Grid line drying device

Abstract

The invention discloses a grid line drying device which comprises a drying box provided with a feeding port and a discharging port and internally provided with a drying channel and a heating device. A transfer assembly; the supporting assembly comprises a supporting unit, the supporting unit comprises a supporting piece, the supporting piece comprises supporting rollers and fan blades, and air holes are formed in the bottom wall of the conveying channel; the backflow assembly comprises a flow guide shell and a backflow pump. The grid line drying device drives air to flow through the reflux pump, so that hot air can preheat and delay cooling silicon wafers in unit channels corresponding to the feeding port and the discharging port respectively, the heating device is used for uniformly heating the silicon wafers in other unit channels, uniform heating is guaranteed, the temperature change rate of the silicon wafers is delayed, and the drying efficiency of the grid line is improved. In addition, the fan blades on the supporting pieces are driven to rotate through air flow, so that the supporting rollers rotate to drive the silicon wafers to translate, the silicon wafers are transferred in cooperation with the transferring assembly, the silicon wafers continuously pass through the drying channel, and therefore the drying efficiency is improved.

Description

Technical Field

[0001] The invention relates to the technical field of gate line technology, and in particular to a gate line drying device. Background Art

[0002] Gate line drying is an important step after gate line printing. After printing the slurry, the cell needs to be dried to remove the solvent and volatile components in the slurry so that the gate line can be more firmly attached to the silicon wafer.

[0003] In the prior art, for example, a Chinese invention patent application with publication number CN118463553A discloses a multi-chamber heterojunction battery sintering furnace device. When the device is in use, the drying chamber is evacuated by a vacuum component during drying and sintering to form a vacuum inside the chamber, and an inert gas such as nitrogen is introduced to effectively isolate oxygen, thereby improving the conversion efficiency of the battery cell and the production quality. This effectively solves the problem of impurities generated by the reaction of organic matter in the metal slurry with oxygen in the air affecting the contact performance of the metal grid line during the traditional drying and sintering process.

[0004] When the above-mentioned device is drying, although the flower basket can carry multiple battery cells, the infrared rays radiated by the infrared heating lamp cannot be evenly irradiated to the side of the battery cell with the grid lines printed on it, that is, it cannot ensure that the infrared radiation received by each part of each battery cell is uniform and consistent. Some parts that are not irradiated with infrared rays are dried only by the transfer of heat radiation and the temperature of the surrounding environment, which leads to uneven heating of the battery cells, affecting the drying quality; not only that, although the use of infrared lamps has the characteristics of fast heating speed and high heating efficiency, it will also cause the silicon wafer to heat up too fast, causing thermal stress damage to the silicon wafer, and affecting the electrical properties of the silicon wafer, resulting in a decrease in drying quality; in addition, when the device is running, it is necessary to frequently control the lifting and moving of the lifting plate through the lifting component. After the flower basket and silicon wafers enter the frame cavity, the lifting plate descends and the transmission device stops running. After the silicon wafer grid lines in the frame cavity are dried, the transmission device is started again, and the above-mentioned silicon wafers and flower baskets are moved out of the frame cavity while other silicon wafers to be dried are transported into the frame cavity, resulting in the need for the transmission device to cooperate with the lifting component to frequently interrupt the transmission of silicon wafers, affecting the drying efficiency.

[0005] Therefore, it is necessary to improve the grid line drying device in the prior art. Summary of the invention

[0006] The purpose of the present invention is to overcome the defects in the prior art and provide a gate line drying device which ensures uniform heating, avoids thermal stress damage to silicon wafers and improves drying efficiency.

[0007] In order to achieve the above technical effects, the technical solution of the present invention is: a grid line drying device, comprising: A drying box, wherein a feed port and a discharge port are arranged on the side wall of the drying box, the drying box has a built-in drying channel and a heating device, the drying channel comprises a plurality of unit channels which are all long strips and arranged side by side in the horizontal direction, the unit channels are connected in sequence, the two unit channels at the ends are respectively connected to the feed port and the discharge port, the heating device is arranged downwardly just above the remaining unit channels, and the drying box is also provided with an air inlet; A transfer assembly, which is disposed at the connection of adjacent unit channels and is used to transfer a silicon wafer at an output end of one unit channel to an input end of another unit channel; A support assembly, wherein the support assembly corresponds to the unit channels one by one, the support assembly comprises support units spaced apart along the length direction of the unit channels, the support unit comprises a support member, the support member comprises a support roller and a fan blade, the axis of the support roller extends in parallel to the width direction of the unit channels, the fan blades are distributed in a circular array on one side of the support roller with the axis of the support roller as the center line, and the fan blades are located on the inner side of the curved surface where the circumferential outer edge of the support roller is located, an air hole for the support member to rotate is opened on the bottom wall of the transmission channel, the top of the support roller is higher than the air hole, and in the support members of the support assemblies corresponding to adjacent unit channels, the fan blades are arranged in opposite directions, and the support members rotate in opposite directions; A reflux component and a filter component, wherein the reflux component includes a guide shell and a reflux pump, wherein the guide shell covers the bottom of the air hole and is enclosed with the drying box to form a guide cavity, wherein the guide cavity is connected to the input end of the reflux pump to drive the fan blade to rotate with the axis of the supporting roller as the center line, and the output end of the reflux pump is connected to the air inlet through the filter component.

[0008] Preferably, in order to facilitate the rotation of the support roller through the flow of air and realize the movement of the silicon wafer in the unit channel, the drying box includes a bottom plate, the top surface of the bottom plate forms the bottom wall of the transmission channel and the bottom wall of the unit channel, the air holes are arranged on the bottom plate, and the bottom of the fan blade activity path is located below the bottom plate.

[0009] Preferably, in order to further promote the rotation of the support roller and drive the movement of the silicon wafer through the flow of air, the guide shell corresponds to the wind hole one by one, and the guide shell is provided with a guide hole connected to the input end of the reflux pump, and the plane where the guide hole opening is located is parallel to the axis of the support roller and directly opposite to the blade surface of the fan blade rotated to the bottom.

