Laser film removing method and device

Abstract

The invention relates to the technical field of film removal, and discloses a laser film removal method and device. The method comprises the following steps: acquiring a workpiece image obtained by performing image acquisition on a workpiece to be subjected to film removal; determining a film thickness parameter of the workpiece to be subjected to film removal according to the pixel color parameter of the workpiece image; determining a real-time laser power parameter of the laser film removing device according to the film thickness parameter; and according to the real-time laser power parameters, the laser film removing device conducts laser film removing on the workpiece to be subjected to film removing. According to the embodiment of the invention, the defects of incomplete removal of the coating layer and damage to the substrate material can be overcome, and the removal effect of the coating layer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of thin film removal, and in particular to a laser film removal method and device. Background Art

[0002] During the processing, the coating or coating removal process is often required, such as producing a mark by removing part of the coating or coating, achieving certain properties of the workpiece by removing part of the coating or coating, or coating a thin film or coating for protection and other functions during the processing. After completing certain processes, the coating or coating needs to be removed. Since the film or coating is generally thin and has strong adhesion, it is difficult to achieve efficient and accurate removal using traditional mechanical means. The emergence of laser processing technology has solved this problem to a certain extent, but in the current laser coating removal process application, the laser energy output is fixed in the same laser process, which may lead to incomplete removal of the coating in areas where the coating is thick, and damage to the substrate material in areas where the coating is thin. Summary of the invention

[0003] The purpose of the present application is to provide a laser film removal device and method, aiming to overcome the defects of incomplete removal of the coating layer and damage to the substrate material, so as to improve the removal effect of the coating layer.

[0004] The embodiment of the present application provides a laser film removal method, which is applied to a laser film removal device, comprising: Acquire a workpiece image obtained by collecting an image of the workpiece to be defilmed; Determining a film thickness parameter of the workpiece to be defilmed according to a pixel color parameter of the workpiece image; Determining a real-time laser power parameter of the laser film removal device according to the film thickness parameter; According to the real-time laser power parameter, the laser film removal device is enabled to perform laser film removal on the workpiece to be film removed.

[0005] In some embodiments, determining the film thickness parameter of the workpiece to be defilmed according to the pixel color parameter of the workpiece image includes: Determining workpiece pixel coordinate parameters of the workpiece to be film-removed in the workpiece image; Determining a pixel grayscale parameter of the workpiece image according to a pixel color parameter of the workpiece image; The film thickness parameter of the workpiece to be film-removed is determined according to the workpiece pixel coordinate parameter, the pixel color parameter and the pixel grayscale parameter.

[0006] In some embodiments, determining the workpiece pixel coordinate parameters of the workpiece to be film-removed in the workpiece image includes: Performing edge detection on the workpiece image to extract the edge contour of the workpiece to be film removed; The workpiece pixel coordinate parameters of the workpiece to be film removed are determined according to the edge contour of the workpiece to be film removed and the coordinate mapping relationship between the image coordinate system and the pixel coordinate system.

[0007] In some embodiments, determining the film thickness parameter of the workpiece to be film-removed according to the workpiece pixel coordinate parameter, the pixel color parameter and the pixel grayscale parameter comprises: Determine a target pixel point representing the workpiece to be film-removed according to the workpiece pixel coordinate parameters; The film thickness parameter of the workpiece to be film removed is determined according to a parameter mapping relationship between the pixel color parameter and the pixel grayscale parameter of the target pixel point and the film thickness parameter of the workpiece to be film removed.

[0008] In some embodiments, determining the real-time laser power parameter of the laser film removal device according to the film thickness parameter includes: Determining a power attenuation parameter according to the film thickness parameter; Calculating the real-time laser power parameter of the laser film removal device according to the power attenuation parameter; The calculation formula of the real-time laser power parameter of the laser film removal device is: , in, is the real-time laser power parameter of the laser film removal device, To compensate the power parameters, is the maximum laser power parameter of the laser film removal device, is the power attenuation parameter, is the compensation factor.

