PCB processing equipment and main shaft calibration method

Abstract

The invention relates to the technical field of circuit board machining, and discloses PCB machining equipment and a spindle calibration method, the PCB machining equipment comprises a first spindle, a second spindle, a machine tool assembly, a detection piece and a first adjusting assembly, the machine tool assembly comprises a cross beam and a machining table, the cross beam is erected above the machining table, the machining table is provided with the calibration piece, and the detection piece is arranged on the first spindle; the relative position of the calibration piece and the machining table can be changed; the first spindle is movably connected with the beam, and the second spindle is movably connected to the beam through a first adjusting assembly. The detection piece is detachably installed on the first main shaft and / or the second main shaft, and the detection piece is used for detecting the relative positions of the first main shaft, the calibration piece and the second main shaft. The position of the calibration piece is adjusted by taking the first main shaft as a reference, and then the position of the second main shaft is adjusted through the first adjustment assembly by taking the calibration piece as a reference, so that the relative position of the first main shaft and the second main shaft is calibrated, and the purpose of improving the main shaft calibration precision can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a PCB processing device and a spindle calibration method. Background Art

[0002] With the continuous development of science and technology, the demand for PCB boards is increasing. In order to improve the processing efficiency of PCB boards, multi-spindle processing equipment is generally used to process PCB boards, such as multi-spindle PCB CNC gong machines.

[0003] At present, when a multi-spindle device is calibrated, it is usually necessary to calibrate each spindle separately. However, when each spindle is calibrated separately, there is a certain relative error between different spindles on the same processing table, which makes the multi-spindle processing equipment have a problem of low processing accuracy when processing the same PCB board.

[0004] Therefore, a high-precision spindle calibration method is urgently needed. Summary of the invention

[0005] The embodiment of the present invention provides a PCB processing equipment and a spindle calibration method to solve the problem of low spindle calibration accuracy of multi-spindle PCB processing equipment.

[0006] A PCB processing device comprises a first spindle, a second spindle, a machine tool assembly, a detection component and a first adjustment assembly; The machine tool assembly comprises a crossbeam and a processing table, wherein the crossbeam is mounted above the processing table, and a calibration piece is arranged on the processing table, and the relative position of the calibration piece and the processing table can be changed; The first main shaft is movably connected to the crossbeam, and the second main shaft is movably connected to the crossbeam through the first adjustment component; The detection member can be detachably mounted on the first spindle and / or the second spindle, and the detection member is used to detect the relative positions among the first spindle, the calibration member and the second spindle.

[0007] In the above-mentioned PCB processing equipment, optionally, the calibration member includes a calibration hole, the calibration hole is arranged on the processing table, and the detection member is used to detect the relative position between the first spindle, the calibration hole and the second spindle; The PCB processing equipment also includes a second adjusting component, which can change the position of the calibration hole.

[0008] In the above-mentioned PCB processing equipment, optionally, the calibration member comprises a calibration block, the calibration block is arranged on the processing table, and a calibration hole is arranged at one end of the calibration block away from the processing table; The PCB processing equipment also includes a third adjusting component, the calibration block is movably connected to the processing table, and the third adjusting component can change the position of the calibration block.

[0009] The above-mentioned PCB processing equipment, optionally, further comprises a cutter disc assembly, wherein the cutter disc assembly is detachably mounted on the processing table, and the calibration piece is arranged at an end of the cutter disc assembly away from the processing table; or, the calibration piece is arranged on one side of the cutter disc assembly.

[0010] The above-mentioned PCB processing equipment, optionally, the calibration block is also provided with a presser foot transfer groove, and the presser foot transfer groove is spaced apart from the calibration hole.

[0011] The above-mentioned PCB processing equipment, optionally, has a plurality of processing tables, each of which corresponds to at least one of the first spindles and at least one of the second spindles, and each of the processing tables is provided with at least one calibration component.

[0012] The above-mentioned PCB processing equipment, optionally, includes a first connecting rod, multiple first spindles are connected by the first connecting rod, multiple second spindles are independently controlled or linked to each other, and the first spindle and the second spindle are independently controlled or linked to each other.

[0013] In the above-mentioned PCB processing equipment, optionally, the first adjustment component includes an X-axis adjustment component and a Y-axis adjustment component connected to each other, the second spindle is connected to the X-axis adjustment component or the Y-axis adjustment component, the X-axis adjustment component is at least used to drive the second spindle to move along a first direction, and the Y-axis adjustment component is at least used to drive the second spindle to move along a second direction, and the first direction intersects with the second direction.

[0014] The present application also provides a spindle calibration method, which is applied to any of the above-mentioned PCB processing equipment, comprising: taking the first spindle as a reference, adjusting the position of the calibration piece so that the coaxiality of the calibration piece and the first spindle is within a first deviation range; Taking the calibration piece as a reference, adjusting the position of the second spindle so that the coaxiality between the second spindle and the calibration piece is within a second deviation range; The position calibration between the first spindle and the second spindle is completed.

[0015] The above spindle calibration method, optionally, according to a preset first calibration position coordinate, the first spindle reaches a first calibration position corresponding to the calibration member; driving the detection member to detect the coaxiality of the calibration member and the first spindle; If the coaxiality between the calibration piece and the first spindle is outside a preset first deviation range, adjusting the position of the calibration piece until the coaxiality between the calibration piece and the first spindle is within the first deviation range; According to the first calibration position coordinates, the second spindle reaches the first calibration position; driving the detection member to detect the coaxiality of the second spindle and the calibration member; If the coaxiality between the second spindle and the calibration part is outside the preset second deviation range, the first adjustment component is controlled to adjust the position of the second spindle until the coaxiality between the second spindle and the calibration part is within the second deviation range, thereby completing the position calibration between the first spindle and the second spindle.

