number of layers, material and copper thickness. The blind hole processing position will affect the tool movement path and processing strategy. The blind hole processing depth will directly affect the tool selection and processing time. After comprehensively considering the above factors, we can determine the priority of multiple PCB boards according to the following principles.

[0120] Specific examples: Assume that we have four different types of PCB boards: A, B, C, and D. The following is a brief description of their model information, blind hole processing locations, and processing depths, as well as priority determination based on this information: PCB board model Blind hole position description Blind hole processing depth Priority A Even distribution Medium Depth middle B Dense distribution Shallow depth high C Sparse distribution Deeper Depth Low (but pay attention to tool selection and processing time) D Special locations (such as edges or corners) Medium Depth Flexible adjustment based on resource availability and delivery requirements analyze: Type B PCBs have dense blind hole locations and may require more sophisticated processing control and tool path planning, so they are identified as high priority.

[0121] The blind holes of Type A PCB are evenly distributed and have a moderate processing depth, so the processing difficulty is relatively low, and therefore it is determined to be a medium priority.

[0122] C-type PCBs have sparse blind holes but deep processing depths, which may require special tools and longer processing time, so they are determined to be low priority. However, it should be noted that the processing of this type of PCB should be scheduled during a period when resources are sufficient and delivery requirements are not high.

[0123] The blind holes of D-type PCB boards are in special positions and may require additional tooling or equipment to ensure processing accuracy. Its priority should be flexibly adjusted according to current resource conditions and delivery requirements.

[0124] At the same time, the blind hole processing tool is located, and the service life of the blind hole processing tool is collected; based on multiple blind hole processing combinations, the priority of multiple PCB boards and the service life of the blind hole processing tool, the work sequence list of the blind hole processing tool is determined.

[0125] At this point, select the appropriate tool from the tool library based on the diameter, depth, material and required machining accuracy of the blind hole. The selection of the tool should take into account factors such as its material, geometry, coating, etc. to ensure the best machining effect and tool life. After the tool is determined, it needs to be accurately positioned on the processing equipment. This usually involves steps such as tool clamping, tool setting, and tool length and radius compensation settings. The service life information of the tool can be collected by consulting the data provided by the tool manufacturer, historical usage records or performing tool life tests. The service life may be affected by many factors, such as processing materials, cutting parameters, cooling conditions, etc.

[0126] According to the known blind hole processing combinations, the priority of the PCB board and the service life of the tool, a reasonable work sequence list is formulated to optimize the processing process, improve efficiency and reduce costs. For multiple blind hole processing combinations, understand the number, location and depth of blind holes on different PCB boards, and arrange the processing sequence according to the priority of multiple PCB boards. High-priority PCB boards should be processed first to ensure delivery time and meet customer needs. According to the service life of the blind hole processing tool, evaluate the life and replacement needs of different tools during the processing process. Based on the above information, a detailed work sequence list is formulated, including the processing sequence of each PCB board, the required tools, the estimated processing time and the tool replacement plan.

[0127] Specifically, suppose we are processing a PCB board containing multiple blind holes, the diameter of the blind holes is 0.5mm, the depth is 1.2mm, and the material is FR-4 epoxy resin fiberglass cloth board.

[0128] Tool selection: We might choose a 0.5mm diameter micro milling cutter made of carbide with appropriate geometry and coating to suit the machining requirements of FR-4 material.

[0129] Tool positioning: Clamp the selected micro milling cutter on the tool holder of the machining center, determine the zero point position of the tool through tool setting operation, and set the compensation value of the tool length and radius.

[0130] Service life collection: By consulting the data provided by the tool manufacturer, we learned that the estimated service life of this micro milling cutter when processing FR-4 material is about 500 blind holes (the specific value may vary depending on cutting parameters, cooling conditions, etc.).

[0131] There are three blind hole processing combinations and two PCB board priorities: Blind hole processing combination 1: Processing shallow blind holes (0.5mm diameter, 0.8mm depth) on type A PCB board.

[0132] Blind hole processing combination 2: Processing deep blind holes (0.5mm diameter, 1.2mm depth) on type B PCB boards.

[0133] PCB board priority: Type A is high priority, and Type B is medium priority.