[0009] In some embodiments, the step of causing the laser film removal device to perform laser film removal on the workpiece to be film removed according to the real-time laser power parameter includes: Determining the laser processing coordinate parameters of the laser film removal device according to the workpiece pixel coordinate parameters of the workpiece to be film removed and the coordinate mapping relationship between the pixel coordinate system and the laser processing coordinate system; According to the laser processing coordinate parameters, the laser film removal device performs laser film removal on the workpiece to be film removed with the real-time laser power parameters.

[0010] In some embodiments, the laser film removal method further includes: Determine the real-time scanning speed parameter of the laser film removal device according to the film thickness parameter; According to the real-time scanning speed parameter, the laser film removal device is enabled to perform laser film removal on the workpiece to be film removed.

[0011] The present application also provides a laser film removal device, comprising: A film removal station, configured to place a workpiece to be film removed; An image acquisition mechanism is configured to acquire an image of the workpiece to be film-removed; A laser film removal mechanism is configured to perform laser film removal on the workpiece to be film removed; The control mechanism is configured to implement the above-mentioned laser film removal method.

[0012] In some embodiments, the laser film removal mechanism comprises: a laser generator configured to output a laser beam; An energy regulating component, located in the transmission path of the laser beam output by the laser generator, and configured to modulate the laser beam output by the laser generator into corresponding energy before outputting it; A beam shaping component, located in the transmission path of the laser beam output by the energy regulating component, and configured to shape the diameter and divergence angle of the laser beam output by the energy regulating component and output the beam; The galvanometer scanning assembly is located in the transmission path of the laser beam output by the beam shaping assembly and is configured to deflect and focus the laser beam output by the beam shaping assembly onto the workpiece to be film removed.

[0013] In some embodiments, the control mechanism is configured to adjust the power of the laser generator to configure the energy of the laser beam output by the laser generator, and / or is configured to adjust the working conditions of the energy adjustment component to configure the energy of the laser beam output by the energy adjustment component.

[0014] The beneficial effects of the present application are as follows: the film thickness parameters of the workpiece to be removed are determined based on the pixel color parameters of the workpiece image obtained by image acquisition of the workpiece to be removed, and then the real-time laser power parameters of the laser film removal device are determined based on the film thickness parameters, and then the laser film removal device is made to laser remove the workpiece to be removed based on the real-time laser power parameters. Since the thickness of the coating layer at each position of the workpiece to be removed and the laser energy required for the position of the workpiece to be removed are determined based on the pixel color parameters of the workpiece image, the laser film removal device can output laser beams of different energy intensities, and can output a laser beam with a weaker energy intensity to remove the coating layer on the area where the coating layer of the workpiece to be removed is thinner, and can output a laser beam with a stronger energy intensity to remove the coating layer on the area where the coating layer of the workpiece to be removed is thicker, thereby avoiding the problem of incomplete removal of the coating layer and damage to the substrate material, and improving the coating layer removal effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1It is a flow chart of the laser film removal method provided in an embodiment of the present application.

[0016] Figure 2 It is a flowchart of the specific method of step S102 provided in an embodiment of the present application.

[0017] Figure 3 It is a schematic diagram of the structure of the laser film removal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown can be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second" and the like in the specification, claims and drawings are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0021] The embodiment of the present application provides a laser film removal method, which is applied to a laser film removal device.

[0022] Figure 1 Flow chart of the laser film removal method provided in the embodiment of the present application. Figure 1 In some embodiments, the method includes but is not limited to steps S101 to S104.

[0023] Step S101, obtaining a workpiece image by collecting an image of the workpiece to be defilmed.

[0024] The workpiece to be de-filmed refers to a workpiece whose surface thin film layer needs to be removed, such as a solar crystalline silicon cell.

[0025] In some embodiments, the workpiece to be filmed can be fixed at a preset position, an image acquisition device is used to capture an image of the workpiece to be filmed and obtain a workpiece image, and the workpiece image obtained by capturing the image of the workpiece to be filmed can be obtained by reading the memory of the image acquisition device.

[0026] Step S102, determining the film thickness parameters of the workpiece to be de-filmed according to the pixel color parameters of the workpiece image.