[0016] In the above spindle calibration method, optionally, the first adjustment component includes an X-direction adjustment component and a Y-direction adjustment component connected to each other, and the second spindle is connected to the X-direction adjustment component or the Y-direction adjustment component; The step of controlling the first adjusting component to adjust the position of the second spindle specifically includes: Driving the X-axis adjustment assembly to move the second spindle along the first direction to change the position of the second spindle in the first direction; The Y-direction adjustment component is driven to move the second spindle along the second direction to change the position of the second spindle in the second direction.

[0017] In the above spindle calibration method, optionally, the PCB processing equipment includes a plurality of processing tables, each of the processing tables corresponds to at least one of the first spindles and at least one of the second spindles, and each of the processing tables is provided with at least one of the calibration parts; The PCB processing equipment further includes a first connecting rod, a plurality of the first spindles are connected by the first connecting rod, and each of the processing tables is preset with a first calibration position coordinate; The step of the first spindle reaching the first calibration position according to the preset first calibration position coordinates specifically includes: According to the preset first calibration position coordinates, each of the first spindles is driven by the first connecting rod to reach the corresponding first calibration position at the same time.

[0018] The spindle calibration method described above, optionally, the PCB processing equipment further includes a cutter head assembly, the cutter head assembly is detachably mounted on the processing table, the cutter head assembly includes a first precision hole and a second precision hole arranged at intervals, and before the step of the first spindle reaching the first calibration position according to the preset first calibration position coordinates, further includes: According to the preset second calibration position coordinates, the first spindle reaches the second calibration position corresponding to the first precision hole; driving the detection member to detect the coaxiality between the first spindle and the first precision hole; If the coaxiality between the first spindle and the first precision hole is outside the third deviation range, adjusting the position of the cutter head assembly until the coaxiality between the first precision hole and the first spindle is within the third deviation range; According to the preset third calibration position coordinates, the first spindle reaches the third calibration position corresponding to the second precision hole; driving the detection member to detect the coaxiality of the first spindle and the second precision hole; If the coaxiality between the first spindle and the second precision hole is outside the third deviation range, adjusting the position of the cutter head assembly until the coaxiality between the second precision hole and the first spindle is within the third deviation range; The cutter head assembly is fixed to the processing table.

[0019] The above-mentioned PCB processing equipment and spindle calibration method, the equipment includes: a first spindle, a second spindle, a machine tool assembly, a detection part and a first adjustment assembly, the machine tool assembly includes a processing table, the processing table is movably arranged, and the processing table is movably connected with a calibration part, the first spindle and the second spindle are both movably connected to the machine tool assembly and are both located above the processing table, the second spindle is movably connected to the machine tool assembly through the first adjustment assembly, the detection part is detachably installed on the first spindle and / or the second spindle, and the detection part is used to detect the relative position between the first spindle, the calibration part and the second spindle. It can be seen that the PCB processing equipment of the present invention detects the relative position between the first spindle, the calibration part and the second spindle through the detection part, and then adjusts the position of the calibration part based on the first spindle, and then adjusts the position of the second spindle through the first adjustment assembly based on the calibration part, thereby realizing the calibration of the relative position of the first spindle and the second spindle, and can achieve the purpose of improving the spindle calibration accuracy. Furthermore, since the first spindle is used as the reference axis, the position of the first spindle does not need to be adjusted, and the calibration of the spindle can be completed by adjusting the position of the second spindle, thereby reducing the difficulty of adjustment. At the same time, since the first spindle is not provided with an adjustment member, the position of the first spindle will basically not shift when it moves, effectively ensuring the accuracy of the reference, thereby improving the accuracy of the subsequent calibration process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0021] Figure 1 It is a structural schematic diagram of a PCB processing device disclosed in an embodiment of the present invention; Figure 2 It is a structural schematic diagram of another PCB processing equipment disclosed in an embodiment of the present invention; Figure 3 It is a structural schematic diagram of a calibration block and a cutter disc assembly disclosed in an embodiment of the present invention; Figure 4 is a flowchart of a spindle calibration method disclosed in an embodiment of the present invention; Figure 5 It is a specific implementation flow chart of a spindle calibration method disclosed in an embodiment of the present invention; Figure 6 It is a partial implementation flow chart of a spindle calibration method disclosed in an embodiment of the present invention; Figure 7 It is a structural schematic diagram of a micrometer measuring calibration hole disclosed in an embodiment of the present invention; Figure 8 It is a flow chart of implementing calibration of a cutter head assembly disclosed in an embodiment of the present invention; The reference numerals are as follows: 1. First spindle; 2. Second spindle; 3. Machine tool assembly; 4. Inspection part; 5. Processing table; 6. Calibration part; 7. Calibration hole; 8. Calibration block; 9. Cutter head assembly; 10. Presser foot transfer slot; 11. First connecting rod; 12. First precision hole; 13. Crossbeam; 14. Second precision hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0024] It should also be understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0025] As used in the present specification and the appended claims, the term "if" may be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" may be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]", depending on the context.

[0026] In addition, in the description of the present specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0027] References to "one embodiment" or "some embodiments" etc. described in the present specification mean that one or more embodiments of the present invention include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. appearing in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0028] like Figure 1-2 As shown, it is a structural schematic diagram of a PCB processing device disclosed in an embodiment of the present invention, including a first spindle 1, a second spindle 2, a machine tool assembly 3, a detection component 4 and a first adjustment assembly; The machine tool assembly 3 includes a crossbeam 13 and a processing table 5. The crossbeam 13 is mounted above the processing table. A calibration piece 6 is disposed on the processing table 5. The relative position of the calibration piece 6 and the processing table 5 can be changed. The first main shaft 1 is movably connected to the cross beam 13, and the second main shaft 2 is movably connected to the cross beam 13 through a first adjustment component; The detection member 4 can be detachably mounted on the first spindle 1 and / or the second spindle 2 , and the detection member 4 is used to detect the relative positions among the first spindle 1 , the calibration member 6 and the second spindle 2 .