[0134] Combined with the previously determined service life of the micro milling cutter (processing about 500 blind holes), we can formulate the following work sequence table: First process type A PCB board (high priority): Machining is performed using selected micro milling cutters.

[0135] It is expected that the number of shallow blind holes processed on a type A PCB will not exceed the life of the tool (assuming 500 blind holes).

[0136] After machining is completed, the tool usage is recorded for subsequent evaluation.

[0137] Then process the B-type PCB board (medium priority): If the tool is still in good condition after processing type A PCB board and has not reached its service life, continue to use the same tool for processing.

[0138] If the tool has reached or is close to its service life, replace it with a new one and record the replacement time.

[0139] When processing deep blind holes on B-type PCB boards, it is necessary to adjust the cutting parameters to adapt to the deeper processing depth.

[0140] Tool replacement plan: Develop a tool replacement plan based on the tool's service life and the actual situation during the machining process.

[0141] Ensure that new tools are replaced in time before the end of tool life to avoid tool damage or degradation of machining quality during processing.

[0142] Therefore, based on the division of the working sequence list of the blind hole processing tool, a plurality of blind hole processing projects are determined; according to the plurality of blind hole processing projects and the corresponding blind hole processing tools, the processing difficulty coefficients of the plurality of blind hole processing projects are determined; based on the step-by-step sorting of the processing difficulty coefficients of the plurality of blind hole processing projects, the working sequence list of the blind hole processing tool is optimized; and a working sequence list of the blind hole processing tool is introduced to facilitate the management and control of the autonomous processing of multiple PCB boards by the blind hole processing tool, thereby further improving the rationality of the batch processing of blind holes of PCB boards.

[0143] At this point, according to the established work sequence table of blind hole processing tools, the processing tasks are further refined into specific blind hole processing projects. Each project represents a specific set of blind hole processing tasks, which may involve blind holes on one or more PCB boards, which have similar processing characteristics (such as diameter, depth, material, etc.). By dividing the blind hole processing projects, we can have a clearer understanding of the specific requirements and required resources for each processing task.

[0144] Determine a difficulty factor for each blind hole machining project. This factor should take into account multiple factors, including the diameter, depth, number, material properties, tool type, and the current condition of the tool (such as wear). By evaluating these factors, we can assign a relative difficulty level to each project, thereby more accurately understanding the machining complexity and resources required for each project.

[0145] The determination of the machining difficulty coefficient can be based on empirical formulas, historical data or expert systems. For example, we can set a basic difficulty value based on the diameter and depth of the blind hole, and then make appropriate adjustments based on the material properties and tool type. In addition, if the tool has been used for a period of time and has a certain degree of wear, we can also increase the corresponding difficulty coefficient to reflect this change.

[0146] According to the processing difficulty coefficient, the blind hole processing projects are sorted step by step, and the work sequence list of the blind hole processing tool is optimized accordingly. The principle of sorting is to give priority to projects with lower difficulty and less resource requirements, so as to maximize the processing efficiency and quality within a limited time. At the same time, we also need to consider the efficiency and life of the tool to avoid excessive consumption of tool resources on projects with higher processing difficulty.

[0147] By sorting the work items in the work order list, we can rearrange the order of the processing items in the work order list to ensure more efficient use of tool resources and reduce processing time and cost. In addition, we can dynamically adjust the tool replacement plan based on the sorting results to ensure that the tools in good condition are always used during the processing.

[0148] Practical example: Suppose we have the following two blind hole processing projects and corresponding tools: Project A: Use a micro milling cutter to process 100 blind holes with a diameter of 0.5mm and a depth of 1.0mm. The material is FR-4.

[0149] Project B: Use the same micro milling cutter to process 50 blind holes with a diameter of 0.6mm and a depth of 1.5mm. The material is also FR-4, but the tool has been used for a period of time and has a certain degree of wear.

[0150] Based on the above information, we can determine a processing difficulty coefficient for each project: Project A may be less difficult because the diameter and depth of the blind hole are relatively small and the tool is in good condition.

[0151] Project B may be more difficult because the diameter and depth of the blind hole are large and the tool is worn, which may cause the tool to be more easily damaged or the processing quality to decline during the processing.

[0152] Based on these difficulty factors, we can prioritize the projects and optimize the work order list: Prioritize Item A because it is less difficult and the tool is in good condition.