[0027] The pixel color parameters of the workpiece image refer to the color parameters of the pixel points of the workpiece image, including red color parameters, green color parameters and blue color parameters.

[0028] The film thickness parameter of the workpiece to be defilmed refers to the thickness of the surface film layer of the workpiece to be defilmed.

[0029] In some embodiments, pixel color recognition can be performed on the workpiece image, and pixel color parameters of the surface thin film layer of the workpiece to be removed can be determined based on the pixel color recognition result, thereby determining the film thickness parameters of the workpiece to be removed based on the pixel color parameters of the surface thin film layer of the workpiece to be removed.

[0030] Step S103, determining the real-time laser power parameter of the laser film removal device according to the film thickness parameter.

[0031] The real-time laser power parameter of the laser film removal device refers to the real-time power parameter of the laser film removal device used to generate the laser beam. For example, the laser film removal device outputs the laser beam through a laser generator, and the real-time power parameter of the laser generator is the real-time laser power parameter of the laser film removal device. It can be understood that the real-time laser power parameter of the laser film removal device is positively correlated with the energy of the laser beam.

[0032] In some embodiments, the real-time laser power parameter of the laser film removal device may be determined according to the film thickness parameter of the workpiece to be film removed and the mapping relationship between the preset film thickness parameter and the real-time laser power parameter.

[0033] Step S104, according to the real-time laser power parameter, the laser film removal device is used to perform laser film removal on the workpiece to be film removed.

[0034] In some embodiments, after determining the real-time laser power parameters, corresponding control instructions can be output to the laser film removal device, so that the laser film removal device outputs a laser beam of corresponding energy with the real-time laser power parameters and acts on the workpiece to be removed, so as to perform laser film removal on the workpiece to be removed.

[0035] Figure 2 is a flowchart of a specific method of step S102 provided in an embodiment of the present application. Figure 2 The method includes but is not limited to steps S201 to S203.

[0036] Step S201, determining the workpiece pixel coordinate parameters of the workpiece to be defilmed in the workpiece image.

[0037] The workpiece pixel coordinate parameters of the workpiece to be filmed are coordinate parameters of the pixel points constituting the workpiece to be filmed in the workpiece image in the pixel coordinate system. By determining the workpiece pixel coordinate parameters of the workpiece to be filmed in the workpiece image, the position of the workpiece to be filmed in the workpiece image can be determined.

[0038] In some embodiments, step S201 specifically includes: performing edge detection on the workpiece image to extract the edge contour of the workpiece to be film removed; determining the workpiece pixel coordinate parameters of the workpiece to be film removed according to the edge contour of the workpiece to be film removed and the coordinate mapping relationship between the image coordinate system and the pixel coordinate system.

[0039] In a specific implementation, edge detection is performed on the workpiece image and the edge contour of the workpiece to be removed is extracted. This can be done by performing edge detection on the workpiece image. Based on the difference between the workpiece to be removed and the surrounding area in the workpiece image, when there is a grayscale change in the pixel points in the workpiece image, it is regarded as the edge contour of the workpiece to be removed. The workpiece to be removed is distinguished from the workpiece image by finding all the edge contours of the workpiece to be removed and distinguishing the workpiece to be removed from the workpiece image based on the edge contour of the workpiece to be removed. The workpiece pixel coordinate parameters of the workpiece to be removed can be determined by determining the pixel points constituting the workpiece to be removed based on the edge contour of the workpiece to be removed, obtaining the image coordinate parameters of the pixel points constituting the workpiece to be removed, and converting the coordinate parameters based on the coordinate mapping relationship between the image coordinate system and the pixel coordinate system to obtain the pixel coordinate parameters of all the pixel points constituting the workpiece to be removed, that is, the workpiece pixel coordinate parameters of the workpiece to be removed.