[0029] The machine tool assembly 3 may include a crossbeam 13 and a processing table 5, and the processing table 5 is movably arranged on the machine tool assembly 3 compared to the crossbeam 13. The first spindle 1 and the second spindle 2 can process the PCB board on the processing table 5 separately, or the first spindle 1 and the second spindle 2 can process the same PCB board on the processing table 5.

[0030] The present application detects the relative position between the first spindle 1, the calibration member 6 and the second spindle 2 by the detection member 4, and then adjusts the position of the calibration member 6 with the first spindle 1 as the reference, and then adjusts the position of the second spindle 2 with the calibration member 6 as the reference through the first adjustment component, so as to realize the calibration of the relative position of the first spindle 1 and the second spindle 2, and can achieve the purpose of improving the spindle calibration accuracy. In addition, since the first spindle 1 is used as the reference axis, the position of the first spindle 1 does not need to be adjusted, and only the position of the second spindle 2 needs to be adjusted to complete the calibration of the spindle, thereby reducing the difficulty of adjustment. At the same time, since the first spindle 1 is not provided with an adjustment member, the position of the first spindle 1 will not be substantially offset when it moves, effectively ensuring the accuracy of the reference, thereby improving the accuracy of the subsequent calibration process. Among them, the detection member 4 in this embodiment can be an electronic device installed or temporarily installed on a multi-spindle processing device, and the detection member includes but is not limited to a micrometer, an infrared rangefinder, etc., and the specific type of the detection device is not limited in this embodiment.

[0031] In one embodiment, Figure 3 As shown, the calibration member 6 in this embodiment includes a calibration hole 7 , which is disposed on the processing table 5 , and the detection member 4 is used to detect the relative positions among the first spindle 1 , the calibration hole 7 and the second spindle 2 .

[0032] The PCB processing equipment also includes a second adjusting component, which can change the position of the calibration hole.

[0033] In one implementation, in the present embodiment, when the calibration member 6 includes the calibration hole 7, the movement of the position of the calibration hole 7 can be achieved by changing the position of the carrier of the calibration hole 7. For example, the calibration hole 7 is arranged on the cutter head, and the cutter head is movably arranged on the processing table 5. The position of the calibration hole 7 can be changed by changing the position of the cutter head. Therefore, it can be understood that the second adjustment component is used to adjust the position of the cutter head, and then change the position of the calibration hole 7. Therefore, when the first spindle 1 and the calibration hole 7 are not coaxial or the coaxiality exceeds the preset range, the position of the cutter head can be adjusted by the second adjustment component, and then the position of the calibration hole 7 can be adjusted, so that the calibration hole 7 is coaxial with the first spindle 1 or the coaxiality is within the preset range, and the position calibration of the calibration hole 7 is completed.

[0034] In one embodiment, Figure 3As shown, the calibration component 6 in this embodiment includes a calibration block 8, which is arranged on the processing table 5. A calibration hole 7 is provided at one end of the calibration block 8 facing away from the processing table 5. The PCB processing equipment also includes a third adjustment component, and the calibration block 8 is movably connected to the processing table 5. The third adjustment component can change the position of the calibration block.

[0035] It can be understood that the calibration block 8 in the present embodiment can be movably connected to the processing table 5 via a third adjustment component. Therefore, when the first spindle 1 and the calibration hole 7 are not coaxial or the coaxiality exceeds a preset range, the position of the calibration block 8 can be adjusted by the third adjustment component so that the calibration hole 7 on the calibration block 8 is coaxial with the first spindle 1 or the coaxiality is within a preset range.

[0036] In a specific implementation, in a specific implementation, in this embodiment, the first spindle 1 can be moved to the calibration position of the preset calibration hole 7, specifically referring to the designed position of the calibration hole in the coordinate system of the PCB processing equipment, and then, the detection part 4 is used to detect whether the axis center of the first spindle 1 and the axis center of the calibration hole 7 are coaxial. If the axis center of the first spindle 1 and the axis center of the calibration hole 7 are not coaxial or the coaxiality exceeds the preset range, the position of the calibration block 8 is adjusted by the third adjustment component so that the axis center of the first spindle 1 and the axis center of the calibration hole 7 are coaxial or the coaxiality is within the preset range to complete the calibration of the calibration hole 7. After the calibration of the calibration hole 7 is completed, the second spindle 2 is moved to the preset calibration position of the calibration hole 7, and then, the detection member 4 is used to detect whether the axis center of the second spindle 2 and the axis center of the calibration hole 7 are coaxial or the coaxiality exceeds the preset range. If the axis center of the second spindle 2 and the axis center of the calibration hole 7 are not coaxial or the coaxiality exceeds the preset range, the position of the second spindle 2 is adjusted by the first adjustment component so that the axis center of the second spindle 2 and the axis center of the calibration hole 7 are coaxial to complete the calibration of the second spindle 2. Thus, the calibration of the relative position of the first spindle 1 and the second spindle 2 can be completed.

[0037] In one embodiment, Figure 3 As shown, the PCB processing equipment in this embodiment further includes a cutter disc assembly 9, which is detachably mounted on the processing table 5, and a calibration member 6 is disposed at one end of the cutter disc assembly 9 away from the processing table 5. Alternatively, the calibration member 6 is disposed on one side of the cutter disc assembly 9.

[0038] The cutter head assembly 9 in this embodiment has a fixed state and a mobile state. In the mobile state, the position of the cutter head assembly 9 on the processing table 5 needs to be calibrated with the first spindle 1 as a reference. After the calibration is completed, the cutter head is fixed on the processing table 5, and then the position of the calibration piece 6 is calibrated with the first spindle 1 as a reference, and finally the position of the second spindle 2 is calibrated with the calibration piece 6 as a reference, thereby realizing the position calibration between the first spindle 1 and the second spindle 2.