[0153] After processing item A, decide whether to replace the tool with a new one based on the remaining life and status of the tool.

[0154] If the tool condition is still acceptable, continue to process project B; if the tool life is nearing the end or is in poor condition, replace it with a new tool before processing project B.

[0155] Through such an optimization process, we can use tool resources more effectively, reduce processing time and cost, and ensure consistent processing quality.

[0156] In an embodiment of the present invention, through the method in the embodiment of the present invention, the center positions of multiple PCB boards are determined based on the top view of the supporting platform, at this time, there are multiple PCB boards in a clamped state in the same supporting platform; the processing space of the multiple PCB boards is determined based on the center position of the supporting platform and the multiple PCB boards; the multiple blind hole processing positions are determined according to the processing space of the multiple PCB boards, the relative distance between the multiple PCB boards and the three-dimensional model of the multiple PCB boards; the blind hole batch processing information of the blind hole processing tool is determined based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the multiple blind hole processing positions, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth, is compatible with the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the overall consideration of the multiple blind hole processing positions, ensures the autonomous optimization of the blind hole batch processing information of the blind hole processing tool, and thus ensures the accuracy of the plane moving path and the corresponding blind hole processing depth.

[0157] Furthermore, multiple blind hole processing combinations are determined based on the blind hole batch processing information of the blind hole processing tool, the model information of multiple PCB boards, and the blind hole processing depths of the multiple PCB boards, thereby achieving precise control of the multiple blind hole processing combinations.

[0158] Therefore, a working sequence list of the blind hole processing tool is determined according to multiple blind hole processing combinations, the priorities of multiple PCB boards and the service life of the blind hole processing tool. The processing difficulty coefficients of multiple blind hole processing items in the working sequence list are gradually increased. A working sequence list of the blind hole processing tool is introduced to facilitate the management and control of the autonomous processing of multiple PCB boards by the blind hole processing tool, thereby further improving the rationality of the batch processing of blind holes on PCB boards.

[0159] Embodiment 3

[0160] See also Figure 3 , Figure 3 The figure is a schematic diagram of the structure of a blind hole batch processing system for PCB boards in an embodiment of the present invention.

[0161] like Figure 3 As shown, a system for batch processing blind holes of PCB boards, the system for batch processing blind holes of PCB boards comprising: A center position module 21, used to determine the center positions of multiple PCB boards based on a top view of the support platform, where multiple PCB boards in a clamped state exist in the same support platform; A processing space module 22, used to determine the processing space of multiple PCB boards based on the support platform and the center positions of the multiple PCB boards; A blind hole processing position module 23 is used to determine a plurality of blind hole processing positions according to the processing space of the plurality of PCB boards, the relative distance between the plurality of PCB boards and the three-dimensional models of the plurality of PCB boards; A blind hole processing depth module 24 is used to determine the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; A blind hole processing combination module 25 is used to determine a plurality of blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of the plurality of PCB boards, and the blind hole processing depths of the plurality of PCB boards; The work sequence table module 26 is used to determine the work sequence table of the blind hole processing tool according to multiple blind hole processing combinations, the priorities of multiple PCB boards and the service life of the blind hole processing tool. The processing difficulty coefficients of the multiple blind hole processing items in the work sequence table are gradually increased.

[0162] Embodiment 4

[0163] In this embodiment, an electronic device is provided. Its internal structure diagram can be shown as follows: Figure 4 As shown. The electronic device includes a processor, a memory, a network interface, a display screen and an input device connected through a system bus. Among them, the processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program, and the non-volatile storage medium is deployed with a database, which is used to store user behavior data and user portraits. The internal memory provides an environment for the operation of the operating system and computer program in the non-volatile storage medium. The network interface of the electronic device is used to communicate with other electronic devices that deploy application software. When the computer program is executed by the processor, a low-altitude patrol method of a drone is implemented. The display screen of the electronic device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the electronic device can be a touch layer covered on the display screen, or a button, trackball or touchpad set on the housing of the electronic device, or an external keyboard, touchpad or mouse.