[0010] Preferably, in order to ensure the transmission force between the supporting roller and the silicon wafer, the supporting roller outer shell is provided with an elastic buffer sleeve.

[0011] Preferably, in order to facilitate the assembly of the base plate and the support member, the base plate includes an upper clamping plate and a lower clamping plate, and the opposite surfaces of the upper clamping plate are provided with upper clamping grooves and lower clamping grooves facing each other, and the upper clamping grooves and the lower clamping grooves are enclosed to form an assembly hole, and the support roller is fixedly connected with a rotating shaft coaxially, and the circumferential outer edge of the rotating shaft is sealed with the circumferential inner wall of the assembly hole.

[0012] Preferably, in order to ensure that the rotation speed of each support member in the same support assembly is consistent during the transmission of the silicon wafer through the support assembly, thereby reducing the relative friction between the bottom surface of the silicon wafer and the support member, a synchronization assembly is also included, wherein the synchronization assembly includes two synchronization units, and two adjacent support assemblies are respectively connected to the two synchronization units in a one-to-one corresponding transmission manner, so as to ensure that the rotation speed of each support member in the same support assembly is consistent.

[0013] Preferably, in order to achieve synchronous and isospeed rotation of the support members, the synchronization assembly includes synchronization shafts distributed along the length direction of the unit channel and corresponding one to the support units, one of two adjacent synchronization shafts is radially fixedly connected to the corresponding rotating shaft, and the other is radially rotationally connected to the corresponding rotating shaft, the synchronization unit includes a synchronization wheel, a rotating shaft radially fixedly connected to the rotating shaft is fixedly connected to the coaxial centerline of the synchronization wheel, and adjacent synchronization wheels are hinged by connecting rods.

[0014] Preferably, for ease of assembly, the rotating shaft is a hollow shaft for the corresponding synchronous shaft to pass through, and the synchronous shaft includes a round shaft and a convex key arranged on the circumferential outer edge of the round shaft and extending axially along the round shaft. Among the rotating shafts of two adjacent support units of each support assembly, the circumferential inner wall of one rotating shaft is sealed with the circumferential outer edge of the synchronous shaft, and there is a gap between the circumferential inner wall of the other rotating shaft and the circumferential outer edge of the synchronous shaft.

[0015] Preferably, in order to ensure smooth movement of the silicon wafer in the unit channel, avoid deviation, and reduce the wear of the side walls of the silicon wafer, balls that rotate around their own spherical centers and protrude from the side wall surfaces are provided on the opposite side walls of the unit channel, and the spherical centers of the balls are located above the horizontal plane where the top of the support member is located and the distance from the horizontal plane is less than the thickness of the silicon wafer.

[0016] Preferably, in order to realize the transfer of silicon wafers between two adjacent unit channels, the transfer assembly includes transfer units distributed along the unit channels, the transfer units include transfer bars, the projection length direction of the transfer bar on the horizontal plane is parallel to the width direction of the unit channel, two telescopic units are arranged under the transfer bar, the telescopic ends of the two telescopic units both move in the vertical direction, the telescopic end of one of the telescopic units is rotatably connected to the transfer bar and the rotation axis is parallel to the length direction of the unit channel, and the telescopic end of the other telescopic unit is abutted against the transfer bar.

[0017] To sum up, compared with the prior art, the gate line drying device of the present invention drives the air flow through a reflux pump, so that the hot air can preheat and delay the cooling of the silicon wafers in the unit channels corresponding to the feed port and the discharge port respectively, and utilizes the heating device to uniformly heat the silicon wafers in the remaining unit channels to ensure uniform heating and delay the temperature change rate of the silicon wafers to avoid thermal stress damage. In addition, the air flow drives the fan blades on the support to rotate, so that the support roller rotates to drive the silicon wafer to translate, and the transfer assembly is cooperated to transfer the silicon wafer, so that the silicon wafer can continuously pass through the drying channel, thereby improving the drying efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a structural schematic diagram of another perspective of the present invention; Figure 3 yes Figure 2 Explosion diagram of Figure 4 yes Figure 2 A schematic cross-sectional structure diagram of ; Figure 5 yes Figure 4 A magnified view of part A; Figure 6 is a schematic diagram of the structure of the filter assembly of the present invention; Figure 7 yes Figure 6 Explosion diagram of Figure 8 It is a partial structural schematic diagram of the present invention; Fig. 9 yes Figure 8 Explosion diagram of Fig.10 yes Fig. 9 A magnified view of part B; Fig.11 yes Figure 8 Schematic diagram of some structures; Fig.12 yes Fig.11 A top view of Fig.13yes Fig.11 Explosion diagram of Fig.14 It is a structural schematic diagram of the bottom plate of the present invention; Fig.15 yes Fig.14 Explosion diagram of Fig.16 yes Fig.14 Schematic diagram of the explosion from another perspective; Fig.17 yes Fig.14 A schematic cross-sectional structure diagram of ; Fig.18 yes Fig.17 Enlarged view of part C; Fig.19 It is a schematic diagram of the structure of two adjacent support members; Fig. 20 is a schematic diagram of the structure of the transfer assembly of the present invention; In the figure: 1. drying box; 11. bottom plate; 111. upper clamping plate; 1111. upper clamping groove; 1112. upper air outlet; 1113. accommodating through hole; 112. lower clamping plate; 1121. lower clamping groove; 1122. lower air outlet; 1123. through hole; 1124. supporting foot; 113. air hole; 12. top plate; 121. air inlet; 13. side plate; 14. partition; 15. feed inlet; 16. discharge outlet; 17. heating device; 18. ball bearing; 19. distance sensor; 2. transfer assembly; 21. transfer strip; 22. telescopic unit; 23. transfer roller; 3. support member; 31. support roller; 32. fan blade; 33. buffer sleeve; 3 4. Rotating shaft; 4. Reflux assembly; 41. Guide shell; 42. Reflux pump; 43. Exhaust pipe; 5. Filter assembly; 51. Filter shell; 511. Filter barrel; 5111. Inner convex ring; 512. Barrel cover; 513. Screw; 514. Screw tube; 52. Filter frame; 53. Heating shell; 54. Electric heating network; 55. Handle; 56. Top cover; 57. Reflux inlet pipe; 58. Reflux outlet pipe; 6. Synchronizing assembly; 61. Synchronizing shaft; 611. Round shaft; 612. Convex key; 62. Synchronizing unit; 621. Synchronizing wheel; 622. Connecting rod; 63. Positioning piece; 7. Material guide assembly; 71. Material guide plate; 72. Material guide roller; 8. Silicon wafer; 9. Base. DETAILED DESCRIPTION