[0039] Furthermore, since the cutter head assembly 9 is a commonly used component, in this embodiment, by disposing the calibration block 8 on the cutter head assembly 9 , it is beneficial to improve the integration of the equipment, thereby achieving the purpose of saving space on the processing table 5 .

[0040] In some feasible embodiments, the calibration member 6 may also be disposed on one side of the cutter disc assembly 9 to facilitate independent replacement of the calibration member 6 and the cutter disc assembly 9 .

[0041] In one embodiment, Figure 3 As shown, the calibration block 8 in this embodiment is further provided with a presser foot transfer groove 10 , and the presser foot transfer groove 10 is spaced apart from the calibration hole 7 .

[0042] In a specific implementation, the presser foot transfer slot 10 in this embodiment is used to place a presser foot or a brush.

[0043] Furthermore, the presser foot transfer slot 10 in this embodiment may include a presser foot placement slot, a brush placement slot, a waste brush placement slot, etc.

[0044] In summary, in this embodiment, by setting the presser foot transfer groove 10 on the calibration block 8, it is beneficial to improve the integration and functionality of the calibration block 8, thereby achieving the purpose of saving space on the processing table 5.

[0045] In one embodiment, Figure 1 As shown, there are multiple processing tables 5 in this embodiment, each processing table 5 corresponds to at least one first spindle 1 and at least one second spindle 2, and each processing table 5 is provided with at least one calibration part 6.

[0046] In a specific implementation, the first spindle 1 in this embodiment can be independently controlled or controlled in a linkage manner, and the second spindle 2 can also be independently controlled or controlled in a linkage manner. During the calibration process of the first spindle 1 and the second spindle 2 of each processing table 5, each processing table 5 can be calibrated individually based on the calibration part 6, or multiple processing tables 5 can be calibrated in a linkage manner.

[0047] In one embodiment, Figure 1-Figure 2 As shown, the PCB processing equipment in this embodiment includes a first connecting rod 11, multiple first spindles 1 are connected by the first connecting rod 11, multiple second spindles 2 are independently controlled or linked to each other, and the first spindle 1 and the second spindle 2 are independently controlled or linked to each other.

[0048] In a specific implementation, in this embodiment, the first connecting rod 11 can be used to drive all the first spindles 1 to move to the calibration position of the preset calibration part 6, that is, multiple first spindles 1 can be moved to the reference position at the same time, and then, the detection part 4 is used to detect whether the axis center of each first spindle 1 and the axis center of the corresponding calibration part 6 are coaxial. If the axis center of the first spindle 1 and the axis center of the calibration part 6 are not coaxial or the coaxiality exceeds the preset range, the position of each calibration part 6 is adjusted respectively, so that the axis center of each first spindle 1 and the axis center of the corresponding calibration part 6 are coaxial or the coaxiality is within the preset range, so as to complete the calibration of each calibration part 6. Then the second spindle 2 is moved to the preset calibration position of the calibration part 6, and then the detection part 4 is used to detect whether the axis center of the second spindle 2 and the axis center of the calibration part 6 are coaxial. If the axis center of the second spindle 2 and the axis center of the calibration part 6 are not coaxial or the coaxiality exceeds the preset range, the position of the second spindle 2 is adjusted by the first adjustment component so that the axis center of the second spindle 2 and the axis center of the calibration part 6 are coaxial or the coaxiality is within the preset range to complete the calibration of the second spindle 2. Thus, the calibration of the relative position of the first spindle 1 and the second spindle 2 can be completed.

[0049] Furthermore, the present embodiment may further include a second connecting rod, through which the plurality of second main shafts 2 are connected, and each second main shaft 2 is movably connected to the second connecting rod through the first adjusting assembly.

[0050] In a specific implementation, in this embodiment, all the second spindles 2 can be driven by the second connecting rod to move to the calibration position of the preset calibration part 6, and then, the detection part 4 is used to detect whether the axis center of each second spindle 2 and the axis center of the corresponding calibration part 6 are coaxial. If the axis center of the second spindle 2 and the axis center of the calibration part 6 are not coaxial or the coaxiality exceeds the preset range, the position of each second spindle 2 is adjusted by the first adjustment component respectively, so that the axis center of each second spindle 2 and the axis center of the corresponding calibration part 6 are coaxial or the coaxiality is within the preset range, so as to complete the calibration of each first spindle 1.

[0051] To sum up, in this embodiment, multiple first spindles 1 are connected by the first connecting rod 11, so that the movement of multiple first spindles 1 can be controlled at the same time, avoiding the deployment of a moving structure for each first spindle 1 separately, and at the same time improving the control efficiency of the first spindle 1, which is beneficial to improving the spindle calibration efficiency of PCB processing equipment.

[0052] In one embodiment, the first adjustment component in this embodiment includes an X-axis adjustment component and a Y-axis adjustment component connected to each other, and the second spindle 2 is connected to the X-axis adjustment component or the Y-axis adjustment component. The X-axis adjustment component is at least used to drive the second spindle 2 to move along the first direction, and the Y-axis adjustment component is at least used to drive the second spindle 2 to move along the second direction, and the first direction intersects with the second direction.

[0053] The planes where the first direction and the second direction are located are parallel to the plane where the processing table 5 is located.

[0054] In a specific implementation, in this embodiment, the position of the second spindle 2 in the first direction and the second direction can be adjusted by the cooperation of the X-direction adjustment component and the Y-direction adjustment component until the axis of the second spindle 2 is coaxial with the axis of the calibration member 6 or the coaxiality is within a preset range. Since the X-direction adjustment component and the Y-direction adjustment component are both integrated on the second spindle 2, the position calibration between the first spindle 1 and the second spindle 2 can be achieved by only adjusting the position of the second spindle 2, which is easy to operate and more efficient.