[0164] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

Claims

1. A method for batch processing of blind holes of PCB boards, characterized in that: include: Determine the center positions of the multiple PCB boards based on the top view of the support platform, where multiple PCB boards in a clamped state exist in the same support platform; Determine a processing space for the multiple PCB boards based on the support platform and the center positions of the multiple PCB boards; Determine multiple blind hole processing positions according to the processing space of multiple PCB boards, the relative distance between the multiple PCB boards, and the three-dimensional models of the multiple PCB boards; Determine the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions, and the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; Determine multiple blind hole processing combinations based on blind hole batch processing information of a blind hole processing tool, model information of multiple PCB boards, and blind hole processing depths of multiple PCB boards; A work sequence list of blind hole processing tools is determined according to multiple blind hole processing combinations, priorities of multiple PCB boards and the service life of the blind hole processing tools. The processing difficulty coefficients of multiple blind hole processing items in the work sequence list are gradually increased.

2. The method for batch processing blind holes of PCB boards according to claim 1, characterized in that: The method of determining the center positions of the plurality of PCB boards based on the top view of the supporting platform, wherein the plurality of PCB boards in a clamped state exist in the same supporting platform, comprises: In PCB processing equipment, collect the spatial position of the support platform; A top view of the support platform is determined according to multi-angle detection of the spatial position of the support platform, and at this time, a plurality of PCB boards in a clamped state exist in the same support platform; Determine the outer contours of the plurality of PCB boards based on traversing the top view of the support platform; Marking model information of the PCB boards in the outer contours of the multiple PCB boards, and determining corresponding center position learning models according to the outer contours of the multiple PCB boards and the model information of the multiple PCB boards; The center positions of the multiple PCB boards are determined according to the outer contours of the multiple PCB boards and the corresponding center position learning model.

3. The method for batch processing blind holes of PCB boards according to claim 2, characterized in that: The method of determining the processing space of the plurality of PCB boards based on the supporting platform and the center positions of the plurality of PCB boards comprises: Get the center position of multiple PCB boards; Determine the relative positions between the multiple PCB boards according to the center positions of the multiple PCB boards; The spatial range of the associated support platform, the relative positions between multiple PCB boards, and the moving range of the blind hole processing tool; The first space coefficient is determined according to the space range of the support platform and the relative positions between the multiple PCB boards; the second space coefficient is determined according to the relative positions between the multiple PCB boards and the moving range of the blind hole processing tool; The processing space of the multiple PCB boards is determined based on the first space coefficient, the second space coefficient, and the space enclosed by the multiple PCB boards.

4. The method for batch processing blind holes of PCB boards according to claim 3, characterized in that: The method of determining a plurality of blind hole processing positions according to the processing spaces of the plurality of PCB boards, the relative distances between the plurality of PCB boards, and the three-dimensional models of the plurality of PCB boards comprises: Get the processing space of multiple PCB boards; Determining relative distances between the plurality of PCB boards based on distance detection of the plurality of PCB boards; Determine an image acquisition system for each PCB board according to the relative distances between the multiple PCB boards, the relative positions between the multiple PCB boards, and the outer contours of the PCB boards; determine an image set of the multiple PCB boards based on the image acquisition system of each PCB board and the center positions of the multiple PCB boards, and construct a three-dimensional model of the multiple PCB boards according to the image set of the multiple PCB boards; Acquire the blind hole positioning system, and match the three-dimensional model of each PCB board with the corresponding blind hole positioning system; A plurality of blind hole processing positions are determined according to the processing spaces of the plurality of PCB boards, the three-dimensional models of the plurality of PCB boards and the blind hole positioning system.

5. The method for batch processing blind holes of PCB boards according to any one of claims 1 to 4, characterized in that: The method determines the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and the multiple blind hole processing positions, wherein the blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth, including: Determine the information space of the corresponding PCB board based on the three-dimensional model of the PCB board, the model information of the PCB board and the PCB board database; Determine the corresponding blind hole processing requirements based on the traversal of the information space of the PCB board; Determine the corresponding blind hole processing depth according to the blind hole processing requirements and multiple blind hole processing positions; Determine a first processing path of a blind hole processing tool based on processing spaces of multiple PCB boards, a three-dimensional model of the PCB boards, and multiple blind hole processing positions, and construct a second processing path based on the multiple blind hole processing positions and corresponding blind hole processing depths; Blind hole batch processing information of the blind hole processing tool is determined according to the first processing path, the second processing path and the blind hole processing tool, and the blind hole batch processing information includes a plane movement path and a corresponding blind hole processing depth.