[0019] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0020] like Figure 1-Figure 20 As shown, the grid line drying device of the present invention comprises: A drying box 1, a feed port 15 and a discharge port 16 are arranged on the side wall of the drying box 1, a drying channel and a heating device 17 are built in the drying box 1, the drying channel includes a plurality of unit channels which are all long strips and arranged side by side in the horizontal direction, the unit channels are connected in sequence, the two unit channels at the ends are respectively connected to the feed port 15 and the discharge port 16, the heating device 17 is downwardly arranged just above the remaining unit channels, and an air inlet 121 is also arranged on the drying box 1; A transfer assembly 2, which is disposed at the connection of adjacent unit channels and is used to transfer the silicon wafer 8 at the output end of one unit channel to the input end of another unit channel; A support assembly, wherein the support assembly corresponds to the unit channel one by one, the support assembly comprises support units spaced apart along the length direction of the unit channel, the support unit comprises a support member 3, the support member 3 comprises a support roller 31 and a fan blade 32, the axis of the support roller 31 extends in parallel to the width direction of the unit channel, the fan blade 32 is distributed in a circular array on one side of the support roller 31 with the axis of the support roller 31 as the center line, and the fan blade 32 is located on the inner side of the curved surface where the circumferential outer edge of the support roller 31 is located, an air hole 113 for the support member 3 to rotate is opened on the bottom wall of the transmission channel, the top of the support roller 31 is higher than the air hole 113, and in the support members 3 of the support assemblies corresponding to adjacent unit channels, the fan blades 32 are arranged in opposite directions, and the rotation direction of the support member 3 is opposite; The reflux component 4 and the filter component 5, the reflux component 4 includes a guide shell 41 and a reflux pump 42, the guide shell 41 covers the bottom of the air hole 113 and is enclosed with the drying box 1 to form a guide cavity, the guide cavity is connected to the input end of the reflux pump 42 to drive the fan blade 32 to rotate with the axis of the supporting roller 31 as the center line, and the output end of the reflux pump 42 is connected to the air inlet 121 through the filter component 5.

[0021] When the device is in use, the heating device 17 and the reflux pump 42 operate continuously, the heating device 17 heats the unit channels except the first and second ends, the reflux pump 42 draws air from the guide cavity, filters it through the filter assembly 5, and then delivers it to the drying box 1 through the air inlet 121, the air in the drying box 1 is then input into the guide cavity through the air holes 113, and then passes into the filter assembly 5 through the reflux pump 42, so that the circulation of air is realized; while the air flows, it acts on the fan blades 32 of the support member 3, blowing the fan blades 32 to rotate with the axis of the support roller 31 as the center line, thereby driving the support roller 31 to rotate; in two adjacent support assemblies, the rotation directions of the support rollers 31 are opposite.

[0022] A single silicon wafer 8 is transported from the feed port 15 to the drying channel, and first enters the unit channel connected to the feed port 15. The hot air flowing in the unit channel contacts the silicon wafer 8 to preheat the silicon wafer 8. At the same time, negative pressure is generated at the air holes 113 in the unit channel, which increases the pressure between the silicon wafer 8 and the support roller 31. The rotation of the support roller 31 drives the silicon wafer 8 to move in the above-mentioned unit channel along the length direction of the unit channel.

[0023] When the silicon wafer 8 moves to the output end of the above-mentioned unit channel, the transfer component 2 transfers the silicon wafer 8 to the input end of another unit channel adjacent to the above-mentioned unit channel, and the supporting roller 31 in the unit channel rotates in the opposite direction, so that the silicon wafer 8 moves in the opposite direction to the original direction. While passing through the unit channel, the heating device 17 is used to heat the top surface of the silicon wafer 8 through the heating range of the heating device 17, so that the gate line on the silicon wafer 8 is dried. Because the preheating treatment has been carried out before heating, the silicon wafer 8 has a certain temperature, thereby slowing down the heating rate of the silicon wafer 8.

[0024] When the silicon wafer 8 moves to the output end of the unit channel, the transfer component 2 transfers the silicon wafer 8 to other unit channels, and cooperates with the rotating support roller 31 to move in the opposite direction of the previous movement. During the movement, it passes through the heating range of the heating device 17 to heat the top surface of the silicon wafer 8 so that the gate lines on the silicon wafer 8 can be dried.

[0025] In the above manner, the silicon wafer 8 is transferred by the end transfer component 2 to the input end of the unit channel corresponding to the discharge port 16. Since the unit channel is outside the heating range of the heating device 17, the silicon wafer 8 only contacts with the hot air flowing in the drying box 1 when passing through the unit channel. By contacting with the flowing hot air, the cooling speed of the silicon wafer 8 can be slowed down, and finally the silicon wafer 8 is discharged from the discharge port 16.