[0055] In one embodiment, Figure 4 As shown, it is a flowchart of a spindle calibration method disclosed in an embodiment of the present invention. This method is applicable to PCB processing equipment including multiple spindles, such as a drilling machine, a forming machine, or a drilling and gong integrated machine. The method in this embodiment includes the following steps: S40: Taking the first spindle 1 as a reference, adjusting the position of the calibration member 6 so that the coaxiality of the calibration member 6 and the first spindle 1 is within a first deviation range; S41: With the calibration piece 6 as a reference, the position of the second spindle 2 is adjusted so that the coaxiality of the calibration piece 6 and the second spindle 2 is within a second deviation range, thereby completing the position calibration between the first spindle 1 and the second spindle 2.

[0056] In the specific implementation, Figure 4 The method shown in the embodiment can be implemented by the following steps: Figure 5 As shown: S401: According to the preset first calibration position coordinates, control the first spindle 1 to reach the first calibration position.

[0057] S402 : Drive the detection member 4 to detect the coaxiality between the calibration member 6 and the first spindle 1 .

[0058] The first calibration position coordinates are theoretical design coordinates preset in the machine coordinate system of the PCB processing equipment for the calibration member 6. After the first spindle 1 is controlled to move to the first calibration position of the calibration member 6 according to the preset first calibration position coordinates, the detection member 4 can be controlled to detect the coaxiality between the calibration member 6 and the first spindle 1. The first calibration position can be located above the calibration member 6, and the height of the first calibration position can be set according to the detection needs, which is not limited in this embodiment.

[0059] S403: If the coaxiality between the calibration member 6 and the first spindle 1 is outside the preset first deviation range, adjust the position of the calibration member 6 until the coaxiality between the calibration member 6 and the first spindle 1 is within the first deviation range.

[0060] If the coaxiality of the calibration part 6 and the first spindle 1 is outside the preset first deviation range, the position of the calibration part 6 is adjusted until the coaxiality of the calibration part 6 and the first spindle 1 is within the first deviation range; if the coaxiality of the calibration part 6 and the first spindle 1 is within the preset first deviation range, there is no need to adjust the position of the calibration part 6, and the step of calibrating the second spindle 2 is started, that is, according to the first calibration position coordinates, the second spindle 2 is controlled to reach the first calibration position.

[0061] S411: According to the first calibration position coordinates, control the second spindle 2 to reach the first calibration position.

[0062] S412: Drive the detection member 4 to detect the coaxiality between the second spindle 2 and the calibration member 6 .

[0063] Among them, the first calibration position coordinates are the theoretical design coordinates preset in the machine coordinate system of the PCB processing equipment for the calibration part 6. After controlling the second spindle 2 to move to the first calibration position of the calibration part 6 according to the preset first calibration position coordinates, the detection part 4 can be controlled to detect the coaxiality of the calibration part 6 and the second spindle 2.

[0064] S413: If the coaxiality between the second spindle 2 and the calibration part 6 is outside the preset second deviation range, the first adjustment component is controlled to adjust the position of the second spindle 2 until the coaxiality between the second spindle 2 and the calibration part 6 is within the second deviation range, thereby completing the position calibration between the first spindle 1 and the second spindle 2.

[0065] The second deviation range and the first deviation range may be the same or different, which is not limited in this embodiment.

[0066] To sum up, the present embodiment discloses a spindle calibration method, which detects the relative positions between the first spindle 1, the calibration part 6 and the second spindle 2 through the detection part 4, firstly adjusts the position of the calibration part 6 with the first spindle 1 as the reference, and then adjusts the position of the second spindle 2 with the calibration part 6 as the reference through the first adjustment component, thereby realizing the calibration of the relative positions of the first spindle 1 and the second spindle 2, and achieving the purpose of improving the spindle calibration accuracy.

[0067] In one embodiment, based on Figure 4 In the specific implementation, the first adjustment component in this embodiment includes an X-direction adjustment component and a Y-direction adjustment component connected to each other, and the second spindle 2 is connected to the X-direction adjustment component or the Y-direction adjustment component. On this basis, this embodiment can control the first adjustment component to adjust the position of the second spindle 2 through the following steps, such as Figure 6 As shown: S601: driving the X-direction adjustment component to drive the second spindle 2 to move along the first direction, so as to change the position of the second spindle 2 in the first direction.

[0068] S602: driving the Y-axis adjustment component to drive the second spindle 2 to move along the second direction, so as to change the position of the second spindle 2 in the second direction.

[0069] It can be understood that in this embodiment, the second spindle 2 can be adjusted in the first direction and the second direction in sequence by the cooperation of the X-direction adjustment component and the Y-direction adjustment component until the coaxiality of the second spindle 2 and the calibration component 6 is within the second deviation range. For example, in this embodiment, the first offset of the second spindle 2 in the first direction and the second offset in the second direction compared with the calibration component 6 can be detected by the detection component 4, and then the X-direction adjustment component is driven to drive the second spindle 2 to move the first offset along the first direction to change the position of the second spindle 2 in the first direction, and the Y-direction adjustment component is driven to drive the second spindle 2 to move the second offset along the second direction to change the position of the second spindle 2 in the second direction, thereby achieving the position adjustment of the second spindle 2 based on the X-direction adjustment component and the Y-direction adjustment component.

[0070] In one embodiment, the calibration component 6 in this embodiment includes a calibration hole 7, and the relative position of the calibration hole 7 and the processing table 5 can be changed, or the calibration component 6 includes a calibration block 8, and the calibration block 8 is provided with the calibration hole 7, and the relative position of the calibration block 8 and the processing table 5 can be changed.