[0040] In a specific embodiment, the conversion formula of the pixel coordinate parameter is: , , in, is the image coordinate parameter in the x-axis direction, is the image coordinate parameter in the y-axis direction, is the number of pixels of the workpiece image in the current x-axis direction, is the number of pixels of the workpiece image in the current y-axis direction, is the total number of pixels in the x-axis direction within the effective range of the visual system, is the total number of pixels in the y-axis direction within the effective range of the visual system, L is the field of view length of the workpiece image in the x-axis direction, and W is the field of view length of the workpiece image in the y-axis direction.

[0041] Step S202, determining the pixel grayscale parameters of the workpiece image according to the pixel color parameters of the workpiece image.

[0042] In a specific implementation, corresponding weight parameters may be assigned to various components of the pixel color parameters and weighted sum operation may be performed to obtain the pixel grayscale parameters of the workpiece image.

[0043] In a specific embodiment, the calculation formula of the pixel grayscale parameter is: , in, is the pixel grayscale parameter, R is the red color parameter, G is the green color parameter, B is the blue color parameter, , and are all weight parameters.

[0044] Step S203, determining the film thickness parameters of the workpiece to be defilmed according to the workpiece pixel coordinate parameters, pixel color parameters and pixel grayscale parameters.

[0045] In a specific implementation, the pixel points constituting the workpiece to be filmed can be determined based on the pixel coordinate parameters of the workpiece, and the pixel color parameters and pixel grayscale parameters of the pixel points constituting the workpiece to be filmed can be determined in combination with the pixel color parameters and pixel grayscale parameters of the workpiece image, and then the film thickness parameters of the workpiece to be filmed can be determined based on the parameter mapping relationship between the pixel color parameters and the pixel grayscale parameters and the film thickness parameters of the workpiece to be filmed.

[0046] In some embodiments, step S203 specifically includes: determining a target pixel representing the workpiece to be film removed according to the workpiece pixel coordinate parameters; determining the film thickness parameters of the workpiece to be film removed according to a parameter mapping relationship between the pixel color parameters and pixel grayscale parameters of the target pixel and the film thickness parameters of the workpiece to be film removed.

[0047] In a specific implementation, the target pixel representing the workpiece to be film-removed is determined according to the workpiece pixel coordinate parameters, which may be to divide the workpiece to be film-removed into a plurality of regions according to the workpiece pixel coordinate parameters, and then select a number of pixels for each region as the pixel representing the region, that is, to obtain the target pixel. The film thickness parameters of the workpiece to be film-removed may be determined according to the parameter mapping relationship between the pixel color parameters and the pixel grayscale parameters and the film thickness parameters of the workpiece to be film-removed, and the pixel color parameters and the pixel grayscale parameters of the target pixel are used to determine the film thickness parameters of the workpiece to be film-removed that meet the parameter mapping relationship.

[0048] Exemplarily, for a solar crystalline silicon cell, the parameter mapping relationship between its pixel color parameters and pixel gray-scale parameters and the film thickness parameter of the workpiece to be film-removed is specifically as follows: when 100 < R < 175, 70 ≤ G < 150, 0 ≤ B < 100 and 75 < σ < 150, the film thickness parameter of the workpiece to be film-removed is 0 nm to 40 nm; when 0 ≤ R < 75, 0 ≤ G < 25, 200 < B ≤ 255 and 0 < σ < 75, the film thickness parameter of the workpiece to be film-removed is 40 nm to 80 nm; when 0 ≤ R < 100, 100 < G < 155, 155 < B ≤ 255 and 100 < σ < 150, the film thickness parameter of the workpiece to be film-removed is 80 nm to 120 nm; when 200 < R ≤ 255, 200 < G ≤ 255, 0 ≤ B < 150 and 195 < σ ≤ 255, the film thickness parameter of the workpiece to be film-removed is 120 nm to 180 nm.

[0049] In some embodiments, step S103 specifically includes: determining a power attenuation parameter according to the film thickness parameter; calculating a real-time laser power parameter of the laser film-removing device according to the power attenuation parameter.

[0050] The calculation formula for the real-time laser power parameter of the laser film-removing device is: , wherein, is the real-time laser power parameter of the laser film-removing device, is the compensation power parameter, is the maximum laser power parameter of the laser film-removing device, is the power attenuation parameter, is the compensation factor.