[0026] Therefore, when the silicon wafer 8 passes through the drying channel, the flowing hot air can be used to preheat the silicon wafer 8 before heating and delay cooling after heating. In this way, the heating rate of the silicon wafer 8 in the entire drying process can be reduced, the temperature change gradient can be alleviated, the thermal stress damage caused by the rapid temperature change of the silicon wafer 8 can be avoided, and the risk of cracking and deformation of the silicon wafer 8 is reduced; in addition, when the silicon wafer 8 passes through the unit channel in the middle position, the top surface is directly heated by the heating device 17, and the flow of air ensures that the silicon wafer 8 is heated evenly, avoiding the deterioration of drying quality caused by uneven heating of the silicon wafer 8; not only that, the air flow is driven by the reflux pump 42 to realize the rotation of the support roller 31, and the transfer component 2 is cooperated to transfer the silicon wafer 8, so that the silicon wafer 8 passes through each unit channel in sequence and in an orderly manner, realizing continuous heating of the silicon wafer 8, ensuring the drying efficiency, and avoiding the deterioration of drying efficiency caused by transmission interruption.

[0027] In the present invention, the specific structure of the drying box 1 Figure 3 , Figure 4 , Figure 8 , Fig. 9 , Figure 11-13 As shown, the drying box 1 includes a horizontal bottom plate 11, and a plurality of vertically arranged side plates 13 are fixed above the circumferential outer edge of the bottom plate 11. Three vertical partitions 14 are also fixed above the bottom plate 11. The length direction of the partition 14 is consistent with the length direction of the bottom plate 11. The three partitions 14 are staggered and fixedly connected to the side plates 13 at the end positions. A top plate 12 is fixed to the top of the side plates 13 and the partitions 14. The air inlet 121 is arranged at the edge position of the top plate 12 and is distributed at intervals along the circumference of the top plate 12 to ensure the uniformity of air intake. The feed port 15 and the discharge port 16 are arranged on the same side of the drying box 1 and are adjacent to the top of the bottom plate 11. In this way, it is convenient to pass the silicon wafers 8 to be dried through the feed port 15 and receive the dried silicon wafers 8 from the discharge port 16 on the same side of the drying box 1.

[0028] In the present embodiment, three partitions 14 are provided, which cooperate with the bottom plate 11, the side plate 13 and the top plate 12 to enclose and form four unit channels which are distributed side by side along the width direction of the drying box 1 and extend along the length direction of the drying box 1. The four unit channels are connected end to end in sequence to form a serpentine drying channel. Correspondingly, three transfer components 2 are provided, which are respectively arranged at the connecting point of two adjacent unit channels. Compared with the straight strip design adopted in the prior art, the drying channel of the present invention is a multi-bend serpentine, which reduces the length dimension of the device while ensuring the same length; and among the four unit channels, two of them are respectively opposite to the feed port 15 and the discharge port 16, and the remaining two are separated from the feed port 15 and the discharge port 16.

[0029] The heating device 17 is an infrared lamp, which is arranged downward and fixed between two adjacent partitions 14, so that the heating device 17 is arranged in two unit channels located in the middle and separated from the feed port 15 and the discharge port 16. The heating device 17 uses an infrared lamp, which has the characteristics of rapid heating and uniform heating. Before entering the above two unit channels, the silicon wafer 8 first enters the unit channel connected to the feed port 15 for preheating to avoid excessive heating. After passing through the above two unit channels, the silicon wafer 8 enters the unit channel connected to the discharge port 16, and uses the flowing hot air to slow down the cooling speed of the silicon wafer 8. In this way, the thermal stress damage to the silicon wafer 8 is greatly reduced, thereby avoiding deformation and damage of the silicon wafer 8 and ensuring the drying quality of the gate line on the silicon wafer 8.

[0030] During the drying process of the silicon wafer 8, the slurry is heated, and the solvent and some volatile substances evaporate, resulting in the hot air extracted by the reflux pump 42 containing the above-mentioned harmful substances. In order to prevent the harmful substances from flowing back into the drying box 1 and affecting the drying effect, and at the same time prevent the harmful substances from being discharged to the outside through the feed port 15 and the discharge port 16 to pollute the surrounding air, a filter component 5 is provided at the output end of the reflux pump 42, and the filter component 5 can filter the solvent and volatile substances in the air.

[0031] Specifically, Figure 4-Figure 7 As shown, the filter assembly 5 is fixed above the top plate 12, and the filter assembly 5 includes a filter shell 51, and the two sides of the filter shell 51 are fixedly connected with a reflux inlet pipe 57, two reflux pumps 42 are provided and are connected with the two reflux inlet pipes 57 in a one-to-one correspondence, the filter shell 51 has a built-in filter frame 52, and the filter frame 52 is used to place the filter material, and the bottom of the filter shell 51 is fixedly connected with a heating shell 53, the heating shell 53 is fixed above the top plate 12 and has a built-in electric heating network 54, and the four sides of the heating shell 53 are fixedly connected with a reflux outlet pipe 58, and the reflux outlet pipe 58 is fixedly connected with a frame-shaped top cover 56, and the top cover 56 covers the air inlet 121 and the bottom surface is fixedly connected to the top surface of the top plate 12.

[0032] After the reflux pump 42 draws air, it is transported to the filter shell 51 through the reflux inlet pipe 57, and the air is filtered by the filter material placed on the filter frame 52, so that the clean air is output from the filter shell 51 and enters the heating shell 53. After the air is heated by the electric heating network 54 in the heating shell 53, it is output through the reflux outlet pipe 58 and enters the top cover 56, and then evenly transported downward into the drying box 1 through the circumferentially distributed air inlet 121.

[0033] It should be noted that the filter material placed on the filter frame 52 can be one type or multiple types, for example, it can be silicon carbide porous ceramic particles, high-temperature synthetic fiber particles, activated carbon filter or filter layer, etc.

[0034] In order to facilitate the replacement of filter materials, the filter frame 52 is detachably disposed in the filter housing 51 .

[0035] Specifically, the filter shell 51 includes a filter barrel 511 with an open top and fixedly connected to the top of the heating shell 53. The top of the filter barrel 511 is open and an outer flange is provided on the circumferential outer edge. A screw 513 extending in a vertical direction is integrally connected to the outer flange. The top cover of the filter barrel 511 is provided with a barrel cover 512. The barrel cover 512 is sleeved on the outside of the screw 513. The screw 513 is threadedly connected with a screw tube 514. The screw tube 514 is used to lock the barrel cover 512 on the filter barrel 511. In this way, the barrel cover 512 and the filter barrel 511 are detachably connected to each other so as to open or close the filter barrel 511.