[0071] It can be understood that in this embodiment, when the detection member 4 detects that the coaxiality of the first spindle 1 and the calibration hole 7 is outside the first deviation range, if the calibration member 6 includes the calibration hole 7, the movement of the position of the calibration hole 7 can be achieved by changing the position of the carrier of the calibration hole 7. For example, the calibration hole 7 is arranged on the tool disc, and the tool disc is movably arranged on the processing table 5. The position of the calibration hole 7 can be changed by changing the position of the tool disc. Then, the position of the calibration hole 7 is adjusted until the coaxiality of the calibration hole 7 with the first spindle 1 is within the first deviation range; if the calibration member 6 is a calibration block 8, the calibration block 8 is provided with the calibration hole 7, and the relative position of the calibration block 8 and the processing table 5 can be changed, then the position of the calibration block 8 is adjusted until the coaxiality of the calibration hole 7 on the calibration block 8 and the first spindle 1 is within the first deviation range.

[0072] In one embodiment, the PCB processing equipment in this embodiment further includes a cutter head assembly 9, and the cutter head assembly 9 is detachably connected to the processing table 5; The PCB processing equipment also includes a second adjustment component, the calibration hole 7 is set on the cutter disc assembly 9, and the second adjustment component can change the relative position of the cutter disc assembly 9 and the processing table 5, or the PCB processing equipment also includes a third adjustment component, the calibration block 8 is movably connected to the processing table 5, and the third adjustment component can change the relative position of the calibration block 8 and the cutter disc assembly 9.

[0073] It can be understood that in this embodiment, when the detection member 4 detects that the coaxiality between the first spindle 1 and the calibration hole 7 is outside the first deviation range, when the calibration hole 7 is arranged on the cutter disc assembly 9, the position of the cutter disc assembly 9 can be adjusted by the second adjustment component to adjust the position of the calibration hole 7 on the cutter disc assembly 9 until the coaxiality of the calibration hole 7 with the first spindle 1 is within the first deviation range, thereby completing the calibration of the first spindle 1; or, when the calibration block 8 is movably connected to the processing table 5, the position of the calibration block 8 is directly adjusted by the third adjustment component to adjust the position of the calibration hole 7 on the calibration block 8 until the coaxiality of the calibration hole 7 with the first spindle 1 is within the first deviation range, thereby completing the calibration of the first spindle 1.

[0074] In one embodiment, the PCB processing equipment in this embodiment includes a plurality of processing tables 5, each processing table 5 corresponds to at least one first spindle 1 and at least one second spindle 2, and each processing table 5 is provided with at least one calibration component 6. A calibration component 6 is provided on each processing table 5 so that the relative position between the first spindle 1 and the second spindle 2 corresponding to the same processing table 5 can be adjusted, thereby improving the calibration efficiency.

[0075] In one embodiment, the PCB processing equipment in this embodiment includes a first connecting rod 11, and multiple first spindles 1 are connected by the first connecting rod 11, and each processing table 5 is preset with a first calibration position coordinate. On this basis, the step of the first spindle 1 reaching the first calibration position according to the preset first calibration position coordinate can be implemented in the following manner in this embodiment: According to the preset first calibration position coordinates, each first spindle 1 is driven by the first connecting rod 11 to reach the corresponding first calibration position at the same time.

[0076] That is to say, in this embodiment, all the first spindles 1 can be driven to move synchronously through the first connecting rod 11 at the same time according to the first calibration position coordinates, so that each first spindle 1 can move to the corresponding first calibration position, and then, the positional relationship between each first spindle 1 and the corresponding calibration part 6 is detected by the detection member 4. It can be understood that in actual applications, the first calibration position coordinates preset on each processing table 5 are based on the coordinate system of the processing table 5 itself. If the coordinate system of the processing equipment is used as a reference, then the values ​​of each first calibration position coordinates are actually different. That is, the first calibration position coordinates preset in this application refer to the relative coordinates of the first calibration position based on the processing table 5, rather than the absolute coordinates based on the processing equipment.

[0077] To sum up, in this embodiment, multiple first spindles 1 are connected by the first connecting rod 11, so that the movement of multiple first spindles 1 can be controlled at the same time, so that the multiple first spindles 1 can be moved to the corresponding first calibration positions at the same time, avoiding the deployment of a separate moving structure for each first spindle 1, and at the same time improving the control efficiency of the first spindle 1, which is beneficial to improving the spindle calibration efficiency of PCB processing equipment.

[0078] like Figure 7 As shown, it is a schematic diagram of the structure of the dial gauge measuring the calibration hole 7 in this embodiment, wherein 1 is the first spindle 1, 2 is the second spindle, 7 is the calibration hole, 12 is the pin, 13 is the dial gauge, 14 is the head of the dial gauge 13, and 15 is the dial gauge fixing device, which is used to install the dial gauge 13 on the first spindle 1. It can be seen that the pin 13 is installed in the calibration hole 7, and the head 14 of the dial gauge 13 is in contact with the pin 12. The first spindle 1 is controlled to rotate to drive the head 14 of the dial gauge 13 to rotate around the pin 12, so as to detect the relative position of the first spindle 1 and the calibration hole 7.

[0079] In a specific implementation, in this embodiment, the micrometer can be installed on the spindle fixture of the first spindle 1 manually or by a robot, or the first spindle 1 is controlled to actively grasp the micrometer to install the micrometer on the first spindle 1, and the pin is installed in the calibration hole 7 by controlling the pin insertion and extraction robot. Then, the first spindle 1 is controlled to rotate to detect the positional relationship between the first spindle 1 and the calibration hole 7 by the micrometer to determine whether the calibration hole 7 is coaxial with the first spindle 1.

[0080] In another embodiment, the calibration member 6 in this embodiment can be a camera, which can be installed at any position where the first spindle 1 and the calibration hole 7 can be photographed, and an image containing the positional relationship between the first spindle 1 and the calibration hole 7 is obtained by the camera, and then the image is recognized by a pre-trained target position relationship recognition model to determine whether the calibration hole 7 is coaxial with the first spindle 1. Among them, the target position relationship recognition model in this embodiment includes but is not limited to any one of the models of the NasNet model, the VGG model, the Inception series, the YOLO series, etc., or a network model composed of multiple models, which is not limited in this embodiment.