[0051] In specific implementation, determining the power attenuation parameter according to the film thickness parameter can be achieved according to the mapping relationship between the film thickness parameter and the power attenuation parameter. Among them, the film thickness parameter and the power attenuation parameter are negatively correlated, that is, the larger the film thickness parameter, the smaller the power attenuation parameter, and the smaller the film thickness parameter, the larger the power attenuation parameter. Exemplarily, for a solar crystalline silicon cell, the mapping relationship between the film thickness parameter and the power attenuation parameter is specifically as follows: when the film thickness parameter of the workpiece to be film-removed is 0 nm to 40 nm, the power attenuation parameter is 75%; when the film thickness parameter of the workpiece to be film-removed is 40 nm to 80 nm, the power attenuation parameter is 50%; when the film thickness parameter of the workpiece to be film-removed is 80 nm to 120 nm, the power attenuation parameter is 25%; when the film thickness parameter of the workpiece to be film-removed is 120 nm to 180 nm, the power attenuation parameter is 0. After determining the power attenuation parameter, calculate the real-time laser power parameter of the laser film-removing device according to the calculation formula of the real-time laser power parameter.

[0052] In some embodiments, step S104 specifically includes: determining the laser processing coordinate parameters of the laser film removal device according to the workpiece pixel coordinate parameters of the workpiece to be film removed and the coordinate mapping relationship between the pixel coordinate system and the laser processing coordinate system; according to the laser processing coordinate parameters, enabling the laser film removal device to perform laser film removal on the workpiece to be film removed with real-time laser power parameters.

[0053] In the specific implementation, according to the coordinate mapping relationship between the pixel coordinate system and the laser processing coordinate system, the pixel coordinate parameters of the workpiece to be film removed are converted into the laser processing coordinate parameters of the laser film removal device, and then the corresponding control instructions are generated based on the laser processing coordinate parameters and the real-time laser power parameters and sent to the laser film removal device, so that the laser film removal device performs laser film removal on the corresponding position of the workpiece to be film removed with the real-time laser power parameters.

[0054] In a specific embodiment, the conversion formula of the laser processing coordinate parameters is: , , in, is the laser processing coordinate parameter in the x-axis direction, is the laser processing coordinate parameter in the y-axis direction, It is the deviation distance between the image acquisition position of the workpiece image and the laser beam output position of the laser film removal device in the coordinate system conversion of the x-axis direction. It is the deviation distance between the image acquisition position of the workpiece image and the laser beam output position of the laser film removal device in the coordinate system conversion of the y-axis direction. It is the deviation distance converted from the coordinate system between the image acquisition position of the workpiece image and the laser beam output position of the laser film removal device.

[0055] Based on the above embodiments, the laser film removal method may also include: determining the real-time scanning speed parameter of the laser film removal device according to the film thickness parameter; and according to the real-time scanning speed parameter, causing the laser film removal device to perform laser film removal on the workpiece to be removed.

[0056] In a specific implementation, according to the mapping relationship between the film thickness parameters of the workpiece to be removed and the real-time scanning speed parameters, the real-time scanning speed parameters of the laser film removal device are determined after determining the film thickness parameters and the real-time laser power parameters. Then, based on the laser processing coordinate parameters, the real-time laser power parameters and the real-time scanning speed parameters, corresponding control instructions are generated and sent to the laser film removal device, so that the laser film removal device performs laser film removal on the corresponding position of the workpiece to be removed with the real-time laser power parameters and the real-time scanning speed parameters.

[0057] The embodiment of the present application also provides a laser film removal device.

[0058] Figure 3 Schematic diagram of the structure of the laser film removal device provided in the embodiment of the present application. Figure 3 In some embodiments, the laser film removal device includes a film removal station 100, an image acquisition mechanism 200, a laser film removal mechanism 300 and a control mechanism 400. The film removal station 100 is configured to place the workpiece to be film removed, the image acquisition mechanism 200 is configured to perform image acquisition on the workpiece to be film removed, the laser film removal mechanism 300 is configured to perform laser film removal on the workpiece to be film removed, and the control mechanism 400 is configured to implement the above-mentioned laser film removal method.