[0036] The filter bag 511 is provided with an inner convex ring 5111 on the inner wall of the filter barrel 511 coaxially, and the inner convex ring 5111 is located below the end of the reflux inlet pipe 57 away from the reflux pump 42. The filter frame 52 is a cylindrical structure with an open top. The filter frame 52 includes a positioning ring and a filter bag fixed below the positioning ring. The inner diameter and outer diameter of the positioning ring are respectively the same as the inner diameter of the inner convex ring 5111 and the inner diameter of the filter barrel 511, so that the positioning ring is supported by the inner convex ring 5111 after being placed in the filter barrel 511. The filter bag is used to place filter materials. The positioning ring is fixedly connected to a handle 55, which is convenient for driving the positioning ring to move. After the barrel cover 512 is locked on the top of the filter barrel 511 by the screw rod 513 and the screw tube 514 connected by thread, the handle 55 abuts against the bottom of the barrel cover 512. In this way, the axial and radial positioning of the positioning ring is achieved to fix the position of the filter frame 52 and prevent the filter frame 52 from changing its position in the filter shell 51.

[0037] A further improvement is that both the feed port 15 and the discharge port 16 are provided with a material guide assembly 7, the material guide assembly 7 connected to the feed port 15 facilitates the introduction of the silicon wafer 8 into the drying box 1 through the feed port 15, and the material guide assembly 7 connected to the discharge port 16 facilitates the export of the silicon wafer 8 through the discharge port 16. Specifically, the material guide assembly 7 includes two material guide plates 71 distributed side by side along the width direction of the drying box 1, the two material guide plates 71 are both long strips and are both inclined and fixedly connected to the side plate 13, and the material guide roller 72 is arranged along the length of the material guide plate 71. The guide rollers 71 are evenly spaced apart and rotate around their own axis. In the guide assembly 7 corresponding to the feed port 15, one end of the guide plate 71 adjacent to the drying box 1 is lower than the other end, so that the silicon wafer 8 can move downward along the inclined guide rollers 72 and enter the drying box 1 from the feed port 15. In the guide assembly 7 corresponding to the discharge port 16, one end of the guide plate 71 adjacent to the drying box 1 is higher than the other end, so that the silicon wafer 8 can move downward along the inclined guide rollers 72 after being discharged from the discharge port 16.

[0038] A further improvement is that the drying box 1 includes a bottom plate 11, the top surface of the bottom plate 11 forms the bottom wall of the transmission channel and the bottom wall of the unit channel, the air holes 113 are arranged on the bottom plate 11, and the bottom of the active path of the fan blade 32 is located below the bottom plate 11; the guide shell 41 corresponds one to one with the air holes 113, and the guide shell 41 is provided with a guide hole connected to the input end of the reflux pump 42, and the plane where the guide hole opening is located is parallel to the axis of the support roller 31 and is opposite to the blade surface of the fan blade 32 rotated to the bottom.

[0039] After adopting the above structure, when the reflux pump 42 is started, air flow is generated. Above the bottom plate 11 in the drying box 1, the air flows downward from the top, passes through the air hole 113, and flows toward the input end of the reflux pump 42. During the flow, the air acts on the fan blade 32, pushing the fan blade 32 to rotate, which is conducive to the rotation of the support roller 31. The top of the support roller 31 is in contact with the bottom surface of the silicon wafer 8, thereby realizing the movement of the silicon wafer 8 along the length direction of the unit channel. In the present invention, the guide holes on the guide shell 41 are directly opposite to the blades of the fan 32 rotated to the bottom position, which is beneficial to ensure that when the air flows toward the input end of the reflux pump 42, its flow path passes through the fan 32, which can push the fan 32 to rotate; in order to facilitate the connection between the guide cavity and the reflux pump 42, an exhaust pipe 43 is fixed under the guide shell 41, and the exhaust pipe 43 is a U-shaped pipe. The upper part of the exhaust pipe 43 is fixedly connected to the guide shell 41 just below two unit channels, and the middle part of the exhaust pipe 43 is connected to the reflux pump 42, and the reflux pump 42 is fixed on the side plate 13.

[0040] A further improvement is that an elastic buffer sleeve 33 is provided on the outer cover of the supporting roller 31 .

[0041] Specifically, Fig.19 As shown, the support member 3 includes two support rollers 31 distributed side by side along the width direction of the unit channel. The two support rollers 31 are sealed with elastic buffer sleeves 33 outside, and matching protrusions and depressions are provided between the circumferential outer edge of the support roller 31 and the circumferential inner wall of the buffer sleeve 33.

[0042] The above structure is adopted to ensure the synchronous rotation of the buffer sleeve 33 and the support roller 31. During use, the air in the drying box 1 is discharged at the air hole 113 to form a negative pressure, so that the silicon wafer 8 located above the support 3 is attracted by the negative pressure, thereby increasing the contact pressure with the support 3 and ensuring the transmission pressure. The buffer sleeve 33 can increase the contact area with the bottom surface of the silicon wafer 8 through its own elastic deformation, thereby ensuring stable transmission and avoiding wear caused by rigid contact between the silicon wafer 8 and the support roller 31.

[0043] A further improvement is that the base plate 11 includes an upper clamping plate 111 and a lower clamping plate 112, and the opposite surfaces of the upper clamping plate 111 and the lower clamping plate 112 are provided with an upper clamping groove 1111 and a lower clamping groove 1121 facing each other, and the upper clamping groove 1111 and the lower clamping groove 1121 are enclosed to form an assembly hole, and the support roller 31 is fixedly connected with a rotating shaft 34 coaxially, and the circumferential outer edge of the rotating shaft 34 is sealed with the circumferential inner wall of the assembly hole.