[0081] It should be noted that the above is only a partial implementation method of obtaining the first adjustment data in this embodiment. The adjustment member in this embodiment can also be a laser rangefinder. The relative position of the first main axis 1 and the calibration hole 7 is detected by the laser rangefinder to determine whether the calibration hole 7 is coaxial with the first main axis 1. Therefore, this embodiment does not limit the specific type of obtaining the calibration member 6 and the detection method based on the calibration member 6.

[0082] In one embodiment, the PCB processing equipment in this embodiment further includes a cutter head assembly 9, which is detachably mounted on the processing table 5. The cutter head assembly 9 includes a first precision hole 12 and a second precision hole 14 arranged at intervals. On this basis, after step S401, this embodiment further includes the following steps: Figure 8 As shown: S801: According to the preset second calibration position coordinates, the first spindle 1 reaches the second calibration position corresponding to the first precision hole 12.

[0083] It should be noted that, in this embodiment, both the first spindle 1 and the second spindle 2 can be used to calibrate the cutter disc assembly 9, and in this embodiment, only the process of calibrating the cutter disc assembly 9 using the first spindle 1 is described.

[0084] Among them, the second calibration position coordinates are the theoretical design coordinates preset for the first precision hole 12 in the machine coordinate system of the PCB processing equipment. After controlling the first spindle 1 to move to the second calibration position of the first precision hole 12 according to the preset second calibration position coordinates, the detection component 4 can be controlled to detect the coaxiality of the first precision hole 12 and the first spindle 1.

[0085] S802: Drive the detection component 4 to detect the coaxiality between the first spindle 1 and the first precision hole 12 of the cutter head assembly 9.

[0086] S803: If the coaxiality of the first spindle 1 or the first precision hole 12 is outside the preset third deviation range, adjust the position of the cutter head assembly 9 until the coaxiality of the first precision hole 12 and the first spindle 1 is within the third deviation range.

[0087] Among them, the third deviation range, the first deviation range and the second deviation range in this embodiment may be the same or different, which is not limited in this embodiment.

[0088] If the coaxiality between the first precision hole 12 and the first spindle 1 is outside the preset third deviation range, adjust the position of the cutter disc assembly 9 until the coaxiality between the first precision hole 12 and the first spindle 1 is within the third deviation range; if the coaxiality between the first precision hole 12 and the first spindle 1 is within the preset first deviation range, there is no need to adjust the position of the cutter disc assembly 9. Among them, the first precision hole 12 of the cutter disc assembly 9 has the same function as the calibration hole 7. In this embodiment, the process of driving the detection member 4 to detect the coaxiality between the first spindle 1 and the first precision hole 12 of the cutter disc assembly 9 will not be described in detail. In addition, the position of the first precision hole 12 on the cutter disc assembly 9 in this embodiment can be referred to. Figure 3 shown.

[0089] S804 : According to the preset third calibration position coordinates, the first spindle 1 reaches the third calibration position corresponding to the second precision hole 14 .

[0090] Among them, the third calibration position coordinates are the theoretical design coordinates preset for the second precision hole 14 in the machine coordinate system of the PCB processing equipment. After controlling the first spindle 1 to move to the third calibration position of the second precision hole 14 according to the preset third calibration position coordinates, the detection component 4 can be controlled to detect the coaxiality of the second precision hole 14 and the first spindle 1.

[0091] S805: Drive the detection member 4 to detect the coaxiality between the first spindle 1 and the second precision hole 14 .

[0092] S806: If the coaxiality between the first spindle 1 and the second precision hole 14 is outside the third deviation range, adjust the position of the cutter head assembly 9 until the coaxiality between the second precision hole 14 and the first spindle 1 is within the third deviation range.

[0093] If the coaxiality between the second precision hole 14 and the first spindle 1 is outside the preset third deviation range, adjust the position of the cutter disc assembly 9 until the coaxiality between the second precision hole 14 and the first spindle 1 is within the third deviation range; if the coaxiality between the second precision hole 14 and the first spindle 1 is within the preset first deviation range, there is no need to adjust the position of the cutter disc assembly 9. Among them, the second precision hole 14 of the cutter disc assembly 9 has the same function as the calibration hole 7. In this embodiment, the process of driving the detection member 4 to detect the coaxiality between the first spindle 1 and the second precision hole 14 of the cutter disc assembly 9 will not be described in detail. In addition, the position of the second precision hole 14 on the cutter disc assembly 9 in this embodiment can be referred to. Figure 3 shown.

[0094] S807: Fix the cutter head assembly 9 to the processing table 5.

[0095] In a specific implementation, in this embodiment, the cutter disc assembly 9 can be manually locked on the processing table 5 using fixing screws, or the cutter disc assembly 9 can be fixed to the processing table 5 by an automatic locking mechanism, wherein the automatic locking mechanism includes but is not limited to an end gear disc positioning locking mechanism, a self-locking cylinder, etc., which is not limited in this embodiment.

[0096] To sum up, in this embodiment, not only can the position of the cutter disc assembly 9 be adjusted to replace the position adjustment of the calibration part 6 on the cutter disc assembly 9, but the position accuracy of the cutter disc assembly 9 in the machine coordinate system can also be improved, which is beneficial to improve the tool picking accuracy of the PCB processing equipment on the cutter disc assembly 9 and avoid the problem of reduced processing efficiency of the PCB processing equipment due to tool picking failure.

[0097] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A PCB processing equipment, characterized in that: It includes a first spindle, a second spindle, a machine tool assembly, a detection component and a first adjustment assembly; The machine tool assembly comprises a crossbeam and a processing table, wherein the crossbeam is mounted above the processing table, and a calibration piece is arranged on the processing table, and the relative position of the calibration piece and the processing table can be changed; The first main shaft is movably connected to the crossbeam, and the second main shaft is movably connected to the crossbeam through the first adjustment component; The detection member can be detachably mounted on the first spindle and / or the second spindle, and the detection member is used to detect the relative positions among the first spindle, the calibration member and the second spindle.