6. The method for batch processing blind holes of PCB boards according to claim 5, characterized in that: The method of determining a plurality of blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of the plurality of PCB boards, and the blind hole processing depths of the plurality of PCB boards comprises: Obtaining the blind hole batch processing information of the blind hole processing tool; Matching the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of multiple PCB boards, and the model information of multiple PCB boards; The category information of the plurality of PCB boards is determined based on the matching of the blind hole batch processing information of the blind hole processing tool, the three-dimensional models of the plurality of PCB boards and the model information of the plurality of PCB boards.

7. The method for batch processing blind holes of PCB boards according to claim 6, characterized in that: The method of determining a plurality of blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of the plurality of PCB boards, and the blind hole processing depths of the plurality of PCB boards further includes: Determine blind hole information of the multiple PCB boards according to model information of the multiple PCB boards and blind hole processing depths of the multiple PCB boards; A plurality of blind hole processing combinations are determined according to category information of a plurality of PCB boards, blind hole information of a plurality of PCB boards, and blind hole processing tools.

8. The method for batch processing blind holes of PCB boards according to claim 7, characterized in that: The blind hole processing tool work sequence table is determined according to the plurality of blind hole processing combinations, the priority of the plurality of PCB boards and the service life of the blind hole processing tool, wherein the processing difficulty coefficients of the plurality of blind hole processing items in the work sequence table are gradually increased, including: Get multiple blind hole processing combinations; Multiple interactions are performed on the model information of multiple PCB boards, multiple blind hole processing positions and corresponding blind hole processing depths; Priorities of the plurality of PCB boards are determined based on multiple interactions of model information of the plurality of PCB boards, a plurality of blind hole processing positions and corresponding blind hole processing depths.

9. The method for batch processing blind holes of PCB boards according to claim 8, characterized in that: The method further comprises: determining a working sequence table of blind hole processing tools according to a plurality of blind hole processing combinations, priorities of a plurality of PCB boards and the service life of the blind hole processing tools, wherein the processing difficulty coefficients of the plurality of blind hole processing items in the working sequence table are gradually increased; Locate the blind hole processing tool and collect the service life of the blind hole processing tool; Determine a work sequence list of blind hole processing tools based on multiple blind hole processing combinations, priorities of multiple PCB boards, and the service life of the blind hole processing tools; Based on the division of the work sequence list of the blind hole processing tool, multiple blind hole processing projects are determined; based on the multiple blind hole processing projects and the corresponding blind hole processing tools, the processing difficulty coefficients of the multiple blind hole processing projects are determined, and based on the step-by-step sorting of the processing difficulty coefficients of the multiple blind hole processing projects, the work sequence list of the blind hole processing tool is optimized.

10. A PCB board blind hole batch processing system, characterized in that: The blind hole batch processing system of the PCB board is applied to the blind hole batch processing method of the PCB board as claimed in any one of claims 1 to 9, and the blind hole batch processing system of the PCB board comprises: A center position module, used to determine the center positions of multiple PCB boards based on a top view of the support platform, where multiple PCB boards in a clamped state exist in the same support platform; A processing space module, used to determine the processing space of multiple PCB boards based on the support platform and the center positions of the multiple PCB boards; A blind hole processing position module is used to determine a plurality of blind hole processing positions according to the processing spaces of the plurality of PCB boards, the relative distances between the plurality of PCB boards, and the three-dimensional models of the plurality of PCB boards; A blind hole processing depth module is used to determine the blind hole batch processing information of the blind hole processing tool based on the three-dimensional model of the PCB board, the corresponding blind hole processing requirements and multiple blind hole processing positions. The blind hole batch processing information includes a plane moving path and a corresponding blind hole processing depth; A blind hole processing combination module is used to determine multiple blind hole processing combinations based on the blind hole batch processing information of the blind hole processing tool, the model information of multiple PCB boards, and the blind hole processing depths of multiple PCB boards; The work sequence list module is used to determine the work sequence list of the blind hole processing tool according to multiple blind hole processing combinations, the priorities of multiple PCB boards and the service life of the blind hole processing tool. The processing difficulty coefficients of multiple blind hole processing items in the work sequence list are gradually increased.

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