[0044] Specifically, Figure 15-17As shown, the bottom plate 11 is formed by an upper clamping plate 111 and a lower clamping plate 112 which are fixedly connected. The upper clamping plate 111 is located directly above the lower clamping plate 112. The bottom surface of the upper clamping plate 111 is provided with upper clamping grooves 1111 which are arranged side by side along the length direction of the drying box 1 and are arranged at equal intervals along the width direction of the drying box 1. The upper clamping plate 111 is also provided with upper air vents 1112 which are distributed in a rectangular array and are in the shape of through holes. The upper clamping grooves 1111 pass through the upper air vents 1112. Correspondingly, the top surface of the lower clamping plate 112 is provided with lower clamping grooves 1121 distributed side by side along the length direction of the drying box 1 and arranged at equal intervals along the width direction of the drying box 1. The lower clamping plate 112 is also provided with lower air outlets 1122 distributed in a rectangular array and in the shape of through holes. The lower clamping grooves 1121 pass through the lower air outlets 1122; the upper clamping grooves 1111 correspond to the lower clamping grooves 1121 one by one, and the air holes 113 are formed by the upper air outlets 1112 and the lower air outlets 1122 being connected.

[0045] After adopting the above structure, during assembly, the support member 3 is placed in the lower air outlet 1122 of the lower clamping plate 112, so that the two ends of the rotating shaft 34 are sealed and fitted with the lower clamping groove 1121, and then the upper clamping plate 111 is covered on the lower clamping plate 112, and the upper clamping plate 111 is fixedly connected to the lower clamping plate 112. The fixing connection method is not limited, including welding, gluing, etc., so that the upper air outlet 1112 and the lower air outlet 1122 are connected to form the air hole 113, and the top and bottom of the support roller 31 are respectively located above and below the air hole 113, and the upper clamping groove 1111 and the lower clamping groove 1121 are combined to form an assembly hole that is sealed and connected to the circumferential outer edge of the rotating shaft 34. In this way, it is convenient for the support member 3 to rotate with the axial center line of the assembly hole as the center line.

[0046] A further improvement is that it also includes a synchronization component 6, which includes two synchronization units 62. Two adjacent support components are respectively connected to the two synchronization units 62 in a one-to-one transmission manner to ensure that the rotation speeds of the support members 3 in the same support component are consistent.

[0047] The two synchronization units 62 of the synchronization component 6 are respectively arranged on both sides of the drying box 1, wherein one of the synchronization units 62 is transmission-connected with the support members 3 in the unit channel corresponding to the feed port 15 and the support members 3 in the unit channel with the same transmission direction as the above-mentioned corresponding unit channel, so as to ensure that the support members 3 in the above-mentioned two unit channels rotate at the same speed, and the other synchronization unit 62 is transmission-connected with the support members 3 in the remaining two unit channels, so that the support members 3 in the above-mentioned remaining two unit channels rotate at the same speed, and the rotation direction is opposite to the rotation direction of the support members 3 in the first two unit channels, so that in the four unit channels, the movement directions of the silicon wafer 8 are opposite, and the wear of the support members 3 and the bottom surface of the silicon wafer 8 caused by inconsistent rotation speeds of the support members 3 in the same unit channel is avoided.

[0048] A further improvement is that the synchronization component 6 includes synchronization shafts 61 distributed along the length direction of the unit channel and corresponding to the support units one by one. Among two adjacent synchronization shafts 61, one is radially fixedly connected to the corresponding rotating shaft 34, and the other is radially rotationally connected to the corresponding rotating shaft 34. The synchronization unit 62 includes a synchronization wheel 621. The rotating shaft radially fixedly connected to the rotating shaft 34 is fixedly connected to the synchronization wheel 621 coaxially, and the adjacent synchronization wheels 621 are hinged by a connecting rod 622; the rotating shaft 34 is a hollow shaft for the corresponding synchronization shaft 61 to pass through, and the synchronization shaft 61 includes a circular shaft 611 and a convex key 612 arranged on the circumferential outer edge of the circular shaft 611 and extending axially along the circular shaft 611. Among the rotating shafts 34 of two adjacent support units of each support component, the circumferential inner wall of one rotating shaft 34 is sealed and fitted with the circumferential outer edge of the synchronization shaft 61, and there is a gap between the circumferential inner wall of the other rotating shaft 34 and the circumferential outer edge of the synchronization shaft 61.

[0049] Specifically, Fig. 9 , Fig.10 , Fig.15 , Fig.16 and Fig.19 As shown, the synchronization component 6 includes synchronization shafts 61 spaced apart along the length direction of the drying box 1 and synchronization units 62 arranged at both ends of the synchronization shaft 61. The upper clamping groove 1111 of the upper clamping plate 111 and the lower clamping groove 1121 of the lower clamping plate 112 are both through grooves, and the number is equal to the number of the synchronization shafts 61 and corresponds one to one. There is a gap between the synchronization shaft 61 and the circumferential inner wall of the assembly hole.

[0050] The rotating shafts 34 of the support members 3 are all hollow shafts. In the same support assembly, along the length direction of the unit channel, on two adjacent rotating shafts 34, the circumferential inner wall of one rotating shaft 34 is sealed with the circumferential outer edge of the synchronization shaft 61, so that the rotation of the synchronization shaft 61 can drive the rotating shaft 34 and the corresponding support roller 31 to rotate, while there is a gap between the circumferential inner wall of the other rotating shaft 34 and the circumferential outer edge of the synchronization shaft 61, so that the rotation of the synchronization shaft 61 will not affect the rotating shaft 34; the axial centerline spacing between two adjacent synchronization shafts 61 is less than half the length of the silicon wafer 8, so that when the silicon wafer 8 is transported and moved by the rotating support members 3, there are always at least two support members 3 in contact with the bottom surface of the silicon wafer 8, thereby ensuring that at least one support member 3 can be affected by the rotation of the synchronization shaft 61 and rotate, thereby driving the silicon wafer 8 to move.