2. The PCB processing equipment according to claim 1, characterized in that: The calibration piece comprises a calibration hole, the calibration hole is arranged on the processing table, and the detection piece is used to detect the relative position between the first spindle, the calibration hole and the second spindle; The PCB processing equipment also includes a second adjusting component, which can change the position of the calibration hole.

3. The PCB processing equipment according to claim 1, characterized in that: The calibration piece comprises a calibration block, the calibration block is arranged on the processing table, and a calibration hole is arranged at one end of the calibration block away from the processing table; The PCB processing equipment also includes a third adjusting component, the calibration block is movably connected to the processing table, and the third adjusting component can change the position of the calibration block.

4. The PCB processing equipment according to claim 2 or 3, characterized in that: The PCB processing equipment further includes a cutter disc assembly, which is detachably mounted on the processing table, and the calibration piece is arranged at one end of the cutter disc assembly away from the processing table; Alternatively, the calibration member is disposed on one side of the cutter disc assembly.

5. The PCB processing equipment according to claim 3, characterized in that: The calibration block is also provided with a presser foot transfer groove, and the presser foot transfer groove is spaced apart from the calibration hole.

6. The PCB processing equipment according to claim 1, characterized in that: There are multiple processing tables, each of which corresponds to at least one of the first spindles and at least one of the second spindles, and each of the processing tables is provided with at least one calibration component.

7. The PCB processing equipment according to claim 6, characterized in that: The PCB processing equipment includes a first connecting rod, a plurality of the first spindles are connected by the first connecting rod, a plurality of the second spindles are independently controlled or linked to each other, and the first spindle and the second spindle are independently controlled or linked to each other.

8. The PCB processing equipment according to claim 1, characterized in that: The first adjustment component includes an X-direction adjustment component and a Y-direction adjustment component connected to each other, the second spindle is connected to the X-direction adjustment component or the Y-direction adjustment component, the X-direction adjustment component is at least used to drive the second spindle to move along a first direction, and the Y-direction adjustment component is at least used to drive the second spindle to move along a second direction, and the first direction intersects with the second direction.

9. A spindle calibration method, characterized in that: The PCB processing equipment according to any one of claims 1 to 8 comprises: Taking the first spindle as a reference, adjusting the position of the calibration piece so that the coaxiality between the calibration piece and the first spindle is within a first deviation range; The position of the second spindle is adjusted based on the calibration piece so that the coaxiality between the second spindle and the calibration piece is within a second deviation range, thereby completing the position calibration between the first spindle and the second spindle.

10. The spindle calibration method according to claim 9, characterized in that: The spindle calibration method specifically includes: According to the preset first calibration position coordinates, the first spindle reaches the first calibration position corresponding to the calibration member; Driving the detection member to detect the coaxiality between the calibration member and the first spindle; If the coaxiality between the calibration piece and the first spindle is outside a preset first deviation range, adjusting the position of the calibration piece until the coaxiality between the calibration piece and the first spindle is within the first deviation range; According to the first calibration position coordinates, the second spindle reaches the first calibration position; driving the detection member to detect the coaxiality of the second spindle and the calibration member; If the coaxiality between the second spindle and the calibration part is outside the preset second deviation range, the first adjustment component is controlled to adjust the position of the second spindle until the coaxiality between the second spindle and the calibration part is within the second deviation range, thereby completing the position calibration between the first spindle and the second spindle.

11. The spindle calibration method according to claim 10, characterized in that: The first adjustment component includes an X-direction adjustment component and a Y-direction adjustment component connected to each other, and the second spindle is connected to the X-direction adjustment component or the Y-direction adjustment component; The step of controlling the first adjusting component to adjust the position of the second spindle specifically includes: Driving the X-axis adjustment component to drive the second spindle to move along the first direction, so as to change the position of the second spindle in the first direction; The Y-direction adjustment component is driven to move the second spindle along the second direction to change the position of the second spindle in the second direction.

12. The spindle calibration method according to claim 10 or 11, characterized in that: The PCB processing equipment includes a plurality of processing tables, each of the processing tables corresponds to at least one of the first spindles and at least one of the second spindles, and each of the processing tables is provided with at least one of the calibration components; The PCB processing equipment further includes a first connecting rod, a plurality of the first spindles are connected by the first connecting rod, and each of the processing tables is preset with a first calibration position coordinate; The step of the first spindle reaching the first calibration position according to the preset first calibration position coordinates specifically includes: According to the preset first calibration position coordinates, each of the first spindles is driven by the first connecting rod to reach the corresponding first calibration position at the same time.

13. The spindle calibration method according to claim 10, characterized in that: The PCB processing equipment further includes a cutter head assembly, which is detachably mounted on the processing table, and includes a first precision hole and a second precision hole arranged at intervals, and before the step of the first spindle reaching the first calibration position according to the preset first calibration position coordinates, further includes: According to the preset second calibration position coordinates, the first spindle reaches the second calibration position corresponding to the first precision hole; driving the detection member to detect the coaxiality between the first spindle and the first precision hole; If the coaxiality between the first spindle and the first precision hole is outside the third deviation range, adjusting the position of the cutter head assembly until the coaxiality between the first precision hole and the first spindle is within the third deviation range; According to the preset third calibration position coordinates, the first spindle reaches the third calibration position corresponding to the second precision hole; driving the detection member to detect the coaxiality of the first spindle and the second precision hole; If the coaxiality between the first spindle and the second precision hole is outside the third deviation range, adjusting the position of the cutter head assembly until the coaxiality between the second precision hole and the first spindle is within the third deviation range; The cutter head assembly is fixed to the processing table.

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