[0059] In some embodiments, the laser film removal mechanism includes a laser generator, an energy adjustment component, a beam shaping component and a galvanometer scanning component. The laser generator is configured to output a laser beam, the energy adjustment component is located in the transmission path of the laser beam output by the laser generator, the energy adjustment component is configured to modulate the laser beam output by the laser generator into a corresponding energy and then output it, the beam shaping component is located in the transmission path of the laser beam output by the energy adjustment component, the beam shaping component is configured to shape the diameter and divergence angle of the laser beam output by the energy adjustment component and output it, the galvanometer scanning component is located in the transmission path of the laser beam output by the beam shaping component, and the galvanometer scanning component is configured to deflect and focus the laser beam output by the beam shaping component onto the workpiece to be film removed. Specifically, after the laser generator outputs the laser beam, the energy regulating component adjusts the energy of the laser beam accordingly, and the laser beam after energy adjustment is output to the beam shaping component. The beam shaping component shapes the diameter and divergence angle of the laser beam output by the energy regulating component based on the principle of laser beam expansion and beam limiting, so that the energy of the laser beam output to the galvanometer scanning component is less than the energy of the laser beam output to the beam shaping component, and the shaped laser beam is output to the galvanometer scanning component, and the laser beam is focused by the galvanometer scanning component and is output to the workpiece to be defilmed. The control mechanism 400 can flexibly adjust the degree of adjustment of the laser beam energy by both the laser generator and the energy regulating component by outputting corresponding control instructions to the laser generator and the energy regulating component. In this way, the energy of the laser output to the workpiece to be defilmed can be flexibly adjusted.

[0060] In some embodiments, the control mechanism 400 is configured to adjust the power of the laser generator to configure the energy of the laser beam output by the laser generator, and / or is configured to adjust the working condition of the energy adjustment component to configure the energy of the laser beam output by the energy adjustment component. In a specific implementation, the control mechanism 400 outputs corresponding control instructions to the laser generator to adjust the power of the laser generator and make the laser generator output a laser beam of corresponding energy intensity. The control mechanism 400 outputs corresponding control instructions to the energy adjustment component to make the energy adjustment component make the energy of the laser beam output to the beam shaping component less than the energy of the laser beam output to the energy adjustment component based on the principle of laser beam splitting. By adjusting the working condition of the energy adjustment component, the amount of beam splitting of the laser beam by the energy adjustment component can be adjusted.

[0061] In summary, the laser film removal method and device provided in the embodiment of the present application determines the film thickness parameters of the workpiece to be removed based on the pixel color parameters of the workpiece image obtained by image acquisition of the workpiece to be removed, and then determines the real-time laser power parameters of the laser film removal device based on the film thickness parameters, and then enables the laser film removal device to perform laser film removal on the workpiece to be removed based on the real-time laser power parameters. Since the thickness of the coating layer at each position of the workpiece to be removed and the laser energy required for the position of the workpiece to be removed are determined based on the pixel color parameters of the workpiece image, the laser film removal device can output laser beams of different energy intensities, and can output a laser beam with a weaker energy intensity to remove the coating layer on the area where the coating layer of the workpiece to be removed is thinner, and can output a laser beam with a stronger energy intensity to remove the coating layer on the area where the coating layer of the workpiece to be removed is thicker, thereby avoiding the problem of incomplete removal of the coating layer and damage to the substrate material, and can improve the effect of removing the coating layer.

[0062] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0063] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A laser film removal method, applied to a laser film removal device, characterized in that: include: Acquire a workpiece image obtained by collecting an image of the workpiece to be defilmed; Determining a film thickness parameter of the workpiece to be defilmed according to a pixel color parameter of the workpiece image; Determining a real-time laser power parameter of the laser film removal device according to the film thickness parameter; According to the real-time laser power parameter, the laser film removal device is enabled to perform laser film removal on the workpiece to be film removed.