[0051] The synchronization unit 62 includes synchronization wheels 621 distributed at intervals along the drying box 1. The distribution interval of the synchronization wheels 621 is twice the distribution interval of the synchronization shaft 61. A positioning piece 63 is arranged between two adjacent synchronization wheels 621. The synchronization wheel 621 and the adjacent positioning piece 63 are respectively fixedly connected to the coaxial center line of the two adjacent synchronization shafts 61. The synchronization wheel 621 and the positioning piece 63 are both in contact with the two sides of the bottom plate 11 to prevent the synchronization shaft 61 from axial movement.

[0052] Adjacent synchronous wheels 621 are hinged by connecting rods 622 to ensure that the rotation speed of the synchronous wheels 621 in the synchronous unit 62 is consistent. The synchronous shaft 61 acts on the rotating shaft 34, so that the rotation speed of each support member 3 in the support assembly corresponding to the same unit channel is consistent.

[0053] A further improvement is that balls 18 are provided on the opposite side walls of the unit channel, rotating around their own centers and protruding from the side wall surfaces; the centers of the balls 18 are located above the horizontal plane where the top of the support member 3 is located and the distance from the above horizontal plane is less than the thickness of the silicon wafer 8.

[0054] Specifically, balls 18 are provided at the bottom of the partition 14 and the side panels 13 distributed on both sides along the width direction of the drying box 1. The balls 18 rotate around their own spherical centers and protrude from the plate surfaces of the partition 14 and the side panels 13. Since the distance between the spherical center of the balls 18 and the plane where the top of the support 3 is located is smaller than the thickness of the silicon wafer 8, when the silicon wafer 8 is transmitted by rotating the support 3, the side wall of the silicon wafer 8 can contact the surface of the balls 18, and the silicon wafer 8 is guided to translate along the length direction of the unit channel by the balls 18. The friction between the balls 18 and the side wall of the silicon wafer 8 is reduced by the rotation of the balls 18 around their own spherical centers.

[0055] A further improvement is that the transfer assembly 2 includes transfer units distributed along the unit channel, the transfer units include a transfer bar 21, the projection length direction of the transfer bar 21 on the horizontal plane is parallel to the width direction of the unit channel, and two telescopic units 22 are arranged below the transfer bar 21. The telescopic ends of the two telescopic units 22 both move in the vertical direction, the telescopic end of one of the telescopic units 22 is rotatably connected to the transfer bar 21 and the center line of the rotating shaft 34 is parallel to the length direction of the unit channel, and the telescopic end of the other telescopic unit 22 is abutted against the transfer bar 21.

[0056] Specifically, Figure 14-18 and Fig. 20As shown, the transfer assembly 2 includes two transfer units distributed along the unit channel, and the distribution spacing of the two transfer units is greater than half the length of the silicon wafer 8 and less than the length of the silicon wafer 8. Specifically, the transfer unit includes a transfer bar 21, a plurality of transfer rollers 23 arranged above the transfer bar 21, and two telescopic units 22 arranged below the transfer bar 21. The two telescopic units 22 are both telescopic cylinders. A horizontal base 9 is fixed below the drying box 1, and the bottom of the lower clamping plate 112 is fixed above the base 9 through the support legs 1124. The cylinder barrels of the telescopic cylinders are all vertically fixed above the base 9; the transfer rollers 23 are evenly spaced along the length direction of the transfer bar 21 and the rotation axis is parallel to the length direction of the drying box 1.

[0057] Correspondingly, the upper clamping plate 111 is provided with a receiving through hole 1113 extending along the width direction of the drying box 1, and the receiving through hole 1113 is used to accommodate the transfer bar 21 and the transfer roller 23; the lower clamping plate 112 is provided with a through hole 1123 located directly below the receiving through hole 1113 and for the telescopic cylinder piston rod to seal and pass through; among the two telescopic cylinders, the top of the piston rod of one is rotatably connected to the bottom of the transfer bar 21, and the telescopic cylinder is correspondingly located below the input end of the unit channel, and the top of the piston rod of the other is abutted against the bottom of the transfer bar 21, and the telescopic cylinder is correspondingly located below the output end of the unit channel.

[0058] After adopting the above structure, in the initial state, the two telescopic cylinders in the transfer unit control the piston rod to descend, so that the transfer bar 21 and the transfer roller 23 descend into the accommodating through hole 1113. When a silicon wafer 8 is transferred to the output end of one of the unit channels, the silicon wafer 8 is located below the transfer bar 21 and the transfer roller 23 in one of the transfer components 2. At this time, the two telescopic cylinders move synchronously to lift the silicon wafer 8 horizontally, so that the silicon wafer 8 is separated from the support 3. The telescopic cylinder corresponding to the output end of the unit channel continues to push the piston rod upward, while the other telescopic cylinder stops running, so that the transfer bar 21 tilts downward. The lower end is located above the stopped telescopic cylinder, and slides down along the inclined transfer bar 21 through the transfer roller 23. After contacting the partition 14 or the side plate 13, the two telescopic cylinder piston rods descend, so that the transfer bar 21 and the transfer roller 23 enter the accommodating through hole 1113 and are separated from the bottom surface of the silicon wafer 8. The silicon wafer 8 moves downward under the influence of gravity, and cooperates with the downward airflow generated by the reflux pump 42 at the air hole 113, so that the silicon wafer 8 contacts the ball 18 and finally falls on the support 3, and then moves in another unit channel through the rotating support roller 31.

[0059] In order to conveniently detect whether there is a silicon wafer 8 at the output end of the unit channel other than the one connected to the discharge port 16, a distance sensor 19 is provided at the bottom of the side plate 13 toward the output end of the unit channel in the drying box 1, and the plane where the distance sensor 19 is located coincides with the plane where the top of the support member 3 is located. In this way, it is convenient to detect the distance between the silicon wafer 8 in the unit channel and the output end of the unit channel. When the silicon wafer 8 moves to the output end of the unit channel as the support member 3 rotates, the silicon wafer 8 can be transferred to the input end of another unit channel through the transfer assembly 2.