2. The laser film removal method according to claim 1, characterized in that: The step of determining the film thickness parameter of the workpiece to be film-removed according to the pixel color parameter of the workpiece image comprises: Determining workpiece pixel coordinate parameters of the workpiece to be film-removed in the workpiece image; Determining a pixel grayscale parameter of the workpiece image according to a pixel color parameter of the workpiece image; The film thickness parameter of the workpiece to be film-removed is determined according to the workpiece pixel coordinate parameter, the pixel color parameter and the pixel grayscale parameter.

3. The laser film removal method according to claim 2, characterized in that: The step of determining the workpiece pixel coordinate parameters of the workpiece to be film-removed in the workpiece image comprises: Performing edge detection on the workpiece image to extract the edge contour of the workpiece to be film removed; The workpiece pixel coordinate parameters of the workpiece to be film removed are determined according to the edge contour of the workpiece to be film removed and the coordinate mapping relationship between the image coordinate system and the pixel coordinate system.

4. The laser film removal method according to claim 2, characterized in that: The step of determining the film thickness parameter of the workpiece to be film-removed according to the workpiece pixel coordinate parameter, the pixel color parameter and the pixel grayscale parameter comprises: Determine a target pixel point representing the workpiece to be film-removed according to the workpiece pixel coordinate parameters; The film thickness parameter of the workpiece to be film removed is determined according to a parameter mapping relationship between the pixel color parameter and the pixel grayscale parameter of the target pixel point and the film thickness parameter of the workpiece to be film removed.

5. The laser film removal method according to claim 1, characterized in that: The method of determining the real-time laser power parameter of the laser film removal device according to the film thickness parameter comprises: Determining a power attenuation parameter according to the film thickness parameter; Calculating the real-time laser power parameter of the laser film removal device according to the power attenuation parameter; The calculation formula of the real-time laser power parameter of the laser film removal device is: ， in, is the real-time laser power parameter of the laser film removal device, To compensate the power parameters, is the maximum laser power parameter of the laser film removal device, is the power attenuation parameter, is the compensation factor.

6. The laser film removal method according to claim 1, characterized in that: The step of causing the laser film removal device to perform laser film removal on the workpiece to be film removed according to the real-time laser power parameter comprises: Determining the laser processing coordinate parameters of the laser film removal device according to the workpiece pixel coordinate parameters of the workpiece to be film removed and the coordinate mapping relationship between the pixel coordinate system and the laser processing coordinate system; According to the laser processing coordinate parameters, the laser film removal device performs laser film removal on the workpiece to be film removed with the real-time laser power parameters.

7. The laser film removal method according to any one of claims 1 to 6, characterized in that: Also includes: Determine the real-time scanning speed parameter of the laser film removal device according to the film thickness parameter; According to the real-time scanning speed parameter, the laser film removal device is enabled to perform laser film removal on the workpiece to be film removed.

8. A laser film removal device, characterized in that: include: A film removal station, configured to place a workpiece to be film removed; An image acquisition mechanism is configured to acquire an image of the workpiece to be film-removed; A laser film removal mechanism is configured to perform laser film removal on the workpiece to be film removed; A control mechanism is configured to implement the laser film removal method according to any one of claims 1 to 7.

9. The laser film removal device according to claim 8, characterized in that: The laser film removal mechanism comprises: a laser generator configured to output a laser beam; An energy regulating component, located in the transmission path of the laser beam output by the laser generator, and configured to modulate the laser beam output by the laser generator into corresponding energy before outputting it; A beam shaping component, located in the transmission path of the laser beam output by the energy regulating component, and configured to shape the diameter and divergence angle of the laser beam output by the energy regulating component and output the beam; The galvanometer scanning assembly is located in the transmission path of the laser beam output by the beam shaping assembly and is configured to deflect and focus the laser beam output by the beam shaping assembly onto the workpiece to be film removed.

10. The laser film removal device according to claim 9, characterized in that: The control mechanism is configured to adjust the power of the laser generator to configure the energy of the laser beam output by the laser generator, and / or is configured to adjust the working condition of the energy adjustment component to configure the energy of the laser beam output by the energy adjustment component.

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