[0060] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A grid line drying device, characterized in that: include: A drying box (1), wherein a feed inlet (15) and a discharge outlet (16) are arranged on a side wall of the drying box (1), the drying box (1) has a built-in drying channel and a heating device (17), the drying channel comprises a plurality of unit channels which are all long and arranged side by side in a horizontal direction, the unit channels are connected in sequence, the two unit channels located at the ends are respectively connected to the feed inlet (15) and the discharge outlet (16), the heating device (17) is arranged downwardly just above the remaining unit channels, and the drying box (1) is also provided with an air inlet (121); A transfer component (2), the transfer component (2) being arranged at the connection between adjacent unit channels and used for transferring the silicon wafer at the output end of one unit channel to the input end of another unit channel; A support assembly, wherein the support assembly corresponds to the unit channel one by one, the support assembly comprises support units spaced apart along the length direction of the unit channel, the support unit comprises a support member (3), the support member (3) comprises a support roller (31) and a fan blade (32), the axis of the support roller (31) extending in parallel with the width direction of the unit channel, the fan blades (32) being distributed in a circular array on one side of the support roller (31) with the axis of the support roller (31) as the center line, and the fan blades (32) being located on the inner side of the curved surface where the circumferential outer edge of the support roller (31) is located, the bottom wall of the transmission channel is provided with a wind hole (113) for the support member (3) to rotate, the top of the support roller (31) being higher than the wind hole (113), and in the support members (3) of the support assemblies corresponding to adjacent unit channels, the fan blades (32) are arranged in opposite directions, and the support members (3) rotate in opposite directions; A reflux component (4) and a filter component (5), wherein the reflux component (4) comprises a guide shell (41) and a reflux pump (42), wherein the guide shell (41) covers the bottom of the air hole (113) and is enclosed with the drying box (1) to form a guide cavity, wherein the guide cavity is communicated with an input end of the reflux pump (42) to drive the fan blade (32) to rotate with the axis of the support roller (31) as the center line, and the output end of the reflux pump (42) is communicated with the air inlet (121) through the filter component (5).

2. The grid line drying device according to claim 1, characterized in that: The drying box (1) comprises a bottom plate (11), the top surface of the bottom plate (11) forming a bottom wall of the transmission channel and a bottom wall of the unit channel, the air holes (113) being arranged on the bottom plate (11), and the bottom of the active path of the fan blades (32) being located below the bottom plate (11).

3. The grid line drying device according to claim 1, characterized in that: The guide shell (41) corresponds to the wind hole (113) one by one, and the guide shell (41) is provided with a guide hole connected to the input end of the reflux pump (42), and the plane where the opening of the guide hole is located is parallel to the axis of the support roller (31) and directly faces the blade surface of the fan blade (32) that rotates to the bottom.

4. The grid line drying device according to claim 1, characterized in that: The outer cover of the supporting roller (31) is provided with an elastic buffer cover (33).

5. The grid line drying device according to claim 2, characterized in that: The bottom plate (11) comprises an upper clamping plate (111) and a lower clamping plate (112); the upper clamping groove (1111) and the lower clamping groove (1121) are arranged on opposite surfaces of the upper clamping plate (1111) and the lower clamping groove (1121); the upper clamping groove (1111) and the lower clamping groove (1121) are enclosed to form an assembly hole; the support roller (31) is fixedly connected to a rotating shaft (34) coaxially; the circumferential outer edge of the rotating shaft (34) is sealed to the circumferential inner wall of the assembly hole.

6. The grid line drying device according to claim 5, characterized in that: It also comprises a synchronization component (6), wherein the synchronization component (6) comprises two synchronization units (62), and two adjacent support components are respectively connected to the two synchronization units (62) in a one-to-one transmission manner, so as to ensure that the rotation speeds of the support members (3) in the same support component are consistent.

7. The grid line drying device according to claim 6, characterized in that: The synchronization component (6) comprises synchronization shafts (61) distributed along the length direction of the unit channel and corresponding to the support units one by one, one of two adjacent synchronization shafts (61) being radially fixedly connected to the corresponding rotating shaft (34), and the other being radially rotationally connected to the corresponding rotating shaft (34), the synchronization unit (62) comprising a synchronization wheel (621), a rotating shaft radially fixedly connected to the rotating shaft (34) being coaxially fixedly connected to the synchronization wheel (621), and adjacent synchronization wheels (621) being hingedly connected via a connecting rod (622).

8. The grid line drying device according to claim 7, characterized in that: The rotating shaft (34) is a hollow shaft through which the corresponding synchronous shaft (61) passes. The synchronous shaft (61) comprises a circular shaft (611) and a convex key (612) arranged on the circumferential outer edge of the circular shaft (611) and extending axially along the circular shaft (611). Among the rotating shafts (34) of two adjacent support units of each support assembly, the circumferential inner wall of one rotating shaft (34) is in sealing contact with the circumferential outer edge of the synchronous shaft (61), and a gap exists between the circumferential inner wall of the other rotating shaft (34) and the circumferential outer edge of the synchronous shaft (61).

9. The grid line drying device according to any one of claims 1 to 8, characterized in that: Balls (18) are provided on opposite side walls of the unit channel, rotating around their own spherical centers and protruding from the side wall surfaces. The spherical centers of the balls (18) are located above the horizontal plane where the top of the support member (3) is located and the distance from the horizontal plane is less than the thickness of the silicon wafer (8).

10. The grid line drying device according to any one of claims 1 to 8, characterized in that: The transfer assembly (2) comprises transfer units distributed along the unit channel, the transfer units comprising a transfer bar (21), the projected length direction of the transfer bar (21) on a horizontal plane is parallel to the width direction of the unit channel, two telescopic units (22) are arranged below the transfer bar (21), the telescopic ends of the two telescopic units (22) both move in a vertical direction, the telescopic end of one of the telescopic units (22) is rotatably connected to the transfer bar (21) and the center line of the rotation axis (34) is parallel to the length direction of the unit channel, and the telescopic end of the other telescopic unit (22) is in contact with the transfer bar (21).

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